TWI858094B - Trimming method - Google Patents
Trimming method Download PDFInfo
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- TWI858094B TWI858094B TW109122953A TW109122953A TWI858094B TW I858094 B TWI858094 B TW I858094B TW 109122953 A TW109122953 A TW 109122953A TW 109122953 A TW109122953 A TW 109122953A TW I858094 B TWI858094 B TW I858094B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
[課題]本發明提供一種修整方法,其可抑制平面修整所需要的時間。[解決手段]一種修整方法,具備:位置檢測步驟ST4,其以攝像單元拍攝被保持在保持台上的修整板,檢測修整板的外周緣的位置;定位步驟ST6,其將從修整板的一端朝向另一端的方向定位成與主軸的軸心平行,且以由位置檢測步驟ST4所檢測出之修整板的外周緣的位置為基準,將切割刀片的下端定位在修整板的一端的外側且切入修整板的切入深度;以及修整步驟ST7,其在實施定位步驟ST6後,使切割刀片對於修整板進行相對移動,從修整板的一端往另一端進行切割,藉此將切割刀片的前端平坦化。[Topic] The present invention provides a trimming method that can reduce the time required for plane trimming. [Solution] A trimming method, comprising: a position detection step ST4, which detects the position of the outer periphery of the trimming plate by photographing the trimming plate held on the holding table with a camera unit; a positioning step ST6, which positions the direction from one end of the trimming plate to the other end to be parallel to the axis of the main shaft, and positions the lower end of the cutting blade to the outer side of one end of the trimming plate and cuts into the trimming plate based on the position of the outer periphery of the trimming plate detected by the position detection step ST4; and a trimming step ST7, which, after implementing the positioning step ST6, causes the cutting blade to move relative to the trimming plate and cuts from one end of the trimming plate to the other end, thereby flattening the front end of the cutting blade.
Description
本發明係關於切割刀片的平面修整方法。The invention relates to a surface finishing method for a cutting blade.
以切割刀片切割由矽、砷化鎵、SiC(碳化矽)、藍寶石等所構成的半導體基板、樹脂封裝基板、陶瓷基板等各種板狀的被加工物之切割裝置,若切割被加工物,則有切割刀片的刀刃前端會變形成剖面圓弧狀的狀況。In a cutting device that uses a dicing blade to cut various plate-shaped workpieces such as semiconductor substrates, resin package substrates, ceramic substrates, etc., which are made of silicon, gallium arsenide, SiC (silicon carbide), sapphire, etc., when cutting the workpiece, the front end of the cutting blade may be deformed into a cross-sectional arc shape.
切割裝置有定期將切割刀片的刀刃前端沿著主軸的軸心進行平坦化的平面修整者(例如,參照專利文獻1)。專利文獻1所示之修整方法係使切割刀片在主軸的軸心方向從黏貼在膠膜上且安裝於框架之修整板的一端移動至另一端為止,並以切割刀片切割修整板,藉此進行平面修整。因此,切割裝置會預先記憶修整板的大小,並基於修整板的大小而設定切割刀片的移動距離。 [習知技術文獻] [專利文獻]The cutting device has a surface trimmer that regularly flattens the front end of the cutting blade along the axis of the main shaft (for example, refer to Patent Document 1). The trimming method shown in Patent Document 1 is to move the cutting blade from one end to the other end of a trimming plate adhered to a film and mounted on a frame in the axis direction of the main shaft, and cut the trimming plate with the cutting blade to perform surface trimming. Therefore, the cutting device will pre-memorize the size of the trimming plate and set the moving distance of the cutting blade based on the size of the trimming plate. [Known Technical Document] [Patent Document]
[專利文獻1] 日本特開2010-588號公報[Patent Document 1] Japanese Patent Application Publication No. 2010-588
[發明所欲解決的課題] 專利文獻1所示之修整方法係搬送單元保持框架,以框架中心與保持台中心重疊之方式進行搬送。因此,修整方法因卡盤中心與修整板中心會因修整板對於框架的黏貼位置誤差及搬送誤差而未必一致,故切割刀片會在修整板外周緣更外側的餘裕寬度量的位置間移動。然而,專利文獻1所示之修整方法,切割刀片的移動距離對應餘裕寬度量而變長,故修整所需要的時間長,迫切期望縮短修整所需要的時間。[Problems to be solved by the invention] The trimming method shown in Patent Document 1 is to transport the frame by a transport unit so that the center of the frame overlaps the center of the holding table. Therefore, in the trimming method, the center of the chuck and the center of the trimming plate may not be consistent due to the error in the pasting position of the trimming plate to the frame and the transport error, so the cutting blade moves between positions with a margin width outside the outer periphery of the trimming plate. However, in the trimming method shown in Patent Document 1, the moving distance of the cutting blade becomes longer according to the margin width, so the time required for trimming is long, and it is urgently desired to shorten the time required for trimming.
尤其,相較於如一般的切割般使切割刀片在X軸方向相對移動而切割被加工物之情形,平面修整因對切割刀片施加負荷,故將相對移動速度設定成低速。因此,迫切期望能盡可能地將平面修整的餘裕寬度設定成較短。In particular, compared to the case where the cutting blade is moved relatively in the X-axis direction to cut the workpiece as in normal cutting, the relative moving speed is set to a lower speed in surface trimming because a load is applied to the cutting blade. Therefore, it is highly desired to set the margin width of surface trimming as short as possible.
本發明係有鑑於此問題點而完成者,其目的係提供一種修整方法,可抑制平面修整所需要的時間。The present invention is made in view of this problem, and its purpose is to provide a trimming method that can reduce the time required for plane trimming.
[解決課題的技術手段] 為了解決上述課題並達成目的,本發明的修整方法係被固定在主軸的前端的切割刀片的平面修整方法,所述修整方法的特徵在於,具備:位置檢測步驟,其以攝像手段拍攝被保持在保持台上的修整板,檢測該修整板的外周緣的位置;定位步驟,其將從該修整板的一端朝向另一端的方向定位成與該主軸的軸心平行,且以由該位置檢測步驟所檢測出之該修整板的外周緣的位置為基準,將該切割刀片的下端定位在該修整板的一端的外側且切入該修整板的預定高度位置;以及修整步驟,其在實施該定位步驟後,使該切割刀片對於該修整板進行相對移動,從該修整板的該一端往另一端進行切割,藉此將該切割刀片的前端平坦化。[Technical means for solving the problem] In order to solve the above-mentioned problem and achieve the purpose, the trimming method of the present invention is a method for trimming the plane of a cutting blade fixed to the front end of a main shaft. The trimming method is characterized in that it has: a position detection step, which uses a photographic means to shoot the trimming plate held on the holding table to detect the position of the outer periphery of the trimming plate; a positioning step, which positions the direction from one end of the trimming plate to the other end to be aligned with the main shaft. The cutting blade is parallel to the axis of the shaft, and based on the position of the outer periphery of the trimming plate detected by the position detection step, the lower end of the cutting blade is positioned on the outer side of one end of the trimming plate and cuts into the predetermined height position of the trimming plate; and a trimming step, after implementing the positioning step, the cutting blade is moved relative to the trimming plate, cutting from one end of the trimming plate to the other end, thereby flattening the front end of the cutting blade.
在前述修整方法中,可具備:切割完成區域記憶步驟,其記憶關於由該修整步驟所切割之該修整板的切割完成區域之資訊;加工步驟,其在實施該修整步驟後,從該保持台上搬出該修整板,以該保持台保持被加工物,以該切割刀片切割該保持台上的被加工物;第二定位步驟,其在實施該加工步驟後,從該保持台上搬出被加工物,以該保持台保持該修整板,基於由該位置檢測步驟所檢測出之該修整板的外周緣的位置與由該切割完成區域記憶步驟所記憶之關於該修整板的切割完成區域之資訊,將該切割刀片的下端定位在該修整板的一端的外側且切入該修整板的預定高度位置;以及第二修整步驟,其在實施該第二定位步驟後,使該切割刀片對於該修整板進行相對移動,從該修整板的該一端往另一端進行切割。In the aforementioned trimming method, there may be: a cutting completion area memory step, which memorizes information about the cutting completion area of the trimming plate cut by the trimming step; a processing step, which after the trimming step is performed, moves the trimming plate from the holding table, holds the workpiece on the holding table, and cuts the workpiece on the holding table with the cutting blade; a second positioning step, which after the processing step is performed, moves the workpiece from the holding table, holds the trimming plate on the holding table , based on the position of the outer periphery of the trimming plate detected by the position detection step and the information about the cutting completion area of the trimming plate stored in the cutting completion area storage step, the lower end of the cutting blade is positioned on the outer side of one end of the trimming plate and cuts into a predetermined height position of the trimming plate; and a second trimming step, after implementing the second positioning step, the cutting blade is moved relative to the trimming plate to cut from one end of the trimming plate to the other end.
[發明功效] 本案發明的修整方法會發揮所謂可抑制平面修整所需要的時間之效果。[Effect of the invention] The trimming method of the present invention has the effect of reducing the time required for plane trimming.
基於用於實施本發明的方式(實施方式),一邊參照圖式一邊詳細地說明。本發明不受限於以下實施方式所記載的內容。並且,在以下所記載的構成要素中,包含本發明所屬技術領域中具有通常知識者可容易推知者、實質上相同者。再者,以下所記載的構成能適當組合。並且,在不脫離本發明的要旨的範圍內,可進行構成的各種省略、取代或變更。The present invention will be described in detail based on the method for implementing the present invention (implementation method) with reference to the drawings. The present invention is not limited to the contents described in the following implementation method. Furthermore, the constituent elements described below include those that can be easily inferred by a person having ordinary knowledge in the technical field to which the present invention belongs and are substantially the same. Furthermore, the structures described below can be appropriately combined. Furthermore, various omissions, substitutions, or changes in the structures can be made without departing from the gist of the present invention.
