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TWI845977B - Writing apparatus and writing method - Google Patents

Writing apparatus and writing method Download PDF

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Publication number
TWI845977B
TWI845977B TW111124873A TW111124873A TWI845977B TW I845977 B TWI845977 B TW I845977B TW 111124873 A TW111124873 A TW 111124873A TW 111124873 A TW111124873 A TW 111124873A TW I845977 B TWI845977 B TW I845977B
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Taiwan
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substrate
aforementioned
pattern
distance
drawing head
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TW111124873A
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Chinese (zh)
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TW202309674A (en
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久野真士
青松哲純
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日商斯庫林集團股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026Focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703Gap setting, e.g. in proximity printer
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)

Abstract

A writing apparatus (1) includes writing heads (41), a first stage (21a) and a second stage (21b), and a first distance sensor (5). Sensor elements (51) included in the first distance sensor (5) obtain distances to measurement positions on a substrate (9) held on one stage while pattern writing is performed on a substrate (9) held on the other stage. A writing head (41) includes a second distance sensor obtaining a distance to a measurement position on the substrate (9) on which pattern writing is performed. A focus control part included in a control part (10) controls a focus position of a light emitted from the writing head (41) with using information obtained by the first distance sensor (5) from a substrate (9) before pattern writing and information obtained by the second distance sensor while pattern writing is performed on the substrate (9).

Description

描繪裝置以及描繪方法 Drawing device and drawing method

本發明有關於一種技術,係對基板照射光線,藉此對基板描繪圖案(pattern)。 The present invention relates to a technology that irradiates light onto a substrate to draw a pattern on the substrate.

[相關申請案的參照] [References to related applications]

本申請案係主張2021年8月26日所申請的日本專利申請案JP2021-137767的優先權,將日本專利申請案JP2021-137767的全部的揭示內容援用於本申請案。 This application claims priority to Japanese patent application JP2021-137767 filed on August 26, 2021, and all disclosures of Japanese patent application JP2021-137767 are incorporated herein.

以往,對表面具有感光材料的層之半導體基板、印刷基板、或者有機EL(electroluminescence;電致發光)顯示裝置或者液晶顯示顯示用的玻璃基板等(以下包含感光材料的層並統稱為「基板」)照射光線,藉此進行圖案的描繪。在此種描繪裝置中依序進行基板的搬入、基板的對準(alignment)、對於基板的描繪以及搬出基板。 In the past, patterns were drawn by irradiating light onto a semiconductor substrate, printed circuit board, organic EL (electroluminescence) display device, or glass substrate for liquid crystal display (hereinafter including the layer of photosensitive material and collectively referred to as "substrate") having a layer of photosensitive material on the surface. In such a drawing device, the substrate is brought in, aligned, drawn on, and unloaded in sequence.

近年來,為了提升描繪裝置的處理量(throughput)(每單位時間所處理的基板的數量),提出下述技術:於一台描繪裝置內設置兩個基板保持部以及一個描繪頭,並在對一方的基板保持部上的基板進行描繪的期間進行另一方的基板保持部上的基板的更換以及對準處理。 In recent years, in order to improve the throughput (the number of substrates processed per unit time) of the drawing device, the following technology has been proposed: two substrate holders and a drawing head are set in one drawing device, and the substrate on the other substrate holder is replaced and aligned while the substrate on one substrate holder is being drawn.

例如,在國際公開第2003/010802號公報的步進掃描(step and scan)方式的掃描型投影曝光裝置中,在對屬於一方的基板保持部的台(stage)上的晶圓 進行曝光的期間,在另一方的台中進行晶圓更換、為了對準的計測、以及在另一方的台處待機至曝光結束為止(參照圖4)。 For example, in the step and scan scanning projection exposure device of International Publication No. 2003/010802, while exposing a wafer on a stage belonging to one substrate holding portion, wafer replacement, alignment measurement, and waiting at the other stage until the exposure is completed are performed on the other stage (see FIG. 4 ).

此外,在日本特開2014-197125號公報中揭示了一種自動對焦機構,係在用以對基板照射光線從而描繪圖案之描繪裝置中於光學頭設置有檢測器,檢測器係用以檢測光學頭與基板之間的分離距離,自動對焦機構係依循分離距離調整描繪光的對焦位置。此外,揭示有一種技術,係使用光學頭的檢測器根據描繪區域在描繪前預先取得描繪區域中的分離距離的變動,並在描繪時依據分離距離的變動來進行自動對焦控制。 In addition, Japanese Patent Publication No. 2014-197125 discloses an autofocus mechanism, in which a detector is provided on an optical head in a drawing device for irradiating light on a substrate to draw a pattern, and the detector is used to detect the separation distance between the optical head and the substrate, and the autofocus mechanism adjusts the focus position of the drawing light according to the separation distance. In addition, a technology is disclosed, which uses the detector of the optical head to obtain the change of the separation distance in the drawing area in advance according to the drawing area before drawing, and performs autofocus control according to the change of the separation distance during drawing.

然而,在大多的描繪裝置中,為了對基板的表面進行高精度的描繪,於描繪頭設置有自動對焦功能。藉由自動對焦功能,藉由從描繪頭射出的光線所形成之影像的高度方向的位置係被正確地對合至基板的表面的高度方向的位置。然而,由於自動對焦所需的測距感測器設置於描繪頭,因此自動對焦所需的測量係在基板配置於描繪頭的下方後再進行。因此,就算基板配置於描繪頭的下方,亦存在未進行描繪之時間。結果,即使設置有兩個基板保持部,亦無法充分地提升處理量。 However, in most drawing devices, an autofocus function is provided on the drawing head in order to draw the surface of the substrate with high precision. With the autofocus function, the height direction position of the image formed by the light emitted from the drawing head is correctly aligned with the height direction position of the surface of the substrate. However, since the distance sensor required for autofocus is provided on the drawing head, the measurement required for autofocus is performed after the substrate is arranged under the drawing head. Therefore, even if the substrate is arranged under the drawing head, there is a time when drawing is not performed. As a result, even if two substrate holding parts are provided, the processing volume cannot be fully increased.

本發明的目的為在具有第一基板保持部以及第二基板保持部之描繪裝置中提升處理量。 The purpose of the present invention is to increase the processing capacity in a drawing device having a first substrate holding portion and a second substrate holding portion.

本發明著眼於一種描繪裝置,係對基板照射光線,藉此對前述基板描繪圖案。描繪裝置係具備:描繪頭,係射出經過調變的光線;第一基板保持部,係保持第一基板;第二基板保持部,係保持第二基板;移動機構,係在 藉由從前述描繪頭射出的光線對被前述第一基板保持部保持的第一基板描繪圖案的期間,將前述描繪頭相對於前述第一基板保持部相對性地移動,在藉由從前述描繪頭射出的光線對被前述第二基板保持部保持的第二基板描繪圖案的期間,將前述描繪頭相對於前述第二基板保持部相對性地移動;第一測距感測器,係在對被前述第二基板保持部保持的第二基板描繪圖案的期間,與被前述第一基板保持部保持的第一基板對向並取得與前述第一基板上的測量位置之間的距離,在對被前述第一基板保持部保持的第一基板描繪圖案的期間,與被前述第二基板保持部保持的第二基板對向並取得與前述第二基板上的測量位置之間的距離;以及對焦控制部,係在圖案的描繪的期間進行用以使從前述描繪頭射出的光線的對焦位置對合至描繪有前述圖案之基板的表面的高度方向的位置之控制。前述描繪頭係包含:第二測距感測器,係取得與正在進行圖案的描繪的基板上的測量位置之間的距離;以及對焦變更部,係變更從前述描繪頭射出的光線的對焦位置;前述對焦控制部係使用在圖案的描繪之前藉由前述第一測距感測器從基板所取得的資訊以及正在對前述基板描繪前述圖案的期間從前述第二測距感測器所取得的資訊來控制前述對焦變更部。 The present invention focuses on a drawing device that irradiates light onto a substrate to draw a pattern on the substrate. The drawing device comprises: a drawing head that emits modulated light; a first substrate holding portion that holds the first substrate; a second substrate holding portion that holds the second substrate; a moving mechanism that moves the drawing head relatively to the first substrate holding portion while the light emitted from the drawing head is drawing a pattern on the first substrate held by the first substrate holding portion, and moves the drawing head relatively to the second substrate holding portion while the light emitted from the drawing head is drawing a pattern on the second substrate held by the second substrate holding portion; a first distance measuring sensor that moves the drawing head relatively to the second substrate holding portion while the light emitted from the drawing head is drawing a pattern on the second substrate held by the second substrate holding portion; During the period when the second substrate held by the aforementioned second substrate holding portion is drawing a pattern, the first substrate held by the aforementioned first substrate holding portion is opposed to the first substrate and the distance between the first substrate and the measurement position is obtained; during the period when the first substrate held by the aforementioned first substrate holding portion is drawing a pattern, the second substrate held by the aforementioned second substrate holding portion is opposed to the second substrate and the distance between the measurement position is obtained; and a focus control portion is used to control the focus position of the light emitted from the aforementioned drawing head to be aligned with the position in the height direction of the surface of the substrate on which the aforementioned pattern is drawn during the drawing of the pattern. The drawing head includes: a second distance sensor for obtaining the distance from the measurement position on the substrate where the pattern is being drawn; and a focus changing unit for changing the focus position of the light emitted from the drawing head; the focus control unit controls the focus changing unit using information obtained from the substrate by the first distance sensor before the pattern is drawn and information obtained from the second distance sensor during the drawing of the pattern on the substrate.

依據本發明,能在具有第一基板保持部以及第二基板保持部的描繪裝置中提升處理量。 According to the present invention, the processing capacity can be increased in a drawing device having a first substrate holding portion and a second substrate holding portion.

較佳為,前述第一測距感測器的測量精度係比前述第二測距感測器的測量精度還低。 Preferably, the measurement accuracy of the first distance measuring sensor is lower than the measurement accuracy of the second distance measuring sensor.

在本發明的較佳實施形態中,在前述描繪頭開始對被前述第一基板保持部或者前述第二基板保持部保持的基板描繪圖案之前,前述對焦控制部係使用藉由前述第一測距感測器所取得的資訊將從前述描繪頭射出的光線的對 焦位置接近至開始描繪時的前述基板的表面的高度方向的位置。 In a preferred embodiment of the present invention, before the drawing head starts drawing a pattern on the substrate held by the first substrate holding portion or the second substrate holding portion, the focus control portion uses information obtained by the first distance measuring sensor to bring the focus position of the light emitted from the drawing head close to the height direction position of the surface of the substrate when drawing starts.

較佳為,前述第一測距感測器係一邊使測量位置位於被前述第一基板保持部或者前述第二基板保持部保持的基板上的開始描繪位置附近的複數個位置,一邊取得直至複數個前述位置為止的複數個距離;前述對焦控制部係將複數個前述距離中之最高頻度的距離作為前述第一測距感測器與前述基板之間的距離來利用。 Preferably, the first distance measuring sensor is configured to locate the measurement position at a plurality of positions near the start drawing position on the substrate held by the first substrate holding portion or the second substrate holding portion, while obtaining a plurality of distances up to the plurality of the aforementioned positions; and the focus control portion uses the distance with the highest frequency among the plurality of the aforementioned distances as the distance between the first distance measuring sensor and the aforementioned substrate.

在本發明的較佳的其他實施形態中,前述第一測距感測器係包含絕對位置被固定於前述第一基板保持部的上方處之感測器要素以及絕對位置被固定於前述第二基板保持部的上方處之感測器要素。 In another preferred embodiment of the present invention, the first distance measuring sensor includes a sensor element whose absolute position is fixed above the first substrate holding portion and a sensor element whose absolute position is fixed above the second substrate holding portion.

在本發明的較佳的其他實施形態中,描繪裝置係進一步具備:對準攝影機,係在對被前述第二基板保持部保持的第二基板描繪圖案的期間,與被前述第一基板保持部保持的第一基板對向並拍攝前述第一基板上的對準標記,在對被前述第一基板保持部保持的第一基板描繪圖案的期間,與被前述第二基板保持部保持的第二基板對向並拍攝前述第二基板上的對準標記;以及攝影機位置切換部,係將前述對準攝影機相對於前述第一基板保持部以及前述第二基板保持部之相對位置在與被前述第一基板保持部保持的第一基板對向之位置以及與被前述第二基板保持部保持的第二基板對向之位置之間切換。前述第一測距感測器相對於前述第一基板保持部以及前述第二基板保持部之相對位置係藉由前述攝影機位置切換部而與前述對準攝影機一起在與前述第一基板對向之位置以及與前述第二基板對向之位置之間被切換。 In other preferred embodiments of the present invention, the drawing device further comprises: an alignment camera, which is opposite to the first substrate held by the first substrate holding portion and photographs the alignment mark on the first substrate during the period of drawing the pattern on the second substrate held by the second substrate holding portion, and is opposite to the second substrate held by the second substrate holding portion and photographs the alignment mark on the second substrate during the period of drawing the pattern on the first substrate held by the first substrate holding portion; and a camera position switching portion, which switches the relative position of the alignment camera relative to the first substrate holding portion and the second substrate holding portion between a position opposite to the first substrate held by the first substrate holding portion and a position opposite to the second substrate held by the second substrate holding portion. The relative position of the first distance measuring sensor relative to the first substrate holding portion and the second substrate holding portion is switched between a position opposite to the first substrate and a position opposite to the second substrate together with the alignment camera by the camera position switching portion.

在本發明的較佳的其他實施形態中,前述第一測距感測器為擴散反射方式;前述對焦控制部係包含:校正部,係校正藉由前述第一測距感測器 所取得的從前述第一測距感測器至基板上的測量位置為止之距離;前述校正部係因應形成於基板的表面以及附近之材料來校正前述距離。 In another preferred embodiment of the present invention, the first distance measuring sensor is a diffuse reflection type; the focus control unit includes: a correction unit, which corrects the distance from the first distance measuring sensor to the measurement position on the substrate obtained by the first distance measuring sensor; the correction unit corrects the distance in response to the material formed on the surface of the substrate and the vicinity.

本發明亦著眼於一種描繪方法,係對基板照射光線,藉此對前述基板描繪圖案。描繪方法係具備:工序a,係藉由第一基板保持部保持第一基板;工序b,係藉由與前述第一基板對向的第一測距感測器取得前述第一測距感測器與前述第一基板上的測量位置之間的距離;工序c,係一邊從描繪頭朝向前述第一基板射出經過調變的光線一邊將前述描繪頭相對於前述第一基板保持部相對性地移動,藉此對前述第一基板描繪圖案;工序d,係在進行前述工序c的期間,藉由第二基板保持部保持第二基板;工序e,係在進行前述工序c的期間,藉由與前述第二基板對向的前述第一測距感測器取得前述第一測距感測器與前述第二基板上的測量位置之間的距離;工序f,係在前述工序c以及前述工序e之後,一邊從前述描繪頭朝向前述第二基板射出經過調變的光線一邊將前述描繪頭相對於前述第二基板保持部相對性地移動,藉此對前述第二基板描繪圖案;以及工序g,係重複前述工序a至前述工序f。在進行前述工序f的期間,對下一片第一基板進行前述工序a以及前述工序b;在前述工序f以及針對前述下一片第一基板的前述工序b之後,對前述下一片第一基板進行前述工序c。前述描繪頭係包含:第二測距感測器,係取得與正在進行圖案的描繪的基板上的測量位置之間的距離。在前述工序c中,使用在前述工序b中藉由前述第一測距感測器從前述第一基板所取得的資訊以及在對前述第一基板描繪圖案的期間從前述第二測距感測器所取得的資訊進行用以使從前述描繪頭射出的光線的對焦位置對合至前述第一基板的表面的高度方向的位置之對焦控制。在前述工序f中,使用在前述工序e中藉由前述第一測距感測器從前述第二基板所取得的資訊以及在對前述第二基 板描繪圖案的期間從前述第二測距感測器所取得的資訊進行用以使從前述描繪頭射出的光線的對焦位置對合至前述第二基板的表面的高度方向的位置之對焦控制。 The present invention also focuses on a drawing method, which is to irradiate light onto a substrate, thereby drawing a pattern on the substrate. The drawing method comprises: step a, holding a first substrate by a first substrate holding portion; step b, obtaining a distance between the first distance measuring sensor and a measurement position on the first substrate by a first distance measuring sensor opposite to the first substrate; step c, emitting modulated light from a drawing head toward the first substrate while moving the drawing head relatively to the first substrate holding portion, thereby drawing a pattern on the first substrate; step d, holding the first substrate by a second substrate holding portion during step c; a second substrate; a step e, during the process of performing the step c, obtaining the distance between the first distance measuring sensor and the measuring position on the second substrate by the first distance measuring sensor facing the second substrate; a step f, after the steps c and e, emitting modulated light from the drawing head toward the second substrate while relatively moving the drawing head relative to the second substrate holding portion, thereby drawing a pattern on the second substrate; and a step g, repeating the steps a to f. During the process f, the steps a and b are performed on the next first substrate; after the step f and the step b on the next first substrate, the step c is performed on the next first substrate. The drawing head includes: a second distance measuring sensor, which obtains the distance to the measuring position on the substrate on which the pattern is being drawn. In the aforementioned step c, the information obtained from the aforementioned first substrate by the aforementioned first distance sensor in the aforementioned step b and the information obtained from the aforementioned second distance sensor during the period of drawing the pattern on the aforementioned first substrate are used to perform focus control so that the focus position of the light emitted from the aforementioned drawing head is aligned with the position in the height direction of the surface of the aforementioned first substrate. In the aforementioned step f, the information obtained from the aforementioned second substrate by the aforementioned first distance sensor in the aforementioned step e and the information obtained from the aforementioned second distance sensor during the period of drawing the pattern on the aforementioned second substrate are used to perform focus control so that the focus position of the light emitted from the aforementioned drawing head is aligned with the position in the height direction of the surface of the aforementioned second substrate.

參照隨附的圖式並藉由以下所進行的本發明的詳細的說明,更明瞭上述目的以及其他的目的、特徵、態樣以及優點。 The above-mentioned purpose and other purposes, features, aspects and advantages will be more clearly understood by referring to the attached drawings and the detailed description of the present invention as follows.

1:描繪裝置 1: Drawing device

2:移動機構 2: Mobile mechanism

2a:第一搬運機構 2a: First transportation agency

2b:第二搬運機構 2b: Second transport mechanism

3:拍攝部 3: Photography Department

4:圖案描繪部 4: Pattern drawing department

5:第一測距感測器 5: First distance sensor

7:框架 7: Framework

8:區域 8: Region

9:基板(第一基板、第二基板) 9: Substrate (first substrate, second substrate)

10:控制部 10: Control Department

12:校正部 12: Correction Department

21a:第一台(第一基板保持部) 21a: First stage (first substrate holding part)

21b:第二台(第二基板保持部) 21b: Second stage (second substrate holding part)

22a:第一移動機構 22a: First moving mechanism

22b:第二移動機構 22b: Second moving mechanism

31:對準攝影機 31: Aim the camera

32:攝影機位置切換部 32: Camera position switching unit

33:攝影機基座 33: Camera base

34,81,82,83:箭頭 34,81,82,83: Arrows

35:攝影機位置調整部 35: Camera position adjustment unit

41:描繪頭 41: Drawing head

42:描繪頭移動機構 42: Drawing head moving mechanism

51:感測器要素 51:Sensor elements

71:基台 71: Base

72:第一高架部 72: First elevated section

73:第二高架部 73: Second elevated section

74:高架部 74: Elevated section

91:上表面 91: Upper surface

100:電腦 100: Computer

101:處理器 101:Processor

102:記憶體 102: Memory

103:輸入輸出部 103: Input and output department

104:匯流排 104: Bus

105:鍵盤 105:Keyboard

106:滑鼠 106: Mouse

107:顯示器 107: Display

111:拍攝控制部 111: Shooting Control Department

112:位置檢測部 112: Position detection unit

113:對焦控制部 113: Focus control unit

114:描繪控制部 114: Drawing control unit

115:記憶部 115: Memory Department

221a,221b:導軌 221a,221b:Guide rails

411:光線調變元件 411: Light modulation element

412:第二測距感測器 412: Second distance sensor

413:對焦變更部 413: Focus change department

S11至S16,S21至步驟S26:步驟 S11 to S16, S21 to step S26: Step

[圖1]係顯示實施形態之一的描繪裝置之立體圖。 [Figure 1] is a three-dimensional diagram of a depiction device showing one embodiment.

