TWM540382U - Stacking structure of multi-function system-level package (2) - Google Patents

Description

Stacking structure of multi-function system-level package (2)

This creation is an electronic component structure, especially a system in package (SiP) structure.

Common electronic components, such as processors, memory, passive components, connectors, antennas, wireless modules, etc., are especially assembled in a system-in-package. Most of its system-in-packages include Multi-chip Module (MCM), Multi-chip Package (MCP), Stack Die, Package on Package, and package. A package or package such as a package in package or an embedded component substrate (Embedded Substrate).

Therefore, the Republic of China Patent No. I453873 discloses a "stacked semiconductor package structure", which is shown in Fig. 8 and Fig. 9 of the case No. I453873, and first refers to Fig. 8, which is a fourth circuit board The second circuit board and the first circuit board are assembled (via a plurality of second connecting conductors), the second circuit board has a second wafer and a second sealing material, the first circuit board having the first wafer and the first sealing material.

In this technical solution, the stacked semiconductor package structure uses a plurality of circuit boards, which not only has high manufacturing cost and complicated process. As shown in FIG. 9, although the third circuit board can be newly assembled and combined with the third circuit board, the third circuit board has a third chip and an electromagnetic shielding cover, and the third The wafer may be a wireless communication chip, and the wireless communication chip is, for example, a Bluetooth chip, a wireless area network (WiFi) chip, or a combination thereof. However, as mentioned in the introduction, the use of multiple circuit boards is not only costly to manufacture but also complicated in process, especially for functional chips, components or the like, such as Bluetooth chips, wireless area network chips (not limited thereto). It cannot be effectively integrated with the main and passive components. When the package structure is installed on an electronic product by using Surface-mount technology (SMT), such as a smart phone or a tablet computer, in particular, only Smart phone or tablet separate use and operation of Bluetooth network transmission or WiFi network transmission (commonly available), the communication control between the two is irrelevant, for smart electronic devices (whether portable or not) The function has design limitations, and the use of multiple boards is relatively large after the completion of manufacturing, which is not conducive to the industrial development trend.

Therefore, how to improve the above-mentioned defects, and effectively design the system-in-package (SiP) structure, is the technical difficulty that the applicant of this case wants to solve.

In view of the lack of usage, the purpose of this creation is to develop a SiP package with different functions stacked on each other, which not only can reduce the size, but also effectively integrate the SiP package with different functions of the stack to expand the applicability of the module. A stacking structure of functional system level packages.

In order to achieve the above objective, the present invention provides a stacked structure of a multi-functional system-level package, comprising: a circuit substrate having a first bonding surface and a second bonding surface; a first system-level package, electrically The connection is disposed on the first bonding surface; a lead frame is provided with a plurality of first connecting ends and a plurality of second connecting ends, wherein the first connecting ends are electrically connected to the first bonding surface; An encapsulation body formed on the first system-in-package, the lead frame and the first bonding surface, the second connection ends being exposed on the first surface of the first encapsulation; a second system The electrical package is electrically connected to the second bonding surface; a metal shield is disposed on the second system-level package and is fixed on the second bonding surface.

The metal shield can be replaced by a second encapsulation formed on the second system-in-package and the second bonding surface, and the first system-in-package and the second system-in-package have different wireless communications. The module, the first system-level package is a Bluetooth communication module, and the second system-level package is a WiFi communication module.

Therefore, the present invention forms a double-sided stacked form by using a separate circuit substrate and respectively providing a first system-level package and a second system-level package on the first bonding surface and the second bonding surface, so that the creation can achieve different functions. The SiP packages are stacked on each other, which not only reduces the size, but also effectively integrates the stacked SiP packages with different functions to expand the applicability of the modules and achieve their functions.

[this creation]

1‧‧‧ circuit substrate

2‧‧‧ circuit board

11‧‧‧ first joint

12‧‧‧Second junction

13‧‧‧First System Level Package

14‧‧‧ lead frame

141‧‧‧First connection

142‧‧‧second connection

15‧‧‧First encapsulation

16‧‧‧Second system-in-package

17‧‧‧Metal shield

21‧‧‧ first joint

22‧‧‧Second junction

23‧‧‧First system-in-package

24‧‧‧ lead frame

241‧‧‧First connection

242‧‧‧second connection

25‧‧‧First encapsulation

26‧‧‧Second system-in-package

27‧‧‧Second encapsulation

100‧‧‧ first surface

200‧‧‧ Carrier Board

The first figure is a schematic diagram of a cross-sectional structure of a first encapsulation body and a metal shield cover in a stacked structure of a multi-functional system-in-package according to a preferred embodiment of the present invention.

The second figure is a schematic diagram of the first system-level package and the lead frame mounted on the first bonding surface of the circuit substrate of the preferred embodiment of the present invention.

