JP6246566B2 - Dressing method - Google Patents

Description

The present invention relates to a de-less way to shape the edge shape of the cutting blades in the trimming dicer.

  In general, the outer peripheral edge of a workpiece is chamfered to prevent cracking and dust generation during the manufacturing process, and is formed in an arc shape in cross section. For this reason, when the work piece is thinned by grinding the back surface of the work piece, a knife edge remains on the outer peripheral edge of the work piece, causing a reduction in device quality due to cracking or chipping of the work piece. Therefore, prior to grinding the back surface of the workpiece, an outer peripheral machining method (edge trimming) in which a chamfered portion of the workpiece is removed with a cutting blade is employed (for example, see Patent Document 1). In the edge trimming process, since the tip of the cutting blade is worn, a flat dress is periodically formed by shaping the tip of the cutting blade into a flat shape with a dresser board (see, for example, Patent Document 2).

  When cutting, it is necessary to position the cutting blade at a suitable height with respect to the workpiece. When the cutting blade is positioned at a suitable height, a setup for detecting the tip position of the cutting blade is performed. In the setup, a predetermined amount of the setup sample is cut with the cutting blade, the length of the cutting mark is detected by the imaging means, and the tip position of the cutting blade is calculated (for example, see Patent Document 3). A setup sample used for setup is usually held in a sub-table provided separately from a holding table that holds a workpiece (see, for example, Patent Document 4).

JP 2000-173961 A JP 2010-588 A JP 2013-27949 A JP 07-283171 A

  When dressing the cutting blade, the dresser board is held on the holding table, and the cutting blade is dressed on the holding table. Further, when setting up the cutting blade after dressing, if the sub-table holding the setup sample is separated from the holding table as in Patent Document 4, the moving distance of the cutting blade becomes large. For this reason, the setup work takes time, and there is a problem that an efficient setup cannot be performed.

The present invention has been made in view of the foregoing, and an object thereof is to provide a de-less method that can be performed up after dress cutting blade efficiently.

The dressing method of the present invention includes a holding table having a holding surface for holding a workpiece, a cutting means having a spindle equipped with a cutting blade for cutting the workpiece held on the holding table, and a holding table. and in at least provided with a cutting device and the imaging means, the imaging the surface of the workpiece, a dress method of performing dress cutting blade using de Lesser board, dresser board surface is flat and cutting A plate-shaped rigid substrate formed of a material that can be cut by a blade, and a dressing member for dressing the cutting blade, formed in a plate shape having an outer shape smaller than the area of the rigid substrate and fixed to the surface of the rigid substrate; , it is composed of a holding step of holding the rigid substrate side of the dresser board on the holding surface of the holding table, after performing the holding step, dresses A dressing process in which a cutting blade is cut into the material and dressed with the cutting blade, and after performing the dressing process, the cutting means is vertically lowered from the surface of the rigid substrate to which the dressing member is not fixed, and the cutting trace is cut at a predetermined height. Then, the length of the cutting trace is detected by the imaging means, and the length is detected.From the detected cutting trace length and the distance from the spindle center height position to the upper surface height position of the rigid substrate, the cutting blade is removed. And an outer diameter size calculating step for calculating a diameter size.

  According to these configurations, since the dress member is fixed and integrally formed on the surface of the rigid substrate, the cutting blade can be cut into the dress member and the rigid substrate on the holding table. Therefore, the dressing of the cutting blade and the setup of the cutting blade can be performed on the holding table, and the moving distance of the cutting blade can be shortened. As a result, the time required for setting up the cutting blade is shortened, and the setup can be performed efficiently. Further, it is not necessary to prepare a sub-table separately from the holding table, and the apparatus configuration can be simplified.

  According to the present invention, the dressing member is fixed and integrated on the surface of the rigid substrate, so that the setup of the cutting blade after dressing can be performed efficiently.

It is a perspective view of the cutting device concerning this embodiment. It is a perspective view of the dresser board concerning this embodiment. It is explanatory drawing of the dress and setup which concern on this Embodiment. It is a figure which shows the flow of operation | movement of the cutting device which concerns on this Embodiment. It is explanatory drawing of the outer diameter size calculation process which concerns on this Embodiment.

