TWM539702U - Chip structure of light emitting diode - Google Patents

Description

Light-emitting diode structure

The present invention relates to the technical field of a chip package structure, and more particularly to a light emitting diode chip structure.

Light Emitting Diode (LED) is a widely used light-emitting element, and it is widely used in human daily life due to its small size and long service life.

Referring to FIG. 1, a perspective cross-sectional view of a conventional LED wafer is shown. Meanwhile, referring to FIG. 2, a side cross-sectional view of a conventional LED wafer is shown. The conventional LED chip 1' is structurally comprising: an insulating body 11', a lead frame 12', a heat sink 13', a colloidal encapsulation 14', a lens 15', and a Light-emitting diode 16'. As shown in FIG. 1 and FIG. 2, in the implementation of emitting white light, the encapsulant 14' is doped with at least one phosphor powder 17'; as such, as long as the light-emitting diode 16' is emitted by electric power. The short-wavelength color light (for example, blue light or ultraviolet light) excites the phosphor powder 17' to emit at least one long-wavelength color light, so that the light-emitting diode chip 1' emits a short-wavelength color light and at least one long-wavelength color light. Mixed white light.

According to the package structure of the conventional LED chip 1' shown in FIG. 1 and FIG. 2, those skilled in the development and manufacture of the LED package structure have long known that the conventional LED chip 1' is too bulky. Practical defects such as wire bonding difficulties. Therefore, in view of the fact that the conventional light-emitting diode chip 1' has many practical application defects, the creator of the present invention continuously creates and develops, and finally completes a novel light-emitting diode structure of the present invention.

The main object of the present invention is to provide a light emitting diode wafer structure. Compared with the conventional light-emitting diode chip system, which has the defects of excessive volume and difficulty in wire bonding, the present invention is specially designed to expose the installation portion of the lead frame, the two soldering portions, and the two electrical connecting portions to the main body. The top surface, and at the same time, a package colloid comprising a cube portion and a lens portion is disposed on the body, thereby completing a novel light-emitting diode structure having a small volume and easily completing wire bonding. In addition, the novel is specially designed with a triangular mark on the bottom surface of the main body; thus, when the engineer wants to configure the novel light-emitting diode structure on a circuit board, the engineer The electrical arrangement direction of the light emitting diode structure can be known by the triangular pattern used as the circuit symbol of the LED.

In order to achieve the above-mentioned primary object of the present invention, the creator of the present invention provides an embodiment of the structure of the light-emitting diode wafer, comprising: a body; a lead frame disposed inside the body and having a mounting portion, a second soldering portion and a second electrical connecting portion; wherein the mounting portion, the two soldering portions, and the two electrical connecting portions are exposed on a top surface of the body; at least one LED die is provided Above the setting portion, and electrically connected to the two soldering portions through at least two bonding wires; an encapsulant formed on the main body and covering the lead frame and the LED die; and two electrodes Attached to the two end faces of the body.

In order to more clearly describe a light-emitting diode wafer structure proposed by the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.

Referring to FIG. 3A, a first perspective view of a light emitting diode structure of the present invention is shown; and, referring to FIG. 3B, a second perspective view of the light emitting diode structure of the present invention is shown. It should be noted that the black lines used to describe the light-emitting diode structure 1 in FIG. 3A and FIG. 3B include thick lines and thin lines, wherein the portion drawn by the thick lines belongs to the light-emitting diode structure. The external structure; in short, the external structure refers to a person who is not covered or accommodated by anything. Conversely, the portion depicted by the thin lines belongs to the internal structure of the light emitting diode structure.

As shown in FIG. 3A and FIG. 3B, the LED structure 1 of the present invention comprises: a main body 11, a lead frame 12, at least one LED die 13, an encapsulant 14, two electrodes 15, and a polarity. Sign 16. The lead frame 12 is disposed inside the main body 11 and has a mounting portion 120, a first soldering portion 121, a second soldering portion 122, a first electrical connecting portion 123, and a second electrical component. The connecting portion 124; the first soldering portion 121, the second soldering portion 122, the first electrical connecting portion 123, and the second electrical connecting portion 124 are exposed to the main body 11 Above the top surface. Moreover, the LED die 13, such as an ultraviolet LED die, a blue LED die, a red LED die, or a green LED die, is disposed on the mounting portion 120 and transmitted through two bonding wires. The first soldering portion 121 and the second soldering portion 122 are connected to the first soldering portion 121.