[實施方式1] 基於圖式說明本發明的實施方式1之修整方法。圖1係表示實施實施方式1之修整方法的切割裝置的構成例之立體圖。圖2係表示將圖1所示之切割裝置的切割刀片進行平面修整的修整板的一例之立體圖。圖3係實施方式1之修整方法的平面修整前的切割刀片的刀刃前端的剖面圖的一例。圖4係圖3所示之切割刀片的平面修整後的切割刀片的刀刃前端的剖面圖的一例。圖5係表示實施方式1之修整方法的修整開始位置及修整收納位置等之修整板的俯視圖。圖6係表示實施方式1之修整方法的切入深度等之修整板的側剖面圖。[Implementation method 1] The trimming method of implementation method 1 of the present invention is described based on the drawings. FIG1 is a perspective view showing an example of the structure of a cutting device for implementing the trimming method of implementation method 1. FIG2 is a perspective view showing an example of a trimming plate for trimming the cutting blade of the cutting device shown in FIG1. FIG3 is an example of a cross-sectional view of the front end of the blade of the cutting blade before the flat trimming of the trimming method of implementation method 1. FIG4 is an example of a cross-sectional view of the front end of the blade of the cutting blade after the flat trimming of the cutting blade shown in FIG3. FIG5 is a top view of the trimming plate showing the trimming start position and trimming storage position of the trimming method of implementation method 1. FIG6 is a side view of the trimming plate showing the cutting depth of the trimming method of implementation method 1.
實施方式1之修整方法係藉由圖1所示之切割裝置1而實施。圖1所示之切割裝置1係將板狀物亦即被加工物200進行切割(加工)的裝置。在實施方式1中,被加工物200係將矽、藍寶石、鎵等作為母材之圓板狀的半導體晶圓、光元件晶圓等晶圓。被加工物200係在正面201的格子狀區域形成有元件203,所述格子狀區域係藉由形成為格子狀的多條分割預定線202而劃分。本發明的被加工物200可為中央部被薄化且外周部形成厚壁部之所謂TAIKO(註冊商標)晶圓,除了晶圓之外,也可為具有多個被樹脂密封之元件的矩形的封裝基板、陶瓷板、玻璃板等。被加工物200係在背面204黏貼圓板狀的黏著膠膜206,且在黏著膠膜206的外周緣黏貼內徑大於被加工物200的外徑之環狀的環狀框架205,並被支撐在環狀框架205的內側的開口。The trimming method of embodiment 1 is implemented by the cutting device 1 shown in Figure 1. The cutting device 1 shown in Figure 1 is a device for cutting (processing) a plate-like object, that is, a workpiece 200. In embodiment 1, the workpiece 200 is a wafer such as a circular plate-shaped semiconductor wafer, an optical element wafer, etc. using silicon, sapphire, gallium, etc. as a base material. The workpiece 200 has elements 203 formed in a grid-like area on the front side 201, and the grid-like area is divided by a plurality of predetermined dividing lines 202 formed in a grid shape. The workpiece 200 of the present invention can be a so-called TAIKO (registered trademark) wafer having a thinned central portion and a thick-walled portion formed on the outer periphery. In addition to a wafer, it can also be a rectangular packaging substrate, a ceramic plate, a glass plate, etc. having a plurality of resin-sealed elements. The workpiece 200 has a disc-shaped adhesive film 206 attached to its back surface 204 , and a ring-shaped annular frame 205 having an inner diameter larger than the outer diameter of the workpiece 200 is attached to the outer periphery of the adhesive film 206 , and is supported by an inner opening of the annular frame 205 .
圖1所示之切割裝置1係以保持台10保持具備分割預定線202的被加工物200,並以切割刀片21沿著分割預定線202進行切割的裝置。如圖1所示,切割裝置1具備:保持台10,其以保持面11將被加工物200吸引保持;切割單元20,其利用已安裝在主軸22的切割刀片21切割被保持在保持台10的被加工物200;攝像單元30,其係拍攝被保持在保持台10的被加工物200之攝像手段;以及控制單元100,其係控制手段。The cutting device 1 shown in FIG. 1 is a device that uses a holding table 10 to hold a workpiece 200 having a predetermined dividing line 202, and uses a cutting blade 21 to cut along the predetermined dividing line 202. As shown in FIG. 1, the cutting device 1 includes: a holding table 10 that attracts and holds the workpiece 200 with a holding surface 11; a cutting unit 20 that uses a cutting blade 21 mounted on a spindle 22 to cut the workpiece 200 held on the holding table 10; a camera unit 30 that is a camera means for photographing the workpiece 200 held on the holding table 10; and a control unit 100 that is a control means.
並且,如圖1所示,切割裝置1至少具備:X軸移動單元41,其將保持台10在水平方向及與裝置本體2的短邊方向平行的X軸方向進行加工進給;Y軸移動單元42,其將切割單元20在水平方向及與裝置本體2的長邊方向平行且與X軸方向正交的Y軸方向進行分度進給;Z軸移動單元43,其將切割單元20在與垂直方向平行的Z軸方向進行切入進給,所述垂直方向係與X軸方向及Y軸方向雙方正交;旋轉移動單元44,其將保持台10繞著與Z軸方向平行的軸心旋轉,且藉由X軸移動單元41而與保持台10一起在X軸方向被加工進給。Furthermore, as shown in FIG. 1 , the cutting device 1 at least comprises: an X-axis moving unit 41, which processes and feeds the holding table 10 in the horizontal direction and in the X-axis direction parallel to the short side direction of the device body 2; a Y-axis moving unit 42, which indexes and feeds the cutting unit 20 in the horizontal direction and in the Y-axis direction parallel to the long side direction of the device body 2 and orthogonal to the X-axis direction; a Z-axis moving unit 43, which cuts and feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction, wherein the vertical direction is orthogonal to both the X-axis direction and the Y-axis direction; and a rotation moving unit 44, which rotates the holding table 10 around an axis parallel to the Z-axis direction, and is processed and fed in the X-axis direction together with the holding table 10 by the X-axis moving unit 41.
保持台10係圓盤形狀,保持被加工物200的保持面11係由多孔陶瓷等所形成。並且,保持台10被設置成藉由X軸移動單元而可移動自如且藉由旋轉驅動源而可旋轉自如。保持台10係與未圖示的真空吸引源連接,並藉由被真空吸引源吸引而吸引、保持被加工物200。並且,在保持台10的周圍設置有多個夾持環狀框架211的夾具部12。The holding table 10 is in the shape of a disk, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramics or the like. Furthermore, the holding table 10 is configured to be movable by an X-axis moving unit and rotatable by a rotation drive source. The holding table 10 is connected to a vacuum suction source (not shown) and is attracted and held by the vacuum suction source. Furthermore, a plurality of clamping parts 12 for clamping an annular frame 211 are provided around the holding table 10.
切割單元20具備安裝切割刀片21的主軸22,所述切割刀片21切割被保持在保持台10的被加工物200。切割單元20係被設置成相對於被保持在保持台10的被加工物200,可藉由Y軸移動單元42在Y軸方向移動自如且藉由Z軸移動單元43在Z軸方向移動自如。The cutting unit 20 has a spindle 22 on which a cutting blade 21 is mounted, and the cutting blade 21 cuts the workpiece 200 held on the holding table 10. The cutting unit 20 is configured to be movable in the Y-axis direction by the Y-axis moving unit 42 and in the Z-axis direction by the Z-axis moving unit 43 relative to the workpiece 200 held on the holding table 10.
如圖1所示,切割單元20係透過Y軸移動單元42、Z軸移動單元43等而設置在從裝置本體2立設的支撐框架3。切割單元20係藉由Y軸移動單元42及Z軸移動單元43,而能將切割刀片21定位在保持台10的保持面11的任意位置。As shown in FIG1 , the cutting unit 20 is provided on the support frame 3 erected from the device body 2 via the Y-axis moving unit 42 and the Z-axis moving unit 43. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 via the Y-axis moving unit 42 and the Z-axis moving unit 43.
切割單元20除了切割刀片21與已將切割刀片21安裝在前端的主軸22以外,更具備:主軸外殼23,其藉由Y軸移動單元42及Z軸移動單元43而在Y軸方向及Z軸方向移動,且將主軸22可繞著軸心旋轉自如地收納;以及未圖示的主軸馬達,其被收納在主軸外殼23內,且將主軸22繞著軸心旋轉。The cutting unit 20 is provided with, in addition to the cutting blade 21 and the spindle 22 with the cutting blade 21 mounted on the front end, a spindle housing 23 which moves in the Y-axis direction and the Z-axis direction by means of the Y-axis moving unit 42 and the Z-axis moving unit 43 and accommodates the spindle 22 so that it can rotate freely around the axis; and a spindle motor (not shown) which is accommodated in the spindle housing 23 and rotates the spindle 22 around the axis.
切割刀片21係具有略環形狀之極薄的切割磨石。主軸22係藉由使切割刀片21旋轉而切割被加工物200。主軸22被收納在主軸外殼23內,主軸外殼23被Z軸移動單元43支撐。切割單元20的主軸22及切割刀片21的軸心被設定成與Y軸方向平行。The cutting blade 21 is an extremely thin cutting grindstone having a slightly annular shape. The spindle 22 cuts the workpiece 200 by rotating the cutting blade 21. The spindle 22 is housed in a spindle housing 23, and the spindle housing 23 is supported by the Z-axis moving unit 43. The axis of the spindle 22 and the cutting blade 21 of the cutting unit 20 is set to be parallel to the Y-axis direction.
X軸移動單元41係藉由使保持台10在加工進給方向亦即X軸方向移動,而將保持台10與切割單元20相對地沿著X軸方向進行加工進給。Y軸移動單元42係藉由使切割單元20在分度進給方向亦即Y軸方向移動,而將保持台10與切割單元20相對地沿著Y軸方向進行分度進給。Z軸移動單元43係藉由使切割單元20在切入進給方向亦即Z軸方向移動,而將保持台10與切割單元20相對地沿著Z軸方向進行切入進給。The X-axis moving unit 41 moves the holding table 10 in the processing feed direction, i.e., the X-axis direction, so that the holding table 10 and the cutting unit 20 are relatively processed and fed along the X-axis direction. The Y-axis moving unit 42 moves the cutting unit 20 in the indexing feed direction, i.e., the Y-axis direction, so that the holding table 10 and the cutting unit 20 are relatively indexed and fed along the Y-axis direction. The Z-axis moving unit 43 moves the cutting unit 20 in the cutting feed direction, i.e., the Z-axis direction, so that the holding table 10 and the cutting unit 20 are relatively cut-in and fed along the Z-axis direction.
X軸移動單元41、Y軸移動單元42及Z軸移動單元43具備:周知的滾珠螺桿,其被設置成可繞著軸心旋轉自如;周知的脈衝馬達,其使滾珠螺桿繞著軸心旋轉;以及周知的導軌,其將保持台10或切割單元20支撐成在X軸方向、Y軸方向或Z軸方向可移動自如。The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 include: a well-known ball screw that is configured to be rotatable around an axis; a well-known pulse motor that causes the ball screw to rotate around the axis; and a well-known guide rail that supports the holding table 10 or the cutting unit 20 to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.
