CN102686082A - Heat sink and method for manufacturing the same - Google Patents

Abstract

A heat sink and its manufacturing method, the said heat sink includes a first cavity, a second cavity and plural connecting pieces, the first cavity, two cavities are separately defined, and these two ends of connecting pieces connect the first cavity, two cavities and connect the first cavity, two cavities through a channel, therefore, the working liquid in the first cavity will be vaporized and pass through the channel to the second cavity, and send back to the first cavity through the channel after condensing into liquid state in the second cavity, and then achieve the heat dissipation.

Description

Heat sink and manufacturing method thereof

technical field

The present invention relates to a heat dissipation device, especially a heat dissipation device capable of improving heat conduction and heat dissipation performance and reducing the overall weight of the heat dissipation device and its manufacturing method. the

Background technique

As the industry continues to evolve, the removal of cooling or heat has always been a major obstacle to the development of the electronics industry. With the requirement of high performance, improvement of integration and multi-functional application, the requirement of heat dissipation is also faced with a great challenge, so the research and development of heat transfer efficiency has become the main subject of the electronics industry. the

The heat dissipation fins are usually used to dissipate the heat of the component or system into the atmosphere; and in the case of low thermal resistance, it shows that the heat dissipation fin has high heat dissipation efficiency. Generally speaking, the thermal resistance is composed of the diffusion thermal resistance inside the heat sink and the convection thermal resistance between the surface of the heat sink and the atmospheric environment; in applications, high conductivity materials such as copper and aluminum are often used for The heat sink is made to reduce the thermal resistance of diffusion; however, the thermal resistance of convection limits the performance of the heat sink, making it unable to meet the heat dissipation requirements of the new generation of electronic components. the

Accordingly, the current market is focusing on a more efficient heat dissipation mechanism, and has successively proposed heat pipes with high thermal conductivity, and combined the heat pipe with heat sinks to effectively solve the current heat dissipation problem. question. the

In actual use, one end of the heat pipe is used as an evaporating section and connected to a heat pipe seat installed on an electronic component, while the other end of the heat pipe is used as a condensation section for the installation of a large number of cooling fins Please refer to shown in Figure 1, which is a perspective view of a conventional heat dissipation device. The conventional heat dissipation device 10 is composed of a radiator 11 with a plurality of heat dissipation fins and at least one heat pipe 12. The heat pipe 12. One end is a condensing end 121 and the other end is an evaporating end 122. The condensing end 121 is passed through the radiator 11, and the evaporating end 122 absorbs the heat energy generated by the electronic components. In this way, when the heat pipe 12 evaporates When the end 122 is heated, the heat transfer medium in the evaporation end 122 will vaporize and absorb a large amount of vaporization heat and lower the temperature of the electronic components, and then when the heat transfer medium diffuses to the condensation end 121 of the heat pipe 12 in vapor state, the heat transfer The medium can then be attached to the capillary structures and condensed into a liquid state to flow back toward the evaporation end 122 of the heat pipe 12 , and at the same time dissipate a large amount of heat of liquefaction through the radiators 11 . the

The heat sink 11 of the existing heat dissipation device 10 is composed of a plurality of heat dissipation fins, and is penetrated by the condensation end 121 of the heat pipe 12, and the number of heat dissipation fins and the number of heat pipes 12 used to achieve a better heat dissipation effect It is also bound to increase relatively, and then cause the increase of its overall volume and weight, and the vaporization and liquefaction of its heat transfer medium are all completed in the heat pipe 12, so the heat dissipation efficiency of its cooling device 10 is also limited; so the prior art has the following disadvantages:

1. The overall volume is large and heavy;

2. The heat transfer and cooling efficiency is limited. the

Therefore, how to solve the problems and deficiencies of the above-mentioned prior art is the direction that the author of this case and related manufacturers engaged in this industry want to study and improve. the

Contents of the invention

The main purpose of the present invention is to provide a heat sink that can reduce the overall weight of the heat sink and its manufacturing method.

A secondary objective of the present invention is to provide a heat dissipation device capable of improving heat conduction efficiency and heat dissipation performance and a manufacturing method thereof. the

In order to achieve the above object, the present invention proposes a heat dissipation device, comprising: a first cavity, a second cavity and a plurality of connectors, a first cavity and a second cavity are defined in the first cavity A second chamber is defined in the body, and the two ends of the connectors respectively have a first opening and a second opening, a passage is communicated between the first opening and the second opening, and the first opening is connected to the The first cavity, and the second opening is connected to the second cavity, so that the first cavity of the first cavity communicates with the second cavity of the second cavity through the passage; thereby After being heated, the working liquid in the first chamber will vaporize and pass through the channel to the second chamber, condense into a liquid state in the second chamber, and then send it back to the first chamber through the channel to achieve heat dissipation. It can have the characteristics of greatly improving its heat dissipation efficiency and reducing the overall volume and weight at the same time. the

