TW202505952A - Apparatus configured to bond an electronic component - Google Patents

Abstract

An apparatus configured to bond an electronic component includes a carrying platform, a pushing mechanism, and an energy generating mechanism. The carrying platform is configured to carry the electronic component to be bonded and a relative substrate. The pushing mechanism includes a pushing body and a pump. The pushing body includes a plurality of rigid peripheral walls and a nonrigid pushing wall. The rigid peripheral walls and the nonrigid pushing wall form an enclosed space. The nonrigid pushing wall faces the carrying platform. The pump communicates with the enclosed space, and is capable of pumping outside air into the enclosed space or extracting air from the enclosed space. The energy generating mechanism is capable of generating an energy beam passing through the pushing body of the pushing mechanism and being projected onto the carrying platform.

Description

Device for soldering electronic components

The present invention relates to a device for welding electronic components.

With the development of the manufacturing process of electronic components (such as microelectronic components, LEDs or microLEDs), a process for transferring a large number of electronic components, LEDs or microLEDs from one substrate to another substrate has been developed, which is beneficial to the mass production of electronic components.

However, in the process of transferring electronic components, LEDs or micro LEDs from one substrate to another, the two substrates need to be placed face to face, and then laser processing is used to transfer the electronic components, LEDs or micro LEDs. At this time, whether the two substrates are tightly attached during laser processing is crucial to the yield of the transfer process.

A known process is to form a closed space above the substrate and inflate the closed space to directly press the substrate with air pressure. However, in order to form such a closed space, this process uses silicone to apply pressure to the peripheral area of the substrate and use silicone to block the gas from flowing out from the side. However, when applying pressure to the peripheral area of the substrate with silicone, due to the small area of silicone, it is easy to generate local high pressure, which is easy to damage the thin film transistor circuit or electronic components on the substrate, thereby reducing the yield of the process.

The present invention provides a device for welding electronic components, which can effectively improve the process yield.

An embodiment of the present invention provides a device for welding electronic components, including a support platform, a pushing mechanism and an energy generating mechanism. The support platform is used to support the electronic components to be welded and their related substrates, and the pushing mechanism includes a pushing body and an air pump. The pushing body includes a plurality of rigid peripheral walls and a non-rigid pushing wall, and the plurality of rigid peripheral walls and the non-rigid pushing wall surround to form a closed space, wherein the non-rigid pushing wall faces the support platform. The air pump is connected to the above-mentioned closed space, and can pump external air into the closed space, and extract the air in the closed space. The energy generating mechanism can generate an energy beam, which is projected onto the support platform through the pushing body of the pushing mechanism.

In the device for soldering electronic components of the embodiment of the present invention, a plurality of rigid peripheral walls and non-rigid pressing walls are used to surround a closed space, and the non-rigid pressing walls are pressed against the substrate by inflating the closed space, so the device for soldering electronic components of the embodiment of the present invention will not have the situation in the prior art where silicone is used to press the peripheral area of the substrate to generate a closed space. In this way, the device for soldering electronic components of the embodiment of the present invention will not have the situation in the prior art where silicone is used to press the thin film transistor circuit on the peripheral area of the substrate, thereby reducing the yield of the process. Therefore, the device for welding electronic components of the embodiment of the present invention can use the non-rigid pressing wall to uniformly push the substrate to complete the process without damaging the circuit on the substrate. Therefore, the device for welding electronic components of the embodiment of the present invention can effectively improve the process yield.

FIG. 1 is a schematic cross-sectional view of a device for soldering electronic components according to an embodiment of the present invention. Referring to FIG. 1 , the device 100 for soldering electronic components according to the present embodiment includes a carrier 110, a pushing mechanism 200, and an energy generating mechanism 120. The carrier 110 is used to support the electronic component 300 to be soldered and its related substrate, wherein the related substrate may be a single substrate or a plurality of sub-substrates. For example, the above-mentioned related substrate may include a transfer substrate 50 and a target substrate 60. In the present embodiment, a plurality of electronic components 300 are attached to the transfer substrate 50 via an adhesive layer 52, and the enlarged view in FIG. 1 shows one of the electronic components 300 as an example. The electronic component 300 has an electrode 310. The target substrate 60 is, for example, a circuit substrate, and is provided with a pad 62 and a circuit (for example, a thin film transistor circuit) electrically connected to the pad 62. In addition, a solder 70 is provided on the pad 62. In this embodiment, the material of the transfer substrate 50 is, for example, glass, and the material of the target substrate 60 is, for example, glass. The target substrate 60 is, for example, a thin film transistor (TFT) substrate.

