CN108454185A - Graphite material radiating fin - Google Patents
Graphite material radiating fin Download PDFInfo
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- CN108454185A CN108454185A CN201710090842.4A CN201710090842A CN108454185A CN 108454185 A CN108454185 A CN 108454185A CN 201710090842 A CN201710090842 A CN 201710090842A CN 108454185 A CN108454185 A CN 108454185A
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- 239000007770 graphite material Substances 0.000 title claims abstract description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 76
- 230000005855 radiation Effects 0.000 claims abstract description 70
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 55
- 239000010439 graphite Substances 0.000 claims abstract description 55
- 239000010410 layer Substances 0.000 claims description 41
- 239000002245 particle Substances 0.000 claims description 16
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000002077 nanosphere Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000011241 protective layer Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910021383 artificial graphite Inorganic materials 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910021382 natural graphite Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B32B9/048—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
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Abstract
Description
技术领域technical field
本发明涉及一种散热器，特别是一种石墨材料辐射散热片。The invention relates to a radiator, in particular to a graphite material radiation radiator.
背景技术Background technique
现有的散热器以金属散热器为主流，其主要藉由热传导的方式自发热源吸收热能，再进一步藉由热对流的方式辐射发散至环境空气中。考虑在金属材料的热传递特性、价格以及重量之间取得平衡，一般金属散散热器常使用的金属材料为铝或者铜，铝的热传导系数(K)约为200W/(m·K)，而铜的热传导系数(K)约为400W/(m·K)，为热传导效率较佳的金属材料之中价格相对较低者。传统的金属散热器藉由改变其鳍片的构造以求达到更好的热对流效率，但现有的金属散热器受限于金属本身的热传递特性极限，已难有更大幅的进展。Existing heat sinks are mainly made of metal heat sinks, which mainly absorb heat energy from a heat source through heat conduction, and then further radiate and radiate into the ambient air through heat convection. Considering the balance between the heat transfer characteristics, price and weight of metal materials, the metal materials commonly used in metal radiators are aluminum or copper, and the thermal conductivity (K) of aluminum is about 200W/(m·K), while The heat conductivity coefficient (K) of copper is about 400W/(m·K), which is relatively cheap among metal materials with better heat conduction efficiency. Traditional metal heat sinks achieve better heat convection efficiency by changing the structure of their fins, but the existing metal heat sinks are limited by the limit of the heat transfer characteristics of the metal itself, and it is difficult to make further progress.
有鉴于此，本发明人遂针对上述现有技术，特潜心研究并配合学理的运用，尽力解决上述之问题点，即成为本发明人改良之目标。In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's improvement.
发明内容Contents of the invention
本发明提供一种石墨材料制成的辐射散热片。The invention provides a radiation heat sink made of graphite material.
本发明提供一种石墨材料散热片，用以对应一发热源设置，其包含一石墨导热片及一热辐射层。石墨导热片的其中一面用以吸收所述发热源产生的热能。热辐射层覆盖在石墨导热片的另一面。The invention provides a heat sink made of graphite material, which is used for setting corresponding to a heat source, which includes a graphite heat conduction sheet and a heat radiation layer. One side of the graphite heat conducting sheet is used for absorbing heat energy generated by the heat source. The heat radiation layer is covered on the other side of the graphite heat conduction sheet.
优选地，上述热辐射层与上述石墨导热片之间夹设有一黏着层。Preferably, an adhesive layer is interposed between the heat radiation layer and the graphite heat conducting sheet.
优选地，上述热辐射层为片状热辐射材料。Preferably, the above-mentioned heat radiation layer is a sheet-shaped heat radiation material.
优选地，上述热辐射层为由一片状石墨烯构成。Preferably, the above-mentioned heat radiation layer is made of sheet-like graphene.
优选地，上述热辐射层为由单一片状石墨烯构成。Preferably, the above-mentioned heat radiation layer is composed of a single sheet of graphene.