[圖2]係顯示電腦的構成之圖。 [Figure 2] is a diagram showing the structure of a computer.

[圖3]係顯示控制部以及控制部的周邊的功能構成之方塊圖。 [Figure 3] is a block diagram showing the functional configuration of the control unit and its peripherals.

[圖4A]係顯示描繪裝置的動作的流程之圖。 [Figure 4A] is a diagram showing the flow of the operation of the depicting device.

[圖4B]係顯示描繪裝置的動作的流程之圖。 [Figure 4B] is a diagram showing the flow of the operation of the depicting device.

[圖5]係顯示第一台以及第二台的位置之圖。 [Figure 5] shows the locations of the first and second units.

[圖6]係顯示第一台以及第二台的位置之圖。 [Figure 6] shows the locations of the first and second units.

[圖7]係顯示第一台以及第二台的位置之圖。 [Figure 7] shows the locations of the first and second units.

[圖8]係顯示第一台以及第二台的位置之圖。 [Figure 8] shows the locations of the first and second units.

[圖9]係顯示第一台以及第二台的位置之圖。 [Figure 9] shows the locations of the first and second units.

[圖10]係顯示第一台以及第二台的位置之圖。 [Figure 10] shows the locations of the first and second units.

[圖11]係用以說明對基板進行描繪的樣子之圖。 [Figure 11] is a diagram used to illustrate the appearance of drawing on a substrate.

[圖12]係顯示拍攝部以及第一測距感測器的構造的其他例子之俯視圖。 [Figure 12] is a top view showing another example of the structure of the camera unit and the first distance measuring sensor.

[圖13]係顯示校正部以及校正部的周邊的功能構成之方塊圖。 [Figure 13] is a block diagram showing the functional configuration of the correction unit and its surroundings.

圖1係顯示本發明的實施形態之一的描繪裝置1之立體圖。描繪裝置1為用以對基板9照射光線從而對該基板9描繪圖案之裝置。描繪裝置1為雙台型(twin stage type)的直接描繪裝置,用以將經過空間調變的略束狀的光線照射至表面具有感光材料的層的基板9上,於基板9上掃描該光線的照射區域,藉此進行圖案的描繪。在圖1中以箭頭顯示彼此正交的三個方向作為X方向、Y方向以及Z方向。在圖1所示的例子中,X方向以及Y方向為彼此垂直的水平方向,Z方向為鉛直方向。在其他的圖式中亦同樣。 FIG. 1 is a three-dimensional diagram of a drawing device 1 of one embodiment of the present invention. The drawing device 1 is a device for irradiating light to a substrate 9 to draw a pattern on the substrate 9. The drawing device 1 is a twin stage type direct drawing device for irradiating slightly beamed light after spatial modulation to a substrate 9 having a layer of photosensitive material on the surface, and scanning the irradiated area of the light on the substrate 9 to draw the pattern. In FIG. 1, three directions orthogonal to each other are shown by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1, the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is a vertical direction. The same is true in other figures.

基板9係例如俯視觀看時為略矩形狀的板狀構件。基板9係例如為製造中途的印刷電路基板。在基板9的+Z側的表面(以下亦稱為「上表面91」)中,於銅層上設置有由感光材料所形成的阻劑(resist)膜。在描繪裝置1中,於基板9的該阻劑膜描繪(亦即形成)有電路圖案。此外,基板9的種類以及形狀等亦可進行各種變更。 The substrate 9 is, for example, a plate-shaped member that is roughly rectangular when viewed from above. The substrate 9 is, for example, a printed circuit substrate in the middle of manufacturing. On the surface of the +Z side of the substrate 9 (hereinafter also referred to as the "upper surface 91"), a resist film formed of a photosensitive material is provided on the copper layer. In the drawing device 1, a circuit pattern is drawn (i.e., formed) on the resist film of the substrate 9. In addition, the type and shape of the substrate 9 can also be changed in various ways.

描繪裝置1係具備第一搬運機構2a、第二搬運機構2b、拍攝部3、圖案描繪部4、框架7以及控制部10。控制部10係控制第一搬運機構2a、第二搬運機構2b、拍攝部3以及圖案描繪部4等。 The drawing device 1 includes a first conveying mechanism 2a, a second conveying mechanism 2b, a shooting unit 3, a pattern drawing unit 4, a frame 7, and a control unit 10. The control unit 10 controls the first conveying mechanism 2a, the second conveying mechanism 2b, the shooting unit 3, the pattern drawing unit 4, etc.

框架7為安裝有描繪裝置1的各個構成之本體基座部。框架7係具備:略立方體狀的基台71;以及門形的第一高架(gantry)部72以及第二高架部73,係跨越基台71。第二高架部73係接近地配置於第一高架部72的+Y側。在以下的說明中,亦將第一高架部72以及第二高架部73統稱為「高架部74」。於基台71上安裝有第一搬運機構2a以及第二搬運機構2b。第一高架部72係支撐拍攝部3。 第二高架部73係支撐圖案描繪部4。框架7係載置於未圖示的台座上。 The frame 7 is a main body base portion on which each component of the drawing device 1 is installed. The frame 7 has: a base 71 in a roughly cubic shape; and a first gantry portion 72 and a second gantry portion 73 in a gate shape, which span the base 71. The second gantry portion 73 is arranged close to the +Y side of the first gantry portion 72. In the following description, the first gantry portion 72 and the second gantry portion 73 are also collectively referred to as "gantry portion 74". The first transport mechanism 2a and the second transport mechanism 2b are installed on the base 71. The first gantry portion 72 supports the shooting portion 3. The second gantry portion 73 supports the pattern drawing portion 4. The frame 7 is mounted on a pedestal not shown in the figure.

第一搬運機構2a以及第二搬運機構2b為用以分別在拍攝部3以及圖案描繪部4的下方(亦即-Z側)保持以及移動基板9之機構。第二搬運機構2b係鄰接地配置於第一搬運機構2a的+X側。第一搬運機構2a以及第二搬運機構2b係具有略同樣的構造。 The first transport mechanism 2a and the second transport mechanism 2b are mechanisms for holding and moving the substrate 9 below the shooting section 3 and the pattern drawing section 4 (i.e., the -Z side), respectively. The second transport mechanism 2b is disposed adjacent to the +X side of the first transport mechanism 2a. The first transport mechanism 2a and the second transport mechanism 2b have a similar structure.

第一搬運機構2a係具備第一台21a以及第一移動機構22a。第一台21a為略平板狀的第一基板保持部,用以從下側保持略水平狀態的基板9。第一台21a係例如為真空夾具(vacuum chuck),用以吸附並保持基板9的下表面。第一台21a亦可具有真空夾具以外的構造。載置於第一台21a上的基板9的上表面91係與Z方向(亦即上下方向)略垂直,且與X方向以及Y方向略平行。 The first transport mechanism 2a includes a first stage 21a and a first moving mechanism 22a. The first stage 21a is a first substrate holding portion that is slightly flat and is used to hold the substrate 9 in a slightly horizontal state from the bottom. The first stage 21a is, for example, a vacuum chuck that is used to absorb and hold the lower surface of the substrate 9. The first stage 21a may also have a structure other than a vacuum chuck. The upper surface 91 of the substrate 9 mounted on the first stage 21a is slightly perpendicular to the Z direction (i.e., the up and down direction) and slightly parallel to the X direction and the Y direction.

第一移動機構22a為第一台移動機構,用以將第一台21a相對於拍攝部3以及圖案描繪部4於略水平方向(亦即與基板9的上表面91略平行的方向)相對性地移動。第一移動機構22a係在拍攝部3以及圖案描繪部4的下方處將被支撐於導軌(guide rail)221a上的第一台21a沿著導軌221a於Y方向直線移動。藉此,被第一台21a支撐的基板9係於Y方向移動。在以下的說明中亦將Y方向稱為「基板移動方向」或者「主掃描方向」。第一移動機構22a的驅動源係例如為線性伺服馬達(linear servo motor)或者於滾珠螺桿(ball screw)安裝有馬達之構造。第一移動機構22a的構造亦可進行各種變更。 The first moving mechanism 22a is a first stage moving mechanism, which is used to relatively move the first stage 21a in a substantially horizontal direction (i.e., a direction substantially parallel to the upper surface 91 of the substrate 9) relative to the photographing section 3 and the pattern drawing section 4. The first moving mechanism 22a moves the first stage 21a supported on the guide rail 221a linearly in the Y direction along the guide rail 221a below the photographing section 3 and the pattern drawing section 4. Thereby, the substrate 9 supported by the first stage 21a moves in the Y direction. In the following description, the Y direction is also referred to as the "substrate moving direction" or the "main scanning direction". The driving source of the first moving mechanism 22a is, for example, a linear servo motor or a structure in which a motor is installed on a ball screw. The structure of the first moving mechanism 22a can also be modified in various ways.

第二搬運機構2b係具備第二台21b以及第二移動機構22b。第二台21b為略平板狀的第二基板保持部,用以從下側保持略水平狀態的基板9。第二台21b係鄰接地配置於第一台21a的側方(亦即+X側)。第二台21b的上表面係位於在上下方向(亦即Z方向)處實質性地與第一台21a的上表面相同的高度。第二台 21b係例如為真空夾具,用以吸附並保持基板9的下表面。第二台21b亦可具有真空夾具以外的構造。載置於第二台21b上的基板9的上表面91係與Z方向略垂直,且與X方向以及Y方向略平行。被第二台21b保持的基板9的上表面91係在上下方向處位於與被第一台21a保持的基板9的上表面91略相同的高度(亦即Z方向的略相同的位置)。 The second transport mechanism 2b includes a second stage 21b and a second moving mechanism 22b. The second stage 21b is a second substrate holding portion in a slightly flat plate shape, which is used to hold the substrate 9 in a slightly horizontal state from the bottom. The second stage 21b is arranged adjacent to the side of the first stage 21a (i.e., the +X side). The upper surface of the second stage 21b is located at a substantially same height as the upper surface of the first stage 21a in the up-down direction (i.e., the Z direction). The second stage 21b is, for example, a vacuum clamp, which is used to absorb and hold the lower surface of the substrate 9. The second stage 21b may also have a structure other than a vacuum clamp. The upper surface 91 of the substrate 9 mounted on the second stage 21b is slightly perpendicular to the Z direction and slightly parallel to the X direction and the Y direction. The upper surface 91 of the substrate 9 held by the second stage 21b is located at approximately the same height in the vertical direction as the upper surface 91 of the substrate 9 held by the first stage 21a (i.e., approximately the same position in the Z direction).

第二移動機構22b為第二台移動機構,用以將第二台21b相對於拍攝部3以及圖案描繪部4於略水平方向(亦即與基板9的上表面91略平行的方向)相對性地移動。第二移動機構22b係在拍攝部3以及圖案描繪部4的下方處將被支撐於導軌221b上的第二台21b沿著導軌221b於Y方向(亦即基板移動方向)直線移動。藉此,被第二台21b支撐的基板9係於Y方向移動。第二移動機構22b所為的第二台21b的移動方向係與第一移動機構22a所為的第一台21a的移動方向略平行。第二移動機構22b的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達之構造。第二移動機構22b的構造亦可進行各種變更。 The second moving mechanism 22b is a second stage moving mechanism, which is used to relatively move the second stage 21b in a substantially horizontal direction (i.e., a direction substantially parallel to the upper surface 91 of the substrate 9) relative to the photographing section 3 and the pattern drawing section 4. The second moving mechanism 22b moves the second stage 21b supported on the guide rail 221b linearly in the Y direction (i.e., the substrate moving direction) along the guide rail 221b below the photographing section 3 and the pattern drawing section 4. Thereby, the substrate 9 supported by the second stage 21b moves in the Y direction. The moving direction of the second stage 21b of the second moving mechanism 22b is substantially parallel to the moving direction of the first stage 21a of the first moving mechanism 22a. The driving source of the second moving mechanism 22b is, for example, a linear servo motor or a structure in which a motor is installed on a ball screw. The structure of the second moving mechanism 22b can also be modified in various ways.

第一移動機構22a以及第二移動機構22b係排列地配置於與基板移動方向(亦即Y方向)交叉的方向。在圖1所示的例子中,第一移動機構22a以及第二移動機構22b係排列地配置於X方向,第二移動機構22b係鄰接於第一移動機構22a的+X側的側方。第一移動機構22a以及第二移動機構22b係位於上下方向的略相同的高度。 The first moving mechanism 22a and the second moving mechanism 22b are arranged in a direction intersecting the substrate moving direction (i.e., the Y direction). In the example shown in FIG. 1 , the first moving mechanism 22a and the second moving mechanism 22b are arranged in a direction intersecting the substrate moving direction (i.e., the Y direction), and the second moving mechanism 22b is adjacent to the side of the +X side of the first moving mechanism 22a. The first moving mechanism 22a and the second moving mechanism 22b are located at approximately the same height in the vertical direction.

第一移動機構22a以及第二移動機構22b係被框架7的基台71從下方支撐。第一移動機構22a以及第二移動機構22b係從比第二高架部73還+Y側朝-Y側延伸,並通過被第二高架部73支撐的圖案描繪部4的下方以及被第一高架部72支撐的拍攝部3的下方從第一高架部72朝-Y側突出。第一高架部72係位於在Y 方向處與第一移動機構22a以及第二移動機構22b的Y方向處的中央部略相同的位置。 The first moving mechanism 22a and the second moving mechanism 22b are supported from below by the base 71 of the frame 7. The first moving mechanism 22a and the second moving mechanism 22b extend from the +Y side to the -Y side beyond the second elevated portion 73, and protrude from the first elevated portion 72 to the -Y side through the bottom of the pattern drawing portion 4 supported by the second elevated portion 73 and the bottom of the shooting portion 3 supported by the first elevated portion 72. The first elevated portion 72 is located at a position in the Y direction that is approximately the same as the center of the first moving mechanism 22a and the second moving mechanism 22b in the Y direction.

在描繪裝置1中,在第一台21a位於比第一高架部72還-Y側的狀態下對第一台21a進行基板9的搬入以及搬出。此外,在第二台21b位於比第一高架部72還-Y側的狀態下對第二台21b進行基板9的搬入以及搬出。 In the drawing device 1, the substrate 9 is carried in and out of the first stage 21a when the first stage 21a is located on the -Y side of the first elevated portion 72. In addition, the substrate 9 is carried in and out of the second stage 21b when the second stage 21b is located on the -Y side of the first elevated portion 72.

如上所述,第一高架部72以及第二高架部73係跨越第一搬運機構2a以及第二搬運機構2b地設置。第一高架部72係具備:兩根支柱部,係在第一搬運機構2a以及第二搬運機構2b的X方向的兩側處於Z方向延伸;以及樑部,係連接兩根支柱部的上端部。第一高架部72的樑部係在第一搬運機構2a以及第二搬運機構2b的上方處於X方向延伸。第一高架部72的兩根支柱部係在-Z側的端部處與基台71連接。第二高架部73係具備:兩根支柱部,係在第一搬運機構2a以及第二搬運機構2b的X方向的兩側處於Z方向延伸;以及樑部,係連接兩根支柱部的上端部。第二高架部73的樑部係在第一搬運機構2a以及第二搬運機構2b的上方處於X方向延伸。第二高架部73的兩根支柱部係在-Z側的端部處與基台71連接。 As described above, the first elevated portion 72 and the second elevated portion 73 are arranged to cross the first transport mechanism 2a and the second transport mechanism 2b. The first elevated portion 72 includes: two pillars extending in the Z direction on both sides of the X direction of the first transport mechanism 2a and the second transport mechanism 2b; and a beam connecting the upper ends of the two pillars. The beam of the first elevated portion 72 extends in the X direction above the first transport mechanism 2a and the second transport mechanism 2b. The two pillars of the first elevated portion 72 are connected to the base 71 at the end on the -Z side. The second elevated portion 73 includes: two pillars extending in the Z direction on both sides of the X direction of the first transport mechanism 2a and the second transport mechanism 2b; and a beam connecting the upper ends of the two pillars. The beam of the second elevated portion 73 extends in the X direction above the first transport mechanism 2a and the second transport mechanism 2b. The two pillars of the second elevated portion 73 are connected to the base 71 at the end on the -Z side.

拍攝部3係具備攝影機位置切換部32以及複數個(在圖1所示的例子中為兩個)對準攝影機31。複數個對準攝影機31係排列於X方向,且能夠移動地安裝於第一高架部72的樑部。攝影機位置切換部32係安裝於樑部,將複數個對準攝影機31沿著樑部於X方向移動。攝影機位置切換部32的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達之構造。在圖1所示的例子中,兩個對準攝影機31的X方向中的間隔係能夠變更。此外,在拍攝部3中,對準攝影機31的數量亦可為一個或者亦可為三個以上。 The photographing section 3 includes a camera position switching section 32 and a plurality of (two in the example shown in FIG. 1 ) alignment cameras 31. The plurality of alignment cameras 31 are arranged in the X direction and are movably mounted on the beam of the first elevated section 72. The camera position switching section 32 is mounted on the beam to move the plurality of alignment cameras 31 along the beam in the X direction. The driving source of the camera position switching section 32 is, for example, a linear servo motor or a structure in which a motor is mounted on a ball screw. In the example shown in FIG. 1 , the interval between the two alignment cameras 31 in the X direction can be changed. In addition, in the shooting unit 3, the number of aiming cameras 31 may be one or more than three.

各個對準攝影機31為具備有未圖示的拍攝感測器以及光學系統之攝影機。各個對準攝影機31係例如為用以取得二維的影像之區域攝影機(area camera)。拍攝感測器係具備排列成矩陣狀的複數個CCD(Charge Coupled Device;電荷耦合元件)等元件。在各個對準攝影機31中,從未圖示的光源被導引至基板9的上表面91之照明光的反射光係經由光學系統被導引至拍攝感測器。拍攝感測器係接收來自基板9的上表面91的反射光,從而取得略矩形狀的拍攝區域的影像。作為上述光源,能夠利用LED(Light Emitting Diode;發光二極體)等各種光源。此外,各個對準攝影機31亦可為線列式攝影機(line camera)等其他種類的攝影機。 Each alignment camera 31 is a camera having a photographing sensor and an optical system (not shown). Each alignment camera 31 is, for example, an area camera for obtaining a two-dimensional image. The photographing sensor has a plurality of CCDs (Charge Coupled Devices) and other elements arranged in a matrix. In each alignment camera 31, the reflected light of the illumination light guided to the upper surface 91 of the substrate 9 from a light source (not shown) is guided to the photographing sensor via the optical system. The photographing sensor receives the reflected light from the upper surface 91 of the substrate 9, thereby obtaining an image of a roughly rectangular photographing area. As the above-mentioned light source, various light sources such as LEDs (Light Emitting Diodes) can be used. In addition, each alignment camera 31 may also be a line camera or other types of cameras.

