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TWI809659B - Double-sided adhesive sheet with backing - Google Patents

Double-sided adhesive sheet with backing Download PDF

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Publication number
TWI809659B
TWI809659B TW111101692A TW111101692A TWI809659B TW I809659 B TWI809659 B TW I809659B TW 111101692 A TW111101692 A TW 111101692A TW 111101692 A TW111101692 A TW 111101692A TW I809659 B TWI809659 B TW I809659B
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Taiwan
Prior art keywords
liner
double
adhesive sheet
sided adhesive
layer
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TW111101692A
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Chinese (zh)
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TW202235567A (en
Inventor
平山高正
西尾昭德
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本發明提供一種附襯墊之雙面黏著片材,其係於兩面具有襯墊之雙面黏著片材,且將任一襯墊先剝離,雙面黏著片材均僅殘存於另一襯墊。 本發明之附襯墊之雙面黏著片材具備雙面黏著片材、可剝離地直接配置於該雙面黏著片材之一面之第1襯墊、及可剝離地直接配置於該雙面黏著片材之另一面之第2襯墊。 The present invention provides a double-sided adhesive sheet with a liner, which is a double-sided adhesive sheet with a liner on both sides, and any liner is peeled off first, and the double-sided adhesive sheet remains only on the other liner . The double-sided adhesive sheet with liner of the present invention includes a double-sided adhesive sheet, a first liner releasably disposed directly on one side of the double-sided adhesive sheet, and a first liner releasably disposed directly on the double-sided adhesive sheet. Second liner on the other side of the sheet.

Description

附襯墊之雙面黏著片材Double-sided adhesive sheet with backing

本發明係關於一種附襯墊之雙面黏著片材。The invention relates to a double-sided adhesive sheet with a liner.

先前以來,於各種情況下使用雙面黏著片材。雙面黏著片材能夠藉由黏著劑層於兩面表現出黏著性。於此種雙面黏著片材中,在供於使用之前之期間,於其黏著面可剝離地配置有剝離紙、剝離襯墊等保護層(以下,亦稱為襯墊)之情況較多。Heretofore, double-sided adhesive sheets have been used in various cases. The double-sided adhesive sheet can express adhesiveness on both sides through the adhesive layer. In such a double-sided adhesive sheet, protective layers (hereinafter, also referred to as liners) such as release paper and release liner are releasably arranged on the adhesive surface until it is used.

上述襯墊配置於雙面黏著片材之兩面,將一襯墊剝離時,雙面黏著片材成分(實質上係黏著劑層成分)之一部分會附著於剝離側之襯墊(先剝離襯墊),有時會產生雙面黏著片材分開保持於2片襯墊之現象(非意願分離現象)。若產生該非意願分離現象,則無法平滑地貼附雙面黏著片材,或者即便貼附,有時亦會產生外觀不良(例如,專利文獻1)。The above-mentioned liner is arranged on both sides of the double-sided adhesive sheet. When one liner is peeled off, a part of the double-sided adhesive sheet component (essentially the adhesive layer component) will adhere to the liner on the peeled side (the liner is first peeled off) ), sometimes the phenomenon that the double-sided adhesive sheet is kept separately on the two liners (unintentional separation phenomenon). When this unintentional separation phenomenon occurs, the double-sided adhesive sheet cannot be attached smoothly, or even if attached, an appearance defect may occur (for example, patent document 1).

對於如上所述之問題,已知有對2片襯墊對黏著片材之剝離力設置差異之技術。藉由該技術,將一襯墊剝離時,雙面黏著片材保持於剝離力較高之襯墊側,從而防止非意願分離現象。Regarding the above-mentioned problems, there is known a technique of providing a difference in the peeling force of the two liners to the adhesive sheet. With this technology, when a liner is peeled off, the double-sided adhesive sheet remains on the side of the liner with a higher release force, thereby preventing unwanted separation.

另一方面,有時對雙面黏著片材要求再剝離性。再剝離性係僅賦予雙面黏著片材之一面,或者以可於不同時點表現之方式賦予兩面。例如,作為可適宜用作電子零件等之加工中之暫時固定材的黏著片材,已知有一面因外部刺激(例如加熱、紫外線照射等)而失去黏著性之雙面黏著片材。此種雙面黏著片材可以如下方式使用:將因外部刺激而失去黏著性之面設為作業台側,於另一面配置電子零件等被黏著體,對該被黏著體進行加工等,其後,藉由外部刺激將雙面黏著片材自作業台剝離。藉此,可在將電子零件固定於黏著片材之狀態下供於後續步驟。On the other hand, re-peelability may be required for a double-sided adhesive sheet. The re-peelability is imparted to only one side of the double-sided adhesive sheet, or is imparted to both sides in such a manner that it can be expressed at different points of time. For example, double-sided adhesive sheets in which one side loses adhesiveness due to external stimuli (such as heating, ultraviolet radiation, etc.) are known as adhesive sheets that can be suitably used as temporary fixing materials during processing of electronic parts and the like. Such a double-sided adhesive sheet can be used in such a way that the surface that loses its adhesiveness due to external stimuli is placed on the side of the workbench, an adherend such as electronic parts is placed on the other side, and the adherend is processed, etc., and thereafter , the double-sided adhesive sheet was peeled off from the workbench by an external stimulus. Thereby, the electronic component can be used for a subsequent process in the state which fixed the adhesive sheet.

將如上所述之具有再剝離性之雙面黏著片材作為代表例,於兩面之黏著及/或剝離機制不同之雙面黏著片材中,欲供於貼合之面存在先後關係,有時會特定出配置於兩面之襯墊之剝離順序。於此種情形時,配置於欲先貼合之面之襯墊必須以低於另一襯墊之剝離力剝離。然而,於上述「對2片襯墊對黏著片材之剝離力設置差異之技術」中,不一定可構成為將配置於欲先貼合之面之襯墊以低剝離力剝離,存在無法有效地應用該技術之情形。 先前技術文獻 專利文獻 Taking the above-mentioned double-sided adhesive sheet with releasability as a representative example, in the double-sided adhesive sheet with different adhesion and/or peeling mechanisms on both sides, there is a sequential relationship between the side to be bonded, and sometimes The peeling order of the liners arranged on both sides will be specified. In this case, the liner arranged on the side to be bonded first must be peeled off with a lower peeling force than the other liner. However, in the above-mentioned "technique of setting difference in peeling force between two liners and adhesive sheets", it is not necessarily possible to make the liner arranged on the surface to be bonded first be peeled off with a low peel force, and it is not effective. the application of the technology. prior art literature patent documents

專利文獻1:日本專利特開2003-201452號公報Patent Document 1: Japanese Patent Laid-Open No. 2003-201452

[發明所欲解決之問題][Problem to be solved by the invention]

本發明係為了解決上述先前之問題而完成者,其目的在於提供一種附襯墊之雙面黏著片材,其係於兩面具有襯墊之雙面黏著片材,且將任一襯墊先剝離,雙面黏著片材均僅殘存於另一襯墊。 [解決問題之技術手段] The present invention is completed in order to solve the above-mentioned previous problems. Its purpose is to provide a double-sided adhesive sheet with a liner, which is a double-sided adhesive sheet with a liner on both sides, and any liner is peeled off first. , the double-sided adhesive sheet remains only on the other liner. [Technical means to solve the problem]

本發明之附襯墊之雙面黏著片材具備:雙面黏著片材;第1襯墊,其可剝離地直接配置於該雙面黏著片材之一面;及第2襯墊,其可剝離地直接配置於該雙面黏著片材之另一面;該雙面黏著片材具備以與該第1襯墊相接之方式配置之第1黏著劑層,該第1黏著劑層包含熱膨脹性微球,該第1襯墊對雙面黏著片材之剝離力為0.001 N/50 mm~2 N/50 mm,該第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)為1×10 -7~1×10 -2(N/m),該第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)為1×10 -7~1×10 -2(N/m),該第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)、該第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)、及構成該雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)滿足下述(1)及(2)之關係。 0.001≤(I)/{(II)+(III)}≤1500・・・(1) 0.001≤(II)/{(I)+(III)}≤1500・・・(2) 於一個實施方式中,上述雙面黏著片材依序具備上述第1黏著劑層、基材、及第2黏著劑層。 於一個實施方式中,構成上述雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)為1×10 -6Nm~1×10 -1Nm。 於一個實施方式中,上述第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)、上述第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)、及構成上述雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)滿足下述(3)之關係。 0.001≤{(I)+(II)}/(III)≤1500・・・(3) 於一個實施方式中,上述第1襯墊及/或第2襯墊藉由螢光X射線分析所得之Si-Kα射線之強度為0.01~500 kcps。 於一個實施方式中,構成上述雙面黏著片材之層中之至少1層為著色層。 於一個實施方式中,上述第1襯墊及/或第2襯墊之厚度為10 μm~100 μm。 於一個實施方式中,上述第1襯墊之厚度與第2襯墊之厚度不同。 於一個實施方式中,上述第1黏著劑層及/或第2黏著劑層包含丙烯酸系黏著劑。 於一個實施方式中,上述丙烯酸系黏著劑包含丙烯酸系聚合物,該丙烯酸系聚合物包含源自具有活性氫基之單體之結構單元。 於一個實施方式中,上述源自具有活性氫基之單體之結構單元之含量相對於構成上述丙烯酸系聚合物之總結構單元為0.1重量%~20重量%。 於一個實施方式中,上述第1襯墊對雙面黏著片材之剝離力與上述第2襯墊對雙面黏著片材之剝離力之差之絕對值為0.5 N/50 mm以下。 於一個實施方式中,上述附襯墊之雙面黏著片材為捲筒狀。 於一個實施方式中,上述附襯墊之雙面黏著片材於製造CSP(Chip Size/Scale Package,晶片級封裝)時用作暫時固定半導體晶片之片材。 於一個實施方式中,上述附襯墊之雙面黏著片材於製造WLP(Wafer Level Package,晶圓級封裝)時,用作暫時固定半導體晶片之片材。 於一個實施方式中,上述附襯墊之雙面黏著片材用於包含先將上述第2襯墊剝離之步驟之加工。 [發明之效果] The double-sided adhesive sheet with a liner of the present invention comprises: a double-sided adhesive sheet; a first liner, which is releasably disposed directly on one side of the double-sided adhesive sheet; and a second liner, which is releasable directly arranged on the other side of the double-sided adhesive sheet; the double-sided adhesive sheet has a first adhesive layer arranged in contact with the first liner, and the first adhesive layer contains thermally expandable Ball, the peeling force of the first liner to the double-sided adhesive sheet is 0.001 N/50 mm to 2 N/50 mm, the third power of the thickness of the first liner and the modulus of elasticity of the first liner The product (I) is 1×10 -7 ~ 1×10 -2 (N/m), and the product (II) of the third power of the thickness of the second gasket and the modulus of elasticity of the second gasket is 1× 10 -7 ~ 1×10 -2 (N/m), the product (I) of the third power of the thickness of the first liner and the modulus of elasticity of the first liner, three times the thickness of the second liner square and the product (II) of the modulus of elasticity of the second liner, and the total of all layers of the product of the cube of the thickness of the single layer of each layer of the double-sided adhesive sheet and the product of the modulus of elasticity of the single layer (III) satisfy The relationship between (1) and (2) below. 0.001≤(I)/{(II)+(III)}≤1500・・・(1) 0.001≤(II)/{(I)+(III)}≤1500・・・(2) In one embodiment wherein, the double-sided adhesive sheet includes the first adhesive layer, the substrate, and the second adhesive layer in this order. In one embodiment, the total (III) of all the layers constituting the product of the single-layer thickness cubed and the single-layer elastic modulus of each layer constituting the above-mentioned double-sided adhesive sheet is 1×10 -6 Nm to 1×10 -1 Nm. In one embodiment, the product (I) of the cube of the thickness of the first liner and the modulus of elasticity of the first liner, the cube of the thickness of the second liner and the elasticity of the second liner The product (II) of the modulus and the sum of all the layers (III) of the product of the cube of the single-layer thickness of each layer constituting the above-mentioned double-sided adhesive sheet and the product of the single-layer elastic modulus satisfy the relationship of the following (3). 0.001≤{(I)+(II)}/(III)≤1500・・・(3) In one embodiment, the first spacer and/or the second spacer are obtained by fluorescent X-ray analysis The intensity of Si-Kα rays is 0.01-500 kcps. In one embodiment, at least one layer among the layers constituting the double-sided adhesive sheet is a colored layer. In one embodiment, the thickness of the first spacer and/or the second spacer is 10 μm˜100 μm. In one embodiment, the thickness of the first liner is different from the thickness of the second liner. In one embodiment, the first adhesive layer and/or the second adhesive layer include an acrylic adhesive. In one embodiment, the acrylic adhesive includes an acrylic polymer including a structural unit derived from a monomer having an active hydrogen group. In one embodiment, the content of the structural unit derived from the monomer having an active hydrogen group is 0.1% by weight to 20% by weight relative to the total structural units constituting the above-mentioned acrylic polymer. In one embodiment, the absolute value of the difference between the release force of the first liner to the double-sided adhesive sheet and the release force of the second liner to the double-sided adhesive sheet is 0.5 N/50 mm or less. In one embodiment, the double-sided adhesive sheet with a liner is in the form of a roll. In one embodiment, the above-mentioned double-sided adhesive sheet with a liner is used as a sheet for temporarily fixing a semiconductor chip when manufacturing a CSP (Chip Size/Scale Package, chip-level package). In one embodiment, the above-mentioned double-sided adhesive sheet with a liner is used as a sheet for temporarily fixing a semiconductor chip when manufacturing WLP (Wafer Level Package, Wafer Level Package). In one embodiment, the double-sided adhesive sheet with a liner is used for processing including the step of first peeling off the second liner. [Effect of Invention]

根據本發明,可提供一種附襯墊之雙面黏著片材,其於兩面具有襯墊,且將任一襯墊先剝離,雙面黏著片材均僅殘存於另一襯墊。According to the present invention, it is possible to provide a double-sided adhesive sheet with a liner, which has a liner on both sides, and any liner is peeled off first, and the double-sided adhesive sheet remains only on the other liner.

A. 襯墊 之雙面黏著片材 之概要圖1係本發明之一實施方式之附襯墊之雙面黏著片材之概略剖視圖。附襯墊之雙面黏著片材100具備雙面黏著片材10、可剝離地直接配置於雙面黏著片材10之一面之第1襯墊20、及可剝離地直接配置於雙面黏著片材10之另一面之第2襯墊30。藉由配置第1襯墊20及第2襯墊30,可保護黏著劑層免受污染等,或可防止捲筒狀或片狀之雙面黏著片材黏連。 A. Outline of double-sided adhesive sheet with liner FIG. 1 is a schematic cross-sectional view of a double-sided adhesive sheet with liner according to one embodiment of the present invention. The double-sided adhesive sheet 100 with liner includes the double-sided adhesive sheet 10, the first liner 20 that is directly disposed on one side of the double-sided adhesive sheet 10 in a peelable manner, and the first liner 20 that is directly disposed on the double-sided adhesive sheet The second gasket 30 on the other side of the material 10. By arranging the first liner 20 and the second liner 30, it is possible to protect the adhesive layer from contamination, etc., or to prevent sticking of roll-shaped or sheet-shaped double-sided adhesive sheets.

雙面黏著片材10係於兩面表現出黏著性之片材。雙面黏著片材10至少具備以與第1襯墊20相接之方式配置之第1黏著劑層11。第1黏著劑層11包含熱膨脹性微球。包含熱膨脹性微球之黏著劑層藉由加熱使該熱膨脹性微球膨脹或發泡而於黏著面產生凹凸,結果黏著力降低或消失。具備此種黏著劑層11之雙面黏著片材10可藉由加熱而容易地剝離。The double-sided adhesive sheet 10 is a sheet exhibiting adhesiveness on both sides. The double-sided adhesive sheet 10 includes at least the first adhesive layer 11 arranged so as to be in contact with the first liner 20 . The first adhesive layer 11 contains heat-expandable microspheres. The adhesive layer containing heat-expandable microspheres expands or foams the heat-expandable microspheres by heating to produce unevenness on the adhesive surface, resulting in reduced or lost adhesive force. The double-sided adhesive sheet 10 provided with such an adhesive layer 11 can be easily peeled off by heating.

雙面黏著片材可為單層(即,可為僅具備第1黏著劑層之構成),亦可為由複數層構成之積層體。於一個實施方式中,如圖1所示,雙面黏著片材10依序具備第1黏著劑層11、基材12、及第2黏著劑層13。藉由設為此種構成,可使用各種黏著劑,又,作為黏著劑層形成方法,可選擇擠出、塗佈、塗覆等各種方法且有效。The double-sided adhesive sheet may be a single layer (that is, may be composed of only the first adhesive layer), or may be a laminate composed of a plurality of layers. In one embodiment, as shown in FIG. 1 , a double-sided adhesive sheet 10 includes a first adhesive layer 11 , a base material 12 , and a second adhesive layer 13 in this order. With such a configuration, various adhesives can be used, and various methods such as extrusion, coating, and coating can be selected as the method for forming the adhesive layer, and are effective.

第1襯墊及第2襯墊對雙面黏著片材之剝離力為0.001 N/50 mm~2 N/50 mm。又,第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)為1×10 -7~1×10 -2(N/m)。又,第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)為1×10 -7~1×10 -2(N/m)。又,第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)、第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)、及構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)滿足下述(1)及(2)之關係。 0.001≤(I)/{(II)+(III)}≤1500・・・(1) 0.001≤(II)/{(I)+(III)}≤1500・・・(2) The peel force of the first liner and the second liner to the double-sided adhesive sheet is 0.001 N/50 mm to 2 N/50 mm. Also, the product (I) of the cube of the thickness of the first spacer and the modulus of elasticity of the first spacer is 1×10 -7 to 1×10 -2 (N/m). Also, the product (II) of the third power of the thickness of the second spacer and the modulus of elasticity of the second spacer is 1×10 -7 to 1×10 -2 (N/m). Also, the product (I) of the cube of the thickness of the first gasket and the modulus of elasticity of the first gasket, the product of the cube of the thickness of the second gasket and the modulus of elasticity of the second gasket (II) ), and the sum of all layers (III) of the product of the cube of the single-layer thickness of each layer constituting the double-sided adhesive sheet and the product of the single-layer elastic modulus satisfies the following relations (1) and (2). 0.001≤(I)/{(II)+(III)}≤1500・・・(1) 0.001≤(II)/{(I)+(III)}≤1500・・・(2)

根據本發明,著眼於襯墊之特性並以如上方式構成,藉此可提供將任一襯墊先剝離,雙面黏著片材均僅殘存於另一襯墊、即非意願分離現象得到防止之附襯墊之雙面黏著片材。本發明之襯墊剝離之操作性優異,且具有如下特徵:(i)容易拖拽(容易捕捉)襯墊(先剝離襯墊)之端部;(ii)可藉由小部分之上拉來獲得剝離契機;(iii)襯墊剝離時之襯墊之回折角度(較佳為90°~180°、更佳為120°~180°、進而較佳為135°~180°、進而較佳為150°~180°、尤佳為165°~180°)於剝離操作中不易變動。以如上方式將襯墊剝離時,藉由剝離操作而作用之力(剝離應力)集中於剝離襯墊之剝離部位(自黏著劑層剝離之襯墊與黏著劑層相接之部分)。結果可降低剝離所需之力,防止剝離部位之黏著劑層之破碎及需要剝離之襯墊之剝離不良等,而使雙面黏著片材僅殘存於其中一襯墊。According to the present invention, focusing on the characteristics of the liner and constituting it in the above manner, it is possible to provide that any liner is peeled off first, and the double-sided adhesive sheet remains only on the other liner, that is, the unintentional separation phenomenon is prevented. Double-sided adhesive sheet with backing. The liner of the present invention has excellent operability in stripping, and has the following characteristics: (i) easy to drag (easy to catch) the end of the liner (peel off the liner first); (ii) can be pulled up by a small part Get the opportunity to peel off; (iii) The back angle of the liner when the liner is peeled off (preferably 90°-180°, more preferably 120°-180°, more preferably 135°-180°, and more preferably 150° to 180°, especially 165° to 180°) are not easily changed during the peeling operation. When the liner is peeled off in the above manner, the force (peeling stress) acting by the peeling operation concentrates on the peeling portion of the release liner (the portion where the liner peeled off from the adhesive layer is in contact with the adhesive layer). As a result, the force required for peeling can be reduced, and the adhesive layer at the peeling part can be prevented from being broken and the liner that needs to be peeled off can be poorly peeled off, so that the double-sided adhesive sheet remains only on one of the liners.

一般而言,包含熱膨脹性微球之黏著劑層有時於表面具有隆起部,於將襯墊剝離時,有剝離應力容易集中之傾向,故具備包含熱膨脹性微球之黏著劑層但亦具有上述效果之本案發明之附襯墊之雙面黏著片材有用。In general, an adhesive layer containing heat-expandable microspheres sometimes has a raised portion on the surface, and when the liner is peeled off, the peeling stress tends to concentrate easily. Therefore, the adhesive layer containing heat-expandable microspheres also has The double-sided adhesive sheet with liner of the present invention having the above effects is useful.

上述「(I)/{(II)+(III)}」較佳為0.0035~250,更佳為0.0035~150,進而較佳為0.0035~100,尤佳為0.0035~30。上述「(II)/{(I)+(III)}」較佳為0.003~500,更佳為0.0035~300,進而較佳為0.0035~150,尤佳為0.0035~130。若為此種範圍,則上述效果變得顯著。再者,「構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)」係針對構成雙面黏著片材之各層,求出單層厚度之三次方與單層彈性模數之乘積(x1、x2、・・・),並對各層中之積(x1、x2、・・・)進行合計所得之值。例如,於雙面黏著片材具備第1黏著劑層、基材、及第2黏著劑層之情形時,第1黏著劑層之厚度之三次方與第1黏著劑層之彈性模數之乘積(x1)、基材之厚度之三次方與基材彈性模數之乘積(x2)、及第2黏著劑層之厚度之三次方與第2黏著劑層之彈性模數之乘積(x3)之合計(x1+x2+x3)相當於「構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)」。又,於雙面黏著片材具備第1黏著劑層、底塗層、基材、及第2黏著劑層之情形時,第1黏著劑層之厚度之三次方與第1黏著劑層之彈性模數之乘積(x1)、底塗層之厚度之三次方與底塗層彈性模數之乘積(x2)、基材之厚度之三次方與基材彈性模數之乘積(x3)、及第2黏著劑層之厚度之三次方與第2黏著劑層之彈性模數之乘積(x4)之合計(x1+x2+x3+x4)相當於「構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)」。The above "(I)/{(II)+(III)}" is preferably 0.0035-250, more preferably 0.0035-150, still more preferably 0.0035-100, especially preferably 0.0035-30. The above "(II)/{(I)+(III)}" is preferably 0.003-500, more preferably 0.0035-300, still more preferably 0.0035-150, especially preferably 0.0035-130. If it is such a range, the said effect will become remarkable. Furthermore, "the sum of all layers (III) of the product of the cube of the single layer thickness of each layer constituting the double-sided adhesive sheet and the product of the elastic modulus of the single layer" is calculated for each layer constituting the double-sided adhesive sheet The product (x1, x2, ...) of the third power of the thickness and the elastic modulus of the single layer, and the value obtained by summing the products (x1, x2, ...) in each layer. For example, when the double-sided adhesive sheet has a first adhesive layer, a substrate, and a second adhesive layer, the product of the cube of the thickness of the first adhesive layer and the modulus of elasticity of the first adhesive layer (x1), the product of the cube of the thickness of the substrate and the elastic modulus of the substrate (x2), and the cube of the thickness of the second adhesive layer and the product of the elastic modulus of the second adhesive layer (x3) The total (x1+x2+x3) is equivalent to "the total of all the layers (III) of the product of the cube of the single-layer thickness of each layer constituting the double-sided adhesive sheet and the single-layer elastic modulus". Also, when the double-sided adhesive sheet has a first adhesive layer, a primer layer, a substrate, and a second adhesive layer, the cube of the thickness of the first adhesive layer and the elasticity of the first adhesive layer The product of the modulus (x1), the product of the cube of the thickness of the undercoat layer and the elastic modulus of the primer layer (x2), the product of the cube of the thickness of the substrate and the elastic modulus of the substrate (x3), and the 2 The sum of the product (x1+x2+x3+x4) of the cube of the thickness of the adhesive layer and the modulus of elasticity of the second adhesive layer (x4) is equivalent to "the cube of the single-layer thickness of each layer constituting the double-sided adhesive sheet and the single-layer The sum of all the layers of the product of the modulus of elasticity (III)".

