M363193 • m - ·- 五、新型說明： 〜 卜 【新型所屬之技術領域】 本創作係關於-種可釋放遠紅外線與熱輕射之散熱基 板’可將發熱源的熱能轉換成遠紅外線，將熱能輻射傳遞 的散熱基板。 【先前技術】 ' 熱的傳遞方式包括三種，分別是傳導 '對流與輻射， φ 一般用於印刷電路板、金屬基板及金屬板的散熱，多是使 用散熱片及風扇，藉由散熱片傳導熱量以及風扇產生的氣 流造成對流，使熱量可發散，達到散熱目的。 目前電子產業以微小化為發展趨勢，以往具有強大散 熱功此的散熱片及風扇，因佔用空間遠比印刷電路板、金 屬基板及金屬板大，在強調商品精緻微小化的現在，已成 為電子產業急需解決的問題。 而近年來遠紅外線技術迅速發展，遠紅外線是指一種 • 不可見光的光波，一般定義光波的波長介於7〇〇 5〇〇〇·是 近紅外線，8,000〜14,000nm是遠紅外線，遠紅外線是以輻 射方式傳導熱量，可節約空間使用且具有快速的反應速 、度，許多的加熱器材皆以照射遠紅外線作為加熱方式。因 此以其節省空間及快速反應的特性，為一適合使用於電子 產業的技術。 【新型内容】 本創作以電子產業所用的印刷電路板、金屬基板及金 屬板為發熱源，因印刷電路板或金屬基板為單層或具有多 M363193 -* - ·— - * ~ * _ 層金屬層的電路板，其上設有積體電路或其他易發熱的電 子7C件’而金屬板為直接或間接接觸發熱源的傳導散熱基 板’若以遠紅外線材質彼覆其上，形成遠紅外線坡覆層， 藉吸收印刷電路板、金屬基板及金屬板等發熱體產生的熱 激發出遠紅外線，再以光的方式將熱輻射傳遞，則可在有 限的元件與空間中，不需增加散熱器材或風扇即可提升散 熱的效果。 • 本創作者以石墨粉、碳粉或陶莞粉末，以單一或數種混 δ方式製成粉末，再將粉末與半固態黏著劑充分混合成半 固態膠體，塗佈於作為發熱源的印刷電路板、金屬基板及 金屬板，使具有發熱源的印刷電路板、金屬基板及金屬板 表面开> 成遠紅外線坡覆層’在產生熱能同時，便可即時以 輻射方式散熱，提升散熱效果。 綜上所述’本創作具有以下的優點： 1.本創作可釋放遠紅外線與熱輻射之散熱基板，可利 Β 用現有的印刷電路板、金屬基板及金屬板直接提升 散熱的效果’不需另增加散熱器材或風扇。 2.本創作可釋放遠紅外線與熱輻射之散熱基板，可節 約空間使用且具有快速的反應速度。 ^ 【實施方式】 % 請參閱第1圖所示，可釋放遠紅外線與熱輻射之散熱 基板包括一散熱基板1以及一遠紅外線坡覆層2;其中， 請參閱第2圖、第3圖以及第4圖所示，該散熱基板1 為印刷電路板11(如第2圖所示）或金屬基板12(如第3圖 4 M363193 所示）或金屬板13(如第4圖所示），其中該印刷電路板u 為單層電路板；金屬基板12為具有鋁、銅等金屬的多層電 路板，金屬板13則為紹、銅等適合散熱的金屬板體。 該遠紅外線披覆層2係以石墨粉及碳粉，以單一或混 合方式製成粉末，再與半固態黏著劑充分混合後，成為半 固態膠體，塗佈於散熱基板丨一面或一面以上。 • 請參閱第3圖所示，本創作將遠紅外線披覆層2塗佈 於散熱基板1的一面或一面以上，可使散熱基板丨發熱源3 產生的熱量，直接藉遠紅外線披覆層2吸收並激發出遠紅 外線，將熱能以光的形式，藉熱輻射方式快速傳遞發散。 另，本創作的遠紅外線披覆層2，尚可在石墨及碳粉以 單一或混合方式製成的粉末中，再加入陶瓷粉末混合，成 為石墨粉與陶瓷粉末的混合粉末，或碳粉與陶瓷粉末的混 合粉末，或石墨粉、碳粉與陶竟粉末的混合粉末與半固態 黏著劑充分混合而成。 【圖式簡單說明】 第 1圖 係本創作之側視圖。 第 2圖 係本創作用於印刷電路板之立體圖。 第 3圖 係本創作用於金屬基板之立體圖。 第 4圖 係本創作用於金屬板之立體圖。 【主要元件符號說明】 I. 散熱基板 II. 印刷電路板 13.金屬板 2. 遠紅外線彼覆層 12.金屬基板 3. 發熱源M363193 • m - ·- V. New description: ~ 卜 [New technical field] This creation is about a kind of heat-dissipating substrate that can release far-infrared rays and heat-light radiation, which can convert the heat energy of the heat source into far-infrared rays. A heat dissipating substrate that transmits thermal energy radiation. [Prior Art] 'The heat transfer method includes three kinds, which are conduction 'convection and radiation, φ is generally used for heat dissipation of printed circuit boards, metal substrates and metal plates. Most of them use heat sinks and fans to conduct heat through heat sinks. And the airflow generated by the fan causes convection, so that the heat can be dissipated for heat dissipation purposes. At present, the electronics industry is developing with miniaturization. In the past, heat sinks and fans with powerful heat dissipation have become much larger than printed circuit boards, metal substrates and metal plates. The industry urgently needs to solve the problem. In recent years, far-infrared technology has developed rapidly. Far-infrared rays refer to a kind of light wave that is invisible. Generally, the wavelength of light waves is defined by 7〇〇5〇〇〇· is near-infrared, 8,000~14,000nm is far-infrared, far-infrared is Conducting heat by radiation can save space and have a fast response speed and degree. Many heating equipments use far infrared rays as a heating method. Therefore, it is a technology suitable for the electronics industry because of its space saving and rapid response characteristics. [New content] This creation uses printed circuit boards, metal substrates and metal plates used in the electronics industry as a heat source. The printed circuit board or metal substrate is a single layer or has many M363193 -* - · - - * ~ * _ layer metals The circuit board of the layer is provided with an integrated circuit or other heat-generating electronic 7C piece 'and the metal plate is a conductive heat-dissipating substrate directly or indirectly contacting the heat source'. If