在描繪裝置1中,藉由攝影機位置切換部32,複數個對準攝影機31係在第一搬運機構2a的上方的第一拍攝位置與第二搬運機構2b的上方的第二拍攝位置之間移動。第一拍攝位置為拍攝時對準攝影機31與第一台21a以及第一基板9對向之位置。第二拍攝位置為拍攝時對準攝影機31與第二台21b以及第二基板9對向之位置。在圖1中,複數個對準攝影機31係位於第一拍攝位置。複數個對準攝影機31係在第一拍攝位置處拍攝第一台21a上的基板9的上表面91。此外,複數個對準攝影機31係在第二拍攝位置處拍攝第二台21b上的基板9的上表面91。 In the drawing device 1, the plurality of alignment cameras 31 are moved between a first shooting position above the first transport mechanism 2a and a second shooting position above the second transport mechanism 2b by means of a camera position switching unit 32. The first shooting position is a position where the alignment camera 31 is opposite to the first stage 21a and the first substrate 9 during shooting. The second shooting position is a position where the alignment camera 31 is opposite to the second stage 21b and the second substrate 9 during shooting. In FIG. 1 , the plurality of alignment cameras 31 are located at the first shooting position. The plurality of alignment cameras 31 shoot the upper surface 91 of the substrate 9 on the first stage 21a at the first shooting position. In addition, the plurality of alignment cameras 31 photograph the upper surface 91 of the substrate 9 on the second stage 21b at the second photographing position.

圖案描繪部4係具備描繪頭移動機構42以及複數個(在圖1所示的例子中為六個)描繪頭41。複數個描繪頭41係排列於X方向,且能夠移動地安裝於第二高架部73的樑部。描繪頭移動機構42係安裝於樑部,將複數個描繪頭41沿著樑部於X方向一體性地移動。描繪頭移動機構42的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達之構造。此外,在圖案描繪部4中,描繪頭41的 數量係可為一個亦可為複數個。 The pattern drawing section 4 has a drawing head moving mechanism 42 and a plurality of (six in the example shown in FIG. 1 ) drawing heads 41. The plurality of drawing heads 41 are arranged in the X direction and are movably mounted on the beam of the second elevated section 73. The drawing head moving mechanism 42 is mounted on the beam to integrally move the plurality of drawing heads 41 along the beam in the X direction. The driving source of the drawing head moving mechanism 42 is, for example, a linear servo motor or a structure in which a motor is mounted on a ball screw. In addition, in the pattern drawing section 4, the number of drawing heads 41 may be one or more.

各個描繪頭41係具備省略圖示的光源、光學系統以及空間光線調變元件。作為空間光線調變元件係能夠利用DMD(Digital Micro Mirror Device;數位微鏡元件)或者GLV(Grating Light Valve;柵光閥)(Silicon Light Machines公司(森尼韋爾(Sunnyvale)、加利福尼亞(California))的註冊商標)等各種元件。作為光源,能夠利用LD(Laser Diode;雷射二極體)等各種光源。複數個描繪頭41係具有略相同的構造。 Each drawing head 41 has a light source, an optical system, and a spatial light modulator, which are not shown in the figure. As a spatial light modulator, various elements such as DMD (Digital Micro Mirror Device) or GLV (Grating Light Valve) (a registered trademark of Silicon Light Machines (Sunnyvale, California)) can be used. As a light source, various light sources such as LD (Laser Diode) can be used. Multiple drawing heads 41 have a similar structure.

在描繪裝置1中,藉由描繪頭移動機構42,複數個描繪頭41係在第一搬運機構2a的上方的第一描繪位置與第二搬運機構2b的上方的第二描繪位置之間移動。第一描繪位置為描繪時描繪頭41與第一台21a以及第一基板9對向之位置。第二描繪位置為描繪時描繪頭41與第二台21b以及第二基板9對向之位置。在圖1中,複數個描繪頭41係位於第二描繪位置。複數個描繪頭41係在第一描繪位置中對第一台21a上的基板9的上表面91描繪圖案。此外,複數個描繪頭41係在第二描繪位置中對第二台21b上的基板9的上表面91描繪圖案。此外,在對第一台21a上的基板9的上表面91描繪圖案時,亦藉由描繪頭移動機構42進行描繪頭41朝X方向的步階移動(step shift)。同樣地,在對第二台21b上的基板9的上表面91描繪圖案時,亦藉由描繪頭移動機構42進行描繪頭41朝X方向的步階移動。 In the drawing device 1, a plurality of drawing heads 41 are moved between a first drawing position above the first transport mechanism 2a and a second drawing position above the second transport mechanism 2b by means of a drawing head moving mechanism 42. The first drawing position is a position where the drawing head 41 is opposite to the first stage 21a and the first substrate 9 during drawing. The second drawing position is a position where the drawing head 41 is opposite to the second stage 21b and the second substrate 9 during drawing. In FIG. 1 , the plurality of drawing heads 41 are located at the second drawing position. The plurality of drawing heads 41 draw patterns on the upper surface 91 of the substrate 9 on the first stage 21a in the first drawing position. In addition, the plurality of drawing heads 41 draw patterns on the upper surface 91 of the substrate 9 on the second stage 21b in the second drawing position. In addition, when drawing a pattern on the upper surface 91 of the substrate 9 on the first stage 21a, the drawing head 41 is also step-shifted in the X direction by the drawing head moving mechanism 42. Similarly, when drawing a pattern on the upper surface 91 of the substrate 9 on the second stage 21b, the drawing head 41 is also step-shifted in the X direction by the drawing head moving mechanism 42.

第一描繪位置以及第二描繪位置係在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。此外,上述第一拍攝位置以及第二拍攝位置亦在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。換言之,圖案描繪部4的複數個描繪 頭41以及拍攝部3的複數個對準攝影機31係在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。 The first drawing position and the second drawing position are located in the Y direction at positions that are approximately the same as the center of the first moving mechanism 22a and the second moving mechanism 22b in the Y direction. In addition, the first shooting position and the second shooting position are also located in the Y direction at positions that are approximately the same as the center of the first moving mechanism 22a and the second moving mechanism 22b in the Y direction. In other words, the multiple drawing heads 41 of the pattern drawing unit 4 and the multiple alignment cameras 31 of the shooting unit 3 are located in the Y direction at positions that are approximately the same as the center of the first moving mechanism 22a and the second moving mechanism 22b in the Y direction.

在第一描繪位置中描繪圖案時,從圖案描繪部4的複數個描繪頭41朝向下方的第一台21a上的基板9照射經過調變(亦即空間調變)的光線。而且,與該光線的照射並行地,藉由第一移動機構22a將基板9於圖案描繪部4的+Y方向朝-Y方向(亦即基板移動方向)水平移動。藉此,來自複數個描繪頭41的光線的照射區域在基板9上於+Y方向相對性地進行主掃描,對基板9進行圖案(例如電路圖案)的描繪。第一移動機構22a為掃描機構,用以將來自各個掃描頭41的光線的照射區域在基板9上於Y方向移動。 When drawing a pattern in the first drawing position, modulated (i.e., spatially modulated) light is irradiated from the plurality of drawing heads 41 of the pattern drawing unit 4 toward the substrate 9 on the first stage 21a below. In addition, in parallel with the irradiation of the light, the substrate 9 is horizontally moved from the +Y direction of the pattern drawing unit 4 to the -Y direction (i.e., the substrate moving direction) by the first moving mechanism 22a. In this way, the irradiation area of the light from the plurality of drawing heads 41 is relatively scanned in the +Y direction on the substrate 9, and the pattern (e.g., circuit pattern) is drawn on the substrate 9. The first moving mechanism 22a is a scanning mechanism for moving the irradiation area of the light from each scanning head 41 in the Y direction on the substrate 9.

當結束一次主掃描時,描繪頭41係藉由描繪頭移動機構42於+X方向步階移動(亦即副掃描)達至預定的距離,並進行朝基板9的+Y方向的移動。亦即,與來自描繪頭41之光線的照射並行地,基板9係藉由第一移動機構22a於+Y方向水平移動。藉此,來自複數個描繪頭41之光線的照射區域係在基板9上於-Y方向相對性地進行主掃描,並對基板9進行圖案的描繪。之後,在本實施形態中,描繪頭41係於+X方向步階移動達至預定的距離,進一步地進行朝向照射區域的+Y方向之主掃描所為的圖案的描繪。如此,在描繪裝置1中,藉由重複地進行第一台21a朝向Y方向的移動以及第一台21a朝向X方向的步階移動之多程(multi pass)方式對基板9進行描繪。第二描繪位置中的圖案的描繪係將第一台21a以及第一移動機構22a被變更成第二台21b以及第二移動機構22b之點除外,與上述第一描繪位置中的圖案的描繪同樣。 When a main scan is completed, the drawing head 41 is moved stepwise in the +X direction (i.e., sub-scanning) to a predetermined distance by the drawing head moving mechanism 42, and is moved in the +Y direction toward the substrate 9. That is, in parallel with the irradiation of the light from the drawing head 41, the substrate 9 is horizontally moved in the +Y direction by the first moving mechanism 22a. Thus, the irradiation area of the light from the plurality of drawing heads 41 is relatively mainly scanned in the -Y direction on the substrate 9, and a pattern is drawn on the substrate 9. Thereafter, in the present embodiment, the drawing head 41 is moved stepwise in the +X direction to a predetermined distance, and is further drawn by the main scan in the +Y direction toward the irradiated area. Thus, in the drawing device 1, the substrate 9 is drawn by repeatedly moving the first stage 21a in the Y direction and stepwise moving the first stage 21a in the X direction in a multi-pass manner. The drawing of the pattern in the second drawing position is the same as the drawing of the pattern in the first drawing position, except that the first stage 21a and the first moving mechanism 22a are changed to the second stage 21b and the second moving mechanism 22b.

對於基板9的描繪係亦可以單程(single pass)(單向(one pass))方式進行。具體而言,在第一台21a之情形中,藉由第一移動機構22a,第一台21a係 相對於複數個描繪頭41於Y方向相對移動,來自複數個描繪頭41之光線的照射區域係在基板9的上表面91上於Y方向僅掃描一次。藉此,結束對於基板9的描繪。針對第二台21b亦同樣。 The drawing of the substrate 9 can also be performed in a single pass (one-way (one pass)) manner. Specifically, in the case of the first station 21a, the first station 21a is relatively moved in the Y direction relative to the plurality of drawing heads 41 by the first moving mechanism 22a, and the irradiation area of the light from the plurality of drawing heads 41 is scanned only once in the Y direction on the upper surface 91 of the substrate 9. Thus, the drawing of the substrate 9 is terminated. The same is true for the second station 21b.

對基板9描繪圖案時之主掃描的次數係可為一次,亦可為兩次,亦可為三次,亦可為四次以上。在進行複數次主掃描之情形中,較佳為基板9的移動係於+Y方向以及-Y方向交互地進行,在切換移動方向時描繪頭41係相對於基板9於+X方向步階移動。當然,描繪頭41的步階移動亦可為-X方向。 The number of main scans when drawing a pattern on the substrate 9 can be one, two, three, or four or more times. In the case of multiple main scans, it is preferred that the substrate 9 is moved alternately in the +Y direction and the -Y direction, and when switching the moving direction, the drawing head 41 moves stepwise in the +X direction relative to the substrate 9. Of course, the stepwise movement of the drawing head 41 can also be in the -X direction.

如上所述,在描繪裝置1中,藉由第一移動機構22a以及描繪頭移動機構42構成用以在描繪時使描繪頭41相對於被第一台21a保持的基板9相對性地移動之機構。然而,在進行單程動作之情形中,第一移動機構22a係成為用以在描繪時使描繪頭41相對於被第一台21a保持的基板9相對性地移動之機構。同樣地,在描繪裝置1中,藉由第二移動機構22b以及描繪頭移動機構42構成用以在描繪時使描繪頭41相對於被第二台21b保持的基板9相對性地移動之機構。然而,在進行單程動作之情形中,第二移動機構22b係成為用以在描繪時使描繪頭41相對於被第二台21b保持的基板9相對性地移動之機構。 As described above, in the drawing device 1, the first moving mechanism 22a and the drawing head moving mechanism 42 constitute a mechanism for relatively moving the drawing head 41 relative to the substrate 9 held by the first stage 21a during drawing. However, in the case of performing a one-way operation, the first moving mechanism 22a becomes a mechanism for relatively moving the drawing head 41 relative to the substrate 9 held by the first stage 21a during drawing. Similarly, in the drawing device 1, the second moving mechanism 22b and the drawing head moving mechanism 42 constitute a mechanism for relatively moving the drawing head 41 relative to the substrate 9 held by the second stage 21b during drawing. However, in the case of a one-way motion, the second moving mechanism 22b becomes a mechanism for moving the drawing head 41 relatively to the substrate 9 held by the second stage 21b during drawing.

此外,描繪頭移動機構42係兼作為頭位置切換部,用以將描繪頭41的位置在與被第一台21a保持的基板9對向之位置以及與被第二台21b保持的基板9對向之位置之間切換。描繪頭移動機構42並不一定要兼作為頭位置切換部,亦可設置用以將描繪頭41的位置在與第一台21a對向之位置以及與第二台21b對向之位置之間切換之移動機構,並於該移動機構上設置有用以使描繪頭41於X方向步階移動之機構。亦即,亦可以各種形態於描繪裝置1設置下述機構(頭位置切換部):用以於描繪時使描繪頭41相對於被第一台21a保持的基板9相對性 地移動之機構;用以於描繪時使描繪頭41相對於被第二台21b保持的基板9相對性地移動之機構;用以使描繪頭41在與被第一台21a保持的基板9對向之位置以及與被第二台21b保持的基板9對向之位置之間相對於第一台21a以及第二台21b相對性地移動之機構。 In addition, the drawing head moving mechanism 42 also serves as a head position switching unit for switching the position of the drawing head 41 between a position opposite to the substrate 9 held by the first stage 21a and a position opposite to the substrate 9 held by the second stage 21b. The drawing head moving mechanism 42 does not necessarily have to also serve as a head position switching unit, and a moving mechanism for switching the position of the drawing head 41 between a position opposite to the first stage 21a and a position opposite to the second stage 21b may be provided, and a mechanism for moving the drawing head 41 in steps in the X direction may be provided on the moving mechanism. That is, the following mechanisms (head position switching unit) can be provided in the drawing device 1 in various forms: a mechanism for relatively moving the drawing head 41 relative to the substrate 9 held by the first stage 21a during drawing; a mechanism for relatively moving the drawing head 41 relative to the substrate 9 held by the second stage 21b during drawing; a mechanism for relatively moving the drawing head 41 relative to the first stage 21a and the second stage 21b between a position opposite to the substrate 9 held by the first stage 21a and a position opposite to the substrate 9 held by the second stage 21b.

在以下的說明中,將這些機構全部總稱為「移動機構2」。在圖1的描繪裝置1之情形中,移動機構2係包含第一移動機構22a、第二移動機構22b以及描繪頭移動機構42。移動機構2係在藉由從描繪頭41射出的光線對被第一台21a(第一基板保持部)保持的基板9描繪圖案的期間使描繪頭41相對於第一台21a相對性地移動;移動機構2係在藉由從描繪頭41射出的光線對被第二台21b(第二基板保持部)保持的基板9描繪圖案的期間使描繪頭41相對於第二台21b相對性地移動。 In the following description, all of these mechanisms are collectively referred to as "moving mechanism 2". In the case of the drawing device 1 of Figure 1, the moving mechanism 2 includes a first moving mechanism 22a, a second moving mechanism 22b, and a drawing head moving mechanism 42. The moving mechanism 2 moves the drawing head 41 relatively to the first stage 21a while the light emitted from the drawing head 41 draws a pattern on the substrate 9 held by the first stage 21a (first substrate holding part); the moving mechanism 2 moves the drawing head 41 relatively to the second stage 21b while the light emitted from the drawing head 41 draws a pattern on the substrate 9 held by the second stage 21b (second substrate holding part).

描繪裝置1係進一步具備第一測距感測器5。第一測距感測器5係配置於第一高架部72的樑部的-Y側。第一測距感測器5係包含複數個感測器要素51。複數個感測器要素51係排列於X方向。感測器要素51的數量原則上為描繪頭41的數量的兩倍。於第一台21a的上方配置有原則上與描繪頭41的數量相同數量的感測器要素51,於第二台21b的上方配置有原則上與描繪頭41的數量相同數量的感測器要素51。在圖1的例子中,描繪頭41的數量為六個,感測器要素51的數量為十二個。在第一台21a的上方中,感測器要素51的間距(亦即感測器要素51的X方向中的中心的間隔)係與描繪頭41的間距(亦即描繪頭41的X方向中的中心的間隔)相同。在第二台21b的上方中,感測器要素51的間距亦與描繪頭41的間距相同。 The drawing device 1 further includes a first distance measuring sensor 5. The first distance measuring sensor 5 is arranged on the -Y side of the beam of the first elevated portion 72. The first distance measuring sensor 5 includes a plurality of sensor elements 51. The plurality of sensor elements 51 are arranged in the X direction. The number of sensor elements 51 is in principle twice the number of drawing heads 41. The same number of sensor elements 51 as the number of drawing heads 41 is arranged above the first station 21a, and the same number of sensor elements 51 as the number of drawing heads 41 is arranged above the second station 21b. In the example of FIG. 1 , the number of drawing heads 41 is six, and the number of sensor elements 51 is twelve. Above the first station 21a, the spacing of the sensor elements 51 (i.e., the spacing of the centers of the sensor elements 51 in the X direction) is the same as the spacing of the drawing heads 41 (i.e., the spacing of the centers of the drawing heads 41 in the X direction). Above the second station 21b, the spacing of the sensor elements 51 is also the same as the spacing of the drawing heads 41.

各個感測器要素51係取得各個感測器要素51與被位於下方的第一台21a或者第二台21b保持的基板9之間的距離。正確來說,藉由測量取得基板9的上表面91上的測量位置與測量上方的感測器要素51的特定的部分之間的距離。感測器要素51的高度方向的位置係能藉由預先測量而取得,並從感測器要素51的高度方向的位置與所取得的距離來求出測量位置的高度方向的位置。因此,感測器要素51與測量位置之間的距離的測量係實質性地取得測量位置的高度方向的位置。正確來說,感測器要素51的輸出值係被控制部10的後述的對焦控制部113轉換成測量位置的高度方向的位置。轉換係例如利用一次函數。此外,雖然測量位置原則上為感測器要素51的正下方的位置,然而只要為大致下方的位置即可,並未限定於正下方。 Each sensor element 51 obtains the distance between each sensor element 51 and the substrate 9 held by the first stage 21a or the second stage 21b located below. More precisely, the distance between the measurement position on the upper surface 91 of the substrate 9 and the specific portion of the sensor element 51 above the measurement is obtained by measurement. The height direction position of the sensor element 51 can be obtained by pre-measurement, and the height direction position of the measurement position is obtained from the height direction position of the sensor element 51 and the obtained distance. Therefore, the measurement of the distance between the sensor element 51 and the measurement position is to obtain the height direction position of the measurement position in essence. More precisely, the output value of the sensor element 51 is converted into the height direction position of the measurement position by the focus control unit 113 described later of the control unit 10. The conversion is performed using, for example, a linear function. In addition, although the measurement position is in principle directly below the sensor element 51, it can be located approximately below and is not limited to directly below.

各個感測器要素51係採用擴散反射方式。具體而言,從感測器要素51經由投光透鏡對基板9照射雷射光,來自基板9的擴散反射光係經由受光透鏡被受光位置檢測感測器(例如PSD(Position Sensitive Detector;位置靈敏檢測器)或者CMOS(Complementary Metal-Oxide Semiconductor;互補式金屬氧化物半導體))接收,從而檢測受光位置。接著,從受光位置求出感測器要素51與基板9上的測量位置之間的距離。雖然擴散反射方式的感測器容易取得且較便宜,然而測量精度較低。從第一測距感測器5射出的光線的波長只要為不會對用以形成基板9的表面(亦即上表面91)之感光材料造成影響之波長,則可採用任意的波長。第一測距感測器5的光源較佳為可視光或者紅外光的半導體雷射,更佳為可視光的半導體雷射。 Each sensor element 51 adopts a diffuse reflection method. Specifically, laser light is irradiated from the sensor element 51 to the substrate 9 through a projecting lens, and the diffuse reflected light from the substrate 9 is received by a light receiving position detection sensor (such as PSD (Position Sensitive Detector) or CMOS (Complementary Metal-Oxide Semiconductor)) through a light receiving lens, thereby detecting the light receiving position. Then, the distance between the sensor element 51 and the measurement position on the substrate 9 is calculated from the light receiving position. Although diffuse reflection sensors are easy to obtain and relatively cheap, their measurement accuracy is relatively low. The wavelength of the light emitted from the first distance sensor 5 can be any wavelength as long as it does not affect the photosensitive material used to form the surface of the substrate 9 (i.e., the upper surface 91). The light source of the first distance sensor 5 is preferably a semiconductor laser of visible light or infrared light, and more preferably a semiconductor laser of visible light.