於一個實施方式中,第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)、第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)、及構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)滿足下述關係(3)。 0.001≤{(I)+(II)}/(III)≤1500・・・(3) 若為此種構成,則可獲得容易切斷且切斷時不易翹曲之附襯墊之雙面黏著片材及雙面黏著片材。此種效果於具備包含熱膨脹性微球之第1黏著劑層之雙面黏著片材中尤其有用。{(I)+(II)}/(III)更佳為0.005~1000,進而較佳為0.015~500,尤佳為0.015~300,最佳為0.015~250。 In one embodiment, the product (I) of the cube of the thickness of the first gasket and the modulus of elasticity of the first gasket, the cube of the thickness of the second gasket and the modulus of elasticity of the second gasket The product (II) of the double-sided adhesive sheet and the sum of all the layers (III) of the product of the cube of the single layer thickness of each layer constituting the double-sided adhesive sheet and the product of the single layer elastic modulus satisfy the following relationship (3). 0.001≤{(I)+(II)}/(III)≤1500・・・(3) According to such a constitution, a double-sided adhesive sheet with a liner and a double-sided adhesive sheet which are easy to cut and hardly warp when cut can be obtained. This effect is particularly useful in a double-sided adhesive sheet provided with a first adhesive layer containing heat-expandable microspheres. {(I)+(II)}/(III) is more preferably 0.005-1000, still more preferably 0.015-500, especially preferably 0.015-300, most preferably 0.015-250.

於一個實施方式中,使用上述附襯墊之雙面黏著片材時,先將第2襯墊剝離。更詳細而言,上述附襯墊之雙面黏著片材可以如下方式使用:先將第2襯墊剝離,將被黏著體(例如電子零件)貼合於露出之黏著面(例如第2黏著劑層表面),其後,將第1襯墊剝離,將第1黏著劑層表面貼合於另一被黏著體(例如台座)。於此種實施方式中,經由雙面黏著片材將被黏著體(例如電子零件)暫時固定於台座;將該被黏著體供於特定之加工;其後,藉由加熱使第1黏著劑層之黏著力降低,將附被黏著體之雙面黏著片材自台座剝離。In one embodiment, when using the above-mentioned double-sided adhesive sheet with a liner, first, the second liner is peeled off. More specifically, the above-mentioned double-sided adhesive sheet with liner can be used in the following manner: first, the second liner is peeled off, and the adherend (such as an electronic component) is attached to the exposed adhesive surface (such as the second adhesive Layer surface), after that, the first liner is peeled off, and the surface of the first adhesive layer is bonded to another adherend (such as a pedestal). In such an embodiment, the adherend (for example, an electronic component) is temporarily fixed to the stand via a double-sided adhesive sheet; the adherend is subjected to a specific process; thereafter, the first adhesive layer is heated to If the adhesive force decreases, the double-sided adhesive sheet with the adherend is peeled off from the pedestal.

B. 1 襯墊、第 2 襯墊代表性而言,上述第1襯墊及第2襯墊具備襯墊基材、及配置於襯墊基材之至少單面之剝離處理層。第1襯墊及第2襯墊係以上述剝離處理層成為雙面黏著片材側之方式配置。再者,第1襯墊及第2襯墊可為相同構成,亦可分別為不同構成。 B. First liner and second liner Typically, the above-mentioned first liner and second liner include a liner base material and a release treatment layer disposed on at least one side of the liner base material. The 1st liner and the 2nd liner are arrange|positioned so that the said release process layer may become a double-sided adhesive sheet side. In addition, the 1st spacer and the 2nd spacer may have the same structure, and may respectively have a different structure.

如上所述,第1襯墊對雙面黏著片材之剝離力為0.001 N/50 mm~2 N/50 mm。第1襯墊對雙面黏著片材之剝離力較佳為0.01 N/50 mm~1.5 N/50 mm,進而較佳為0.05 N/50 mm~1 N/50 mm,尤佳為0.1 N/50 mm~0.8 N/50 mm。藉由將襯墊對雙面黏著片材之剝離力設為上述範圍,不會將襯墊過度剝離,又,可快速進行襯墊剝離時之端面上拉,且可防止熱膨脹性微球自第1黏著劑層脫落。再者,第1襯墊對雙面黏著片材之剝離力(及第2襯墊對雙面黏著片材之剝離力)意指於23℃之環境下,將襯墊自附襯墊之雙面黏著片材之雙面黏著片材剝離(剝離角度:180°、剝離速度(拉伸速度):300 mm/min)並進行測定所得之黏著力。襯墊對雙面黏著片材之剝離力可藉由黏著劑層之組陳、襯墊之種類、對襯墊實施之表面處理等任意適當之方法進行調整。As mentioned above, the peeling force of a 1st liner with respect to a double-sided adhesive sheet is 0.001 N/50 mm - 2 N/50 mm. The peel force of the first liner to the double-sided adhesive sheet is preferably 0.01 N/50 mm to 1.5 N/50 mm, more preferably 0.05 N/50 mm to 1 N/50 mm, and most preferably 0.1 N/50 mm. 50 mm to 0.8 N/50 mm. By setting the release force of the liner to the double-sided adhesive sheet within the above-mentioned range, the liner will not be peeled off excessively, and the end surface pull can be quickly performed when the liner is peeled off, and the heat-expandable microspheres can be prevented from being released from the second side. 1 Adhesive layer peeled off. Furthermore, the peeling force of the first liner to the double-sided adhesive sheet (and the peeling force of the second liner to the double-sided adhesive sheet) means that the liner is attached to the double-sided adhesive sheet in an environment of 23°C. The double-sided adhesive sheet of the surface-adhesive sheet is peeled (peeling angle: 180°, peeling speed (stretching speed): 300 mm/min) and the resulting adhesive force is measured. The release force of the liner to the double-sided adhesive sheet can be adjusted by any appropriate method such as the composition of the adhesive layer, the type of the liner, and the surface treatment of the liner.

如上所述,第2襯墊對雙面黏著片材之剝離力為0.001 N/50 mm~2 N/50 mm。第2襯墊對雙面黏著片材之剝離力較佳為0.01 N/50 mm~1.5 N/50 mm,進而較佳為0.05 N/50 mm~1 N/50 mm,尤佳為0.1 N/50 mm~0.8 N/50 mm。As mentioned above, the peeling force of a 2nd liner with respect to a double-sided adhesive sheet is 0.001 N/50 mm - 2 N/50 mm. The peeling force of the second liner to the double-sided adhesive sheet is preferably 0.01 N/50 mm to 1.5 N/50 mm, more preferably 0.05 N/50 mm to 1 N/50 mm, especially preferably 0.1 N/50 mm 50 mm to 0.8 N/50 mm.

第1襯墊對雙面黏著片材之剝離力與第2襯墊對雙面黏著片材之剝離力可相同,亦可不同。於一個實施方式中,第1襯墊對雙面黏著片材之剝離力與第2襯墊對雙面黏著片材之剝離力之差之絕對值較佳為0.5 N/50 mm以下,更佳為0.4 N/50 mm以下,進而較佳為0.2 N/50 mm以下。根據本發明,即便不對第1襯墊與第2襯墊之剝離力設置差異,亦可獲得將任一襯墊先剝離,均可使雙面黏著片材僅殘存於另一襯墊之附襯墊之雙面黏著片材。The peeling force of the first liner to the double-sided adhesive sheet and the peeling force of the second liner to the double-sided adhesive sheet may be the same or different. In one embodiment, the absolute value of the difference between the peeling force of the first liner to the double-sided adhesive sheet and the peeling force of the second liner to the double-sided adhesive sheet is preferably 0.5 N/50 mm or less, more preferably It is 0.4 N/50 mm or less, more preferably 0.2 N/50 mm or less. According to the present invention, even if there is no difference in the release force between the first liner and the second liner, any liner can be peeled off first, and the double-sided adhesive sheet can only remain on the other liner. Adhesive sheet on both sides of the pad.

上述第1襯墊之厚度較佳為5 μm~250 μm,更佳為10 μm~200 μm,進而較佳為20~150 μm,最佳為30~100 μm。若為此種範圍,則可製成識別性優異且可容易地維持剝離時之剝離角度(回折角度)之襯墊。又,可獲得捲取成捲筒時容易捲繞且可防止沖切加工中之襯墊自黏著劑層分離(所謂之「隆起」)之不良情況之襯墊。於一個實施方式中,上述第1襯墊之厚度為10 μm~100 μm。The thickness of the first spacer is preferably 5 μm to 250 μm, more preferably 10 μm to 200 μm, further preferably 20 to 150 μm, and most preferably 30 to 100 μm. If it is within such a range, it can be used as a liner which is excellent in visibility and can easily maintain the peeling angle (folding angle) at the time of peeling. In addition, it is possible to obtain a liner that is easy to wind up when rolled into a roll and that prevents the liner from being separated from the adhesive layer during punching (so-called "bulging"). In one embodiment, the thickness of the first spacer is 10 μm˜100 μm.

上述第2襯墊之厚度較佳為5 μm~250 μm,更佳為10 μm~200 μm,進而較佳為20~150 μm,最佳為30~100 μm。於一個實施方式中,上述第2襯墊之厚度為10 μm~100 μm。The thickness of the second spacer is preferably 5 μm to 250 μm, more preferably 10 μm to 200 μm, still more preferably 20 to 150 μm, most preferably 30 to 100 μm. In one embodiment, the thickness of the second spacer is 10 μm˜100 μm.

第1襯墊之厚度與第2襯墊之厚度可相同,亦可不同。於一個實施方式中,第1襯墊之厚度與第2襯墊之厚度不同。藉由使用厚度不同之襯墊,容易識別出應剝離之襯墊。The thickness of the first liner and the thickness of the second liner may be the same or different. In one embodiment, the thickness of the first liner is different from the thickness of the second liner. By using liners of different thicknesses, it is easy to identify which liners should be peeled off.

上述第1襯墊(實質上為襯墊基材)之彈性模數為500 MPa~5000 MPa,更佳為500 MPa~4000 MPa,進而較佳為700 MPa~4000 MPa。若為此種範圍,則可獲得操作性優異,捲取成捲筒時容易捲繞,防止沖切加工中襯墊自黏著劑層分離(所謂「隆起」)之不良情況的襯墊。於說明書中,所謂彈性模數,意指於23℃之環境下藉由奈米壓痕法所得之彈性模數。藉由奈米壓痕法所得之彈性模數係指如下彈性模數:於負載時、卸載時連續測定將壓頭壓入試樣(可為襯墊基材)時之對壓頭之負載荷重與壓入深度,根據所獲得之負載荷重-壓入深度曲線求出。藉由奈米壓痕法所得之彈性模數之測定條件於下文中進行說明。The modulus of elasticity of the first gasket (essentially the gasket base material) is 500 MPa to 5000 MPa, more preferably 500 MPa to 4000 MPa, still more preferably 700 MPa to 4000 MPa. Within this range, it is possible to obtain a liner that is excellent in handleability, easy to wind up when rolled into a roll, and prevents the liner from separating from the adhesive layer during punching (so-called "bulging"). In the description, the so-called elastic modulus refers to the elastic modulus obtained by nano-indentation method under the environment of 23°C. The elastic modulus obtained by the nano-indentation method refers to the following elastic modulus: when the indenter is pressed into the sample (it can be a gasket substrate), the load and pressure on the indenter are continuously measured when the indenter is loaded and unloaded. The penetration depth can be obtained from the obtained load-indentation depth curve. The measurement conditions of the elastic modulus obtained by the nanoindentation method are described below.

上述第2襯墊(實質上為襯墊基材)之彈性模數為500 MPa~5000 MPa,更佳為500 MPa~4000 MPa,進而較佳為700 MPa~4000 MPa。第1襯墊之彈性模數與第2襯墊之彈性模數可相同,亦可不同。The modulus of elasticity of the second gasket (essentially the gasket base material) is 500 MPa to 5000 MPa, more preferably 500 MPa to 4000 MPa, still more preferably 700 MPa to 4000 MPa. The modulus of elasticity of the first gasket and the modulus of elasticity of the second gasket may be the same or different.

如上所述,第1襯墊之厚度之三次方與第1襯墊之彈性模數之乘積(I)為1×10 -7~1×10 -2(N/m)。該乘積(I)較佳為1×10 -6~5×10 -3(N/m),更佳為5×10 -6~2×10 -3(N/m)。若為此種範圍,則可獲得容易回折,又,可容易地維持剝離時之剝離角度(回折角度)之襯墊。 As described above, the product (I) of the cube of the thickness of the first spacer and the modulus of elasticity of the first liner is 1×10 -7 to 1×10 -2 (N/m). The product (I) is preferably 1×10 -6 to 5×10 -3 (N/m), more preferably 5×10 -6 to 2×10 -3 (N/m). Within this range, a liner that is easy to fold back and can easily maintain the peeling angle (folding angle) at the time of peeling can be obtained.

如上所述,第2襯墊之厚度之三次方與第2襯墊之彈性模數之乘積(II)為1×10 -7~1×10 -2(N/m)。該乘積(II)較佳為1×10 -6~5×10 -3(N/m),更佳為5×10 -6~2×10 -3(N/m),尤佳為5×10 -6~1.5×10 -3(N/m),最佳為5×10 -6~1.308×10 -3。若為此種範圍,則可獲得容易回折,又,可容易地維持剝離時之剝離角度(回折角度)之襯墊。第1襯墊之上述「乘積(I)」與第2襯墊之上述「乘積(II)」可相同,亦可不同。 As described above, the product (II) of the third power of the thickness of the second spacer and the modulus of elasticity of the second spacer is 1×10 -7 to 1×10 -2 (N/m). The product (II) is preferably 1×10 -6 to 5×10 -3 (N/m), more preferably 5×10 -6 to 2×10 -3 (N/m), most preferably 5× 10 -6 to 1.5×10 -3 (N/m), preferably 5×10 -6 to 1.308×10 -3 . Within this range, a liner that is easy to fold back and can easily maintain the peeling angle (folding angle) at the time of peeling can be obtained. The above-mentioned "product (I)" of the first liner and the above-mentioned "product (II)" of the second liner may be the same or different.

上述襯墊基材可由任意適當之材料構成。襯墊基材例如除塑膠膜、塑膠片以外,亦可使用紙、布、不織布、金屬箔或者其等之塑膠層壓體、塑膠彼此之積層體等各種片狀物。其中,就操作性或成本之觀點而言,最佳為塑膠膜或塑膠片(以下稱為塑膠膜)。作為塑膠膜之原材料,就強度、耐熱性等觀點而言,可視需要選擇。例如可例舉:聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)等將α-烯烴作為單體成分之烯烴系樹脂;聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)等聚酯;聚氯乙烯(PVC);聚苯硫醚(PPS);聚醯胺(尼龍)、全芳香族聚醯胺(芳香族聚醯胺)等醯胺系樹脂;聚醚醚酮(PEEK)、聚醯亞胺、聚醚醯亞胺、聚苯乙烯、丙烯酸系樹脂等。該等原材料可單獨使用或將2種以上組合使用。又,作為塑膠膜,可使用未延伸膜、單軸配向膜、雙軸配向膜之任一者。又,該等膜亦可為包含2層以上之膜層之積層膜,就操作性之觀點而言,亦可使用適當添加惰性粒子等潤滑劑之膜。The pad base mentioned above may be made of any suitable material. As the base material of the gasket, for example, besides plastic films and sheets, various sheets such as paper, cloth, non-woven fabric, metal foil or their plastic laminates, and laminates of plastics can be used. Among them, a plastic film or a plastic sheet (hereinafter referred to as a plastic film) is most preferable from the viewpoint of workability or cost. As the raw material of the plastic film, it can be selected according to needs in terms of strength, heat resistance, and the like. For example, polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other olefin-based resins that use α-olefin as a monomer component; polyparaphenylene Polyethylene dicarboxylate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT) and other polyesters; polyvinyl chloride (PVC); polyphenylene sulfide (PPS); Amide-based resins such as polyamide (nylon), wholly aromatic polyamide (aromatic polyamide); polyetheretherketone (PEEK), polyimide, polyetherimide, polystyrene, acrylic Department of resin, etc. These raw materials can be used individually or in combination of 2 or more types. Also, as the plastic film, any one of an unstretched film, a uniaxially oriented film, and a biaxially oriented film can be used. In addition, these films may be laminated films including two or more film layers, and films in which lubricants such as inert particles are appropriately added may also be used from the viewpoint of handleability.

作為用以形成上述剝離處理層之處理,可採用任意適當之處理。於一個實施方式中,剝離處理層係聚矽氧處理層。作為聚矽氧,可較佳地使用主成分為二甲基聚矽氧烷類且具有交聯(硬化)所需之官能基之反應性聚矽氧系化合物。其原因在於可以低分子狀態塗佈於膜,且塗佈後能夠藉由使其硬化而製成耐摩擦等之剝離處理層。作為反應性聚矽氧化合物之官能基,例如可例舉乙烯基、環氧基、烷氧基、異氰酸基等。Any appropriate treatment can be adopted as the treatment for forming the above-mentioned release treatment layer. In one embodiment, the release treatment layer is a silicone treatment layer. As the polysiloxane, a reactive polysiloxane-based compound whose main component is dimethylpolysiloxane and has a functional group required for crosslinking (hardening) can be preferably used. The reason for this is that it can be applied to a film in a low-molecular state, and it can be hardened after application to form a peeling treatment layer that is resistant to friction and the like. As the functional group of the reactive polysiloxane compound, for example, a vinyl group, an epoxy group, an alkoxy group, an isocyanate group, etc. may be mentioned.

聚矽氧處理層例如可藉由將上述反應性聚矽氧系化合物稀釋至溶劑等中進行濃度調整,並利用凹版塗佈機等進行塗佈、加熱而形成。藉由進行加熱,促進溶劑乾燥與硬化反應。此處,較佳為併用促進硬化反應之觸媒。作為觸媒,例如可利用鉑、鈀、銠、鋯、錫等金屬錯合物或胺等有機鹼、乙酸等有機酸。The silicone-treated layer can be formed, for example, by diluting the above-mentioned reactive silicone-based compound in a solvent or the like to adjust the concentration, applying it with a gravure coater or the like, and heating it. By heating, the solvent drying and hardening reactions are promoted. Here, it is preferable to use together a catalyst that accelerates the curing reaction. As the catalyst, for example, metal complexes such as platinum, palladium, rhodium, zirconium, and tin, organic bases such as amines, and organic acids such as acetic acid can be used.

於一個實施方式中,上述第1襯墊及/或第2襯墊(實質上為各襯墊之剝離處理層)藉由螢光X射線分析所得之Si-Kα射線之強度為0.01~500 kcps(較佳為0.5~250 kcps,更佳為1.0~150 kcps,進而較佳為1.05~100 kcps)。若為此種範圍,則可以較小之力將襯墊自黏著劑層剝離,故容易將襯墊之一端快速地略微拿起。又,襯墊/黏著劑層間之密接性變得充分,可防止襯墊之不必要之剝離。上述藉由螢光X射線分析所得之Si-Kα射線之強度係如下值:藉由螢光X射線分析分別測定剝離處理劑層與非剝離處理劑層之Si強度,自剝離處理劑層之強度減去非剝離處理劑層之強度而求出。再者,強度例如可藉由控制剝離處理劑之塗佈量、濃度、塗佈速度、乾燥等剝離處理層形成條件來調整。In one embodiment, the above-mentioned first liner and/or second liner (essentially the release treatment layer of each liner) has an intensity of Si-Kα rays obtained by fluorescent X-ray analysis of 0.01 to 500 kcps (Preferably, it is 0.5-250 kcps, More preferably, it is 1.0-150 kcps, More preferably, it is 1.05-100 kcps). If it is within such a range, the liner can be peeled off from the adhesive layer with a small force, so it is easy to pick up one end of the liner quickly and slightly. In addition, the adhesion between the liner and the adhesive layer becomes sufficient, and unnecessary peeling of the liner can be prevented. The intensity of the above-mentioned Si-Kα ray obtained by fluorescent X-ray analysis is as follows: the Si intensity of the peeling treatment agent layer and the non-release treatment agent layer were measured respectively by fluorescence X-ray analysis, and the intensity of the self-release treatment agent layer Calculated by subtracting the strength of the non-peeling treatment agent layer. Furthermore, the strength can be adjusted by, for example, controlling the release treatment layer formation conditions such as the coating amount, concentration, coating speed, and drying of the release treatment agent.

於一個實施方式中,上述第1襯墊與第2襯墊為不同顏色。以如上方式構成之附襯墊之雙面黏著片材例如可藉由使任一襯墊(例如襯墊基材)著色而獲得。若使兩個襯墊為不同顏色,則附襯墊之雙面黏著片材之正反變得明確,容易識別出應剝離之襯墊。In one embodiment, the first liner and the second liner are of different colors. The double-sided adhesive sheet with a liner constituted as described above can be obtained, for example, by coloring any liner (for example, liner base material). If the two liners are made of different colors, the front and back of the double-sided adhesive sheet with the liner become clear, and the liner to be peeled off can be easily identified.