it is covered with a far-infrared material, a far infrared ray slope is formed. Layer, by absorbing the heat generated by the heating element such as printed circuit board, metal substrate and metal plate to excite far infrared rays, and then transmitting the heat radiation by light, it is possible to increase the heat sink material or the space in a limited component and space. The fan can improve the heat dissipation effect. • The creator uses graphite powder, carbon powder or pottery powder to make a powder in a single or several mixed δ manners, and then thoroughly mixes the powder with a semi-solid adhesive to form a semi-solid colloid, which is applied to printing as a heat source. The circuit board, the metal substrate and the metal plate enable the surface of the printed circuit board, the metal substrate and the metal plate with the heat source to be turned into a far-infrared sloping layer to generate heat at the same time, and can radiate heat in a timely manner to improve the heat dissipation effect. . In summary, the author has the following advantages: 1. This creation can release the heat-dissipating substrate of far-infrared rays and heat radiation, and can directly improve the heat-dissipating effect by using existing printed circuit boards, metal substrates and metal plates. Add a radiator or fan. 2. This creation can release the heat-dissipating substrate of far-infrared rays and heat radiation, which can save space and have a fast reaction speed. ^ [Embodiment] % Please refer to Figure 1, the heat sink substrate that can release far infrared rays and heat radiation includes a heat dissipation substrate 1 and a far infrared ray slope layer 2; As shown in FIG. 4, the heat dissipation substrate 1 is a printed circuit board 11 (as shown in FIG. 2) or a metal substrate 12 (as shown in FIG. 3, M363193) or a metal plate 13 (as shown in FIG. 4). The printed circuit board u is a single-layer circuit board; the metal substrate 12 is a multi-layer circuit board having a metal such as aluminum or copper, and the metal plate 13 is a metal plate body suitable for heat dissipation such as a copper or a copper. The far-infrared coating layer 2 is made of graphite powder and carbon powder in a single or mixed manner, and is sufficiently mixed with a semi-solid adhesive to form a semi-solid colloid, which is applied to one side or more of the heat-dissipating substrate. • Referring to Figure 3, this application applies the far-infrared coating layer 2 to one or more surfaces of the heat-dissipating substrate 1, so that the heat generated by the heat-dissipating substrate and the heat source 3 can be directly applied to the far-infrared coating layer 2 Absorbs and excites far-infrared rays, and transfers heat in the form of light, which is quickly transmitted and radiated by means of thermal radiation. In addition, the far infrared ray coating layer 2 of the present invention can be mixed with ceramic powder in a powder prepared by graphite or carbon powder in a single or mixed manner, and becomes a mixed powder of graphite powder and ceramic powder, or carbon powder and A mixed powder of ceramic powder, or a mixture of graphite powder, carbon powder and ceramic powder and a semi-solid adhesive. [Simple description of the diagram] Figure 1 is a side view of the creation. Figure 2 is a perspective view of a printed circuit board. Figure 3 is a perspective view of a metal substrate. Figure 4 is a perspective view of the creation of a metal plate. [Description of main component symbols] I. Heat-dissipating substrate II. Printed circuit board 13. Metal plate 2. Far-infrared coating 12. Metal substrate 3. Heat source