並且,切割裝置1具備:未圖示的X軸方向位置檢測單元,其用於檢測保持台10的X軸方向的位置;未圖示的Y軸方向位置檢測單元,其用於檢測切割單元20的Y軸方向的位置;以及Z軸方向位置檢測單元,其用於檢測切割單元20的Z軸方向的位置。X軸方向位置檢測單元及Y軸方向位置檢測單元可藉由與X軸方向或Y軸方向平行的線性標尺與讀頭而構成。Z軸方向位置檢測單元係利用脈衝馬達的脈衝而檢測切割單元20的Z軸方向的位置。X軸方向位置檢測單元、Y軸方向位置檢測單元及Z軸方向位置檢測單元係將保持台10的X軸方向、切割單元20的Y軸方向或Z軸方向的位置輸出至控制單元100。此外,在實施方式1中,各位置係以距預定基準位置的X軸方向、Y軸方向及Z軸方向的距離而定義。Furthermore, the cutting device 1 includes: an unillustrated X-axis direction position detection unit for detecting the position of the holding table 10 in the X-axis direction; an unillustrated Y-axis direction position detection unit for detecting the position of the cutting unit 20 in the Y-axis direction; and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be formed by a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction using a pulse of a pulse motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the X-axis direction position of the holding table 10, the Y-axis direction or the Z-axis direction position of the cutting unit 20 to the control unit 100. In addition, in the first embodiment, each position is defined by the distance from the predetermined reference position in the X-axis direction, the Y-axis direction, and the Z-axis direction.
並且,切割裝置1具備:卡匣升降機50,其載置收納切割前後的被加工物200之卡匣51且使卡匣51在Z軸方向移動;清洗單元60,其清洗切割後的被加工物200;以及未圖示的搬送單元,其使被加工物200進出卡匣51且搬送被加工物200。Furthermore, the cutting device 1 comprises: a cassette elevator 50, which carries a cassette 51 storing the workpiece 200 before and after cutting and moves the cassette 51 in the Z-axis direction; a cleaning unit 60, which cleans the workpiece 200 after cutting; and a transport unit (not shown) which allows the workpiece 200 to enter and exit the cassette 51 and transports the workpiece 200.
卡匣51係在Z軸方向空開間隔地收納多個被環狀框架205支撐的被加工物200。並且,卡匣51收納一片如圖2所示的修整板90。圖2所示的修整板90係用於平面修整切割刀片21,所述切割刀片21係因重複被加工物200的切割而刀刃24的前端例如如圖3所示般成為剖面圓弧狀。所謂平面修整,係指使圖3所示之切割刀片21一邊在與主軸的軸心平行的Y軸方向移動一邊切入修整板90,並如圖4所示般將刀刃24的前端沿著Y軸方向形成為平坦。The cassette 51 stores a plurality of workpieces 200 supported by the annular frame 205 at intervals in the Z-axis direction. In addition, the cassette 51 stores a trimming plate 90 as shown in FIG. 2 . The trimming plate 90 shown in FIG. 2 is used for plane trimming of the cutting blade 21, and the front end of the blade 24 of the cutting blade 21 is formed into a cross-sectional arc shape, for example, as shown in FIG. 3 due to repeated cutting of the workpiece 200. The so-called plane trimming means that the cutting blade 21 shown in FIG. 3 is moved in the Y-axis direction parallel to the axis of the main shaft while cutting into the trimming plate 90, and the front end of the blade 24 is formed flat along the Y-axis direction as shown in FIG. 4 .
在實施方式1中,修整板90的平面形狀被形成為矩形的平板狀。修整板90係在樹脂或陶瓷的黏合材中混入WA(白剛玉、氧化鋁系)、GC(綠色天然焦、碳化矽系)等的磨粒而構成。與被加工物200同樣地,修整板90在一側的表面黏貼圓板狀的黏著膠膜206,在黏著膠膜206的外周緣黏貼環狀框架205,並被支撐在環狀框架205的內側的開口。此外,修整板90被配置在環狀框架205的中央,但相對於環狀框架205的相對位置被設定在已預先設定的位置,但有時會偏離已預先設定的位置。In the first embodiment, the plane shape of the trimming plate 90 is formed into a rectangular flat plate. The trimming plate 90 is formed by mixing abrasive grains such as WA (corundum, alumina), GC (green natural coke, silicon carbide) into a resin or ceramic binder. Similar to the workpiece 200, the trimming plate 90 has a circular plate-shaped adhesive film 206 attached to the surface of one side, and a ring frame 205 attached to the outer periphery of the adhesive film 206, and is supported by the inner opening of the ring frame 205. In addition, the trimming plate 90 is arranged in the center of the ring frame 205, but the relative position relative to the ring frame 205 is set at a predetermined position, but sometimes deviates from the predetermined position.
修整板90被環狀框架205支撐,被收納在卡匣51的Z軸方向的已預先設定之預定位置,在實施平面修整之際,在被搬出至卡匣51外後,被吸引保持在保持台10,並藉由夾具部12夾持環狀框架205。平面修整之際,修整板90係在被保持在保持台10的狀態下,被在Y軸方向移動之切割單元20的切割刀片21的刀刃24切入,形成從上表面凹陷的切割槽95(圖5中以虛線表示),平面修整切割刀片21。The trimming plate 90 is supported by the annular frame 205 and is stored in a predetermined position in the Z-axis direction of the cassette 51. When performing surface trimming, after being carried out of the cassette 51, it is attracted and held on the holding table 10, and the annular frame 205 is clamped by the clamping part 12. During surface trimming, the trimming plate 90 is cut by the blade 24 of the cutting blade 21 of the cutting unit 20 moving in the Y-axis direction while being held on the holding table 10, forming a cutting groove 95 (indicated by a dotted line in FIG. 5 ) recessed from the upper surface, and the surface trimming cutting blade 21 is cut.
在平面修整中,切割刀片21係從被保持在保持台10的修整板90的X軸方向的一端91朝向另一端92、或從另一端92朝向一端91,對於修整板90在Y軸方向相對地移動而形成切割槽95。在平面修整中,切割刀片21在形成切割槽95後,在X軸方向移動,從被保持在保持台10的修整板90的X軸方向的另一端92朝向一端91、或從一端91朝向另一端92,對於修整板90在Y軸方向相對地移動而形成切割槽95。In the plane trimming, the cutting blade 21 moves relatively in the Y-axis direction from one end 91 of the trimming plate 90 held on the holding table 10 toward the other end 92, or from the other end 92 toward one end 91, to form the cutting groove 95. In the plane trimming, after forming the cutting groove 95, the cutting blade 21 moves in the X-axis direction, and moves relatively in the Y-axis direction from the other end 92 of the trimming plate 90 held on the holding table 10 toward one end 91, or from one end 91 toward the other end 92, to form the cutting groove 95.
在實施方式1中,在平面修整中,切割刀片21係依序從X軸方向的一端93朝向另一端94依序形成與Y軸方向平行的切割槽95。並且,比起使切割刀片21對於修整板90相對地在X軸方向移動之一般修整,平面修整因使切割刀片21在Y軸方向移動,故切割刀片21對於修整板90的相對移動速度較慢。In the first embodiment, in the plane trimming, the cutting blade 21 sequentially forms cutting grooves 95 parallel to the Y-axis direction from one end 93 in the X-axis direction toward the other end 94. Moreover, compared with the general trimming in which the cutting blade 21 moves relative to the trimming plate 90 in the X-axis direction, the plane trimming moves the cutting blade 21 in the Y-axis direction, so the relative movement speed of the cutting blade 21 relative to the trimming plate 90 is slower.
攝像單元30係以與切割單元20一體地移動之方式被固定。攝像單元30具備攝像元件,其拍攝被保持在保持台10的切割前的被加工物200的應分割區域。攝像元件係例如CCD(Charge-Coupled Device,電荷耦合裝置)攝像元件或CMOS(Complementary MOS,互補金屬氧化物半導體)攝像元件。攝像單元30係拍攝被保持在保持台10的被加工物200,獲得用於執行進行被加工物200與切割刀片21的對位之對準等的影像,並將所得的影像輸出至控制單元100。The imaging unit 30 is fixed in a manner that moves integrally with the cutting unit 20. The imaging unit 30 has an imaging element that photographs the area to be divided of the workpiece 200 held on the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 photographs the workpiece 200 held on the holding table 10, obtains an image used to perform alignment of the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.
並且,攝像單元30係在實施平面修整之際,拍攝被保持在保持台10的修整板90的外周緣,將拍攝所得的影像輸出至控制單元100。此外,在實施方式1中,攝像單元30拍攝修整板90的所有外周緣的長邊方向的中央。攝像單元30拍攝修整板90的外周緣時,對於保持台10的相對位置係被預先設定,且攝像單元30的視野範圍被設定為即使是對於環狀框架205位置偏移的修整板90亦能拍攝其外周緣的範圍。Furthermore, the camera unit 30 photographs the outer periphery of the trimming plate 90 held on the holding table 10 during the surface trimming, and outputs the photographed image to the control unit 100. In the first embodiment, the camera unit 30 photographs the center of the long side direction of all the outer peripheries of the trimming plate 90. When the camera unit 30 photographs the outer periphery of the trimming plate 90, the relative position of the camera unit 30 to the holding table 10 is preset, and the field of view of the camera unit 30 is set to a range that can photograph the outer periphery of the trimming plate 90 even if the position of the annular frame 205 is offset.
控制單元100分別控制切割裝置1的上述構成要素,使切割裝置1實施對於被加工物200的加工動作及平面修整。此外,控制單元100係具有以下裝置的電腦:具有如CPU(central processing unit,中央處理單元)之微處理器的運算處理裝置;具有如ROM(read only memory,唯讀記憶體)或RAM(random access memory,隨機存取記憶體)之記憶體的記憶裝置;以及輸入輸出介面裝置。The control unit 100 controls the above-mentioned components of the cutting device 1 respectively, so that the cutting device 1 performs processing and surface finishing on the workpiece 200. In addition, the control unit 100 is a computer having the following devices: an operation processing device having a microprocessor such as a CPU (central processing unit); a memory device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input-output interface device.