C. 雙面黏著片材如上所述,雙面黏著片材具備第1黏著劑層。於一個實施方式中,雙面黏著片材依序具備第1黏著劑層、基材、及第2黏著劑層。於一個實施方式中,雙面黏著片材進而具備配置於第1黏著劑層與基材之間之底塗層。若具備底塗層,則可獲得對被黏著體之追隨性優異之雙面黏著片材。又,若對包含熱膨脹性微球之第1黏著劑層進行加熱,則隨著熱膨脹微球之膨脹而欲於厚度方向上膨脹時會產生變形,但藉由底塗層抑制向基材方向之變形,故剝離性提高。 C. Double-sided adhesive sheet As described above, the double-sided adhesive sheet includes the first adhesive layer. In one embodiment, a double-sided adhesive sheet is equipped with a 1st adhesive layer, a base material, and a 2nd adhesive layer in this order. In one embodiment, the double-sided adhesive sheet further includes a primer layer disposed between the first adhesive layer and the substrate. If a primer layer is provided, a double-sided adhesive sheet excellent in followability to an adherend can be obtained. In addition, if the first adhesive layer containing heat-expandable microspheres is heated, deformation will occur when the heat-expandable microspheres expand in the thickness direction, but the primer layer suppresses the expansion in the direction of the substrate. Deformation improves peelability.

將上述雙面黏著片材之第1黏著劑層貼合於聚對苯二甲酸乙二酯時之23℃下之初始黏著力較佳為0.5 N/20 mm以上,更佳為0.5 N/20 mm~20 N/20 mm,進而較佳為0.5 N/20 mm~15 N/20 mm。若為此種範圍,則可獲得例如有效用作用於製造電子零件之暫時固定用片材之雙面黏著片材。於本說明書中,初始黏著力係並未因熱膨脹性微球之膨脹而產生黏著力降低之狀態下之黏著力,意指未經歷50℃以上之熱歷程之狀態之黏著力。又,黏著力係指藉由依據JIS Z 0237:2000之方法(貼合條件:2 kg輥往返1次、剝離速度:300 mm/min、剝離角度180°)所測得之黏著力。When laminating the first adhesive layer of the above-mentioned double-sided adhesive sheet to polyethylene terephthalate, the initial adhesive force at 23°C is preferably 0.5 N/20 mm or more, more preferably 0.5 N/20 mm mm to 20 N/20 mm, and more preferably 0.5 N/20 mm to 15 N/20 mm. If it is such a range, for example, a double-sided adhesive sheet effectively used as a temporary fixing sheet for manufacturing electronic components can be obtained. In this specification, the initial adhesive force refers to the adhesive force in the state where the adhesive force has not been reduced due to the expansion of the heat-expandable microspheres, and means the adhesive force in the state where the heat history above 50°C has not been experienced. In addition, the adhesive force refers to the adhesive force measured by the method based on JIS Z 0237:2000 (lamination condition: 2 kg roller back and forth once, peeling speed: 300 mm/min, peeling angle 180°).

將上述雙面黏著片材之第1黏著劑層貼合於聚對苯二甲酸乙二酯時之黏著力較佳為藉由加熱降低至0.2 N/20 mm以下(較佳為0.1 N/20 mm以下)。該加熱溫度較佳為90℃~300℃,更佳為100℃~280℃。When the first adhesive layer of the above-mentioned double-sided adhesive sheet is bonded to polyethylene terephthalate, the adhesive force is preferably reduced to below 0.2 N/20 mm (preferably 0.1 N/20 mm) by heating. mm or less). The heating temperature is preferably from 90°C to 300°C, more preferably from 100°C to 280°C.

將上述雙面黏著片材之第2黏著劑層貼合於聚對苯二甲酸乙二酯時之23℃下之黏著力較佳為0.5 N/20 mm以上,更佳為0.5 N/20 mm~20 N/20 mm,進而較佳為0.5 N/20 mm~15 N/20 mm。When laminating the second adhesive layer of the above-mentioned double-sided adhesive sheet to polyethylene terephthalate, the adhesive force at 23°C is preferably 0.5 N/20 mm or more, more preferably 0.5 N/20 mm ~20 N/20 mm, and more preferably 0.5 N/20 mm~15 N/20 mm.

上述雙面黏著片材之厚度較佳為3 μm~300 μm,更佳為5 μm~150 μm,進而較佳為10 μm~100 μm。The thickness of the double-sided adhesive sheet is preferably from 3 μm to 300 μm, more preferably from 5 μm to 150 μm, and still more preferably from 10 μm to 100 μm.

構成上述雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)較佳為1×10 -6Nm~1×10 -1Nm,更佳為5×10 -6Nm~5×10 -2,進而較佳為5×10 -6Nm~3×10 -2。若為此種範圍,則可獲得富有自支撐性、貼合之操作性優異且柔軟性優異之雙面黏著片材。此種效果於具備包含熱膨脹性微球之第1黏著劑層之雙面黏著片材中尤其有用。 The sum of all the layers (III) of the product of the cube of the single layer thickness of each layer constituting the above-mentioned double-sided adhesive sheet and the product of the single layer elastic modulus is preferably 1×10 -6 Nm to 1×10 -1 Nm, more preferably 5×10 -6 Nm to 5×10 -2 , more preferably 5×10 -6 Nm to 3×10 -2 . If it is within such a range, a double-sided adhesive sheet having high self-supporting properties, excellent lamination workability, and excellent flexibility can be obtained. This effect is particularly useful in a double-sided adhesive sheet provided with a first adhesive layer containing heat-expandable microspheres.

於一個實施方式中,構成上述雙面黏著片材之層中之至少1層為著色層。於存在複數層著色層之情形時,較佳為顏色分別不同。藉由該等構成,附襯墊之雙面黏著片材之正反面變得明確,容易識別出應剝離之襯墊。再者,著色意指吸收及/或者反射光中之可見光區域(250 nm~700 nm)之光中之任意或者所有光之狀態。作為對任一層進行著色之方法,可採用任意適當之方法。In one embodiment, at least one layer among the layers constituting the double-sided adhesive sheet is a colored layer. When there are plural colored layers, it is preferable that the colors are different from each other. With these configurations, the front and back sides of the double-sided adhesive sheet with liner become clear, and the liner to be peeled can be easily identified. Furthermore, coloring refers to the state of absorbing and/or reflecting any or all of light in the visible light region (250 nm to 700 nm) of light. Any appropriate method can be adopted as a method of coloring any layer.

作為上述著色劑,可使用顏料或染料等。作為上述顏料,例如作為有機顏料,可例舉:丙烯酸系顏料、偶氮系顏料、聚偶氮系顏料、蒽醌系顏料、喹吖酮系顏料、異吲哚啉系顏料、異吲哚啉酮系顏料、酞菁系顏料、苝系顏料、DPP(Diketopyrrolo-pyrrole,吡咯并吡咯二酮)系顏料、螢光顏料、縮合多環顏料、著色樹脂粒子等;作為無機顏料,可例舉:碳黑、合成二氧化矽、氧化鉻、氧化鐵、氧化鈦、硫化鋅、焙燒顏料、天然雲母等公知之顏料。作為染料,可例舉:酸性染料、反應染料、直接染料、分散染料、陽離子染料、高分子染料等。作為墨水,亦可使用大日精化製造之「NB300」等市售品。再者,亦可藉由於黏著劑層中混合著色劑進行著色。又,於黏著劑層之組合物微相分離成例如親水性組合物與疏水性組合物等且具有可見光波長左右之大小之微細構造之情形時,亦存在對應於其大小而著色之現象、所謂之呈現出構造色之情況,因此亦可採用利用該現象之著色。Pigments, dyes, and the like can be used as the above-mentioned colorant. As the above-mentioned pigments, for example, as organic pigments, acrylic pigments, azo pigments, polyazo pigments, anthraquinone pigments, quinacridone pigments, isoindoline pigments, isoindoline pigments, Ketone pigments, phthalocyanine pigments, perylene pigments, DPP (Diketopyrrolo-pyrrole, diketopyrrolopyrrole) pigments, fluorescent pigments, condensed polycyclic pigments, colored resin particles, etc.; examples of inorganic pigments include: Known pigments such as carbon black, synthetic silica, chromium oxide, iron oxide, titanium oxide, zinc sulfide, calcined pigment, and natural mica. The dye may, for example, be an acid dye, a reactive dye, a direct dye, a disperse dye, a cationic dye or a polymer dye. As the ink, commercially available items such as "NB300" manufactured by Dainichi Seika Chemical Co., Ltd. can also be used. Furthermore, coloring can also be performed by mixing a colorant in the adhesive layer. Also, when the composition of the adhesive layer is microphase-separated into, for example, a hydrophilic composition and a hydrophobic composition, etc., and has a microstructure with a size around the wavelength of visible light, there is also a phenomenon of coloring corresponding to the size, so-called In the case of structural color, it is also possible to use coloring that utilizes this phenomenon.

C-1.第1黏著劑層 第1黏著劑層如上所述,包含熱膨脹性微球。第1黏著劑層亦可進而包含黏著劑。 C-1. The first adhesive layer As described above, the first adhesive layer contains heat-expandable microspheres. The first adhesive layer may further contain an adhesive.

作為構成第1黏著劑層之黏著劑,可例舉:丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑等。其中,可較佳地使用丙烯酸系黏著劑。又,作為黏著劑,亦可使用活性能量線硬化型丙烯酸系黏著劑(以下,稱為活性能量線硬化型黏著劑)。黏著劑之詳細內容例如記載於日本專利特開2015-168711號公報中。該公報之記載作為參考被援用至本說明書中。As an adhesive agent which comprises a 1st adhesive agent layer, an acrylic adhesive agent, a rubber adhesive agent, a silicone adhesive agent etc. are mentioned. Among them, an acrylic adhesive can be preferably used. In addition, an active energy ray-curable acrylic adhesive (hereinafter referred to as an active energy ray-curable adhesive) can also be used as the adhesive. The details of the adhesive are described in, for example, Japanese Patent Laid-Open No. 2015-168711. The description of this publication is incorporated in this specification as a reference.

(丙烯酸系黏著劑) 於一個實施方式中,作為上述黏著劑,使用丙烯酸系黏著劑。作為上述丙烯酸系黏著劑,例如可例舉將使用(甲基)丙烯酸烷基酯之1種或2種以上作為單體成分之丙烯酸系聚合物(均聚物或共聚物)作為基礎聚合物之丙烯酸系黏著劑等。 (acrylic adhesive) In one embodiment, an acrylic adhesive is used as the adhesive. Examples of the aforementioned acrylic adhesives include ones using, as a base polymer, an acrylic polymer (homopolymer or copolymer) using one or more alkyl (meth)acrylates as a monomer component. Acrylic adhesive, etc.

作為上述(甲基)丙烯酸烷基酯之具體例,可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1-20烷基酯。其中,較佳為具有碳數為4~20(更佳為6~20,尤佳為8~18)之直鏈狀或者支鏈狀烷基之(甲基)丙烯酸烷基酯,更佳為(甲基)丙烯酸2-乙基己酯。Specific examples of the above-mentioned alkyl (meth)acrylate include: methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate , Butyl (meth)acrylate, Isobutyl (meth)acrylate, Second butyl (meth)acrylate, Tertiary butyl (meth)acrylate, Amyl (meth)acrylate, (Meth) Hexyl acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, ( Isononyl methacrylate, Decyl (meth)acrylate, Isodecyl (meth)acrylate, Undecyl (meth)acrylate, Lauryl (meth)acrylate, (Meth)acrylate ) Tridecyl acrylate, Myristyl (meth)acrylate, Pentadecyl (meth)acrylate, Hexadecyl (meth)acrylate, Heptadecyl (meth)acrylate C1-20 alkyl (meth)acrylates such as octadecyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, etc. Among them, the alkyl (meth)acrylate having a linear or branched alkyl group with a carbon number of 4 to 20 (more preferably 6 to 20, especially preferably 8 to 18) is preferred, more preferably 2-Ethylhexyl (meth)acrylate.

為了對凝聚力、耐熱性、交聯性等進行改質,上述丙烯酸系聚合物亦可視需要包含與可與上述(甲基)丙烯酸烷基酯共聚合之其他單體成分對應之單元。作為此種單體成分,例如可例舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含羧基單體;順丁烯二酸酐、伊康酸酐等酸酐單體;(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、(4-羥甲基環己基)甲基丙烯酸甲酯等含羥基單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基系單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體;N-環己基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-月桂基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等順丁烯二醯亞胺系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等伊康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等琥珀醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基唑、乙烯基㗁唑、乙烯基嗎啉、N-乙烯基羧醯胺類、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含環氧基丙烯酸系單體;聚乙二醇(甲基)丙烯酸酯、聚丙二醇(甲基)丙烯酸酯、(甲基)丙烯酸甲氧基乙二醇、(甲基)丙烯酸甲氧基聚丙二醇等二醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等具有雜環、鹵素原子、矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等多官能單體;異戊二烯、丁二烯、異丁烯等烯烴系單體;乙烯醚等乙烯醚系單體等。該等單體成分可單獨或將2種以上組合使用。上述之中,更佳為含羧基單體(尤佳為丙烯酸)或含羥基單體(尤佳為(甲基)丙烯酸羥基乙酯)。源自含羧基單體之結構單元之含量相對於構成丙烯酸系聚合物之總結構單元,較佳為0.1重量%~10重量%,更佳為0.5重量%~5重量%,尤佳為1重量%~4重量%。又,源自含羥基單體之結構單元之含量相對於構成丙烯酸系聚合物之總結構單元,較佳為0.1重量%~20重量%,更佳為0.5重量%~10重量%,尤佳為1重量%~7重量%。再者,於本說明書中,(甲基)丙烯酸意指丙烯酸及/或甲基丙烯酸。In order to improve cohesion, heat resistance, crosslinkability, etc., the above-mentioned acrylic polymer may optionally contain units corresponding to other monomer components that can be copolymerized with the above-mentioned alkyl (meth)acrylate. Examples of such monomer components include carboxyl group-containing compounds such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxy (meth)acrylate Hydroxyl-containing monomers such as hexyl ester, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl methacrylate; Styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, ( Meth)acryloxynaphthalenesulfonic acid and other sulfonic acid-containing monomers; (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl(meth)propylene Amide, N-methylol(meth)acrylamide, N-methylolpropane(meth)acrylamide and other (N-substituted) amido monomers; (meth)aminoethyl acrylate , N, N-dimethylaminoethyl (meth)acrylate, tertiary butylaminoethyl (meth)acrylate and other (meth)acrylic acid aminoalkyl monomers; (meth)methacrylate Alkoxyalkyl (meth)acrylate monomers such as oxyethyl ester and ethoxyethyl (meth)acrylate; N-cyclohexylmaleimide, N-isopropylcis-butyl Maleimide-based monomers such as olefinic imide, N-laurylmaleimide, N-phenylmaleimide, etc.; N-methyliconimide , N-Ethyl Iconimide, N-Butyl Iconimide, N-Octyl Iconimide, N-2-Ethylhexyl Iconimide, N-Cyclohexyl Iconimide Iconimide-based monomers such as imide and N-lauryl iconimide; N-(meth)acryloxymethylene succinimide, N-(meth)acryl -6-oxyhexamethylene succinimide, N-(meth)acryl-8-oxyoctamethylene succinimide and other succinimide monomers; vinyl acetate, acrylic acid Vinyl Acetate, N-Vinylpyrrolidone, Methylvinylpyrrolidone, Vinylpyridine, Vinylpiperidine, Vinylpyrimidine, Vinylpiperidine, Vinylpyrrolidone, Vinylpyrrole, Vinylazole , Vinyl azole, vinyl morpholine, N-vinyl carboxamides, styrene, α-methyl styrene, N-vinyl caprolactam and other vinyl monomers; acrylonitrile, methacrylic Cyanoacrylate monomers such as nitrile; acrylic monomers containing epoxy groups such as glycidyl (meth)acrylate; polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, (meth) ) Diol-based acrylate monomers such as methoxyethylene glycol acrylate, methoxypolypropylene glycol (meth)acrylate; tetrahydrofurfuryl (meth)acrylate, fluorine (meth)acrylate, polysiloxane ( Acrylate-based monomers such as methacrylates with heterocycles, halogen atoms, silicon atoms, etc.; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly) ) propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate Acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate and other multifunctional monomers; isoprene, butadiene, isobutylene and other olefinic monomers body; vinyl ether monomers such as vinyl ether, etc. These monomer components can be used individually or in combination of 2 or more types. Among the above, carboxyl-containing monomers (especially preferably acrylic acid) or hydroxyl-containing monomers (especially preferably hydroxyethyl (meth)acrylate) are more preferred. The content of structural units derived from carboxyl group-containing monomers is preferably 0.1% by weight to 10% by weight, more preferably 0.5% by weight to 5% by weight, and especially preferably 1% by weight, relative to the total structural units constituting the acrylic polymer % to 4% by weight. Furthermore, the content of the structural unit derived from the hydroxyl-containing monomer is preferably 0.1% by weight to 20% by weight, more preferably 0.5% by weight to 10% by weight, and especially preferably 1% by weight to 7% by weight. In addition, in this specification, (meth)acryl means acryl and/or methacryl.

於一個實施方式中,上述丙烯酸系聚合物包含源自具有活性氫基之單體之結構單元。藉由包含源自具有活性氫基之單體之結構單元,丙烯酸系聚合物會產生微相分離,使可見光區域波長之光散射而著色(乳白色~淡黃色),故容易識別出向上拉之襯墊端面。In one embodiment, the acrylic polymer includes a structural unit derived from a monomer having an active hydrogen group. By including structural units derived from monomers with active hydrogen groups, acrylic polymers will undergo microphase separation, and light of wavelengths in the visible region will be scattered and colored (milky white to light yellow), so it is easy to recognize the lining pulled up pad ends.

上述源自具有活性氫基之單體之結構單元之含量相對於構成丙烯酸系聚合物之總結構單元,較佳為0.1重量%~20重量%,更佳為0.5重量%~10重量%,尤佳為1重量%~7重量%。作為具有活性氫基之單體,例如可例舉(甲基)丙烯酸、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯等。The content of the above-mentioned structural units derived from monomers having active hydrogen groups is preferably 0.1% by weight to 20% by weight, more preferably 0.5% by weight to 10% by weight, and especially Preferably, it is 1% by weight to 7% by weight. As a monomer which has an active hydrogen group, (meth)acrylic acid, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, etc. are mentioned, for example.

上述丙烯酸系黏著劑可視需要包含任意適當之添加劑。作為該添加劑,例如可例舉:交聯劑、黏著賦予劑、塑化劑(例如偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑等)、顏料、染料、填充劑、抗老化劑、導電材、抗靜電劑、紫外線吸收劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑等。The above-mentioned acrylic adhesive may contain any appropriate additives as needed. Examples of such additives include: crosslinking agents, tackifiers, plasticizers (such as trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, etc. agent, anti-aging agent, conductive material, antistatic agent, ultraviolet absorber, light stabilizer, peeling regulator, softener, surfactant, flame retardant, antioxidant, etc.

作為上述丙烯酸系黏著劑中所包含之交聯劑,例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中,較佳為異氰酸酯系交聯劑或環氧系交聯劑。Examples of the cross-linking agent contained in the acrylic adhesive include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, and urea-based cross-linking agents. Linking agent, metal alkoxide-based cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based Crosslinking agent, amine crosslinking agent, etc. Among them, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferable.

作為上述丙烯酸系黏著劑中所包含之上述異氰酸酯系交聯劑之具體例,可例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(日本聚氨酯工業公司製造,商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(日本聚氨酯工業公司製造,商品名「Coronate HL」)、六亞甲基二異氰酸酯之異氰尿酸酯體(日本聚氨酯工業公司製造,商品名「Coronate HX」)等異氰酸酯加成物等。異氰酸酯系交聯劑之含量可根據所需黏著力設定為任意適當之量,相對於基礎聚合物100重量份,代表性而言為0.1重量份~20重量份,更佳為0.5重量份~10重量份。Specific examples of the above-mentioned isocyanate-based crosslinking agent contained in the above-mentioned acrylic adhesive include: lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate; , cyclohexyl diisocyanate, isophorone diisocyanate and other alicyclic isocyanates; 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic isocyanates; Trimethylolpropane/toluene diisocyanate trimer adduct (manufactured by Japan Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate trimer adduct (Japan Polyurethane Industry Co., Ltd., trade name "Coronate HL"), isocyanurate body of hexamethylene diisocyanate (Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HX") and other isocyanate adducts. The content of the isocyanate-based crosslinking agent can be set to any appropriate amount according to the required adhesive force, and is typically 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, relative to 100 parts by weight of the base polymer. parts by weight.

作為上述丙烯酸系黏著劑中所包含之上述環氧系交聯劑,例如可例舉:N,N,N',N'-四縮水甘油基-間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製造,商品名「Tetrad C」)、1,6-己二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight1500NP」)、乙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight40E」)、丙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight70P」)、聚乙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL E-400」)、聚丙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL P-200」)、山梨糖醇聚縮水甘油醚(Nagase chemteX公司製造,商品名「Denacol EX-611」)、甘油聚縮水甘油醚(Nagase chemteX公司製造,商品名「Denacol EX-314」)、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚(Nagase chemteX公司製造,商品名「Denacol EX-512」)、山梨糖醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、分子內具有2個以上之環氧基之環氧系樹脂等。環氧系交聯劑之含量可根據所需黏著力設定為任意適當之量,相對於基礎聚合物100重量份,代表性而言為0.01重量份~10重量份,更佳為0.03重量份~5重量份。Examples of the epoxy-based crosslinking agent contained in the acrylic adhesive include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., trade name "Tetrad C"), 1,6-hexanediol diglycidyl ether (Kyoei manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1600"), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1500NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight40E"), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight70P"), polyethylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL E-400") , polypropylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "Denacol EX-611"), glycerol polyglycidol Ether (manufactured by Nagase ChemteX Company, trade name "Denacol EX-314"), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX Company, trade name "Denacol EX-512"), polysorbate Glycidyl ether, trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, tris(2-hydroxyethyl) isocyanurate triglycidyl ester, isophthalic acid Phenol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resin with more than 2 epoxy groups in the molecule, etc. The content of the epoxy-based crosslinking agent can be set to any appropriate amount according to the required adhesive force, with respect to 100 parts by weight of the base polymer, typically 0.01 to 10 parts by weight, more preferably 0.03 to 10 parts by weight 5 parts by weight.