To achieve the above object, the present invention proposes a method of manufacturing a heat sink, which includes: providing a first cavity and defining a first cavity; providing a second cavity and defining a second cavity; then Provide a plurality of connectors and each connector defines a channel; connect the first cavity and the second cavity through the plurality of connectors, and make the channel communicate with the first chamber and the second chamber; provide a A conduit, the conduit has a first end exposed outside the second chamber, and a second end connected to the second chamber; through the conduit, the air in the first chamber, the passage and the second chamber is drawn out, and then passed through The conduit feeds the working fluid into the second chamber; then closes the first end of the conduit; thereby, the working fluid fed from the second chamber flows into the first chamber, and the working fluid in the first chamber After the liquid is heated, it will vaporize and pass through the channel to the second chamber, and condense into a liquid state in the second chamber, and then send it back to the first chamber through the channel to achieve heat dissipation, so that it can improve its heat dissipation efficiency and reduce the overall temperature at the same time. The characteristics of volume and weight; so the present invention has the following advantages:

1. Reduce the overall volume and weight;

2. Improve heat conduction efficiency and heat dissipation performance. the

Description of drawings

Fig. 1 is the three-dimensional view of prior art radiator;

Fig. 2 is the three-dimensional view of cooling device of the present invention;

Fig. 3 is the front sectional view of heat dissipation device of the present invention;

Fig. 4 is the implementation schematic diagram of cooling device of the present invention;

Fig. 5 is the front sectional view of another cooling device of the present invention;

Fig. 6 is the perspective view of another cooling device of the present invention;

Figure 7A is a front sectional view one of another heat dissipation device of the present invention;

Fig. 7B is the second front sectional view of another cooling device of the present invention;

Fig. 8 is the flow chart of the manufacturing method of cooling device of the present invention;

Fig. 9 is the implementation schematic diagram of the manufacturing method of heat sink of the present invention;

Description of main component symbols

Cooling device 20

First chamber 30

First chamber 31

The first port 32

Second cavity 40

Second chamber 41

Second port 42

Connector 50

First opening 51

Second opening 52

Channel 53

capillary layer 60

Radiating fin set 70

Catheter 80

first end 81

second end 82

Detailed ways

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. the

Please refer to Figures 2, 3, and 4, which are perspective views, front sectional views and implementation schematic diagrams of the first embodiment of the heat dissipation device of this invention. As shown in the figure, the heat dissipation device 20 includes a first cavity 30, a first cavity Two cavities 40 and a plurality of connectors 50;

A first chamber 31 is defined in the first chamber 30, and the first chamber 31 contains a working liquid, and the two ends of the connectors 50 respectively have a first opening 51 and a second opening 52, A channel 53 is communicated between the first opening 51 and the second opening 52, and the first opening 51 is connected to the first cavity 30, and the first cavity 30 has a plurality of first openings 51 corresponding to the position. A port 32, and the first opening 51 is extended to connect the first port 32, and the channel 53 communicates with the first chamber 31 through the first opening 51;

A second chamber 41 is defined in the second cavity 40, and the second opening 52 is connected to the second cavity 40, and the second cavity 40 has a plurality of second passages corresponding to the second opening 52. The mouth 42, and the second opening 52 is extended to connect the second port 42, and the passage 53 communicates with the second chamber 41 through the second opening 52;

Thus, the heat dissipation device 20 can be arranged around a heat source (that is, it is arranged near the heat source in a contact or non-contact manner). In this embodiment, the first cavity 30 is a so-called The evaporating end or heating end, and its first cavity 30 absorbs the heat/thermal energy scattered by its heat source in the surrounding environment, and guides the heat/thermal energy to the second cavity 40, and the second cavity 40 is It is the so-called condensation end or heat dissipation end, that is, when the heat source generates heat/heat energy, the first cavity 30 absorbs the heat/heat energy generated by it, and the working liquid in the first chamber 31 After being heated, it evaporates upwards, and then passes through at least one channel 53 to the second chamber 41 until the vapor reaches the second chamber 41 to release latent heat and then turns into a liquid, and then is sent back to the first chamber 31 by the remaining channels 53 to complete a work cycle and achieve heat dissipation. the

Or the second cavity 40 is arranged around the heat source, the second cavity 40 is the so-called evaporation end or the heating end, and the first cavity 30 is the so-called condensation end. Or the heat dissipation end can also complete a working cycle to achieve the effect of heat dissipation. the

