TWI856858B - Method for bonding electronic component and method for manufacturing led display - Google Patents

Abstract

A method for bonding electronic component including the following steps is provided: providing a carrier substrate having a carrying surface on which the electronic component to be bonded is disposed; providing a target substrate having a bonded position; positioning the carrier substrate and the target substrate with the carrying surface facing the bonded position; making the carrier substrate and the target substrate move toward each other until the electronic component be in contact with the bonded position; applying a plurality of flexible pushes to a non-carrying surface of the carrier substrate or to a non-bonded position of the target substrate, in order for the electronic component on the carrying substrate to attain a more complete contact with the bonded position of the target substrate; applying a thermal energy to bond the electronic component onto the bonded position of the target substrate from the carrier substrate.

Description

Method for welding electronic components and method for manufacturing LED display

The present invention relates to a method, and in particular to a method for welding electronic components and a method for manufacturing an LED display.

In the manufacturing process of electronic products, there are often related transfer steps. For example, in the manufacturing process of LED display panels, the LEDs are often placed on the thin film transistor array substrate (TFT array substrate) by a pick-and-place apparatus. However, it may be difficult to bring the transferred objects closer together by the aforementioned pick-and-place apparatus or the aforementioned transfer steps.

The present invention provides a method for welding electronic components, which can at least bring a corresponding carrier substrate and a target substrate closer together.

The method for soldering electronic components of the present invention comprises the following steps: providing a carrier substrate, on the surface of which the electronic components are bonded; providing a target substrate, on the surface of which the soldering position is provided; applying solder to the electronic components and/or the soldering position; making the surface of the carrier substrate on which the electronic components are bonded face the surface of the target substrate on which the soldering position is provided, and bringing the carrier substrate and the target substrate closer to each other until the electronic components are against the soldering position; sequentially applying a plurality of flexible thrusts to the surface of the carrier substrate on which the electronic components are not bonded or to the surface of the target substrate on which the soldering position is not provided, so as to bring the carrier substrate and the target substrate closer together; and applying heat energy to melt the solder, so that the electronic components are soldered to the soldering position of the target substrate.

Based on the above, in the device for transferring electronic components and the method for welding electronic components of the present invention, a plurality of flexible thrusts can be used to at least bring the corresponding carrier substrate and the target substrate closer together.

The contents of the following embodiments are for illustrative purposes only and are not intended to be limiting. Furthermore, descriptions of well-known devices, methods, and materials may be omitted to avoid blurring the description of the various principles of the present invention. The directional terms (e.g., up, down) used herein refer only to the customary terms used or corresponding to the diagrams, and are not intended to imply an absolute orientation. Therefore, unless otherwise specified, the directional terms used are used to illustrate and are not intended to limit the present invention. Furthermore, in order to clearly indicate the directional relationship between different diagrams, the Cartesian coordinate system (i.e., the XYZ rectangular coordinate system) is used as an example in some of the diagrams to indicate the corresponding directions, but the present invention is not limited thereto.

In addition, unless the content clearly indicates otherwise, the singular forms "a", "an", "the" or forms without specific quantity indications may include one or more forms, that is, including "at least one".

In some of the drawings, for the sake of clarity, some elements or film layers may be enlarged, reduced or omitted. Similar components are represented by the same reference numerals and have similar functions, materials or formation methods, and the description is omitted. It will be obvious to those with ordinary knowledge in the technical field to which the present invention belongs that, through the content of the embodiments and the corresponding illustrations, the present invention can be implemented in other embodiments that deviate from the specific details disclosed herein.

Fig. 1 to Fig. 4 are partial side schematic diagrams of a device for transferring electronic components or a method for welding electronic components according to an embodiment of the present invention. Fig. 5 is a partial side schematic diagram of a device for transferring electronic components or a method for welding electronic components according to an embodiment of the present invention. For example, Fig. 5 may be an enlarged view corresponding to area R1 in Fig. 1. Fig. 6 is a partial top schematic diagram of a device for transferring electronic components according to an embodiment of the present invention. For example, Fig. 6 may be a top schematic diagram corresponding to Fig. 1, Fig. 2, Fig. 3 and/or Fig. 4. Fig. 7A is a partial component connection schematic diagram of a device for transferring electronic components according to an embodiment of the present invention. Fig. 7B is a partial component connection schematic diagram of a device for transferring electronic components according to an embodiment of the present invention.