控制單元100連接:未圖示的顯示單元,其係藉由顯示加工動作的狀態及影像等的液晶顯示裝置等所構成;輸入單元,其在操作員登錄加工內容資訊等之際使用;以及通知單元110。輸入單元係藉由設置於顯示單元的觸控面板與鍵盤等外部輸入裝置中之至少一者所構成。通知單元110係藉由控制單元100而被控制,並發出光與聲音之至少一者以通知操作員。The control unit 100 is connected to: a display unit (not shown), which is composed of a liquid crystal display device that displays the state and image of the processing operation, etc.; an input unit, which is used when the operator logs in the processing content information, etc.; and a notification unit 110. The input unit is composed of at least one of an external input device such as a touch panel and a keyboard provided on the display unit. The notification unit 110 is controlled by the control unit 100 and emits at least one of light and sound to notify the operator.
加工條件係由輸入單元登錄控制單元100的記憶裝置。控制單元100的運算處理裝置係遵循記憶在記憶裝置的加工條件、電腦程式而實施運算處理,將用於控制切割裝置1的控制訊號透過輸入輸出介面裝置輸出至切割裝置1的上述構成要素。此外,在實施方式1中,加工條件包含:圖5所示之X軸方向餘裕寬度301、Y軸方向餘裕寬度302、X軸方向進給寬度303、切割刀片21對於修整板90的移動次數、及圖6所示之切入深度304。此等X軸方向餘裕寬度301、Y軸方向餘裕寬度302、X軸方向進給寬度303、切割刀片21對於修整板90的移動次數、及切入深度304係切割裝置1實施平面修整之際的加工條件。The processing conditions are registered in the memory device of the control unit 100 by the input unit. The operation processing device of the control unit 100 performs operation processing according to the processing conditions and computer programs stored in the memory device, and outputs the control signal used to control the cutting device 1 to the above-mentioned components of the cutting device 1 through the input and output interface device. In addition, in the embodiment 1, the processing conditions include: the X-axis direction margin width 301 shown in FIG. 5, the Y-axis direction margin width 302, the X-axis direction feed width 303, the number of movements of the cutting blade 21 with respect to the trimming plate 90, and the cutting depth 304 shown in FIG. 6. The X-axis direction margin width 301, the Y-axis direction margin width 302, the X-axis direction feed width 303, the number of movements of the cutting blade 21 with respect to the trimming plate 90, and the cutting depth 304 are processing conditions when the cutting device 1 performs plane trimming.
X軸方向餘裕寬度301係未實施平面修整之修整板90的X軸方向的一端93起至最初實施平面修整之際的修整開始位置401或修整結束位置402為止的X軸方向的距離。此外,修整開始位置401係在實施平面修整之際,於被保持在保持台10的修整板90的外側且切割單元20對於修整板90在Y軸方向開始移動時的切割刀片21的刀刃24的下端的位置。修整結束位置402係在實施平面修整之際,於被保持在保持台10的修整板90的外側且切割單元20對於修整板90結束在Y軸方向的移動時的切割刀片21的刀刃24的下端的位置。The X-axis direction margin width 301 is the distance in the X-axis direction from one end 93 in the X-axis direction of the trimming plate 90 that has not been subjected to surface trimming to the trimming start position 401 or the trimming end position 402 when surface trimming is first performed. In addition, the trimming start position 401 is the position of the lower end of the blade 24 of the cutting blade 21 when the trimming plate 90 is held on the holding table 10 and the cutting unit 20 starts to move the trimming plate 90 in the Y-axis direction when surface trimming is performed. The trimming end position 402 is the position of the lower end of the blade 24 of the cutting blade 21 when the trimming plate 90 is held on the holding table 10 and the cutting unit 20 ends moving the trimming plate 90 in the Y-axis direction when surface trimming is performed.
Y軸方向餘裕寬度302係修整板90的Y軸方向的端部起至修整開始位置401或修整結束位置402為止的Y軸方向的距離。此外,比起一般修整的切割刀片21對於修整板90的相對移動速度,平面修整的切割刀片21對於修整板90的相對移動速度較慢,因此Y軸方向餘裕寬度302期望是極盡可能短的距離。The Y-axis direction margin width 302 is the distance in the Y-axis direction from the end of the trimming plate 90 in the Y-axis direction to the trimming start position 401 or the trimming end position 402. In addition, compared with the relative movement speed of the cutting blade 21 of the general trimming to the trimming plate 90, the relative movement speed of the cutting blade 21 of the plane trimming to the trimming plate 90 is slower, so the Y-axis direction margin width 302 is expected to be as short as possible.
X軸方向進給寬度303係修整開始位置401與修整結束位置402之間之X軸方向的距離,亦即,在平面修整之際,在對於修整板90在Y軸方向移動後,使切割刀片21對於修整板90在X軸方向移動時的距離。The X-axis feed width 303 is the distance in the X-axis direction between the trimming start position 401 and the trimming end position 402, that is, during plane trimming, after the trimming plate 90 is moved in the Y-axis direction, the distance when the cutting blade 21 moves relative to the trimming plate 90 in the X-axis direction.
切割刀片21對於修整板90的移動次數係表示在一次的平面修整中,使切割刀片21對於修整板90在Y軸方向移動的次數、方向。在實施方式1中,切割刀片21對於修整板90的移動次數係表示將切割刀片21從被保持在保持台10的修整板90的X軸方向的一端91朝向另一端92移動,其後從另一端92朝向一端91對於修整板90在Y軸方向相對地移動的次數、方向,但在本發明中並不限於此。The number of times the cutting blade 21 moves relative to the trimming plate 90 indicates the number of times and directions in which the cutting blade 21 moves relative to the trimming plate 90 in the Y-axis direction in one plane trimming operation. In Embodiment 1, the number of times the cutting blade 21 moves relative to the trimming plate 90 indicates the number of times and directions in which the cutting blade 21 is moved from one end 91 of the trimming plate 90 held on the holding table 10 toward the other end 92 in the X-axis direction, and then moves relative to the trimming plate 90 from the other end 92 toward one end 91 in the Y-axis direction, but the present invention is not limited thereto.
切入深度304係切割刀片21切入修整板90的預訂高度位置,表示在平面修整時切入修整板90的切割刀片21的刀刃24的下端距修整板90的上表面的距離。並且,控制單元100記憶關於切割刀片21的刀刃24的外徑之資訊。關於切割刀片21的刀刃24的外徑之資訊係從輸入單元登錄,或藉由切割裝置1的未圖示的基準位置設定機構登錄在記憶裝置。The cutting depth 304 is a predetermined height position of the cutting blade 21 cutting into the trimming plate 90, and indicates the distance between the lower end of the blade 24 of the cutting blade 21 cutting into the trimming plate 90 and the upper surface of the trimming plate 90 during flat trimming. In addition, the control unit 100 memorizes information about the outer diameter of the blade 24 of the cutting blade 21. The information about the outer diameter of the blade 24 of the cutting blade 21 is registered from the input unit or registered in the memory device by the reference position setting mechanism (not shown) of the cutting device 1.
並且,如圖1所示,控制單元100具備:切割完成區域記憶部101、修整範圍設定部102、以及控制部103。切割完成區域記憶部101係在平面修整中,記憶關於切割刀片21的刀刃24切入所形成之修整板90的切割完成區域601(圖14所示)之資訊。在實施方式1中,作為關於切割完成區域601之資訊,係記憶平面修整時切割刀片21對於修整板90在Y軸方向移動的移動次數的累積次數。As shown in FIG1 , the control unit 100 includes a cut-finished area memory unit 101, a trimming range setting unit 102, and a control unit 103. The cut-finished area memory unit 101 stores information about a cut-finished area 601 (shown in FIG14 ) of a trimming plate 90 formed by the cutting edge 24 of the cutting blade 21 during plane trimming. In Embodiment 1, the information about the cut-finished area 601 is the cumulative number of times the cutting blade 21 moves the trimming plate 90 in the Y-axis direction during plane trimming.
修整範圍設定部102係以下所示者:在切割完成區域記憶部101所記憶之作為關於切割完成區域601之資訊的移動次數是零次之情形,從攝像單元30拍攝未實施平面修整的修整板90的外周緣所得的影像算出修整板90的外周緣的位置,基於餘裕寬度301、302、X軸方向進給寬度303、平面修整時的切割刀片21對於修整板90的移動次數及切入深度304,設定平面修整時的修整開始位置401及修整結束位置402。The trimming range setting unit 102 is as follows: when the number of movements as information about the cutting completion area 601 stored in the cutting completion area storage unit 101 is zero, the position of the outer periphery of the trimming plate 90 is calculated from the image obtained by the camera unit 30 of the outer periphery of the trimming plate 90 without plane trimming, and the trimming start position 401 and the trimming end position 402 during plane trimming are set based on the margin widths 301, 302, the X-axis direction feed width 303, the number of movements of the cutting blade 21 with respect to the trimming plate 90 during plane trimming, and the cutting depth 304.
修整範圍設定部102係以下所示者:在切割完成區域記憶部101所記憶之作為關於切割完成區域601之資訊的移動次數為一次以上之情形,基於被記憶在切割完成區域601之平面修整時切割刀片21對於修整板90在Y軸方向移動的移動次數的累積次數、餘裕寬度301、302、X軸方向進給寬度303、平面修整時的切割刀片21對於修整板90的移動次數及切入深度304,設定平面修整時的修整開始位置401及修整結束位置402。The trimming range setting unit 102 is as follows: when the number of movements as information about the cutting completion area 601 stored in the cutting completion area storage unit 101 is more than one time, the trimming start position 401 and the trimming end position 402 during plane trimming are set based on the accumulated number of movements of the trimming plate 90 in the Y-axis direction by the cutting blade 21 during plane trimming of the cutting completion area 601, the margin width 301, 302, the X-axis direction feed width 303, the number of movements of the trimming plate 90 by the cutting blade 21 during plane trimming, and the cutting depth 304.
控制部103控制切割裝置1的構成要素,使切割裝置1實施對於被加工物200的加工動作及平面修整。The control unit 103 controls the components of the cutting device 1 to cause the cutting device 1 to perform a processing operation and perform surface finishing on the workpiece 200 .
切割完成區域記憶部101係藉由記憶裝置而實現功能。修整範圍設定部102及控制部103的功能係藉由運算處理裝置執行被記憶在記憶裝置的電腦程式而實現。The cut area storage unit 101 is implemented by a storage device. The trimming range setting unit 102 and the control unit 103 are implemented by a computer program stored in the storage device executed by a processing device.
