M394582 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種天線模組結構，特別是指一種 利用封裝膠體支撐的立體天線模組結構。 【先前技術】 今曰’無線通訊技術已廣泛應用於各式各樣的消 費性電子產品以利接收或發送各種無線訊號。為了滿 足消費性電子產品的外觀設計需求，無線通訊模組之 製造者與設計者無不將輕薄短小列為無線通訊模組 的開發设计目標。其中’平面天線(p atch Antenna)由 於具有體積小、重量輕與製造容易等特性，被廣泛利 用在手機、個人數位助理(personal Digital Assistant ; PDA)等電子產品之無線通訊模組中。 請參閱第一圖’其係習知技術中平面天線之應用 示意圖。如圖所示，傳統的無線通訊模組具有一電路 板PA1，電路板PA1上係設置至少一包含各種主、被 動元件或相關電路之工作模組PA2,電路板pAi上方 更包覆一封裝膠體PA3以封裝保護工作模組pA2。 平面天線PA4包含一幅射體PA41與一饋入元件 PA42，饋入元件PA42係電性連接幅射體pA41與工 作模組PA2。基於幅射體PA41之電磁輻射特性^及 其體積上的大小限制，常難以和工作模組PA2整合製 造，而必須單獨佔用電路板PA1上封裴結構部分之外 的面積，使無線通訊模組的體積難以壓縮。 緣此，專利公開號200950048「具有天線之半導 體封裴結構」揭露一種半導體封裝結構以解決平面天 3 M394582 線佔用電路板PA1面積的問題。請參閱如第二圖所顯 示之具有天線之半導體封裝結構之結構示意圖，該發 明係包含一電路板ΡΑΓ、一晶片PA2’、一封裝膠體 PA3’以及一平面天線PA4’。平面天線PA4’之幅射體 PA41’係直接置放在封裝膠體PA3’上方以避免佔用電 路板ΡΑΓ上之空間。同時，平面天線PA4’利用饋入 元件PA42’穿過晶片PA2’上之晶片穿孔導通至電路 板ΡΑΓ。如此，即可解決平面天線PA4’佔用電路板 ΡΑΓ上面積的問題，使整體半導體封裝結構的面積得 以壓縮。 然而，在晶片PA2’上穿孔於實行面上具有其技 術複雜度與困難度，並且可能產生例如為晶片PA2’ 之結構遭破壞等衍生問題。同時，平面天線PA4’在 電磁波場型的變化上具有其限制，無法滿足現代無線 通訊對天線之需求。 【新型内容】 有鑒於在習知技術中，存在天線結構佔用電路板 面積以及平面天線效益不足之問題，本創作係提供一種 天線模組結構，利用封裝膠體作為立體天線之支撐架 構，增加空間之利用效率並以效益較佳之立體天線取代 平面天線，藉以解決上述之問題。 本創作之天線模組結構係包含一基板、一封裝膠 體以及一天線主結構。封裝膠體由環氧樹脂（Epoxy Resin)所製成，並包覆基板之一工作面。天線主結構包 含一第一幅射體、一第二幅射體以及至少一饋入元件。 其中，第一幅射體設置於工作面與封裝膠體之間，第二 幅射體設置於該封裝膠體之外表面上，饋入元件係電性M394582 V. New description: [New technical field] This creation is about an antenna module structure, especially a stereo antenna module structure supported by a package colloid. [Prior Art] Today's wireless communication technology has been widely used in a wide variety of consumer electronic products to receive or transmit various wireless signals. In order to meet the design requirements of consumer electronics products, manufacturers and designers of wireless communication modules have listed light and thin as the development and design goals of wireless communication modules. Among them, the 'Patch Antenna' is widely used in wireless communication modules of electronic products such as mobile phones and personal digital assistants (PDAs) because of its small size, light weight and easy manufacturing. Please refer to the first figure' for a schematic diagram of the application of planar antennas in the prior art. As shown in the figure, the conventional wireless communication module has a circuit board PA1. The circuit board PA1 is provided with at least one working module PA2 including various active and passive components or related circuits, and the circuit board pAi is covered with a package colloid. The PA3 protects the working module pA2 in a package. The planar antenna PA4 includes a radiation body PA41 and a feed element PA42. The feed element PA42 is electrically connected to the radiation body pA41 and the working module PA2. Based on the electromagnetic radiation characteristics of the radiator PA41 and the size limitation of the volume, it is often difficult to integrate with the working module PA2, and it is necessary to separately occupy the area outside the sealing structure part of the circuit board PA1, so that the wireless communication module The volume is difficult to compress. For this reason, Patent Publication No. 200950048 "Semiconductor Sealing Structure with Antenna" discloses a semiconductor package structure to solve the problem that the plane 3 M394582 line occupies the area of the circuit board PA1. Referring to the schematic diagram of a semiconductor package structure having an antenna as shown in the second figure, the invention comprises a circuit board, a wafer PA2', an encapsulant PA3' and a planar antenna PA4'. The radiator PA41' of the planar antenna PA4' is placed directly above the encapsulant PA3' to avoid occupying space on the circuit board. At the same time, the