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TWI818861B - Processing apparatus and producing method of processed article - Google Patents

Processing apparatus and producing method of processed article Download PDF

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Publication number
TWI818861B
TWI818861B TW112102895A TW112102895A TWI818861B TW I818861 B TWI818861 B TW I818861B TW 112102895 A TW112102895 A TW 112102895A TW 112102895 A TW112102895 A TW 112102895A TW I818861 B TWI818861 B TW I818861B
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processing
holding mechanism
moving
cutting
holding
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TW112102895A
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Chinese (zh)
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TW202320967A (en
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深井元樹
堀聡子
坂上雄哉
山本裕子
吉岡翔
片岡昌一
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日商Ｔｏｗａ股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Feeding Of Workpieces (AREA)
  • Dicing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Threshing Machine Elements (AREA)
  • Multi-Process Working Machines And Systems (AREA)

Abstract

The present invention simplified the structure of apparatus and reduced the occupying area, which comprises: a processing table 2A and a processing table 2B hold a sealing completed substrate W; a first holding mechanism 3 holds the sealing completed substrate W to transport the sealing completed substrate W to the processing table 2A and the processing table 2B; a processing mechanism 4 processes the sealing completed substrate W which is held on the processing table 2A and the processing table 2B; a transferring table 5 moves plurality of products P; a second holding mechanism 6 holds the plurality of products P to transport the plurality of products P from the processing table 2A and the processing table 2B to the transferring table 5; a transporting used moving mechanism 7 has a shared transfer shaft 71 that extends along a aligned direction of the processing table 2A, the processing table 2B and the transferring table 5, and is used as moving the first holding mechanism 3 and the second holding mechanism 6; and a processing used moving mechanism 8 moves the processing mechanism 4 on a horizontal plane, wherein moves separately along a X-direction of the transfer shaft 71 and a Y-direction that is orthogonal to the X-direction.

Description

加工裝置及加工品的製造方法Processing device and manufacturing method of processed product

本發明是有關於一種加工裝置及加工品的製造方法。The present invention relates to a processing device and a method for manufacturing processed products.

先前，如專利文獻1所示，於切斷系統中，想到下述結構，即：條帶拾取器（strip picker）於X軸方向移動，將半導體條帶自裝載裝置移送至切斷裝置的卡盤台，卡盤台吸附半導體條帶並於Y軸方向移動至系統後方，之後，藉由心軸將半導體條帶切斷成半導體封裝體。另外，卡盤台採用使用滾珠絲桿（滾珠螺桿機構）而於Y軸方向移動的結構。Previously, as shown in Patent Document 1, in a cutting system, a structure in which a strip picker moves in the X-axis direction and transfers a semiconductor strip from a loading device to a card of the cutting device has been considered. The chuck table absorbs the semiconductor strips and moves them to the rear of the system in the Y-axis direction. After that, the semiconductor strips are cut into semiconductor packages using a mandrel. In addition, the chuck table adopts a structure that uses a ball screw (ball screw mechanism) to move in the Y-axis direction.

然而，於所述切斷系統中，由於使用滾珠絲桿使卡盤台移動來進行切斷，因此於實際的切斷時，例如如專利文獻2所示，需要設置保護滾珠絲桿免受加工水或加工屑的蛇腹構件，進而需要為了保護蛇腹構件而於蛇腹構件上設置多個板構件。其結果，裝置結構變得複雜。However, in the cutting system, since the ball screw is used to move the chuck table for cutting, during actual cutting, as shown in Patent Document 2, for example, it is necessary to provide a protective ball screw to protect the ball screw from processing. In order to protect the bellows member from water or processing chips, it is necessary to provide a plurality of plate members on the bellows member. As a result, the device structure becomes complicated.

另外，於所述切斷系統中，不僅於X軸方向移送半導體條帶，而且為了切斷半導體條帶而於Y軸方向移送至系統後方，因此裝置的佔據面積（footprint）變大。 [現有技術文獻] [專利文獻] In addition, in the cutting system, the semiconductor strip is not only transferred in the X-axis direction but also transferred to the rear of the system in the Y-axis direction in order to cut the semiconductor strip. Therefore, the footprint of the device becomes larger. [Prior art documents] [Patent Document]

[專利文獻1]日本專利特表2007-536727號公報 [專利文獻2]日本專利特開2004-186361號公報 [Patent Document 1] Japanese Patent Publication No. 2007-536727 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-186361

[發明所欲解決之課題][Problem to be solved by the invention]

因此，本發明是為解決所述問題點而成，其主要課題在於使裝置結構簡化並且減少佔據面積。 [解決課題之手段] Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to simplify the device structure and reduce the occupied area. [Means to solve the problem]

即，本發明的加工裝置的特徵在於包括：加工台，保持加工對象物；第一保持機構，為了將所述加工對象物搬送至所述加工台而保持所述加工對象物；加工機構，對保持於所述加工台的所述加工對象物進行加工；移載台，移動加工後的所述加工對象物；第二保持機構，為了將加工後的所述加工對象物自所述加工台搬送至所述移載台而保持加工後的所述加工對象物；搬送用移動機構，具有沿著所述加工台及所述移載台的排列方向延伸且用以使所述第一保持機構及所述第二保持機構移動的共用的傳遞軸；以及加工用移動機構，使所述加工機構於水平面上於沿著所述傳遞軸的第一方向及與該第一方向正交的第二方向分別移動。 [發明的效果] That is, the processing apparatus of the present invention is characterized by including: a processing table that holds an object to be processed; a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; and a processing mechanism that holds the object to be processed. The processing object held on the processing table is processed; the transfer table moves the processed object; and the second holding mechanism is used to transport the processed object from the processing table. The processed object is held on the transfer table; a transport moving mechanism extends along the arrangement direction of the processing table and the transfer table and is used to move the first holding mechanism and a common transmission axis that the second holding mechanism moves; and a processing moving mechanism that moves the processing mechanism in a first direction along the transmission axis and a second direction orthogonal to the first direction on the horizontal plane. Move separately. [Effects of the invention]

根據如此構成的本發明，可使裝置結構簡化並且減少佔據面積。According to the invention thus constituted, the device structure can be simplified and the occupied area can be reduced.

繼而，對本發明舉例加以更詳細說明。但是，本發明不受以下說明的限定。Next, examples of the present invention will be described in more detail. However, the present invention is not limited to the following description.

如所述般，本發明的加工裝置的特徵在於包括：加工台，保持加工對象物；第一保持機構，為了將所述加工對象物搬送至所述加工台而保持所述加工對象物；加工機構，對保持於所述加工台的所述加工對象物進行加工；移載台，移動加工後的所述加工對象物；第二保持機構，為了將加工後的所述加工對象物自所述加工台搬送至所述移載台而保持加工後的所述加工對象物；搬送用移動機構，具有沿著所述加工台及所述移載台的排列方向延伸且用以使所述第一保持機構及所述第二保持機構移動的共用的傳遞軸；以及加工用移動機構，使所述加工機構於水平面上於沿著所述傳遞軸的第一方向及與該第一方向正交的第二方向分別移動。 若為所述加工裝置，則採用藉由沿著加工台及移載台的排列方向延伸的共用的傳遞軸使第一保持機構及第二保持機構移動的結構，藉由加工用移動機構使加工機構於水平面上於沿著傳遞軸的第一方向及與該第一方向正交的第二方向分別移動，因此可不使加工台於第一方向及第二方向上移動而對加工對象物進行加工。因此，可不藉由滾珠螺桿機構使加工台移動，而無需用以保護滾珠螺桿機構的蛇腹構件及用於保護該蛇腹構件的蓋構件。其結果，可使加工裝置的裝置結構簡化。另外，由於形成為加工台不於水平面上於第一方向及第二方向移動的結構，因此可削減加工台的移動空間及其周邊的無用空間，可減少加工裝置的佔據面積。 As described above, the processing apparatus of the present invention is characterized by including: a processing table that holds the object to be processed; and a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; a mechanism to process the object to be processed held on the processing table; a transfer table to move the object to be processed; and a second holding mechanism to remove the object to be processed from the object to be processed. The processing table is transported to the transfer table and the processed object is held; a transport moving mechanism extends along the arrangement direction of the processing table and the transfer table and is used to move the first a common transmission axis through which the holding mechanism and the second holding mechanism move; and a processing moving mechanism that moves the processing mechanism on a horizontal plane in a first direction along the transmission axis and orthogonal to the first direction. Move in the second direction respectively. In the above-mentioned processing device, a structure is adopted in which the first holding mechanism and the second holding mechanism are moved by a common transmission shaft extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism is used to perform processing. The mechanism moves on the horizontal plane in a first direction along the transmission axis and a second direction orthogonal to the first direction, so that the processing object can be processed without moving the processing table in the first direction and the second direction. . Therefore, the processing table can be moved without using the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are not required. As a result, the device structure of the processing device can be simplified. In addition, since the processing table is configured not to move in the first direction and the second direction on the horizontal plane, the movement space of the processing table and the useless space around it can be reduced, and the occupied area of the processing device can be reduced.

作為傳遞軸及加工用移動機構的具體配置的態樣，所述傳遞軸理想的是以於所述加工用移動機構的上方橫穿所述加工用移動機構的方式配置。 若為所述結構，則可使沿著傳遞軸移動的第一保持機構於加工用移動機構的上方移動，從而可防止第一保持機構與加工用移動機構發生物理干擾。另外，可使沿著傳遞軸移動的第二保持機構於加工用移動機構的上方移動，從而可防止第二保持機構與加工用移動機構發生物理干擾。 As a specific arrangement aspect of the transmission shaft and the processing moving mechanism, the transmission shaft is preferably disposed above the processing moving mechanism and crossing the processing moving mechanism. According to the above structure, the first holding mechanism that moves along the transmission axis can be moved above the processing moving mechanism, thereby preventing physical interference between the first holding mechanism and the processing moving mechanism. In addition, the second holding mechanism that moves along the transmission axis can be moved above the processing moving mechanism, thereby preventing physical interference between the second holding mechanism and the processing moving mechanism.

為了於一個加工裝置中提高加工對象物的處理能力，本發明的加工裝置理想的是包括多個所述加工台。 於所述結構中，理想的是，所述多個加工台及所述移載台於水平面上配置成一行。 若為所述結構，則可藉由沿著共用的傳遞軸移動的第一保持機構將加工對象物搬送至多個加工台的各個。另外，可藉由沿著共用的傳遞軸移動的第二保持機構自多個加工台的各個將加工後的加工對象物搬送至移載台。另外，於藉由其中一個加工台處理加工對象物時，可於另一個加工台進行搬送等的其他處理。 In order to improve the processing capability of the object to be processed in one processing device, the processing device of the present invention preferably includes a plurality of the processing tables. In the above-mentioned structure, it is desirable that the plurality of processing tables and the transfer table are arranged in a line on a horizontal plane. According to the above structure, the object to be processed can be transported to each of the plurality of processing tables by the first holding mechanism that moves along the common transmission axis. In addition, the processed object can be transferred to the transfer table from each of the plurality of processing tables by the second holding mechanism that moves along the common transmission axis. In addition, when the object to be processed is processed on one of the processing stations, other processing such as transportation can be performed on the other processing station.

當設為不使加工台於水平面上於第一方向及第二方向移動的結構、且僅藉由加工用移動機構使加工機構於第一方向及第二方向移動時，有對加工對象物的加工受到制約之虞。 為了消除所述加工的制約，理想的是，所述加工台構成為能夠於水平面上旋轉。 When a structure is adopted in which the processing table is not moved in the first direction and the second direction on the horizontal plane, and the processing mechanism is moved in the first direction and the second direction only by the processing moving mechanism, there is a risk of damage to the object to be processed. Processing may be restricted. In order to eliminate the restriction of the processing, it is desirable that the processing table is configured to be rotatable on a horizontal plane.