接著,本說明書說明前述切割裝置1的加工動作亦即實施方式1之修整方法。圖7係表示實施方式1之修整方法的流程之流程圖。實施方式1之切割裝置1的加工動作亦即修整方法係將被加工物200分割成一個個元件203且被固定在主軸22的前端之切割刀片21的平面修整方法。Next, this specification describes the processing action of the aforementioned cutting device 1, that is, the trimming method of the embodiment 1. FIG. 7 is a flow chart showing the process of the trimming method of the embodiment 1. The processing action of the cutting device 1 of the embodiment 1, that is, the trimming method, is a method for trimming the surface of the cutting blade 21 fixed to the front end of the spindle 22 and dividing the workpiece 200 into individual components 203.
前述構成的切割裝置1係操作員將加工條件登錄於控制單元100,且收納切割加工前的被加工物200及修整板90之卡匣51被設置在卡匣升降機50。之後,切割裝置1若透過輸入單元從操作員接受到加工動作的開始指示,則開始加工動作亦即實施方式1之修整方法。切割裝置1若開始加工動作,則控制單元100的控制部103會驅動主軸馬達,以由加工條件所設定之旋轉數將主軸22繞著軸心旋轉,且判定是否為平面修整時機(步驟ST1)。The cutting device 1 of the above-mentioned structure is that the operator registers the processing conditions in the control unit 100, and the cassette 51 storing the workpiece 200 and the trimming plate 90 before the cutting process is set on the cassette elevator 50. Afterwards, if the cutting device 1 receives the start instruction of the processing operation from the operator through the input unit, the processing operation, that is, the trimming method of embodiment 1, is started. If the cutting device 1 starts the processing operation, the control unit 103 of the control unit 100 drives the spindle motor to rotate the spindle 22 around the axis at the number of rotations set by the processing conditions, and determines whether it is the time for plane trimming (step ST1).
平面修整時機係指將切割單元20的切割刀片21進行平面修整的時機。在實施方式1中,平面修整時機例如是在每當切割預先設定數量的被加工物200時,且作為加工條件的一部分而被登錄於控制單元100。並且,本發明的平面修整時機不限於在每當切割預先設定數量的被加工物200時。切割裝置1若判定控制單元100的控制部103不在平面修整時機(步驟ST1:否),則前往加工步驟ST2。The plane finishing timing refers to the timing of performing plane finishing on the cutting blade 21 of the cutting unit 20. In the first embodiment, the plane finishing timing is, for example, every time a preset number of workpieces 200 are cut, and is registered in the control unit 100 as a part of the processing conditions. In addition, the plane finishing timing of the present invention is not limited to every time a preset number of workpieces 200 are cut. If the cutting device 1 determines that the control unit 103 of the control unit 100 is not in the plane finishing timing (step ST1: No), it proceeds to the processing step ST2.
(加工步驟) 圖8係以局部剖面表示圖7所示之修整方法的加工步驟之側視圖。加工步驟ST2係以保持台10保持被加工物200,並以切割刀片21切割保持台10上的被加工物200之步驟。(Processing step) Figure 8 is a side view showing a processing step of the trimming method shown in Figure 7 in partial section. Processing step ST2 is a step of holding the workpiece 200 on the holding table 10 and cutting the workpiece 200 on the holding table 10 with a cutting blade 21.
在加工步驟ST2中,控制單元100的控制部103控制搬送單元,從卡匣51取出切割加工前的被加工物200,透過黏著膠膜206將背面204側載置於保持台10的保持面11。控制單元100的控制部103控制真空吸引源等,透過黏著膠膜206將被加工物200的背面204側吸引保持在保持台10的保持面11,且以夾具部12夾持環狀框架205。控制單元100的控制部103控制X軸移動單元41,使保持台10朝向切割單元20的下方移動,並控制攝像單元30使其拍攝被加工物200,基於攝像單元30拍攝所得之影像,完成對準。In the processing step ST2, the control unit 103 of the control unit 100 controls the conveying unit to take out the workpiece 200 before cutting from the cartridge 51, and places the back side 204 of the workpiece 200 on the holding surface 11 of the holding table 10 through the adhesive film 206. The control unit 103 of the control unit 100 controls the vacuum suction source, etc., to suck and hold the back side 204 of the workpiece 200 on the holding surface 11 of the holding table 10 through the adhesive film 206, and clamps the annular frame 205 with the clamping unit 12. The control unit 103 of the control unit 100 controls the X-axis moving unit 41 to move the holding table 10 toward the bottom of the cutting unit 20, and controls the imaging unit 30 to shoot the workpiece 200, and completes the alignment based on the image captured by the imaging unit 30.
在加工步驟ST2中,控制單元100的控制部103控制切割單元20及各移動單元41、42、43、44,沿著分割預定線202使被加工物200與切割單元20相對地移動,如圖8所示,使切割刀片21切入各分割預定線202,將被加工物200分割成一個個元件203。在加工步驟ST2中,控制單元100的控制部103控制搬送單元,將被分割成一個個元件203的被加工物200搬送至清洗單元60,控制清洗單元60清洗被加工物200後,控制搬送單元將被加工物200收納至卡匣51,前往步驟ST13。In the processing step ST2, the control unit 103 of the control unit 100 controls the cutting unit 20 and the moving units 41, 42, 43, and 44 to move the workpiece 200 relative to the cutting unit 20 along the predetermined dividing line 202, so that the cutting blade 21 cuts into each predetermined dividing line 202, and divides the workpiece 200 into individual components 203. In the processing step ST2, the control unit 103 of the control unit 100 controls the conveying unit to convey the workpiece 200 divided into individual components 203 to the cleaning unit 60, controls the cleaning unit 60 to clean the workpiece 200, and then controls the conveying unit to store the workpiece 200 in the cartridge 51, and proceeds to step ST13.
並且,若控制單元100的控制部103判定是平面修整時機(步驟ST1:是),則判定切割完成區域記憶部101中是否記憶關於切割完成區域601之資訊,亦即判定是否記憶切割完成區域記憶部101中所記憶之作為關於切割完成區域601之資訊的移動次數為零次(步驟ST3)。Furthermore, if the control section 103 of the control unit 100 determines that it is time to perform plane trimming (step ST1: yes), it is determined whether the information about the cutting completion area 601 is stored in the cutting completion area memory section 101, that is, it is determined whether the number of moves of the information about the cutting completion area 601 stored in the cutting completion area memory section 101 is zero (step ST3).
控制單元100的控制部103若判定切割完成區域記憶部101中未記憶關於切割完成區域601之資訊,亦即記憶切割完成區域記憶部101中所記憶之作為關於切割完成區域601之資訊的移動次數為零次(步驟ST3:否),則前往位置檢測步驟ST4。If the control unit 103 of the control unit 100 determines that the information about the cutting completion area 601 is not stored in the cutting completion area memory unit 101, that is, the number of times the information about the cutting completion area 601 stored in the cutting completion area memory unit 101 is moved is zero (step ST3: No), it goes to the position detection step ST4.
(位置檢測步驟) 圖9係圖7所示之修整方法的位置檢測步驟的被加工物之俯視圖。位置檢測步驟ST4係以攝像單元30拍攝被保持在保持台10上的修整板90,並檢測修整板90的外周緣的位置之步驟。(Position detection step) Figure 9 is a top view of the workpiece in the position detection step of the trimming method shown in Figure 7. The position detection step ST4 is a step of photographing the trimming plate 90 held on the holding table 10 with the imaging unit 30 and detecting the position of the outer periphery of the trimming plate 90.
在位置檢測步驟ST4中,控制單元100的控制部103控制搬送單元,從卡匣51取出修整板90,透過黏著膠膜206將修整板90載置於保持台10的保持面11。控制單元100的控制部103控制真空吸引源等,透過黏著膠膜206將修整板90吸引保持在保持台10的保持面11,且以夾具部12夾持環狀框架205。控制單元100的控制部103控制X軸移動單元41,使保持台10朝向切割單元20的下方移動,並控制攝像單元30拍攝修整板90的外周緣。In the position detection step ST4, the control unit 103 of the control unit 100 controls the conveying unit to take out the trimming plate 90 from the cassette 51 and place the trimming plate 90 on the holding surface 11 of the holding table 10 through the adhesive film 206. The control unit 103 of the control unit 100 controls the vacuum suction source and the like to suck and hold the trimming plate 90 on the holding surface 11 of the holding table 10 through the adhesive film 206, and clamps the annular frame 205 with the clamping unit 12. The control unit 103 of the control unit 100 controls the X-axis moving unit 41 to move the holding table 10 toward the bottom of the cutting unit 20, and controls the camera unit 30 to photograph the outer periphery of the trimming plate 90.
在實施方式1中,在位置檢測步驟ST4中,攝像單元30拍攝在圖9中以虛線表示之攝像範圍501內的各外周緣的中央部,獲得攝像範圍501內的各外周緣的中央部的影像,將所得的影像輸出至控制單元100。在位置檢測步驟ST4中,控制單元100的控制部103係基於攝像範圍501內的影像、各位置檢測單元的檢測結果等,算出被保持在保持台10的修整板90的外周緣的位置,且記憶於記憶裝置,並前往修整範圍設定步驟ST5。In the first embodiment, in the position detection step ST4, the imaging unit 30 captures the central portion of each outer periphery within the imaging range 501 indicated by the dotted line in FIG. 9, obtains an image of the central portion of each outer periphery within the imaging range 501, and outputs the obtained image to the control unit 100. In the position detection step ST4, the control unit 103 of the control unit 100 calculates the position of the outer periphery of the trimming plate 90 held on the holding table 10 based on the image within the imaging range 501, the detection results of each position detection unit, etc., and stores it in the storage device, and proceeds to the trimming range setting step ST5.
(修整範圍設定步驟) 修整範圍設定步驟ST5係設定平面修整的修整開始位置401、修整結束位置402之步驟。在修整範圍設定步驟ST5中,控制單元100的修整範圍設定部102參照記憶於記憶裝置之修整板90的外周緣的位置、加工條件的餘裕寬度301、302、X軸方向進給寬度303、平面修整時的切割刀片21對於修整板90的移動次數及切入深度304,計算修整開始位置401及修整結束位置402。(Trimming range setting step) The trimming range setting step ST5 is a step for setting the trimming start position 401 and the trimming end position 402 of the plane trimming. In the trimming range setting step ST5, the trimming range setting section 102 of the control unit 100 calculates the trimming start position 401 and the trimming end position 402 with reference to the position of the outer periphery of the trimming plate 90 stored in the memory device, the margin widths 301 and 302 of the processing conditions, the X-axis direction feed width 303, the number of movements of the cutting blade 21 with respect to the trimming plate 90 during the plane trimming, and the cutting depth 304.