planar antenna PA4' is conducted to the board ΡΑΓ through the wafer vias on the wafer PA2' by the feed element PA42'. In this way, the problem that the planar antenna PA4' occupies the area on the upper surface of the circuit board can be solved, so that the area of the entire semiconductor package structure is compressed. However, the perforation on the wafer PA2' has its technical complexity and difficulty on the implementation surface, and may cause derivation problems such as damage to the structure of the wafer PA2'. At the same time, the planar antenna PA4' has limitations in the variation of the electromagnetic wave field type, which cannot meet the demand of the antenna for modern wireless communication. [New content] In view of the conventional technology, there is a problem that the antenna structure occupies the circuit board area and the planar antenna has insufficient efficiency. The present invention provides an antenna module structure, which uses the package colloid as a supporting structure of the stereo antenna to increase the space. The above problem can be solved by replacing the planar antenna with an efficiency and a better-performing stereo antenna. The antenna module structure of the present invention comprises a substrate, a package body and an antenna main structure. The encapsulant is made of epoxy resin (Epoxy Resin) and covers one of the working surfaces of the substrate. The antenna main structure includes a first radiator, a second radiator, and at least one feed element. Wherein, the first emitter is disposed between the working surface and the encapsulant, and the second emitter is disposed on the outer surface of the encapsulant, and the component is electrically charged
t S I 4 M394582 連接該第一幅射體與該第二幅射體。較佳者，天線主結 構為一單極天線(Monopole Antenna)。 在本創作較佳實施例之第一實施例中，饋入元件 為一金屬導線，金屬導線之一端電性連接第一幅射體， 金屬導線之另一端穿過封裝膠體之内部並電性連接第 二幅射體。 在本創作較佳實施例之第二實施例中，饋入元件 為一金屬導線，該金屬導線係設置於該封裝膠體之外表 面之側邊以電性連接該第一幅射體與該第二幅射體，藉 以組成該天線主結構。 相較於習知技術中，存在天線結構佔用電路板面積 以及平面天線效益不足之問題，本創作利用習知技術中 的封裝膠體作為天線主結構之支撐架構，將第一幅射體 設置於基板之工作面與封裝膠體之間，將第二幅射體設 置於封裝膠體之外表面上，並利用饋入元件穿過封裝膠 體或貼附於封裝膠體之外表面之側邊上以電性連接第 一幅射體與第二幅射體組成所述之天線主結構，使封裝 膠體以及天線主結構所佔用之空間整合，增進天線模組 結構中空間使用之效益。即便不使用平面天線，亦可在 維持天線效益的前提下，達到壓縮天線模組結構整體面 積之目的。 【實施方式】 以下兹列舉本創作之二個較佳實施例以供所屬 技術領域者據以實施。 m 請參閱第三圖，其係本創作較佳實施例之第一實 施例中天線模組結構之立體結構圖。如圖所示，天線 模組結構100包含一基板1、一封裝膠體2、一天線 5 M394582 主結構3、一傳輸線4以及一工作模組5。美板^具 ί一^"H11，封裝膠體2可由環氧樹1(¾⑽y Resin)或，、他封裝材料所構成，係包覆於工作面11 上。 天線主結構3包含一第一幅射體31、一 體32以及一饋入元件33。第一幅射體3 ;二 面11與封裳膠體2之間，在本實施例中，係設= Γ "t。第二幅射· 32則設置於封震膠體2之 夕卜表面上。第一幅射體31與第二幅射體32分 V體，並以鍍覆（coating)或黏附的方式 ς 作面u上與封裝膠體2之外表面上。d; 用以電性連接第-幅射體31與第二幅射體32千。係 在^實施例中，天線主結構3為 (M〇nop〇le Antenna)結構。惟， ^ 天線結構，各式各樣線结 Ϊ，第四® ’其係本創作較佳實施例之第-實 :中，線模組結構之側面示意圖，亦為 所 J不之ΑΑ斷面圖。如第四圖所示，在本實施：：所 凡件33為-導線，較佳者為-金屬導線，古亥導 線之一端係電性連接第一幅射體 ^ 。亥導 =裝以r部以電性連接第導二 i以二聊」;=方 射貫孔，並 例如為銅或鋁之導電材質所形成。 …兄 請參閱第五圖，其係本創作錄實施例之第二實 rsi 6 M394582 施例中天線模組結構之側面示意圖。如圖所示，在本 實施例中，天線模組結構100’之饋入元件33’亦為一 導線。惟，該導線係設置於封裝膠體2之外表面之側 邊上，並上下延伸以電性連接第一幅射體31與第二 幅射體32。其中，該導線可由喷塗、印刷、電鍍、蒸 鍍、曝光、顯影與蝕刻等方法及該等方法之組合而製 造成形於封裝膠體2之外表面之側邊上。 回頭參閱第三圖。饋入元件33更電性連接印刷 於工作面11上之傳輸線4,藉以透過傳輸線4電性連 接工作模組5。傳輸線4可為一帶線傳輸線、一微帶 傳輸線或一共平面導波管傳輸線；工作模組5包含各 種主、被動元件，例如RF處理器、RF濾波器等。 本創作之天線模組結構100由於利用習知技術中 既有的封裝膠體2作為天線主結構3之支撐架構，將第 一幅射體31設置於基板1之工作面11上，將第二幅射 體32設置於封裝膠體2之外表面上，並利用饋入元件 33穿過封裝膠體2或貼附於封裝膠體2之外表面之側 邊上，以電性連接第一幅射體31與第二幅射體32組成 所述之天線主結構3，使封裝膠體2以及天線主結構3 所佔用之空間得以整合而增進天線模組結構100中空 間使用之效益。即使不使用平面天線，亦可達到壓縮天 線模組結構100面積之目的。 藉由上述之本創作實施例可知，本創作確具產業 上之利用價值。惟以上之實施例說明，僅為本創作之 較佳實施例說明，舉凡所屬技術領域中具有通常知識 者當可依據本創作之上述實施例說明而作其它種種 之改良及變化。然而這些依據本創作實施例所作的種 種改良及變化，當仍屬於本創作之創作精神及界定之 專利範圍内。 7 M394582 【圖式簡單說明】 第一圖係習知技術中平面天線之應用示意圖； 第二圖係習知技術中具有天線之半導體封裝結構之 結構示意圖； 第三圖係本創作較佳實施例之第一實施例中天線模 組結構之立體結構圖； 第四圖係本創作較佳實施例之第一實施例中天線模 組結構之側面示意圖；以及 第五圖係本創作較佳實施例之第二實施例中天線模 組結構之側面示意圖。 