1 , the device 100 can be used to transfer an electronic component 190. The device 100 includes a first platform 110, a second platform 120, a driving mechanism 150 (indicated in FIG. 7A or FIG. 7B ), and a flexible thrust generating mechanism 130. The first platform 110 can be used to support a support substrate 181. The second platform 120 can be used to support a target substrate 182. The driving mechanism 150 can make the first platform 110 and the second platform 120 approach each other and move away from each other. The flexible thrust generating mechanism 130 can be disposed near the first platform 110 or the second platform 120. When the first platform 110 and the second platform 120 are brought close to each other by the driving mechanism 150, the flexible thrust generating mechanism 130 can generate a plurality of flexible thrusts in the direction of the first platform 110 and the second platform 120. In addition, for the sake of clarity, not all electronic components 190 are labeled one by one in FIG. 1 or other similar diagrams.

In one embodiment, as shown in FIG. 7A , the first platform 110 may be movably connected to a driving mechanism 150; and/or, as shown in FIG. 7B , the second platform 120 may be movably connected to the driving mechanism 150. The driving mechanism 150 may include, for example, corresponding motors, gears, transmission belts, transmission chains, threaded rods, or other components suitable for moving the first platform 110 and/or the second platform 120. In this way, by actuating the driving mechanism 150, the first platform 110 moves toward the second platform 120, and/or the second platform 120 moves toward the first platform 110.

In one embodiment, a corresponding flexible film (e.g., first flexible film 141 or second flexible film 142) may be provided on the surface 110b of the first platform 110 (below in FIG. 1 or other similar figures). A portion of the flexible film may be fixed to the surface 110b of the first platform 110 by a corresponding annular fixing member 145. The aforementioned fixing member 145 may be a single component; or, one or more fasteners, one or more clamps, one or more pressing members, one or more locks and/or a combination thereof. The space between the partial area of the flexible film surrounded by the aforementioned fixing member 145 and the first platform 110 may be connected to an appropriate gas pipeline. Therefore, if the aforementioned space is inflated by the aforementioned gas pipeline, the air pressure in the aforementioned space can be increased and/or the aforementioned space can be expanded. Conversely, if the aforementioned space is evacuated by the aforementioned gas pipeline, the air pressure in the aforementioned space can be decreased and/or the aforementioned space can be shrunk. In this way, a corresponding bag can be constructed in the above manner. For example, the flexible membrane 141 can constitute a part of the first bag 131; and/or, the flexible membrane 142 can constitute a part of the second bag 132.

In one embodiment, the flexible thrust generating mechanism 130 may include a ventilation device 136. The ventilation device 136 may be connected to a vacuum pump via an appropriate gas pipeline. Through the vacuum pump, the supporting substrate 181 may be supported on the first platform 110. The gas pipeline may include a corresponding valve, and the valve may adjust the flow rate or flow velocity of the gas.

For example, referring to FIG. 5 , the ventilation device 136 can be placed on a flexible film 142 (e.g., a portion of the second bag 132). By exhausting air with the exhaust pump, the air pressure in the gap G between the flexible film 142 and the supporting substrate 181 can be made lower than the ambient air pressure. In this way, the supporting substrate 181 can be supported on the first platform 110 (below in FIG. 1 or other similar figures). In addition, the ventilation device 136 in the exhaust state can be referred to as an exhaust device.

In one embodiment, an electronic component 190 may be adhered to the surface 181b of the carrier substrate 181 (below in FIG. 1 or other similar figures). The electronic component 190 may be transferred in a subsequent step. In other words, the electronic component 190 may be temporarily adhered to the surface 181b of the carrier substrate 181 (below in FIG. 1 or other similar figures). For example, a release film (not shown) may be provided between the surface 181b of the carrier substrate 181 and the electronic component 190, but the present invention is not limited thereto.

In one embodiment, the electronic component 190 may include a light emitting diode (LED) chip.

In one embodiment, the target substrate 182 may have a corresponding soldering position 182c on the surface 182a (the upper side in FIG. 1 or other similar figures). The soldering position 182c of the target substrate 182 may correspond to the electronic component 190. For example, the soldering position 182c of the target substrate 182 may correspond to the solder 192 on the electronic component 190. In addition, for the sake of clarity, not all soldering positions 182c are marked one by one in FIG. 1 or other similar figures; or, some or all of the soldering positions 182c are omitted.