作為上述丙烯酸系黏著劑中所包含之上述黏著賦予劑,使用任意適當之黏著賦予劑。作為黏著賦予劑,例如使用黏著賦予樹脂。作為該黏著賦予樹脂之具體例,可例舉:松香系黏著賦予樹脂(例如未改性松香、改性松香、松香酚系樹脂、松香酯系樹脂等)、萜烯系黏著賦予樹脂(例如萜烯系樹脂、萜酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂)、烴系黏著賦予樹脂(例如脂肪族系烴樹脂、脂肪族系環狀烴樹脂、芳香族系烴樹脂(例如苯乙烯系樹脂、二甲苯系樹脂等)、脂肪族・芳香族系石油樹脂、脂肪族・脂環族系石油樹脂、氫化烴樹脂、苯并呋喃系樹脂、苯并呋喃-茚系樹脂等)、酚系黏著賦予樹脂(例如烷酚系樹脂、二甲苯甲醛系樹脂、可溶酚醛樹脂、酚醛清漆等)、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。其中,較佳為松香系黏著賦予樹脂、萜烯系黏著賦予樹脂或烴系黏著賦予樹脂(苯乙烯系樹脂等)。黏著賦予劑可單獨或將2種以上組合使用。上述黏著賦予劑之添加量相對於基礎聚合物100重量份,較佳為5重量份~100重量份,更佳為10重量份~50重量份。Any appropriate tackifier is used as the tackifier contained in the acrylic adhesive. As the tackifier, for example, tackifier resin is used. Specific examples of the tackifying resin include: rosin-based tackifying resins (such as unmodified rosin, modified rosin, rosin phenolic resins, rosin ester resins, etc.), terpene-based tackifying resins (such as terpene olefin-based resin, terpene-phenol-based resin, styrene-modified terpene-based resin, aromatic-modified terpene-based resin, hydrogenated terpene-based resin), hydrocarbon-based tackifying resin (such as aliphatic hydrocarbon resin, Cyclic hydrocarbon resins, aromatic hydrocarbon resins (such as styrene resins, xylene resins, etc.), aliphatic and aromatic petroleum resins, aliphatic and alicyclic petroleum resins, hydrogenated hydrocarbon resins, benzofuran resins, coumarone-indene resins, etc.), phenolic adhesive resins (such as alkanol resins, xylene formaldehyde resins, resole resins, novolaks, etc.), ketone adhesive resins, polyamide Adhesive resin, epoxy adhesive resin, elastic adhesive resin, etc. Among them, rosin-based tackifying resins, terpene-based tackifying resins, or hydrocarbon-based tackifying resins (styrene-based resins, etc.) are preferable. The tackifier can be used alone or in combination of two or more. The added amount of the above-mentioned tackifier is preferably 5 to 100 parts by weight, more preferably 10 to 50 parts by weight, based on 100 parts by weight of the base polymer.

(熱膨脹性微球) 作為上述熱膨脹性微球,只要為藉由加熱能夠膨脹或發泡之微球即可,可使用任意適當之熱膨脹性微球。作為上述熱膨脹性微球,例如可使用使藉由加熱容易膨脹之物質內包於具有彈性之殼內而成之微球。此種熱膨脹性微球可藉由任意適當之方法、例如凝聚法、界面聚合法等製造。 (heat-expandable microspheres) As the heat-expandable microspheres, any appropriate heat-expandable microspheres can be used as long as they are expandable or foamable by heating. As the above-mentioned heat-expandable microspheres, for example, microspheres obtained by enclosing a material that is easily expanded by heating in an elastic shell can be used. Such heat-expandable microspheres can be produced by any appropriate method, such as coacervation method, interfacial polymerization method and the like.

作為藉由加熱容易膨脹之物質,例如可例舉:丙烷、丙烯、丁烯、正丁烷、異丁烷、異戊烷、新戊烷、正戊烷、正己烷、異己烷、庚烷、辛烷、石油醚、甲烷之鹵化物、四烷基矽烷等低沸點液體;藉由熱分解氣化之偶氮二甲醯胺等。Examples of substances that are easily expanded by heating include propane, propylene, butene, n-butane, isobutane, isopentane, neopentane, n-pentane, n-hexane, isohexane, heptane, Octane, petroleum ether, halides of methane, tetraalkylsilanes and other low-boiling liquids; azodicarbonamide, which is vaporized by thermal decomposition, etc.

作為構成上述殼之物質,例如可例舉:丙烯腈、甲基丙烯腈、α-氯丙烯腈、α-乙氧基丙烯腈、反丁烯二腈等腈單體;丙烯酸、甲基丙烯酸、伊康酸、順丁烯二酸、反丁烯二酸、檸康酸等羧酸單體;偏二氯乙烯;乙酸乙烯酯;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異𦯉酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、β-丙烯酸羧基乙酯等(甲基)丙烯酸酯;苯乙烯、α-甲基苯乙烯、氯苯乙烯等苯乙烯單體;丙烯醯胺、經取代之丙烯醯胺、甲基丙烯醯胺、經取代之甲基丙烯醯胺等醯胺單體等構成之聚合物。由該等單體構成之聚合物可為均聚物,亦可為共聚物。作為該共聚物,例如可例舉:偏二氯乙烯‐甲基丙烯酸甲酯-丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈-甲基丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈共聚物、丙烯腈-甲基丙烯腈-伊康酸共聚物等。Examples of the material constituting the shell include: nitrile monomers such as acrylonitrile, methacrylonitrile, α-chloroacrylonitrile, α-ethoxyacrylonitrile, and fumaronitrile; acrylic acid, methacrylic acid, Carboxylic acid monomers such as itaconic acid, maleic acid, fumaric acid, and citraconic acid; vinylidene chloride; vinyl acetate; methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, iso-(meth)acrylate, cyclohexyl (meth)acrylate, (meth) (meth)acrylates such as benzyl acrylate and β-carboxyethyl acrylate; styrene monomers such as styrene, α-methylstyrene, and chlorostyrene; acrylamides, substituted acrylamides, methyl Polymers composed of amide monomers such as acrylamide and substituted methacrylamide. The polymer composed of these monomers may be a homopolymer or a copolymer. Examples of such copolymers include: vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, methyl methacrylate-acrylonitrile Copolymer, acrylonitrile-methacrylonitrile-itaconic acid copolymer, etc.

作為上述熱膨脹性微球,可使用無機系發泡劑或有機系發泡劑。作為無機系發泡劑,例如可例舉:碳酸銨、碳酸氫銨、碳酸氫鈉、亞硝酸銨、氫氧化硼鈉、各種疊氮化物類等。又,作為有機系發泡劑,例如可例舉:三氯單氟甲烷、二氯單氟甲烷等氟氯化烷烴系化合物;偶氮二異丁腈、偶氮二甲醯胺、鋇偶氮二羧酸酯等偶氮系化合物;對甲苯磺醯肼、二苯基碸-3,3'-二磺醯基醯肼、4,4'-氧基雙(苯磺醯肼)、烯丙基雙(磺醯基醯肼)等肼系化合物;對甲苯磺醯胺基脲、4,4'-氧基雙(苯磺醯基胺脲)等胺脲系化合物;5-嗎啉基-1,2,3,4-噻三唑等三唑系化合物;N,N'-二亞硝基五亞甲基四胺、N,N'-二甲基-N,N'-二亞硝基對苯二甲醯胺醯胺等N-亞硝基系化合物等。As the heat-expandable microspheres, an inorganic foaming agent or an organic foaming agent can be used. As an inorganic foaming agent, ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydroxide, various azides, etc. are mentioned, for example. Moreover, as an organic foaming agent, for example: Chlorofluoroalkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; Azobisisobutyronitrile, azodicarbonamide, barium azo Azo compounds such as dicarboxylates; p-toluenesulfonylhydrazine, diphenylsulfonyl-3,3'-disulfonylhydrazine, 4,4'-oxybis(benzenesulfonylhydrazine), allyl Hydrazine compounds such as bis(sulfonyl hydrazine); semicarbazide compounds such as p-toluenesulfonyl semiurea and 4,4'-oxybis(benzenesulfonyl semicarbazide); 5-morpholinyl- 1,2,3,4-Thiatriazole and other triazole compounds; N,N'-Dinitrosopentamethylenetetramine, N,N'-Dimethyl-N,N'-Dinitroso N-nitroso compounds such as p-phthalamide, etc.

上述熱膨脹性微球之加熱前之粒徑較佳為0.5 μm~80 μm,更佳為5 μm~45 μm,進而較佳為10 μm~20 μm,尤佳為10 μm~15 μm。因此,若以平均粒徑來說明上述熱膨脹性微球之加熱前之粒子尺寸,較佳為6 μm~45 μm,更佳為15 μm~35 μm。上述粒徑與平均粒徑係藉由雷射散射法中之粒度分佈測定法而求出之值。The particle size of the thermally expandable microspheres before heating is preferably from 0.5 μm to 80 μm, more preferably from 5 μm to 45 μm, further preferably from 10 μm to 20 μm, especially preferably from 10 μm to 15 μm. Therefore, if the average particle size is used to describe the particle size of the thermally expandable microspheres before heating, it is preferably 6 μm to 45 μm, more preferably 15 μm to 35 μm. The above-mentioned particle size and average particle size are values obtained by the particle size distribution measurement method in the laser scattering method.

上述熱膨脹性微球較佳為具有在體積膨脹率成為較佳為5倍以上、更佳為7倍以上、進而較佳為10倍以上之前均不會破裂之適度之強度。於使用此種熱膨脹性微球之情形時,可藉由加熱處理高效率地使黏著力降低。The heat-expandable microspheres preferably have a moderate strength that does not break until the volume expansion ratio becomes preferably 5 times or more, more preferably 7 times or more, and further preferably 10 times or more. In the case of using such heat-expandable microspheres, the adhesive force can be efficiently reduced by heat treatment.

上述黏著劑層中之熱膨脹性微球之含有比率可根據所需黏著力之降低性等適當地設定。熱膨脹性微球之含有比率相對於形成黏著劑層之基礎聚合物100重量份,例如為1重量份~150重量份,較佳為10重量份~130重量份,進而較佳為25重量份~100重量份。The content ratio of the heat-expandable microspheres in the above-mentioned pressure-sensitive adhesive layer can be appropriately set according to the required reduction of the pressure-sensitive adhesive force and the like. The content ratio of the heat-expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, and more preferably 25 to 100 parts by weight relative to 100 parts by weight of the base polymer forming the adhesive layer. 100 parts by weight.

熱膨脹性微球膨脹前(即加熱前)之第1黏著劑層之算術表面粗糙度Ra較佳為500 nm以下,更佳為400 nm以下,進而較佳為300 nm以下。於包含熱膨脹性微球之黏著劑層中,存在因熱膨脹性微球而產生隆起部之情形,但只要加熱前之表面粗糙度為上述範圍,則可獲得可於不產生襯墊剝離中之剝離應力集中於隆起部分而產生之黏著劑層之破碎或非意願分離現象等不良情況之情況下將襯墊剝離,又,對被黏著體之密接性優異之雙面黏著片材。算術表面粗糙度Ra例如可藉由第1黏著劑層之厚度、對形成於基體之第1黏著劑層進行轉印而形成雙面黏著片材時之該基體之表面平滑性、第1黏著劑層形成時之乾燥條件等進行調整。The arithmetical surface roughness Ra of the first adhesive layer before the heat-expandable microspheres expand (that is, before heating) is preferably 500 nm or less, more preferably 400 nm or less, and still more preferably 300 nm or less. In the adhesive layer containing heat-expandable microspheres, there may be cases where raised portions are generated due to heat-expandable microspheres, but as long as the surface roughness before heating is within the above range, peeling can be obtained without causing liner peeling It is a double-sided adhesive sheet that can peel off the liner in the event of unfavorable situations such as cracking or unintentional separation of the adhesive layer due to stress concentration on the raised portion, and has excellent adhesion to the adherend. The arithmetical surface roughness Ra can be determined by, for example, the thickness of the first adhesive layer, the surface smoothness of the substrate when the first adhesive layer formed on the substrate is transferred to form a double-sided adhesive sheet, the first adhesive Drying conditions and the like at the time of layer formation are adjusted.

上述第1黏著劑層之厚度較佳為5 μm~70 μm,更佳為10 μm~60 μm,進而較佳為15 μm~55 μm,最佳為20 μm~50 μm。若為此種範圍,則可獲得襯墊剝離之操作性、貼合時之操作性、黏著性、平滑性、加熱時之變形性優異之雙面黏著片材。於一個實施方式中,上述第1黏著劑層之厚度為23 μm~47 μm。若為此種範圍,則可獲得就黏著劑層表面之平滑性之觀點而言,尤其適合將被黏著體用於CSP或WLP之台座基板之情形時之雙面黏著片材。The thickness of the first adhesive layer is preferably 5 μm to 70 μm, more preferably 10 μm to 60 μm, further preferably 15 μm to 55 μm, most preferably 20 μm to 50 μm. Within this range, a double-sided adhesive sheet excellent in liner peeling operability, operability at the time of lamination, adhesiveness, smoothness, and deformability at the time of heating can be obtained. In one embodiment, the thickness of the first adhesive layer is 23 μm˜47 μm. If it is such a range, the double-sided adhesive sheet suitable especially when using an adherend as a base board of CSP or WLP from a viewpoint of the smoothness of the surface of an adhesive layer can be obtained.

上述第1黏著劑層之彈性模數較佳為0.001 MPa~10 MPa,更佳為0.01 MPa~8 MPa。若為此種範圍,則可獲得襯墊剝離之操作性、貼合時之操作性、黏著性、平滑性、加熱時之變形性優異之雙面黏著片材。於一個實施方式中,上述第1黏著劑層之彈性模數較佳為0.05 MPa~4 MPa,更佳為0.1 MPa~3 MPa。若為此種範圍,則可獲得就黏著劑層表面之平滑性之觀點而言,尤其適合將被黏著體用於CSP或WLP之台座基板之情形之雙面黏著片材。The modulus of elasticity of the first adhesive layer is preferably from 0.001 MPa to 10 MPa, more preferably from 0.01 MPa to 8 MPa. Within this range, a double-sided adhesive sheet excellent in liner peeling operability, operability at the time of lamination, adhesiveness, smoothness, and deformability at the time of heating can be obtained. In one embodiment, the modulus of elasticity of the first adhesive layer is preferably 0.05 MPa-4 MPa, more preferably 0.1 MPa-3 MPa. If it is such a range, the double-sided adhesive sheet suitable especially when using an adherend as a base board of CSP or WLP from the viewpoint of the smoothness of the surface of an adhesive layer can be obtained.

C-2.第2黏著劑層 上述第2黏著劑層可包含任意適當之黏著劑。作為構成第2黏著劑層之黏著劑,可例舉:丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑等。其中,可較佳地使用丙烯酸系黏著劑。又,作為黏著劑,亦可使用活性能量線硬化型丙烯酸系黏著劑(以下稱為活性能量線硬化型黏著劑)。黏著劑之詳細內容例如記載於日本專利特開2015-168711號公報中。該公報之記載係作為參考而被援用至本說明書中。 C-2. Second adhesive layer The above-mentioned second adhesive layer may contain any appropriate adhesive. As an adhesive agent which comprises a 2nd adhesive agent layer, an acrylic adhesive agent, a rubber adhesive agent, a silicone adhesive agent etc. are mentioned. Among them, an acrylic adhesive can be preferably used. In addition, an active energy ray-curable acrylic adhesive (hereinafter referred to as an active energy ray-curable adhesive) can also be used as the adhesive. The details of the adhesive are described in, for example, Japanese Patent Laid-Open No. 2015-168711. The description of this publication is incorporated in this specification as a reference.

於一個實施方式中,上述第2黏著劑層包含於C-1項中所說明之丙烯酸系黏著劑。如上所述,丙烯酸系黏著劑包含丙烯酸系聚合物作為基礎聚合物。於一個實施方式中,上述丙烯酸系聚合物包含源自具有活性氫基之單體之結構單元。上述源自具有活性氫基之單體之結構單元之含量相對於構成丙烯酸系聚合物之總結構單元,較佳為0.1重量%~20重量%,更佳為0.5重量%~10重量%,尤佳為1重量%~7重量%。In one embodiment, the second adhesive layer includes the acrylic adhesive described in Section C-1. As described above, the acrylic adhesive contains an acrylic polymer as a base polymer. In one embodiment, the acrylic polymer includes a structural unit derived from a monomer having an active hydrogen group. The content of the above-mentioned structural units derived from monomers having active hydrogen groups is preferably 0.1% by weight to 20% by weight, more preferably 0.5% by weight to 10% by weight, and especially Preferably, it is 1% by weight to 7% by weight.

上述第2黏著劑層之厚度較佳為1 μm~50 μm,更佳為2 μm~60 μm,進而較佳為3 μm~35 μm,最佳為5 μm~35 μm。若為此種範圍,則可獲得襯墊剝離之操作性、貼合時之操作性、黏著性、平滑性優異之雙面黏著片材。於一個實施方式中,上述第2黏著劑層之厚度較佳為2 μm~35 μm,更佳為3 μm~25 μm。若為此種範圍,則可獲得就對凹凸面之埋入性、間隙抑制之觀點而言,尤其適合將被黏著體用於CSP或WLP之半導體晶片之情形之雙面黏著片材。The thickness of the second adhesive layer is preferably 1 μm to 50 μm, more preferably 2 μm to 60 μm, further preferably 3 μm to 35 μm, most preferably 5 μm to 35 μm. Within such a range, a double-sided adhesive sheet excellent in liner peeling operability, operability at the time of lamination, adhesiveness, and smoothness can be obtained. In one embodiment, the thickness of the second adhesive layer is preferably 2 μm˜35 μm, more preferably 3 μm˜25 μm. If it is within such a range, a double-sided adhesive sheet suitable especially when the adherend is used for a semiconductor wafer of CSP or WLP can be obtained from the viewpoint of embedability to the uneven surface and suppression of gaps.

上述第2黏著劑層之彈性模數較佳為0.001 MPa~10 MPa,更佳為0.01 MPa~8 MPa。若為此種範圍,則可獲得襯墊剝離之操作性、貼合時之操作性、黏著性、平滑性優異之雙面黏著片材。於一個實施方式中,上述第2黏著劑層之彈性模數較佳為0.05 MPa~4 MPa,更佳為0.1 MPa~3 MPa。若為此種範圍,則可獲得就對凹凸面之埋入性之觀點而言,尤其適合將被黏著體用於CSP或WLP之半導體晶片之情形之雙面黏著片材。再者,於第2黏著劑層包含活性能量線硬化型黏著劑之情形時,該第2黏著劑層藉由活性能量線之照射而硬化,其彈性模數較佳為成為1 MPa~200 MPa,更佳為成為5 MPa~150 MPa,進而較佳為成為10 MPa~100 MPa。The modulus of elasticity of the second adhesive layer is preferably from 0.001 MPa to 10 MPa, more preferably from 0.01 MPa to 8 MPa. Within such a range, a double-sided adhesive sheet excellent in liner peeling operability, operability at the time of lamination, adhesiveness, and smoothness can be obtained. In one embodiment, the elastic modulus of the second adhesive layer is preferably 0.05 MPa-4 MPa, more preferably 0.1 MPa-3 MPa. If it is such a range, the double-sided adhesive sheet suitable especially when using an adherend to the semiconductor wafer of CSP or WLP from a viewpoint of embedding property with respect to an uneven|corrugated surface can be obtained. Furthermore, when the second adhesive layer contains an active energy ray-curable adhesive, the second adhesive layer is cured by irradiation of active energy rays, and its modulus of elasticity is preferably 1 MPa to 200 MPa. , more preferably 5 MPa to 150 MPa, further preferably 10 MPa to 100 MPa.

C-3.底塗層 上述底塗層包含任意適當之黏著劑。作為構成底塗層之黏著劑,可例舉:丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑等。其中,可較佳地使用丙烯酸系黏著劑。又,作為黏著劑,亦可使用活性能量線硬化型丙烯酸系黏著劑(以下稱為活性能量線硬化型黏著劑)。作為構成底塗層之黏著劑,較佳為使用與構成上述第1黏著劑層之黏著劑相同之黏著劑。 C-3. Primer coat The above primer layer contains any suitable adhesive. Examples of the adhesive constituting the undercoat layer include acrylic adhesives, rubber adhesives, and silicone adhesives. Among them, an acrylic adhesive can be preferably used. In addition, an active energy ray-curable acrylic adhesive (hereinafter referred to as an active energy ray-curable adhesive) can also be used as the adhesive. As the adhesive constituting the undercoat layer, it is preferable to use the same adhesive as the adhesive constituting the above-mentioned first adhesive layer.

上述底塗層之厚度較佳為1 μm~40 μm,更佳為5 μm~35 μm,進而較佳為10 μm~30 μm。若為此種範圍,則可獲得襯墊剝離之操作性優異且熱膨脹性微球加熱時之對基材側之影響得到抑制之雙面黏著片材。The thickness of the undercoat layer is preferably from 1 μm to 40 μm, more preferably from 5 μm to 35 μm, and still more preferably from 10 μm to 30 μm. If it is within such a range, a double-sided adhesive sheet having excellent liner peeling operability and suppressing the influence of thermally expandable microspheres on the substrate side when heated can be obtained.

上述底塗層之彈性模數較佳為0.001 MPa~10 MPa,更佳為0.01 MPa~8 MPa,更佳為0.5 MPa~5 MPa。若為此種範圍,則可獲得襯墊剝離之操作性優異且熱膨脹性微球加熱時之對基材側之影響得到抑制之雙面黏著片材。再者,於底塗層包含活性能量線硬化型黏著劑之情形時,該底塗層藉由活性能量線之照射而硬化,其彈性模數較佳為成為1 MPa~200 MPa,更佳為成為5 MPa~150 MPa,進而較佳為成為10 MPa~100 MPa。The modulus of elasticity of the above primer layer is preferably from 0.001 MPa to 10 MPa, more preferably from 0.01 MPa to 8 MPa, more preferably from 0.5 MPa to 5 MPa. If it is within such a range, a double-sided adhesive sheet having excellent liner peeling operability and suppressing the influence of thermally expandable microspheres on the substrate side when heated can be obtained. Furthermore, when the undercoat layer contains an active energy ray-curable adhesive, the undercoat layer is hardened by irradiation of active energy rays, and its modulus of elasticity is preferably 1 MPa to 200 MPa, more preferably It is 5 MPa to 150 MPa, and more preferably, it is 10 MPa to 100 MPa.

C-4.基材 上述基材可由任意適當之材料構成。基材例如除塑膠膜、塑膠片以外,亦可使用紙、布、不織布、金屬箔、或者其等之塑膠層壓體、塑膠彼此之積層體等各種片狀物。其中,就操作性及成本之觀點而言,最佳為塑膠膜或塑膠片(以下稱為塑膠膜)。作為塑膠膜之原材料,就強度、耐熱性等觀點而言,可視需要選擇。例如可例舉:聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)等將α-烯烴作為單體成分之烯烴系樹脂;聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)等聚酯;聚氯乙烯(PVC);聚苯硫醚(PPS);聚醯胺(尼龍)、全芳香族聚醯胺(芳香族聚醯胺)等醯胺系樹脂;聚醚醚酮(PEEK)、聚醯亞胺、聚醚醯亞胺、聚苯乙烯、丙烯酸系樹脂等。該等原材料可單獨或將2種以上組合使用。又,作為塑膠膜,亦可使用未延伸膜、單軸配向膜、雙軸配向膜之任一者。又,該等膜亦可為包含2層以上之膜層之積層膜,就操作性之觀點而言,亦可使用適當添加惰性粒子等潤滑劑之膜。 C-4. Substrate The above-mentioned substrate can be made of any suitable material. As the substrate, for example, besides plastic film and plastic sheet, various sheets such as paper, cloth, non-woven fabric, metal foil, or their plastic laminates, and laminates of plastics can be used. Among them, a plastic film or a plastic sheet (hereinafter referred to as a plastic film) is most preferable from the viewpoints of workability and cost. As the raw material of the plastic film, it can be selected according to needs in terms of strength, heat resistance, and the like. For example, polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other olefin-based resins that use α-olefin as a monomer component; polyparaphenylene Polyethylene dicarboxylate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT) and other polyesters; polyvinyl chloride (PVC); polyphenylene sulfide (PPS); Amide-based resins such as polyamide (nylon), wholly aromatic polyamide (aromatic polyamide); polyetheretherketone (PEEK), polyimide, polyetherimide, polystyrene, acrylic Department of resin, etc. These raw materials can be used individually or in combination of 2 or more types. In addition, as the plastic film, any one of an unstretched film, a uniaxially oriented film, and a biaxially oriented film may be used. In addition, these films may be laminated films including two or more film layers, and films in which lubricants such as inert particles are appropriately added may also be used from the viewpoint of handleability.