圖2係顯示控制部10所具備的電腦100的構成之圖。電腦100為具備有處理器(processor)101、記憶體102、輸入輸出部103以及匯流排(bus)104之一 般的電腦。匯流排104為用以連接處理器101、記憶體102以及輸入輸出部103之訊號電路。記憶體102係記憶程式以及各種資訊。記憶體102係例如為RAM(Random Access Memory;隨機存取記憶體)或者硬式磁碟機(hard disk drive)。處理器101係依循記憶於記憶體102的程式等,一邊利用記憶體102等一邊執行各種處理(例如數值計算、影像處理)。輸入輸出部103係具備:鍵盤105以及滑鼠106,係接受來自操作者的輸入;以及顯示器107,係顯示處理器101的輸出等。此外,控制部10係可為可程式邏輯控制器(PLC;Programmable Logic Controller)或者電路基板等,亦可為這些構件與一個以上的電腦的組合。 FIG2 is a diagram showing the structure of a computer 100 included in the control unit 10. The computer 100 is a general computer including a processor 101, a memory 102, an input/output unit 103, and a bus 104. The bus 104 is a signal circuit for connecting the processor 101, the memory 102, and the input/output unit 103. The memory 102 stores programs and various information. The memory 102 is, for example, a RAM (Random Access Memory) or a hard disk drive. The processor 101 follows the program stored in the memory 102, and performs various processing (such as numerical calculation and image processing) while using the memory 102. The input and output unit 103 includes a keyboard 105 and a mouse 106, which receive input from the operator, and a display 107, which displays the output of the processor 101. In addition, the control unit 10 can be a programmable logic controller (PLC) or a circuit board, or a combination of these components and one or more computers.

圖3係顯示藉由電腦100所實現的控制部10的功能構成以及周邊的功能構成之方塊圖。控制部10係具備拍攝控制部111、位置檢測部112、對焦控制部113、描繪控制部114以及記憶部115。記憶部115係主要藉由記憶體102所實現。記憶部115係記憶被描繪至基板9之預定的圖案的資料(亦即描繪用資料)以及其他的資訊。 FIG3 is a block diagram showing the functional structure of the control unit 10 and the peripheral functional structure realized by the computer 100. The control unit 10 has a shooting control unit 111, a position detection unit 112, a focus control unit 113, a drawing control unit 114 and a memory unit 115. The memory unit 115 is mainly realized by the memory 102. The memory unit 115 stores the data of the predetermined pattern drawn on the substrate 9 (i.e., the drawing data) and other information.

拍攝控制部111、位置檢測部112、對焦控制部113以及描繪控制部114係主要藉由處理器101所實現。拍攝控制部111係控制拍攝部3、第一移動機構22a以及第二移動機構22b,藉此藉由對準攝影機31取得第一台21a以及第二台21b上的基板9的上表面91上所設置的標記(亦可為圖案的一部分)。該影像係被傳送並被儲存於記憶部115。 The shooting control unit 111, the position detection unit 112, the focus control unit 113 and the drawing control unit 114 are mainly implemented by the processor 101. The shooting control unit 111 controls the shooting unit 3, the first moving mechanism 22a and the second moving mechanism 22b, thereby obtaining the mark (which may also be a part of the pattern) set on the upper surface 91 of the substrate 9 on the first stage 21a and the second stage 21b by the alignment camera 31. The image is transmitted and stored in the memory unit 115.

位置檢測部112係使用該影像來檢測基板9的位置(包含基板9的應變)。描繪控制部114係控制移動機構2以及圖案描繪部4對被第一台21a或者第二台21b保持的基板9照射光線並描繪圖案。此時,利用藉由位置檢測部112所檢測的基板9的位置,一邊校正所描繪的圖案一邊進行描繪。 The position detection unit 112 uses the image to detect the position of the substrate 9 (including the strain of the substrate 9). The drawing control unit 114 controls the moving mechanism 2 and the pattern drawing unit 4 to irradiate light to the substrate 9 held by the first stage 21a or the second stage 21b and draw the pattern. At this time, the position of the substrate 9 detected by the position detection unit 112 is used to correct the drawn pattern while drawing.

如上所述,圖案描繪部4的各個描繪頭41係包含光源、光學系統以及光線調變元件411。此外,光源係可與描繪頭41一體性地設置,亦可與描繪頭41分離地設置。在光源與描繪頭41分離之情形中,來自光源的光線係經由具有光纖等的光學系統被導入至描繪頭41。 As described above, each drawing head 41 of the pattern drawing unit 4 includes a light source, an optical system, and a light modulation element 411. In addition, the light source can be provided integrally with the drawing head 41 or separately from the drawing head 41. In the case where the light source is separated from the drawing head 41, light from the light source is introduced into the drawing head 41 via an optical system having an optical fiber or the like.

如圖3所示,描繪頭41係進一步包含第二測距感測器412以及對焦變更部413。第二測距感測器412係取得第二測距感測器412與正在進行圖案的描繪的基板9上的測量位置之間的距離。選擇描繪位置或者能視為與描繪位置相同的高度之位置作為測量位置,第二測距感測器412係實質性地測量描繪頭41與基板9的上表面91之間的距離。正確來說,第二測距感測器412係取得基板9的上表面91的描繪位置與相對於描繪頭41被固定的位置且為描繪位置的正上方的位置之間的距離。然而,第二測距感測器412所取得的距離係無須為描繪頭41與描繪頭41的正下方的位置之間的距離或者描繪位置與描繪位置的正上方的位置之間的距離,只要為能視為這些距離之預定的位置之間的高度方向的距離即可。亦即,第二測距感測器412亦可取得從基板9的上表面91的描繪位置偏移的位置與描繪頭41之間的高度方向的距離。 As shown in FIG3 , the drawing head 41 further includes a second distance sensor 412 and a focus changing unit 413. The second distance sensor 412 obtains the distance between the second distance sensor 412 and a measurement position on the substrate 9 where the pattern is being drawn. The drawing position or a position that can be regarded as the same height as the drawing position is selected as the measurement position, and the second distance sensor 412 substantially measures the distance between the drawing head 41 and the upper surface 91 of the substrate 9. More precisely, the second distance sensor 412 obtains the distance between the drawing position on the upper surface 91 of the substrate 9 and a position directly above the drawing position relative to the position where the drawing head 41 is fixed. However, the distance obtained by the second distance measuring sensor 412 does not need to be the distance between the drawing head 41 and the position directly below the drawing head 41 or the distance between the drawing position and the position directly above the drawing position, as long as it is the distance in the height direction between the predetermined positions that can be regarded as these distances. That is, the second distance measuring sensor 412 can also obtain the distance in the height direction between the position offset from the drawing position of the upper surface 91 of the substrate 9 and the drawing head 41.

第二測距感測器412(或者描繪頭41)的高度方向的位置係能藉由預先測量所取得,並從第二測距感測器412的高度方向的位置與所取得的距離來求出測量位置的高度方向的位置。因此,第二測距感測器412與測量位置之間的距離的測量係實質性地取得測量位置的高度方向的位置。 The height position of the second distance sensor 412 (or the drawing head 41) can be obtained by pre-measurement, and the height position of the measurement position can be obtained from the height position of the second distance sensor 412 and the obtained distance. Therefore, the measurement of the distance between the second distance sensor 412 and the measurement position is to obtain the height position of the measurement position in essence.

第二測距感測器412係進行精度比第一測距感測器5還高的測量。作為第二測距感測器412,例如以高精度的受光元件對基板9的表面照射傾斜的光線並檢測光線的正反射光的受光位置,具體而言例如對基板9的表面照射 雷射光並檢測光線的正反射光的受光位置。第二測距感測器412係基於受光位置來取得描繪頭41與基板9之間的距離。作為第二測距感測器412,能採用例如已經說明的日本特開2014-197128號公報所記載的構件。 The second distance sensor 412 performs measurement with higher accuracy than the first distance sensor 5. As the second distance sensor 412, for example, a high-precision light receiving element is used to irradiate the surface of the substrate 9 with oblique light and detect the light receiving position of the regular reflection light of the light. Specifically, for example, laser light is irradiated on the surface of the substrate 9 and the light receiving position of the regular reflection light of the light is detected. The second distance sensor 412 obtains the distance between the drawing head 41 and the substrate 9 based on the light receiving position. As the second distance sensor 412, for example, the components described in the already described Japanese Patent Publication No. 2014-197128 can be used.

對焦變更部413係變更藉由從描繪頭41射出的光線所形成的影像的Z方向的位置(亦即高度方向的位置,以下亦稱為「對焦位置」)。對焦變更部413係例如包含:對焦透鏡,係包含於描繪頭41的光學系統;以及驅動部,係將對焦透鏡沿著光軸移動。對焦透鏡係可為一片亦可為兩片以上。驅動部係將對焦透鏡的位置沿著光軸移動,藉此變更藉由從描繪頭41射出的光線所形成的影像的高度方向的位置。 The focus changing unit 413 changes the Z-direction position (i.e., the height direction position, hereinafter also referred to as "focus position") of the image formed by the light emitted from the drawing head 41. The focus changing unit 413 includes, for example: a focus lens, which is included in the optical system of the drawing head 41; and a drive unit, which moves the focus lens along the optical axis. The focus lens can be one or more than two. The drive unit moves the position of the focus lens along the optical axis, thereby changing the height direction position of the image formed by the light emitted from the drawing head 41.

對焦控制部113係使用來自第一測距感測器5的各個感測器要素51的資訊以及來自第二測距感測器412的資訊,在描繪途中進行下述控制:使從描繪頭41射出的光線所形成的影像的對焦位置與描繪位置中的基板9的表面的Z方向的位置一致。亦即,雖然基板9上的描繪位置的Z方向的位置係與描繪位置的主掃描方向的移動一起僅上下地變動,然而藉由對焦控制部113配合此種變動來變更藉由從描繪頭41射出的光線所形成的影像的Z方向的位置。此外,針對對焦控制部113對於來自第一測距感測器5的資訊之利用係容後說明。 The focus control unit 113 uses the information from each sensor element 51 of the first distance sensor 5 and the information from the second distance sensor 412 to perform the following control during the drawing process: the focus position of the image formed by the light emitted from the drawing head 41 is consistent with the position of the Z direction of the surface of the substrate 9 at the drawing position. That is, although the Z direction position of the drawing position on the substrate 9 changes only up and down along with the movement of the drawing position in the main scanning direction, the focus control unit 113 changes the Z direction position of the image formed by the light emitted from the drawing head 41 in accordance with this change. In addition, the use of the information from the first distance sensor 5 by the focus control unit 113 will be described later.

如上述般,第一測距感測器5的各個感測器要素51係精度比第二測距感測器412還低且價格便宜。藉此,能抑制描繪裝置1的製造成本的增加。在第一測距感測器5由複數個感測器要素51構成之情形中,能進一步抑制描繪裝置1的製造成本的增加。尤其,如圖1的描繪裝置1般,在設置描繪頭41的數量的兩倍的數量的感測器要素51之情形中,抑制描繪裝置1的製造成本的增加之功效較大。 As described above, each sensor element 51 of the first distance sensor 5 has lower accuracy and is cheaper than the second distance sensor 412. This can suppress the increase in the manufacturing cost of the drawing device 1. In the case where the first distance sensor 5 is composed of a plurality of sensor elements 51, the increase in the manufacturing cost of the drawing device 1 can be further suppressed. In particular, as in the drawing device 1 of FIG. 1, in the case where the number of sensor elements 51 is twice the number of the drawing head 41, the effect of suppressing the increase in the manufacturing cost of the drawing device 1 is greater.

接著,說明圖1所示的描繪裝置1所為的朝基板9的圖案的描繪之流程。在描繪裝置1中,大概在對被保持於第一台21a以及第二台21b中的一方的台上的基板9進行描繪的期間,將基板9搬入至另一方的台上並進行對準(亦即位置對合)等。而且,當結束對於被保持於上述一方的台上的基板9之描繪時,開始對被保持於上述另一方的台上的基板9之描繪。此外,在對該另一方的台上的基板9進行描繪的期間,從一方的台上搬出描繪完畢的基板9,並將新的基板9搬入至該一方的台上並進行對準等之處理。 Next, the process of drawing a pattern on a substrate 9 by the drawing device 1 shown in FIG. 1 is described. In the drawing device 1, while drawing the substrate 9 held on one of the first and second stages 21a and 21b, the substrate 9 is moved to the other stage and aligned (i.e., position alignment) is performed. When drawing the substrate 9 held on the one stage is completed, drawing the substrate 9 held on the other stage is started. In addition, while drawing the substrate 9 on the other stage, the drawn substrate 9 is moved out from one stage, and a new substrate 9 is moved to the one stage and aligned.

圖4A以及圖4B係顯示描繪裝置1中的描繪處理的流程的一例之圖。圖4A以及圖4B中的左側的步驟S11至步驟S16係顯示朝第一台21a上的基板9的描繪處理之流程,圖4A以及圖4B中的右側的步驟S21至步驟S26係顯示朝第二台21b上的基板9的描繪處理之流程。此外,位於圖4A以及圖4B中的上下方向的相同位置之步驟係並行地進行。具體而言,步驟S11至步驟S15與步驟S26係並行地進行。此外,步驟S16與步驟S21至步驟S25係並行地進行。在圖4A以及圖4B中省略對最初被搬入至描繪裝置1的基板9以及最後被搬出的基板9的動作之記載。 Fig. 4A and Fig. 4B are diagrams showing an example of the flow of the drawing process in the drawing device 1. Steps S11 to S16 on the left side of Fig. 4A and Fig. 4B show the flow of the drawing process toward the substrate 9 on the first stage 21a, and steps S21 to S26 on the right side of Fig. 4A and Fig. 4B show the flow of the drawing process toward the substrate 9 on the second stage 21b. In addition, steps located at the same position in the vertical direction of Fig. 4A and Fig. 4B are performed in parallel. Specifically, steps S11 to S15 and step S26 are performed in parallel. In addition, step S16 and steps S21 to S25 are performed in parallel. In FIG. 4A and FIG. 4B, the description of the movement of the substrate 9 that is first carried into the drawing device 1 and the substrate 9 that is last carried out is omitted.

在圖4A以及圖4B中,從對第二搬運機構2b的第二台21b上的基板9進行圖案的描繪之狀態開始說明。此外,圖5至圖10係顯示描繪處理中的描繪裝置1中的第一台21a以及第二台21b的Y方向中的概略性的位置之概念圖。在圖5至圖10中,以實線描繪第一台21a、第一移動機構22a、第二台21b以及第二移動機構22b,以虛線描繪對準攝影機31、描繪頭41的排列以及第一測距感測器5的感測器要素51的排列。 In FIG. 4A and FIG. 4B, the description starts with the state of drawing a pattern on the substrate 9 on the second stage 21b of the second transport mechanism 2b. In addition, FIG. 5 to FIG. 10 are conceptual diagrams showing the approximate positions of the first stage 21a and the second stage 21b in the drawing device 1 in the drawing process in the Y direction. In FIG. 5 to FIG. 10, the first stage 21a, the first moving mechanism 22a, the second stage 21b, and the second moving mechanism 22b are drawn with solid lines, and the alignment camera 31, the arrangement of the drawing head 41, and the arrangement of the sensor elements 51 of the first distance measuring sensor 5 are drawn with dotted lines.

在以下的說明中,針對Y方向中的第一台21a的位置,將第一台21a於上下方向與對準攝影機31以及/或者描繪頭41重疊的位置稱為「處理位置」,將第一台21a在上下方向與第一移動機構22a的-Y側的部位重疊的位置稱為「搬入搬出位置」,將第一台21a在上下方向與第一移動機構22a的+Y側的部位重疊的位置稱為「待機位置」。此外,針對Y方向中的第二台21b的位置,將第二台21b於上下方向與對準攝影機31以及/或者描繪頭41重疊的位置稱為「處理位置」,將第二台21b在上下方向與第二移動機構22b的-Y側的部位重疊的位置稱為「搬入搬出位置」,將第二台21b在上下方向與第二移動機構22b的+Y側的部位重疊的位置稱為「待機位置」。此外,上述處理位置並非是指Y方向中的一點之概念,而是指對準攝影機31所為的基板9的拍攝以及描繪頭41進行圖案的描繪之Y方向的預定的範圍(亦即進行處理之區域)。 In the following description, with respect to the position of the first stage 21a in the Y direction, the position where the first stage 21a overlaps with the alignment camera 31 and/or the drawing head 41 in the vertical direction is referred to as the "processing position", the position where the first stage 21a overlaps with the portion on the -Y side of the first moving mechanism 22a in the vertical direction is referred to as the "carry-in and carry-out position", and the position where the first stage 21a overlaps with the portion on the +Y side of the first moving mechanism 22a in the vertical direction is referred to as the "standby position". In addition, regarding the position of the second stage 21b in the Y direction, the position where the second stage 21b overlaps with the alignment camera 31 and/or the drawing head 41 in the vertical direction is called the "processing position", the position where the second stage 21b overlaps with the -Y side of the second moving mechanism 22b in the vertical direction is called the "carry-in and carry-out position", and the position where the second stage 21b overlaps with the +Y side of the second moving mechanism 22b in the vertical direction is called the "standby position". In addition, the above-mentioned processing position does not refer to the concept of a point in the Y direction, but refers to the predetermined range in the Y direction (i.e., the area to be processed) where the alignment camera 31 shoots the substrate 9 and the drawing head 41 draws the pattern.

如圖5所示,在描繪裝置1中,在第二台21b位於處理位置且描繪頭41位於第二描繪位置的狀態下,描繪頭41係對第二台21b上的基板9進行圖案的描繪(步驟S26)。以下,將被第二台21b保持的基板9或者被保持的預定的基板9稱為「第二基板9」。「第二基板9」並非是指第二片基板,而是單純地指與第二台21b相關的基板。在步驟S26中,藉由描繪控制部114(參照圖3)控制圖案描繪部4、第二移動機構22b以及描繪頭移動機構42,藉此對在處理位置中朝+Y方向或者-Y方向移動之基板9進行圖案的描繪。 As shown in FIG5, in the drawing device 1, when the second stage 21b is located at the processing position and the drawing head 41 is located at the second drawing position, the drawing head 41 draws the pattern on the substrate 9 on the second stage 21b (step S26). Hereinafter, the substrate 9 held by the second stage 21b or the predetermined substrate 9 held is referred to as the "second substrate 9". The "second substrate 9" does not refer to the second substrate, but simply refers to the substrate related to the second stage 21b. In step S26, the drawing control unit 114 (refer to FIG3) controls the pattern drawing unit 4, the second moving mechanism 22b and the drawing head moving mechanism 42, thereby drawing the pattern on the substrate 9 moving in the +Y direction or -Y direction in the processing position.

此外,與步驟S26並行地,從位於搬入搬出位置的第一台21a搬出描繪完畢的基板9,並將新的基板9搬入並保持於第一台21a上(步驟S11、S12)。以下,將被第一台21a保持的基板9或者被保持的預定的基板9稱為「第一基板 9」。「第一基板9」並非是指第一片基板,而是單純地指與第一台21a相關的基板。在不區別的一基板9以及後述的第二基板9之情形中,簡稱為「基板9」。 In addition, in parallel with step S26, the substrate 9 that has been drawn is unloaded from the first stage 21a located at the loading and unloading position, and a new substrate 9 is loaded and held on the first stage 21a (steps S11, S12). Hereinafter, the substrate 9 held by the first stage 21a or the predetermined substrate 9 held is referred to as the "first substrate 9". The "first substrate 9" does not refer to the first substrate, but simply refers to the substrate related to the first stage 21a. In the case of a substrate 9 and a second substrate 9 described later that are not distinguished, it is simply referred to as "substrate 9".

