TWM457222U - Heat dissipating device - Google Patents

Abstract

A heat dissipating device includes a vapor chamber, a cooling unit, a pump, a second guiding channel, a third guiding channel, a fourth guiding channel and a liquid. The vapor chamber has a first capillary structure formed in the vapor chamber. The cooling unit comprises a first storage chamber, a second storage chamber and a plurality of first guiding channels. The first guiding channels communicate with the first storage chamber and the second storage chamber. The second guiding channel communicates with the first storage chamber and the pump. The third guiding channel communicates with pump and the vapor chamber. The fourth guiding channel communicates with the vapor chamber and the second storage chamber. The liquid is filled in the vapor chamber. The vapor chamber, the cooling unit, the pump, the second guiding channel, the third guiding channel and the fourth guiding channel are vacuumized.

Description

Heat sink

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device using an evaporation chamber as a heat conducting substrate.

Heat sinks are closely related to the development of electronic products. Since the current in the circuit generates unnecessary heat due to the influence of the impedance when the electronic product is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic product, the electronic component may be raised because of the rising The temperature is damaged. Therefore, the advantages and disadvantages of the heat sink affect the operation of electronic products.

At present, the most commonly used heat sink for electronic products is to heat the electronic components by contacting one end of the heat pipe, and the heat radiating fins are connected to the other end, and the heat radiating fins are used to dissipate the heat radiating fins. However, the disturbing noise and high power consumption of the cooling fan at high speeds are often difficult for manufacturers to overcome. Therefore, the heat sink is created accordingly.

The general heat dissipating device uses a copper plate as a heat conduction substrate. Since the heat transfer coefficient of copper is only about 380 W/mK, when the heat generated by the electronic component per unit time is very large, the general heat dissipating device cannot effectively carry away the heat, so that Electronic devices affect their performance due to increased temperature.

The present invention provides a heat sink having an evaporation chamber as a heat conduction substrate to solve the above problems.

According to an embodiment, the heat sink of the present invention comprises an evaporation chamber, a cooling unit, a pump, a second guiding duct, a third guiding duct, a fourth guiding duct and a liquid. The evaporation chamber has a first capillary structure, and the first capillary structure is formed inside the evaporation chamber. The cooling unit includes a first storage cavity, a second storage cavity, and a plurality of first guiding pipes, wherein the first guiding pipe communicates with the first storage cavity and the second storage cavity. The second guiding duct communicates with the first storage cavity and the pump. The third guiding conduit connects the pumping and evaporation chambers. The fourth guiding duct communicates with the evaporation chamber and the second storage chamber. The liquid is filled in the evaporation chamber. The evaporation chamber, the cooling unit, the pump, the second guiding duct, the third guiding duct and the fourth guiding duct are all evacuated.

In summary, when the heat sink of the present invention is used to dissipate heat from an electronic component, the evaporation chamber system of the heat sink is attached to the electronic component. In other words, this creation replaces the traditional copper plate with a vaporization chamber as a heat conduction substrate. When the evaporation chamber absorbs the heat generated by the electronic components, the liquid in the evaporation chamber gradually evaporates due to the temperature rise, and is converted into steam. Then, the vapor flows to the cooling unit, and then returns to the liquid by cooling by the cooling unit. Finally, the liquid is self-cooled to the evaporation chamber by pumping to complete the heat dissipation cycle. The first capillary structure inside the evaporation chamber can effectively adsorb the liquid, thereby increasing the efficiency of liquid evaporation by heat. Thereby, the evaporation chamber can be effectively The heat generated by the electronic components is carried away. Therefore, the heat sink of the present invention has both liquid cooling and two-phase flow functions.

The advantages and spirit of this creation can be further understood by the following detailed description of the creation and the drawings.

1 to 3, FIG. 1 is a perspective view of a heat sink 1 according to a first embodiment of the present invention, and FIG. 2 is a perspective view of the heat sink 1 of FIG. 1 at another angle, FIG. A front view for dissipating heat to the electronic component 3 by the heat sink 1 in FIG. As shown in FIG. 1 to FIG. 3, the heat dissipating device 1 includes an evaporation chamber 10, a cooling unit 12, a pump 14, a second guiding duct 16, a third guiding duct 18, and a fourth. The guiding duct 20, a liquid 22, a plurality of fins 24 and a first fan 26 are provided.