  A cutting apparatus in which the dresser board according to the present embodiment is used will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of a cutting apparatus according to the present embodiment. FIG. 2 is a perspective view of the dresser board according to the present embodiment. FIG. 3 is an explanatory diagram of dresses and setups according to the present embodiment. In the present embodiment, a configuration in which a dresser board is used in a cutting apparatus that performs edge trimming will be described, but the present invention is not limited to this configuration. The dresser board may be used in any cutting device as long as it is a cutting device that performs cutting using a cutting blade.

  As shown in FIG. 1, the cutting device 1 according to the present embodiment is configured to perform dressing and setup on a cutting blade 131 (see FIG. 3) that has been worn by edge trimming. Not only the workpiece W but also the dresser board 3 for dressing and setting up the cutting blade 131 is carried into the cutting device 1 in a state where it is accommodated in the cassette 4. The workpiece W is formed in a substantially disk shape, and the outer peripheral edge is chamfered to prevent cracking and dust generation during the manufacturing process. The workpiece W may be a semiconductor wafer such as silicon or gallium arsenide, or may be a ceramic, glass, or sapphire optical device wafer.

  As shown in FIG. 2, the dresser board 3 is configured by fixing a dress member 31 having a rectangular shape in a top view on the surface of a substantially disc-shaped rigid substrate 32. The rigid substrate 32 is used as a setup sample and is formed into a plate shape with a material having a flat surface and capable of being cut with a cutting blade 131 (see FIG. 3), for example, a thick silicon substrate or a carbon substrate. ing. The dress member 31 shapes the tip shape of the cutting blade 131 and is formed in a plate shape having an outer shape smaller than the area of the rigid substrate 32. The dress member 31 is formed by bonding abrasive grains such as white alundum and green carbon smaller than the abrasive grain size of the cutting blade 131 with a resin or the like.

  The rigid substrate 32 may be formed of the same material as the workpiece W or may be formed of a different material. Further, the rigid substrate 32 is formed to have substantially the same diameter as the workpiece W, but the size is not particularly limited as long as it can be held by the holding table 5. The dress member 31 may be fixed on the rigid substrate 32 so that a cutting region for setup is left on the surface of the rigid substrate 32. Therefore, the center of the rigid substrate 32 and the center of the dress member 31 do not have to coincide.

  Returning to FIG. 1, an opening is formed in the center of the upper surface of the base 2 of the cutting apparatus 1 so as to extend in the X-axis direction, and a bellows-shaped waterproof cover 6 is provided so as to cover the opening. . On the waterproof cover 6, a disk-shaped holding table 5 that holds the workpiece W is provided. Below the waterproof cover 6, ball screw type moving means (not shown) for moving the holding table 5 in the X-axis direction is provided. The holding table 5 is reciprocated between a machining position where the workpiece W is cut below the pair of cutting means 13 and a transfer position where the workpiece W is transferred by driving the moving mechanism. Is done.

  The holding table 5 is provided with a lifter 52 that lifts the workpiece W from the holding surface 51. The lifter 52 is accommodated in the center of the holding table 5 so as to be movable up and down. Further, an annular suction surface 53 is formed on the holding surface 51 so as to surround the lifter 52. When the upper surface of the lifter 52 rises above the holding surface 51, the outer periphery of the workpiece W is lifted from the holding surface 51, and the workpiece W is delivered. Since the upper surface of the lifter 52 is flush with the holding surface 51, the outer peripheral side of the workpiece W is held on the suction surface 53. Note that the lifter 52 may sink below the holding surface 51 so that the lifter 52 is separated from the lower surface of the workpiece W.

  On the base 2, an elevator means 7 on which the cassette 4 is placed and a cleaning means 8 for cleaning the processed workpiece W are provided so as to sandwich the moving path of the holding table 5. In the elevator means 7, the cassette 4 is placed on the stage 71, and the position of the workpiece W in and out of the cassette 4 is adjusted by an elevating mechanism (not shown). In the cleaning means 8, the workpiece W on the spinner table 81 is lowered into the base 2, cleaning water is sprayed to clean the workpiece W, and then dry air is blown to blow the workpiece W. Dried.

  Above the base 2, a robot pick 9 that conveys the workpiece W between the cassette 4 and the holding table 5, and an edge clamp that conveys the workpiece W between the holding table 5 and the cleaning means 8. And a conveying means 10 of the type. The robot pick 9 is configured so that the workpiece W can be taken in and out of the cassette 4 and delivered to the lifter 52 by a substantially C-shaped plate-shaped holding portion. The conveying means 10 is configured to convey the workpiece W while holding the workpiece W by sandwiching the outer periphery of the workpiece W by the three clamp portions 101.