【主要元件符號說明】 電路板PA1、ΡΑΓ 工作模組PA2 晶片PA2’ 封裝膠體PA3、PA3’ 平面天線PA4、PA4’ 幅射體PA41、ΡΑ4Γ 饋入元件PA42、PA42’ 天線模組結構100、100’ i si 基板1 工作面11 8 M394582 封裝膠體2 天線主結構3 第一幅射體31 第二幅射體32 饋入元件33、33’ 傳輸線4 工作模組5t S I 4 M394582 connects the first emitter to the second emitter. Preferably, the main structure of the antenna is a monopole antenna. In the first embodiment of the preferred embodiment of the present invention, the feeding component is a metal wire, and one end of the metal wire is electrically connected to the first emitter, and the other end of the metal wire passes through the inside of the encapsulant and is electrically connected. The second shot. In a second embodiment of the preferred embodiment of the present invention, the feeding component is a metal wire, and the metal wire is disposed on a side of the outer surface of the encapsulant to electrically connect the first emitter and the first The two radiators are used to form the main structure of the antenna. Compared with the prior art, there is a problem that the antenna structure occupies the circuit board area and the planar antenna has insufficient efficiency. The present invention utilizes the encapsulation colloid in the prior art as the support structure of the main structure of the antenna, and the first radiation body is disposed on the substrate. Between the working surface and the encapsulant, the second emitter is disposed on the outer surface of the encapsulant and electrically connected by the feeding component through the encapsulant or the side of the outer surface of the encapsulant. The first emitter and the second emitter constitute the main structure of the antenna, so that the space occupied by the encapsulant and the main structure of the antenna is integrated, and the utility of the space in the structure of the antenna module is improved. Even if the planar antenna is not used, the overall area of the compressed antenna module structure can be achieved while maintaining the antenna efficiency. [Embodiment] Two preferred embodiments of the present invention are listed below for implementation by those skilled in the art. m. Referring to the third drawing, which is a perspective structural view of the antenna module structure in the first embodiment of the preferred embodiment of the present invention. As shown, the antenna module structure 100 includes a substrate 1, an encapsulant 2, an antenna 5 M394582 main structure 3, a transmission line 4, and a working module 5.美一^"H11, encapsulant 2 can be composed of epoxy tree 1 (3⁄4 (10) y Resin) or his packaging material, which is coated on the working surface 11. The antenna main structure 3 comprises a first radiator 31, a body 32 and a feed element 33. The first shot 3; between the two sides 11 and the sealant 2, in this embodiment, is set = Γ "t. The second radiation·32 is disposed on the surface of the sealant colloid 2. The first projecting body 31 and the second projecting body 32 are divided into V bodies and coated or adhered to the outer surface of the encapsulant 2 on the surface u. d; for electrically connecting the first radiator 31 and the second radiator 32 thousand. In the embodiment, the antenna main structure 3 is a (M〇nop〇le Antenna) structure. However, ^ antenna structure, various types of line knots, the fourth ® 'the first embodiment of the preferred embodiment of the present invention, the side view of the line module structure, is also the section of the J Figure. As shown in the fourth figure, in the present embodiment: the member 33 is a wire, preferably a metal wire, and one end of the Guhai wire is electrically connected to the first body ^. The guide is installed with the r part to electrically connect the second lead to