接著,藉由第一移動機構22a將第一台21a朝+Y方向移動並位於如圖6所示的處理位置。在圖6所示的狀態中,在第二台21b位於處理位置的狀態下對第二台21b上的基板9進行描繪。此外,對準攝影機31係藉由攝影機位置切換部32位於與被第一台21a(第一基板保持部)保持的第一基板9對向之第一拍攝位置。此外,對準攝影機31的間隔係配合第一基板9的尺寸預先被調整。 Next, the first stage 21a is moved in the +Y direction by the first moving mechanism 22a and is located at the processing position shown in FIG6. In the state shown in FIG6, the substrate 9 on the second stage 21b is depicted while the second stage 21b is located at the processing position. In addition, the alignment camera 31 is located at the first shooting position opposite to the first substrate 9 held by the first stage 21a (first substrate holding part) by the camera position switching part 32. In addition, the interval of the alignment camera 31 is pre-adjusted to match the size of the first substrate 9.

當第一台21a位於處理位置時,藉由拍攝控制部111(參照圖3)控制第一移動機構22a,藉此第一台21a係以預定的速度於+Y方向移動。藉由拍攝控制部111所為的對準攝影機31的控制,在第一基板9上的對準標記(省略圖示)位於對準攝影機31的下方的瞬間進行拍攝,並將所取得的影像朝位置檢測部112輸送。此外,亦可在拍攝時停止移動第一台21a。拍攝係針對第一基板9上的各個對準標記進行。在位置檢測部112中,對該影像進行使用了基準影像的圖案匹配(pattern matching)。該圖案匹配係例如藉由公知的圖案匹配法(例如幾何學形狀圖案匹配、正規化相關檢索等)來進行。藉此,求出該影像中的對準標記的位置,檢測出第一台21a上的第一基板9的位置(步驟S13)。以下,將與藉由位置檢測部112所取得的基板9的位置相關之資訊稱為「對準資訊」。 When the first stage 21a is located at the processing position, the first moving mechanism 22a is controlled by the shooting control unit 111 (refer to FIG. 3 ), whereby the first stage 21a moves in the +Y direction at a predetermined speed. By controlling the alignment camera 31 by the shooting control unit 111, shooting is performed at the moment when the alignment mark (not shown) on the first substrate 9 is located below the alignment camera 31, and the acquired image is transmitted to the position detection unit 112. In addition, the movement of the first stage 21a may be stopped during shooting. Shooting is performed for each alignment mark on the first substrate 9. In the position detection unit 112, pattern matching using a reference image is performed on the image. The pattern matching is performed, for example, by a known pattern matching method (e.g., geometric shape pattern matching, normalized correlation search, etc.). In this way, the position of the alignment mark in the image is obtained, and the position of the first substrate 9 on the first stage 21a is detected (step S13). Hereinafter, the information related to the position of the substrate 9 obtained by the position detection unit 112 is referred to as "alignment information".

所謂位置檢測部112所檢測的第一基板9的位置係包含第一基板9相對於屬於基板保持部的第一台21a之X方向以及Y方向中的座標、第一基板9的朝向(亦即旋轉位置)以及用以顯示第一基板9的應變等所致使的變形之資訊。此外,所謂用以顯示第一基板9的變形之資訊為已變形的第一基板9的形狀以及該第一基板9上的描繪區域的位置等之資訊。在位置檢測部112中,基於所檢測的 對準資訊,進行第一台21a上的第一基板9用的描繪資料的校正(亦即對準處理)。此外,在第一移動機構22a具有以朝向Z方向的軸作為中心旋轉第一台21a的功能之情形中,亦可基於對準資訊進行第一基板9的旋轉。關於第一基板9的對準的上述說明係在對於後述的第二基板9的處理亦相同。 The position of the first substrate 9 detected by the position detection unit 112 includes the coordinates of the first substrate 9 in the X direction and the Y direction relative to the first stage 21a belonging to the substrate holding unit, the orientation of the first substrate 9 (i.e., the rotational position), and information for displaying the deformation caused by the strain of the first substrate 9. In addition, the information for displaying the deformation of the first substrate 9 is information such as the shape of the deformed first substrate 9 and the position of the drawing area on the first substrate 9. In the position detection unit 112, based on the detected alignment information, the drawing data for the first substrate 9 on the first stage 21a is corrected (i.e., alignment processing). In addition, in the case where the first moving mechanism 22a has the function of rotating the first stage 21a with the axis toward the Z direction as the center, the first substrate 9 can also be rotated based on the alignment information. The above description on the alignment of the first substrate 9 is also the same for the processing of the second substrate 9 described later.

第一基板9的-Y側的部位通過第一測距感測器5的下方時,從第一台21a側的六個感測器要素51的輸出係被記錄至控制部10的記憶部115。亦即,從各個感測器要素51反復地輸出該感測器要素51與第一基板9的上表面91之間的距離並記錄至控制部10的記憶部115。感測器要素51與第一基板9的上表面91之間的距離係與感測器要素51的測量位置中的基板9的上表面91的高度方向的位置對應。因此,藉由上述測量,取得測量位置的移動範圍中的第一基板9的上表面91的高度方向的位置的變動。以下,亦將測量位置或者描繪位置中的基板9的上表面91的高度方向的位置稱為「表面高度位置」。對焦控制部113係基於從各個感測器要素51所取得的資訊所取得的第一基板9的眾多的測量位置中的表面高度位置求出最高頻度值(步驟S14)。以下,將最高頻度值稱為「對焦資訊」。取得與第一測距感測器5的感測器要素51的數量相同數量的預對焦資訊。 When the -Y side portion of the first substrate 9 passes under the first distance measuring sensor 5, the outputs of the six sensor elements 51 on the first stage 21a side are recorded in the memory section 115 of the control section 10. That is, the distance between the sensor element 51 and the upper surface 91 of the first substrate 9 is repeatedly output from each sensor element 51 and recorded in the memory section 115 of the control section 10. The distance between the sensor element 51 and the upper surface 91 of the first substrate 9 corresponds to the position of the upper surface 91 of the substrate 9 in the height direction at the measurement position of the sensor element 51. Therefore, by the above measurement, the change in the position of the upper surface 91 of the first substrate 9 in the height direction within the moving range of the measurement position is obtained. Hereinafter, the position of the upper surface 91 of the substrate 9 in the height direction at the measurement position or the drawing position is also referred to as the "surface height position". The focus control unit 113 obtains the highest frequency value of the surface height position of the first substrate 9 among the plurality of measurement positions based on the information obtained from each sensor element 51 (step S14). Hereinafter, the highest frequency value is referred to as "focus information". The same number of pre-focus information as the number of sensor elements 51 of the first distance measuring sensor 5 is obtained.

於基板9存在有通孔(through hole)以及段差等之不應該作為基板9的上表面91的高度之測量位置。採用各個感測器要素51所取得的第一基板9的眾多的表面高度位置的最高頻度值作為第一基板9的上表面91的高度方向的位置,藉此能取得用以代表眾多的表面高度位置之正確的表面高度位置。此外,所謂「最高頻度值」係指:將高度方向的位置分割成複數個小範圍,將各個感測器要素51所取得的眾多的表面高度位置區分成屬於各個小範圍的值,並採用 最多的表面高度位置所隸屬的小範圍的中央值作為用以代表眾多的測量位置之正確的表面高度位置。 There are through holes and steps in the substrate 9, which should not be used as the measurement position of the height of the upper surface 91 of the substrate 9. The highest frequency value of the numerous surface height positions of the first substrate 9 obtained by each sensor element 51 is used as the position of the height direction of the upper surface 91 of the first substrate 9, thereby obtaining the correct surface height position representing the numerous surface height positions. In addition, the so-called "highest frequency value" means: dividing the position in the height direction into a plurality of small ranges, distinguishing the numerous surface height positions obtained by each sensor element 51 into values belonging to each small range, and using the central value of the small range to which the most surface height positions belong as the correct surface height position representing the numerous measurement positions.

基板9上的各個感測器要素51的測量位置的移動範圍係與後續工序的任一個描繪頭41開始描繪時之描繪位置的移動軌跡重疊。亦即,各個感測器要素51的X方向的位置係與後續描繪時的任一個描繪頭41的開始描繪時的X方向的位置一致。因此,第一測距感測器5的各個感測器要素51(正確來說為第一基板9側的各個感測器要素51)係一邊使測量位置位於被屬於第一基板保持部的第一台21a保持的第一基板9上的開始描繪位置附近的(於主掃描方向排列)複數個位置一邊取得直至該複數個位置為止的複數個距離。而且,對焦控制部113係將所取得的複數個距離中之頻度最高的距離作為第一測距感測器5的各個感測器要素51與第一基板9之間的距離來利用。如上所述,各個感測器要素51與第一基板9之間的距離係實質性地為用以顯示開始描繪時的描繪位置中的基板9的表面高度位置之預對焦資訊。 The moving range of the measurement position of each sensor element 51 on the substrate 9 overlaps with the moving trajectory of the drawing position when any drawing head 41 starts drawing in the subsequent process. That is, the position of each sensor element 51 in the X direction coincides with the position of any drawing head 41 in the X direction when drawing starts in the subsequent drawing. Therefore, each sensor element 51 of the first distance measuring sensor 5 (to be more precise, each sensor element 51 on the first substrate 9 side) acquires a plurality of distances to the plurality of positions while the measurement position is located at a plurality of positions near the starting drawing position on the first substrate 9 held by the first stage 21a belonging to the first substrate holding unit (arranged in the main scanning direction). Furthermore, the focus control unit 113 uses the distance with the highest frequency among the obtained multiple distances as the distance between each sensor element 51 of the first distance measuring sensor 5 and the first substrate 9. As described above, the distance between each sensor element 51 and the first substrate 9 is essentially pre-focus information for displaying the surface height position of the substrate 9 in the drawing position when drawing starts.

當在對被第二台21b(第二基板保持部)保持的第二基板9描繪圖案的期間結束從第一基板9取得對準資訊以及預對焦資訊時,藉由第一移動機構22a將第一台21a進一步地朝+Y方向移動並位於圖7所示的待機位置(步驟S15)。在圖7所示的狀態中,在第二台21b位於處理位置(正確來說為具有用以進行描繪之一定範圍的位置)的狀態下對第二基板9進行描繪。第一台21a係在待機位置處待機,直至結束對於第二基板9的描繪為止。 When the alignment information and pre-focus information are obtained from the first substrate 9 while the pattern is being drawn on the second substrate 9 held by the second stage 21b (second substrate holding portion), the first stage 21a is further moved in the +Y direction by the first moving mechanism 22a and is located at the standby position shown in FIG. 7 (step S15). In the state shown in FIG. 7, the second substrate 9 is drawn while the second stage 21b is located at the processing position (more precisely, a position with a certain range for drawing). The first stage 21a waits at the standby position until the drawing of the second substrate 9 is completed.

當結束對於第二基板9之描繪時(步驟S26),藉由第二移動機構22b將第二台21b朝-Y方向移動,第二台21b係如圖8所示位於搬入搬出位置。此外,與此種動作並行地,藉由第一移動機構22a將第一台21a朝-Y方向移動並位於處 理位置。再者,對準攝影機31係從第一拍攝位置朝第二拍攝位置移動且描繪頭41係從第二描繪位置朝第一描繪位置移動,第二拍攝位置為與被第二台21b(第二基板保持部)保持的第二基板9對向(正確來說為拍攝時對向)之位置。而且,基於上述對準處理完畢的描繪資料等,藉由描繪控制部114控制圖案描繪部4以及第一移動機構22a,藉此對處理位置中朝Y方向移動的第一台21a上的第一基板9進行圖案的描繪(步驟S16)。 When the drawing of the second substrate 9 is completed (step S26), the second stage 21b is moved in the -Y direction by the second moving mechanism 22b, and the second stage 21b is located at the loading and unloading position as shown in FIG8. In parallel with this operation, the first stage 21a is moved in the -Y direction by the first moving mechanism 22a and located at the processing position. Furthermore, the alignment camera 31 is moved from the first shooting position to the second shooting position and the drawing head 41 is moved from the second drawing position to the first drawing position. The second shooting position is a position opposite to the second substrate 9 held by the second stage 21b (second substrate holding part) (to be more precise, opposite during shooting). Furthermore, based on the alignment-processed drawing data, the drawing control unit 114 controls the pattern drawing unit 4 and the first moving mechanism 22a, thereby drawing the pattern on the first substrate 9 on the first stage 21a moving in the Y direction in the processing position (step S16).

圖11係用以說明對第一基板9進行描繪的樣子之圖。對於第二基板9之描繪亦同樣。因此,在以下關於圖11的說明中,不區別第一基板9以及第二基板9而是總稱為「基板9」。在圖11中以虛線顯示六個描繪頭41。描繪於基板9上的十八個Y方向較長的區域8係分別顯示基板9於Y方向移動時一個描繪頭41進行描繪之區域。在使用DMD作為描繪頭41的光線調變元件411且DMD的矩形的影像傾斜地投影至基板9上之情形中,正確來說複數個區域8係在X方向中稍微重疊。 FIG. 11 is a diagram for explaining how the first substrate 9 is drawn. The same is true for the drawing of the second substrate 9. Therefore, in the following description of FIG. 11, the first substrate 9 and the second substrate 9 are not distinguished but are collectively referred to as "substrate 9". Six drawing heads 41 are shown in dashed lines in FIG. 11. The eighteen Y-direction long regions 8 drawn on the substrate 9 are regions drawn by a drawing head 41 when the substrate 9 moves in the Y direction. In the case where a DMD is used as the light modulation element 411 of the drawing head 41 and the rectangular image of the DMD is projected obliquely onto the substrate 9, it is correct to say that the plurality of regions 8 slightly overlap in the X direction.

以粗的實線所顯示的箭頭81係顯示複數個描繪頭41的描繪位置的最初的移動。亦即顯示下述情形:基板9於-Y方向移動,藉此描繪位置係於基板9上於+Y方向相對性地移動。當描繪位置移動至區域8的+Y側的端部時,藉由描繪頭移動機構42使描繪頭41於+X方向步階移動,藉此描繪位置係在基板9上於+X方向步階移動。接著,基板9係於+Y方向移動,藉此如虛線的箭頭82所示描繪位置係於-Y方向移動並進行朝第二個區域8的描繪。當描繪位置移動至第二個區域8的-Y側的端部時,藉由描繪頭移動機構42使描繪頭41於+X方向步階移動,藉此描繪位置係在基板9上於+X方向步階移動。接著,基板9係於-Y方向移動, 藉此如虛線的箭頭83所示描繪位置係於+Y方向移動並進行朝第三個區域8的描繪。 The arrow 81 indicated by a thick solid line shows the initial movement of the drawing positions of the plurality of drawing heads 41. That is, the following situation is shown: the substrate 9 moves in the -Y direction, whereby the drawing position moves relatively in the +Y direction on the substrate 9. When the drawing position moves to the end of the +Y side of the area 8, the drawing head moving mechanism 42 causes the drawing head 41 to move stepwise in the +X direction, whereby the drawing position moves stepwise in the +X direction on the substrate 9. Then, the substrate 9 moves in the +Y direction, whereby the drawing position moves in the -Y direction as indicated by the dashed arrow 82, and drawing is performed toward the second area 8. When the drawing position moves to the end of the -Y side of the second area 8, the drawing head 41 is moved stepwise in the +X direction by the drawing head moving mechanism 42, whereby the drawing position is moved stepwise in the +X direction on the substrate 9. Then, the substrate 9 is moved in the -Y direction, whereby the drawing position is moved in the +Y direction as shown by the dotted arrow 83 and drawing is performed toward the third area 8.

在圖11的例子之情形中,描繪頭41係相對於基板9於Y方向來回移動1.5次(亦即去程結束後回程移動至一半),藉此結束描繪。此外,如上所述,描繪頭41的數量以及區域8的寬度亦可進行各種變更。較佳為,描繪頭41的數量為兩個以上。此外,描繪頭41亦可相對於基板9於Y方向亦即主掃描方向僅移動一次並結束描繪,亦可於主掃描方向移動兩次以上並結束描繪。若以一般性的說明來描述第一基板9,則一邊從描繪頭41朝向第一基板9射出經過調變的光線,一邊使描繪頭41相對於第一台21a(第一基板保持部)相對性地移動,藉此對該第一基板9描繪圖案。在第二基板9之情形中,將第一台21a置換成第二台21b(第二基板保持部)之點除外亦同樣。 In the case of the example of Figure 11, the drawing head 41 moves back and forth 1.5 times in the Y direction relative to the substrate 9 (that is, it moves to half of the return journey after the outward journey is completed), thereby completing the drawing. In addition, as described above, the number of the drawing heads 41 and the width of the area 8 can also be changed in various ways. Preferably, the number of the drawing heads 41 is two or more. In addition, the drawing head 41 can also move only once in the Y direction, that is, the main scanning direction, relative to the substrate 9 to complete the drawing, or it can move more than two times in the main scanning direction to complete the drawing. If the first substrate 9 is described in general terms, the drawing head 41 emits modulated light toward the first substrate 9 while the drawing head 41 is relatively moved relative to the first stage 21a (first substrate holding portion), thereby drawing a pattern on the first substrate 9. In the case of the second substrate 9, the same is true except that the first stage 21a is replaced with the second stage 21b (second substrate holding portion).

此外,在主掃描方向移動奇數次直至結束描繪為止之情形中,為了使結束描繪的時間點的基板9的位置與搬入搬出位置接近,相對於描繪頭41之待機位置較佳為與搬入搬出位置為相反側。反之,在主掃描方向移動偶數次直至結束描繪為止之情形中,為了使結束描繪的時間點的基板9的位置與搬入搬出位置接近,較佳為相對於描繪頭41之待機位置與搬入搬出位置為相同側。 In addition, when the main scanning direction moves an odd number of times until the drawing is completed, in order to make the position of the substrate 9 at the time of the end of the drawing close to the carry-in and carry-out position, the standby position relative to the drawing head 41 is preferably on the opposite side of the carry-in and carry-out position. Conversely, when the main scanning direction moves an even number of times until the drawing is completed, in order to make the position of the substrate 9 at the time of the end of the drawing close to the carry-in and carry-out position, the standby position relative to the drawing head 41 is preferably on the same side as the carry-in and carry-out position.

在開始朝最初的區域8進行描繪時,利用步驟S14所取得的預對焦資訊。在描繪裝置1中,進行非常精密的描繪。因此,不容許基板9的表面的描繪位置的高度方向的位置亦即表面高度位置與形成有來自描繪頭41的光線的影像的高度方向的位置(以下稱為「影像高度位置」)之間的微小的偏移。在連續性地進行描繪的期間,描繪頭41的第二測距感測器412係測量表面高度位置,控制部10的對焦控制部113係基於測量結果來控制描繪頭41的對焦變更部413。亦 即,使描繪頭41內的對焦透鏡沿著光軸微小地移動。藉此,即使描繪位置與基板9平行地移動,描繪位置中的表面高度位置與影像高度位置亦會正確地一致。然而,由於在開始描繪的時間點沒有來自第二測距感測器412的可靠性高的資訊,因此會有實際的表面高度位置與控制前的影像高度位置大幅偏移之可能性。尤其,在基板9存在應變之情形中,會有在基板9的端部處表面高度位置與影像高度位置大幅偏移之情形。由於影像高度位置的變更的速度存在限度,因此當表面高度位置與影像高度位置大幅偏移時會有下述問題:需要使表面高度位置與影像高度位置對合的時間,開始描繪後的一段時間無法對合表面高度位置與影像高度位置。 When the drawing starts toward the initial area 8, the pre-focus information obtained in step S14 is used. In the drawing device 1, very precise drawing is performed. Therefore, a slight deviation between the height direction position of the drawing position on the surface of the substrate 9, that is, the surface height position and the height direction position of the image formed by the light from the drawing head 41 (hereinafter referred to as the "image height position") is not allowed. During the continuous drawing, the second distance sensor 412 of the drawing head 41 measures the surface height position, and the focus control unit 113 of the control unit 10 controls the focus changing unit 413 of the drawing head 41 based on the measurement result. That is, the focus lens in the drawing head 41 is slightly moved along the optical axis. Thereby, even if the drawing position moves parallel to the substrate 9, the surface height position and the image height position in the drawing position are accurately consistent. However, since there is no highly reliable information from the second distance measuring sensor 412 at the time of starting the drawing, there is a possibility that the actual surface height position and the image height position before the control will be greatly offset. In particular, when there is strain in the substrate 9, there may be a situation where the surface height position and the image height position at the end of the substrate 9 are greatly offset. Since there is a limit to the speed of changing the image height position, when the surface height position and the image height position are greatly offset, there will be the following problem: the time required to make the surface height position and the image height position match, the surface height position and the image height position cannot be matched for a period of time after the start of drawing.