优选地，上述热辐射层为相互接合延伸的复数片状石墨烯构成。Preferably, the above-mentioned heat radiation layer is composed of a plurality of sheets of graphene jointed and extended.
优选地，上述热辐射层包含有覆盖在上述石墨导热片的一固着结构、以及分散嵌埋在该固着结构的复数热辐射颗粒。Preferably, the heat radiation layer includes a fixing structure covering the graphite heat conducting sheet, and a plurality of heat radiation particles dispersed and embedded in the fixing structure.
优选地，上述热辐射颗粒为石墨烯碎片。Preferably, the above-mentioned heat radiation particles are graphene fragments.
优选地，上述热辐射颗粒为奈米碳球。Preferably, the above-mentioned heat radiation particles are carbon nanospheres.
优选地，上述固着结构为固化的胶态材料。Preferably, the above-mentioned fixing structure is a cured colloidal material.
本发明的石墨材料散热片能够藉由其石墨导热片自发热源吸收热能并且快速扩散，再进一步藉由热辐射层以热辐射方式快速发散。其相较于现有的金属散热器具有更好的散热效率。The heat sink made of graphite material of the present invention can absorb heat energy from a heat source through its graphite heat conduction sheet and quickly diffuse it, and further dissipate heat energy rapidly through a heat radiation layer in a heat radiation manner. Compared with the existing metal heat sink, it has better heat dissipation efficiency.
附图说明Description of drawings
图1是本发明第一实施例之石墨材料散热片之示意图。FIG. 1 is a schematic diagram of a heat sink made of graphite material according to the first embodiment of the present invention.
图2是本发明第二实施例之石墨材料散热片之示意图。FIG. 2 is a schematic diagram of a heat sink made of graphite material according to a second embodiment of the present invention.
图3是本发明第三实施例之石墨材料散热片之示意图。FIG. 3 is a schematic diagram of a heat sink made of graphite material according to a third embodiment of the present invention.
图4是本发明之石墨材料散热片之另一配置方式示意图。Fig. 4 is a schematic diagram of another configuration of the graphite heat sink of the present invention.
【主要部件符号说明】【Description of main component symbols】
10 发热源10 heat source
20 外壳20 shells
100 石墨导热片100 graphite thermal pad
200 热辐射层200 thermal radiation layers
210 固着结构210 Fixed structure
220 热辐射颗粒220 Heat Radiant Particles
300 黏着层300 adhesive layer
400 保护层400 layers of protection
具体实施方式Detailed ways
参阅图1，本发明之第一实施例提供一种石墨材料散热片，其用以对应一发热源10设置以进行辐射散热，其中发热源10利如IC芯片、电路板或是其它发热组件。于本实施例中，本发明的石墨材料散热片包含有一石墨导热片100以及一热辐射层200。Referring to FIG. 1 , the first embodiment of the present invention provides a heat sink made of graphite material, which is configured to correspond to a heat source 10 for radiation heat dissipation, wherein the heat source 10 is for example an IC chip, a circuit board or other heat generating components. In this embodiment, the graphite heat sink of the present invention includes a graphite heat conduction sheet 100 and a heat radiation layer 200 .
石墨导热片100为片状的石墨(Graphite)，石墨烯为碳原子的六边形键结相连构成的多层层迭结构，其可以是天然石墨或是人工石墨，天然石墨的热传导系数(K)约为600W/(m·K)以上，而人工石墨的热传导系数(K)约为1500W/(m·K)以上 。石墨导热片100的其中一面用以吸收发热源10产生的热能，并且将该些热能传导扩散至石墨导热片100的各部分。Graphite heat conducting sheet 100 is flake graphite (Graphite). Graphene is a multi-layer laminated structure formed by hexagonal bonds of carbon atoms. It can be natural graphite or artificial graphite. The thermal conductivity of natural graphite (K ) is about 600W/(m·K) or more, while the thermal conductivity (K) of artificial graphite is about 1500W/(m·K) or more. One side of the graphite heat conducting sheet 100 is used to absorb heat energy generated by the heat source 10 , and conduct and diffuse the heat energy to various parts of the graphite heat conducting sheet 100 .