  On the base 2, a gate-shaped column portion 11 is erected so as to straddle the opening at the center of the base 2. The column part 11 is provided with blade moving means 12 for moving the pair of cutting means 13 in the Y-axis direction and the Z-axis direction. The blade moving means 12 includes a pair of guide rails 121 arranged in the pillar portion 11 and parallel to the Y-axis direction, and a pair of motor-driven Y-axis tables 123 slidably installed on the pair of guide rails 121. doing. The blade moving means 12 includes a pair of guide rails 122 arranged in front of each Y-axis table 123 and parallel to the Z-axis direction, and a motor-driven Z-axis slidably installed on each pair of guide rails 122. And a table 124.

  Each Z-axis table 124 is provided with cutting means 13. Further, nut portions (not shown) are formed on the back surfaces of the Y-axis tables 123 and the Z-axis tables 124, and ball screws 125 and 126 are screwed to these nut portions. The pair of cutting means 13 are moved along the guide rails 121 and 122 in the Y-axis direction and the Z-axis direction by rotationally driving the drive motors 127 and 128 connected to one end portions of the ball screws 125 and 126. The

  A cutting blade 131 is attached to the tip of a spindle shaft (not shown) of the spindle 132 (see FIG. 3). The cutting blade 131 is constituted by a resin blade in which diamond abrasive grains are hardened with a resin bond to form a circle. The cutting blade 131 has a thickness larger than the width dimension of the chamfer of the workpiece W. The cutting means 13 rotates the cutting blade 131 at high speed, and performs edge trimming on the workpiece W while spraying cutting water from a spray nozzle (not shown) onto the cutting portion. On the side surface of the spindle 132, an imaging unit 14 that images the surface of the workpiece W held on the holding table 5 is provided.

  Inside the base 2 is provided a control means 15 for comprehensively controlling each part of the cutting apparatus 1. The control means 15 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The memory stores not only the edge trimming process for the workpiece W but also a program for controlling dressing and setup for the cutting blade 131 (see FIG. 3).

  In the cutting apparatus 1 configured as described above, the workpiece W is taken out from the cassette 4 and the edge trimming process is performed by the cutting means 13. The workpiece W that has been subjected to the edge trimming process is cleaned by the cleaning means 8 and then accommodated in the cassette 4 again. Further, in the edge trimming process, only one side of the cutting blade 131 (see FIG. 3) contributes to the cutting, so that the amount of wear on both sides of the cutting blade 131 is different, and uneven wear tends to occur. Therefore, in the present embodiment, the dresser board 3 is periodically taken out from the cassette 4, and dressing (flat dress) and setup of the cutting blade 131 are performed.

  As shown in FIG. 3A, when the cutting blade 131 is dressed, the cutting blade 131 is positioned above the dress member 31 disposed in the center of the dresser board 3. Then, with the cutting blade 131 rotated at a high speed and the surface of the dressing member 31 being slightly cut, the cutting blade 131 is indexed in the indexing feed direction perpendicular to the machining feed direction (X-axis direction) with respect to the dressing member 31. Relatively moved in the Y-axis direction Thus, the tip shape of the cutting blade 131 worn by the edge trimming process is shaped to be flat. Note that the cutting blade 131 may be relatively moved with respect to the dressing member 31 in the processing feed direction to make the sharpening.

  As shown in FIG. 3B, when the cutting blade 131 is set up, the cutting blade 131 is positioned above the rigid substrate 32 exposed around the dress member 31 of the dresser board 3. Then, the cutting blade 131 rotated at high speed is vertically lowered to form the cutting marks 16 on the surface of the rigid substrate 32. The cutting mark 16 is picked up by the image pickup means 14, and the length of the cutting mark 16 is detected by image processing or the like. The outer diameter size of the cutting blade 131 is calculated from the length of the cutting trace 16 and the height of the spindle shaft (the distance from the surface height position of the rigid substrate 32 to the axial center height position of the spindle 132). As a result, the tip height of the cutting blade 131 is accurately calculated, and a highly accurate setup is performed.