為了進一步簡化裝置結構並且進一步減少佔據面積，理想的是所述第一保持機構、所述第二保持機構、所述加工台及所述移載台於平面視時相對於所述傳遞軸而設置於同側。另外，由於第一保持機構、第二保持機構、加工台及移載台設置於同側，因此亦可使維護性提高。In order to further simplify the device structure and further reduce the occupied area, it is ideal that the first holding mechanism, the second holding mechanism, the processing table and the transfer table are arranged relative to the transmission shaft in plan view. on the same side. In addition, since the first holding mechanism, the second holding mechanism, the processing table, and the transfer table are arranged on the same side, maintainability can also be improved.

所述加工用移動機構被稱為所謂的龍門架機構。具體而言，所述加工用移動機構理想的是包括：使所述加工機構於所述第一方向直線移動的第一方向移動部、以及使所述加工機構於所述第二方向直線移動的第二方向移動部，且所述第一方向移動部具有：一對第一方向導軌，沿著所述第一方向夾持所述加工台而設置；以及支持體，沿著該一對第一方向導軌移動，並且經由所述第二方向移動部支持所述加工機構。於所述結構中，共用的傳遞軸以於支持體的上方橫穿該支持體的方式配置，共用的傳遞軸及支持體處於相互交叉的位置關係。 如此沿著第一方向設置的一對第一方向導軌夾持加工台而設置，因此可增大一對第一方向導軌的間距（間隔）。其結果，可減小第一方向導軌彼此的上下方向的位置偏移對加工的影響。即，可減小加工機構（例如刀片等旋轉工具）與加工台的正交度的偏移，可提高加工精度。另外，第一方向導軌可使用規格較先前低的導軌。 The moving mechanism for processing is called a so-called gantry mechanism. Specifically, the processing moving mechanism preferably includes a first direction moving part for linearly moving the processing mechanism in the first direction, and a first direction moving part for linearly moving the processing mechanism in the second direction. A second direction moving part, and the first direction moving part has: a pair of first direction guide rails, which are arranged to sandwich the processing table along the first direction; and a support body, which is arranged along the pair of first direction guide rails. The direction guide rail moves and supports the processing mechanism via the second direction moving part. In the structure, the common transmission shaft is arranged above the support body and crosses the support body, and the common transmission shaft and the support body are in a mutually intersecting positional relationship. Since the pair of first direction guide rails arranged along the first direction sandwich the processing table and are arranged, the distance (interval) between the pair of first direction guide rails can be increased. As a result, the influence of the vertical positional deviation of the first direction guide rails on the processing can be reduced. That is, the deviation of the orthogonality between the processing mechanism (for example, a rotating tool such as a blade) and the processing table can be reduced, thereby improving processing accuracy. In addition, the first direction guide rail may use a guide rail with lower specifications than before.

為了清洗保持於加工台的加工後的加工對象物，本發明的加工裝置理想的是更包括將保持於所述加工台的加工後的所述加工對象物的上表面側進行清潔的第一清潔機構。 於所述結構中，為了設為使用共用的傳遞軸以使第一清潔機構移動的結構而簡化裝置結構，理想的是，所述第一清潔機構以能夠與所述第一保持機構一起沿著所述傳遞軸移動的方式構成。 In order to clean the processed object held on the processing table, the processing device of the present invention preferably further includes a first cleaning step for cleaning the upper surface side of the processed object held on the processing table. institution. In the above structure, in order to simplify the device structure by using a common transmission shaft to move the first cleaning mechanism, it is ideal that the first cleaning mechanism can move along the first cleaning mechanism together with the first holding mechanism. The transmission shaft is configured to move.

另外，為了將無法藉由第一清潔機構進行清潔的加工後的加工對象物的下表面側進行清潔，本發明的加工裝置理想的是更包括將保持於所述第二保持機構的加工後的所述加工對象物的下表面側進行清潔的第二清潔機構。In addition, in order to clean the lower surface side of the processed object that cannot be cleaned by the first cleaning mechanism, the processing device of the present invention preferably further includes a processed object held by the second holding mechanism. The second cleaning mechanism cleans the lower surface side of the object to be processed.

為了進行加工後的加工對象物的兩面檢查，本發明的加工裝置理想的是更包括：檢查部，檢查保持於所述第二保持機構的加工後的所述加工對象物；以及反轉機構，為了能夠藉由所述檢查部檢查加工後的所述加工對象物的兩面而使加工後的所述加工對象物反轉。In order to inspect both sides of the processed object, the processing device of the present invention preferably further includes: an inspection unit that inspects the processed object held by the second holding mechanism; and a reversing mechanism, The processed object is reversed so that both sides of the processed object can be inspected by the inspection unit.

作為用以使搬送用移動機構的結構簡化的具體實施態樣，所述搬送用移動機構理想的是具有：共用的導軌，設置於所述傳遞軸上、且導引所述第一保持機構及所述第二保持機構；以及齒條與小齒輪機構，使所述第一保持機構及所述第二保持機構沿著所述導軌移動。 於所述結構中，所述齒條與小齒輪機構理想的是具有：凸輪齒條，為所述第一保持機構及所述第二保持機構所共用；以及小齒輪，分別設置於所述第一保持機構及所述第二保持機構，由致動器旋轉。 若為所述結構，藉由變更共用的凸輪齒條的長度，可任意地設定第一保持機構及第二保持機構的移動範圍。 As a specific embodiment for simplifying the structure of the conveyance moving mechanism, the conveyance moving mechanism preferably has a common guide rail provided on the transmission shaft and guiding the first holding mechanism and The second holding mechanism; and the rack and pinion mechanism enable the first holding mechanism and the second holding mechanism to move along the guide rail. In the above structure, the rack and pinion mechanism ideally has: a cam rack shared by the first holding mechanism and the second holding mechanism; and pinions respectively provided on the third holding mechanism. A holding mechanism and the second holding mechanism are rotated by an actuator. With the above structure, by changing the length of the common cam rack, the movement ranges of the first holding mechanism and the second holding mechanism can be set arbitrarily.

所述搬送用移動機構理想的是更包括：升降移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸升降移動；以及水平移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸沿著所述第二方向移動。 此處，升降移動機構不僅於藉由第一保持機構交接加工對象物時進行升降移動，而且為了使第一保持機構不與加工用移動機構發生物理干擾而進行升降移動。另外，可藉由水平移動機構，於藉由第一保持機構將加工對象物載置於加工台時將加工對象物相對於加工台沿著第二方向進行位置調整。 The conveyance moving mechanism preferably further includes an up-and-down movement mechanism that is provided between the transmission shaft and the first holding mechanism and that moves the first holding mechanism up and down relative to the transmission shaft. ; And a horizontal moving mechanism, provided between the transmission shaft and the first holding mechanism, and causing the first holding mechanism to move in the second direction relative to the transmission shaft. Here, the lifting and lowering movement mechanism not only performs lifting and lowering movement when transferring the object to be processed via the first holding mechanism, but also performs lifting and lowering movement so that the first holding mechanism does not physically interfere with the processing moving mechanism. In addition, the horizontal movement mechanism can be used to position the object to be processed in the second direction relative to the processing table when the object to be processed is placed on the processing table by the first holding mechanism.

為了簡化水平移動機構的結構，所述水平移動機構理想的是具有：水平導軌，沿著所述第二方向設置且導引所述第一保持機構；彈性體，對所述第一保持機構向所述第一導引部的其中一側賦予力；以及凸輪機構，使所述第一保持機構向所述第一導引部的另一側移動。In order to simplify the structure of the horizontal moving mechanism, the horizontal moving mechanism ideally has: a horizontal guide rail, which is arranged along the second direction and guides the first holding mechanism; and an elastic body, which moves the first holding mechanism toward the first holding mechanism. One side of the first guide part is provided with force; and a cam mechanism moves the first holding mechanism to the other side of the first guide part.

本發明的加工裝置中，藉由加工用移動機構相對於在第一方向及第二方向被固定的加工台而移動的加工機構對加工對象物進行加工，因此不需要使加工台於第一方向或第二方向移動的移動機構。因此，本發明的加工裝置理想的是更包括加工屑收容部，所述加工屑收容部設置於所述加工台的下方、且收容由所述加工機構進行的加工而產生的加工屑。如此於加工台的下方設置加工屑收容部，藉此可提高加工屑的回收率。In the processing device of the present invention, the object to be processed is processed by the processing moving mechanism moving with respect to the processing table fixed in the first direction and the second direction. Therefore, there is no need to move the processing table in the first direction. Or a moving mechanism that moves in the second direction. Therefore, it is preferable that the processing device of the present invention further includes a processing chip storage portion that is provided below the processing table and stores processing chips generated by processing by the processing mechanism. In this way, the recovery rate of machining chips can be improved by arranging a machining chip receiving portion below the processing table.

作為加工屑收容部的具體實施態樣，所述加工屑收容部理想的是具有：導引滑槽（guide chute），具有於平面視時包圍所述加工台的上部開口；以及回收容器，將由所述導引滑槽所導引的加工屑回收。 若為所述結構，由於導引滑槽具有包圍加工台的上部開口，因此不易將自加工台飛散或落下的加工屑漏掉，可進一步提高加工屑的回收率。 As a specific embodiment of the machining waste receiving part, the machining waste receiving part ideally has: a guide chute having an upper opening surrounding the processing table in plan view; and a recovery container, which is formed by The processing chips guided by the guide chute are recovered. With the above structure, since the guide chute has an upper opening surrounding the processing table, it is difficult to miss the processing chips scattered or dropped from the processing table, and the recovery rate of processing chips can be further improved.

於所述加工機構藉由刀片將所述加工對象物切斷而進行單片化的情況下，特別重要的是基於刀片的切斷方向與基於加工用移動機構的第一方向一致（即，刀片的旋轉軸方向與基於加工用移動機構的第一方向正交）。於本發明中，只要相對於第一方向移動部的支持體來定位刀片即可，與如先前般相對於與刀片分開移動的加工台來定位刀片的旋轉軸方向的情況相比，該些的定位變得容易。When the processing mechanism cuts the processing object into individual pieces by using a blade, it is particularly important that the cutting direction by the blade coincides with the first direction by the processing moving mechanism (i.e., the cutting direction of the blade The direction of the rotation axis is orthogonal to the first direction based on the processing moving mechanism). In the present invention, it is only necessary to position the blade with respect to the support of the first direction moving part. Compared with the previous case of positioning the rotation axis direction of the blade with respect to a processing table that moves separately from the blade, these Positioning made easy.

作為本發明的加工裝置的具體實施態樣，理想的是，所述加工對象物是經樹脂密封的密封完畢基板，所述加工機構藉由利用刀片將所述密封完畢基板切斷，從而單片化為多個製品。As a specific embodiment of the processing device of the present invention, it is desirable that the object to be processed is a resin-sealed sealed substrate, and the processing mechanism cuts the sealed substrate into single pieces by using a blade. into multiple products.

另外，使用所述加工裝置來製造加工品的、加工品的製造方法亦為本發明的一態樣。In addition, a method for manufacturing a processed product using the processing device is also an aspect of the present invention.

＜本發明的一實施形態＞ 以下，參照圖式對本發明的加工裝置的一實施形態加以說明。再者，關於以下所示的任一圖，均為了容易理解而適當省略或誇張地示意性地描畫。對相同的構成要素標註相同符號，適當省略說明。 <One embodiment of the present invention> Hereinafter, an embodiment of the processing device of the present invention will be described with reference to the drawings. In addition, any of the figures shown below are appropriately omitted or schematically drawn in an exaggerated manner for easy understanding. The same components are labeled with the same symbols, and descriptions are omitted where appropriate.

＜加工裝置的總體結構＞ 本實施形態的加工裝置100為切斷裝置，藉由將作為加工對象物的密封完畢基板W切斷，從而單片化為多個製品P。 ＜Overall structure of processing equipment＞ The processing device 100 of this embodiment is a cutting device that cuts the sealed substrate W as a processing object into individual pieces into a plurality of products P.