The pushing mechanism 200 includes a pushing body 400 and an air pump 210. The pushing body 400 includes a plurality of rigid peripheral walls 410 and a non-rigid pushing wall 420. The plurality of rigid peripheral walls 410 and the non-rigid pushing wall 420 surround a closed space S, wherein the non-rigid pushing wall 420 faces the support platform 110. The air pump 210 is connected to the closed space S, and can pump external air into the closed space S, and extract the air in the closed space S. In this embodiment, the non-rigid push wall 420 includes a push member 422, and the two sides of the push member 422 are connected to the adjacent rigid peripheral wall 410, for example, connected to the rigid peripheral wall 412 by an elastic member 424. In this embodiment, the push member 422 is a flexible quartz. In addition, in this embodiment, one end of the elastic member 424 is attached to the lower surface 411 of the adjacent rigid peripheral wall 410 facing the support platform 110, and the other end of the elastic member 424 is attached to the upper surface 423 of the push member 422 facing away from the support platform 110. In one embodiment, the push member 422 is a flexible glass.

In this embodiment, the pushing body 400 includes five rigid peripheral walls 410, which and a non-rigid pushing wall 420 surround a closed space S in a hexahedral manner. Specifically, the rigid peripheral wall 410 may include a rigid peripheral wall 414 opposite to the pushing wall 420 and four rigid peripheral walls 412 surrounding the closed space S, wherein the rigid peripheral wall 414 opposite to the pushing wall 420 is light-permeable. In one embodiment, the material of the rigid peripheral wall 414 opposite to the pushing wall 420 is quartz.

The energy generating mechanism 120 can generate an energy beam 122, which is projected onto the support platform 110 through the pushing body 400 of the pushing mechanism 200. In this embodiment, the energy beam 122 is a laser beam, and the energy generating mechanism 120 is, for example, a laser light source. The energy beam 122 can penetrate the rigid peripheral wall 414 and the pushing member 422 and irradiate onto the support platform 110.

The electronic component 300 is, for example, a light-emitting diode chip or other electronic component, which is originally attached to the transfer substrate 50 by the adhesive layer 52, and the device 100 for soldering electronic components can transfer the electronic component 300 from the transfer substrate 50 to the target substrate 60. First, the transfer substrate 50 can be adsorbed onto the rigid peripheral wall 412 by a plurality of adsorption structures 430 (such as suction nozzles), and the side of the transfer substrate 50 with the electronic component 300 faces the target substrate 60, and the electrode 310 of the electronic component 300 is aligned with the solder 70 and the pad 62. Then, the air pump 210 is used to inflate the closed space S. For example, the air pump 210 can pump external air into the closed space S through the channel 402. At this time, the elastic member 424 will be deformed downward, and the pushing member 422 will evenly push the surface of the transfer substrate 50 where the electronic components 300 are not arranged, so that the electrode 310 and the solder 70 are in close contact. Then, the energy generating mechanism 120 emits an energy beam 122, and the energy beam 122 penetrates the rigid peripheral wall 414 and the pushing member 422 and irradiates the solder 70 to melt the solder 70. After the solder 70 cools and solidifies, the electrode 310 and the pad 62 will be joined. Afterwards, the air pump 210 can be used to extract the air in the closed space S so that the pushing member 422 no longer presses the transfer substrate 50, and then the transfer substrate 50 and the target substrate 60 are separated. At this time, the bonding force between the solder 70 and the electrode 310 of the electronic component 300 is greater than the bonding force between the adhesive layer 52 and the electronic component 300, so the electronic component 300 will be separated from the transfer substrate 50. At this point, the electronic component 300 is successfully transferred from the transfer substrate 50 to the target substrate 60. In this embodiment, the material of the elastic member 424 is, for example, silicone.

In one embodiment, the device 100 for welding electronic components further includes a driving mechanism 130, which can drive the pushing body 400 of the pushing mechanism 200 and the supporting platform 110 to move relative to each other. In this way, the pushing body 400 can push different areas of the target substrate 60 to transfer the electronic components 300 to different areas of the target substrate 60. That is, in this embodiment, the area of the target substrate 60 that can be used to support the electronic components 300 is larger than the surface area of the non-rigid pushing wall 420, so the pushing body 400 of the pushing mechanism 200 and the supporting platform 110 can be moved relative to each other by the driving mechanism 130 to transfer the electronic components 300 in different areas.