在實施方式1中,在修整範圍設定步驟ST5中,修整範圍設定部102係算出以下位置作為最初的修整開始位置401:修整板90的X軸方向的一端93起往另一端94靠近對應X軸方向餘裕寬度301之量的位置且修整板90的Y軸方向的一端91起對應Y軸方向餘裕寬度302之量之修整板90的外側的位置。在實施方式1中,在修整範圍設定步驟ST5中,修整範圍設定部102係算出以下位置作為最初的修整結束位置402:修整板90的X軸方向的一端93起往另一端94靠近對應X軸方向餘裕寬度301之量的位置且修整板90的Y軸方向的另一端92起對應Y軸方向餘裕寬度302之量之修整板90的外側的位置。修整範圍設定步驟ST5若算出修整開始位置401及修整結束位置402,則前往定位步驟ST6。In implementation method 1, in the trimming range setting step ST5, the trimming range setting unit 102 calculates the following position as the initial trimming start position 401: a position from one end 93 of the trimming plate 90 in the X-axis direction to the other end 94 close to a position corresponding to the X-axis direction margin width 301 and a position on the outer side of the trimming plate 90 from one end 91 of the Y-axis direction to a position corresponding to the Y-axis direction margin width 302. In the first embodiment, in the trimming range setting step ST5, the trimming range setting unit 102 calculates the following position as the initial trimming end position 402: a position from one end 93 of the trimming plate 90 in the X-axis direction to the other end 94 corresponding to the X-axis direction margin width 301 and a position on the outer side of the trimming plate 90 from the other end 92 of the Y-axis direction corresponding to the Y-axis direction margin width 302. If the trimming start position 401 and the trimming end position 402 are calculated in the trimming range setting step ST5, the process proceeds to the positioning step ST6.
(定位步驟) 圖10係以局部剖面表示圖7所示之修整方法的定位步驟的切割單元及修整板之側視圖。圖11係圖10所示之切割單元及修整板之俯視圖。(Positioning step) Figure 10 is a side view of a cutting unit and a trimming plate showing the positioning step of the trimming method shown in Figure 7 in partial section. Figure 11 is a top view of the cutting unit and the trimming plate shown in Figure 10.
定位步驟ST6係基於記憶於記憶裝置之修整板90的外周緣的位置,將從修整板90的一端91朝向另一端92的方向定位成與主軸22的軸心亦即Y軸方向平行,且基於由位置檢測步驟ST4所檢測出之修整板90的外周緣的位置,將切割刀片21的刀刃24的下端定位在修整板90的一端91的外側且切入修整板90的切入深度304之步驟。The positioning step ST6 is based on the position of the outer periphery of the trimming plate 90 stored in the memory device, and positions the direction from one end 91 of the trimming plate 90 toward the other end 92 to be parallel to the axis of the main shaft 22, that is, the Y-axis direction. Based on the position of the outer periphery of the trimming plate 90 detected by the position detection step ST4, the lower end of the blade 24 of the cutting blade 21 is positioned on the outer side of one end 91 of the trimming plate 90 and cuts into the trimming plate 90 to a cutting depth of 304.
在定位步驟ST6中,控制單元100的控制部103控制旋轉移動單元44,以從修整板90的一端91朝向另一端92的方向成為與Y軸方向平行之方式,調整保持台10繞軸心的方向。在定位步驟ST6中,控制單元100的控制部103控制各移動單元41、42、43,將切割單元20的切割刀片21的刀刃24的下端定位在由修整範圍設定步驟ST5所算出之最初的修整開始位置401,並前往修整步驟ST7。In the positioning step ST6, the control unit 103 of the control unit 100 controls the rotational moving unit 44 to adjust the direction of the holding table 10 around the axis so that the direction from one end 91 to the other end 92 of the trimming plate 90 becomes parallel to the Y-axis direction. In the positioning step ST6, the control unit 103 of the control unit 100 controls each moving unit 41, 42, 43 to position the lower end of the blade 24 of the cutting blade 21 of the cutting unit 20 at the initial trimming start position 401 calculated in the trimming range setting step ST5, and proceed to the trimming step ST7.
(修整步驟) 圖12係以局部剖面表示圖7所示之修整方法的修整步驟的切割單元及修整板之側視圖。圖13係圖12所示之切割單元及修整板之俯視圖。圖14係圖7所示之修整方法的修整步驟後的修整板之俯視圖。(Trimming step) Figure 12 is a side view of a cutting unit and a trimming plate in a trimming step of the trimming method shown in Figure 7, with a partial cross section. Figure 13 is a top view of the cutting unit and the trimming plate shown in Figure 12. Figure 14 is a top view of the trimming plate after the trimming step of the trimming method shown in Figure 7.
修整步驟ST7係在實施定位步驟ST6後,使切割刀片21對於修整板90相對移動,從修整板90的一端91往另一端92進行切割,藉此將切割刀片21的刀刃24的前端進行平坦化之步驟。在修整步驟ST7中,控制單元100的控制部103控制Y軸移動單元42,從修整板90的一端91朝向另一端92將切割單元20在Y軸方向移動,如圖12及圖13所示,將切割刀片21的刀刃24切入修整板90,形成切割槽95。在修整步驟ST7中,控制單元100的控制部103控制X軸移動單元41及Y軸移動單元42,在修整結束位置402停止切割刀片21的Y軸方向的移動後,使切割刀片21往X軸方向的另一端94側移動對應X軸方向進給寬度303之量,並定位在下一個修整開始位置401。The trimming step ST7 is a step of flattening the front end of the blade 24 of the cutting blade 21 by moving the cutting blade 21 relative to the trimming plate 90 after the positioning step ST6 is performed, cutting from one end 91 to the other end 92 of the trimming plate 90. In the trimming step ST7, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from one end 91 to the other end 92 of the trimming plate 90, as shown in FIG. 12 and FIG. 13, so that the blade 24 of the cutting blade 21 cuts into the trimming plate 90 to form a cutting groove 95. In the trimming step ST7, the control unit 103 of the control unit 100 controls the X-axis moving unit 41 and the Y-axis moving unit 42, and after stopping the Y-axis movement of the cutting blade 21 at the trimming end position 402, the cutting blade 21 moves toward the other end 94 in the X-axis direction by an amount corresponding to the X-axis feed width 303, and is positioned at the next trimming start position 401.
在修整步驟ST7中,控制單元100的控制部103控制Y軸移動單元42,從修整板90的另一端92朝向一端91將切割單元20在Y軸方向移動,將切割刀片21的刀刃24切入修整板90,形成切割槽95。在實施方式1中,在修整步驟ST7中,控制單元100的控制部103以加工條件的平面修整時的切割刀片21對於修整板90的移動次數,將切割刀片21在Y軸方向移動,將切割刀片21的刀刃24的前端進行平坦化。在實施方式1中,在修整步驟ST7中,如圖14所示,若形成二條切割槽95,則前往切割完成區域記憶步驟ST8。In the trimming step ST7, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from the other end 92 to the one end 91 of the trimming plate 90, and cuts the blade 24 of the cutting blade 21 into the trimming plate 90 to form a cutting groove 95. In the first embodiment, in the trimming step ST7, the control unit 103 of the control unit 100 moves the cutting blade 21 in the Y-axis direction according to the number of movements of the cutting blade 21 with respect to the trimming plate 90 during the plane trimming of the processing conditions, and flattens the front end of the blade 24 of the cutting blade 21. In the first embodiment, in the trimming step ST7, as shown in FIG. 14, if two cutting grooves 95 are formed, the process proceeds to the cutting completion area memory step ST8.
(切割完成區域記憶步驟) 切割完成區域記憶步驟ST8係切割完成區域記憶部101記憶在修整步驟ST7中關於由平面修整所切割之修整板90的切割完成區域601之資訊的步驟。在實施方式1中,在切割完成區域記憶步驟ST8中,切割完成區域記憶部101係記憶累積次數作為關於切割完成區域601之資訊,所述累積次數係在修整步驟ST7中切割刀片21對於修整板90在Y軸方向移動的移動次數加上已記憶完成的次數。在切割完成區域記憶步驟ST8中,若切割完成區域記憶部101記憶平面修整時的切割刀片21對於修整板90在Y軸方向移動的移動次數的累積次數作為關於切割完成區域601之資訊,則前往步驟ST13。(Cutting completion area memory step) Cutting completion area memory step ST8 is a step in which the cutting completion area memory unit 101 memorizes information about the cutting completion area 601 of the trimming plate 90 cut by the plane trimming in the trimming step ST7. In the first embodiment, in the cutting completion area memory step ST8, the cutting completion area memory unit 101 memorizes the accumulated number of times as the information about the cutting completion area 601, and the accumulated number of times is the number of times the cutting blade 21 moves the trimming plate 90 in the Y-axis direction in the trimming step ST7 plus the number of times that has been memorized. In the cutting completion area storage step ST8, if the cutting completion area storage unit 101 stores the cumulative number of times the cutting blade 21 moves the trimming plate 90 in the Y-axis direction during plane trimming as information about the cutting completion area 601, then go to step ST13.
並且,控制單元100的控制部103若判定在切割完成區域記憶部101中記憶關於切割完成區域601之資訊,亦即記憶在切割完成區域記憶部101中所記憶之作為關於切割完成區域601之資訊的移動次數為一次以上(步驟ST3:是),則前往第二修整範圍設定步驟ST9。Furthermore, if the control section 103 of the control unit 100 determines that the information about the cutting completion area 601 is stored in the cutting completion area storage section 101, that is, the number of times the information about the cutting completion area 601 stored in the cutting completion area storage section 101 is moved is more than once (step ST3: yes), then proceed to the second trimming range setting step ST9.
(第二修整範圍設定步驟) 第二修整範圍設定步驟ST9係在修整板90形成有切割完成區域601亦即切割槽95之情形中,設定平面修整的修整開始位置401、修整結束位置402之步驟。(Second trimming range setting step) The second trimming range setting step ST9 is a step for setting the trimming start position 401 and the trimming end position 402 of the plane trimming when the trimming plate 90 has a cutting completion area 601, i.e., a cutting groove 95.
在第二修整範圍設定步驟ST9中,控制單元100的修整範圍設定部102係參照切割完成區域記憶部101所記憶之平面修整時切割刀片21對於修整板90在Y軸方向移動的移動次數的累積次數、記憶於記憶裝置之修整板90的外周緣的位置、加工條件的餘裕寬度301、302、X軸方向進給寬度303、平面修整時的切割刀片21對於修整板90的移動次數及切入深度304,計算修整開始位置401及修整結束位置402。In the second trimming range setting step ST9, the trimming range setting section 102 of the control unit 100 calculates the trimming start position 401 and the trimming end position 402 by referring to the accumulated number of movements of the cutting blade 21 with respect to the trimming plate 90 in the Y-axis direction during plane trimming stored in the cutting completion area memory section 101, the position of the outer periphery of the trimming plate 90 stored in the memory device, the margin widths 301 and 302 of the processing conditions, the X-axis feed width 303, the number of movements of the cutting blade 21 with respect to the trimming plate 90 during plane trimming and the cutting depth 304.