具體而言，如圖1所示，切斷裝置100包括：兩個切斷用台（加工台）2A、2B，保持密封完畢基板W；第一保持機構3，為了將密封完畢基板W搬送至切斷用台2A、切斷用台2B而保持密封完畢基板W；切斷機構（加工機構）4，將保持於切斷用台2A、切斷用台2B的密封完畢基板W切斷；移載台5，移動多個製品P；第二保持機構6，為了將多個製品P自切斷用台2A、切斷用台2B搬送至移載台5而保持多個製品P；搬送用移動機構7，具有用以使第一保持機構3及第二保持機構6移動的共用的傳遞軸71；以及切斷用移動機構（加工用移動機構）8，使切斷機構4相對於保持於切斷用台2A、切斷用台2B的密封完畢基板W移動。Specifically, as shown in FIG. 1 , the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W; and a first holding mechanism 3 that transports the sealed substrate W to The cutting tables 2A and 2B hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 cuts the sealed substrate W held on the cutting tables 2A and 2B; and moves The carrier 5 moves a plurality of products P; the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5; the transfer movement The mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 to hold the cutting mechanism 4 relative to the cutting mechanism. The sealed substrate W of the cutting table 2A and the cutting table 2B moves.

此處，所謂密封完畢基板W，是針對連接有半導體晶片、電阻元件、電容元件等電子元件的基板，以至少將電子元件加以樹脂密封的方式進行樹脂成形而成。作為構成密封完畢基板W的基板，可使用引線框架（lead frame）、印刷配線板，除了該些以外，亦可使用半導體製基板（包含矽晶圓等半導體晶圓）、金屬製基板、陶瓷製基板、玻璃製基板、樹脂製基板等。另外，對於構成密封完畢基板W的基板，可實施有配線亦可未實施配線。Here, the sealed substrate W is a substrate to which electronic components such as semiconductor wafers, resistive elements, and capacitive elements are connected, and is formed by resin molding to seal at least the electronic components with resin. As the substrate constituting the sealed substrate W, a lead frame and a printed wiring board can be used. In addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can also be used. Substrates, glass substrates, resin substrates, etc. In addition, the substrate constituting the sealed substrate W may or may not have wiring implemented.

以下的說明中，將沿著切斷用台2A、切斷用台2B的上表面的平面（水平面）內相互正交的方向分別設為X方向及Y方向，將與X方向及Y方向正交的鉛垂方向設為Z方向。具體而言，將圖1的左右方向設為X方向，將上下方向設為Y方向。雖將於後述，但X方向為支持體812的移動方向，另外，為與門型支持體812的架設一對腳部的樑部（橫樑部）的長度方向（樑部延伸的方向）正交的方向（參照圖2）。In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively referred to as the X direction and the Y direction, and the directions orthogonal to the X direction and the Y direction are respectively The vertical direction of the intersection is set to the Z direction. Specifically, let the left-right direction in FIG. 1 be the X direction, and let the up-down direction be the Y direction. Although it will be described later, the X direction is the moving direction of the support body 812 and is orthogonal to the longitudinal direction (the direction in which the beam portion extends) of the beam portion (cross beam portion) of the door-shaped support body 812 that bridges the pair of legs. direction (see Figure 2).

＜切斷用台＞ 兩個切斷用台2A、2B於X方向、Y方向及Z方向經固定而設置。再者，切斷用台2A可由設置於切斷用台2A之下的旋轉機構9A於θ方向旋轉。另外，切斷用台2B可由設置於切斷用台2B之下的旋轉機構9B於θ方向旋轉。 ＜Cutting table＞ The two cutting tables 2A and 2B are fixedly installed in the X direction, the Y direction, and the Z direction. Furthermore, the cutting table 2A can be rotated in the θ direction by the rotation mechanism 9A provided below the cutting table 2A. In addition, the cutting table 2B can be rotated in the θ direction by the rotation mechanism 9B provided below the cutting table 2B.

該些兩個切斷用台2A、2B於水平面上沿著X方向設置。具體而言，兩個切斷用台2A、2B以該些的上表面位於同一水平面上（於Z方向位於相同高度位置）的方式配置（參照圖4），並且以該些上表面的中心（具體而言為基於旋轉機構9A、旋轉機構9B的旋轉中心）位於沿X方向延伸的同一直線上的方式配置（參照圖2及圖3）。These two cutting tables 2A and 2B are installed along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged so that their upper surfaces are on the same horizontal plane (at the same height position in the Z direction) (see FIG. 4 ), and the center of the upper surfaces ( Specifically, they are arranged so that the rotation centers of the rotating mechanisms 9A and 9B are located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

另外，兩個切斷用台2A、2B吸附保持密封完畢基板W，如圖1所示，與兩個切斷用台2A、2B對應地配置有用以吸附保持的兩個真空泵10A、10B。各真空泵10A、10B例如為水封式真空泵。In addition, the two cutting tables 2A and 2B suction and hold the sealed substrate W. As shown in FIG. 1 , two vacuum pumps 10A and 10B are arranged corresponding to the two cutting tables 2A and 2B for suction and holding. Each of the vacuum pumps 10A and 10B is, for example, a water-sealed vacuum pump.

此處，切斷用台2A、切斷用台2B於XYZ方向經固定，故而可縮短自真空泵10A、真空泵10B連接於切斷用台2A、切斷用台2B的配管（未圖示），可減小配管的壓力損失，防止吸附力的降低。其結果為，即便為例如1 mm見方以下的極小封裝體，亦能可靠地吸附於切斷用台2A、切斷用台2B。另外，可防止配管的壓力損失所致的、吸附力的降低，故而可減小真空泵10A、真空泵10B的容量，帶來小型化或成本降低。Here, since the cutting table 2A and the cutting table 2B are fixed in the XYZ direction, the pipes (not shown) connected from the vacuum pump 10A and the vacuum pump 10B to the cutting table 2A and the cutting table 2B can be shortened. It can reduce the pressure loss in piping and prevent the reduction of adsorption force. As a result, even a very small package, for example, 1 mm square or less, can be reliably adsorbed to the cutting tables 2A and 2B. In addition, the reduction in adsorption force due to pressure loss in the piping can be prevented, so that the capacity of the vacuum pump 10A and the vacuum pump 10B can be reduced, resulting in downsizing and cost reduction.

＜第一保持機構＞ 如圖1所示，第一保持機構3為了將密封完畢基板W自基板供給機構11搬送至切斷用台2A、切斷用台2B而保持密封完畢基板W。如圖5及圖6所示，所述第一保持機構3具有：吸附頭31，設置有用以吸附保持密封完畢基板W的多個吸附部311；以及真空泵（未圖示），連接於該吸附頭31的吸附部311。而且，藉由吸附頭31由後述搬送用移動機構7等移動至所需位置，從而將密封完畢基板W自基板供給機構11搬送至切斷用台2A、切斷用台2B。 ＜First holding mechanism＞ As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting stages 2A and 2B. As shown in FIGS. 5 and 6 , the first holding mechanism 3 has: an adsorption head 31 provided with a plurality of adsorption portions 311 for adsorbing and holding the sealed substrate W; and a vacuum pump (not shown) connected to the adsorption unit. The suction part 311 of the head 31. Then, the sealed substrate W is transported from the substrate supply mechanism 11 to the cutting stages 2A and 2B by moving the suction head 31 to a desired position by the transport moving mechanism 7 described below.

如圖1所示，基板供給機構11具有：基板收容部111，自外部收容多個密封完畢基板W；以及基板供給部112，使收容於該基板收容部111的密封完畢基板W移動至由第一保持機構3吸附保持的保持位置RP。所述保持位置RP是以於X方向與兩個切斷用台2A、2B成為同行的方式設定。再者，基板供給機構11亦可為了使由第一保持機構3吸附的密封完畢基板W為柔軟的狀態以容易吸附，而具有進行加熱的加熱部113。As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating part 111 for accommodating a plurality of sealed substrates W from the outside; and a substrate supply part 112 for moving the sealed substrates W accommodated in the substrate accommodating part 111 to a first position. A holding mechanism 3 adsorbs and holds the holding position RP. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. Furthermore, the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W adsorbed by the first holding mechanism 3 in a soft state so that it can be easily adsorbed.

＜切斷機構（加工機構）＞ 如圖1、圖2及圖3所示，切斷機構4具有包含刀片41A、刀片41B及兩個心軸42A、42B的兩個旋轉工具40。兩個心軸42A、42B以該些的旋轉軸沿著Y方向的方式設置，安裝於該些心軸的刀片41A、刀片41B以彼此相向的方式配置（參照圖3）。心軸42A的刀片41A及心軸42B的刀片41B藉由在包含X方向及Z方向的面內旋轉，從而將保持於各切斷用台2A、2B的密封完畢基板W切斷。再者，於本實施形態的切斷裝置100，如圖4所示，為了抑制由刀片41A、刀片41B產生的摩擦熱而設置有液體供給機構12，所述液體供給機構12具有噴射切削水（加工液）的噴射噴嘴121。所述噴射噴嘴121例如支持於後述的Z方向移動部83。 ＜Cutting mechanism (processing mechanism)＞ As shown in FIGS. 1 , 2 and 3 , the cutting mechanism 4 has two rotating tools 40 including a blade 41A, a blade 41B and two spindles 42A and 42B. The two spindles 42A and 42B are provided with their rotational axes along the Y direction, and the blades 41A and 41B attached to the spindles are arranged to face each other (see FIG. 3 ). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on each of the cutting tables 2A and 2B by rotating in the plane including the X direction and the Z direction. Furthermore, in the cutting device 100 of this embodiment, as shown in FIG. 4 , a liquid supply mechanism 12 having a function of injecting cutting water ( machining fluid) injection nozzle 121. The injection nozzle 121 is supported by, for example, a Z-direction moving portion 83 described below.

＜移載台＞ 如圖1所示，本實施形態的移載台5為移動經後述的檢查部13進行了檢查的多個製品P的台。所述移載台5被稱為所謂索引台，於將多個製品P分類至各種托盤21之前，暫時載置多個製品P。另外，移載台5於水平面上沿著X方向與兩個切斷用台2A、2B配置成一行。載置於移載台5的多個製品P根據由檢查部13所得的檢查結果（良品、不良品等）而由分類機構20分類至各種托盤21。 ＜Transfer stage＞ As shown in FIG. 1 , the transfer stage 5 of this embodiment is a stage that moves a plurality of products P inspected by an inspection unit 13 to be described later. The transfer table 5 is called a so-called index table and temporarily places a plurality of products P before sorting the products P into various trays 21 . In addition, the transfer table 5 is arranged in line with the two cutting tables 2A and 2B on the horizontal plane along the X direction. The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the classification mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13 .

再者，各種托盤21由沿著傳遞軸71移動的托盤搬送機構22搬送至所需的位置，載置由分類機構20所分類的製品P。經分類後，各種托盤21由托盤搬送機構22收容於托盤收容部23。Furthermore, the various pallets 21 are conveyed to a required position by the pallet conveying mechanism 22 that moves along the transmission shaft 71, and the products P classified by the sorting mechanism 20 are placed thereon. After sorting, the various pallets 21 are accommodated in the pallet accommodating part 23 by the pallet transport mechanism 22 .

＜檢查部＞ 此處，檢查部13如圖1所示，設置於切斷用台2A、切斷用台2B與移載台5之間，檢查保持於第二保持機構6的多個製品P。本實施形態的檢查部13具有檢查製品P的密封面（封裝面）的第一檢查部131、及檢查製品P的引線面的第二檢查部132。第一檢查部131為具有用以檢查封裝面的光學系統的攝像相機，第二檢查部132為具有用以檢查引線面的光學系統的攝像相機。再者，亦可使第一檢查部131及第二檢查部132共用。 ＜Inspection Department＞ Here, as shown in FIG. 1 , the inspection unit 13 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection unit 13 of this embodiment includes a first inspection unit 131 that inspects the sealing surface (packaging surface) of the product P, and a second inspection unit 132 that inspects the lead surface of the product P. The first inspection unit 131 is a camera having an optical system for inspecting the package surface, and the second inspection unit 132 is a camera having an optical system for inspecting the lead surface. Furthermore, the first inspection part 131 and the second inspection part 132 may be shared.