Please refer to Fig. 5, which is another preferred embodiment of the heat dissipation device of the present invention. The overall structure and component connection relationship are roughly the same as those of the previous embodiment, and the same parts will not be repeated here. In this embodiment Compared with the previous embodiment, the difference is that at least one capillary structure layer 60 is provided on the inner wall of the first cavity 30, the second cavity 40 and the connecting piece 50, so that when the heating component generates heat, the first The working fluid flowing in the cavity 30 on the capillary structure layer 60 is then heated and evaporated into steam, and after the steam reaches the second chamber 41 and releases latent heat, it turns into a liquid, and then passes through the capillary structure of the second chamber 41 and the channel 53 The capillary force of the layer 60 flows back to the first chamber 31 to complete a working cycle to dissipate heat. the

Please refer to Fig. 6, which is another preferred embodiment of the heat dissipation device 20 of the present invention. The overall structure and component connection relationship are roughly the same as those of the previous embodiment. Compared with the previous embodiment, the difference in the example is that there is at least one cooling fin set 70 between the adjacent connectors 50, so that when steam or liquid passes through the passage 53 (as shown in FIG. 3 ), it can The heat can be dissipated through its heat dissipation fin group 70 at the same time, thereby improving the heat dissipation effect of its heat dissipation device 20. the

Please refer to FIG. 7A, which is another preferred embodiment of the heat dissipation device of the present invention. The overall structure and component connection relationship are roughly the same as those of the previous embodiment, and the same points will not be repeated here. In this embodiment, the same The difference from the previous embodiment is that the second openings 52 are of equal or unequal height, that is, the second openings 52 of part of the channel 53 pass through the second port 42 and extend to the second chamber 41 position, so that after the working liquid in the first chamber 31 is heated, the evaporated steam can be sent to the second chamber 41 through the second opening 52 extending the channel 53 of the second chamber 41, and the steam reaches the second chamber 41 After the latent heat is released, the passage 53 of the second port 42 can be extended from the second opening 52 to flow to the first chamber 31 after being converted into a liquid, and the passage 53 of its liquid and vapor has been effectively distinguished; please refer to FIG. The second cavity 40 is arranged around/adjacent to the heat source, and its second cavity 40 is the so-called evaporation end or heating end, and its first cavity 30 is the so-called condensation end or heat dissipation. At the end, the first openings 51 are in a state of equal height or unequal height, that is, the first opening 51 of a part of the channel 53 extends to the position of the first chamber 31 through the first through opening 32, so as to After the working liquid in the second chamber 41 is heated, the evaporated steam can be sent to the first chamber 31 through the first opening 51 extending the channel 53 of the first chamber 31, and the steam reaches the first chamber 31 to release latent heat and then turns into a liquid Then the channel 53 of the first port 32 can be extended from the first opening 51 to flow to the second chamber 41, and the channel 53 of liquid and steam can be effectively distinguished. the

Please refer to Figures 8 and 9, which are the flow chart and implementation diagram of the first embodiment of the manufacturing method of the heat dissipation device 20 of the present invention and combined with reference to Figures 2, 3, and 4. The above-mentioned structure is completed through the following steps, as shown in the figure , the manufacturing method of the heat sink of the present invention comprises the following steps:

Step 1 (sp1): providing a first cavity and defining a first cavity;

A first cavity 30 is provided and the first cavity 30 and the space formed therein are defined as a first cavity 31 , and a plurality of first openings 32 are formed on one side of the first cavity 31 . the

Step 2 (sp2): providing a second cavity and defining a second cavity;

A second cavity 40 is provided and the second cavity 40 and the space formed therein are defined as a second cavity 41 , and a plurality of second openings 42 are formed on one side of the second cavity 41 . the

Step 3 (sp3): providing a plurality of connectors and each connector defines a channel;

A plurality of connectors 50 are provided, and the two ends of the connectors 50 respectively have a first opening 51 and a second opening 52, and a channel 53 is communicated between the first opening 51 and the second opening 52. the

Step 4 (sp4): connecting the first cavity and the second cavity through a plurality of connectors, and making the channel communicate with the first cavity and the second cavity;

The two ends of these connectors 50 are respectively connected to the first cavity 30 and the second cavity 40, and the first opening 51 is correspondingly connected to the first port 32, and the second opening 52 is correspondingly connected to the first opening 52. The two ports 42 make their channels 53 communicate with the first chamber 31 and the second chamber 41 . the

Step 5 (sp5): Provide a catheter to be set in either the first cavity or the second cavity;

The conduit 80 has a first end 81 and a second end 82. When the conduit 80 is installed in the first cavity 30, the first end 81 is exposed outside the first cavity 30, and the second End 82 communicates with the first chamber 31, or when the conduit 80 is disposed in the second chamber 40, the first end 81 is exposed outside the second chamber 40, and the second end 82 communicates with the second chamber 40. The second chamber 41 ; in this embodiment, its conduit is set in the first chamber 30 . the