In the above, the encapsulant 14 is formed on the main body 11 and covers the lead frame 12 and the LED die 13 . In the present invention, the encapsulant 14 includes a cube portion 141 and a lens portion 142 formed on the cube portion 141; wherein the cube portion 141 is formed on the top surface of the body 11, and the cube The four sections of the portion 141 are aligned with the four sections of the body 11, respectively. As is well known to those skilled in the art of designing, developing, and manufacturing LED chips, the cube portion 141 of the encapsulant 14 is typically doped with at least one phosphor.

On the other hand, the electrode 15 is composed of an electrical connection plate 151, a soldering plate 152 and an intermediate plate 153. As shown in FIG. 3A and FIG. 3B , the two electrical connecting plates 151 disposed on the top surface of the main body 11 are respectively connected to the first electrical connecting portion 123 and the second electrical connecting portion 124 . A portion of the two welded plates 152 of the electrode 15 is disposed above the bottom surface of the body 11 with respect to the electrical connection plate 151. In the present invention, the welded plate 152 is specifically designed as a type of T-shaped plate. In addition, the intermediate plate 153 is above the end surface of the main body 11 to connect the electrical connecting plate 151 and the welded plate 152.

In particular, the present invention has a polarity mark 16 planned above the bottom surface of the body 11. It is worth noting that although FIG. 3B shows that the polarity flag 16 is a triangular mark, the triangular mark can be regarded as a triangular pattern used as a circuit symbol of the LED. So designed, when an engineer wants to configure the novel LED structure 1 on a circuit board, the engineer can use the triangular pattern (ie, the polarity) used as the circuit symbol of the LED. The mark 16) knows the electrical arrangement direction of the light-emitting diode structure 1.

Please refer to FIG. 3A, and also refer to the second perspective view of the LED structure of the present invention shown in FIG. 3C. Although FIG. 3B shows that the polarity flag 16 is a triangular flag, it is not intended to limit the manner in which the polarity flag 16 is presented. As shown in FIG. 3C, the polarity mark 16 may also be a rectangular mark, and the rectangular mark is located at one third of the bottom surface of the main body 11. With this arrangement, the engineer can know that the solder plate 152 near the rectangular mark (i.e., the polarity mark 16) is the anode defined on the circuit.

Referring to FIG. 4A and FIG. 4B, a second perspective view of the light emitting diode structure of the present invention is shown. Although FIGS. 3B and 3C show that the welded plate 152 is designed as a type of T-shaped plate, the embodiment of the welded plate 152 should not be limited accordingly. As shown in FIG. 4A and FIG. 4B, the welded plate 152 may also be a square plate.

Thus, the above-mentioned system has completely and clearly explained the components and composition of the light-emitting diode wafer structure of the present invention. From the above, it can be known that the novel system has the following advantages:

(1) Compared with the conventional light-emitting diode chip system, which has the defects of excessive volume and difficulty in wire bonding, the present invention is specially designed such that the mounting portion 120 of the lead frame 12 and the two soldering portions are provided. (121, 122), two electrical connecting portions (123, 124) are exposed on the top surface of the main body 11, and at the same time, an encapsulant 14 including a cube portion 141 and a lens portion 142 is disposed on the main body 11 In this way, a new light-emitting diode structure 1 having a small volume and easily completing wire bonding is completed.

(2) In addition to this, the present invention, in particular, has a triangular mark (polar mark 16) planned on the bottom surface of the main body 11; thus, when the engineer wants to configure the novel light-emitting diode structure 1 to On top of a circuit board, the engineer can know the electrical configuration direction of the LED structure 1 by the triangular pattern (i.e., the polarity mark 16) used as the circuit symbol of the LED.