本實施形態的密封完畢基板W及製品P為基板的一面經樹脂成形的結構。於此種結構中，經樹脂成形的面是與基板連接的電子元件經樹脂密封而成的面，被稱為「密封面」或「封裝面」。另一方面，與經樹脂成形的面相反的一側的未經樹脂成形的面露出了通常作為製品的外部連接電極發揮功能的引線，因此被稱為引線面。於所述引線為球柵陣列（Ball Grid Array，BGA）等的電子零件中使用的突起狀電極的情況下，有時亦被稱為「球面」。進而，與經樹脂成形的面相反的一側的未經樹脂成形的面亦有未形成引線的形態，因此有時亦被稱為「基板面」。於本實施形態的說明中，將經樹脂成形的面記載為「密封面」或「封裝面」，將與經樹脂成形的面相反的一側的未經樹脂成形的面記載為「引線面」。The sealed substrate W and product P of this embodiment have a structure in which one side of the substrate is resin-molded. In this structure, the resin-molded surface is the surface where the electronic components connected to the substrate are sealed with resin, and is called the "sealing surface" or "packaging surface". On the other hand, the non-resin-molded surface opposite to the resin-molded surface exposes leads that usually function as external connection electrodes of the product, and is therefore called a lead surface. When the lead is a protruding electrode used in electronic components such as a Ball Grid Array (BGA), it is sometimes called a "spherical surface". Furthermore, the non-resin-molded surface opposite to the resin-molded surface may also have a form in which leads are not formed, so it is sometimes called the "substrate surface". In the description of this embodiment, the resin-molded surface will be described as the "sealing surface" or "packaging surface", and the non-resin-molded surface on the opposite side to the resin-molded surface will be described as the "lead surface". .

另外，為了能夠藉由檢查部13來檢查多個製品P的兩面，設置有使多個製品P反轉的反轉機構14（參照圖1）。所述反轉機構14具有保持多個製品P的保持台141、以及使該保持台141以成為表背相反的方式反轉的馬達等反轉部142。In addition, in order to enable the inspection unit 13 to inspect both sides of the plurality of products P, an inversion mechanism 14 for inverting the plurality of products P is provided (see FIG. 1 ). The reversal mechanism 14 includes a holding base 141 that holds a plurality of products P, and a reversing portion 142 such as a motor that reverses the holding base 141 so that the front and back thereof are reversed.

於第二保持機構6自加工台2A、加工台2B保持多個製品P時，製品P的封裝面朝向下側。於此狀態下，於自加工台2A、加工台2B向反轉機構14搬送多個製品P的中途，藉由第一檢查部131來檢查製品P的封裝面。其後，保持於第二保持機構6的多個製品P由反轉機構14反轉，再次，藉由第二保持機構6保持。於此狀態下，製品P的引線面朝向下側，使第二保持機構6移動至第二檢查部132，藉此檢查製品P的引線面。When the second holding mechanism 6 holds a plurality of products P from the processing tables 2A and 2B, the packaging surface of the products P faces downward. In this state, while the plurality of products P are being transported from the processing tables 2A and 2B to the reversing mechanism 14 , the sealing surface of the products P is inspected by the first inspection unit 131 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 and held by the second holding mechanism 6 again. In this state, the lead surface of the product P faces downward, and the second holding mechanism 6 is moved to the second inspection part 132 to inspect the lead surface of the product P.

＜第二保持機構＞ 如圖1所示，第二保持機構6為了將多個製品P自切斷用台2A、切斷用台2B搬送至移載台5而保持多個製品P。如圖8所示，所述第二保持機構6具有：吸附頭61，設置有用以吸附保持多個製品P的多個吸附部611；以及真空泵（未圖示），連接於該吸附頭61的吸附部611。繼而，藉由吸附頭61由後述的搬送用移動機構7等移動至所需的位置，從而將多個製品P自切斷用台2A、切斷用台2B搬送至保持台141或移載台5。 ＜Second holding mechanism＞ As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5 . As shown in FIG. 8 , the second holding mechanism 6 includes: an adsorption head 61 provided with a plurality of adsorption portions 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the adsorption head 61 . Adsorption part 611. Then, the adsorption head 61 is moved to a required position by the transportation moving mechanism 7 described below, and the plurality of products P are transported from the cutting table 2A and the cutting table 2B to the holding table 141 or the transfer table. 5.

＜搬送用移動機構＞ 如圖1所示，搬送用移動機構7使第一保持機構3至少於基板供給機構11與切斷用台2A、切斷用台2B之間移動，並且使第二保持機構6至少於切斷用台2A、切斷用台2B與保持台141之間移動。 ＜Moving mechanism for transportation＞ As shown in FIG. 1 , the transport moving mechanism 7 moves the first holding mechanism 3 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B. The table 2A, the cutting table 2B and the holding table 141 move among each other.

而且，如圖1所示，搬送用移動機構7具有：共用的傳遞軸71，沿著兩個切斷用台2A、2B及移載台5的排列方向（X方向）一直線地延伸，用以使第一保持機構3及第二保持機構6移動。Furthermore, as shown in FIG. 1 , the transport moving mechanism 7 has a common transmission shaft 71 extending linearly along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5 . The first holding mechanism 3 and the second holding mechanism 6 are moved.

所述傳遞軸71設於下述範圍，即：第一保持機構3可移動至基板供給機構11的基板供給部112的上方，並且第二保持機構6可移動至移載台5的上方（參照圖1）。另外，相對於所述傳遞軸71，第一保持機構3、第二保持機構6、切斷用台2A、切斷用台2B及移載台5於平面視時設置於同側（近前側）。此外，檢查部13、反轉機構14、各種托盤21、托盤搬送機構22、托盤收容部23、後述的第一清潔機構18及第二清潔機構19、回收容器172亦相對於傳遞軸71而設置於同側（近前側）。The transmission shaft 71 is provided in a range in which the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer stage 5 (see Figure 1). In addition, with respect to the transmission shaft 71 , the first holding mechanism 3 , the second holding mechanism 6 , the cutting table 2A, the cutting table 2B, and the transfer table 5 are provided on the same side (the near side) in plan view. . In addition, the inspection part 13 , the reversing mechanism 14 , various pallets 21 , the pallet transport mechanism 22 , the pallet storage part 23 , the first cleaning mechanism 18 and the second cleaning mechanism 19 described below, and the recovery container 172 are also provided relative to the transmission shaft 71 On the same side (near front side).

進而，如圖5、圖6及圖8所示，搬送用移動機構7具有：主移動機構72，使第一保持機構3及第二保持機構6沿著傳遞軸71於X方向移動；升降移動機構73，使第一保持機構3及第二保持機構6相對於傳遞軸71於Z方向升降移動；以及水平移動機構74，使第一保持機構3及第二保持機構6相對於傳遞軸71於Y方向水平移動。Furthermore, as shown in FIGS. 5 , 6 and 8 , the transport moving mechanism 7 has: a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transmission shaft 71 ; and a lifting movement. The mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal movement mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move in the Z direction relative to the transmission shaft 71. Move horizontally in Y direction.

如圖5～圖8所示，主移動機構72具有：共用的導軌721，設置於傳遞軸71、且導引第一保持機構3及第二保持機構6；以及齒條與小齒輪機構722，使第一保持機構3及第二保持機構6沿著該導軌721移動。As shown in Figures 5 to 8, the main moving mechanism 72 has: a common guide rail 721, which is provided on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 are moved along the guide rail 721 .

導軌721沿著傳遞軸71於X方向一直線地延伸，與傳遞軸71同樣地設於下述範圍，即：第一保持機構3可移動至基板供給機構11的基板供給部112的上方，並且第二保持機構6可移動至移載台5的上方。於所述導軌721，能夠滑動地設置有滑動構件723，所述滑動構件723經由升降移動機構73及水平移動機構74而設置有第一保持機構3及第二保持機構6。此處，導軌721為第一保持機構3及第二保持機構6所共用，但升降移動機構73、水平移動機構74及滑動構件723是針對第一保持機構3及第二保持機構6各自而分別設置。The guide rail 721 extends linearly in the X direction along the transmission shaft 71 , and is provided in a range where the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 721 is provided in a range similar to the transmission shaft 71 . The second holding mechanism 6 can move above the transfer platform 5 . A sliding member 723 is slidably provided on the guide rail 721 , and the sliding member 723 is provided with a first holding mechanism 3 and a second holding mechanism 6 via a lifting and lowering movement mechanism 73 and a horizontal movement mechanism 74 . Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6 , but the lifting and lowering movement mechanism 73 , the horizontal movement mechanism 74 and the sliding member 723 are separate for each of the first holding mechanism 3 and the second holding mechanism 6 . settings.

齒條與小齒輪機構722具有：凸輪齒條722a，為第一保持機構3及第二保持機構6所共用；以及小齒輪722b，分別設置於第一保持機構3及第二保持機構6，由致動器（未圖示）旋轉。凸輪齒條722a設置於共用的傳遞軸71，可藉由將多個凸輪齒條要素連結從而變更為各種長度。另外，小齒輪722b設置於滑動構件723，被稱為所謂滾子小齒輪（roller pinion），如圖7所示，具有：與馬達的旋轉軸一起旋轉的一對滾子本體722b1，以及於該一對滾子本體722b1之間於圓周方向等間隔地設置、且以相對於滾子本體722b1能夠滾動的方式設置的多個滾子銷722b2。本實施形態的齒條與小齒輪機構722使用所述滾子小齒輪，故而兩個以上的滾子銷722b2與凸輪齒條722a接觸，於正反方向不產生背隙（backlash），於使第一保持機構3及第二保持機構6於X方向移動時定位精度變良好。The rack and pinion mechanism 722 has: a cam rack 722a, which is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion gear 722b, which is respectively provided in the first holding mechanism 3 and the second holding mechanism 6. The actuator (not shown) rotates. The cam rack 722a is provided on the common transmission shaft 71 and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723 and is called a so-called roller pinion. As shown in FIG. 7, it has a pair of roller bodies 722b1 that rotate together with the rotation axis of the motor, and A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are disposed to be rollable with respect to the roller body 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion. Therefore, two or more roller pins 722b2 are in contact with the cam rack 722a, and no backlash is generated in the forward and reverse directions, so that the third roller pinion can be used. When the first holding mechanism 3 and the second holding mechanism 6 move in the X direction, the positioning accuracy becomes better.

如圖5及圖8所示，升降移動機構73是與第一保持機構3及第二保持機構6分別對應地設置。如圖5及圖6所示，第一保持機構3的升降移動機構73介於傳遞軸71（具體而言為主移動機構72）與第一保持機構3之間而設置，具有：Z方向導軌73a，沿著Z方向設置；以及致動器部73b，使第一保持機構3沿著該Z方向導軌73a移動。再者，致動器部73b例如可使用滾珠螺桿機構，亦可使用氣缸，亦可使用直線馬達。再者，如圖8所示，第二保持機構6的升降移動機構73的結構與第一保持機構3的升降移動機構73同樣。As shown in FIGS. 5 and 8 , the lifting and lowering movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the lifting and lowering movement mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72 ) and the first holding mechanism 3 , and has a Z-direction guide rail. 73a, which is arranged along the Z direction; and the actuator part 73b, which moves the first holding mechanism 3 along the Z direction guide rail 73a. Furthermore, the actuator part 73b may use a ball screw mechanism, a cylinder, or a linear motor, for example. Furthermore, as shown in FIG. 8 , the structure of the lifting and lowering movement mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and lowering movement mechanism 73 of the first holding mechanism 3 .

如圖5及圖8所示，水平移動機構74是與第一保持機構3及第二保持機構6分別對應地設置。如圖5及圖6所示，第一保持機構3的水平移動機構74是介於傳遞軸71（具體而言為升降移動機構73）與第一保持機構3之間而設置，具有：Y方向導軌74a，沿著Y方向設置；彈性體74b，對第一保持機構3向Y方向導軌74a的其中一側賦予力；以及凸輪機構74c，使第一保持機構3向Y方向導軌74a的另一側移動。此處，凸輪機構74c使用偏心凸輪，藉由利用馬達等致動器使該偏心凸輪旋轉，從而可調整第一保持機構3於Y方向的移動量。As shown in FIGS. 5 and 8 , the horizontal moving mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the lifting movement mechanism 73 ) and the first holding mechanism 3 , and has: Y direction The guide rail 74a is arranged along the Y direction; the elastic body 74b applies force to the first holding mechanism 3 to one side of the Y direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move to the other side of the Y direction guide rail 74a. Move sideways. Here, the cam mechanism 74c uses an eccentric cam, and by rotating the eccentric cam using an actuator such as a motor, the movement amount of the first holding mechanism 3 in the Y direction can be adjusted.