因此,在描繪裝置1中設置第一測距感測器5,藉此在開始描繪之前預先取得開始描繪時的描繪位置的基板9的表面的高度方向的位置亦即開始描繪時的表面高度位置作為預對焦資訊,並在開始描繪之前預先使表面高度位置與影像高度位置接近,藉此實現開始描繪後立即迅速地進行自動對焦控制。正確來說,第一測距感測器5的各個感測器要素51所取得的預對焦資訊亦即各個感測器要素51與基板9之間的距離係被轉換成對應的描繪頭41與基板9之間的距離,藉此被利用於開始描繪時的自動對焦控制。藉由轉換所取得的描繪頭41與基板9之間的距離係與實質性取得的開始描繪位置中的表面高度位置同等。此外,結束一個區域8的描繪後在開始下一個區域8的描繪時的表面高度位置係能使用在結束前一個區域8的描繪時從第二測距感測器412所取得的表面高度位置。 Therefore, the first distance measuring sensor 5 is provided in the drawing device 1, so that the position of the height direction of the surface of the substrate 9 at the drawing position at the start of drawing, that is, the surface height position at the start of drawing, is obtained in advance as pre-focus information before the start of drawing, and the surface height position and the image height position are made close to each other before the start of drawing, so that the auto focus control is performed immediately after the start of drawing. More precisely, the pre-focus information obtained by each sensor element 51 of the first distance measuring sensor 5, that is, the distance between each sensor element 51 and the substrate 9 is converted into the distance between the corresponding drawing head 41 and the substrate 9, and is used for the auto focus control at the start of drawing. The distance between the drawing head 41 and the substrate 9 obtained by the conversion is equivalent to the surface height position at the start of drawing obtained substantially. In addition, the surface height position when starting the next area 8 after the description of one area 8 is completed can use the surface height position obtained from the second distance measuring sensor 412 when the description of the previous area 8 is completed.

設置第一測距感測器5,藉此無須下述動作:在開始描繪之前使用描繪頭41的第二測距感測器412測量開始描繪位置中的表面高度位置。假設在 未設置有第一測距感測器5之情形中,則需要:在開始描繪之前將描繪頭41相對於基板9於主掃描方向掃描一定距離,並使用第二測距感測器412的輸出取得開始描繪位置中的表面高度位置。相對於此,在描繪裝置1中,能使用第一測距感測器5的資訊使描繪頭41位於開始描繪位置後立即開始描繪,從而能提升描繪裝置1的處理量。 The first distance measuring sensor 5 is provided, thereby eliminating the need for the following action: using the second distance measuring sensor 412 of the drawing head 41 to measure the surface height position at the starting drawing position before starting drawing. Assuming that the first distance measuring sensor 5 is not provided, it is necessary to scan the drawing head 41 relative to the substrate 9 in the main scanning direction for a certain distance before starting drawing, and use the output of the second distance measuring sensor 412 to obtain the surface height position at the starting drawing position. In contrast, in the drawing device 1, the information of the first distance measuring sensor 5 can be used to make the drawing head 41 start drawing immediately after it is located at the starting drawing position, thereby increasing the processing capacity of the drawing device 1.

如圖4B所示,在描繪裝置1中,與朝第一台21a上的第一基板9之描繪(步驟S16)並行地,從位於搬入搬出位置的第二台21b搬出描繪完畢的第二基板9,並將新的第二基板9搬入並保持於第二台21b上(步驟S21、S22)。接著,藉由第二移動機構22b將第二台21b朝+Y方向移動,並與步驟S13、S14同樣地藉由拍攝控制部111的控制取得第二基板9的對準資訊,且與此動作大致並行地取得預對焦資訊(步驟S23、S24)。這些動作係在下述情形中亦同樣:在針對第一基板9的說明中,將第一基板9置換成第二基板9,將第一台21a置換成第二台21b,將第一移動機構22a置換成第二移動機構22b,將第一拍攝位置置換成第二拍攝位置。 As shown in FIG. 4B , in the drawing device 1, in parallel with drawing on the first substrate 9 on the first stage 21a (step S16), the second substrate 9 after drawing is unloaded from the second stage 21b located at the loading and unloading position, and a new second substrate 9 is loaded and held on the second stage 21b (steps S21, S22). Then, the second stage 21b is moved in the +Y direction by the second moving mechanism 22b, and the alignment information of the second substrate 9 is obtained by the control of the shooting control unit 111 in the same manner as steps S13 and S14, and pre-focus information is obtained substantially in parallel with this operation (steps S23, S24). These actions are also the same in the following situations: in the description of the first substrate 9, the first substrate 9 is replaced by the second substrate 9, the first stage 21a is replaced by the second stage 21b, the first moving mechanism 22a is replaced by the second moving mechanism 22b, and the first shooting position is replaced by the second shooting position.

亦即,如圖9所示,藉由拍攝控制部111的控制將第二基板9移動至處理位置,一邊將第二基板9於+Y方向移動一邊在對準標記位於對準攝影機31的下方的瞬間進行拍攝,並藉由位置檢測部112取得第二基板9的對準資訊(步驟S23)。接著,進行第二基板9用的描繪資料的校正(亦即對準處理)。 That is, as shown in FIG9 , the second substrate 9 is moved to the processing position by the control of the shooting control unit 111, and the second substrate 9 is moved in the +Y direction while shooting at the moment when the alignment mark is located below the alignment camera 31, and the alignment information of the second substrate 9 is obtained by the position detection unit 112 (step S23). Then, the drawing data for the second substrate 9 is corrected (i.e., alignment processing).

在第二基板9的-Y側的部位通過第一測距感測器5的下方時,第二台21b側的六個感測器要素51的輸出係被記錄至記憶部115。對焦控制部113係基於從各個感測器要素51所取得的資訊所獲得的第二基板9的上表面91的高度方向的位置的眾多的值(表面高度位置)求出最高頻度值作為預對焦資訊(步驟 S24)。預對焦資訊係顯示開始描繪時所對應的描繪位置中的第二基板9的上表面91的高度方向的位置(表面高度位置)。 When the -Y side of the second substrate 9 passes under the first ranging sensor 5, the outputs of the six sensor elements 51 on the second stage 21b side are recorded in the memory unit 115. The focus control unit 113 obtains the highest frequency value as pre-focus information based on the numerous values (surface height positions) of the height direction position of the upper surface 91 of the second substrate 9 obtained from the information obtained from each sensor element 51 (step S24). The pre-focus information is the height direction position (surface height position) of the upper surface 91 of the second substrate 9 in the drawing position corresponding to the start of drawing.

當在對被第一台21a(第一基板保持部)保持的第一基板9描繪圖案的期間結束從第二基板9取得對準資訊以及預對焦資訊時,藉由第二移動機構22b使第二台21b進一步地朝+Y方向移動並如圖10所示位於待機位置(步驟S25)。在圖10的狀態下,對第一基板9進行描繪。第二台21b係在待機位置待機直至結束對於第一基板9的描繪為止。 When the alignment information and pre-focus information are obtained from the second substrate 9 during the period of drawing the pattern on the first substrate 9 held by the first stage 21a (first substrate holding part), the second stage 21b is further moved in the +Y direction by the second moving mechanism 22b and is located at the standby position as shown in Figure 10 (step S25). In the state of Figure 10, the first substrate 9 is drawn. The second stage 21b waits at the standby position until the drawing of the first substrate 9 is completed.

當結束對於第一基板9的描繪時,描繪頭41係移動至第二描繪位置,對準攝影機31係移動至第一拍攝位置。接著,如參照圖4A所說明般,開始對於第二基板9的描繪(步驟S26),在對於第二基板9的描繪的期間進行第一基板9的搬出與下一個第一基板9的搬入(步驟S11、S12)以及第一基板9的對準資訊與預對焦資訊的取得(步驟S13、S14),並使第一基板9位於待機位置(步驟S15)。 When the drawing of the first substrate 9 is completed, the drawing head 41 moves to the second drawing position, and the alignment camera 31 moves to the first shooting position. Then, as described with reference to FIG. 4A, the drawing of the second substrate 9 begins (step S26), and during the drawing of the second substrate 9, the first substrate 9 is moved out and the next first substrate 9 is moved in (steps S11, S12), and the alignment information and pre-focus information of the first substrate 9 are obtained (steps S13, S14), and the first substrate 9 is placed in the standby position (step S15).

在開始對於第二基板9的描繪時,亦利用藉由第一測距感測器5在步驟S24所取得的預對焦資訊,實現迅速地開始自動對焦控制。此種動作在第一基板9之情形亦同樣。設置第一測距感測器5,藉此無須下述動作:在開始描繪之前使用描繪頭41的第二測距感測器412測量開始描繪位置中的表面高度位置。結果,能使描繪頭41位於第二描繪位置後立即開始描繪,從而能提升描繪裝置1的處理量。 When the second substrate 9 is started to be drawn, the pre-focus information obtained by the first distance sensor 5 in step S24 is also used to quickly start the auto focus control. This action is also the same for the first substrate 9. The first distance sensor 5 is provided, so that the following action is not required: using the second distance sensor 412 of the drawing head 41 to measure the surface height position in the starting drawing position before starting the drawing. As a result, the drawing head 41 can start drawing immediately after being located at the second drawing position, thereby improving the processing capacity of the drawing device 1.

圖12係顯示描繪裝置1的拍攝部3以及第一測距感測器5的構造的其他例子之俯視圖。圖12係顯示設置於第一高架部72的構造,描繪裝置1的其他構造係與圖1相同。 FIG. 12 is a top view showing another example of the structure of the camera unit 3 and the first distance measuring sensor 5 of the depicting device 1. FIG. 12 shows the structure provided on the first elevated portion 72, and the other structures of the depicting device 1 are the same as those of FIG. 1 .

於圖12的第一高架部72的樑部設置有於X方向延伸的攝影機位置 切換部32。攝影機位置切換部32係將攝影機基座33如箭頭34所示般於X方向移動。於攝影機基座33設置有兩個對準攝影機31。一個對準攝影機31係經由攝影機位置調整部35安裝於攝影機基座33。攝影機位置調整部35係將對準攝影機31相對於攝影機基座33於X方向相對性地移動。攝影機位置調整部35亦可採用各種機構,例如使用線性伺服馬達或者於滾珠螺桿安裝有馬達的機構。 A camera position switching section 32 extending in the X direction is provided on the beam of the first elevated section 72 in FIG. 12. The camera position switching section 32 moves the camera base 33 in the X direction as indicated by the arrow 34. Two alignment cameras 31 are provided on the camera base 33. One alignment camera 31 is mounted on the camera base 33 via a camera position adjusting section 35. The camera position adjusting section 35 moves the alignment camera 31 relative to the camera base 33 in the X direction. The camera position adjusting section 35 can also adopt various mechanisms, such as a linear servo motor or a mechanism in which a motor is mounted on a ball screw.

藉由攝影機位置調整部35變更兩個對準攝影機31的間隔。此外,藉由攝影機位置切換部32,兩個對準攝影機31的位置係在第一拍攝位置與第二拍攝位置之間切換,第一拍攝位置為與第一台21a以及第一基板9對向(正確來說與第一移動機構22a對向)之位置,第二拍攝位置為與第二台21b以及第二基板9對向(正確來說與第二移動機構22b對向)。此外,在圖1的說明中雖然已經簡化,攝影機基座33以及攝影機位置調整部35亦設置於圖1的描繪裝置1。攝影機基座33亦可視為攝影機位置切換部32的一部分。在對準攝影機31的數量為一個之情形中,未設置有攝影機位置調整部35。在對準攝影機31為三個以上之情形中,亦可於將一個對準攝影機31除外之其他的全部的對準攝影機31個別地設置攝影機位置調整部35。此外,即使對準攝影機31的數量為兩個以上,全部的對準攝影機31的位置亦可相對於攝影機基座33被固定。 The distance between the two alignment cameras 31 is changed by the camera position adjustment unit 35. In addition, the positions of the two alignment cameras 31 are switched between a first shooting position and a second shooting position by the camera position switching unit 32. The first shooting position is a position opposite to the first stage 21a and the first substrate 9 (to be more precise, opposite to the first moving mechanism 22a), and the second shooting position is a position opposite to the second stage 21b and the second substrate 9 (to be more precise, opposite to the second moving mechanism 22b). In addition, although the description of FIG. 1 has been simplified, the camera base 33 and the camera position adjustment unit 35 are also provided in the drawing device 1 of FIG. 1. The camera base 33 can also be regarded as a part of the camera position switching unit 32. In the case where the number of the alignment camera 31 is one, the camera position adjustment unit 35 is not provided. In the case where the number of the alignment cameras 31 is three or more, the camera position adjustment unit 35 may be provided individually for all the alignment cameras 31 except for one alignment camera 31. In addition, even if the number of the alignment cameras 31 is two or more, the positions of all the alignment cameras 31 may be fixed relative to the camera base 33.

與圖1之情形不同,在圖12中第一測距感測器5係被固定於攝影機基座33。在圖12的例子中,第一測距感測器5的六個感測器要素51係被固定於攝影機基座33。較佳為,感測器要素51的X方向的間隔亦即X方向的間距係與描繪頭41的X方向的間距相同。當然,感測器要素51的X方向的間距亦可與描繪頭41的X方向的間距不同。感測器要素51的數量較佳為與描繪頭41的數量相同,然而亦可不同。感測器要素51的數量較佳為兩個以上,然而亦可為一個。 Unlike the case of FIG. 1 , in FIG. 12 , the first distance measuring sensor 5 is fixed to the camera base 33. In the example of FIG. 12 , the six sensor elements 51 of the first distance measuring sensor 5 are fixed to the camera base 33. Preferably, the spacing of the sensor elements 51 in the X direction, that is, the spacing in the X direction is the same as the spacing in the X direction of the drawing head 41. Of course, the spacing in the X direction of the sensor elements 51 may also be different from the spacing in the X direction of the drawing head 41. The number of sensor elements 51 is preferably the same as the number of the drawing head 41, but it may be different. The number of sensor elements 51 is preferably two or more, but it may also be one.

具有圖12所示的構造的描繪裝置1的動作係將第一測距感測器5與對準攝影機31一起於X方向移動之點除外,與參照圖4A以及圖4B所說明的動作同樣。亦即,在對第二基板9描繪圖案的期間(步驟S26),進行第一基板9的搬出以及搬入(步驟S11、S12),進行對準資訊與預對焦資訊的取得(步驟S13、S14),並使第一基板9於待機位置待機直至結束對於第二基板9的圖案的描繪(步驟S15)。接著,當結束對於第二基板9的圖案的描繪時,描繪頭41係從第二描繪位置朝第一描繪位置移動,與此同時對準攝影機31係從第一拍攝位置朝第二拍攝位置移動。藉此,第一測距感測器5亦從與第一移動機構22a對向之位置(測量時與第一台21a以及第一基板9對向之位置)朝與第二移動機構22b對向之位置(測量時與第二台21b以及第二基板9對向之位置)移動。 The operation of the drawing device 1 having the structure shown in FIG12 is the same as the operation described with reference to FIG4A and FIG4B except that the first distance measuring sensor 5 is moved in the X direction together with the alignment camera 31. That is, during the period of drawing the pattern on the second substrate 9 (step S26), the first substrate 9 is carried out and carried in (steps S11 and S12), the alignment information and the pre-focus information are obtained (steps S13 and S14), and the first substrate 9 is made to wait at the standby position until the drawing of the pattern on the second substrate 9 is completed (step S15). Next, when the drawing of the pattern on the second substrate 9 is completed, the drawing head 41 moves from the second drawing position to the first drawing position, and at the same time, the alignment camera 31 moves from the first shooting position to the second shooting position. Thus, the first distance sensor 5 also moves from the position opposite to the first moving mechanism 22a (the position opposite to the first stage 21a and the first substrate 9 during measurement) to the position opposite to the second moving mechanism 22b (the position opposite to the second stage 21b and the second substrate 9 during measurement).

之後,在對第一基板9描繪圖案的期間(步驟S16),進行第二基板9的搬出以及搬入(步驟S21、S22),進行對準資訊與預對焦資訊的取得(步驟S23、S24),並使第二基板9於待機位置待機直至結束對於第一基板9的圖案的描繪(步驟S25)。當結束對於第一基板9的圖案的描繪時,描繪頭41係從第一描繪位置朝第二描繪位置移動,與此同時對準攝影機31係從第二拍攝位置朝第一拍攝位置移動。藉此,第一測距感測器5亦從與第二移動機構22b對向之位置朝與第一移動機構22a對向之位置移動。在開始對第一基板9以及第二基板9進行描繪時,如上所述利用事先所取得的預對焦資訊。藉此,能提升描繪裝置1的處理量。 After that, while the pattern is being drawn on the first substrate 9 (step S16), the second substrate 9 is carried out and brought in (steps S21 and S22), alignment information and pre-focus information are obtained (steps S23 and S24), and the second substrate 9 is made to wait at the standby position until the drawing of the pattern on the first substrate 9 is completed (step S25). When the drawing of the pattern on the first substrate 9 is completed, the drawing head 41 moves from the first drawing position to the second drawing position, and at the same time, the alignment camera 31 moves from the second shooting position to the first shooting position. Thereby, the first distance measuring sensor 5 also moves from the position opposite to the second moving mechanism 22b to the position opposite to the first moving mechanism 22a. When the first substrate 9 and the second substrate 9 are started to be drawn, the pre-focus information obtained in advance is used as described above. This can improve the processing capacity of the drawing device 1.

圖1以及圖12所示的第一測距感測器5(在第一測距感測器5包含複數個感測器要素51之情形中為各個感測器要素51(以下相同))並未限定於擴散反射方式的感測器。例如,在可能的範圍內亦可採用正反射方式或者其他的方式。擴散反射方式的感測器係能價格便宜地取得,另一方面在使用於測量之光線相 對於測量對象之透過率高之情形中,會有無法進行與透過率低之情形同等的測量之缺點。因此,在使用於測量之光線相對於測量對象之透過率高之情形中,如圖13所示,於描繪裝置1的對焦控制部113設置有校正部12,校正部12係校正從藉由第一測距感測器5所取得的第一測距感測器5(的各個感測器要素51)至基板9上的測量位置為止的距離。亦即,校正所測量的表面高度位置。在上述實施形態之情形中,校正部12係校正預對焦資訊。此外,在圖13中僅顯示對焦控制部113以及第一測距感測器5,省略其他的構成要素的圖示。 The first distance measuring sensor 5 shown in FIG. 1 and FIG. 12 (in the case where the first distance measuring sensor 5 includes a plurality of sensor elements 51, each sensor element 51 (hereinafter the same)) is not limited to a diffuse reflection type sensor. For example, a regular reflection type or other types may be used within a possible range. A diffuse reflection type sensor is available at a low price, but on the other hand, when the transmittance of the light used for measurement is high relative to the measurement object, there is a disadvantage that the same measurement cannot be performed as when the transmittance is low. Therefore, in the case where the transmittance of the light used for measurement is high relative to the measurement object, as shown in FIG13, a correction unit 12 is provided in the focus control unit 113 of the drawing device 1, and the correction unit 12 corrects the distance from the first distance sensor 5 (each sensor element 51) obtained by the first distance sensor 5 to the measurement position on the substrate 9. That is, the measured surface height position is corrected. In the case of the above-mentioned implementation form, the correction unit 12 corrects the pre-focus information. In addition, FIG13 only shows the focus control unit 113 and the first distance sensor 5, and the illustrations of other components are omitted.