  Here, the operation of the cutting apparatus according to the present embodiment will be described. In the following description, a series of operations in which the edge trimming process is performed after the dressing method including the holding process, the dressing process, and the outer diameter size calculating process will be described. FIG. 4 is a diagram showing a flow of operation of the cutting apparatus according to the present embodiment. FIG. 5 is an explanatory diagram of the outer diameter size calculating step according to the present embodiment.

  As shown in FIG. 4A, a holding process is first performed. In the holding step, the rigid substrate 32 side of the dresser board 3 is held on the holding surface 51 of the holding table 5. The dresser board 3 is positioned so that the longitudinal direction of the dress member 31 is directed to the rotation axis direction of the cutting blade 131. For this reason, the short direction (the direction perpendicular to the paper surface) of the dress member 31 is the processing feed direction (X-axis direction), and the longitudinal direction (the left-right direction of the paper surface) of the dress member 31 is the index feed direction (Y-axis direction). Become.

  As shown in FIG. 4B, a dressing process is performed after the holding process. In the dressing process, the cutting blade 131 is moved above the dress member 31 and positioned at one end in the longitudinal direction of the dress member 31. The cutting blade 131 is lowered toward one end of the dress member 31 in a rotated state, and one end of the dress member 31 is slightly cut. Subsequently, the cutting blade 131 is moved along the longitudinal direction of the dress member 31, that is, the index feed direction (Y-axis direction). As a result, the tip of the cutting blade 131 is cut to the surface of the dress member 31, and the tip shape of the cutting blade 131 is adjusted to be flat.

  In this way, the tip of the cutting blade 131 is flat dressed by the dress member 31 of the dresser board 3. Further, the groove 18 (see FIG. 3) is formed on the surface of the dress member 31 by the flat dress, so that the stress balance between the front and back of the dress member 31 is disrupted. However, since the dress member 31 is fixed to the rigid substrate 32, the dress member 31 is not affected by the collapse of the stress balance. Therefore, even when the dress member 31 that is thinned by dressing is used, warping associated with the shape change of the dress member 31 is suppressed.

  As shown in FIG. 4C, after the dressing process is performed, an outer diameter size calculating process (setup process) is performed. In the outer diameter size calculating step, the cutting blade 131 above the dress member 31 is moved in the index feed direction and positioned above the rigid substrate 32 to which the dress member 31 is not fixed. The cutting blade 16 is vertically lowered from the surface of the rigid substrate 32 in a state where the cutting blade 131 is rotated, and the rigid substrate 32 is cut at a predetermined height, whereby the cutting trace 16 is formed. Subsequently, the surface of the rigid substrate 32 is imaged by the imaging unit 14, and the length of the cutting mark 16 is detected by performing image processing on the captured image.

At this time, as shown in FIG. 5A and FIG. 5B, the outside of the cutting blade 131 is determined by the length D of the cutting trace 16 and the distance Z from the axial center height position of the spindle 132 to the upper surface height position of the rigid substrate 32. A diameter size 2r is calculated. In this case, edge detection processing is performed on the captured image, and the length D of the cutting scar 16 included in the captured image is detected. The distance Z, which is position information of the cutting blade 131 at this time, is set in the control means 15 (see FIG. 1), and the length D of the cutting trace 16 is input to the control means 15. Then, the outer diameter size 2r of the cutting blade 131 is calculated by the following equation (1).

  Based on the outer diameter 2r of the cutting blade 131 calculated by the expression (1), the axial center position of the spindle 132 when the workpiece W is machined is adjusted (set up). Further, the outer diameter size 2r of the cutting blade 131 calculated by the outer diameter size calculating step is recorded / stored in the control means 15 (see FIG. 1), and the outer diameter size 2r of the cutting blade 131 is again processed after the workpiece W is processed. By detecting this, the amount of wear of the cutting blade 131 can be calculated. Thereby, the cutting blade 131 can be replaced at an appropriate time based on the amount of wear of the cutting blade 131.

  Thus, the dressing step and the outer diameter size calculating step are performed by cutting the cutting blade 131 into the dressing member 31 and the rigid substrate 32 on the dresser board 3 held by the holding table 5. Therefore, since the dressing step and the outer diameter size calculating step are performed in the holding table 5, the moving distance of the cutting blade 131 when shifting from the dressing step to the outer diameter size calculating step can be shortened. As a result, the time required for setup can be shortened, and the efficiency of setup can be improved.