In this embodiment, the evaporation chamber 10 has a first capillary structure 100, and the first capillary structure 100 is formed inside the evaporation chamber 10. The first capillary structure 100 may be a grooved capillary structure and a porous capillary. Structure, mesh capillary structure, powder sintered capillary structure or composite capillary structure, depending on the application. It should be noted that the composite capillary structure described above may be composed of at least two capillary structures of a grooved capillary structure, a porous capillary structure, a network capillary structure and a powder sintered capillary structure. The liquid 22 is filled in the evaporation chamber 10. Liquid 22 can be water, propanol or other liquid that is susceptible to heat evaporation.

The cooling unit 12 includes a first storage cavity 120, a second storage cavity 122, and a plurality of first guiding conduits 124. The first guiding duct 124 communicates with the first storage cavity 120 and the second storage cavity 122, the second guiding pipe 16 communicates with the first storage cavity 120 and the pump 14, and the third guiding pipe 18 communicates with the pump 14 and The chamber 10 is vaporized, and the fourth guiding duct 20 communicates with the evaporation chamber 10 and the second storage chamber 122. In this embodiment, the evaporation chamber 10, the cooling unit 12, the pump 14, the second guiding conduit 16, the third guiding conduit 18, and the fourth guiding conduit 20 are all evacuated. For example, an opening (not shown) may be reserved on one side of the evaporation chamber 10, in which the evaporation chamber 10, the cooling unit 12, the pump 14, the second guiding conduit 16, and the third guiding conduit 18 are After the assembly with the fourth guiding duct 20 is completed, the liquid 22 is filled in the evaporation chamber 10 through the opening, and vacuuming is performed. Finally, the opening is sintered and closed. Thereby, the evaporation chamber 10, the cooling unit 12, the pump 14, the second guiding duct 16, the third guiding duct 18 and the fourth guiding duct 20 can all be in a vacuum state.

The fins 24 are interleaved with the first guiding ducts 124 and are in contact with each other. In this embodiment, the heat sink 24 may be in a zigzag shape to increase the heat dissipation area of the heat sink 24, but is not limited thereto. In this embodiment, the evaporation chamber 10, the cooling unit 12 and the heat sink 24 may be made of aluminum, copper or other materials having high thermal conductivity, depending on the practical application; the second guiding duct 16, the third guiding The pipe 18 and the fourth guiding pipe 20 may be made of copper or plastic, but not limited thereto. The first fan 26 is disposed on one side of the first guiding duct 124 and the heat sink 24 . In this embodiment, the first fan 26 can be an axial fan, but is not limited thereto. When the first fan 26 is running, the first fan 26 can generate airflow. A guiding duct 124 is carried away with heat on the fins 24.

As shown in FIG. 3, when the heat sink 1 is used to dissipate heat from the electronic component 3, the evaporation chamber 10 of the heat sink 1 is attached to the electronic component 3. When the evaporation chamber 10 absorbs the heat generated by the electronic component 3, the liquid 22 in the evaporation chamber 10 gradually evaporates due to an increase in temperature, and is converted into a vapor. In this embodiment, the first capillary structure 100 inside the evaporation chamber 10 can effectively adsorb the liquid 18, thereby increasing the efficiency of the liquid 18 being thermally evaporated. Thereby, the evaporation chamber 10 can effectively carry away the heat generated by the electronic component 3. Then, the vapor flows to the second storage cavity 122 of the cooling unit 12 via the fourth guiding duct 20 in the direction indicated by the arrow in FIG. 3, and then flows to the first guiding direction in the direction indicated by the arrow in FIG. Pipe 124. At this time, the heat of the vapor is sucked away by the fins 24 in contact with the first guiding duct 124 and carried away by the airflow generated by the first fan 26, so that the vapor is cooled back to the liquid 18. Finally, the liquid 18 is sent back to the evaporation chamber 10 from the first storage chamber 120 via the second guiding conduit 16 and the third guiding conduit 18 by the pump 14, thereby completing the heat dissipation cycle, wherein in FIG. The direction indicated by the arrow is the direction of the heat dissipation cycle. In general, a drive element (not shown) such as a motor is provided in the pump 14 to cause the liquid 18 to flow in the direction indicated by the arrow in FIG.