热辐射层200覆盖在石墨导热片100的另一面。于本实施例中热辐射层200为片状热辐射材料制成，其较佳地为一片片状的石墨烯(Graphene)所构成，石墨烯为碳原子的六边形键结相连构成的单层平面状键结构。其中，片状的石墨烯可以是单一的片状石墨烯，也可以是复数片状石墨烯平铺相接而构成。热辐射层200与石墨导热片100之间夹设有一黏着层300，藉由黏着层300将热辐射层200黏着固定在石墨导热片100之上，而且热辐射层200覆盖有一保护层400，保护层400为绝缘且能够被热辐射穿透，其保护层400较佳地是由PET(聚对苯二甲酸乙二酯；polyethylene terephthalate)制成。由于片状的石墨烯难以直接覆盖在石墨导热片100上，因此片状的石墨较佳地先行形成在黏着层300或是保护层400再贴附至石墨导热片100。The heat radiation layer 200 covers the other side of the graphite heat conducting sheet 100 . In this embodiment, the heat radiation layer 200 is made of a sheet-shaped heat radiation material, which is preferably composed of a sheet-shaped graphene (Graphene). Graphene is a single hexagonal bond of carbon atoms. Layer planar key structure. Wherein, the sheet-shaped graphene may be a single sheet-shaped graphene, or may be composed of a plurality of sheet-shaped graphenes tiled together. An adhesive layer 300 is interposed between the heat radiation layer 200 and the graphite heat conduction sheet 100, and the heat radiation layer 200 is adhered and fixed on the graphite heat conduction sheet 100 by the adhesive layer 300, and the heat radiation layer 200 is covered with a protective layer 400 to protect The layer 400 is insulating and can be penetrated by heat radiation, and the protective layer 400 is preferably made of PET (polyethylene terephthalate). Since it is difficult for flake graphene to cover directly on the graphite heat conduction sheet 100 , the flake graphite is preferably firstly formed on the adhesive layer 300 or the protective layer 400 and then attached to the graphite heat conduction sheet 100 .
参阅图2，本发明之第二实施例提供一种石墨材料散热片，其用以对应一发热源10设置以进行辐射散热，其中发热源10利如IC芯片。于本实施例中，本发明的石墨材料散热片包含有一石墨导热片100以及一热辐射层200。Referring to FIG. 2 , the second embodiment of the present invention provides a heat sink made of graphite material, which is configured to correspond to a heat source 10 for radiation heat dissipation, wherein the heat source 10 is such as an IC chip. In this embodiment, the graphite heat sink of the present invention includes a graphite heat conduction sheet 100 and a heat radiation layer 200 .
石墨导热片100为片状的石墨，其可以是天然石墨或是人工石墨。石墨导热片100的其中一面用以吸收发热源10产生的热能，并且将该些热能传导扩散至石墨导热片100的各部分。The graphite heat conduction sheet 100 is flake graphite, which can be natural graphite or artificial graphite. One side of the graphite heat conducting sheet 100 is used to absorb heat energy generated by the heat source 10 , and conduct and diffuse the heat energy to various parts of the graphite heat conducting sheet 100 .
热辐射层200覆盖在石墨导热片100的另一面。于本实施例中，热辐射层200与石墨导热片100之间夹设有一黏着层300，藉由黏着层300将热辐射层200黏着固定在石墨导热片100之上，而且热辐射层200覆盖有一保护层400，保护层400为绝缘且能够被热辐射穿透，其保护层400较佳地是由PET(聚对苯二甲酸乙二酯；polyethylene terephthalate)制成。The heat radiation layer 200 covers the other side of the graphite heat conducting sheet 100 . In this embodiment, an adhesive layer 300 is interposed between the heat radiation layer 200 and the graphite heat conduction sheet 100, and the heat radiation layer 200 is adhered and fixed on the graphite heat conduction sheet 100 by the adhesive layer 300, and the heat radiation layer 200 covers There is a protective layer 400 which is insulating and can be penetrated by heat radiation. The protective layer 400 is preferably made of PET (polyethylene terephthalate).