the second one; the square is formed by a conductive material such as copper or aluminum. ... brother, please refer to the fifth figure, which is a schematic side view of the antenna module structure in the second embodiment of the present rsi 6 M394582 embodiment. As shown, in the present embodiment, the feed element 33' of the antenna module structure 100' is also a wire. However, the wires are disposed on the side of the outer surface of the encapsulant 2 and extend up and down to electrically connect the first and third radiators 31, 32. Wherein, the wire can be formed on the side of the outer surface of the encapsulant 2 by spraying, printing, electroplating, vapor deposition, exposure, development and etching, and the like. See the third picture later. The feed element 33 is electrically connected to the transmission line 4 printed on the working surface 11 to electrically connect the working module 5 through the transmission line 4. The transmission line 4 can be a strip line transmission line, a microstrip transmission line or a coplanar waveguide tube transmission line; the working module 5 includes various active and passive components such as an RF processor, an RF filter and the like. The antenna module structure 100 of the present invention uses the encapsulation colloid 2 as the support structure of the antenna main structure 3 in the prior art, and the first radiator 31 is disposed on the working surface 11 of the substrate 1, and the second frame is The projecting body 32 is disposed on the outer surface of the encapsulant 2 and passes through the encapsulating component 2 or attached to the side of the outer surface of the encapsulant 2 by the feeding component 33 to electrically connect the first radiating body 31 with The second frame body 32 constitutes the antenna main structure 3, so that the space occupied by the encapsulant 2 and the antenna main structure 3 is integrated to enhance the space use efficiency of the antenna module structure 100. Even if a planar antenna is not used, the purpose of compressing the area of the antenna module structure 100 can be achieved. It can be seen from the above-described embodiments of the present invention that the creation has an industrial use value. The above embodiments are merely illustrative of the preferred embodiments of the present invention, and those skilled in the art can make various other modifications and changes as described in the above embodiments of the present invention. However, all of the improvements and variations made in accordance with the present embodiment are still within the scope of the creative spirit and definition of the present invention. 7 M394582 [Simple description of the diagram] The first diagram is a schematic diagram of the application of the planar antenna in the prior art; the second diagram is a schematic diagram of the structure of the semiconductor package structure having the antenna in the prior art; A perspective view of the antenna module structure in the first embodiment; a fourth side view of the antenna module structure in the first embodiment of the preferred embodiment; and a fifth embodiment of the preferred embodiment of the present invention A schematic side view of the antenna module structure in the second embodiment. [Main component symbol description] Circuit board PA1, ΡΑΓ Working module PA2 Chip PA2' Package colloid PA3, PA3' Planar antenna PA4, PA4' Radiator PA41, ΡΑ4Γ Feeding component PA42, PA42' Antenna module structure 100, 100 ' i si Substrate 1 Working surface 11 8 M394582 Encapsulation 2 Antenna main structure 3 First radiator 31 Second radiator 32 Feeding elements 33, 33' Transmission line 4 Working module 5