上述基材之厚度較佳為200 μm以下,更佳為1 μm~200 μm,進而較佳為5 μm~200 μm,尤佳為10 μm~200 μm,尤佳為20 μm~200 μm,最佳為30 μm~200 μm。若為此種範圍,則可獲得可有助於提高襯墊剝離性、強度、柔軟性、柔韌性、耐彎曲性等優異之基材。The thickness of the above substrate is preferably less than 200 μm, more preferably 1 μm to 200 μm, further preferably 5 μm to 200 μm, especially preferably 10 μm to 200 μm, most preferably 20 μm to 200 μm, most preferably Preferably, it is 30 μm to 200 μm. If it is within such a range, a base material excellent in liner peelability, strength, softness, flexibility, bending resistance, etc. can be obtained.

上述基材之彈性模數較佳為500 MPa~5000 MPa,更佳為500 MPa~4000 MPa,進而較佳為700 MPa~4000 MPa。若為此種範圍,則可獲得可有助於提高襯墊剝離性、強度、柔軟性、柔韌性、耐彎曲性等優異之基材。The modulus of elasticity of the base material is preferably from 500 MPa to 5000 MPa, more preferably from 500 MPa to 4000 MPa, and still more preferably from 700 MPa to 4000 MPa. If it is within such a range, a base material excellent in liner peelability, strength, softness, flexibility, bending resistance, etc. can be obtained.

上述基材亦可實施表面處理。作為表面處理,例如可例舉電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化輻射處理、藉由底塗劑之塗佈處理等。The above-mentioned substrates may also be subjected to surface treatment. As the surface treatment, for example, corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, coating treatment with a primer, etc. may be mentioned.

為了提高襯墊之端面識別性,又,為了提高基材與黏著劑層之抓固性,亦可對基材進行塗佈墨水等之印刷。作為墨水,可利用大日精化製造之「NB300」等。In order to improve the recognition of the end face of the pad, and to improve the grip between the base material and the adhesive layer, the base material may be printed with ink or the like. As the ink, "NB300" manufactured by Dainichi Seika Chemical Co., Ltd., etc. can be used.

C-5.雙面黏著片材之製造方法 上述雙面黏著片材可藉由任意適當之方法製造。作為本發明之雙面黏著片材之製造方法,例如可例舉:將包含黏著劑之組合物直接塗佈於基材上之方法;或將包含黏著劑之組合物塗佈於任意適當之基體上並將所形成之塗佈層轉印至基材之方法等。又,亦可藉由將於襯墊上塗佈包含黏著劑之組合物而形成之積層體(第1襯墊/第1黏著劑層、第2黏著劑層/第2襯墊)貼合於基材之方法而獲得附襯墊之雙面黏著片材。包含黏著劑之組合物可包含任意適當之溶劑。 C-5. Manufacturing method of double-sided adhesive sheet The above-mentioned double-sided adhesive sheet can be produced by any appropriate method. As the production method of the double-sided adhesive sheet of the present invention, for example, a method of directly coating a composition containing an adhesive on a substrate; or coating a composition containing an adhesive on any appropriate substrate A method of applying and transferring the formed coating layer to a substrate, etc. Also, a laminate formed by coating a liner with a composition containing an adhesive (first liner/first adhesive layer, second adhesive layer/second liner) can be attached to A double-sided adhesive sheet with a liner is obtained by using the method of the base material. Compositions comprising an adhesive may comprise any suitable solvent.

第1黏著劑層可將包含熱膨脹性微球、黏著劑及任意適當之溶劑的組合物塗佈於基材而形成該黏著劑層。或者亦可於將熱膨脹性微球於黏著劑塗佈層鋪開後,使用層壓機等將該熱膨脹性微球埋入黏著劑中來形成包含熱膨脹性微球之黏著劑層。The first adhesive layer can be formed by coating a composition comprising heat-expandable microspheres, an adhesive, and any appropriate solvent on a substrate. Alternatively, after spreading the heat-expandable microspheres on the adhesive coating layer, the heat-expandable microspheres may be embedded in the adhesive using a laminator or the like to form an adhesive layer containing the heat-expandable microspheres.

於雙面黏著片材具有上述底塗層之情形時,該底塗層例如可於基材上或第1黏著劑層上塗佈用以形成底塗層之組合物(黏著劑)而形成。When the double-sided adhesive sheet has the aforementioned undercoat layer, the undercoat layer can be formed, for example, by applying a composition (adhesive) for forming the undercoat layer on the substrate or the first adhesive layer.

作為上述黏著劑之塗佈方法,可採用任意適當之塗佈方法。例如可於塗佈後進行乾燥來形成各層。作為塗佈方法,例如可例舉使用多功能塗佈機、模嘴塗佈機、凹版塗佈機、敷料器等之塗佈方法。作為乾燥方法,例如可例舉自然乾燥、加熱乾燥等。加熱乾燥之情形時之加熱溫度可根據成為乾燥對象之物質之特性設定為任意適當之溫度。Any appropriate coating method can be adopted as the coating method of the above-mentioned adhesive. For example, each layer can be formed by drying after coating. As a coating method, the coating method using a multi-function coater, a die coater, a gravure coater, an applicator, etc. is mentioned, for example. As a drying method, natural drying, heat drying, etc. are mentioned, for example. In the case of heat drying, the heating temperature can be set to any appropriate temperature according to the characteristics of the substance to be dried.

D. 用途上述附襯墊之雙面黏著片材可適宜用作對任意適當之構件(例如半導體晶片等電子零件)進行加工時之暫時固定用片材。於一個實施方式中,上述附襯墊之雙面黏著片材係於製造CSP(Chip Size/Scale Package)或WLP(Wafer Level Package)時可用作暫時固定半導體晶片之片材。於一個實施方式中,上述附襯墊之雙面黏著片材用於包括將上述第2襯墊先剝離之步驟之加工。 D. Application The above-mentioned double-sided adhesive sheet with a liner can be suitably used as a temporary fixing sheet when processing any appropriate member (for example, electronic parts such as semiconductor chips). In one embodiment, the above-mentioned double-sided adhesive sheet with a liner can be used as a sheet for temporarily fixing semiconductor chips when manufacturing CSP (Chip Size/Scale Package) or WLP (Wafer Level Package). In one embodiment, the double-sided adhesive sheet with a liner is used for processing including the step of first peeling off the second liner.

於一個實施方式中,上述附襯墊之雙面黏著片材為捲筒狀。 [實施例] In one embodiment, the double-sided adhesive sheet with a liner is in the form of a roll. [Example]

以下,藉由實施例對本發明具體地進行說明,但本發明並不受該等實施例限定。又,於實施例中,只要未特別明確記載,則「份」及「%」係以重量為基準。Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by these Examples. In addition, in the examples, "parts" and "%" are based on weight unless otherwise specified.

[製造例1]襯墊a(厚度:12 μm)之製造 將加成型聚矽氧處理劑(Shin-Etsu Silicones公司製造,主劑「KS-774」:100重量份,觸媒「CAT PL-3」:0.4重量份)溶解於庚烷與己烷之混合溶劑(混合重量比1:1)中,製作將處理劑之濃度調整為0.9%之剝離處理劑溶液。 繼而,使用凹版法將上述剝離處理劑溶液塗佈於PET膜(東麗公司製造,商品名「Lumirror S10」,厚度12 μm)之一面,使用熱風烘箱進行乾燥,獲得厚度12 μm之襯墊a。所獲得之襯墊之Si-Kα射線之強度為13(kcps)(測定方法於下文中進行說明)。 [Manufacturing example 1] Manufacture of spacer a (thickness: 12 μm) Addition silicone treatment agent (manufactured by Shin-Etsu Silicones, main agent "KS-774": 100 parts by weight, catalyst "CAT PL-3": 0.4 parts by weight) was dissolved in a mixture of heptane and hexane In a solvent (mixing weight ratio 1:1), prepare a peeling treatment agent solution in which the concentration of the treatment agent is adjusted to 0.9%. Next, the above release treatment agent solution was coated on one side of a PET film (manufactured by Toray Corporation, trade name "Lumirror S10", thickness 12 μm) using a gravure method, and dried in a hot air oven to obtain a liner a with a thickness of 12 μm . The Si-Kα ray intensity of the obtained gasket was 13 (kcps) (the measurement method will be described below).

[製造例2]襯墊b(厚度:75 μm)之製造 作為PET膜,使用厚度75 μm之PET膜(東麗公司製造,商品名「Lumirror S10」),除此以外,以與製造例1相同之方式獲得厚度75 μm之襯墊b。所獲得之襯墊之Si-Kα射線之強度為80(kcps)。 [Manufacturing example 2] Manufacture of gasket b (thickness: 75 μm) A spacer b with a thickness of 75 μm was obtained in the same manner as in Production Example 1 except that a PET film with a thickness of 75 μm (manufactured by Toray Corporation, trade name “Lumirror S10”) was used. The Si-Kα ray intensity of the obtained spacer was 80 (kcps).

[製造例3]襯墊c(厚度:38 μm)之製造 作為PET膜,使用厚度38 μm之PET膜(東麗公司製造,商品名「Lumirror S10」),除此以外,以與製造例1相同之方式獲得厚度38 μm之襯墊c。所獲得之襯墊之Si-Kα射線之強度為3.2(kcps)。 [Manufacturing example 3] Manufacture of spacer c (thickness: 38 μm) A spacer c with a thickness of 38 μm was obtained in the same manner as in Production Example 1 except that a PET film with a thickness of 38 μm (manufactured by Toray Corporation, trade name “Lumirror S10”) was used. The Si-Kα ray intensity of the obtained spacer was 3.2 (kcps).

[製造例4]襯墊d(厚度:50 μm)之製造 作為PET膜,使用厚度50 μm之PET膜(東麗公司製造,商品名「Lumirror S10」),除此以外,以與製造例1相同之方式獲得厚度50 μm之襯墊d。所獲得之襯墊之Si-Kα射線之強度為35(kcps)。 [Manufacturing example 4] Manufacture of pad d (thickness: 50 μm) A spacer d with a thickness of 50 μm was obtained in the same manner as in Production Example 1 except that a PET film with a thickness of 50 μm (manufactured by Toray Corporation, trade name “Lumirror S10”) was used. The Si-Kα ray intensity of the obtained spacer was 35 (kcps).

[製造例5]襯墊e(厚度:26 μm)之製造 使用厚度26 μm之烯烴膜(東麗公司製造,商品名「Torayfan」)代替PET膜,除此以外,以與製造例1相同之方式獲得厚度26 μm之襯墊e。所獲得之襯墊之Si-Kα射線之強度為12(kcps)。 [Manufacturing example 5] Manufacture of spacer e (thickness: 26 μm) A spacer e with a thickness of 26 μm was obtained in the same manner as in Production Example 1 except that an olefin film with a thickness of 26 μm (manufactured by Toray Corporation, trade name “Torayfan”) was used instead of the PET film. The Si-Kα ray intensity of the obtained spacer was 12 (kcps).

[製造例6]襯墊f(厚度:38 μm) 準備厚度38 μm之附剝離處理層之PET膜(三菱樹脂公司製造,商品名「MRF38」)作為襯墊f。該襯墊之Si-Kα射線之強度為18(kcps)。 [Manufacturing example 6] Spacer f (thickness: 38 μm) A PET film (manufactured by Mitsubishi Plastics Corporation, trade name "MRF38") having a thickness of 38 μm with a peeling layer was prepared as a liner f. The Si-Kα ray intensity of the gasket is 18 (kcps).

[製造例7]襯墊g(厚度:25 μm)之製造 使用厚度25 μm之PET膜(東麗公司製造,商品名「Lumirror S10」)代替PET膜,除此以外,以與製造例1相同之方式獲得厚度25 μm之襯墊g。所獲得之襯墊之Si-Kα射線之強度為1.1(kcps)。 [Manufacturing example 7] Manufacture of gasket g (thickness: 25 μm) A spacer g having a thickness of 25 μm was obtained in the same manner as in Production Example 1 except that a PET film with a thickness of 25 μm (manufactured by Toray Corporation, trade name “Lumirror S10”) was used instead of the PET film. The Si-Kα ray intensity of the obtained spacer was 1.1 (kcps).

[製造例8]襯墊h(厚度:5 μm)之製造 作為PET膜,使用厚度5 μm之PET膜(東麗公司製造,商品名「Lumirror S10」),除此以外,以與製造例1相同之方式獲得厚度5 μm之襯墊h。所獲得之襯墊之Si-Kα射線之強度為1.0(kcps)。 [Manufacturing Example 8] Manufacture of spacer h (thickness: 5 μm) A spacer h with a thickness of 5 μm was obtained in the same manner as in Production Example 1 except that a PET film with a thickness of 5 μm (manufactured by Toray Corporation, trade name “Lumirror S10”) was used. The Si-Kα ray intensity of the obtained spacer was 1.0 (kcps).

[製造例9]襯墊i(厚度:75 μm)之製造 使用厚度75 μm之烯烴膜(東麗公司製造,商品名「Torayfan」)代替PET膜,除此以外,以與製造例1相同之方式獲得厚度75 μm之襯墊i。所獲得之襯墊之Si-Kα射線之強度為13(kcps)。 [Manufacture Example 9] Manufacture of spacer i (thickness: 75 μm) A spacer i with a thickness of 75 μm was obtained in the same manner as in Production Example 1 except that an olefin film with a thickness of 75 μm (manufactured by Toray Corporation, trade name “Torayfan”) was used instead of the PET film. The Si-Kα ray intensity of the obtained spacer was 13 (kcps).

[製造例10]基礎聚合物1之製造 向甲苯中添加丙烯酸乙酯70份、丙烯酸丁酯3份、丙烯酸2-乙基己酯30份、甲基丙烯酸甲酯5份、丙烯酸2-羥基乙酯3.5份、及作為聚合起始劑之過氧化苯甲醯0.2份後進行加熱,獲得丙烯酸系共聚物(聚合物1)之甲苯溶液。再者,源自構成聚合物1之單體之重複單元中之3.1重量%係源自具有活性氫基之單體之重複單元。 [Production Example 10] Production of Base Polymer 1 Add 70 parts of ethyl acrylate, 3 parts of butyl acrylate, 30 parts of 2-ethylhexyl acrylate, 5 parts of methyl methacrylate, 3.5 parts of 2-hydroxyethyl acrylate, and After adding 0.2 parts of benzoyl peroxide, it was heated to obtain a toluene solution of an acrylic copolymer (polymer 1). Furthermore, 3.1% by weight of the repeating units derived from the monomers constituting Polymer 1 were repeating units derived from monomers having an active hydrogen group.

[製造例11]基礎聚合物2之製造 向甲苯中添加丙烯酸丁酯50份、丙烯酸乙酯50份、丙烯酸5份、丙烯酸2-羥基乙酯0.2份、及作為聚合起始劑之過氧化苯甲醯0.2份後進行加熱,獲得丙烯酸系共聚物(聚合物2)之甲苯溶液。再者,源自構成聚合物2之單體之重複單元中之4.9重量%係源自具有活性氫基之單體之重複單元。 [Production Example 11] Production of Base Polymer 2 Add 50 parts of butyl acrylate, 50 parts of ethyl acrylate, 5 parts of acrylic acid, 0.2 parts of 2-hydroxyethyl acrylate, and 0.2 parts of benzoyl peroxide as a polymerization initiator to toluene and heat to obtain an acrylic Copolymer (Polymer 2) in Toluene. Furthermore, 4.9% by weight of the repeating units derived from the monomers constituting Polymer 2 were repeating units derived from monomers having an active hydrogen group.

[製造例12]基礎聚合物3之製造 向乙酸乙酯中添加丙烯酸甲酯70份、丙烯酸丁酯2份、丙烯酸2-乙基己酯30份、丙烯酸10份、作為聚合起始劑之過氧化苯甲醯0.2份後進行加熱,獲得丙烯酸系共聚物(聚合物3)之乙酸乙酯溶液。再者,源自構成聚合物3之單體之重複單元中之8.9重量%係源自具有活性氫基之單體之重複單元。 [Production Example 12] Production of Base Polymer 3 70 parts of methyl acrylate, 2 parts of butyl acrylate, 30 parts of 2-ethylhexyl acrylate, 10 parts of acrylic acid, and 0.2 parts of benzoyl peroxide as a polymerization initiator were added to ethyl acetate, followed by heating to obtain Acrylic Copolymer (Polymer 3) in Ethyl Acetate. Furthermore, 8.9% by weight of repeating units derived from monomers constituting polymer 3 were repeating units derived from monomers having an active hydrogen group.

[製造例13]基礎聚合物4之製造 向甲苯中添加丙烯酸丁酯50莫耳、丙烯酸乙酯50莫耳、丙烯酸2-羥基乙酯24莫耳、及作為聚合起始劑之過氧化苯甲醯(相對於丙烯酸丁酯、丙烯酸乙酯及丙烯酸2-羥基乙酯之合計100份為0.2份)後進行加熱,獲得丙烯酸系共聚物(聚合物4)之甲苯溶液。再者,源自構成聚合物4之單體之重複單元中之19.6重量%係源自具有活性氫基之單體之重複單元。 [Production Example 13] Production of Base Polymer 4 Add 50 moles of butyl acrylate, 50 moles of ethyl acrylate, 24 moles of 2-hydroxyethyl acrylate, and benzoyl peroxide as a polymerization initiator (relative to butyl acrylate, ethyl acrylate, etc. and a total of 100 parts of 2-hydroxyethyl acrylate is 0.2 part) and heated to obtain a toluene solution of an acrylic copolymer (polymer 4). Furthermore, 19.6% by weight of repeating units derived from monomers constituting polymer 4 were repeating units derived from monomers having an active hydrogen group.

[製造例14]基礎聚合物5之製造 向甲苯中添加丙烯酸丁酯50莫耳、丙烯酸乙酯50莫耳、丙烯酸2-羥基乙酯24莫耳、及作為聚合起始劑之過氧化苯甲醯(相對於丙烯酸丁酯、丙烯酸乙酯及丙烯酸2-羥基乙酯之合計100份為0.2份)後進行加熱,獲得共聚物溶液。向該共聚物溶液中添加相當於源自該溶液中之丙烯酸2-羥基乙酯之羥基之78莫耳%之量的2-異氰酸基丙烯酸乙酯後進行加熱,使甲基丙烯酸2-異氰酸基乙酯加成於源自該丙烯酸2-羥基乙酯之羥基,藉此獲得側鏈具有甲基丙烯酸基之丙烯酸系共聚物(聚合物5)之甲苯溶液。再者,源自構成聚合物5之單體之重複單元中之3.4重量%係源自具有活性氫基之單體之重複單元。 [Production Example 14] Production of Base Polymer 5 Add 50 moles of butyl acrylate, 50 moles of ethyl acrylate, 24 moles of 2-hydroxyethyl acrylate, and benzoyl peroxide as a polymerization initiator (relative to butyl acrylate, ethyl acrylate, etc. and a total of 100 parts of 2-hydroxyethyl acrylate is 0.2 part) and then heated to obtain a copolymer solution. After adding 2-isocyanatoacrylate ethyl in an amount corresponding to 78 mol% of the hydroxyl group derived from 2-hydroxyethyl acrylate in the solution to the copolymer solution, heat it to make methacrylic acid 2- Isocyanatoethyl was added to the hydroxyl group derived from the 2-hydroxyethyl acrylate to obtain a toluene solution of an acrylic copolymer (polymer 5) having a methacrylic group in its side chain. Furthermore, 3.4% by weight of the repeating units derived from the monomers constituting Polymer 5 were repeating units derived from monomers having an active hydrogen group.