The third figure is a schematic view of the preferred embodiment of the present invention for forming a first encapsulant over the first system in package, the leadframe, and the first bonding surface.

The fourth figure is a schematic diagram of a second system-level package mounted on the second bonding surface of the circuit substrate of the preferred embodiment of the present invention.

The fifth drawing is a schematic view of a lead frame provided on a temporary carrier plate of the preferred embodiment of the present invention.

The sixth figure is a second system level on the second bonding surface of the circuit substrate of the preferred embodiment of the present invention. Schematic diagram of the package.

The seventh figure is a schematic diagram of the first system-level package mounted on the first bonding surface of the circuit substrate of the preferred embodiment of the present invention.

The eighth figure is a schematic diagram of the first connection end of the lead frame electrically connected to the first bonding surface of the circuit board in the preferred embodiment of the present invention.

The ninth drawing is a schematic view of the eighth embodiment of the preferred embodiment of the present invention.

The tenth figure is a schematic diagram of a cross-sectional structure of a first encapsulating body and a second encapsulating body in a stacked structure of a multi-functional system-in-package according to a preferred embodiment of the present invention.

In order for your review board to have a clear understanding of the content of this work, please refer to the following examples with diagrams and symbols, please refer to it.

Referring to the first figure, the present invention provides a stack structure of a multi-functional system-level package, comprising: a circuit substrate 1, a first system-in-package 13, a lead frame 14, a first encapsulation 15, A second system level package 16 and a metal shield 17 are provided. In this embodiment, the first system-in-package 13 and the second system-in-package 16 can be any main or passive components (such as controller chips, processor chips, wireless communication chips (bluetooth or WiFi), resistors, inductors). , capacitors, etc.) or a die or an antenna, etc., and are not limited thereto, to form a module that is stacked on top of each other and has the same function or different functions.

Please refer to the second figure, wherein the circuit substrate 1 is provided with a first bonding surface 11 and a second bonding surface 12 . The first system-level package 13 is electrically connected to the first bonding surface 11 by surface mount technology (SMT), and the lead frame 14 is provided with a plurality of first connecting ends 141 (which can be regarded as inner leads inner lead). Or outer lead) and plural second The first end 141 of the lead frame 14 is electrically connected to the first bonding surface 11 by the SMT. In this embodiment, the lead frame 14 surrounds the first system-in-package 13 (the first system-in-package 13 is located at an intermediate portion of the lead frame 14 , and the form and shape of the lead frame 14 are electrically connected to the circuit substrate 1 . Point locations are designed differently and have different designs and are not limited to this).

Please refer to the third figure, wherein the first encapsulation 15 is formed on the first system-in-package 13, the lead frame 14 and the first bonding surface 11, and the second connection ends 142 are exposed. The first surface 100 of the first encapsulant 15. In the present embodiment, a molding process is performed, which utilizes paste printing, compression molding, transfer molding, liquid encapsulation molding, vacuum lamination, spin coating or Other suitable applicators are deposited over the first system in package 13, leadframe 14 and first bonding surface 11. The first encapsulant 15 is a polymer composite such as an epoxy resin, epoxy acrylate or polymer having a filler. Again, the first encapsulant 15 is electrically non-conductive and protects the first system-in-package 13 from external contamination.

Please continue to refer to the fourth figure, wherein the circuit substrate 1 can be flipped through an automatic fixture (not limited thereto) such that the second bonding surface 12 faces upward, and the second system level package 16 is also similar by SMT. The electrical connection is provided on the second bonding surface 12 of the circuit board 1 . In this embodiment, the first system-in-package 13 and the second system-in-package 16 can be configured as modules of the same or different functions, and preferably the first system-in-package 13 and the second system-in-package 16 are Different wireless communication modules, for example, the first system-in-package 13 is a Bluetooth communication module, and the second system-level package 16 is a WiFi communication module, which can reduce the volume. In particular, the upper and lower layers can be connected by the circuit layout of the circuit substrate 1, so that the first system-level package 13 and the second system-level package 16 can communicate with each other (Bluetooth communication to WiFi, Not limited to this), and can expand the module's suitability Usability, such as the IoT gateway (Gateway) and wireless communication (not limited by this), is a feature of this creation.

In addition, please continue to refer to the first figure, in which the metal shield 17 is finally overlaid on the second system-in-package 16 by SMT and fixed (adhesively embedded) on the second bonding surface 12 In addition, the metal shield 17 is dust-proof in addition to electromagnetic interference (EMI). Therefore, the present invention forms a double-sided stacked form by using the separate circuit substrate 1 and the first system-level package 13 and the second system-level package 16 on the first bonding surface 11 and the second bonding surface 12, respectively. The creation of different functions of SiP packages stacked on each other (same function SiP stacking) can not only reduce the size, but also effectively integrate the SiP packages of different functions stacked to expand the applicability of the modules and achieve their functions.