热辐射层200包含有覆盖在石墨导热片100一固着结构210以及分散嵌埋在固着结构210的复数热辐射颗粒220。固着结构210为固化的胶态材料(例如胶或是漆)且较佳地为绝缘的胶态材料以避免导电至发热源而造成发热源损坏，热辐射颗粒220可以是石墨烯碎片，热辐射颗粒220也可以是奈米碳球，奈米碳球为碳原子所构成的球状键结结构。The heat radiation layer 200 includes a fixing structure 210 covering the graphite heat conducting sheet 100 and a plurality of heat radiation particles 220 dispersed and embedded in the fixing structure 210 . The fixing structure 210 is a cured colloidal material (such as glue or paint) and is preferably an insulating colloidal material to avoid conduction to the heat source and cause damage to the heat source. The heat radiation particles 220 can be graphene fragments, and the heat radiation The particles 220 may also be carbon nanospheres, which are spherical bonded structures composed of carbon atoms.
其制作方式可以先将热辐射颗粒220与未固化的胶态材料混合后能够均匀分散，而后再将混合物以喷涂、涂布或是印刷之方式覆盖在黏着层300，再藉由黏着层300贴附石墨导热片100而构成。另一种其制作方式可以将辐射颗粒与未固化的胶态材料的混合物以喷涂、涂布或是印刷之方式覆盖在保护层400，再上喷涂、涂布或是印刷之方式在热辐射层200上覆盖黏着层300，再藉由黏着层300贴附石墨导热片100而构成。Its production method can firstly mix the heat radiation particles 220 with the uncured colloidal material and then disperse them evenly, and then cover the mixture on the adhesive layer 300 by spraying, coating or printing, and then paste it with the adhesive layer 300 It is constructed with a graphite heat conduction sheet 100 . Another way of making it can cover the protective layer 400 with the mixture of radiation particles and uncured colloidal material by spraying, coating or printing, and then spray, coat or print on the heat radiation layer 200 is covered with an adhesive layer 300 , and then the graphite heat conduction sheet 100 is attached to the adhesive layer 300 to form a structure.
参阅图3，本发明之第三实施例提供一种石墨材料散热片，其用以对应一发热源10设置以进行辐射散热，其中发热源10利如IC芯片。于本实施例中，本发明的石墨材料散热片包含有一石墨导热片100以及一热辐射层200。Referring to FIG. 3 , the third embodiment of the present invention provides a heat sink made of graphite material, which is configured to correspond to a heat source 10 for radiation heat dissipation, wherein the heat source 10 is such as an IC chip. In this embodiment, the graphite heat sink of the present invention includes a graphite heat conduction sheet 100 and a heat radiation layer 200 .
石墨导热片100为片状的石墨，其可以是天然石墨或是人工石墨 。石墨导热片100的其中一面用以吸收发热源10产生的热能，并且将该些热能传导扩散至石墨导热片100的各部分。The graphite heat conducting sheet 100 is flake graphite, which can be natural graphite or artificial graphite. One side of the graphite heat conducting sheet 100 is used to absorb heat energy generated by the heat source 10 , and conduct and diffuse the heat energy to various parts of the graphite heat conducting sheet 100 .