[實施例1] (底塗層/基材積層體之製作) 製作將聚合物1之甲苯溶液(聚合物1:100份)與異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)3份混合而成之混合溶液A。 使用東麗公司製造之Lumirror S10(厚度:25 μm)作為基材,使用敷料器將上述混合溶液A以溶劑揮發(乾燥)後之厚度成為13 μm之方式塗佈於其一面,其後,使溶劑揮發(乾燥),獲得底塗層/基材積層體。 (第1襯墊/第1黏著劑層(含熱膨脹性微球)積層體之製作) 製作將聚合物1之甲苯溶液(聚合物1:100份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)1.5份、交聯助劑(東京精密化學公司製造,商品名「OL-1」)0.05份、黏著賦予樹脂(住友電木公司製造,商品名「Sumilite PR12603」)10份、熱膨脹性微球(松本油脂製藥公司製造,商品名「FN-180SSD」)30份、著色劑(大日精化工業公司製造,商品名「DYMICS SZ-7510 GREEN」)0.5份混合而成之混合溶液B。 將上述混合溶液B以溶劑揮發(乾燥)後之厚度成為35 μm之方式塗佈於襯墊a之剝離處理劑塗佈面。其後,使溶劑揮發(乾燥),獲得第1襯墊/第1黏著劑層積層體。 (第1襯墊/第1黏著劑層(含熱膨脹性微球)/底塗層/基材積層體之製作) 將第1襯墊/第1黏著劑層積層體與底塗層/基材積層體以第1黏著劑層與底塗層對向之方式貼合,獲得第1襯墊/第1黏著劑層(含熱膨脹性微球)/底塗層/基材積層體。 (第2黏著劑層/第2襯墊積層體之製作) 製作將聚合物1之甲苯溶液(聚合物1:100份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)1.5份、交聯助劑(東京精密化學公司製造,商品名「OL-1」)0.05份、塑化劑(DIC公司製造,商品名「Monocizer W700」)10份混合而成之混合溶液C。 將上述混合溶液C以溶劑揮發(乾燥)後之厚度成為10 μm之方式塗佈於襯墊b之剝離處理劑塗佈面。其後,使溶劑揮發(乾燥),獲得第2黏著劑層/第2襯墊積層體。 (附襯墊之雙面黏著片材之製作) 將第1襯墊/第1黏著劑層(含熱膨脹性微球)/底塗層/基材積層體與第2黏著劑層/第2襯墊積層體以基材與第2黏著劑層對向之方式貼合,獲得附襯墊之雙面黏著片材(第1襯墊/雙面黏著片材(第1黏著劑層(含熱膨脹性微球)/底塗層/基材/第2黏著劑層)/第2襯墊)。 [Example 1] (Preparation of base coat/substrate laminate) A mixed solution A obtained by mixing a toluene solution of polymer 1 (polymer 1: 100 parts) and 3 parts of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L") was prepared. Using Lumirror S10 (thickness: 25 μm) manufactured by Toray Co., Ltd. as a substrate, the above-mentioned mixed solution A was coated on one side with an applicator so that the thickness after solvent evaporation (drying) became 13 μm, and then, The solvent was evaporated (dried), and a primer layer/substrate laminate was obtained. (Preparation of the first liner/first adhesive layer (including heat-expandable microspheres) laminate) Toluene solution of polymer 1 (polymer 1: 100 parts), 1.5 parts of isocyanate crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L"), crosslinking auxiliary agent (manufactured by Tokyo Seiki Chemical Co., Ltd., commercial product) were prepared. "OL-1") 0.05 parts, adhesion imparting resin (manufactured by Sumitomo Bakelite Co., Ltd., trade name "Sumilite PR12603") 10 parts, heat-expandable microspheres (manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "FN-180SSD") 30 parts 0.5 part of a coloring agent (manufactured by Dainichi Seika Kogyo Co., Ltd., trade name "DYMICS SZ-7510 GREEN") and a mixed solution B obtained by mixing 0.5 part. The above-mentioned mixed solution B was applied to the release treatment agent-applied surface of the liner a so that the thickness after the solvent evaporated (dried) became 35 μm. Thereafter, the solvent was volatilized (dried) to obtain a first liner/first adhesive laminate. (1st liner/1st adhesive layer (including heat-expandable microspheres)/undercoat layer/substrate laminate) Laminate the first liner/first adhesive laminate and the base coat/substrate laminate in such a way that the first adhesive layer and the base coat face each other to obtain the first liner/first adhesive layer (Contains heat-expandable microspheres)/undercoat layer/substrate laminate. (Production of the 2nd adhesive layer/2nd liner laminate) Toluene solution of polymer 1 (polymer 1: 100 parts), 1.5 parts of isocyanate crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L"), crosslinking auxiliary agent (manufactured by Tokyo Seiki Chemical Co., Ltd., commercial product) were prepared. A mixed solution C obtained by mixing 0.05 parts of "OL-1") and 10 parts of a plasticizer (manufactured by DIC Corporation, trade name "Monocizer W700"). The above-mentioned mixed solution C was applied to the release treatment agent-applied surface of the liner b so that the thickness after the solvent evaporated (dried) became 10 μm. Thereafter, the solvent was volatilized (dried) to obtain a second adhesive layer/second liner laminate. (Production of double-sided adhesive sheet with backing) The first liner/first adhesive layer (containing thermally expandable microspheres)/undercoat layer/substrate laminate and the second adhesive layer/second liner laminate are paired with the substrate and the second adhesive layer. Laminate in the same way to obtain a double-sided adhesive sheet with a liner (the first liner/double-sided adhesive sheet (the first adhesive layer (containing thermally expandable microspheres)/undercoat layer/substrate/second Adhesive layer)/Second liner).

[實施例2~18、20~23、比較例1] 使各層之成分組成如表1~4所示,除此以外,以與實施例1相同之方式獲得附襯墊之雙面黏著片材。 各成分之內容如下所述。 <交聯劑> Tetrad C:三菱瓦斯化學公司製造,商品名「TetradC」、環氧系交聯劑 <黏著賦予劑> Sumilite PR12603:住友電木公司製造,商品名「Sumilite Resin PR12603」 S145:Yasuhara Chemical公司製造,商品名「YS POLYSTERS145」 <熱膨脹性微球> F-30D:松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-30D」、發泡(膨脹)起始溫度:70℃~80℃、最大膨脹溫度:110℃~120℃、平均粒徑10 μm~18 μm FN-180SSD:松本油脂製藥公司製造,商品名「Matsumoto Microsphere FN-180SSD」、發泡(膨脹)起始溫度:135℃~150℃、最大膨脹溫度:165℃~180℃、平均粒徑15 μm~25 μm F-230D:松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-230D」 F-50D:松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-50D」 <著色劑> DYMICS SZ-7200 RED:大日精化工業公司製造,商品名「DYMICS SZ-7200 RED」 [Examples 2-18, 20-23, Comparative Example 1] A double-sided adhesive sheet with a liner was obtained in the same manner as in Example 1 except that the component composition of each layer was shown in Tables 1 to 4. The content of each component is as follows. <Crosslinking agent> Tetrad C: Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C", epoxy-based crosslinking agent <Adhesion imparting agent> Sumilite PR12603: Manufactured by Sumitomo Bakelite Co., Ltd., trade name "Sumilite Resin PR12603" S145: Manufactured by Yasuhara Chemical Co., Ltd., trade name "YS POLYSTERS 145" <Heat-expandable microspheres> F-30D: Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-30D", foaming (expansion) start temperature: 70°C to 80°C, maximum expansion temperature: 110°C to 120°C, average particle diameter: 10 μm ~18 μm FN-180SSD: Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere FN-180SSD", foaming (expansion) start temperature: 135°C to 150°C, maximum expansion temperature: 165°C to 180°C, average particle diameter: 15 μm ~25 μm F-230D: Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-230D" F-50D: Manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50D" <Coloring agent> DYMICS SZ-7200 RED: Manufactured by Dainichi Seika Co., Ltd., trade name "DYMICS SZ-7200 RED"

[實施例19] (底塗層/基材積層體之製作) 將聚合物4之甲苯溶液(聚合物4:100份)、作為活性能量線反應性低聚物之紫外線硬化型胺基甲酸酯丙烯酸酯(UV7620EA:日本合成化學公司製造,商品名「紫光UV-7620EA」)40份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「Tetrad C」)0.5份、及能量線聚合起始劑(BASF JAPAN公司製造,商品名「Irgacure 651」)3份加以混合而製備混合液。向該混合液中進而添加與該混合液中之溶劑相同之溶劑(甲苯),將黏度調整至容易塗佈之黏度為止,獲得混合液A'。 準備利用凹版塗佈機將藍色印刷墨水CVL-PR(DIC GRAPHICS公司製造)以乾燥後之塗佈厚度成為2 μm之方式塗佈(滿版印刷)於東麗公司製造之Lumirror S10(厚度50 μm)之一面而形成之膜作為基材。使用敷料器將上述混合溶液A'塗佈於該基材之一面,其後,使溶劑揮發(乾燥),獲得包含底塗層之前驅層/基材之積層體。 (第1襯墊/第1黏著劑層(含熱膨脹性微球)積層體之製作) 將聚合物4之甲苯溶液(聚合物4:100份)、作為活性能量線反應性低聚物之紫外線硬化型胺基甲酸酯丙烯酸酯(UV7620EA:日本合成化學公司製造,商品名「紫光UV-7620EA」)40份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「Tetrad C」)0.5份、能量線聚合起始劑(BASF JAPAN公司製造,商品名「Irgacure 651」)3份、及熱膨脹性微球(松本油脂製藥公司製造,商品名「F-30D」)30份進行混合而製備混合液。向該混合液中進而添加與該混合液中之溶劑相同之溶劑(甲苯),將黏度調整至容易塗佈之黏度為止,獲得混合液B'。 將上述混合溶液B'塗佈於襯墊c之剝離處理劑塗佈面。其後,使溶劑揮發(乾燥),獲得包含第1襯墊/第1黏著劑層之前驅層之積層體。 (第1襯墊/第1黏著劑層(含熱膨脹性微球)/底塗層/基材積層體之製作) 將包含第1襯墊/第1黏著劑層之前驅層之積層體與包含底塗層之前驅層/基材之積層體以第1黏著劑層之前驅層與底塗層之前驅層對向之方式貼合,獲得包含第1襯墊/第1黏著劑層之前驅層(含熱膨脹性微球)/底塗層之前驅層/基材之積層體。 (第2黏著劑層/第2襯墊積層體之製作) 製作將聚合物5之甲苯溶液(聚合物1:100份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)0.2份、及能量線聚合起始劑(BASF JAPAN公司製造,商品名「Irgacure 651」)3份混合而成之混合溶液C'。 將上述混合溶液C'塗佈於襯墊f之剝離處理劑塗佈面。其後,使溶劑揮發(乾燥),獲得包含第2黏著劑層之前驅層/第2襯墊之積層體。 (附襯墊之雙面黏著片材之製作) 將包含第1襯墊/第1黏著劑層之前驅層(含熱膨脹性微球)/底塗層之前驅層/基材之積層體與包含第2黏著劑層之前驅層/第2襯墊之積層體以基材與第2黏著劑層之前驅層對向之方式貼合。其後,使用紫外線照射機(日東精機公司製造,商品名「UM810(高壓水銀燈光源)」)對各前驅層照射累計光量300 mJ/cm 2之紫外線。以如上方式獲得附襯墊之雙面黏著片材(第1襯墊/雙面黏著片材(第1黏著劑層(含熱膨脹性微球;厚度:25 μm)/底塗層(25 μm)/基材/第2黏著劑層(10 μm))/第2襯墊)。 [Example 19] (Preparation of undercoat layer/substrate laminate) A toluene solution of polymer 4 (polymer 4: 100 parts), ultraviolet curable urethane as an active energy ray reactive oligomer 40 parts of ester acrylate (UV7620EA: manufactured by Nippon Synthetic Chemicals Co., Ltd., trade name "Ultraviolet UV-7620EA"), 0.5 parts of epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C"), and energy rays Three parts of a polymerization initiator (manufactured by BASF JAPAN, trade name "Irgacure 651") were mixed to prepare a liquid mixture. Further, the same solvent (toluene) as the solvent in the mixed liquid was added to the mixed liquid, and the viscosity was adjusted to a viscosity that was easy to apply, thereby obtaining the mixed liquid A'. The blue printing ink CVL-PR (manufactured by DIC GRAPHICS Co., Ltd.) was prepared to be coated (solid printing) on Lumirror S10 (thickness 50 μm) made by Toray Co. μm) as the base material. The above-mentioned mixed solution A' was applied to one side of the substrate using an applicator, and then the solvent was evaporated (dried) to obtain a laminate including a primer layer and a precursor layer/substrate. (Preparation of the first liner/first adhesive layer (including heat-expandable microspheres) laminate) Polymer 4 in toluene solution (polymer 4: 100 parts), ultraviolet rays as active energy ray reactive oligomer 40 parts of hardening urethane acrylate (UV7620EA: manufactured by Nippon Synthetic Chemicals Co., Ltd., trade name "Ultraviolet UV-7620EA"), epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C") 0.5 parts, 3 parts of an energy ray polymerization initiator (manufactured by BASF JAPAN, trade name "Irgacure 651"), and 30 parts of heat-expandable microspheres (manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "F-30D") were mixed. Prepare the mixture. Further, the same solvent (toluene) as the solvent in the mixed liquid was added to the mixed liquid, and the viscosity was adjusted to a viscosity that was easy to coat, and the mixed liquid B' was obtained. The above-mentioned mixed solution B' was applied to the release treatment agent-applied surface of the liner c. Thereafter, the solvent was volatilized (dried) to obtain a laminate including the precursor layer of the first liner/first adhesive layer. (Preparation of the first liner/first adhesive layer (containing heat-expandable microspheres)/undercoat layer/substrate laminate) The laminate including the first liner/first adhesive layer and the precursor layer containing The laminate of the precursor layer of the primer layer/substrate is bonded in such a way that the precursor layer of the first adhesive layer and the precursor layer of the primer layer face each other to obtain a precursor layer comprising the first liner/the first adhesive layer (Contains heat-expandable microspheres)/Primer layer Precursor layer/Substrate laminate. (Preparation of the second adhesive layer/second liner laminate) Preparation of polymer 5 in toluene solution (polymer 1: 100 parts), isocyanate crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L") ) and 3 parts of an energy ray polymerization initiator (manufactured by BASF JAPAN, trade name "Irgacure 651"). The above-mentioned mixed solution C' was applied to the release treatment agent-applied surface of the liner f. Thereafter, the solvent was volatilized (dried) to obtain a laminate of the precursor layer/second spacer including the second adhesive layer. (Production of Double-sided Adhesive Sheet with Liner) A laminate comprising the first liner/precursor layer of the first adhesive layer (including thermally expandable microspheres)/precursor layer of the primer layer/substrate and the laminate containing The laminate of the precursor layer of the second adhesive layer/the second liner is bonded in such a way that the base material and the precursor layer of the second adhesive layer face each other. Thereafter, each precursor layer was irradiated with ultraviolet rays with a cumulative light quantity of 300 mJ/cm 2 using an ultraviolet irradiation machine (manufactured by Nitto Seiki Co., Ltd., trade name "UM810 (high-pressure mercury lamp light source)"). A double-sided adhesive sheet with liner was obtained in the above manner (the first liner/double-sided adhesive sheet (the first adhesive layer (containing heat-expandable microspheres; thickness: 25 μm)/undercoat layer (25 μm) /substrate/2nd adhesive layer (10 μm))/2nd spacer).

[評價] 將實施例及比較例中所獲得之附襯墊之雙面黏著片材供於以下評價。將結果示於表1~5中。 (1)襯墊剝離操作性評價a 以使第1襯墊成為上側之方式經由雙面膠帶(日東電工公司製造,商品名「No.500」)將附襯墊之雙面黏著片材(50 mm×100 mm)貼合於金屬板(SUS304板、厚度3 mm)來準備測定試樣(a)。 又,以使第2襯墊成為上側之方式經由雙面膠帶(日東電工公司製造,商品名「No.500」)將附襯墊之雙面黏著片材(50 mm×100 mm)貼合於金屬板(SUS304板、厚度3 mm)來準備測定試樣(b)。 針對測定試樣(a)及測定試樣(b),於23℃/65%RH之環境下進行徒手將上側之襯墊拉拽回折之操作,並藉由以下基準對襯墊剝離操作性進行評價。 優(表中○):能夠於30秒以內回折。 良(表中△):雖耗費30秒以上,但仍能夠回折。 不合格(表中×):於回折之前黏著劑層破碎或產生無用之隆起(剝離)等而成為不屬於「優」、「良」之結果。 (2)襯墊剝離操作性評價b 與上述(1)同樣地準備測定試樣(a)及測定試樣(b)。 針對測定試樣(a)及測定試樣(b),於23℃/65%RH之環境下藉由以下之操作對襯墊剝離操作性進行評價。 將膠帶(Nichiban公司製造,商品名「Sellotape(註冊商標)No.405」(產業用、寬18 mm))如圖2(表示測定試樣之自上側觀察之俯視圖)所示貼合於上側之襯墊,準備測定試樣(c)。將測定試樣(c)安裝於附恆溫槽之拉伸試驗機(商品名「島津Autograph AG-120kN」島津製作所公司製造)。其後,將上述膠帶於設定剝離角度180°、固定之力、剝離速度300 mm/min之條件下沿長度方向(紙面右方向拉伸,觀察上側之襯墊自雙面黏著片材分離之情況,並以以下基準進行評價。 優(表中○):維持剝離角度180°而將上側之襯墊剝離。 良(表中△):未能維持剝離角度180°,但上側之襯墊仍被剝離。 不合格(表中×):黏著劑層破碎,出現下側襯墊/黏著劑層界面之剝離等非意願分離現象。 (3)捲筒捲取試驗 將長度2 m×寬度0.3 m之附襯墊之雙面黏著片材以第2襯墊成為外側之方式捲繞於外周直徑5 cm之管。此時,附襯墊之雙面黏著片材之兩端係由末端膠帶(Nichiban公司製造,商品名「Sellotape(註冊商標)No.405」(產業用、寬18 m)、20 mm×18 mm)封口。 將以如上方式捲繞於管之附襯墊之雙面黏著片材於40℃/50%RH之環境下保管72小時。 其後,目視確認附襯墊之雙面黏著片材之外觀,並以以下基準對捲筒捲取性進行評價。 優(表中○):保管前後外觀無變化 良(表中△):雖確認到末端膠帶產生隆起之程度之外觀變化,但捲繞並不慢。 不合格(表中×):捲繞緩慢,確認到末端膠帶之剝落,從而確認到襯墊剝離 (4)襯墊剝離力 自附襯墊之雙面黏著片材(50 mm×180 mm)將第2襯墊剝離,並經由雙面膠帶(日東電工公司製造,商品名「No.500」)將第2黏著劑層貼合於金屬板(SUS304板、厚度:3 mm)來準備測定試樣。 將該測定試樣設置於附恆溫槽之拉伸試驗機(商品名「島津Autograph AG-120kN」島津製作所公司製造),並放置30分鐘。 繼而,於23℃/55%RH之環境下將第1襯墊於剝離角度:180°、剝離速度(拉伸速度):300 mm/min之條件下自雙面黏著片材剝離,並測定第1襯墊之剝離力。 又,將第1襯墊自附襯墊之雙面黏著片材(50 mm×180 mm)剝離,並經由雙面膠帶(日東電工公司製造,商品名「No.500」)將第1黏著劑層貼附於金屬板(SUS304板、厚度:3 mm)來準備測定試樣,以與上述方法相同之方法測定第2襯墊之剝離力。 (5)彈性模數 將附襯墊之雙面黏著片材用切片機沿厚度方向切斷,藉由目視或光學顯微鏡觀察其切斷面而識別各層,測定構成該附襯墊之雙面黏著片材之層之奈米壓痕儀彈性模數。 再者,第1黏著劑層之彈性模數係不存在熱膨脹性微球之區域之彈性模數。 用測定裝置附帶之軟體(triboscan)對藉由將探針(壓頭)壓抵於測定對象所得之位移-荷重遲滯曲線進行數值處理,藉此獲得彈性模數(3次測定之平均值)。 奈米壓痕儀裝置以及測定條件如下。 裝置及測定條件・裝置:奈米壓痕儀;Hysitron Inc公司製造之Triboindenter 測定方法:單一壓入法 測定溫度:25℃ 壓入速度:約1000 nm/sec 壓入深度:約800 nm 探針:金剛石製,Berkovich型(三角錐型) (6)厚度 將附襯墊之雙面黏著片材用修整刀沿厚度方向切斷,實施Pt-Pd濺鍍處理後,使用日立高新技術公司製造之S3400N低真空掃描電子顯微鏡(SEM)對切斷面進行觀察並進行厚度測定。 SEM觀察之測定條件如下 ・觀察圖像:ESED圖像 ・加速電壓:10 kV ・倍率:600倍 再者,於構成層界面不清晰之情形時,併用下述拉曼光譜測定,確定層之界面後測定厚度。 (拉曼光譜測定) ・激發波長:532 nm ・測定波數範圍:300~3600 cm-1 ・光柵:600 gr/mm ・物鏡:×100 ・測定時間:0.2 sec/1光譜 ・測定範圍:20×40 μm ・測定數:100×200點 ・檢測器:EMCCD (7)襯墊之Si-Kα射線強度測定 對在襯墊表面(剝離處理面)中隨機抽取之100個部位進行螢光X射線分析。更詳細而言,測定襯墊之與黏接著劑層相接之面(塗佈有剝離處理劑之面)之Si-Kα射線之強度(i)及不與黏接著劑層相接之面(未塗佈剝離處理劑之面)之Si-Kα射線之強度(ii),求出(i)之值減去(ii)之值所得之值之絕對值,將該值之100個部位測定之平均值作為襯墊之Si-Kα射線強度。 再者,Si-Kα射線之強度係於利用下述裝置而進行之測定中波長7.125埃下之強度。 裝置:Rigaku製造 ZSX100e 分析面積:30 mmϕ 分析元素:Si 分析結晶:RX4 輸出:50 kV、70 mA [evaluate] The double-sided adhesive sheet with a liner obtained in Examples and Comparative Examples was used for the following evaluation. The results are shown in Tables 1-5. (1) Evaluation of liner peeling operabilitya Attach a double-sided adhesive sheet (50 mm×100 mm) with a liner to the metal plate via a double-sided tape (manufactured by Nitto Denko Co., Ltd., trade name "No. 500") so that the first liner is on the upper side (SUS304 plate, thickness 3 mm) to prepare the measurement sample (a). In addition, a double-sided adhesive sheet (50 mm×100 mm) with a liner (50 mm×100 mm) was bonded to the second liner via a double-sided adhesive tape (manufactured by Nitto Denko Co., Ltd., trade name "No. 500"). A metal plate (SUS304 plate, thickness 3 mm) was used to prepare the measurement sample (b). For the measurement sample (a) and the measurement sample (b), the operation of pulling and folding the upper liner by hand is performed in an environment of 23°C/65%RH, and the liner peeling operability is evaluated according to the following criteria evaluate. Excellent (○ in the table): Can be folded back within 30 seconds. Good (△ in the table): Although it took more than 30 seconds, it was still possible to turn back. Unacceptable (× in the table): The adhesive layer was broken or useless swelling (peeling) occurred before the folding back, and the result was not classified as "excellent" or "good". (2) Evaluation of liner peeling operabilityb A measurement sample (a) and a measurement sample (b) were prepared in the same manner as in (1) above. With respect to the measurement sample (a) and the measurement sample (b), the liner peeling workability was evaluated by the following operation in an environment of 23° C./65% RH. Adhesive tape (manufactured by Nichiban Corporation, trade name "Sellotape (registered trademark) No. 405" (industrial use, width 18 mm)) was attached to the upper side as shown in Fig. Pad, prepare test sample (c). The measurement sample (c) was installed in a tensile testing machine (trade name "Shimadzu Autograph AG-120kN" manufactured by Shimadzu Corporation) with a constant temperature bath. Afterwards, stretch the above-mentioned adhesive tape along the longitudinal direction (the right direction of the paper surface) under the conditions of setting the peeling angle of 180°, the fixing force, and the peeling speed of 300 mm/min, and observe the separation of the upper liner from the double-sided adhesive sheet , and evaluated on the basis of the following criteria. Excellent (○ in the table): The upper liner was peeled while maintaining the peeling angle of 180°. Good (△ in the table): The peeling angle of 180° could not be maintained, but the liner on the upper side was still peeled off. Unqualified (× in the table): The adhesive layer is broken, and there are unintentional separation phenomena such as peeling of the lower liner/adhesive layer interface. (3) Reel winding test A double-sided adhesive sheet with a liner having a length of 2 m x a width of 0.3 m was wound around a tube with an outer peripheral diameter of 5 cm so that the second liner was on the outside. At this time, the two ends of the double-sided adhesive sheet with liner are made of end tape (manufactured by Nichiban Corporation, trade name "Sellotape (registered trademark) No. 405" (industrial use, width 18 m), 20 mm x 18 mm )seal. The double-sided adhesive sheet with liner wound up on the tube as above was stored in an environment of 40° C./50% RH for 72 hours. Thereafter, the appearance of the double-sided adhesive sheet with a liner was visually confirmed, and the roll windability was evaluated on the following criteria. Excellent (○ in the table): No change in appearance before and after storage Good (△ in the table): Although an appearance change was observed to the extent that the end tape was raised, the winding was not slow. Unqualified (× in the table): Winding is slow, peeling of tape at the end is confirmed, and liner peeling is confirmed (4) Liner peel force Peel off the second liner from the double-sided adhesive sheet (50 mm×180 mm) with liner, and stick the second adhesive layer through double-sided tape (manufactured by Nitto Denko Co., Ltd., trade name "No. 500") Fit the metal plate (SUS304 plate, thickness: 3 mm) to prepare a measurement sample. This measurement sample was set in a tensile testing machine (trade name "Shimadzu Autograph AG-120kN" manufactured by Shimadzu Corporation) with a constant temperature bath, and left to stand for 30 minutes. Then, in the environment of 23°C/55%RH, the first liner was peeled from the double-sided adhesive sheet under the conditions of peeling angle: 180° and peeling speed (stretching speed): 300 mm/min, and the second liner was measured. 1 Peel force of liner. In addition, the first liner was peeled off from the double-sided adhesive sheet (50 mm×180 mm) with liner, and the first adhesive was attached via a double-sided tape (manufactured by Nitto Denko Co., Ltd., trade name "No. 500"). The layer was attached to a metal plate (SUS304 plate, thickness: 3 mm) to prepare a measurement sample, and the peeling force of the second liner was measured in the same way as above. (5) modulus of elasticity Cut the double-sided adhesive sheet with a liner along the thickness direction with a microtome, observe the cut surface visually or with an optical microscope to identify each layer, and measure the thickness of the layers that constitute the double-sided adhesive sheet with a liner m indenter modulus of elasticity. Furthermore, the elastic modulus of the first adhesive layer is the elastic modulus of the region where thermally expandable microspheres do not exist. Use the software (triboscan) attached to the measuring device to perform numerical processing on the displacement-load hysteresis curve obtained by pressing the probe (indenter) against the measuring object, thereby obtaining the elastic modulus (the average value of 3 measurements). The nanoindentation apparatus and measurement conditions are as follows. Apparatus and measurement conditions ・Apparatus: Nanoindenter; Triboindenter manufactured by Hysitron Inc. Measuring method: single indentation method Measuring temperature: 25°C Pressing speed: about 1000 nm/sec Indentation depth: about 800 nm Probe: made of diamond, Berkovich type (triangular pyramid type) (6) Thickness Cut the double-sided adhesive sheet with a liner in the thickness direction with a trimming knife, and after performing Pt-Pd sputtering treatment, observe the cut surface with a S3400N low-vacuum scanning electron microscope (SEM) manufactured by Hitachi High-Tech Co., Ltd. And measure the thickness. The measurement conditions of SEM observation are as follows ・Observation image: ESED image ・Acceleration voltage: 10 kV ・Magnification: 600 times In addition, when the interface of the constituent layers is not clear, the following Raman spectrum measurement is used to determine the interface of the layer and then measure the thickness. (Raman spectrometry) ・Excitation wavelength: 532 nm ・Measurement wave number range: 300~3600 cm-1 ・Raster: 600 gr/mm ・Objective lens: ×100 ・Measurement time: 0.2 sec/1 spectrum ・Measurement range: 20×40 μm ・Number of measurements: 100×200 points ・Detector: EMCCD (7) Determination of Si-Kα ray intensity of gasket Fluorescent X-ray analysis was performed on 100 sites randomly selected from the surface of the liner (peeling-treated surface). More specifically, the Si-Kα ray intensity (i) of the surface of the liner in contact with the adhesive layer (the surface coated with the release treatment agent) and the surface not in contact with the adhesive layer ( Intensity (ii) of the Si-Kα ray on the surface not coated with the peeling treatment agent), the absolute value of the value obtained by subtracting the value of (ii) from the value of (i) is obtained, and the value is measured at 100 points The average value is taken as the Si-Kα ray intensity of the gasket. In addition, the intensity of the Si-Kα ray is the intensity at a wavelength of 7.125 angstroms in the measurement performed with the following equipment. Device: ZSX100e made by Rigaku Analysis area: 30 mmϕ Analytical element: Si Analytical crystallization: RX4 Output: 50 kV, 70 mA