再者，如圖8所示，第二保持機構6的水平移動機構74的結構與第一保持機構3的升降移動機構73同樣。另外，可設為未對第二保持機構6設置有水平移動機構74的結構，亦可設為未對第一保持機構3及第二保持機構6兩者設置有水平移動機構74的結構。進而，水平移動機構74與升降移動機構73同樣地，亦可不使用凸輪機構74c而使用例如滾珠螺桿機構，亦可使用氣缸，亦可使用直線馬達。Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3 . In addition, the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be provided with the horizontal movement mechanism 74 . Furthermore, like the up-and-down movement mechanism 73 , the horizontal movement mechanism 74 may not use the cam mechanism 74 c but may use, for example, a ball screw mechanism, a cylinder, or a linear motor.

＜切斷用移動機構（加工用移動機構）＞ 切斷用移動機構8使兩個心軸42A、42B的各個於X方向、Y方向及Z方向分別獨立地直線移動。 ＜Moving mechanism for cutting (moving mechanism for processing)＞ The moving mechanism 8 for cutting linearly moves each of the two spindles 42A and 42B independently in the X direction, the Y direction, and the Z direction.

具體而言，如圖2、圖3、圖9及圖10所示，切斷用移動機構8包括：X方向移動部81，使心軸42A、心軸42B於X方向直線移動；Y方向移動部82，使心軸42A、心軸42B於Y方向直線移動；以及Z方向移動部83，使心軸42A、心軸42B於Z方向直線移動。Specifically, as shown in FIGS. 2 , 3 , 9 and 10 , the moving mechanism 8 for cutting includes an X-direction moving part 81 that moves the spindles 42A and 42B linearly in the X direction; and moves the spindles in the Y direction. The part 82 linearly moves the spindles 42A and 42B in the Y direction; and the Z-direction moving part 83 linearly moves the spindles 42A and 42B in the Z direction.

X方向移動部81為兩個切斷用台2A、2B所共用，尤其如圖2及圖3所示，具有：沿著X方向夾持兩個切斷用台2A、2B而設置的一對X方向導軌811；以及支持體812，沿著該一對X方向導軌811移動並且經由Y方向移動部82及Z方向移動部83支持心軸42A、心軸42B。一對X方向導軌811設置於沿著X方向設置的兩個切斷用台2A、2B的側方。另外，支持體812例如為門型，具有沿Y方向延伸的形狀。具體而言，支持體812具有自一對X方向導軌811向上方延伸的一對腳部、以及架設於該一對腳部的樑部（橫樑部），該樑部沿Y方向延伸。The X-direction moving part 81 is shared by the two cutting tables 2A and 2B. As shown in FIGS. 2 and 3 , it has a pair of two cutting tables 2A and 2B sandwiched along the X direction. The X-direction guide rail 811; and the support body 812 move along the pair of X-direction guide rails 811 and support the spindles 42A and 42B via the Y-direction moving part 82 and the Z-direction moving part 83. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. In addition, the support 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam (crossbeam) installed on the pair of legs and extending in the Y-direction.

而且，支持體812例如藉由沿X方向延伸的滾珠螺桿機構813而於一對X方向導軌811上沿著X方向直線往返移動。所述滾珠螺桿機構813由伺服馬達等驅動源（未圖示）驅動。除此以外，支持體812亦可以藉由直線馬達等其他直動機構而往返移動的方式構成。Furthermore, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a driving source (not shown) such as a servo motor. In addition, the support body 812 may also be configured to reciprocate by a linear motor or other linear motion mechanism.

尤其如圖3所示，Y方向移動部82具有：Y方向導軌821，於支持體812中沿著Y方向設置；以及Y方向滑塊822，沿著該Y方向導軌821移動。Y方向滑塊822例如由直線馬達823驅動，於Y方向導軌821上直線往返移動。本實施形態中，與兩個心軸42A、42B對應地設置有兩個Y方向滑塊822。藉此，兩個心軸42A、42B能夠相互獨立地於Y方向移動。除此以外，Y方向滑塊822亦可以藉由使用滾珠螺桿機構的其他直動機構而往返移動的方式構成。Especially as shown in FIG. 3 , the Y-direction moving part 82 has a Y-direction guide rail 821 provided along the Y-direction in the support 812 and a Y-direction slider 822 that moves along the Y-direction guide rail 821 . The Y-direction slider 822 is driven by a linear motor 823, for example, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindles 42A and 42B. Thereby, the two spindles 42A and 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 can also be configured to reciprocate by using other linear motion mechanisms such as ball screw mechanisms.

如圖9及圖10所示，Z方向移動部83具有：Z方向導軌831，於各Y方向滑塊822中沿著Z方向設置；以及Z方向滑塊832，沿著所述Z方向導軌831移動並且支持心軸42A、心軸42B。即，Z方向移動部83是與各心軸42A、42B對應地設置。Z方向滑塊832例如由偏心凸輪機構（未圖示）驅動，於Z方向導軌831上直線往返移動。除此以外，Z方向滑塊832亦可以藉由滾珠螺桿機構等其他直動機構而往返移動的方式構成。As shown in FIGS. 9 and 10 , the Z-direction moving part 83 has a Z-direction guide rail 831 provided in each Y-direction slider 822 along the Z-direction; and a Z-direction slider 832 along the Z-direction guide rail 831 The spindles 42A and 42B are moved and supported. That is, the Z-direction moving part 83 is provided corresponding to each of the spindles 42A and 42B. The Z-direction slider 832 is driven by an eccentric cam mechanism (not shown), for example, and moves linearly back and forth on the Z-direction guide rail 831 . In addition, the Z-direction slider 832 can also be configured to move back and forth by other linear motion mechanisms such as a ball screw mechanism.

關於所述切斷用移動機構8與傳遞軸71的位置關係，如圖1及圖4所示，以傳遞軸71於切斷用移動機構8的上方橫穿切斷用移動機構8的方式配置。具體而言，傳遞軸71以於支持體812的上方橫穿該支持體812的方式配置，傳遞軸71及支持體812成為相互交叉的位置關係。Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71 , as shown in FIGS. 1 and 4 , the transmission shaft 71 is arranged above the cutting moving mechanism 8 and traverses the cutting moving mechanism 8 . . Specifically, the transmission shaft 71 is arranged above the support body 812 and crosses the support body 812 , and the transmission shaft 71 and the support body 812 have a mutually intersecting positional relationship.

＜蓋構件＞ 如圖3、圖9及圖10所示，於所述切斷用移動機構8中，於支持體812設置有收容兩個心軸42A、42B的蓋構件15。再者，於圖2中省略了蓋構件15。所述蓋構件15不僅收容兩個心軸42A、42B，而且收容噴射噴嘴121，以使自噴射噴嘴121噴射的切削水不會向周圍飛濺。 <Cover member> As shown in FIGS. 3 , 9 and 10 , in the cutting moving mechanism 8 , the support 812 is provided with a cover member 15 that accommodates the two spindles 42A and 42B. In addition, the cover member 15 is omitted in FIG. 2 . The cover member 15 accommodates not only the two spindles 42A and 42B but also the injection nozzle 121 so that the cutting water injected from the injection nozzle 121 does not splash around.

具體而言，如圖9及圖10所示，蓋構件15於下表面形成有用以使刀片41A、刀片41B露出的開口部15a。另外，於蓋構件15的上表面形成有開口部15b，以不妨礙心軸42A、42B或切斷用移動機構8的移動。所述上表面的開口部15b被蛇腹構件16封閉，構成為蛇腹構件16隨著心軸42A、心軸42B的移動而伸縮。形成心軸42A、心軸42B的X方向的兩側、Y方向的兩側及上側被該些蓋構件15及蛇腹構件16覆蓋的結構，自噴射噴嘴121噴射的切削水飛濺的範圍受到限制。另外，於蓋構件15的近前側（與支持體812相反的一側）的側壁形成有能夠看見蓋構件15的內部的窗151（參照圖10）。進而，藉由利用排氣機構（未圖示）對所述蓋構件15的周圍進行排氣，可有效地將液滴（霧）排出至外部。Specifically, as shown in FIGS. 9 and 10 , the opening 15 a for exposing the blades 41A and 41B is formed on the lower surface of the cover member 15 . In addition, an opening 15b is formed on the upper surface of the cover member 15 so as not to interfere with the movement of the spindles 42A and 42B or the cutting moving mechanism 8 . The opening 15b of the upper surface is closed by the bellows member 16, and the bellows member 16 is configured to expand and contract in accordance with the movement of the spindles 42A and 42B. The structure in which both sides of the spindles 42A and 42B in the X direction, both sides in the Y direction, and the upper side are covered by the cover member 15 and the bellows member 16 limits the splash range of the cutting water sprayed from the injection nozzle 121 . In addition, a window 151 through which the inside of the cover member 15 can be seen is formed on the side wall on the front side of the cover member 15 (the side opposite to the support 812 ) (see FIG. 10 ). Furthermore, by exhausting the surroundings of the cover member 15 using an exhaust mechanism (not shown), the liquid droplets (mist) can be efficiently exhausted to the outside.

＜加工屑收容部＞ 另外，如圖1所示，本實施形態的切斷裝置100更包括：加工屑收容部17，收容因密封完畢基板W的切斷而產生的端材等加工屑S。 ＜Machining waste storage unit＞ In addition, as shown in FIG. 1 , the cutting device 100 of this embodiment further includes a processing waste storage portion 17 for storing processing waste S such as end materials generated by cutting the sealed substrate W.

如圖2～圖4所示，所述加工屑收容部17設置於切斷用台2A、切斷用台2B的下方，具有：導引滑槽171，具有於平面視時包圍切斷用台2A、切斷用台2B的上部開口171X；以及回收容器172，將由該導引滑槽171所導引的加工屑S回收。藉由將加工屑收容部17設置於切斷用台2A、切斷用台2B的下方，從而可提高加工屑S的回收率。As shown in FIGS. 2 to 4 , the processing chip storage portion 17 is provided below the cutting tables 2A and 2B, and has a guide chute 171 surrounding the cutting table in plan view. 2A. The upper opening 171X of the cutting table 2B; and the recovery container 172 to recover the processing chips S guided by the guide chute 171. By arranging the processing waste storage portion 17 below the cutting tables 2A and 2B, the recovery rate of the processing waste S can be improved.

導引滑槽171將自切斷用台2A、切斷用台2B飛散或掉落的加工屑S導引至回收容器172。本實施形態中，以導引滑槽171的上部開口171X包圍切斷用台2A、切斷用台2B的方式構成（參照圖3），故而不易漏掉加工屑S，可進一步提高加工屑S的回收率。另外，導引滑槽171以包圍設置於切斷用台2A、切斷用台2B之下的旋轉機構9A、旋轉機構9B的方式設置（參照圖4），以保護旋轉機構9A、旋轉機構9B免受加工屑S及切削水的方式構成。The guide chute 171 guides the processing chips S scattered or dropped from the cutting tables 2A and 2B to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A and 2B (see FIG. 3 ). Therefore, the processing chips S are less likely to be missed, and the processing chips S can be further increased. recovery rate. In addition, the guide chute 171 is provided to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4 ) to protect the rotating mechanisms 9A and 9B. It is free from machining chips S and cutting water.

本實施形態中，加工屑收容部17為兩個切斷用台2A、2B所共用，但亦可與切斷用台2A、切斷用台2B分別對應地設置。In this embodiment, the processing chip receiving part 17 is shared by the two cutting tables 2A and 2B, but may be provided corresponding to the cutting table 2A and the cutting table 2B respectively.