热辐射层200覆盖在石墨导热片100的另一面。于本实施例中热辐射层200包含有覆盖在石墨导热片100一固着结构210，以及分散嵌埋在固着结构210的复数热辐射颗粒220。固着结构210为固化的胶态材料(例如胶或是漆)且较佳地为绝缘的胶态材料以避免导电至发热源而造成发热源损坏，热辐射颗粒220可以是石墨烯碎片，热辐射颗粒220也可以是奈米碳球，奈米碳球为碳原子所构成的球状键结结构。而且热辐射层200覆盖有一保护层400，保护层400为绝缘且能够被热辐射穿透，其保护层400较佳地是由PET(聚对苯二甲酸乙二酯；polyethylene terephthalate)制成。The heat radiation layer 200 covers the other side of the graphite heat conducting sheet 100 . In this embodiment, the heat radiation layer 200 includes a fixing structure 210 covering the graphite heat conducting sheet 100 , and a plurality of heat radiation particles 220 scattered and embedded in the fixing structure 210 . The fixing structure 210 is a cured colloidal material (such as glue or paint) and is preferably an insulating colloidal material to avoid conduction to the heat source and cause damage to the heat source. The heat radiation particles 220 can be graphene fragments, and the heat radiation The particles 220 may also be carbon nanospheres, which are spherical bonded structures composed of carbon atoms. Moreover, the heat radiation layer 200 is covered with a protective layer 400 , which is insulating and can be penetrated by heat radiation. The protective layer 400 is preferably made of PET (polyethylene terephthalate).
其制作方式可以先将热辐射颗粒220与未固化的胶态材料混合后能够均匀分散，而后再将混合物以喷涂、涂布或是印刷之方式覆盖在石墨导热片100而构成。Its production method can firstly mix the heat radiation particles 220 with the uncured colloidal material to disperse evenly, and then cover the graphite heat conducting sheet 100 with the mixture by spraying, coating or printing.
于前述的各实施例中，本发明的石墨材料散热片皆是贴附设置在发热源10，其石墨导热片100接触发热源10而能够藉由热传导的方式吸收发热源10产生的热能，但是本发明不限于此。参阅图4，本发明的石墨材料散热片也可以贴附设置在一电子装置的外壳20之内壁，较佳地，热辐射层200贴附于电子装置的外壳20的非金属区域之内壁，石墨导热片100对应电子装置内的发热源10配置但未接触发热源10，其藉由热辐射的方式吸收发热源10产生的热能。而且，热辐射层200能够以热辐射的方式将该些热能穿透外壳20的非金属区域发散至电子装置之外。In the foregoing embodiments, the heat sink made of graphite material of the present invention is attached to the heat source 10, and the graphite heat conduction sheet 100 is in contact with the heat source 10 and can absorb the thermal energy generated by the heat source 10 through heat conduction. The present invention is not limited thereto. Referring to Fig. 4, the heat sink made of graphite material of the present invention can also be attached to the inner wall of the housing 20 of an electronic device. Preferably, the heat radiation layer 200 is attached to the inner wall of the non-metallic region of the housing 20 of the electronic device. The heat conduction sheet 100 is disposed corresponding to the heat source 10 in the electronic device but not in contact with the heat source 10 , and absorbs heat energy generated by the heat source 10 by means of thermal radiation. Moreover, the heat radiation layer 200 can transmit the heat energy through the non-metallic region of the casing 20 to the outside of the electronic device in the form of heat radiation.
综上所述，本发明的石墨材料散热片能够藉由其石墨导热片100自发热源10吸收热能并藉由石墨导热片100以热传导的方式快速扩散，再进一步藉由热辐射层200以热辐射方式快速发散。其相较于现有的金属散热器具有更好的散热效率且能够穿透塑料结构的阻碍，再者其体形轻巧而能够适用更多的用途，且成低廉且便于运送及安装。To sum up, the graphite heat sink of the present invention can absorb heat energy from the heat source 10 through the graphite heat conduction sheet 100 and rapidly spread it through heat conduction through the graphite heat conduction sheet 100 , and further radiate heat through the heat radiation layer 200 Ways to diverge quickly. Compared with the existing metal heat sink, it has better heat dissipation efficiency and can penetrate the obstruction of the plastic structure. Furthermore, it is light in size and can be used for more purposes, and it is cheap and easy to transport and install.
以上所述仅为本发明之较佳实施例，非用以限定本发明之专利保护范围，其它运用本发明之专利精神之等效变化，均应俱属本发明之专利保护范围。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of patent protection of the present invention. Other equivalent changes using the spirit of the patent of the present invention should all fall within the scope of patent protection of the present invention.
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