[表1]    實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 第2襯墊 第2襯墊 襯墊b 襯墊a 襯墊d 襯墊d 襯墊c 襯墊i 材料 PET PET PET PET PET 烯烴 厚度(μm) 75 12 50 50 38 75 彈性模數(MPa) 3100 3100 3100 3100 3100 800 第2黏著劑層 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 3 3 3 3 3 3 交聯助劑 OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 交聯助劑調配量(重量份) 0.05 0.05 0.05 0.05 0.05 0.05 塑化劑 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 塑化劑調配量(重量份) 10 10 10 10 10 10 黏著賦予樹脂                   黏著賦予樹脂調配量(重量份)                   厚度(μm) 10 10 10 10 10 10 彈性模數(MPa) 2.50 2.50 2.50 2.50 2.50 2.50 基材 材料 PET PET PET PET PET 烯烴 厚度(μm) 25 25 25 75 25 25 彈性模數(MPa) 3100 3100 3100 3100 3100 800 底塗層 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 3 3 3 3 3 3 厚度(μm) 13 13 13 13 13 13 彈性模數(MPa) 1.20 1.20 1.20 1.20 1.20 1.20 第1黏著劑層 (含熱膨脹性 微球) 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 1.5 1.5 1.5 1.5 1.5 1.5 交聯助劑 OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 交聯助劑調配量(重量份) 0.05 0.05 0.05 0.05 0.05 0.05 黏著賦予樹脂 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 黏著賦予樹脂調配量(重量份) 10 10 10 10 10 10 熱膨脹性微球 FN-180SSD FN-180SSD FN-180SSD FN-180SSD FN-180SSD FN-180SSD 熱膨脹性微球調配量(重量份) 30 30 30 30 30 30 著色劑 DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN 著色劑調配量(重量份) 0.5 0.5 0.5 0.5 0.5 0.5 厚度(μm) 35 35 35 35 35 35 彈性模數(MPa) 1.00 1.00 1.00 1.00 1.00 1.00 第1襯墊 第1襯墊 襯墊a 襯墊b 襯墊c 襯墊c 襯墊d 襯墊e 材料 PET PET PET PET PET 烯烴 厚度(μm) 12 75 38 38 50 26 彈性模數(MPa) 3100 3100 3100 3100 3100 800 評價 第2襯墊剝離力(N/50 mm) 0.02 0.03 0.02 0.02 0.03 0.02 第1襯墊剝離力(N/50 mm) 0.37 0.33 0.35 0.35 0.34 0.36 第1襯墊之厚度之三次方與第1襯墊之彈性模數之乘積(I) 5.3568E-06 0.001307813 0.000170103 0.000170103 0.0003875 1.40608E-05 第2襯墊之厚度之三次方與第2襯墊之彈性模數之乘積(II) 0.001307813 5.3568E-06 0.0003875 0.0003875 0.000170103 0.0003375 構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III) 4.84855E-05 4.84855E-05 4.84855E-05 0.001307861 4.84855E-05 1.2548E-05 (I)+(III) 5.384E-05 1.356E-03 2.186E-04 1.478E-03 4.360E-04 2.661E-05 (II)+(III) 1.356E-03 5.384E-05 4.360E-04 1.695E-03 2.186E-04 3.500E-04 (I)/{(II)+(III)} 3.950E-03 2.429E+01 3.902E-01 1.003E-01 1.773E+00 4.017E-02 (II)/{(I)+(III)} 2.429E+01 3.950E-03 1.773E+00 2.622E-01 3.902E-01 1.268E+01 {(I)+(II)}/(III) 2.708E+01 2.708E+01 1.150E+01 4.263E-01 1.150E+01 2.802E+01 襯墊剝離操作性評價a/測定試樣(a) 襯墊剝離操作性評價a/測定試樣(b) 襯墊剝離操作性評價b/測定試樣(a) 襯墊剝離操作性評價b/測定試樣(b) 捲筒捲取試驗 [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 2nd liner 2nd liner liner b liner a liner d liner d liner c liner i Material PET PET PET PET PET Olefin Thickness (μm) 75 12 50 50 38 75 Elastic modulus (MPa) 3100 3100 3100 3100 3100 800 2nd Adhesive Layer base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 3 3 3 3 3 3 Crosslinking Auxiliary OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 0.05 0.05 0.05 Plasticizer Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Plasticizer deployment amount (parts by weight) 10 10 10 10 10 10 Adhesion Imparting Resin Adhesion-imparting resin formulation amount (parts by weight) Thickness (μm) 10 10 10 10 10 10 Elastic modulus (MPa) 2.50 2.50 2.50 2.50 2.50 2.50 Substrate Material PET PET PET PET PET Olefin Thickness (μm) 25 25 25 75 25 25 Elastic modulus (MPa) 3100 3100 3100 3100 3100 800 Primer base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 3 3 3 3 3 3 Thickness (μm) 13 13 13 13 13 13 Elastic modulus (MPa) 1.20 1.20 1.20 1.20 1.20 1.20 1st adhesive layer (containing heat-expandable microspheres) base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 1.5 1.5 1.5 1.5 1.5 1.5 Crosslinking Auxiliary OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 0.05 0.05 0.05 Adhesion Imparting Resin Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Adhesion-imparting resin formulation amount (parts by weight) 10 10 10 10 10 10 heat-expandable microspheres FN-180SSD FN-180SSD FN-180SSD FN-180SSD FN-180SSD FN-180SSD Heat-expandable microsphere deployment amount (weight part) 30 30 30 30 30 30 Colorant DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN Coloring agent deployment amount (weight part) 0.5 0.5 0.5 0.5 0.5 0.5 Thickness (μm) 35 35 35 35 35 35 Elastic modulus (MPa) 1.00 1.00 1.00 1.00 1.00 1.00 1st liner 1st liner liner a liner b liner c liner c liner d liner e Material PET PET PET PET PET Olefin Thickness (μm) 12 75 38 38 50 26 Elastic modulus (MPa) 3100 3100 3100 3100 3100 800 evaluate Peel force of the second liner (N/50 mm) 0.02 0.03 0.02 0.02 0.03 0.02 Peel force of the first liner (N/50 mm) 0.37 0.33 0.35 0.35 0.34 0.36 The product of the third power of the thickness of the first liner and the modulus of elasticity of the first liner (I) 5.3568E-06 0.001307813 0.000170103 0.000170103 0.0003875 1.40608E-05 The product of the third power of the thickness of the second liner and the modulus of elasticity of the second liner (II) 0.001307813 5.3568E-06 0.0003875 0.0003875 0.000170103 0.0003375 The total of all layers of the product of the single layer thickness cubed and the single layer elastic modulus of each layer constituting the double-sided adhesive sheet (III) 4.84855E-05 4.84855E-05 4.84855E-05 0.001307861 4.84855E-05 1.2548E-05 (I)+(III) 5.384E-05 1.356E-03 2.186E-04 1.478E-03 4.360E-04 2.661E-05 (II)+(III) 1.356E-03 5.384E-05 4.360E-04 1.695E-03 2.186E-04 3.500E-04 (I)/{(II)+(III)} 3.950E-03 2.429E+01 3.902E-01 1.003E-01 1.773E+00 4.017E-02 (II)/{(I)+(III)} 2.429E+01 3.950E-03 1.773E+00 2.622E-01 3.902E-01 1.268E+01 {(I)+(II)}/(III) 2.708E+01 2.708E+01 1.150E+01 4.263E-01 1.150E+01 2.802E+01 Liner peeling workability evaluation a/measurement sample (a) Liner release workability evaluation a/measurement sample (b) Liner release workability evaluation b/measurement sample (a) Liner release workability evaluation b/measurement sample (b) Roll take-up test

[表2]    實施例7 實施例8 實施例9 實施例10 實施例11 實施例12 第2襯墊 第2襯墊 襯墊i 襯墊d 襯墊b 襯墊b 襯墊f 襯墊b 材料 烯烴 PET PET PET PET PET 厚度(μm) 75 50 75 75 38 75 彈性模數(MPa) 800 3100 3100 3100 3100 3100 第2黏著劑層 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 3 3 3 1.55 1.1 1.8 交聯助劑 OL-1 OL-1 OL-1 OL-1    OL-1 交聯助劑調配量(重量份) 0.05 0.05 0.05 0.05    0.05 塑化劑 Monocizer W700 Monocizer W700 Monocizer W700          塑化劑調配量(重量份) 10 10 10          黏著賦予樹脂          Sumilite PR12603    Sumilite PR12603 黏著賦予樹脂調配量(重量份)          5    5 厚度(μm) 10 15 10 10 10 5 彈性模數(MPa) 2.50 2.50 2.50 1.00 0.90 1.00 基材 材料 PET PET PET PET PET PET 厚度(μm) 25 38 38 38 38 38 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 底塗層 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 3 3 3 3.1 2.9 1 厚度(μm) 13 13 13 13 13 25 彈性模數(MPa) 1.20 1.20 1.20 1.21 1.19 0.50 第1黏著劑層(含熱膨脹性微球) 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 1.5 1.5 1.5 1.5 1.5 1.5 交聯助劑 OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 交聯助劑調配量(重量份) 0.05 0.05 0.05 0.05 0.05 0.05 黏著賦予樹脂 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 黏著賦予樹脂調配量(重量份) 10 10 10 10 10 10 熱膨脹性微球 FN-180SSD FN-180SSD FN-180SSD FN-180SSD F-230D FN-180SSD 熱膨脹性微球調配量(重量份) 30 30 30 30 30 30 著色劑 DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7200 RED DYMICS SZ-7510 GREEN 著色劑調配量(重量份) 0.5 0.5 0.5 0.5 0.4 0.5 厚度(μm) 35 45 35 35 35 25 彈性模數(MPa) 1.00 1.00 1.00 1.00 1.00 0.50 第1襯墊 第1襯墊 襯墊e 襯墊f 襯墊f 襯墊f 襯墊f 襯墊f 材料 烯烴 PET PET PET PET PET 厚度(μm) 26 38 38 38 38 38 彈性模數(MPa) 800 3100 3100 3100 3100 3100 評價 第2襯墊剝離力(N/50 mm) 0.02 0.02 0.02 0.4 0.3 0.4 第1襯墊剝離力(N/50 mm) 0.36 0.36 0.35 0.07 0.1 0.3 第1襯墊之厚度之三次方與第1襯墊之彈性模數之乘積(I) 1.40608E-05 0.000170103 0.000170103 0.000170103 0.000170103 0.000170103 第2襯墊之厚度之三次方與第2襯墊之彈性模數之乘積(II) 0.0003375 0.0003875 0.001307813 0.001307813 0.000170103 0.001307813 構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III) 4.84855E-05 0.000170205 0.000170151 0.00017015 0.00017015 0.000170119 (I)+(III) 6.255E-05 3.403E-04 3.403E-04 3.403E-04 3.403E-04 3.402E-04 (II)+(III) 3.860E-04 5.577E-04 1.478E-03 1.478E-03 3.403E-04 1.478E-03 (I)/{(II)+(III)} 3.643E-02 3.050E-01 1.151E-01 1.151E-01 4.999E-01 1.151E-01 (II)/{(I)+(III)} 5.396E+00 1.139E+00 3.844E+00 3.844E+00 4.999E-01 3.844E+00 {(I)+(II)}/(III) 7.251E+00 3.276E+00 8.686E+00 8.686E+00 1.999E+00 8.688E+00 襯墊剝離操作性評價a/測定試樣(a) 襯墊剝離操作性評價a/測定試樣(b) 襯墊剝離操作性評價b/測定試樣(a) 襯墊剝離操作性評價b/測定試樣(b) 捲筒捲取試驗 [Table 2] Example 7 Example 8 Example 9 Example 10 Example 11 Example 12 2nd liner 2nd liner liner i liner d liner b liner b Pad f liner b Material Olefin PET PET PET PET PET Thickness (μm) 75 50 75 75 38 75 Elastic modulus (MPa) 800 3100 3100 3100 3100 3100 2nd Adhesive Layer base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 3 3 3 1.55 1.1 1.8 Crosslinking Auxiliary OL-1 OL-1 OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 0.05 0.05 Plasticizer Monocizer W700 Monocizer W700 Monocizer W700 Plasticizer deployment amount (parts by weight) 10 10 10 Adhesion Imparting Resin Sumilite PR12603 Sumilite PR12603 Adhesion-imparting resin formulation amount (parts by weight) 5 5 Thickness (μm) 10 15 10 10 10 5 Elastic modulus (MPa) 2.50 2.50 2.50 1.00 0.90 1.00 Substrate Material PET PET PET PET PET PET Thickness (μm) 25 38 38 38 38 38 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100 Primer base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 3 3 3 3.1 2.9 1 Thickness (μm) 13 13 13 13 13 25 Elastic modulus (MPa) 1.20 1.20 1.20 1.21 1.19 0.50 1st adhesive layer (containing heat-expandable microspheres) base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 1.5 1.5 1.5 1.5 1.5 1.5 Crosslinking Auxiliary OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 0.05 0.05 0.05 Adhesion Imparting Resin Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Adhesion-imparting resin formulation amount (parts by weight) 10 10 10 10 10 10 heat-expandable microspheres FN-180SSD FN-180SSD FN-180SSD FN-180SSD F-230D FN-180SSD Heat-expandable microsphere deployment amount (weight part) 30 30 30 30 30 30 Colorant DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7200RED DYMICS SZ-7510 GREEN Coloring agent deployment amount (weight part) 0.5 0.5 0.5 0.5 0.4 0.5 Thickness (μm) 35 45 35 35 35 25 Elastic modulus (MPa) 1.00 1.00 1.00 1.00 1.00 0.50 1st liner 1st liner liner e Pad f Pad f Pad f Pad f Pad f Material Olefin PET PET PET PET PET Thickness (μm) 26 38 38 38 38 38 Elastic modulus (MPa) 800 3100 3100 3100 3100 3100 evaluate Peel force of the second liner (N/50 mm) 0.02 0.02 0.02 0.4 0.3 0.4 Peel force of the first liner (N/50 mm) 0.36 0.36 0.35 0.07 0.1 0.3 The product of the third power of the thickness of the first liner and the modulus of elasticity of the first liner (I) 1.40608E-05 0.000170103 0.000170103 0.000170103 0.000170103 0.000170103 The product of the third power of the thickness of the second liner and the modulus of elasticity of the second liner (II) 0.0003375 0.0003875 0.001307813 0.001307813 0.000170103 0.001307813 The total of all layers of the product of the single layer thickness cubed and the single layer elastic modulus of each layer constituting the double-sided adhesive sheet (III) 4.84855E-05 0.000170205 0.000170151 0.00017015 0.00017015 0.000170119 (I)+(III) 6.255E-05 3.403E-04 3.403E-04 3.403E-04 3.403E-04 3.402E-04 (II)+(III) 3.860E-04 5.577E-04 1.478E-03 1.478E-03 3.403E-04 1.478E-03 (I)/{(II)+(III)} 3.643E-02 3.050E-01 1.151E-01 1.151E-01 4.999E-01 1.151E-01 (II)/{(I)+(III)} 5.396E+00 1.139E+00 3.844E+00 3.844E+00 4.999E-01 3.844E+00 {(I)+(II)}/(III) 7.251E+00 3.276E+00 8.686E+00 8.686E+00 1.999E+00 8.688E+00 Liner peeling workability evaluation a/measurement sample (a) Liner release workability evaluation a/measurement sample (b) Liner release workability evaluation b/measurement sample (a) Liner release workability evaluation b/measurement sample (b) Roll take-up test

[表3]    實施例13 實施例14 實施例15 實施例16 實施例17 實施例18 第2襯墊 第2襯墊 襯墊d 襯墊f 襯墊f 襯墊f 襯墊f 襯墊a 材料 PET PET PET PET PET PET 厚度(μm) 50 38 38 38 38 12 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 第2黏著劑層 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 0.5 2.95 2.95 2.95 2.95 3 交聯助劑    OL-1 OL-1 OL-1 OL-1 OL-1 交聯助劑調配量(重量份)    0.05 0.05 0.05 0.05 0.05 塑化劑    Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 塑化劑調配量(重量份)    10 10 10 10 10 黏著賦予樹脂 Sumilite PR12603                黏著賦予樹脂調配量(重量份) 5                厚度(μm) 3 10 10 10 10 10 彈性模數(MPa) 0.20 0.50 0.50 0.50 0.50 2.50 基材 材料 PET PET PET PET PET PET 厚度(μm) 38 38 50 100 188 75 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 底塗層 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 1 1 1 1 1 3 厚度(μm) 25 25 25 25 25 13 彈性模數(MPa) 0.50 0.50 0.50 0.50 0.50 1.20 第1黏著劑層(含熱膨脹性微球) 基礎聚合物 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 1 1 1 1 1 1 交聯助劑 OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 交聯助劑調配量(重量份) 0.05 0.05 0.05 0.05 0.05 0.05 黏著賦予樹脂 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 黏著賦予樹脂調配量(重量份) 10 10 10 10 10 10 熱膨脹性微球 FN-180SSD F-50D F-50D F-50D F-50D FN-180SSD 熱膨脹性微球調配量(重量份) 30 30 30 30 30 30 著色劑 DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN 著色劑調配量(重量份) 0.5 0.5 0.5 0.5 0.5 0.5 厚度(μm) 25 25 25 25 25 35 彈性模數(MPa) 0.50 0.50 0.50 0.50 0.50 1.00 第1襯墊 第1襯墊 襯墊f 襯墊f 襯墊f 襯墊f 襯墊f 襯墊g 材料 PET PET PET PET PET PET 厚度(μm) 38 38 38 38 38 25 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 評價 第2襯墊剝離力(N/50 mm) 0.4 0.49 0.49 0.49 0.49 0.06 第1襯墊剝離力(N/50 mm) 0.3 0.49 0.49 0.49 0.49 0.36 第1襯墊之厚度之三次方與第1襯墊之彈性模數之乘積(I) 0.000170103 0.000170103 0.000170103 0.000170103 0.000170103 4.84375E-05 第2襯墊之厚度之三次方與第2襯墊之彈性模數之乘積(II) 0.0003875 0.000170103 0.000170103 0.000170103 0.000170103 5.3568E-06 構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III) 0.000170119 0.000170119 0.000387516 0.003100016 0.020598499 0.001307861 (I)+(III) 3.402E-04 3.402E-04 5.576E-04 3.270E-03 2.077E-02 1.356E-03 (II)+(III) 5.576E-04 3.402E-04 5.576E-04 3.270E-03 2.077E-02 1.313E-03 (I)/{(II)+(III)} 3.051E-01 5.000E-01 3.051E-01 5.202E-02 8.190E-03 3.688E-02 (II)/{(I)+(III)} 1.139E+00 5.000E-01 3.051E-01 5.202E-02 8.190E-03 3.950E-03 {(I)+(II)}/(III) 3.278E+00 2.000E+00 8.779E-01 1.097E-01 1.652E-02 4.113E-02 襯墊剝離操作性評價a/測定試樣(a) 襯墊剝離操作性評價a/測定試樣(b) 襯墊剝離操作性評價b/測定試樣(a) 襯墊剝離操作性評價b/測定試樣(b) 捲筒捲取試驗 [table 3] Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 2nd liner 2nd liner liner d Pad f Pad f Pad f Pad f liner a Material PET PET PET PET PET PET Thickness (μm) 50 38 38 38 38 12 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100 2nd Adhesive Layer base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 0.5 2.95 2.95 2.95 2.95 3 Crosslinking Auxiliary OL-1 OL-1 OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 0.05 0.05 Plasticizer Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Monocizer W700 Plasticizer deployment amount (parts by weight) 10 10 10 10 10 Adhesion Imparting Resin Sumilite PR12603 Adhesion-imparting resin formulation amount (parts by weight) 5 Thickness (μm) 3 10 10 10 10 10 Elastic modulus (MPa) 0.20 0.50 0.50 0.50 0.50 2.50 Substrate Material PET PET PET PET PET PET Thickness (μm) 38 38 50 100 188 75 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100 Primer base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 1 1 1 1 1 3 Thickness (μm) 25 25 25 25 25 13 Elastic modulus (MPa) 0.50 0.50 0.50 0.50 0.50 1.20 1st adhesive layer (containing heat-expandable microspheres) base polymer Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 1 1 1 1 1 1 Crosslinking Auxiliary OL-1 OL-1 OL-1 OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 0.05 0.05 0.05 Adhesion Imparting Resin Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Sumilite PR12603 Adhesion-imparting resin formulation amount (parts by weight) 10 10 10 10 10 10 heat-expandable microspheres FN-180SSD F-50D F-50D F-50D F-50D FN-180SSD Heat-expandable microsphere deployment amount (weight part) 30 30 30 30 30 30 Colorant DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN Coloring agent deployment amount (weight part) 0.5 0.5 0.5 0.5 0.5 0.5 Thickness (μm) 25 25 25 25 25 35 Elastic modulus (MPa) 0.50 0.50 0.50 0.50 0.50 1.00 1st liner 1st liner Pad f Pad f Pad f Pad f Pad f liner g Material PET PET PET PET PET PET Thickness (μm) 38 38 38 38 38 25 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100 evaluate Peel force of the second liner (N/50 mm) 0.4 0.49 0.49 0.49 0.49 0.06 Peel force of the first liner (N/50 mm) 0.3 0.49 0.49 0.49 0.49 0.36 The product of the third power of the thickness of the first liner and the modulus of elasticity of the first liner (I) 0.000170103 0.000170103 0.000170103 0.000170103 0.000170103 4.84375E-05 The product of the third power of the thickness of the second liner and the modulus of elasticity of the second liner (II) 0.0003875 0.000170103 0.000170103 0.000170103 0.000170103 5.3568E-06 The total of all layers of the product of the single layer thickness cubed and the single layer elastic modulus of each layer constituting the double-sided adhesive sheet (III) 0.000170119 0.000170119 0.000387516 0.003100016 0.020598499 0.001307861 (I)+(III) 3.402E-04 3.402E-04 5.576E-04 3.270E-03 2.077E-02 1.356E-03 (II)+(III) 5.576E-04 3.402E-04 5.576E-04 3.270E-03 2.077E-02 1.313E-03 (I)/{(II)+(III)} 3.051E-01 5.000E-01 3.051E-01 5.202E-02 8.190E-03 3.688E-02 (II)/{(I)+(III)} 1.139E+00 5.000E-01 3.051E-01 5.202E-02 8.190E-03 3.950E-03 {(I)+(II)}/(III) 3.278E+00 2.000E+00 8.779E-01 1.097E-01 1.652E-02 4.113E-02 Liner peeling workability evaluation a/measurement sample (a) Liner release workability evaluation a/measurement sample (b) Liner release workability evaluation b/measurement sample (a) Liner release workability evaluation b/measurement sample (b) Roll take-up test