在實施方式1中,在第二修整範圍設定步驟ST9中,修整範圍設定部102係計算在修整步驟ST7或第二修整步驟ST11中最近形成之切割槽95的寬度方向的中央的位置,並算出以下位置作為最初的修整開始位置401:所計算之最近形成的切割槽95的寬度方向的中央的位置起往另一端94靠近對應X軸方向進給寬度303之量的位置且修整板90的Y軸方向的一端91起對應Y軸方向餘裕寬度302之量之修整板90的外側的位置。在實施方式1中,在第二修整範圍設定步驟ST9中,修整範圍設定部102係算出以下位置作為最初的修整結束位置402:所計算之最近形成的切割槽95的寬度方向的中央的位置起往另一端94靠近對應X軸方向進給寬度303之量的位置且修整板90的Y軸方向的另一端92起對應Y軸方向餘裕寬度302之量之修整板90的外側的位置。第二修整範圍設定步驟ST9若算出修整開始位置401及修整結束位置402,則前往第二定位步驟ST10。In implementation method 1, in the second trimming range setting step ST9, the trimming range setting unit 102 calculates the center position in the width direction of the cutting groove 95 that was most recently formed in the trimming step ST7 or the second trimming step ST11, and calculates the following position as the initial trimming start position 401: the position of the center position in the width direction of the most recently formed cutting groove 95 is close to the other end 94 corresponding to the position of the feed width 303 in the X-axis direction and the position of the outer side of the trimming plate 90 corresponding to the margin width 302 in the Y-axis direction from one end 91 of the trimming plate 90 in the Y-axis direction. In the first embodiment, in the second trimming range setting step ST9, the trimming range setting unit 102 calculates the following position as the initial trimming end position 402: the position close to the other end 94 of the trimming plate 90 corresponding to the feed width 303 in the X-axis direction from the center position in the width direction of the calculated most recently formed cutting groove 95 and the position on the outer side of the trimming plate 90 corresponding to the Y-axis direction margin width 302 from the other end 92 in the Y-axis direction of the trimming plate 90. If the trimming start position 401 and the trimming end position 402 are calculated in the second trimming range setting step ST9, the process proceeds to the second positioning step ST10.
(第二定位步驟) 圖15係圖7所示之修整方法的第二定位步驟的切割單元及修整板之俯視圖。第二定位步驟ST10係以保持台10保持修整板90,基於由位置檢測步驟ST4所檢測出之修整板90的外周緣的位置與由切割完成區域記憶步驟ST8所記憶之關於修整板90的切割完成區域之資訊,將切割刀片21的刀刃24的下端定位在修整板90的一端91的外側且切入修整板90的預定高度位置亦即切入深度304之步驟。(Second positioning step) Figure 15 is a top view of the cutting unit and the trimming plate in the second positioning step of the trimming method shown in Figure 7. The second positioning step ST10 is a step of holding the trimming plate 90 with the holding table 10, positioning the lower end of the blade 24 of the cutting blade 21 at the outer side of one end 91 of the trimming plate 90 and cutting into the trimming plate 90 to a predetermined height position, i.e., a cutting depth 304, based on the position of the outer periphery of the trimming plate 90 detected by the position detection step ST4 and the information about the cutting completion area of the trimming plate 90 stored in the cutting completion area storage step ST8.
在實施方式1中,在第二定位步驟ST10中,控制單元100的控制部103控制搬送單元,從卡匣51取出修整板90,透過黏著膠膜206,將修整板90載置於保持台10的保持面11。控制單元100的控制部103控制真空吸引源等,透過黏著膠膜206將修整板90吸引保持在保持台10的保持面11,且以夾具部12夾持環狀框架205。In the first embodiment, in the second positioning step ST10, the control unit 103 of the control unit 100 controls the conveying unit to take out the trimming plate 90 from the cassette 51, and places the trimming plate 90 on the holding surface 11 of the holding table 10 through the adhesive film 206. The control unit 103 of the control unit 100 controls the vacuum suction source, etc., to suck and hold the trimming plate 90 on the holding surface 11 of the holding table 10 through the adhesive film 206, and clamps the annular frame 205 with the clamping unit 12.
在第二定位步驟ST10中,控制單元100的控制部103基於記憶在記憶裝置之修整板90的外周緣的位置,控制旋轉移動單元44,以從修整板90的一端91朝向另一端92的方向成為與Y軸方向平行之方式,調整保持台10繞軸心的方向。在第二定位步驟ST10中,控制單元100的控制部103控制各移動單元41、42、43,將切割單元20的切割刀片21的刀刃24的下端定位在由第二修整範圍設定步驟ST9所算出之最初的修整開始位置401,並前往第二修整步驟ST11。In the second positioning step ST10, the control unit 103 of the control unit 100 controls the rotational moving unit 44 based on the position of the outer periphery of the trimming plate 90 stored in the memory device, and adjusts the direction of the holding table 10 around the axis so that the direction from one end 91 to the other end 92 of the trimming plate 90 becomes parallel to the Y-axis direction. In the second positioning step ST10, the control unit 103 of the control unit 100 controls each moving unit 41, 42, 43 to position the lower end of the blade 24 of the cutting blade 21 of the cutting unit 20 at the initial trimming start position 401 calculated in the second trimming range setting step ST9, and proceeds to the second trimming step ST11.
(第二修整步驟) 圖16係圖7所示之修整方法的第二修整步驟的切割單元及修整板之俯視圖。第二修整步驟ST11係在實施第二定位步驟ST10後,使切割刀片21對於修整板90相對移動,從修整板90的一端91往另一端92進行切割,藉此將切割刀片21的刀刃24的前端進行平坦化之步驟。(Second trimming step) Figure 16 is a top view of the cutting unit and the trimming plate in the second trimming step of the trimming method shown in Figure 7. The second trimming step ST11 is a step of flattening the front end of the cutting blade 24 of the cutting blade 21 by moving the cutting blade 21 relative to the trimming plate 90 and cutting from one end 91 to the other end 92 of the trimming plate 90 after the second positioning step ST10.
在第二修整步驟ST11中,控制單元100的控制部103控制Y軸移動單元42,從修整板90的一端91朝向另一端92將切割單元20在Y軸方向移動,如圖16所示,在修整板90形成切割槽95。在第二修整步驟ST11中,控制單元100的控制部103控制X軸移動單元41及Y軸移動單元42,在修整結束位置402停止切割刀片21的Y軸方向的移動後,使切割刀片2往X軸方向的另一端94側移動對應X軸方向進給寬度303之量,並定位在下一個修整開始位置401。In the second trimming step ST11, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from one end 91 to the other end 92 of the trimming plate 90, as shown in FIG16, to form a cutting groove 95 in the trimming plate 90. In the second trimming step ST11, the control unit 103 of the control unit 100 controls the X-axis moving unit 41 and the Y-axis moving unit 42 to stop the movement of the cutting blade 21 in the Y-axis direction at the trimming end position 402, and then moves the cutting blade 2 toward the other end 94 in the X-axis direction by an amount corresponding to the X-axis feed width 303, and positions it at the next trimming start position 401.
在第二修整步驟ST11中,控制單元100的控制部103控制Y軸移動單元42,從修整板90的另一端92朝向一端91將切割單元20在Y軸方向移動,將切割刀片21切入修整板90,形成切割槽95。在實施方式1中,在第二修整步驟ST11中,控制單元100的控制部103係以加工條件的平面修整時的切割刀片21對於修整板90的移動次數,將切割刀片21在Y軸方向移動,將切割刀片21的刀刃24的前端進行平坦化。在實施方式1中,在第二修整步驟ST11中,若形成二條切割槽95,則前往第二切割完成區域記憶步驟ST12。In the second trimming step ST11, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from the other end 92 to the one end 91 of the trimming plate 90, and cuts the cutting blade 21 into the trimming plate 90 to form a cutting groove 95. In the first embodiment, in the second trimming step ST11, the control unit 103 of the control unit 100 moves the cutting blade 21 in the Y-axis direction according to the number of movements of the cutting blade 21 on the trimming plate 90 during the plane trimming of the processing conditions, and flattens the front end of the blade 24 of the cutting blade 21. In the first embodiment, in the second trimming step ST11, if two cutting grooves 95 are formed, the process proceeds to the second cutting completion area storage step ST12.
(第二切割完成區域記憶步驟) 第二切割完成區域記憶步驟ST12係切割完成區域記憶部101記憶在第二修整步驟ST11中關於由平面修整所切割之修整板90的切割完成區域601之資訊的步驟。在實施方式1中,在切割完成區域記憶步驟ST8中,切割完成區域記憶部101係記憶累積次數作為關於切割完成區域601之資訊,所述累積次數係在第二修整步驟ST11中切割刀片21對於修整板90在Y軸方向移動的移動次數加上已記憶完成的次數。在切割完成區域記憶步驟ST8中,若切割完成區域記憶部101記憶關於切割完成區域601之資訊,則前往步驟ST13。(Second cutting completion area memory step) The second cutting completion area memory step ST12 is a step in which the cutting completion area memory unit 101 stores information about the cutting completion area 601 of the trimming plate 90 cut by the plane trimming in the second trimming step ST11. In the first embodiment, in the cutting completion area memory step ST8, the cutting completion area memory unit 101 stores the accumulated number of times as the information about the cutting completion area 601, and the accumulated number of times is the number of times the cutting blade 21 moves the trimming plate 90 in the Y-axis direction in the second trimming step ST11 plus the number of times that has been stored. In the cut-completed area storage step ST8, if the cut-completed area storage unit 101 stores information about the cut-completed area 601, the process proceeds to step ST13.