Step 6 (sp6): pumping out the air in the first chamber, the channel and the second chamber through the conduit, and then feeding the working fluid into any one of the first chamber or the second chamber through the conduit;

The air in the first chamber 31, the passage 53 and the second chamber 41 is extracted through the conduit 80, so that a vacuum appears in the first chamber 31, the passage 53 and the second chamber 41, and then through the duct 80 The conduit 80 feeds the working fluid into any one of the first chamber 31 or the second chamber 41 ; and in this embodiment, it is implemented by feeding the working fluid into the first chamber 31 . the

Step 7 (sp7): closing the first end of the catheter. the

The first end of the conduit 80 is closed so that the first cavity 30 , the channel 53 and the second cavity 40 are in a vacuum and closed state. the

Thereby, the first cavity 30 is arranged around the heat source, and when it is used to absorb the heat/thermal energy generated by the heat source, the first cavity 30 absorbs the heat emitted by the heat source to the surrounding environment / heat energy, make the working liquid in the first chamber 31 evaporate upward after being heated, and then pass through at least one of the passages 53 to the second chamber 41 until the steam reaches the second chamber 41 and releases latent heat and then turns into a liquid , and then sent back to the first chamber 31 through the remaining channels 53 to complete a working cycle and achieve heat dissipation. the

At least one capillary structure layer 60 can be formed on the first chamber 31, the second chamber 41 and the channel 53, so that when the heating element generates heat, the first cavity 30 is on the capillary structure layer 60 The flowing working fluid is then heated and evaporated into steam, and after the steam reaches the second chamber 41 and releases latent heat, it turns into a liquid, and then flows back to the first chamber through the capillary force of the capillary structure layer 60 of the second chamber 41 and the channel 53. A chamber 31 completes a working cycle to dissipate heat. the

In addition, after the first cavity 30 , the channel 53 and the second cavity 40 are in a vacuum and closed state, there is a step of removing the conduit 60 so that the cooling device 20 can be assembled and used. the

Although the present invention is disclosed as above in terms of implementation, it is not intended to limit the present invention. Any skilled person can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined in the scope of the appended patent application. the

Claims (11)

1. a heat abstractor is characterized in that, comprises:

One first cavity defines one first chamber;

One second cavity defines one second chamber;

The plural number connector; These connectors have one first opening and one second opening and at least one passage; This first and second opening is connected with this passage; First opening of these connectors and second opening connect aforementioned first cavity and this second cavity respectively, and are connected with this first cavity and this second cavity through this passage.

2. heat abstractor as claimed in claim 1 is characterized in that, said first cavity has plural first port corresponding to the first aperture position place, and this first opening system extends said first port of connection or extends to first chamber through said first port.

3. heat abstractor as claimed in claim 1 is characterized in that, said second cavity has plural second port corresponding to the second aperture position place, and this second opening system extends said second port of connection or extends to second chamber through said second port.

4. heat abstractor as claimed in claim 1 is characterized in that, said connecting portion passage sees through first opening and said first chamber of second open communication and second chamber.

5. heat abstractor as claimed in claim 1 is characterized in that, has at least one radiating fin group between said adjacent connecting portion.

6. heat abstractor as claimed in claim 1 is characterized in that, has at least one capillary structure layer and hydraulic fluid in said first cavity and second cavity and the connector.

7. a heat abstractor manufacturing approach is characterized in that, comprises the following step:

One first cavity is provided and defines one first chamber;

One second cavity is provided and defines one second chamber;

Provide plural connector and each connector to define a passage;

See through plural connector and connect said first cavity and second cavity, and make said first chamber of channel connection and second chamber;

Provide conduit to select to be located at first cavity or second cavity is wherein arbitrary;

See through this conduit the air in first chamber and the passage and second chamber is extracted out, it is wherein arbitrary with this first chamber of hydraulic fluid feed-in or second chamber to see through this conduit again; And first end of this conduit of sealing.

8. heat abstractor manufacturing approach as claimed in claim 7 is characterized in that, group is provided with at least one radiating fin group between said adjacent connector.

9. heat abstractor manufacturing approach as claimed in claim 7 is characterized in that, is formed with at least one capillary structure layer on said first chamber and second chamber and the passage.

10. heat abstractor manufacturing approach as claimed in claim 7 is characterized in that, seal first end of this conduit after, have more step system its conduit removed.

11. heat abstractor manufacturing approach as claimed in claim 7 is characterized in that, said conduit has one first end and one second end; When this conduit is located at said first cavity; This first end system is outer to be exposed at outside this first cavity, and second end is communicated with this first chamber, again or this conduit when being located at said second cavity; Be exposed at outside this second cavity outside this first end system, and second end is communicated with this second chamber.

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