回收容器172將因自重而通過導引滑槽171的加工屑S回收，本實施形態中，如圖4等所示，與兩個切斷用台2A、2B分別對應地設置。而且，兩個回收容器172配置於傳遞軸的近前側，以可分別獨立地自切斷裝置100的近前側卸除的方式構成。藉由所述結構，可提高加工屑S的廢棄等的維護性。再者，回收容器172可考慮密封完畢基板W的尺寸或加工屑S的尺寸及量、作業性等而於所有切斷用台之下總體設置一個，亦可設置三個以上。The recovery container 172 collects the processing chips S that have passed through the guide chute 171 due to its own weight. In the present embodiment, as shown in FIG. 4 and others, it is provided corresponding to the two cutting tables 2A and 2B. Furthermore, the two recovery containers 172 are arranged on the front side of the transmission shaft, and are configured to be independently detachable from the front side of the cutting device 100 . With this structure, maintenance such as disposal of machining chips S can be improved. Furthermore, one recovery container 172 may be provided under all the cutting tables, or three or more recovery containers 172 may be provided in consideration of the size of the sealed substrate W, the size and amount of the processing chips S, workability, etc.

另外，如圖4等所示，加工屑收容部17具有將切削水與加工屑分離的分離部173。作為所述分離部173的結構，例如可想到於回收容器172的底面設置使切削水通過的多孔板等過濾器。藉由所述分離部173，可不於回收容器172蓄積切削水而將加工屑S回收。In addition, as shown in FIG. 4 etc., the machining chip storage part 17 has the separation part 173 which separates cutting water and machining chips. As a structure of the separation unit 173 , for example, a filter such as a porous plate that allows cutting water to pass is provided on the bottom surface of the recovery container 172 . The separation part 173 allows the processing chips S to be recovered without accumulating cutting water in the recovery container 172 .

＜第一清潔機構＞ 另外，如圖1及圖5所示，本發明的切斷裝置100更包括：第一清潔機構18，將保持於切斷用台2A、切斷用台2B的多個製品P的上表面側（引線面）清潔。所述第一清潔機構18藉由對保持於切斷用台2A、切斷用台2B的多個製品P的上表面噴射洗淨液及/或壓縮空氣的噴射噴嘴18a（參照圖5），來清潔製品P的上表面側。 ＜First Cleaning Mechanism＞ In addition, as shown in FIGS. 1 and 5 , the cutting device 100 of the present invention further includes a first cleaning mechanism 18 for cleaning the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. (lead side) clean. The first cleaning mechanism 18 uses a spray nozzle 18 a (see FIG. 5 ) that sprays cleaning fluid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. to clean the upper surface side of product P.

如圖5所示，所述第一清潔機構18以能夠與第一保持機構3一起沿著傳遞軸71移動的方式構成。此處，第一清潔機構18設置於滑動構件723，所述滑動構件723在設置於傳遞軸71的導軌721上滑動。此處，於第一清潔機構18及滑動構件723之間，設置有用以使第一清潔機構18於Z方向升降移動的升降移動機構181。關於所述升降移動機構181，例如可想到使用齒條與小齒輪機構，使用滾珠螺桿機構，或使用氣缸等。As shown in FIG. 5 , the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on the sliding member 723 which slides on the guide rail 721 provided on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the sliding member 723, a lifting and lowering movement mechanism 181 for lifting and lowering the first cleaning mechanism 18 in the Z direction is provided. As the lifting and lowering movement mechanism 181 , for example, it is conceivable to use a rack and pinion mechanism, a ball screw mechanism, or a cylinder.

＜第二清潔機構＞ 進而，如圖1所示，本發明的切斷裝置100更包括：第二清潔機構19，將保持於第二保持機構6的多個製品P的下表面側（封裝面）清潔。所述第二清潔機構19設置於切斷用台2B與檢查部13之間，藉由向保持於第二保持機構6的多個製品P的下表面噴射洗淨液及/或壓縮空氣，從而清潔製品P的下表面側。即，於第二保持機構6沿著傳遞軸71移動的中途，第二清潔機構19將製品P的下表面側清潔。 ＜Second cleaning mechanism＞ Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 for cleaning the lower surface side (sealing surface) of the plurality of products P held by the second holding mechanism 6 . The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection part 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. Clean the lower surface side of the product P. That is, while the second holding mechanism 6 is moving along the transmission shaft 71 , the second cleaning mechanism 19 cleans the lower surface side of the product P.

＜切斷裝置的動作的一例＞ 繼而，對切斷裝置100的動作的一例加以說明。圖11中，表示切斷裝置10的動作中的第一保持機構3的移動路徑、及第二保持機構6的移動路徑。再者，本實施形態中，切斷裝置100的動作、例如密封完畢基板W的搬送、密封完畢基板W的切斷、製品P的檢查等所有動作或控制是由控制部CTL（參照圖1）進行。 ＜Example of operation of cutting device＞ Next, an example of the operation of the cutting device 100 will be described. FIG. 11 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting device 10 . In addition, in this embodiment, all operations or controls of the cutting device 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, etc., are performed by the control unit CTL (see FIG. 1) conduct.

基板供給機構11的基板供給部112使收容於基板收容部111的密封完畢基板W向由第一保持機構3保持的保持位置RP移動。The substrate supply part 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating part 111 to the holding position RP held by the first holding mechanism 3 .

繼而，搬送用移動機構7使第一保持機構3移動至保持位置RP，第一保持機構3吸附保持密封完畢基板W。其後，搬送用移動機構7使保持有密封完畢基板W的第一保持機構3移動至切斷用台2A、切斷用台2B，第一保持機構3解除吸附保持，將密封完畢基板W載置於切斷用台2A、切斷用台2B。此時，藉由主移動機構72來調整密封完畢基板W的X方向的位置，藉由水平移動機構74來調整密封完畢基板W的Y方向的位置。而且，切斷用台2A、切斷用台2B吸附保持密封完畢基板W。Then, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transport moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and holds the sealed substrate W. Place them on the cutting table 2A and the cutting table 2B. At this time, the X-direction position of the sealed substrate W is adjusted by the main moving mechanism 72 , and the Y-direction position of the sealed substrate W is adjusted by the horizontal moving mechanism 74 . Furthermore, the cutting table 2A and the cutting table 2B adsorb and hold the sealed substrate W.

此處，於使保持有密封完畢基板W的第一保持機構3移動至切斷用台2B的情況下，升降移動機構73使第一保持機構3上升至不與切斷用移動機構8（支持體812）發生物理干擾的位置為止。再者，於使保持有密封完畢基板W的第一保持機構3移動至切斷用台2B時，於使支持體812自切斷用台2B向移載台5側退避的情況下，無需如所述般使第一保持機構3升降。Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and lowering moving mechanism 73 raises the first holding mechanism 3 to a position where it is not in contact with the cutting moving mechanism 8 (support Body 812) to the location where physical interference occurs. Furthermore, when moving the first holding mechanism 3 holding the sealed substrate W to the cutting stage 2B, and retracting the support 812 from the cutting stage 2B to the transfer stage 5 side, there is no need to do the following. As described above, the first holding mechanism 3 is raised and lowered.

於此狀態下，切斷用移動機構8使兩個心軸42A、42B於X方向及Y方向依序移動，並且切斷用台2A、2B旋轉，藉此將密封完畢基板W切斷為格子狀而單片化。In this state, the cutting moving mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate, thereby cutting the sealed substrate W into a grid. Shape and monolithic.

於切斷後，搬送用移動機構7使第一清潔機構18移動，將保持於切斷用台2A、切斷用台2B的多個製品P的上表面側（引線面）清潔。所述清潔之後，搬送用移動機構7使第一保持機構3及第一清潔機構18退避至既定位置。After cutting, the conveyance moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the above cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

繼而，搬送用移動機構7使第二保持機構6移動至切斷後的切斷用台2A、切斷用台2B，第二保持機構6吸附保持多個製品P。其後，搬送用移動機構7使保持有多個製品P的第二保持機構6移動至第二清潔機構19。藉此，第二清潔機構19將保持於第二保持機構6的多個製品P的下表面側（封裝面）清潔。Then, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 adsorbs and holds the plurality of products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (sealing surface) of the plurality of products P held by the second holding mechanism 6 .

於清潔之後，保持於第二保持機構6的多個製品P藉由檢查部13及反轉機構14進行兩面檢查。其後，搬送用移動機構7使第二保持機構6移動至移載台5，第二保持機構6解除吸附保持，將多個製品P載置於移載台5。載置於移載台5的多個製品P根據由檢查部13所得的檢查結果（良品、不良品等）而由分類機構20分類至各種托盤21。After cleaning, the plurality of products P held in the second holding mechanism 6 are inspected on both sides by the inspection part 13 and the reversing mechanism 14 . Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 to the transfer table 5, and the second holding mechanism 6 releases the suction holding, and places the plurality of products P on the transfer table 5. The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the classification mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13 .

再者，關於兩面檢查，例如，首先於由第二保持機構6吸附保持的狀態下檢查製品P的其中一個面。接著，自第二保持機構6將製品P移載至反轉機構14的保持台141，於由反轉後的保持台141吸附保持的狀態下檢查製品P的另一面，藉此可執行兩面檢查。而且，之後的自反轉台14向移載台5的製品P的搬送可藉由自保持台141移載至第二保持機構6來進行。另外，將保持台141設為能夠於X方向移動的結構，將保持台141或移載台5的至少其中一者設為能夠於Z方向移動的結構，使保持台141移動至移載台5的上方，藉此亦可將製品P搬送至移載台5並進行移載。Furthermore, regarding the double-sided inspection, for example, first one of the surfaces of the product P is inspected while being suction-held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being adsorbed and held by the reversed holding table 141, thereby performing double-sided inspection. . Furthermore, subsequent transportation of the product P from the reversing stage 14 to the transfer stage 5 can be performed by transferring the product P from the holding stage 141 to the second holding mechanism 6 . In addition, the holding base 141 is configured to be movable in the X direction, at least one of the holding base 141 and the transfer table 5 is made to be movable in the Z direction, and the holding base 141 is moved to the transfer base 5 above, the product P can also be transported to the transfer table 5 and transferred.

＜本實施形態的效果＞ 根據本實施形態的切斷裝置100，設為藉由沿著切斷用台2A、切斷用台2B及移載台5的排列方向延伸的共用的傳遞軸71來使第一保持機構3及第二保持機構6的結構，藉由切斷用移動機構8使切斷機構4於水平面上於沿著傳遞軸71的X方向及與X方向正交的Y方向分別移動，因此可不使切斷用台2A、切斷用台2B於X方向及Y方向移動而對密封完畢基板W進行加工。因此，可不藉由滾珠螺桿機構使切斷用台2A、切斷用台2B移動，而無需用以保護滾珠螺桿機構的蛇腹構件及用以保護該蛇腹構件的蓋構件。其結果為，可使切斷裝置100的裝置結構簡化。另外，可設為不使切斷用台2A、切斷用台2B於X方向及Y方向移動的結構，可減小切斷裝置100的佔據面積。 <Effects of this embodiment> According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the first holding mechanism 3 are moved by the common transmission shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5 . The second holding mechanism 6 has a structure in which the cutting moving mechanism 8 moves the cutting mechanism 4 on the horizontal plane in the X direction along the transmission axis 71 and in the Y direction orthogonal to the X direction, so that cutting is not required. The sealed substrate W is processed by moving the table 2A and the cutting table 2B in the X direction and the Y direction. Therefore, the cutting table 2A and the cutting table 2B can be moved without using the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are not required. As a result, the device structure of the cutting device 100 can be simplified. In addition, the cutting table 2A and the cutting table 2B can be configured so as not to move in the X direction and the Y direction, so that the area occupied by the cutting device 100 can be reduced.