  Moreover, since the dressing step and the outer diameter size calculating step are performed with the same holding table 5, it is not necessary to provide a separate table, and the apparatus configuration can be simplified. Further, in the outer diameter size calculating step, the rigid substrate 32 is cut near the processing position at the time of edge trimming, so that the outer diameter size 2r can be calculated close to the actual processing state of the workpiece W. In addition, by making the material of the workpiece W and the material of the rigid substrate 32 the same, it is possible to further approximate the actual processing state of the workpiece W.

  As shown in FIG. 4D, the edge trimming process is performed after the outer diameter size calculating process is performed. In this case, the dresser board 3 is returned to the cassette 4 (see FIG. 1), and a new workpiece W is conveyed from the cassette 4 to the holding table 5. In the edge trimming step, the workpiece W is held on the holding table 5 so that the center of the workpiece W coincides with the rotation center of the holding table 5. Further, the cutting blade 131 is positioned above the chamfered portion 17 on the outer periphery of the workpiece W. At this time, the rotation axis (Y axis) of the cutting blade 131 is aligned with the center line of the workpiece W.

  Then, the cutting means 13 is lowered while the cutting blade 131 is rotated at a high speed, and the chamfered portion 17 of the workpiece W is cut. Subsequently, the chamfered portion 17 of the workpiece W is removed by rotating the holding table 5 around the Z axis. In this case, the cutting blade 131 cuts deeper than the finishing thickness in the subsequent grinding process. For this reason, even if the workpiece W is thinned by a subsequent grinding process, the outer periphery of the workpiece W does not remain in a knife edge shape. The dressing of the cutting blade 131 is performed when the cutting edge shape is worn (for example, 50 times) by repeated edge trimming, but the setup may be performed every several times (for example, 3 times). .

  As described above, since the dress member 31 is fixed and integrally formed on the surface of the rigid substrate 32 according to the present embodiment, the cutting blade 131 is attached to the dress member 31 and the rigid substrate 32 on the holding table 5. Can be cut. Accordingly, the dressing of the cutting blade 131 and the setup of the cutting blade 131 can be performed on the holding table 5, and the moving distance of the cutting blade 131 can be shortened. As a result, the time required for setting up the cutting blade 131 is reduced, and the setup can be performed efficiently. Further, it is not necessary to prepare a sub-table separately from the holding table 5, and the apparatus configuration can be simplified.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the flat dress that is dressed by moving the cutting blade 131 in the index feed direction (Y-axis direction) with respect to the dress member 31 has been described, but the present invention is not limited to this configuration. The cutting blade 131 may be dressed by moving the cutting blade 131 in the processing feed direction (X-axis direction) with respect to the dress member 31. Moreover, both a flat dress and a dressing dress may be implemented.

  As described above, the present invention has an effect that it is possible to efficiently perform setup after dressing of a cutting blade, and in particular, to a dresser board and a dressing method for shaping the cutting edge shape of a cutting blade in a trimming dicer. Useful.

DESCRIPTION OF SYMBOLS 1 Cutting device 3 Dresser board 5 Holding table 13 Cutting means 14 Imaging means 16 Cutting trace 31 Dress member 32 Rigid board 51 Holding surface 131 Cutting blade 132 Spindle D Length of cutting trace W Workpiece Z distance 2r Outer diameter size

Claims (1)

A holding table having a holding surface for holding a workpiece, a cutting means having a spindle equipped with a cutting blade for cutting the workpiece held on the holding table, and a workpiece held on the holding table. in at least with cutting device and the imaging means, the imaging the surface, a dress how to do dresses the cutting blade using de Lesser board,
The dresser board
A plate-shaped rigid substrate having a flat surface and formed of a material that can be cut by the cutting blade;
A dressing member for dressing the cutting blade, which is formed in a plate shape having an outer shape smaller than the area of the rigid substrate and fixed to the surface of the rigid substrate,
A holding step of holding the rigid substrate side of the dresser board on the holding surface of the holding table;
After performing the holding step, a dressing step of cutting the cutting blade into the dress member and dressing the cutting blade;
After carrying out the dressing process, the cutting means is vertically lowered from the surface of the rigid substrate to which the dressing member is not fixed to form a cutting trace at a predetermined height, and the cutting trace is imaged by the imaging means. Then, the length is detected, and the outer diameter size of the cutting blade is calculated from the detected length of the cutting trace and the distance from the axial center height position of the spindle to the upper surface height position of the rigid substrate. A dressing method comprising a diameter size calculating step.

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