[表4]    實施例19 實施例20 實施例21 實施例22 實施例23 比較例1 第2襯墊 第2襯墊 襯墊f 襯墊b 襯墊b 襯墊d 襯墊d 襯墊b 材料 PET PET PET PET PET PET 厚度(μm) 38 75 75 50 50 75 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 第2黏著劑層 基礎聚合物 聚合物5 聚合物1 聚合物1 聚合物2 聚合物3 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Coronate L Coronate L Coronate L Tetrad C Tetrad C Coronate L 交聯劑調配量(重量份) 0.2 2.95 3 0.8 1.2 2.9 交聯助劑    OL-1 OL-1       OL-1 交聯助劑調配量(重量份)    0.05 0.05       0.05 活性能量線(紫外線)聚合起始劑 Irgacure 651                活性能量線(紫外線)聚合起始劑調配量(重量份) 3                塑化劑    Monocizer W700 Monocizer W700       Monocizer W700 塑化劑調配量(重量份)    10 10       10 黏著賦予樹脂          YS POLYSTER S145 YS POLYSTER S145    黏著賦予樹脂調配量(重量份)          5 5    厚度(μm) 10 10 10 5 5 10 彈性模數(MPa) 64.00 0.50 2.50 0.70 0.90 0.48 基材 材料 PET (藍色Lumirror S10) PET PET PET PET PET 厚度(μm) 50 188 12 38 38 5 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 底塗層 基礎聚合物 聚合物4 聚合物1 聚合物1 聚合物1 聚合物1 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Tetrad C Coronate L Coronate L Coronate L Coronate L Coronate L 交聯劑調配量(重量份) 0.5 1 3 3 3 1 活性能量線(紫外線)反應性化合物 UV-7620EA                活性能量線(紫外線)反應性化合物調配量(重量份) 40                活性能量線(紫外線)聚合起始劑 Irgacure 651                活性能量線(紫外線)聚合起始劑調配量(重量份) 3                厚度(μm) 25 25 25 13 13 25 彈性模數(MPa) 89.00 0.50 1.20 1.20 1.20 0.50 第1黏著劑層 (含熱膨脹性微球) 基礎聚合物 聚合物4 聚合物1 聚合物1 聚合物2 聚合物2 聚合物1 基礎聚合物調配量(重量份) 100 100 100 100 100 100 交聯劑 Tetrad C Coronate L Coronate L Tetrad C Tetrad C Coronate L 交聯劑調配量(重量份) 0.5 1 1.5 0.8 0.8 0.95 交聯助劑    OL-1 OL-1       OL-1 交聯助劑調配量(重量份)    0.05 0.05       0.05 活性能量線(紫外線)反應性化合物 UV-7620EA                活性能量線(紫外線)反應性化合物調配量(重量份) 40                活性能量線(紫外線)聚合起始劑 Irgacure 651                活性能量線(紫外線)聚合起始劑調配量(重量份) 3                黏著賦予樹脂    Sumilite PR12603 Sumilite PR12603 YS POLYSTER S145 YS POLYSTER S145 Sumilite PR12603 黏著賦予樹脂調配量(重量份)    10 10 5 5 10 熱膨脹性微球 F-30D F-50D F-100VSD F-100VSD F-100VSD F-100VSD 熱膨脹性微球調配量(重量份) 30 30 30 30 30 30 著色劑    DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN    DYMICS SZ-7510 GREEN 著色劑調配量(重量份)    0.5 0.5 0.5    0.5 厚度(μm) 25 25 25 35 35 25 彈性模數(MPa) 89.00 0.50 1.00 1.00 1.00 0.49 第1襯墊 第1襯墊 襯墊c 襯墊b 襯墊a 襯墊f 襯墊f 襯墊h 材料 PET PET PET PET PET PET 厚度(μm) 38 75 12 38 38 5 彈性模數(MPa) 3100 3100 3100 3100 3100 3100 [Table 4] Example 19 Example 20 Example 21 Example 22 Example 23 Comparative example 1 2nd liner 2nd liner Pad f liner b liner b liner d liner d liner b Material PET PET PET PET PET PET Thickness (μm) 38 75 75 50 50 75 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100 2nd Adhesive Layer base polymer Polymer 5 Polymer 1 Polymer 1 Polymer 2 Polymer 3 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Coronate L Coronate L Coronate L Tetrad C Tetrad C Coronate L Crosslinking agent deployment amount (weight part) 0.2 2.95 3 0.8 1.2 2.9 Crosslinking Auxiliary OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 Active energy ray (UV) polymerization initiator Irgacure 651 Active energy ray (ultraviolet) polymerization initiator compounding amount (parts by weight) 3 Plasticizer Monocizer W700 Monocizer W700 Monocizer W700 Plasticizer deployment amount (parts by weight) 10 10 10 Adhesion Imparting Resin YS POLYSTER S145 YS POLYSTER S145 Adhesion-imparting resin formulation amount (parts by weight) 5 5 Thickness (μm) 10 10 10 5 5 10 Elastic modulus (MPa) 64.00 0.50 2.50 0.70 0.90 0.48 Substrate Material PET (Blue Lumirror S10) PET PET PET PET PET Thickness (μm) 50 188 12 38 38 5 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100 Primer base polymer Polymer 4 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Tetrad C Coronate L Coronate L Coronate L Coronate L Coronate L Crosslinking agent deployment amount (weight part) 0.5 1 3 3 3 1 Active energy ray (UV) reactive compound UV-7620EA Active energy ray (ultraviolet) reactive compound compounding amount (parts by weight) 40 Active energy ray (UV) polymerization initiator Irgacure 651 Active energy ray (ultraviolet) polymerization initiator compounding amount (parts by weight) 3 Thickness (μm) 25 25 25 13 13 25 Elastic modulus (MPa) 89.00 0.50 1.20 1.20 1.20 0.50 1st adhesive layer (containing heat-expandable microspheres) base polymer Polymer 4 Polymer 1 Polymer 1 Polymer 2 Polymer 2 Polymer 1 Basic polymer formulation amount (parts by weight) 100 100 100 100 100 100 crosslinking agent Tetrad C Coronate L Coronate L Tetrad C Tetrad C Coronate L Crosslinking agent deployment amount (weight part) 0.5 1 1.5 0.8 0.8 0.95 Crosslinking Auxiliary OL-1 OL-1 OL-1 Amount of cross-linking aids formulated (parts by weight) 0.05 0.05 0.05 Active energy ray (UV) reactive compound UV-7620EA Active energy ray (ultraviolet) reactive compound compounding amount (parts by weight) 40 Active energy ray (UV) polymerization initiator Irgacure 651 Active energy ray (ultraviolet) polymerization initiator compounding amount (parts by weight) 3 Adhesion Imparting Resin Sumilite PR12603 Sumilite PR12603 YS POLYSTER S145 YS POLYSTER S145 Sumilite PR12603 Adhesion-imparting resin formulation amount (parts by weight) 10 10 5 5 10 heat-expandable microspheres F-30D F-50D F-100VSD F-100VSD F-100VSD F-100VSD Heat-expandable microsphere deployment amount (weight part) 30 30 30 30 30 30 Colorant DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN DYMICS SZ-7510 GREEN Coloring agent deployment amount (weight part) 0.5 0.5 0.5 0.5 Thickness (μm) 25 25 25 35 35 25 Elastic modulus (MPa) 89.00 0.50 1.00 1.00 1.00 0.49 1st liner 1st liner liner c liner b liner a Pad f Pad f Pad h Material PET PET PET PET PET PET Thickness (μm) 38 75 12 38 38 5 Elastic modulus (MPa) 3100 3100 3100 3100 3100 3100

[表5]    實施例19 實施例20 實施例21 實施例22 實施例23 比較例1 評價 第2襯墊剝離力(N/50 mm) 0.002 0.45 0.02 0.15 0.15 0.02 第1襯墊剝離力(N/50 mm) 0.001 0.42 0.38 0.6 0.6 0.7 第1襯墊之厚度之三次方與第1襯墊之彈性模數之乘積(I) 0.000170103 0.001307813 5.3568E-06 0.000170103 0.000170103 3.875E-07 第2襯墊之厚度之三次方與第2襯墊之彈性模數之乘積(II) 0.000170103 0.001307813 0.001307813 0.0003875 0.0003875 0.001307813 構成雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III) 0.000390345 0.020598499 5.39368E-06 0.000170149 0.000170149 4.03449E-07 (I)+(III) 5.604E-04 2.191E-02 1.075E-05 3.403E-04 3.403E-04 7.909E-07 (II)+(III) 5.604E-04 2.191E-02 1.313E-03 5.576E-04 5.576E-04 1.308E-03 (I)/{(II)+(III)} 3.035E-01 5.970E-02 4.079E-03 3.050E-01 3.050E-01 2.962E-04 (II)/{(I)+(III)} 3.035E-01 5.970E-02 1.217E+02 1.139E+00 1.139E+00 1.653E+03 {(I)+(II)}/(III) 8.716E-01 1.270E-01 2.435E+02 3.277E+00 3.277E+00 3.243E+03 襯墊剝離操作性評價a/測定試樣(a) 襯墊剝離操作性評價a/測定試樣(b) × 襯墊剝離操作性評價b/測定試樣(a) 未試驗 襯墊剝離操作性評價b/測定試樣(b) 未試驗 捲筒捲取試驗 × 未試驗 [table 5] Example 19 Example 20 Example 21 Example 22 Example 23 Comparative example 1 evaluate Peel force of the second liner (N/50 mm) 0.002 0.45 0.02 0.15 0.15 0.02 Peel force of the first liner (N/50 mm) 0.001 0.42 0.38 0.6 0.6 0.7 The product of the third power of the thickness of the first liner and the modulus of elasticity of the first liner (I) 0.000170103 0.001307813 5.3568E-06 0.000170103 0.000170103 3.875E-07 The product of the third power of the thickness of the second liner and the modulus of elasticity of the second liner (II) 0.000170103 0.001307813 0.001307813 0.0003875 0.0003875 0.001307813 The total of all layers of the product of the single layer thickness cubed and the single layer elastic modulus of each layer constituting the double-sided adhesive sheet (III) 0.000390345 0.020598499 5.39368E-06 0.000170149 0.000170149 4.03449E-07 (I)+(III) 5.604E-04 2.191E-02 1.075E-05 3.403E-04 3.403E-04 7.909E-07 (II)+(III) 5.604E-04 2.191E-02 1.313E-03 5.576E-04 5.576E-04 1.308E-03 (I)/{(II)+(III)} 3.035E-01 5.970E-02 4.079E-03 3.050E-01 3.050E-01 2.962E-04 (II)/{(I)+(III)} 3.035E-01 5.970E-02 1.217E+02 1.139E+00 1.139E+00 1.653E+03 {(I)+(II)}/(III) 8.716E-01 1.270E-01 2.435E+02 3.277E+00 3.277E+00 3.243E+03 Liner peeling workability evaluation a/measurement sample (a) Liner release workability evaluation a/measurement sample (b) x Liner release workability evaluation b/measurement sample (a) Not tested Liner release workability evaluation b/measurement sample (b) Not tested Roll take-up test x Not tested

10:雙面黏著片材 11:第1黏著劑層 12:基材 13:第2黏著劑層 20:第1襯墊 30:第2襯墊 100:黏著片材 10: Double-sided adhesive sheet 11: The first adhesive layer 12: Substrate 13: The second adhesive layer 20: 1st liner 30: 2nd liner 100: Adhesive sheet

圖1係本發明之一實施方式之附襯墊之雙面黏著片材之概略剖視圖。 圖2係對實施例中之襯墊剝離操作性評價b進行說明之俯視圖。 Fig. 1 is a schematic sectional view of a double-sided adhesive sheet with a liner according to an embodiment of the present invention. Fig. 2 is a plan view illustrating evaluation b of liner peeling workability in Examples.

10:雙面黏著片材 10: Double-sided adhesive sheet

11:第1黏著劑層 11: The first adhesive layer

12:基材 12: Substrate

13:第2黏著劑層 13: The second adhesive layer

20:第1襯墊 20: 1st liner

30:第2襯墊 30: 2nd liner

100:黏著片材 100: Adhesive sheet

Claims (16)

一種附襯墊之雙面黏著片材,其具備:雙面黏著片材;第1襯墊,其可剝離地直接配置於該雙面黏著片材之一面;及第2襯墊,其可剝離地直接配置於該雙面黏著片材之另一面;該雙面黏著片材具備以與該第1襯墊相接之方式配置之第1黏著劑層,該第1黏著劑層包含熱膨脹性微球,該第1襯墊對雙面黏著片材之剝離力為0.001N/50mm~2N/50mm,該第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)為1×10-7~1×10-2(N/m),該第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)為1×10-7~1×10-2(N/m),該第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)、該第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)、及構成該雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)滿足下述(1)及(2)之關係:
Figure 111101692-A0305-02-0048-7
Figure 111101692-A0305-02-0048-8
A double-sided adhesive sheet with a liner, comprising: a double-sided adhesive sheet; a first liner, which is releasably disposed directly on one side of the double-sided adhesive sheet; and a second liner, which is releasable directly arranged on the other side of the double-sided adhesive sheet; the double-sided adhesive sheet has a first adhesive layer arranged in contact with the first liner, and the first adhesive layer contains thermally expandable Ball, the peeling force of the first liner to the double-sided adhesive sheet is 0.001N/50mm~2N/50mm, the product of the third power of the thickness of the first liner and the modulus of elasticity of the first liner (I ) is 1×10 -7 ~1×10 -2 (N/m), the product (II) of the third power of the thickness of the second liner and the modulus of elasticity of the second liner is 1×10 -7 ~1×10 -2 (N/m), the product (I) of the cube of the thickness of the first liner and the modulus of elasticity of the first liner, the cube of the thickness of the second liner and the The product (II) of the modulus of elasticity of the second liner, and the sum of all the layers (III) of the product of the cube of the single-layer thickness of each layer constituting the double-sided adhesive sheet and the product of the elastic modulus of the single layer satisfy the following ( The relationship between 1) and (2):
Figure 111101692-A0305-02-0048-7
Figure 111101692-A0305-02-0048-8
如請求項1之附襯墊之雙面黏著片材,其中上述雙面黏著片材依序具備上述第1黏著劑層、基材、及第2黏著劑層。 The double-sided adhesive sheet with a liner according to claim 1, wherein the double-sided adhesive sheet includes the first adhesive layer, the base material, and the second adhesive layer in sequence. 如請求項1或2之附襯墊之雙面黏著片材,其中構成上述雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)為1×10-6Nm~1×10-1Nm。 The double-sided adhesive sheet with a liner as claimed in claim 1 or 2, wherein the sum of all layers (III) of the product of the cube of the single-layer thickness and the single-layer elastic modulus of each layer constituting the above-mentioned double-sided adhesive sheet is 1×10 -6 Nm~1×10 -1 Nm. 如請求項1或2之附襯墊之雙面黏著片材,其中上述第1襯墊之厚度之三次方與該第1襯墊之彈性模數之乘積(I)、上述第2襯墊之厚度之三次方與該第2襯墊之彈性模數之乘積(II)、及構成上述雙面黏著片材之各層之單層厚度之三次方與單層彈性模數之乘積之所有層合計(III)滿足下述(3)之關係:
Figure 111101692-A0305-02-0049-9
The double-sided adhesive sheet with a liner as claimed in claim 1 or 2, wherein the product (I) of the cube of the thickness of the first liner and the modulus of elasticity of the first liner, the The product (II) of the cube of the thickness and the elastic modulus of the second liner, and the product of the cube of the single-layer thickness of each layer constituting the above-mentioned double-sided adhesive sheet and the product of the elastic modulus of the single layer ( III) Satisfy the following relationship (3):
Figure 111101692-A0305-02-0049-9
如請求項1或2之附襯墊之雙面黏著片材,其中上述第1襯墊及/或第2襯墊藉由螢光X射線分析所得之Si-Kα射線之強度為0.01~500kcps。 The double-sided adhesive sheet with a liner according to claim 1 or 2, wherein the Si-Kα ray intensity of the first liner and/or the second liner obtained by fluorescent X-ray analysis is 0.01~500kcps. 如請求項1或2之附襯墊之雙面黏著片材,其中構成上述雙面黏著片材之層中之至少1層為著色層。 The double-sided adhesive sheet with a liner according to claim 1 or 2, wherein at least one of the layers constituting the double-sided adhesive sheet is a colored layer. 如請求項1或2之附襯墊之雙面黏著片材,其中上述第1襯墊及/或第2襯墊之厚度為10μm~100μm。 The double-sided adhesive sheet with a liner according to claim 1 or 2, wherein the thickness of the first liner and/or the second liner is 10 μm to 100 μm. 如請求項1或2之附襯墊之雙面黏著片材,其中上述第1襯墊之厚度與第2襯墊之厚度不同。 The double-sided adhesive sheet with a liner according to claim 1 or 2, wherein the thickness of the first liner is different from that of the second liner. 如請求項1或2之附襯墊之雙面黏著片材,其中上述第1黏著劑層及/或第2黏著劑層包含丙烯酸系黏著劑。 The double-sided adhesive sheet with a liner according to claim 1 or 2, wherein the first adhesive layer and/or the second adhesive layer include an acrylic adhesive. 如請求項9之附襯墊之雙面黏著片材,其中上述丙烯酸系黏著劑包含丙烯酸系聚合物,該丙烯酸系聚合物包含源自具有活性氫基之單體之結構單元。 The double-sided adhesive sheet with a liner according to claim 9, wherein the acrylic adhesive comprises an acrylic polymer, and the acrylic polymer comprises a structural unit derived from a monomer having an active hydrogen group. 如請求項10之附襯墊之雙面黏著片材,其中上述源自具有活性氫基之單體之結構單元之含量相對於構成上述丙烯酸系聚合物之總結構單元為0.1重量%~20重量%。 The double-sided adhesive sheet with a liner as claimed in claim 10, wherein the content of the above-mentioned structural unit derived from a monomer having an active hydrogen group is 0.1% by weight to 20% by weight relative to the total structural units constituting the above-mentioned acrylic polymer %. 如請求項1或2之附襯墊之雙面黏著片材,其中上述第1襯墊對雙面黏著片材之剝離力與上述第2襯墊對雙面黏著片材之剝離力之差之絕對值為0.5N/50mm以下。 The double-sided adhesive sheet with a liner as claimed in claim 1 or 2, wherein the difference between the peeling force of the first liner on the double-sided adhesive sheet and the peeling force of the second liner on the double-sided adhesive sheet The absolute value is 0.5N/50mm or less. 如請求項1或2之附襯墊之雙面黏著片材,其係捲筒狀。 The double-sided adhesive sheet with liner as claimed in claim 1 or 2 is in the form of a roll. 如請求項1或2之附襯墊之雙面黏著片材,其於製造CSP(Chip Size/Scale Package)時用作暫時固定半導體晶片之片材。 The double-sided adhesive sheet with a liner as claimed in claim 1 or 2, which is used as a sheet for temporarily fixing semiconductor chips when manufacturing CSP (Chip Size/Scale Package). 如請求項1或2之附襯墊之雙面黏著片材,其於製造WLP(Wafer Level Package)時用作暫時固定半導體晶片之片材。 The double-sided adhesive sheet with a liner as claimed in claim 1 or 2 is used as a sheet for temporarily fixing semiconductor chips when manufacturing WLP (Wafer Level Package). 如請求項1或2之附襯墊之雙面黏著片材,其用於包括將上述第2襯墊先剝離之步驟之加工。 The double-sided adhesive sheet with a liner according to claim 1 or 2, which is used for processing including the step of peeling off the second liner first.
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