This creation further provides another embodiment, the preparation process of which is shown in the fifth to the tenth. As shown in the fifth figure, the second connecting ends 242 of the lead frame 24 are preferentially disposed on a temporary and sacrificial carrier 200. The material of the carrier 200 can be resin, glass, Tantalum, steel, niobium, gallium arsenide, indium phosphide, niobium carbide, niobium oxide or other low cost steel materials that are beneficial to structural support. The carrier 200 has a temporary adhesive bonding film (not shown) thereon so that the lead frame 24 is laminated and bonded thereto via a pick-and-place operation, and is not limited thereto.

In addition, as shown in FIG. 6 , the second system-level package 26 is electrically connected to the second bonding surface 22 by SMT. Similarly, as shown in the seventh figure, the circuit substrate 2 can be flipped through an automatic fixture (not limited thereto) such that the first bonding surface 21 faces upward, and the first system-level package 23 is also similar by SMT. The electrical connection is provided on the first bonding surface 21 of the circuit substrate 2 to form a double-sided stack.

As shown in the eighth and ninth diagrams, the first bonding surface 21 of the circuit substrate 2 is faced downward, and the circuit substrate 2, the first system-in-package 23, and the second system are connected via a pick-and-place operation. The stacked SiP structure of the level package 26 is disposed on the lead frame 24, and the first connection ends 241 are electrically connected to the first bonding surface 21.

Finally, as shown in the ninth and tenth drawings, a Molding process is performed to form a second encapsulant 27, and the second encapsulation 27 is formed on the second system-in-package 26 and the second bonding surface 22 Above. In the present embodiment, the length or width of the circuit board 2 (the left-right direction shown in the drawing) may be slightly smaller than the length or width of the first encapsulant 25 and the second encapsulant 27 (the left-right direction shown in the drawing). To create gaps and voids. Therefore, when the sealant is applied, it is convenient to form the first encapsulant 25 and the second encapsulant 27 at one time (which can be regarded as a single encapsulant, but is not limited thereto).

After the encapsulation is completed, the carrier 200 can be subjected to a de-tape process by chemical etching, mechanical peeling, CMP, mechanical grinding, hot baking, UV light, laser scanning or wet stripping. In addition, the second connecting end 242 of the lead frame 24 is exposed on the first surface 100 to form a quad flat no-lead (QFN) for reapparatus. Adhesion on the surface of the SMT (not limited to this), in order to facilitate the subsequent formation of electrical interconnect structures. The structural aspects of the present embodiment are as described above, and the effects produced by the technical means are as described in the preamble, and therefore will not be described again.

The above discussion is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; therefore, the equivalent shape, structure or combination of changes made in the spirit and scope of the present invention should be It is covered by the patent application scope of this creation.

1‧‧‧ circuit substrate

11‧‧‧ first joint

12‧‧‧Second junction

13‧‧‧First System Level Package

14‧‧‧ lead frame

15‧‧‧First encapsulation

16‧‧‧Second system-in-package

17‧‧‧Metal shield

Claims (6)

A stack structure of a multi-functional system-level package, comprising: a circuit substrate having a first bonding surface and a second bonding surface; a first system-level package electrically connected to the first bonding surface a lead frame having a plurality of first connecting ends and a plurality of second connecting ends, wherein the first connecting ends are electrically connected to the first bonding surface; and a first sealing body is formed on the first sealing body a system-level package, a lead frame and a first bonding surface, wherein the second connecting end is exposed on the first surface of the first encapsulating body; a second system-level package is electrically connected to the first surface a metal shield is disposed on the second system-level package and is fixed on the second bonding surface. The stack structure of the multi-function system-level package according to claim 1, wherein the first system-level package and the second system-level package are different wireless communication modules. The stacking structure of the multi-function system-level package according to claim 2, wherein the first system-level package is a Bluetooth communication module, and the second system-level package is a WiFi communication module. A stack structure of a multi-functional system-level package, comprising: a circuit substrate having a first bonding surface and a second bonding surface; a first system-level package electrically connected to the first bonding surface a lead frame having a plurality of first connecting ends and a plurality of second connecting ends, wherein the first connecting ends are electrically connected to the first bonding surface; and a first sealing body is formed on the first sealing body a system-level package, a lead frame and a first bonding surface, wherein the second connecting end is exposed on the first surface of the first encapsulating body; a second system-level package is electrically connected to the first surface a second bonding surface; a second encapsulating body formed on the second system-in-package and the second bonding surface. The stack structure of the multi-function system-level package according to claim 4, wherein the first system-level package and the second system-level package are different wireless communication modules. The stacking structure of the multi-function system-level package according to claim 5, wherein the first system-level package is a Bluetooth communication module, and the second system-level package is a WiFi communication module.