於本實施方式中，設置於X方向的一對X方向導軌811夾持切斷用台2A、切斷用台2B而設置，因此可增大一對X方向導軌811的間距。其結果，可減小X方向導軌811彼此於Z方向上的位置偏移對加工的影響。進而，藉由增大一對導軌811的間距而提高X方向移動部81的直進性，其結果，刀片41A、刀片41B的刀尖的晃動變小，切斷時的切削阻力等變小，從而可提高加工精度。另外，X方向導軌811可使用規格較先前低的構件。In this embodiment, the pair of X-direction guide rails 811 provided in the X-direction are provided sandwiching the cutting table 2A and the cutting table 2B. Therefore, the distance between the pair of X-direction guide rails 811 can be increased. As a result, the influence of the positional deviation of the X-direction guide rails 811 in the Z-direction on the processing can be reduced. Furthermore, by increasing the distance between the pair of guide rails 811, the straightness of the X-direction moving part 81 is improved. As a result, the wobbling of the blade tips of the blades 41A and 41B is reduced, and the cutting resistance during cutting is reduced, thereby reducing the cutting resistance. Can improve processing accuracy. In addition, the X-direction guide rail 811 can use components with lower specifications than before.

於本實施形態中，由於兩個以上的切斷用台2A、2B於切斷時不於Y方向移動，因此可一併調整相對於兩個以上的切斷用台2A、2B而言的移動機構8（X方向移動部81）於X方向的平行度。即，於切斷時切斷用台移動的現有裝置中設置兩個切斷用台的情況下，需要調整兩個切斷用台於X方向的平行度，進而對所述調整後的於X方向的平行度以及刀片於X方向的平行度進行調整（具體而言，需要進行兩次調整），於本實施形態中，兩個切斷用台2A、2B於切斷時不於X方向移動，因此只需要調整刀片41A、刀片41B於X方向的平行度即可（具體而言，只需要調整一次）。In this embodiment, since the two or more cutting tables 2A and 2B do not move in the Y direction during cutting, the movement of the two or more cutting tables 2A and 2B can be adjusted simultaneously. The parallelism of the mechanism 8 (X-direction moving part 81) in the X direction. That is, when two cutting stages are installed in a conventional device that moves the cutting stage during cutting, it is necessary to adjust the parallelism of the two cutting stages in the X direction, and then adjust the adjusted parallelism in the X direction. The parallelism of the direction and the parallelism of the blade in the X direction are adjusted (specifically, two adjustments are required). In this embodiment, the two cutting tables 2A and 2B do not move in the X direction during cutting. , so it is only necessary to adjust the parallelism of the blades 41A and 41B in the X direction (specifically, it only needs to be adjusted once).

另外，由於為兩個以上的切斷用台2A、2B沿著X方向而設置並且使支持心軸42A、心軸42B的支持體812沿著X方向移動的結構，因此可於藉由其中一個切斷用台2A處理密封完畢基板W時，於另一個切斷用台2B進行搬送等的其他處理。In addition, since it is a structure in which two or more cutting tables 2A and 2B are provided along the X direction and the support 812 supporting the mandrels 42A and 42B is moved in the X direction, it is possible to use one of them When the sealed substrate W is processed by the cutting station 2A, other processing such as transportation is performed on the other cutting station 2B.

＜其他變形實施形態＞ 再者，本發明並不限於所述實施形態。 ＜Other variations＞ In addition, the present invention is not limited to the above-described embodiment.

例如，所述實施形態中，對雙切割台方式且雙心軸結構的切斷裝置進行了說明，但並不限於此，亦可為單切割台方式且單心軸結構的切斷裝置、或單切割台方式且雙心軸結構的切斷裝置等。For example, in the above embodiment, a cutting device with a double cutting table type and a double mandrel structure has been described, but the invention is not limited thereto. A cutting device with a single cutting table type and a single mandrel structure may also be used, or Single cutting table type and double mandrel structure cutting device, etc.

另外，所述實施形態的移載台5為於分類至各種托盤21之前暫時載置的索引台，但亦可將移載台5設為反轉機構14的保持台141。In addition, the transfer table 5 in the above embodiment is an index table that is temporarily placed before sorting into various pallets 21 , but the transfer table 5 may also be used as the holding table 141 of the reversing mechanism 14 .

進而，於所述實施形態中，為自移載台5分類至托盤21的結構，但亦可為將製品P搬送並貼附於框狀構件的內側所配置的黏接帶上的結構。Furthermore, in the above-described embodiment, the structure is configured to sort the products P from the transfer stage 5 to the tray 21. However, the structure may also be a structure in which the product P is transported and attached to an adhesive tape arranged inside the frame-shaped member.

而且，於所述實施形態的結構中，亦可設為下述結構，即：於切斷用台2A、切斷用台2B中不將密封完畢基板切斷，而是形成槽。於此情況下，例如亦可設為下述結構，即：於切斷用台2A、切斷用台2B實施了槽加工的密封完畢基板W藉由第一保持機構3及搬送用移動機構7而回到基板供給部112。另外，亦可設為下述結構，即：將回到所述基板供給部112的密封完畢基板W收容於基板收容部111。Moreover, in the structure of the said embodiment, you may make it a structure in which the sealed board|substrate is not cut|disconnected but groove|channel is formed in the cutting table 2A and the cutting table 2B. In this case, for example, a structure may be adopted in which the sealed substrate W that has been grooved on the cutting tables 2A and 2B is moved by the first holding mechanism 3 and the transport moving mechanism 7 And return to the substrate supply unit 112 . In addition, a structure may be adopted in which the sealed substrate W returned to the substrate supply part 112 is accommodated in the substrate accommodating part 111 .

另外，構成傳遞軸71的凸輪齒條要素可將多個連結而構成，因而例如可將切斷裝置（加工裝置）100設為於第二清潔機構19與檢查部13之間可分離及連結（可裝卸）的模組結構。於此情況下，例如可於第二清潔機構19側的模組、與檢查部13側的模組之間，追加進行與檢查部13中的檢查為不同種類的檢查的模組。再者，除了此處例示的結構以外，亦可將切斷裝置（加工裝置）100設為能夠於某處分離及連結（能夠裝卸）的模組結構，亦可將追加的模組設為檢查以外的各種功能的模組。In addition, the cam rack element constituting the transmission shaft 71 can be configured by connecting a plurality of cam rack elements. Therefore, for example, the cutting device (processing device) 100 can be configured to be separable and connectable between the second cleaning mechanism 19 and the inspection unit 13 ( removable) module structure. In this case, for example, a module that performs a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Furthermore, in addition to the structure illustrated here, the cutting device (processing device) 100 may be configured as a module structure that can be separated and connected (removable) somewhere, or an additional module may be configured as an inspection unit. Modules with various functions other than.

另外，本發明的加工裝置亦可進行切斷以外的加工，例如亦可進行切削或磨削等其他機械加工。In addition, the processing device of the present invention can also perform processing other than cutting, for example, it can also perform other mechanical processing such as cutting or grinding.

除此以外，本發明不限於所述實施形態，當然能夠於不偏離其主旨的範圍進行各種變形。 [產業上的可利用性] In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. [Industrial availability]

本發明可使裝置結構簡化並且減少佔據面積。The invention can simplify the device structure and reduce the occupied area.

2A、2B:切斷用台（加工台） 3:第一保持機構 4:切斷機構（加工機構） 5:移載台 6:第二保持機構 7:搬送用移動機構 8:切斷用移動機構（加工用移動機構）（移動機構） 9A、9B:旋轉機構 10A、10B:真空泵 11:基板供給機構 12:液體供給機構 13:檢查部 14:反轉機構（反轉台） 15:蓋構件 15a、15b:開口部 16:蛇腹構件 17:加工屑收容部 18:第一清潔機構 18a、121:噴射噴嘴 19:第二清潔機構 20:分類機構 21:托盤 22:托盤搬送機構 23:托盤收容部 31、61:吸附頭 40:旋轉工具 41A、41B:刀片 42A、42B:心軸 71:共用的傳遞軸 72:主移動機構 73:升降移動機構 73a:Z方向導軌 74a:水平導軌（Y方向導軌） 73b:致動器部 74:水平移動機構 74b:彈性體 74c:凸輪機構 81:X方向移動部（第一方向移動部） 82:Y方向移動部（第二方向移動部） 83:Z方向移動部 100:切斷裝置（加工裝置） 111:基板收容部 112:基板供給部 113:加熱部 131:第一檢查部 132:第二檢查部 141:保持台 142:反轉部 151:窗 171:導引滑槽 171X:上部開口 172:回收容器 173:分離部 181:升降移動機構 311、611:吸附部 721:共用的導軌 722:齒條與小齒輪機構 722a:共用的凸輪齒條 722b:小齒輪 722b1:滾子本體 722b2:滾子銷 723:滑動構件 811:一對第一方向導軌（X方向導軌）（導軌） 812:支持體 813:滾珠螺桿機構 821:Y方向導軌 822:Y方向滑塊822 823:直線馬達 831:Z方向導軌 832:Z方向滑塊 CTL:控制部 P:製品 RP:保持位置 S:加工屑 W:密封完畢基板（加工對象物） X、Y:軸方向（方向） Z、θ:方向 2A, 2B: Cutting table (processing table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5:Transfer platform 6: Second holding mechanism 7:Moving mechanism for transportation 8: Moving mechanism for cutting (moving mechanism for processing) (moving mechanism) 9A, 9B: Rotating mechanism 10A, 10B: Vacuum pump 11:Substrate supply mechanism 12:Liquid supply mechanism 13:Inspection Department 14: Reversal mechanism (reversal table) 15: cover member 15a, 15b: opening 16: Belly component 17: Processing waste collection department 18:The first cleaning agency 18a, 121: Injection nozzle 19:Second cleaning mechanism 20:Classification agency 21:Pallet 22:Pallet transport mechanism 23:Pallet storage department 31, 61: Adsorption head 40: Rotary tool 41A, 41B: Blade 42A, 42B: Spindle 71: Shared transmission shaft 72: Main moving mechanism 73: Lifting and moving mechanism 73a:Z direction guide rail 74a: Horizontal guide rail (Y direction guide rail) 73b: Actuator part 74: Horizontal moving mechanism 74b: Elastomer 74c: Cam mechanism 81: X-direction moving part (first direction moving part) 82: Y-direction moving part (second direction moving part) 83:Z direction moving part 100: Cutting device (processing device) 111:Substrate receiving section 112:Substrate supply department 113:Heating part 131:First Inspection Department 132:Second Inspection Department 141:Keeping platform 142:Reversal Department 151:window 171:Guide chute 171X: Upper opening 172:Recycling container 173:Separation Department 181: Lifting and moving mechanism 311, 611: Adsorption department 721: Shared guide rail 722: Rack and pinion mechanism 722a: Shared cam rack 722b: pinion 722b1:Roller body 722b2:Roller pin 723:Sliding member 811: A pair of first direction guide rails (X direction guide rails) (guide rails) 812:Support 813: Ball screw mechanism 821: Y direction guide rail 822: Y direction slider 822 823:Linear motor 831:Z direction guide rail 832:Z direction slider CTL:Control Department P:Products RP: maintain position S: Processing chips W: Sealed substrate (object to be processed) X, Y: axis direction (direction) Z, θ: direction

圖1為示意性地表示本發明的一實施形態的切斷裝置的結構的圖。 圖2為示意性地表示所述實施形態的切斷用台及其周邊結構的立體圖。 圖3為示意性地表示所述實施形態的切斷用台及其周邊結構的結構的、自Z方向觀看的圖（平面圖）。 圖4為示意性地表示所述實施形態的切斷用台及其周邊結構的結構的、自Y方向觀看的圖（正面圖）。 圖5為示意性地表示所述實施形態的第一保持機構及搬送用移動機構的結構的、自Y方向觀看的圖（正面圖）。 圖6為示意性地表示所述實施形態的第一保持機構及搬送用移動機構的結構的、自X方向觀看的圖（側面圖）。 圖7為示意性地表示所述實施形態的第二保持機構及搬送用移動機構的結構的、自Y方向觀看的圖（正面圖）。 圖8為示意性地表示所述實施形態的齒條與小齒輪（rack and pinion）機構的結構的剖面圖。 圖9為示意性地表示所述實施形態的加工用移動機構及蓋構件的結構的、自X方向觀看的剖面圖。 圖10為示意性地表示所述實施形態的加工用移動機構及蓋構件的結構的、自Y方向觀看的剖面圖。 圖11為表示所述實施形態的切斷裝置的動作的示意圖。 FIG. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing the cutting table of the embodiment and its peripheral structure. FIG. 3 is a diagram (plan view) viewed from the Z direction, schematically showing the structure of the cutting table and its surrounding structures according to the embodiment. FIG. 4 is a diagram (front view) viewed from the Y direction, schematically showing the structure of the cutting table and its surrounding structures according to the embodiment. 5 is a diagram (front view) viewed from the Y direction, schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment. 6 is a diagram (side view) viewed from the X direction, schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment. 7 is a diagram (front view) viewed from the Y direction schematically showing the structure of the second holding mechanism and the transport moving mechanism of the embodiment. FIG. 8 is a cross-sectional view schematically showing the structure of a rack and pinion mechanism according to the embodiment. 9 is a cross-sectional view viewed from the X direction schematically showing the structure of the processing moving mechanism and the cover member of the embodiment. 10 is a cross-sectional view viewed from the Y direction schematically showing the structure of the processing moving mechanism and the cover member of the embodiment. Fig. 11 is a schematic diagram showing the operation of the cutting device according to the embodiment.