In one embodiment, solder 192 (shown in FIG. 5 ) may be applied to electronic component 190 . In an embodiment not shown, solder that is the same as or similar to solder 192 may be applied to soldering location 182 c of target substrate 182 .

In one embodiment, the target substrate 182 may have a corresponding circuit (not shown). For example, the welding position 182c of the target substrate 182 may have a corresponding contact pad. In one embodiment, the target substrate 182 may include a thin film transistor (TFT) substrate.

Referring to FIG. 1 and FIG. 2, the surface 181b of the carrier substrate 181 on which the electronic component 190 is adhered is made to face the surface 182a of the target substrate 182 having the soldering position 182c, and the carrier substrate 181 and the target substrate 182 are brought close to each other until the electronic component 190 hits the soldering position 182c. For example, the surface 181b of the carrier substrate 181 on which the electronic component 190 is adhered is made to face the surface 182a of the target substrate 182 having the soldering position 182c; then, the carrier substrate 181 and the target substrate 182 can be brought close to each other by the driving mechanism 150 until the solder 192 on the electronic component 190 hits the soldering position 182c on the target substrate 182.

In one embodiment, when the first platform 110 and the second platform 120 are brought closer to each other by the driving mechanism 150, a plurality of flexible thrusts can be generated in the direction of the first platform 110 and the second platform 120. For example, the flexible thrust generating mechanism 130 may include a first bladder 131 and an inflation device 135. The inflation device 135 may include, for example, a corresponding inflation pump and a corresponding gas pipeline 135d. The gas pipeline 135d may be connected to the inflation pump and the first bladder 131. In this way, the corresponding first bladder 131 may be inflated by the inflation device 135 to generate a corresponding flexible thrust.

In one embodiment, the number of the first pouches 131 may be plural. For example, as shown in FIG6 , the first pouches 131 may include a first pouch 131A, a first pouch 131B, a first pouch 131C, a first pouch 131D, a first pouch 131E, a first pouch 131F, a first pouch 131G, a first pouch 131H, a first pouch 131I, a first pouch 131J, a first pouch 131K, a first pouch 131L, a first pouch 131M, a first pouch 131N, and a first pouch 131O. The number of the first pouches 131 only needs to be plural, and is not limited in the present invention.

In one direction, a plurality of the first pouches 131 may be arranged in parallel. For example, along the first direction X, the first pouches 131A, 131B, 131C, 131D, and 131E may be arranged in parallel. In one embodiment, the plurality of first pouches 131 may be arranged in an array.

In one embodiment, the order of inflating the corresponding first pouches 131 may be applied sequentially and/or separately along one side of the carrier substrate 181 or the target substrate 182 toward another side opposite to the aforementioned side.

For example, please further refer to FIG. 6 , the first bags 131A, 131F, and 131K may be inflated; then the first bags 131B, 131G, and 131L may be inflated; then the first bags 131C, 131H, and 131M may be inflated; then the first bags 131D, 131I, and 131N may be inflated; then the first bags 131E, 131J, and 131O may be inflated. In short, the corresponding first bags 131 may be inflated sequentially and/or separately along the first direction X.

For example, please further refer to FIG. 6 , the first bags 131A, 131B, 131C, 131D, and 131E may be inflated; then, the first bags 131F, 131G, 131H, 131I, and 131J may be inflated; then, the first bags 131K, 131L, 131M, 131N, and 131O may be inflated. In short, the corresponding first bags 131 may be inflated sequentially and/or separately along the second direction Y.

In one embodiment, the order of inflating the corresponding first bags 131 can be applied sequentially and/or separately along one corner of the carrier substrate 181 or the target substrate 182 toward another corner opposite to the aforementioned corner.

For example, please further refer to Figure 6. The first bag 131A can be inflated; then, the first bags 131B and 131F can be inflated; then, the first bags 131C, 131G, and 131K can be inflated; then, the first bags 131D, 131H, and 131L can be inflated; then, the first bags 131E, 131I, and 131M can be inflated; then, the first bags 131J and 131N can be inflated; then, the first bag 131O can be inflated.