校正係在用以形成基板9的表面以及基板9的表面附近之材料相對於從第一測距感測器5射出的光線的波長之透過率為50%以上之情形時進行,較佳為在透過率為60%以上之情形時進行,更佳為在透過率為70%以上之情形時進行。用以形成基板9的表面以及基板9的表面附近之材料為形成有阻劑膜的蘇打石灰玻璃(soda lime glass)或者形成有阻劑膜的乾膜(例如聚對苯二甲酸乙二酯(polyethylene terephthalate))。亦可於阻劑膜上進一步存在有保護膜。當然,需要校正的材料並未限定於這些材料。從第一測距感測器5射出的光線的波長係只要為不會對用以形成基板9的上表面91之感光材料造成影響之波長即可。較佳為波長600nm以上的可視光或者紅外線。波長例如為660nm。 The calibration is performed when the transmittance of the material used to form the surface of the substrate 9 and the vicinity of the surface of the substrate 9 relative to the wavelength of the light emitted from the first ranging sensor 5 is 50% or more, preferably when the transmittance is 60% or more, and more preferably when the transmittance is 70% or more. The material used to form the surface of the substrate 9 and the vicinity of the surface of the substrate 9 is soda lime glass formed with a resist film or a dry film (such as polyethylene terephthalate) formed with a resist film. A protective film may further exist on the resist film. Of course, the materials that need to be calibrated are not limited to these materials. The wavelength of the light emitted from the first ranging sensor 5 only needs to be a wavelength that does not affect the photosensitive material used to form the upper surface 91 of the substrate 9. Visible light or infrared light with a wavelength of 600nm or more is preferred. For example, the wavelength is 660nm.

在需要校正部12進行校正之情形中,例如預先藉由校正作業求出用以顯示第一測距感測器5的輸出與距離之間的關係之函數(或者用以顯示輸出與表面高度位置之間的關係之函數),校正部12係將第一測距感測器5的輸出應用於此函數,藉此求出第一測距感測器5與基板9之間的距離。函數係較佳為一次函數。藉由設置校正部12,即使在用以形成基板9的表面之材料相對於使用於測量的光線具有透過性之情形中,亦能利用擴散方式的感測器作為第一測距感測 器5。 In the case where the calibration unit 12 is required to perform calibration, for example, a function for displaying the relationship between the output of the first distance sensor 5 and the distance (or a function for displaying the relationship between the output and the height position of the surface) is obtained in advance by calibration work, and the calibration unit 12 applies the output of the first distance sensor 5 to this function to obtain the distance between the first distance sensor 5 and the substrate 9. The function is preferably a linear function. By providing the calibration unit 12, even in the case where the material used to form the surface of the substrate 9 is transparent to the light used for measurement, a diffusion type sensor can be used as the first distance sensor 5.

在上述描繪裝置1中能夠進行各種變更。 Various changes can be made in the above-mentioned drawing device 1.

描繪頭41並未限定於用以射出被空間調變成二維的光線,亦可射出於與主掃描方向交叉的方向延伸之線狀且被空間調變成一維的光線。再者,描繪頭41亦可射出點狀的光線,並一邊將該光線於與主掃描交叉的方向掃描一邊調變該光線。作為描繪頭41,能夠採用用以射出經過調變的光線之各種形態的描繪頭。 The drawing head 41 is not limited to emitting light that is spatially modulated into two dimensions, but may also emit linear light that extends in a direction intersecting the main scanning direction and is spatially modulated into one dimension. Furthermore, the drawing head 41 may also emit point-shaped light and modulate the light while scanning the light in a direction intersecting the main scanning direction. As the drawing head 41, various types of drawing heads that emit modulated light may be used.

用以保持基板9之基板保持部並未限定於第一台21a以及第二台21b這種台狀的基板保持部。作為用以保持第一基板9之第一基板保持部以及用以保持第二基板9之第二基板保持部,能夠採用各種形狀的基板保持部。例如,第一基板保持部以及第二基板保持部亦可以爪狀的構件來保持基板9的外緣部,亦可吸附保持基板9的下表面的中央。 The substrate holding part for holding the substrate 9 is not limited to the first stage 21a and the second stage 21b. As the first substrate holding part for holding the first substrate 9 and the second substrate holding part for holding the second substrate 9, substrate holding parts of various shapes can be used. For example, the first substrate holding part and the second substrate holding part can also hold the outer edge of the substrate 9 with a claw-shaped component, or can adsorb and hold the center of the lower surface of the substrate 9.

移動機構2並未限定於上述實施形態所示的移動機構。移動機構2係在藉由從描繪頭41射出的光線對被第一基板保持部保持的第一基板9描繪圖案的期間將描繪頭41相對於第一基板保持部相對性地移動,在藉由從描繪頭41射出的光線對被第二基板保持部保持的第二基板9描繪圖案的期間將描繪頭41相對於第二基板保持部相對性地移動。在此,由於較佳為獨立地進行對第一基板9進行描繪時的第一基板9的移動以及對第二基板9測量時的第二基板9的移動,因此移動機構2較佳為包含:第一基板移動機構(廣義的定義,與上述第一移動機構22a不同),係將第一基板9相對於描繪頭41以及第一測距感測器5相對性地水平地移動;以及第二基板移動機構(廣義的定義,與上述第二移動機構22b不同),係與第一基板移動機構獨立,用以將第二基板9相對於描繪頭41以及第一測 距感測器5相對性地水平地移動。 The moving mechanism 2 is not limited to the moving mechanism shown in the above-mentioned embodiment. The moving mechanism 2 relatively moves the drawing head 41 relative to the first substrate holding portion while the light emitted from the drawing head 41 draws a pattern on the first substrate 9 held by the first substrate holding portion, and relatively moves the drawing head 41 relative to the second substrate holding portion while the light emitted from the drawing head 41 draws a pattern on the second substrate 9 held by the second substrate holding portion. Here, since it is preferred to independently move the first substrate 9 when drawing on the first substrate 9 and to independently move the second substrate 9 when measuring the second substrate 9, the moving mechanism 2 preferably includes: a first substrate moving mechanism (broadly defined, different from the first moving mechanism 22a described above), which moves the first substrate 9 horizontally relative to the drawing head 41 and the first distance sensor 5; and a second substrate moving mechanism (broadly defined, different from the second moving mechanism 22b described above), which is independent of the first substrate moving mechanism and is used to relatively move the second substrate 9 horizontally relative to the drawing head 41 and the first distance sensor 5.

再者,由於較佳為在描繪中盡可能地固定描繪頭41的位置並將描繪頭41與第一基板9以及第二基板9之間的位置偏移抑制在最小限度,因此第一基板移動機構較佳為如圖1所示般包含用以使第一基板9朝主掃描方向直線前進之第一移動機構22a,第二基板移動機構亦較佳為包含用以使第二基板9朝主掃描方向直線前進之第二移動機構22b。 Furthermore, since it is preferred to fix the position of the drawing head 41 as much as possible during drawing and to minimize the positional deviation between the drawing head 41 and the first substrate 9 and the second substrate 9, the first substrate moving mechanism preferably includes a first moving mechanism 22a for moving the first substrate 9 in a straight line in the main scanning direction as shown in FIG. 1, and the second substrate moving mechanism also preferably includes a second moving mechanism 22b for moving the second substrate 9 in a straight line in the main scanning direction.

在圖1的例子中,雖然將基板9的位置作為「搬入搬出位置」、「處理位置」以及「待機位置」的任一者進行說明,然而亦可為例如「搬入搬出位置」與「待機位置」為相同的位置。再者,根據用以進行基板9的搬入以及搬出之機器人的構造,「搬入搬出位置」與「處理位置」亦可重疊。在此情形中,基板9亦可僅在描繪時的移動範圍內移動。 In the example of FIG. 1 , the position of the substrate 9 is described as any one of the "carry-in/carry-out position", the "processing position" and the "standby position", but the "carry-in/carry-out position" and the "standby position" may be the same position. Furthermore, depending on the structure of the robot used to carry in and out the substrate 9, the "carry-in/carry-out position" and the "processing position" may overlap. In this case, the substrate 9 may also move only within the moving range during drawing.

在圖1的例子中,藉由用以使描繪頭41於X方向移動之描繪頭移動機構42,將描繪頭41在與第一基板保持部對向之位置以及與第二基板保持部對向之位置之間切換。因此,移動機構2係概念性地包含頭位置切換部,該頭位置切換部係將描繪頭41在與第一基板保持部對向之位置以及與第二基板保持部對向之位置之間切換。頭位置切換部亦可與用以在描繪時將描繪頭朝X方向移動之機構分開地設置。因此,移動機構2係包含第一基板移動機構、第二基板移動機構以及頭位置切換部。 In the example of FIG. 1 , the drawing head 41 is switched between a position opposite to the first substrate holding portion and a position opposite to the second substrate holding portion by a drawing head moving mechanism 42 for moving the drawing head 41 in the X direction. Therefore, the moving mechanism 2 conceptually includes a head position switching unit that switches the drawing head 41 between a position opposite to the first substrate holding portion and a position opposite to the second substrate holding portion. The head position switching unit may also be provided separately from the mechanism for moving the drawing head in the X direction during drawing. Therefore, the moving mechanism 2 includes a first substrate moving mechanism, a second substrate moving mechanism, and a head position switching unit.

第一測距感測器5係在對被第二基板保持部保持的第二基板9描繪圖案的期間與被第一基板保持部保持的第一基板9對向並取得與第一基板9上的測量位置之間的距離,並在對被第一基板保持部保持的第一基板9描繪圖案的期間與被第二基板保持部保持的第二基板9對向並取得與第二基板9上的測量位 置之間的距離。為了實現此種動作,在圖1中,第一測距感測器5係包含在第一基板保持部的上方處絕對位置被固定的感測器要素51以及在第二基板保持部的上方處絕對位置被固定的感測器要素51。在此,所謂「絕對位置」係指相對於設置有描繪裝置1的框架7的空間(亦即隔間)之位置。此外,感測器要素51的絕對位置亦可藉由感測器要素5固定於高架部74以外的部位而實現。 The first distance measuring sensor 5 faces the first substrate 9 held by the first substrate holding part and obtains the distance between the first substrate 9 and the measurement position on the first substrate 9 during the period of drawing the pattern on the second substrate 9 held by the second substrate holding part, and faces the second substrate 9 held by the second substrate holding part and obtains the distance between the measurement position on the second substrate 9 during the period of drawing the pattern on the first substrate 9 held by the first substrate holding part. In order to realize such an action, in FIG. 1, the first distance measuring sensor 5 includes a sensor element 51 fixed at an absolute position above the first substrate holding part and a sensor element 51 fixed at an absolute position above the second substrate holding part. Here, the so-called "absolute position" refers to the position relative to the space (i.e., the compartment) of the frame 7 where the drawing device 1 is set. In addition, the absolute position of the sensor element 51 can also be achieved by fixing the sensor element 5 to a location other than the elevated portion 74.

藉由固定感測器要素51的絕對位置,能將感測器要素51所取得的距離的誤差抑制的很小,從而能容易地利用於自動對焦控制。在固定感測器要素51的絕對位置之情形中,雖然感測器要素51的數量變得比圖12的情形還多,然而由於感測器要素51為價格便宜的感測器,因此裝置製造成本不會大幅地增加。 By fixing the absolute position of the sensor element 51, the error of the distance obtained by the sensor element 51 can be suppressed to a very small level, so that it can be easily used for autofocus control. In the case of fixing the absolute position of the sensor element 51, although the number of sensor elements 51 becomes larger than that in the case of FIG. 12, since the sensor element 51 is a cheap sensor, the manufacturing cost of the device will not increase significantly.

絕對位置被固定於第一基板保持部(在圖1的情形中為第一台21a)之感測器要素51的數量係可為一個,亦可為兩個以上。絕對位置被固定於第二基板保持部(在圖1的情形中為第二台21b)的上方之感測器要素51的數量係可為一個,亦可為兩個以上。在圖1的例子的情形中,感測器要素51的最小數量為兩個。 The number of sensor elements 51 whose absolute position is fixed to the first substrate holding part (the first stage 21a in the case of FIG. 1) can be one or more. The number of sensor elements 51 whose absolute position is fixed above the second substrate holding part (the second stage 21b in the case of FIG. 1) can be one or more. In the case of the example of FIG. 1, the minimum number of sensor elements 51 is two.

在同時與一個基板9對向的感測器要素51的數量為兩個以上之情形中,所謂第一測距感測器5取得第一測距感測器5與基板9上的測量位置之間的距離係指取得各個感測器要素51與基板9上對應的測量位置之間的距離。在與一個基板9對向的感測器要素51的數量為一個之情形中,所謂第一測距感測器5取得第一測距感測器5與基板9上的測量位置之間的距離係指取得一個感測器要素51與基板9上對應的測量位置之間的距離。 In the case where there are two or more sensor elements 51 facing one substrate 9 at the same time, the first distance sensor 5 obtaining the distance between the first distance sensor 5 and the measurement position on the substrate 9 means obtaining the distance between each sensor element 51 and the corresponding measurement position on the substrate 9. In the case where there is one sensor element 51 facing one substrate 9, the first distance sensor 5 obtaining the distance between the first distance sensor 5 and the measurement position on the substrate 9 means obtaining the distance between one sensor element 51 and the corresponding measurement position on the substrate 9.

在圖12的例子的情形中,第一測距感測器5相對於作為第一台21a 的第一基板保持部以及作為第二台21b的第二基板保持部之相對位置係藉由攝影機位置切換部32而與對準攝影機31一起在與被第一基板保持部保持的第一基板9對向之位置與被第二基板保持部保持的第二基板9對向之位置之間切換。在此情形中,第一測距感測器5的感測器要素51的數量的最小數量為一個。此外,第一測距感測器5只要與對準攝影機31一起移動,則亦可被固定於攝影機基座33以外的部位。攝影機位置切換部32係只要為在與被第一基板保持部保持的第一基板9對向之位置與被第二基板保持部保持的第二基板9對向之位置之間切換對準攝影機31相對於第一基板保持部以及第二基板保持部之相對位置之構造,則亦可採用各種構造。 In the case of the example of FIG. 12 , the relative position of the first distance measuring sensor 5 relative to the first substrate holding portion as the first stage 21a and the second substrate holding portion as the second stage 21b is switched between the position opposite to the first substrate 9 held by the first substrate holding portion and the position opposite to the second substrate 9 held by the second substrate holding portion together with the alignment camera 31 by the camera position switching portion 32. In this case, the minimum number of sensor elements 51 of the first distance measuring sensor 5 is one. In addition, the first distance measuring sensor 5 can also be fixed to a position other than the camera base 33 as long as it moves together with the alignment camera 31. The camera position switching unit 32 may have various structures as long as it switches the relative position of the camera 31 relative to the first substrate holding unit and the second substrate holding unit between the position opposite to the first substrate 9 held by the first substrate holding unit and the position opposite to the second substrate 9 held by the second substrate holding unit.

在上述描繪裝置1中,對焦控制部113係利用第一測距感測器5所取得的預對焦資訊,藉此實現下述動作:預先將描繪頭41的對焦位置(影像高度位置)接近至基板9的表面的位置(表面高度位置),當描繪頭41配置於第一描繪位置或者第二描繪位置時,立即一邊進行自動對焦控制一邊開始圖案的描繪。然而,第一測距感測器5所取得的資訊並未限定於上述方式所取得的預對焦資訊。 In the above-mentioned drawing device 1, the focus control unit 113 uses the pre-focus information obtained by the first distance sensor 5 to implement the following actions: the focus position (image height position) of the drawing head 41 is preliminarily brought close to the position (surface height position) of the surface of the substrate 9, and when the drawing head 41 is arranged at the first drawing position or the second drawing position, the drawing of the pattern is immediately started while performing automatic focus control. However, the information obtained by the first distance sensor 5 is not limited to the pre-focus information obtained in the above-mentioned manner.

例如,在上述實施形態中,雖然取得開始最初的主掃描之位置中的表面高度位置,然而亦可取得開始+Y方向以及-Y方向的全部的主掃描之位置中的表面高度位置。再者,亦可藉由第一測距感測器5預先取得全部的主掃描的全長中的表面高度位置的變動,並在一邊利用第二測距感測器412一邊描繪圖案時利用此種資訊。例如,亦可在各個主掃描中藉由第一測距感測器5預先檢測利用第二測距感測器412之自動對焦控制可能會錯誤之位置,並利用於防止描繪時的控制錯誤。不論在哪種情形中,第一測距感測器5所為的測量皆在上述步驟S14、S24進行。如上所述,對焦控制部113亦可一邊將在圖案的描繪之前藉由第 一測距感測器5從基板9所取得的資訊以及在對該基板9描繪圖案的期間藉由第二測距感測器412所取得的資訊作為各種態樣來利用,一邊控制對焦變更部413。 For example, in the above-mentioned embodiment, although the surface height position is obtained at the position where the first main scan is started, the surface height position may be obtained at the position where all the main scans in the +Y direction and the -Y direction are started. Furthermore, the change of the surface height position in the entire length of all the main scans may be obtained in advance by the first ranging sensor 5, and this information may be used when drawing a pattern while using the second ranging sensor 412. For example, the position where the auto focus control using the second ranging sensor 412 may be wrong may be detected in advance by the first ranging sensor 5 in each main scan, and used to prevent control errors during drawing. In either case, the measurement performed by the first ranging sensor 5 is performed in the above-mentioned steps S14 and S24. As described above, the focus control unit 113 can also control the focus changing unit 413 while using the information obtained from the substrate 9 by the first distance sensor 5 before the pattern is drawn and the information obtained by the second distance sensor 412 during the pattern drawing on the substrate 9 as various forms.

對焦控制部113係利用來自第一測距感測器5的資訊以及來自第二測距感測器412的資訊,藉此在對被一方的基板保持部保持的基板9描繪圖案的期間預先藉由第一測距感測器5從被另一方的基板保持部保持的基板9取得資訊,並在對被該另一方的基板保持部保持的基板9進行圖案的描繪時利用第一測距感測器5所取得的資訊,藉此能效率佳地進行描繪圖案時的對焦控制,從而能提升處理量。 The focus control unit 113 uses information from the first distance sensor 5 and information from the second distance sensor 412, thereby obtaining information from the substrate 9 held by the other substrate holding unit in advance through the first distance sensor 5 during the period of drawing a pattern on the substrate 9 held by the substrate holding unit of one party, and using the information obtained by the first distance sensor 5 when drawing a pattern on the substrate 9 held by the substrate holding unit of the other party, thereby efficiently performing focus control when drawing a pattern, thereby improving the processing volume.

在上述實施形態中,雖然藉由第一測距感測器5在開始描繪位置附近進行測量並取得感測器要素51與基板9之間的距離的最高頻度值作為預對焦資訊,然而預對焦資訊亦可為距離的平均值或者中央值。即使是這些資訊,在描繪頭41開始對被第一基板保持部或者第二基板保持部保持的基板9描繪圖案之前,預對焦控制部113亦能使用藉由第一測距感測器5所取得的資訊將從描繪頭41射出的光線的對焦位置(影像高度位置)接近至開始描繪時的基板9的表面高度位置。 In the above-mentioned embodiment, although the first distance measuring sensor 5 measures near the start drawing position and obtains the highest frequency value of the distance between the sensor element 51 and the substrate 9 as pre-focus information, the pre-focus information may also be an average value or a central value of the distance. Even with this information, before the drawing head 41 starts drawing a pattern on the substrate 9 held by the first substrate holding portion or the second substrate holding portion, the pre-focus control unit 113 can use the information obtained by the first distance measuring sensor 5 to bring the focus position (image height position) of the light emitted from the drawing head 41 close to the surface height position of the substrate 9 when drawing starts.