控制單元100的控制部103係在步驟ST13中判定能否使用被保持在保持台10的修整板90平面修整切割刀片21。在實施方式1中,控制單元100的控制部103係計算在第二修整步驟ST11中最近形成的切割槽95的寬度方向的中央的位置,並算出從所計算之最近形成的切割槽95的寬度方向的中央的位置起往另一端94靠近對應X軸方向進給寬度303之量的位置。若往另一端94靠近對應X軸方向進給寬度303之量的位置與另一端94之間的距離小於X軸方向餘裕寬度301,則控制單元100的控制部103判定不可能使用被保持在保持台10的修整板90平面修整切割刀片21(步驟ST13:否),並使通知單元110運作且通知操作員(步驟ST14)。The control unit 103 of the control unit 100 determines in step ST13 whether the trimming plate 90 held on the holding table 10 can be used to trim the cutting blade 21. In the first embodiment, the control unit 103 of the control unit 100 calculates the center position in the width direction of the cutting groove 95 formed most recently in the second trimming step ST11, and calculates the position from the calculated center position in the width direction of the cutting groove 95 formed most recently toward the other end 94 by the amount of the X-axis feed width 303. If the distance between the position close to the other end 94 corresponding to the X-axis feed width 303 and the other end 94 is less than the X-axis margin width 301, the control unit 103 of the control unit 100 determines that it is impossible to use the trimming plate 90 held on the holding table 10 to flatly trim the cutting blade 21 (step ST13: No), and operates the notification unit 110 and notifies the operator (step ST14).
若往另一端94靠近對應X軸方向進給寬度303之量的位置與另一端94之間的距離為X軸方向餘裕寬度301以上,則控制單元100的控制部103返回步驟ST1。因此,在實施方式1之修整方法中,在第二次以後的加工步驟ST2中,在實施修整步驟ST7與第二修整步驟ST11的至少一者後,從保持台10上搬出修整板90,將修整板90收納至卡匣51內。並且,在實施方式1之修整方法中,在第二定位步驟ST10中,實施加工步驟ST2後,從保持台10上搬出被加工物200並收納至卡匣51內,以保持台10保持修整板90。If the distance between the position corresponding to the X-axis feed width 303 and the other end 94 is greater than the X-axis margin width 301, the control unit 103 of the control unit 100 returns to step ST1. Therefore, in the trimming method of the first embodiment, in the second and subsequent processing steps ST2, after performing at least one of the trimming step ST7 and the second trimming step ST11, the trimming plate 90 is unloaded from the holding table 10 and stored in the cassette 51. Furthermore, in the trimming method of the first embodiment, in the second positioning step ST10, after performing the processing step ST2, the workpiece 200 is unloaded from the holding table 10 and stored in the cassette 51, so that the holding table 10 holds the trimming plate 90.
如前述,實施方式1之修整方法具備:位置檢測步驟ST4、定位步驟ST6、修整步驟ST7、切割完成區域記憶步驟ST8、加工步驟ST2、第二定位步驟ST10、以及第二修整步驟ST11。As mentioned above, the trimming method of implementation mode 1 includes: a position detection step ST4, a positioning step ST6, a trimming step ST7, a cutting completion area memory step ST8, a processing step ST2, a second positioning step ST10, and a second trimming step ST11.
如以上,實施方式1之修整方法及切割裝置1因實施檢測修整板90的外周緣的位置之位置檢測步驟ST4,故不需要過度地設定Y軸方向餘裕寬度302,可抑制Y軸方向餘裕寬度302本身。其結果,修整方法及切割裝置1發揮所謂可抑制平面修整所需要的時間之效果。As described above, the trimming method and cutting device 1 of the first embodiment implement the position detection step ST4 for detecting the position of the outer periphery of the trimming plate 90, so there is no need to excessively set the Y-axis direction margin width 302, and the Y-axis direction margin width 302 itself can be suppressed. As a result, the trimming method and cutting device 1 can exert the effect of suppressing the time required for plane trimming.
並且,實施方式1之修整方法及切割裝置1係在修整步驟ST7、ST11後,將關於修整板90的切割完成區域601之資訊記憶在切割完成區域記憶部101。其結果,修整方法及切割裝置1可避開切割完成區域601而進行平面修整。Furthermore, the trimming method and cutting device 1 of the embodiment 1 store information about the cut-finished area 601 of the trimming plate 90 in the cut-finished area storage unit 101 after the trimming steps ST7 and ST11. As a result, the trimming method and cutting device 1 can perform plane trimming without trimming the cut-finished area 601.
並且,實施方式1之修整方法及切割裝置1係將平面修整時的切割刀片21對於修整板90在Y軸方向移動的移動次數的累積次數作為關於修整板90的切割完成區域601之資訊而記憶於切割完成區域記憶部101。其結果,修整方法及切割裝置1可確實地避開切割完成區域601而進行平面修整。Furthermore, the trimming method and the cutting device 1 of the first embodiment store the accumulated number of times the cutting blade 21 moves the trimming plate 90 in the Y-axis direction during the plane trimming as information on the cut-finished area 601 of the trimming plate 90 in the cut-finished area storage unit 101. As a result, the trimming method and the cutting device 1 can perform plane trimming while surely avoiding the cut-finished area 601.
此外,本發明不受限於上述實施方式。亦即,在不脫離本發明的要旨之範圍內可進行各種變形並加以實施。In addition, the present invention is not limited to the above-mentioned embodiments. That is, various modifications can be made and implemented without departing from the gist of the present invention.
1:切割裝置 10:保持台 21:切割刀片 22:主軸 30:攝像單元(攝像手段) 90:修整板 91:一端 92:另一端 200:被加工物 304:切入深度(預定高度位置) 601:切割完成區域 ST2:加工步驟 ST4:位置檢測步驟 ST6:定位步驟 ST7:修整步驟 ST8:切割完成區域記憶步驟 ST10:第二定位步驟 ST11:第二修整步驟1: Cutting device 10: Holding table 21: Cutting blade 22: Spindle 30: Camera unit (camera means) 90: Trimming plate 91: One end 92: The other end 200: Workpiece 304: Cutting depth (predetermined height position) 601: Cutting completion area ST2: Processing step ST4: Position detection step ST6: Positioning step ST7: Trimming step ST8: Cutting completion area memory step ST10: Second positioning step ST11: Second trimming step
圖1係表示實施實施方式1之修整方法的切割裝置的構成例之立體圖。 圖2係表示將圖1所示之切割裝置的切割刀片進行平面修整的修整板的一例之立體圖。 圖3係實施方式1之修整方法的平面修整前的切割刀片的刀刃前端的剖面圖的一例。 圖4係圖3所示之切割刀片的平面修整後的切割刀片的刀刃前端的剖面圖的一例。 圖5係表示實施方式1之修整方法的修整開始位置及修整收納位置等之修整板的俯視圖。 圖6係表示實施方式1之修整方法的切入深度等之修整板的側剖面圖。 圖7係表示實施方式1之修整方法的流程之流程圖。 圖8係以局部剖面表示圖7所示之修整方法的加工步驟之側視圖。 圖9係圖7所示之修整方法的位置檢測步驟的被加工物之俯視圖。 圖10係以局部剖面表示圖7所示之修整方法的定位步驟的切割單元及修整板之側視圖。 圖11係圖10所示之切割單元及修整板之俯視圖。 圖12係以局部剖面表示圖7所示之修整方法的修整步驟的切割單元及修整板之側視圖。 圖13係圖12所示之切割單元及修整板之俯視圖。 圖14係圖7所示之修整方法的修整步驟後的修整板之俯視圖。 圖15係圖7所示之修整方法的第二定位步驟的切割單元及修整板之俯視圖。 圖16係圖7所示之修整方法的第二修整步驟的切割單元及修整板之俯視圖。FIG. 1 is a perspective view showing an example of a structure of a cutting device for implementing the trimming method of embodiment 1. FIG. 2 is a perspective view showing an example of a trimming plate for performing plane trimming on the cutting blade of the cutting device shown in FIG. 1. FIG. 3 is an example of a cross-sectional view of the front end of the blade of the cutting blade before plane trimming of the trimming method of embodiment 1. FIG. 4 is an example of a cross-sectional view of the front end of the blade of the cutting blade after plane trimming of the cutting blade shown in FIG. 3. FIG. 5 is a top view of a trimming plate showing the trimming start position and trimming storage position of the trimming method of embodiment 1. FIG. 6 is a side view of a trimming plate showing the cutting depth of the trimming method of embodiment 1. FIG. 7 is a flow chart showing the process of the trimming method of embodiment 1. FIG. 8 is a side view showing the processing step of the trimming method shown in FIG. 7 in a partial cross section. FIG. 9 is a top view of the workpiece in the position detection step of the trimming method shown in FIG. 7. FIG. 10 is a side view of the cutting unit and the trimming plate in the positioning step of the trimming method shown in FIG. 7, with a partial section. FIG. 11 is a top view of the cutting unit and the trimming plate shown in FIG. 10. FIG. 12 is a side view of the cutting unit and the trimming plate in the trimming step of the trimming method shown in FIG. 7, with a partial section. FIG. 13 is a top view of the cutting unit and the trimming plate shown in FIG. 12. FIG. 14 is a top view of the trimming plate after the trimming step of the trimming method shown in FIG. 7. FIG. 15 is a top view of the cutting unit and the trimming plate in the second positioning step of the trimming method shown in FIG. 7. FIG. 16 is a top view of the cutting unit and the trimming plate in the second trimming step of the trimming method shown in FIG. 7 .
ST2:加工步驟 ST2: Processing steps
ST4:位置檢測步驟 ST4: Position detection step
ST5:修整範圍設定步驟 ST5: Trim range setting steps
ST6:定位步驟 ST6: Positioning step
ST7:修整步驟 ST7: Finishing step
ST8:切割完成區域記憶步驟 ST8: Cutting completed area memory step
ST9:第二修整範圍設定步驟 ST9: Second trimming range setting step
ST10:第二定位步驟 ST10: Second positioning step
ST11:第二修整步驟 ST11: Second finishing step
ST12:第二切割完成區域記憶步驟 ST12: Second cutting completion area memory step
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JP2006218571A (en) * | 2005-02-10 | 2006-08-24 | Disco Abrasive Syst Ltd | Dressing board and dressing method |
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TW201831273A (en) * | 2017-01-17 | 2018-09-01 | 日商迪思科股份有限公司 | Dressing board, cutting blade dressing method, and cutting apparatus |
JP2018144206A (en) * | 2017-03-08 | 2018-09-20 | 株式会社ディスコ | Dressing method for cutting blade |
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JP2006218571A (en) * | 2005-02-10 | 2006-08-24 | Disco Abrasive Syst Ltd | Dressing board and dressing method |
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TW201831273A (en) * | 2017-01-17 | 2018-09-01 | 日商迪思科股份有限公司 | Dressing board, cutting blade dressing method, and cutting apparatus |
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