In one embodiment, the order of inflating the corresponding first pouches 131 may be applied sequentially and/or separately from the center of the carrier substrate 181 or the target substrate 182 outward.

For example, please further refer to Figure 6, the first bag 131H can be inflated; then, the first bags 131B, 131C, 131D, 131G, 131I, 131L, 131M, and 131N can be inflated; then, the first bags 131A, 131F, 131K, 131E, 131J, and 131O can be inflated.

In one embodiment, by inflating the first bag 131 as described above, the carrier substrate 181 and the target substrate 182 can be brought closer together; and/or the flatness of the carrier substrate 181 and/or the target substrate 182 can be improved after the electronic component 190 is pressed against the welding position 182c.

Please continue to refer to FIG. 2 , the flexible thrust generating mechanism 130 may further include a second bag 132 wrapped around the plurality of first bags 131. After the plurality of flexible thrusts are applied by the plurality of first bags 131, the second bag 132 may be further inflated to generate a flexible thrust applied to the support substrate 181 and/or the target substrate 182, so that the support substrate 181 and the target substrate 182 may be brought closer together; and/or, the flatness of the support substrate 181 and/or the target substrate 182 may be improved after the electronic component 190 is pressed against the welding position 182c.

For example, the ventilation device 136 can be connected to an inflation pump (not shown) through an appropriate gas line (not shown). By inflating the inflation pump, the second bag 132 can be inflated. The ventilation device 136 in the inflated state can be referred to as the inflation device 135. For another example, the inflation method for the second bag 132 can be similar to the inflation method for the first bag 131.

It is worth noting that at this time (eg, the state shown in FIG. 2 ), the electronic component 190 is still substantially not soldered to the soldering position 182 c of the target substrate 182 .

Referring to FIG. 2 and FIG. 3 , after the support substrate 181 and the target substrate 182 are brought closer together (e.g., as shown in FIG. 2 ) by applying a plurality of flexible thrusts through the plurality of first bags 131 and/or the second bags 132, heat energy can be applied through the heat energy generating mechanism 160 as shown in FIG. 3 . The solder 192 can be melted by receiving sufficient heat energy. In this way, after the application of heat energy is stopped and the molten solder 192 is cooled, the electronic component 190 can be soldered to the soldering position 182c of the target substrate 182.

In one embodiment, the heat energy generating mechanism 160 may include a laser beam generating mechanism 161. The laser beam generating mechanism 161 may be disposed adjacent to the first platform 110 or the second platform 120. Furthermore, the laser beam generating mechanism 161 may generate a laser beam L in the direction of the first platform 110 and the second platform 120.

In one embodiment, the laser beam L may further irradiate the release film (if any) between the surface 181b of the carrier substrate 181 and the electronic element 190; or, the heat energy may be thermally transferred to the release film (if any) between the surface 181b of the carrier substrate 181 and the electronic element 190. The viscosity or bonding force of the release film (if any) may be reduced after being irradiated with light and/or heated. In this way, the electronic element 190 can be easily separated from the carrier substrate 181 in the subsequent steps.

Taking FIG. 3 as an example, the laser beam generating mechanism 161 can be disposed adjacent to the second platform 120 (e.g., below the second platform 120 as shown in FIG. 3 ). The material of the second platform 120 can be suitable for allowing the laser beam L to penetrate (e.g., the penetration rate of the laser beam L is greater than 50%; preferably greater than 70%; and more preferably greater than 80%). For example, the material of the second platform 120 can include glass or light-transmitting plastic (e.g., acrylic), but the present invention is not limited thereto. For another example, the laser beam L can include a green laser or an infrared laser, but the present invention is not limited thereto. The type of the laser beam L and the material of the second platform 120 can cooperate with each other so that the laser beam L generated by the laser beam generating mechanism 161 can penetrate the second platform 120.

It is worth noting that the present invention does not specifically limit the form or quantity of the laser beam generating mechanism 161; and/or the wavelength range of the laser beam L, as long as the laser beam L generated by the laser beam generating mechanism 161 irradiates the solder 192 and generates heat energy suitable for melting the solder 192.

3 and 4 , after the electronic component 190 is soldered to the soldering position 182 c of the target substrate 182 , the first platform 110 and the second platform 120 can be moved away from each other by actuating the driving mechanism 150 .