It is to be understood that the foregoing detailed description of the preferred embodiments of the present invention is not intended to limit the scope of the invention, Both should be included in the scope of the patent in this case.

<This new type>
1‧‧‧Light emitting diode structure
11‧‧‧ Subject
12‧‧‧ lead frame
13‧‧‧LED dies
14‧‧‧Package colloid
15‧‧‧Electrode
16‧‧‧Polar sign
120‧‧‧Setting Department
121‧‧‧First Welding Department
122‧‧‧Second welding department
123‧‧‧First electrical connection
124‧‧‧Second electrical connection
141‧‧‧ cube part
142‧‧‧ lens part
151‧‧‧Electrical connection board
152‧‧‧welding board
153‧‧‧Intermediate board

<知知>
1'‧‧‧Light Diode Wafer
11'‧‧‧Insulation body
12'‧‧‧ lead frame
13'‧‧‧ radiator
14'‧‧‧Package colloid
15'‧‧‧ lens
16'‧‧‧Lighting diode
17'‧‧‧Flame powder

1 is a perspective cross-sectional view showing a conventional light-emitting diode wafer; FIG. 2 is a side cross-sectional view showing a conventional light-emitting diode wafer; FIG. 3A is a first perspective view showing a light-emitting diode structure of the present invention. 3B is a second perspective view showing the structure of the light emitting diode of the present invention; FIG. 3C is a second perspective view showing the structure of the light emitting diode of the present invention; FIG. 4A is a perspective view showing the light emitting diode of the present invention; A second perspective view of the bulk wafer structure; FIG. 4B is a second perspective view of the light emitting diode structure of the present invention

1‧‧‧Light emitting diode structure

11‧‧‧ Subject

12‧‧‧ lead frame

13‧‧‧LED dies

14‧‧‧Package colloid

15‧‧‧Electrode

120‧‧‧Setting Department

121‧‧‧First Welding Department

122‧‧‧Second welding department

123‧‧‧First electrical connection

124‧‧‧Second electrical connection

141‧‧‧ cube part

142‧‧‧ lens part

151‧‧‧Electrical connection board

152‧‧‧welding board

153‧‧‧Intermediate board

Claims (9)

A light-emitting diode structure includes: a main body; a lead frame disposed inside the main body and having a setting portion, two soldering portions and two electrical connecting portions; wherein the mounting portion and the two soldering portions The second electrical connection portion is exposed on the top surface of the main body; at least one LED die is disposed on the installation portion and electrically connected to the two solder portions through at least two bonding wires; An encapsulant is formed on the main body and covers the lead frame and the LED die; and two electrodes are attached to the two end faces of the main body. The LED structure of claim 1, wherein the LED die can be any of the following: an ultraviolet LED die, a blue LED die, a red LED die, and a green LED. A crystal grain, a combination of any two of the above, or a combination of any of the above. The illuminating diode structure as described in claim 1, wherein the encapsulant system comprises: a cube portion formed on a top surface of the body, and the four sections of the cube portion are The four sections of the body are respectively aligned; and a lens portion is formed on the cube portion. The illuminating diode structure of claim 1, wherein the electrode system comprises: an electrical connecting plate disposed on a top surface of the main body and connected to the electrical connecting portion; a soldering plate is disposed on a bottom surface of the body; and an intermediate plate is disposed on an end surface of the body for connecting the electrical connecting plate and the soldering plate. The light-emitting diode structure of claim 1, further comprising a polarity mark disposed on a bottom surface of the body. The illuminating diode structure of claim 3, wherein the encapsulant system is doped with a phosphor. The light emitting diode wafer structure of claim 4, wherein the soldering plate is a type of T-shaped plate or a square plate. The light emitting diode wafer structure of claim 5, wherein the polarity mark is a triangular mark. The light-emitting diode structure of claim 5, wherein the polarity mark is a rectangular mark and is located at one third of a bottom surface of the body.