As shown in FIG. 3, the second guiding duct 16 may have a second capillary structure 160, and the second capillary structure 160 is formed inside the second guiding duct 16; the third guiding duct 18 may have a third The capillary structure 180, and the third capillary structure 180 is formed inside the third guiding duct 18. The second capillary structure 160 and the third capillary structure 180 may be grooves Capillary structure, porous capillary structure, reticular capillary structure, powder sintered capillary structure or composite capillary structure, depending on the practical application. The second capillary structure 160 and the third capillary structure 180 can adsorb the liquid 18, thereby accelerating the return of the liquid 18 from the first storage cavity 120 into the evaporation chamber 10.

For the first picture, please refer to Figure 4. Fig. 4 is a perspective view of the heat sink 1' according to the second embodiment of the present invention. The main difference between the heat dissipating device 1 ′ and the heat dissipating device 1 is that the heat dissipating device 1 ′ further includes a second fan 28 , and the second fan 28 and the first fan 26 are respectively disposed on the first guiding duct 124 and dissipating heat. The opposite sides of the sheet 24. In this embodiment, the second fan 28 can also be an axial fan, but is not limited thereto. When the first fan 26 and the second fan 28 are simultaneously operated, the first fan 26 and the second fan 28 generate airflow to carry away the heat on the first guiding duct 124 and the heat sink 24. Thereby, an excessively high rotational speed of the single fan can be avoided to cause annoying noise. It should be noted that the components of the same reference numerals as those shown in FIG. 1 are substantially the same, and will not be described again.

For the first to third figures, please refer to Figures 5 to 7. 5 is a perspective view of a heat dissipating device 1" according to a third embodiment of the present invention, FIG. 6 is a perspective view of the heat dissipating device 1" in FIG. 5, and FIG. 7 is a heat dissipating device in FIG. 1" Front view of heat dissipation of the electronic component 3. The heat sink 1" is mainly different from the heat sink 1 described above in that the evaporation chamber 10 of the heat sink 1" is parallel to the cooling unit 12, and the heat sink 1 is evaporated. The cavity 10 is perpendicular to the cooling unit 12. Therefore, as shown in Figures 3 and 7, the creation can be based on the electronic component 3 on an electronic device (not shown). In the placement position of the electronic device and the internal space of the electronic device, the heat dissipating device 1 or the heat dissipating device 1" is used to dissipate the electronic component 3. It should be noted that the fifth to seventh figures are the same as those shown in the first to third figures. The components of the label have the same principle of operation and will not be described again here.

With Figure 5, please refer to Figure 8. Figure 8 is a perspective view of a heat sink 1"" according to a fourth embodiment of the present invention. The main difference between the heat dissipating device 1 ′′′ and the heat dissipating device 1 ′′ is that the heat dissipating device 1 ′′′ further includes a second fan 28 , and the second fan 28 and the first fan 26 are respectively disposed on the first guiding unit. The second fan 28 can also be an axial fan, but not limited thereto. When the first fan 26 and the second fan 28 are simultaneously operated, The first fan 26 and the second fan 28 can generate airflow to carry away the heat on the first guiding duct 124 and the heat sink 24. Thereby, the excessive rotation speed of the single fan can be avoided to generate annoying noise. Yes, the components of the same reference numerals as those shown in FIG. 5 are substantially the same, and will not be described again.