In the device 100 for soldering electronic components of the present embodiment, since a plurality of rigid peripheral walls 410 and non-rigid pressing walls 420 are used to surround and form a closed space S, and the non-rigid pressing walls 420 are pressed against the substrate by inflating the closed space S, the device 100 for soldering electronic components of the present embodiment will not use silicone to press the peripheral area of the substrate to generate a closed space. In this way, the device 100 for soldering electronic components of the present embodiment will not have silicone press damage to the thin film transistor circuit or electronic components on the peripheral area of the substrate, thereby reducing the yield of the process. Therefore, the device 100 for welding electronic components of the present embodiment can use the non-rigid pushing wall 420 to uniformly push the substrate to complete the process without damaging the circuit (such as a thin film transistor circuit) or electronic components on the substrate. Therefore, the device 100 for welding electronic components of the present embodiment can effectively improve the process yield.

FIG2 is a cross-sectional schematic diagram of another embodiment of the device for soldering electronic components of the present invention. Referring to FIG2, the device 100a for soldering electronic components of the present embodiment is similar to the device 100 for soldering electronic components of FIG1, and the difference between the two is that in the device 100a for soldering electronic components of the present embodiment, one end of the elastic member 424 is attached to the upper surface 413 of the adjacent rigid peripheral wall 410 facing away from the support platform 110, and the upper surface 413 is located on a horizontal extension arm 415 at the bottom of the rigid peripheral wall 410.

In summary, in the device for soldering electronic components of the embodiment of the present invention, a closed space is formed by surrounding a plurality of rigid peripheral walls and non-rigid pressing walls, and the closed space is inflated to make the non-rigid pressing wall press the substrate, so the device for soldering electronic components of the embodiment of the present invention will not have the situation of using silicone to press the peripheral area of the substrate to produce a closed space in the prior art. In this way, the device for soldering electronic components of the embodiment of the present invention will not have the situation of silicone pressing the thin film transistor circuit on the peripheral area of the substrate in the prior art, thereby reducing the yield of the process. Therefore, the device for welding electronic components of the embodiment of the present invention can use the non-rigid pressing wall to uniformly push the substrate to complete the process without damaging the circuit on the substrate. Therefore, the device for welding electronic components of the embodiment of the present invention can effectively improve the process yield.

50: transfer substrate 52: adhesive layer 60: target substrate 62: pad 70: solder 100, 100a: device for soldering electronic components 110: carrier 120: energy generating mechanism 122: energy beam 130: driving mechanism 200: pushing mechanism 210: air pump 300: electronic component 310: electrode 400: pushing body 402: channel 410, 412, 414: rigid peripheral wall 411: lower surface 413, 423: upper surface 415: horizontal extension arm 420: non-rigid pushing wall 422: pushing member 424: Elastic parts 430: Adsorption structure S: Closed space

FIG. 1 is a schematic cross-sectional view of a device for soldering electronic components according to one embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a device for soldering electronic components according to another embodiment of the present invention.

50: Transfer substrate

52: Adhesive layer

60: Target substrate

62:Pad

70: Solder

100: Device for welding electronic components

110: Carrier platform

120: Energy generating mechanism

122: Energy beam

130: Driving mechanism

200: Pushing mechanism

210: Air pump

300: Electronic components

310:Electrode

400: Push the body

402: Channel

410, 412, 414: Rigid peripheral wall

411: Lower surface

420: Non-rigid push wall

422: Push piece

423: Upper surface

424: Elastic parts

430: Adsorption structure

S: Closed space

Claims (8)

A device for welding electronic components, comprising: A carrier, which is used to carry the electronic components to be welded and their related substrates; A pushing mechanism, which comprises: A pushing body, which includes a plurality of rigid peripheral walls and a non-rigid pushing wall, wherein the plurality of rigid peripheral walls and the non-rigid pushing wall surround a closed space, wherein the non-rigid pushing wall faces the carrier; and An air pump, which is connected to the above-mentioned closed space and can pump external air into the closed space and extract the air in the closed space; and An energy generating mechanism, which can generate an energy beam, which passes through the pushing body of the pushing mechanism and is projected onto the carrier. A device for welding electronic components as described in claim 1, wherein the non-rigid pushing wall includes a pushing member, and two sides of the pushing member are connected to the adjacent rigid peripheral wall by an elastic member respectively. A device for welding electronic components as described in claim 2, wherein the pushing member is a flexible quartz or glass. The device for welding electronic components as described in claim 1 further includes a driving mechanism that can drive the pushing body and the supporting platform of the pushing mechanism to move relative to each other. As described in claim 1, the device for welding electronic components, wherein the pushing body includes 5 rigid peripheral walls, which and the non-rigid pushing wall surround the closed space in a hexahedral manner. A device for welding electronic components as described in claim 5, wherein the rigid peripheral wall opposite to the pushing wall is light-permeable. A device for welding electronic components as described in claim 6, wherein the material of the rigid peripheral wall opposite to the pushing wall is quartz. A device for welding electronic components as described in claim 1, wherein the energy beam is a laser beam.

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