In this embodiment, after the electronic component 190 is soldered to the soldering position 182c of the target substrate 182, the carrier substrate 181 can be carried on the first platform 110 (at the bottom in FIG. 1 or other similar figures) by exhausting the gas by the exhaust pump as described above. In this way, when the first platform 110 and the second platform 120 are separated from each other, the electronic component 190 soldered to the target substrate 182 can be separated from the carrier substrate 181, so that the electronic component 190 can be transferred from the carrier substrate 181 to the target substrate 182.

In one embodiment, the aforementioned method of transferring electronic components (such as electronic component 190) can be applied to the manufacture of LED displays. For example, if the target substrate 182 is a thin film transistor substrate (such as a thin film transistor array substrate (TFT array substrate)), and the electronic component 190 is a LED chip, then the structure shown on the second platform 120 in FIG. 4 can be a part or all of the LED display.

In summary, the device for transferring electronic components and the method for soldering electronic components of the present invention can be used to transfer electronic components on a carrier substrate to a target substrate.

100: device 110: first platform 110b: surface 120: second platform 130: flexible thrust generating mechanism 131, 131A, 131B, 131C, 131D, 131E, 131F, 131G, 131H, 131I, 131J, 131K, 131L, 131M, 131N, 131O: first bladder 132: second bladder 135: inflation device 135d: gas pipeline 136: ventilation device 141: flexible membrane 142: flexible membrane 145: fixing member 150: driving mechanism 160: heat energy generating mechanism 161: laser beam generating mechanism 181: Carrier substrate 181b: Surface 182: Target substrate 182a: Surface 182c: Soldering position 190: Electronic component 192: Solder L: Laser beam G: Gap R1: Region X, Y, Z: Direction

Figures 1 to 4 are partial side schematic diagrams of a device for transferring electronic components or a method for welding electronic components according to an embodiment of the present invention. Figure 5 is a partial side schematic diagram of a device for transferring electronic components or a method for welding electronic components according to an embodiment of the present invention. Figure 6 is a partial top schematic diagram of a device for transferring electronic components according to an embodiment of the present invention. Figure 7A is a partial component connection schematic diagram of a device for transferring electronic components according to an embodiment of the present invention. Figure 7B is a partial component connection schematic diagram of a device for transferring electronic components according to an embodiment of the present invention.

100:Device

110: First platform

110b: Surface

120: Second platform

130: Flexible thrust generating mechanism

131: First pouch

132: Second pouch

135: Inflatable device

135d: Gas pipeline

136: Ventilation device

141: Flexible membrane

142: Flexible membrane

145:Fixer

160: Heat energy generating mechanism

161: Laser beam generating mechanism

181: Carrier substrate

182: Target substrate

190: Electronic components

L: Laser beam

X, Y, Z: direction

Claims (8)

A method for soldering electronic components, comprising: providing a carrier substrate, on one surface of which an electronic component is bonded; providing a target substrate, on one surface of which a soldering position is provided; applying a solder to the electronic component and/or the soldering position; making the surface of the carrier substrate on which the electronic component is bonded face the surface of the target substrate on which the soldering position is provided, and bringing the carrier substrate and the target substrate closer to each other until the electronic component abuts against the soldering position; sequentially applying a plurality of flexible thrusts to the surface of the carrier substrate on which the electronic component is not bonded or the surface of the target substrate on which the soldering position is not provided, so as to bring the carrier substrate and the target substrate closer together; and applying heat to melt the solder, so that the electronic component is soldered to the soldering position of the target substrate. A method for soldering electronic components as described in claim 1, wherein the plurality of flexible thrusts are applied sequentially outward from a central position of the carrier substrate or the target substrate. A method for soldering electronic components as described in claim 1, wherein the plurality of flexible thrusts are applied sequentially from one side of the carrier substrate or the target substrate to another side opposite to the side. A method for welding electronic components as described in claim 1, wherein the flexible thrust is generated by an air bag. A method for welding electronic components as described in claim 1, wherein the heat energy is generated by a laser beam. A method for welding electronic components as described in claim 1, wherein the target substrate is a thin film transistor (TFT) substrate. A method for welding electronic components as described in claim 1, wherein the electronic component is a light emitting diode (LED) chip. A method for manufacturing an LED display, comprising soldering LED chips using the method of claim 7.

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