In summary, when the heat sink of the present invention is used to dissipate heat from an electronic component, the evaporation chamber system of the heat sink is attached to the electronic component. In other words, this creation replaces the traditional copper plate with a vaporization chamber as a heat conduction substrate. When the evaporation chamber absorbs the heat generated by the electronic components, the liquid in the evaporation chamber gradually evaporates due to the temperature rise, and is converted into steam. Then, the vapor flows to the cooling unit, and then returns to the liquid by cooling by the cooling unit. Finally, the liquid is self-cooled to the evaporation chamber by pumping to complete the heat dissipation cycle. The first capillary structure inside the evaporation chamber can effectively adsorb the liquid, thereby increasing the efficiency of liquid evaporation by heat. Thereby, the evaporation chamber can be effectively The heat generated by the electronic components is carried away. Therefore, the heat sink of the present invention has both liquid cooling and two-phase flow functions.

The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.

1, 1', 1", 1'''‧‧‧ heat sink

3‧‧‧Electronic components

10‧‧‧Evaporation chamber

12‧‧‧Cooling unit

14‧‧‧ pump

16‧‧‧Second guiding pipeline

18‧‧‧ Third guiding duct

20‧‧‧fourth guiding pipeline

22‧‧‧Liquid

24‧‧‧ Heat sink

26‧‧‧First fan

28‧‧‧second fan

100‧‧‧First capillary structure

120‧‧‧First storage chamber

122‧‧‧Second storage cavity

124‧‧‧First guiding duct

160‧‧‧Second capillary structure

180‧‧‧ Third capillary structure

Fig. 1 is a perspective view of a heat sink according to a first embodiment of the present invention.

Fig. 2 is a perspective view of the heat sink of Fig. 1 from another perspective.

Fig. 3 is a front view of the heat sink of Fig. 1 for dissipating heat from electronic components.

Fig. 4 is a perspective view of a heat sink according to a second embodiment of the present invention.

Fig. 5 is a perspective view of a heat sink according to a third embodiment of the present invention.

Figure 6 is a perspective view of the heat sink of Figure 5 in another perspective.

Figure 7 is a front elevational view of the heat sink of Figure 5 for dissipating heat from electronic components.

Figure 8 is a perspective view of a heat sink according to a fourth embodiment of the present invention.

1‧‧‧heating device

3‧‧‧Electronic components

10‧‧‧Evaporation chamber

12‧‧‧Cooling unit

14‧‧‧ pump

16‧‧‧Second guiding pipeline

18‧‧‧ Third guiding duct

20‧‧‧fourth guiding pipeline

22‧‧‧Liquid

26‧‧‧First fan

100‧‧‧First capillary structure

120‧‧‧First storage chamber

122‧‧‧Second storage cavity

160‧‧‧Second capillary structure

180‧‧‧ Third capillary structure

Claims (10)

A heat dissipating device comprising: an evaporation chamber having a first capillary structure, the first capillary structure being formed inside the evaporation chamber; a cooling unit comprising a first storage cavity and a second storage cavity And a plurality of first guiding conduits, the first guiding conduits are connected to the first storage cavity and the second storage cavity; a pump; a second guiding conduit connecting the first storage cavity with a pumping unit; a third guiding duct connecting the pump and the evaporation chamber; a fourth guiding duct connecting the evaporation chamber and the second storage chamber; and a liquid filling the evaporation chamber In the body; wherein the evaporation chamber, the cooling unit, the pump, the second guiding duct, the third guiding duct and the fourth guiding duct are all evacuated. The heat dissipating device of claim 1, further comprising a plurality of fins, the fins being staggered and in contact with the first guiding ducts. The heat sink of claim 2, wherein the fins are in a zigzag shape. The heat dissipation device of claim 2, further comprising a first fan disposed on one side of the first guiding duct and the heat sink. The heat dissipating device of claim 4, further comprising a second fan, wherein the second fan and the first fan are respectively disposed on opposite sides of the first guiding duct and the heat sink. The heat sink of claim 1, wherein the liquid is water or propanol. The heat dissipating device of claim 1, wherein the second guiding duct has a second capillary structure, and the second capillary structure is formed inside the second guiding duct. The heat dissipating device of claim 1, wherein the third guiding duct has a third capillary structure, and the third capillary structure is formed inside the third guiding duct. The heat sink of claim 1, wherein the evaporation chamber is perpendicular to the cooling unit. The heat sink of claim 1, wherein the evaporation chamber is parallel to the cooling unit.