2A、2B:切斷用台(加工台) 2A, 2B: Cutting table (processing table)

3:第一保持機構 3: The first holding mechanism

4:切斷機構(加工機構) 4: Cutting mechanism (processing mechanism)

5:移載台 5:Transfer platform

6:第二保持機構 6: Second holding mechanism

7:搬送用移動機構 7:Moving mechanism for transportation

8:切斷用移動機構(加工用移動機構)(移動機構) 8: Moving mechanism for cutting (moving mechanism for processing) (moving mechanism)

9A、9B:旋轉機構 9A, 9B: Rotating mechanism

10A、10B:真空泵 10A, 10B: Vacuum pump

11:基板供給機構 11:Substrate supply mechanism

13:檢查部 13:Inspection Department

14:反轉機構(反轉台) 14: Reversal mechanism (reversal table)

17:加工屑收容部 17: Processing waste collection department

18:第一清潔機構 18:The first cleaning agency

19:第二清潔機構 19:Second cleaning mechanism

20:分類機構 20:Classification agency

21:托盤 21:Pallet

22:托盤搬送機構 22:Pallet transport mechanism

23:托盤收容部 23:Pallet storage department

40:旋轉工具 40: Rotary tool

41A、41B:刀片 41A, 41B: Blade

42A、42B:心軸 42A, 42B: Spindle

71:共用的傳遞軸 71: Shared transmission shaft

100:切斷裝置(加工裝置) 100: Cutting device (processing device)

111:基板收容部 111:Substrate receiving section

112:基板供給部 112:Substrate supply department

113:加熱部 113:Heating part

131:第一檢查部 131:First Inspection Department

132:第二檢查部 132:Second Inspection Department

141:保持台 141:Keeping platform

142:反轉部 142:Reversal Department

172:回收容器 172:Recycling container

812:支持體 812:Support

CTL:控制部 CTL:Control Department

RP:保持位置 RP: maintain position

W:密封完畢基板(加工對象物) W: Sealed substrate (object to be processed)

X、Y:軸方向(方向) X, Y: axis direction (direction)

Z、θ:方向 Z, θ: direction

Claims (16)

一種加工裝置，包括： 加工台，保持加工對象物； 第一保持機構，為了將所述加工對象物搬送至所述加工台而保持所述加工對象物； 加工機構，對保持於所述加工台的所述加工對象物進行加工； 移載台，移動加工後的所述加工對象物； 第二保持機構，為了將加工後的所述加工對象物自所述加工台搬送至所述移載台而保持加工後的所述加工對象物； 搬送用移動機構，具有沿著所述加工台及所述移載台的排列方向延伸且用以使所述第一保持機構及所述第二保持機構移動的共用的傳遞軸；以及 加工用移動機構，使所述加工機構於水平面上於沿著所述傳遞軸的第一方向及與所述第一方向正交的第二方向分別移動， 其中，所述加工用移動機構包括：使所述加工機構於所述第一方向直線移動的第一方向移動部、以及使所述加工機構於所述第二方向直線移動的兩個第二方向移動部， 且所述第一方向移動部具有：一對第一方向導軌，沿著所述第一方向夾持所述加工台而設置；以及支持體，沿著所述一對第一方向導軌移動，並且經由所述第二方向移動部支持所述加工機構， 所述加工台是設成固定於所述第一方向及所述第二方向。 A processing device including: The processing table holds the processing object; a first holding mechanism that holds the object to be processed in order to transport the object to be processed to the processing table; a processing mechanism that processes the object to be processed held on the processing table; A transfer platform to move the processed object; a second holding mechanism that holds the processed object to be processed in order to transport the processed object from the processing table to the transfer table; A transport moving mechanism has a common transmission shaft extending along the arrangement direction of the processing table and the transfer table and for moving the first holding mechanism and the second holding mechanism; and a processing moving mechanism that moves the processing mechanism on a horizontal plane in a first direction along the transmission axis and in a second direction orthogonal to the first direction, Wherein, the processing moving mechanism includes: a first direction moving part for linearly moving the processing mechanism in the first direction, and two second directions for linearly moving the processing mechanism in the second direction. mobile department, And the first direction moving part has: a pair of first direction guide rails, which are arranged to sandwich the processing table along the first direction; and a support body which moves along the pair of first direction guide rails, and supporting the processing mechanism via the second direction moving part, The processing table is fixed in the first direction and the second direction. 如請求項1所述的加工裝置，其中所述加工台包括多個，且所述多個加工台在所述一對第一方向導軌之間，沿著所述第一方向排列。The processing device according to claim 1, wherein the processing tables include a plurality of processing tables, and the plurality of processing tables are arranged along the first direction between the pair of first direction guide rails. 如請求項2所述的加工裝置，其中所述多個加工台及所述移載台沿著所述第一方向排列。The processing device according to claim 2, wherein the plurality of processing tables and the transfer table are arranged along the first direction. 如請求項1至請求項3中任一項所述的加工裝置，其中所述加工機構具有多個刀片, 且具備第一清潔機構，所述第一清潔機構將保持於所述加工台的加工後的所述加工對象物的上表面側進行清潔， 所述第一清潔機構以能夠與所述第一保持機構一起沿著所述傳遞軸移動的方式構成。 The processing device according to any one of claims 1 to 3, wherein the processing mechanism has a plurality of blades, and a first cleaning mechanism for cleaning the upper surface side of the processed object held on the processing table, The first cleaning mechanism is configured to be movable along the transmission shaft together with the first holding mechanism. 如請求項1至請求項3中任一項所述的加工裝置，其中，所述傳遞軸以於所述加工用移動機構的上方橫穿所述加工用移動機構的方式配置。The processing apparatus according to any one of claims 1 to 3, wherein the transmission shaft is disposed above the processing moving mechanism and crossing the processing moving mechanism. 如請求項1至請求項3中任一項所述的加工裝置，其中，所述加工台構成為能夠於水平面上旋轉。The processing device according to any one of claims 1 to 3, wherein the processing table is configured to be rotatable on a horizontal plane. 如請求項1至請求項3中任一項所述的加工裝置，其中，所述第一保持機構、所述第二保持機構、所述加工台及所述移載台於平面視時相對於所述傳遞軸而設置於同側。The processing device according to any one of claims 1 to 3, wherein the first holding mechanism, the second holding mechanism, the processing table and the transfer table are relative to each other in plan view. The transmission shafts are arranged on the same side. 如請求項1至請求項3中任一項所述的加工裝置，更包括第二清潔機構，所述第二清潔機構將保持於所述第二保持機構的加工後的所述加工對象物的下表面側進行清潔。The processing device according to any one of claims 1 to 3, further comprising a second cleaning mechanism that retains the processed object in the second holding mechanism. Clean the lower surface side. 如請求項1至請求項3中任一項所述的加工裝置，更包括：檢查部，檢查保持於所述第二保持機構的加工後的所述加工對象物；以及 反轉機構，為了能夠藉由所述檢查部檢查加工後的所述加工對象物的兩面而使加工後的所述加工對象物反轉。 The processing device according to any one of claims 1 to 3, further comprising: an inspection unit that inspects the processed object held by the second holding mechanism; and The reversing mechanism reverses the processed object so that both sides of the processed object can be inspected by the inspection unit. 如請求項1至請求項3中任一項所述的加工裝置，其中，所述搬送用移動機構具有：共用的導軌，設置於所述傳遞軸上、且導引所述第一保持機構及所述第二保持機構；以及齒條與小齒輪機構，使所述第一保持機構及所述第二保持機構沿著所述共用的導軌移動， 所述齒條與小齒輪機構具有：凸輪齒條，為所述第一保持機構及所述第二保持機構所共用；以及小齒輪，分別設置於所述第一保持機構及所述第二保持機構，由致動器旋轉。 The processing device according to any one of claims 1 to 3, wherein the transport moving mechanism has a common guide rail provided on the transmission shaft and guiding the first holding mechanism and the second holding mechanism; and the rack and pinion mechanism to move the first holding mechanism and the second holding mechanism along the common guide rail, The rack and pinion mechanism has: a cam rack, which is shared by the first holding mechanism and the second holding mechanism; and pinions, which are respectively provided on the first holding mechanism and the second holding mechanism. mechanism, rotated by an actuator. 如請求項1至請求項3中任一項所述的加工裝置，其中，所述搬送用移動機構更包括： 升降移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸升降移動；以及 水平移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸沿著所述第二方向移動。 The processing device according to any one of claims 1 to 3, wherein the transport moving mechanism further includes: A lifting and moving mechanism is provided between the transmission shaft and the first holding mechanism, and causes the first holding mechanism to lift and move relative to the transmission shaft; and A horizontal moving mechanism is provided between the transmission shaft and the first holding mechanism, and moves the first holding mechanism in the second direction relative to the transmission shaft. 如請求項11所述的加工裝置，其中，所述水平移動機構具有：水平導軌，沿著所述第二方向設置且導引所述第一保持機構；彈性體，對所述第一保持機構向所述水平導軌的其中一側賦予力；以及凸輪機構，使所述第一保持機構向所述水平導軌的另一側移動。The processing device according to claim 11, wherein the horizontal moving mechanism has: a horizontal guide rail disposed along the second direction and guiding the first holding mechanism; and an elastic body that moves the first holding mechanism applying force to one side of the horizontal guide rail; and a cam mechanism to move the first holding mechanism to the other side of the horizontal guide rail. 如請求項1至請求項3中任一項所述的加工裝置，更包括加工屑收容部，所述加工屑收容部設置於所述加工台的下方、且收容由所述加工機構進行的加工而產生的加工屑。The processing device according to any one of Claims 1 to 3, further comprising a machining waste storage portion, which is disposed below the processing table and stores the processing performed by the processing mechanism. The processing chips generated. 如請求項13所述的加工裝置，其中，所述加工屑收容部具有：導引滑槽，具有於平面視時包圍所述加工台的上部開口；以及回收容器，將由所述導引滑槽所導引的加工屑回收。The processing device according to claim 13, wherein the processing chip receiving part has: a guide chute with an upper opening surrounding the processing table in plan view; and a recovery container, which is moved by the guide chute. Guided machining chip recovery. 如請求項1至請求項3中任一項所述的加工裝置，其中，所述加工對象物是經樹脂密封的密封完畢基板， 所述加工機構藉由利用刀片將所述密封完畢基板切斷，從而單片化為多個製品。 The processing apparatus according to any one of claims 1 to 3, wherein the object to be processed is a resin-sealed sealed substrate, The processing mechanism cuts the sealed substrate using a blade, thereby singulating it into a plurality of products. 一種加工品的製造方法，使用如請求項1至請求項15中任一項所述的加工裝置來製造加工品。A method of manufacturing a processed product using the processing device according to any one of claims 1 to 15.
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