在圖1的例子之情形中,較佳為第一測距感測器5的感測器要素51的數量為描繪頭41的數量的兩倍。藉此,能取得各個描繪頭41開始描繪之位置中的描繪頭41與基板9之間的距離。在圖12的例子之情形中,較佳為第一測距感測器5的感測器要素51的數量係與描繪頭41的數量相同。然而,第一測距感測器5的感測器要素51的數量並未限定於上述例子。即使在感測器要素51的測量位置未與描繪頭41的開始描繪位置一致之情形中,例如將複數個感測器要素51的測 量值予以線性內插(linear interpolation),藉此能取得各個描繪頭41的開始描繪位置中的描繪頭41與基板9之間的距離(或者表面高度位置)。 In the case of the example of FIG. 1 , it is preferable that the number of sensor elements 51 of the first distance measuring sensor 5 is twice the number of the drawing heads 41. In this way, the distance between the drawing head 41 and the substrate 9 at the position where each drawing head 41 starts drawing can be obtained. In the case of the example of FIG. 12 , it is preferable that the number of sensor elements 51 of the first distance measuring sensor 5 is the same as the number of the drawing heads 41. However, the number of sensor elements 51 of the first distance measuring sensor 5 is not limited to the above example. Even in the case where the measurement position of the sensor element 51 does not coincide with the starting position of the drawing head 41, for example, the measurement values of a plurality of sensor elements 51 are linearly interpolated, thereby obtaining the distance between the drawing head 41 and the substrate 9 at the starting position of each drawing head 41 (or the surface height position).

在描繪裝置1中,第一搬運機構2a亦可進一步具備下述一個以上的構件:移動機構,係將第一基板保持部(第一台21a)於X方向移動;旋轉機構,係以於Z方向延伸的旋轉軸作為中心旋轉第一基板保持部;以及升降機構,係將第一基板保持部於Z方向移動。作為該移動機構以及升降機構,能夠利用例如線性伺服馬達。此外,作為該旋轉機構,能夠利用例如伺服馬達。該移動機構、旋轉機構以及升降機構亦可進行各種變更。第二搬運機構2b亦與第一搬運機構2a同樣。 In the drawing device 1, the first transport mechanism 2a may further have one or more of the following components: a moving mechanism that moves the first substrate holding part (first stage 21a) in the X direction; a rotating mechanism that rotates the first substrate holding part around a rotating shaft extending in the Z direction; and a lifting mechanism that moves the first substrate holding part in the Z direction. As the moving mechanism and the lifting mechanism, for example, a linear servo motor can be used. In addition, as the rotating mechanism, for example, a servo motor can be used. The moving mechanism, the rotating mechanism, and the lifting mechanism can also be modified in various ways. The second transport mechanism 2b is also the same as the first transport mechanism 2a.

在描繪裝置1中,基板保持部的數量亦可為三個以上。在此情形中,較佳為同時被利用於同一個基板9的描繪時之一個以上的描繪頭41(以下稱為「描繪頭群」)的數量為未滿基板保持部的數量(且為一個以上),同時被利用於同一個基板9的拍攝時之一個以上的對準攝影機31(以下稱為「攝影機群」)的數量亦為未滿基板保持部的數量(且為一個以上),第一測距感測器5(亦即同時被利用於同一個基板9的測量時之一個以上的感測器要素51)的數量亦為未滿基板保持部的數量(且為一個以上)。各個基板保持部所執行的處理係與上述第一基板保持部以及第二基板保持部所進行的處理同樣。 In the drawing device 1, the number of substrate holding parts may be more than three. In this case, it is preferred that the number of more than one drawing heads 41 (hereinafter referred to as "drawing head group") used for drawing the same substrate 9 at the same time is less than the number of substrate holding parts (and more than one), the number of more than one alignment cameras 31 (hereinafter referred to as "camera group") used for photographing the same substrate 9 at the same time is also less than the number of substrate holding parts (and more than one), and the number of first distance measuring sensors 5 (that is, more than one sensor elements 51 used for measuring the same substrate 9 at the same time) is also less than the number of substrate holding parts (and more than one). The processing performed by each substrate holding part is the same as the processing performed by the first substrate holding part and the second substrate holding part mentioned above.

依據上述構成,藉由數量比基板保持部的數量還少的描繪頭群、數量比基板保持部的數量還少的攝影機群以及數量比基板保持部的數量還少的第一測距感測器5,能夠在對任一個基板9進行描繪的期間取得其他的基板9的對準資訊以及來自第一測距感測器5的資訊,從而能提升處理量。一般而言,由於 圖案的描繪動作需要時間,因此較佳為描繪頭群的數量比基板保持部的數量還少一個。 According to the above configuration, by using a drawing head group whose number is less than the number of substrate holding parts, a camera group whose number is less than the number of substrate holding parts, and a first distance measuring sensor 5 whose number is less than the number of substrate holding parts, it is possible to obtain the alignment information of other substrates 9 and the information from the first distance measuring sensor 5 during the drawing of any substrate 9, thereby improving the processing capacity. Generally speaking, since the drawing action of the pattern takes time, it is preferable that the number of the drawing head group is one less than the number of substrate holding parts.

上述基板9並未限定於印刷電路基板。在描繪裝置1中,亦可對例如半導體基板、液晶顯示裝置、有機EL顯示裝置等的平板面板(flat panel)顯示裝置用的玻璃基板、光罩用的玻璃基板、太陽電池面板用的基板等進行描繪。 The substrate 9 is not limited to a printed circuit substrate. In the drawing device 1, it is also possible to draw glass substrates for flat panel display devices such as semiconductor substrates, liquid crystal display devices, organic EL display devices, glass substrates for photomasks, and substrates for solar cell panels.

上述實施形態以及各變化例中的構成只要相互未矛盾則亦可適當地組合。 The above-mentioned embodiments and the configurations in the various variations can be appropriately combined as long as they do not contradict each other.

雖然已經詳細地描繪並說明本發明,然而這些說明是例示性的而非是限定性的。因此,只要未逸離本發明的範圍,則能夠認為有多種變化以及態樣。 Although the present invention has been described and illustrated in detail, these descriptions are illustrative rather than restrictive. Therefore, it is believed that there are many variations and aspects as long as they do not depart from the scope of the present invention.

1:描繪裝置 1: Drawing device

2:移動機構 2: Mobile mechanism

2a:第一搬運機構 2a: First transportation agency

2b:第二搬運機構 2b: Second transport mechanism

3:拍攝部 3: Photography Department

4:圖案描繪部 4: Pattern drawing department

5:第一測距感測器 5: First distance sensor

7:框架 7: Framework

9:基板(第一基板、第二基板) 9: Substrate (first substrate, second substrate)

10:控制部 10: Control Department

21a:第一台(第一基板保持部) 21a: First stage (first substrate holding part)

21b:第二台(第二基板保持部) 21b: Second stage (second substrate holding part)

22a:第一移動機構 22a: First moving mechanism

22b:第二移動機構 22b: Second moving mechanism

31:對準攝影機 31: Aim the camera

32:攝影機位置切換部 32: Camera position switching unit

41:描繪頭 41: Drawing head

42:描繪頭移動機構 42: Drawing head moving mechanism

51:感測器要素 51:Sensor elements

71:基台 71: Base

72:第一高架部 72: The first elevated section

73:第二高架部 73: Second elevated section

74:高架部 74: Elevated section

91:上表面 91: Upper surface

221a,221b:導軌 221a,221b:Guide rails

Claims (7)

一種描繪裝置,係對基板照射光線,藉此對前述基板描繪圖案;前述描繪裝置係具備:描繪頭,係射出經過調變的光線;第一基板保持部,係保持第一基板;第二基板保持部,係保持第二基板;移動機構,係在藉由從前述描繪頭射出的光線對被前述第一基板保持部保持的第一基板描繪圖案的期間,將前述描繪頭相對於前述第一基板保持部相對性地移動,在藉由從前述描繪頭射出的光線對被前述第二基板保持部保持的第二基板描繪圖案的期間,將前述描繪頭相對於前述第二基板保持部相對性地移動;第一測距感測器,係在對被前述第二基板保持部保持的第二基板描繪圖案的期間,與被前述第一基板保持部保持的第一基板對向並取得與前述第一基板上的測量位置之間的距離,在對被前述第一基板保持部保持的第一基板描繪圖案的期間,與被前述第二基板保持部保持的第二基板對向並取得與前述第二基板上的測量位置之間的距離;以及對焦控制部,係在圖案的描繪的期間進行用以使從前述描繪頭射出的光線的對焦位置對合至描繪有前述圖案之基板的表面的高度方向的位置之控制;前述描繪頭係包含:第二測距感測器,係取得與正在進行圖案的描繪的基板上的測量位置之間的距離;以及對焦變更部,係變更從前述描繪頭射出的光線的對焦位置; 在前述描繪頭對被前述第一基板保持部或者前述第二基板保持部的一者保持的基板進行圖案的描繪之後,在前述描繪頭對被前述第一基板保持部或者前述第二基板保持部的另一者保持的基板進行圖案的描繪之前,前述對焦控制部係使用藉由前述第一測距感測器所取得的資訊將從前述描繪頭射出的光線的對焦位置接近至開始描繪時的前述基板的表面的高度方向的位置。 A drawing device is provided for drawing a pattern on a substrate by irradiating light to the substrate; the drawing device comprises: a drawing head for emitting modulated light; a first substrate holding part for holding the first substrate; a second substrate holding part for holding the second substrate; and a moving mechanism for moving the drawing head relative to the first substrate holding part while the light emitted from the drawing head is drawing the pattern on the first substrate held by the first substrate holding part. The first distance measuring sensor is used to move the drawing head relative to the second substrate holding portion while the second substrate held by the second substrate holding portion is drawing a pattern. The first distance measuring sensor is used to move the drawing head relative to the second substrate holding portion while the second substrate held by the second substrate holding portion is drawing a pattern. The first distance measuring sensor is used to move the drawing head relative to the second substrate holding portion while the second substrate held by the second substrate holding portion is drawing a pattern. The first distance measuring sensor is used to move the drawing head relative to the second substrate holding portion while the second substrate held by the second substrate holding portion is drawing a pattern. The drawing head is provided with a second distance measuring sensor for obtaining the distance from the measurement position on the substrate on which the pattern is being drawn; and a focus control unit for controlling the focus position of the light emitted from the drawing head to be aligned with the height direction of the surface of the substrate on which the pattern is being drawn during the drawing of the pattern. The drawing head comprises: a second distance measuring sensor for obtaining the distance from the measurement position on the substrate on which the pattern is being drawn; and a focus changing unit for changing the focus position of the light emitted from the drawing head. Focus position; After the drawing head draws a pattern on the substrate held by one of the first substrate holding part or the second substrate holding part, and before the drawing head draws a pattern on the substrate held by the other of the first substrate holding part or the second substrate holding part, the focus control part uses the information obtained by the first distance measuring sensor to bring the focus position of the light emitted from the drawing head close to the height direction position of the surface of the substrate when drawing starts. 如請求項1所記載之描繪裝置,其中前述第一測距感測器的測量精度係比前述第二測距感測器的測量精度還低。 A depiction device as described in claim 1, wherein the measurement accuracy of the first distance sensor is lower than the measurement accuracy of the second distance sensor. 如請求項1所記載之描繪裝置,其中前述第一測距感測器係一邊使測量位置位於被前述第一基板保持部或者前述第二基板保持部保持的基板上的開始描繪位置附近的複數個位置,一邊取得直至複數個前述位置為止的複數個距離;前述對焦控制部係將複數個前述距離中之最高頻度的距離作為前述第一測距感測器與前述基板之間的距離來利用。 The drawing device as recited in claim 1, wherein the first distance measuring sensor is configured to obtain a plurality of distances up to the plurality of the aforementioned positions while making the measurement position located at a plurality of positions near the starting drawing position on the substrate held by the first substrate holding portion or the second substrate holding portion; and the focus control portion uses the distance with the highest frequency among the plurality of the aforementioned distances as the distance between the first distance measuring sensor and the aforementioned substrate. 如請求項1至3中任一項所記載之描繪裝置,其中前述第一測距感測器係包含絕對位置被固定於前述第一基板保持部的上方處之感測器要素以及絕對位置被固定於前述第二基板保持部的上方處之感測器要素。 A drawing device as recited in any one of claims 1 to 3, wherein the first distance measuring sensor comprises a sensor element whose absolute position is fixed above the first substrate holding portion and a sensor element whose absolute position is fixed above the second substrate holding portion. 如請求項1至3中任一項所記載之描繪裝置,其中進一步具備:對準攝影機,係在對被前述第二基板保持部保持的第二基板描繪圖案的期間,與被前述第一基板保持部保持的第一基板對向並拍攝前述第一基板上的對準標記,在對被前述第一基板保持部保持的第一基板描繪圖案的期間,與被前述第二基板保持部保持的第二基板對向並拍攝前述第二基板上的對準標記;以及 攝影機位置切換部,係將前述對準攝影機相對於前述第一基板保持部以及前述第二基板保持部之相對位置在與被前述第一基板保持部保持的第一基板對向之位置以及與被前述第二基板保持部保持的第二基板對向之位置之間切換;前述第一測距感測器相對於前述第一基板保持部以及前述第二基板保持部之相對位置係藉由前述攝影機位置切換部而與前述對準攝影機一起在與前述第一基板對向之位置以及與前述第二基板對向之位置之間被切換。 A drawing device as described in any one of claims 1 to 3, further comprising: an alignment camera, which faces the first substrate held by the first substrate holding portion and photographs the alignment mark on the first substrate during the drawing of the pattern on the second substrate held by the second substrate holding portion, and faces the second substrate held by the second substrate holding portion and photographs the alignment mark on the second substrate during the drawing of the pattern on the first substrate held by the first substrate holding portion; and a camera position switching portion, which switches the alignment camera position. The relative position of the camera relative to the first substrate holding part and the second substrate holding part is switched between a position opposite to the first substrate held by the first substrate holding part and a position opposite to the second substrate held by the second substrate holding part; the relative position of the first distance measuring sensor relative to the first substrate holding part and the second substrate holding part is switched together with the alignment camera between a position opposite to the first substrate and a position opposite to the second substrate by the camera position switching part. 如請求項1所記載之描繪裝置,其中前述第一測距感測器為擴散反射方式;前述對焦控制部係包含:校正部,係校正藉由前述第一測距感測器所取得的從前述第一測距感測器至基板上的測量位置為止之距離;前述校正部係因應形成於基板的表面以及附近之材料來校正前述距離。 The drawing device as described in claim 1, wherein the first distance measuring sensor is a diffuse reflection type; the focus control unit includes: a correction unit, which corrects the distance from the first distance measuring sensor to the measurement position on the substrate obtained by the first distance measuring sensor; the correction unit corrects the distance in response to the material formed on the surface of the substrate and the vicinity. 一種描繪方法,係對基板照射光線,藉此對前述基板描繪圖案;前述描繪方法係具備:工序a,係藉由第一基板保持部保持第一基板;工序b,係藉由與前述第一基板對向的第一測距感測器取得前述第一測距感測器與前述第一基板上的測量位置之間的距離;工序c,係一邊從描繪頭朝向前述第一基板射出經過調變的光線一邊將前述描繪頭相對於前述第一基板保持部相對性地移動,藉此對前述第一基板描繪圖案;工序d,係在進行前述工序c的期間,藉由第二基板保持部保持第二基板;工序e,係在進行前述工序c的期間,藉由與前述第二基板對向的前述第一測距感測器取得前述第一測距感測器與前述第二基板上的測量位置之間的距離; 工序f,係在前述工序c以及前述工序e之後,一邊從前述描繪頭朝向前述第二基板射出經過調變的光線一邊將前述描繪頭相對於前述第二基板保持部相對性地移動,藉此對前述第二基板描繪圖案;以及工序g,係重複前述工序a至前述工序f;在進行前述工序f的期間,對下一片第一基板進行前述工序a以及前述工序b;在前述工序f以及針對前述下一片第一基板的前述工序b之後,對前述下一片第一基板進行前述工序c;前述描繪頭係包含:第二測距感測器,係取得與正在進行圖案的描繪的基板上的測量位置之間的距離;在前述工序c中進行下述對焦控制:在前述描繪頭開始對前述第一基板進行圖案的描繪之前,使用在前述工序b中藉由前述第一測距感測器從前述第一基板所取得的資訊將從前述描繪頭射出的光線的對焦位置對合至前述第一基板的表面的高度方向的位置;在前述描繪頭對前述第一基板描繪圖案的期間,使用來自前述第二測距感測器的資訊將從前述描繪頭射出的光線的對焦位置對合至前述第一基板的表面的高度方向的位置;在前述工序f中進行下述對焦控制:在前述描繪頭開始對前述第二基板進行圖案的描繪之前,使用在前述工序e中藉由前述第一測距感測器從前述第二基板所取得的資訊將從前述描繪頭射出的光線的對焦位置接近至前述第二基板的表面的高度方向的位置;在前述描繪頭對前述第二基板描繪圖案的期間,使用來自前述第二測距感測器的資訊將從前述描繪頭射出的光線的對焦位置對合至前述第二基板的表面的高度方向的位置。 A drawing method is to irradiate light onto a substrate to draw a pattern on the substrate; the drawing method comprises: step a, holding a first substrate by a first substrate holding portion; step b, obtaining a distance between the first distance sensor and a measurement position on the first substrate by a first distance sensor facing the first substrate; step c, emitting modulated light from a drawing head toward the first substrate while moving the drawing head relative to the first substrate holding portion to draw a pattern on the first substrate; step d, holding a second substrate by a second substrate holding portion during step c; step e, while performing step c; During the aforementioned process c, the distance between the aforementioned first distance measuring sensor and the measurement position on the aforementioned second substrate is obtained by the aforementioned first distance measuring sensor facing the aforementioned second substrate; Process f, after the aforementioned process c and the aforementioned process e, while emitting modulated light from the aforementioned drawing head toward the aforementioned second substrate, the aforementioned drawing head is relatively moved relative to the aforementioned second substrate holding portion, thereby drawing a pattern on the aforementioned second substrate; and process g, repeating the aforementioned process a to the aforementioned process f; during the aforementioned process f, the aforementioned process a and the aforementioned process b are performed on the next first substrate; during the aforementioned process f and the aforementioned process b on the next first substrate After the aforementioned step b, the aforementioned step c is performed on the aforementioned next first substrate; the aforementioned drawing head includes: a second distance measuring sensor, which obtains the distance between the measurement position and the substrate on which the pattern is being drawn; in the aforementioned step c, the following focus control is performed: before the aforementioned drawing head starts to draw the pattern on the aforementioned first substrate, the focus position of the light emitted from the aforementioned drawing head is aligned to the position in the height direction of the surface of the aforementioned first substrate using the information obtained from the aforementioned first distance measuring sensor in the aforementioned step b; while the aforementioned drawing head is drawing the pattern on the aforementioned first substrate, the focus position of the light emitted from the aforementioned drawing head is aligned to the position in the height direction of the surface of the aforementioned first substrate using the information from the aforementioned second distance measuring sensor The focus position of the light emitted by the drawing head is aligned to the position in the height direction of the surface of the first substrate; the following focus control is performed in the above step f: before the above drawing head starts drawing the pattern on the above second substrate, the focus position of the light emitted from the drawing head is brought close to the position in the height direction of the surface of the second substrate using the information obtained from the above second substrate by the above first distance sensor in the above step e; while the above drawing head is drawing the pattern on the above second substrate, the focus position of the light emitted from the drawing head is aligned to the position in the height direction of the surface of the second substrate using the information from the above second distance sensor.
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