TWI777618B - Electronic device and rack structure thereof - Google Patents

Abstract

A rack structure includes a substrate, a first circuit board, a second circuit board, a first slot and a second slot. The substrate has a reference surface. The first circuit board is disposed on the substrate and stands on the reference surface. The first circuit board has a first surface. The second circuit board is arranged on the substrate and stands on the reference surface. The second circuit board has a second surface. The first surface and the second surface face each other and are spaced apart from each other. The first slot is arranged on the first surface. The second slot is arranged on the second surface. The projection of the first slot to the reference plane and the projection of the second slot to the reference plane at least partially overlap.

Description

Electronic device and its rack structure

The present invention relates to an electronic device and its rack structure, in particular to a multi-slot electronic device and its rack structure.

With the development and progress of science and technology, computers have gradually become an indispensable necessity in people's daily life. In order to make the computer meet various functional requirements, the motherboard of the computer usually has multiple functional expansion slots for installing some functional expansion cards such as graphics cards, sound cards, network cards, etc. to enhance its additional functions.

Due to the width limitation of the current server, it is difficult to insert four graphics cards at the same time in the case of flat insertion. Therefore, if there are four graphics cards required, the graphics card can only be installed in the height of more than 3U through straight insertion. within the server. However, for a server with a height of less than 2U, it is not enough to carry four graphics cards at the same time. Therefore, how to reduce the total width required when a plurality of graphics cards lie flat is a major design issue.

The present invention is to provide an electronic device and a rack structure thereof, so as to reduce the total width required when a plurality of electronic devices lie flat to match various height servers.

A rack structure of an electronic device disclosed in an embodiment of the present invention includes a substrate, a first circuit board, a second circuit board, a first slot, and a second slot. The substrate has a reference plane. The first circuit board is disposed on the base plate and is erected on the reference plane. The first circuit board has a first surface. The second circuit board is disposed on the base plate and is erected on the reference plane. The second circuit board has a second surface. The first surface and the second surface face each other and are spaced apart from each other. The first slot is arranged on the first surface. The second slot is arranged on the second surface. The projection of the first slot to the reference plane at least partially overlaps the projection of the second slot to the reference plane.

Another embodiment of the present invention discloses a rack structure of an electronic device including a substrate, a first circuit board, a second circuit board, a first slot, and a second slot. The first circuit board is disposed on the substrate. The first circuit board has a first surface. The second circuit board is disposed on the substrate. The second circuit board has a second surface. The first surface and the second surface face each other and are spaced apart from each other. The first slot is arranged on the first surface. The first socket has a first edge on a side close to the second circuit board. The second slot is arranged on the second surface. The second socket has a second edge on a side close to the first circuit board. The second edge is closer to the first circuit board than the first edge.

An electronic device disclosed in another embodiment of the present invention includes a rack structure, a first electronic component and a second electronic component. The rack structure includes a base plate, a first circuit board, a second circuit board, a first slot, a second slot and an I-shaped support frame. The substrate has a reference plane. The first circuit board is disposed on the base plate and is erected on the reference plane. The first circuit board has a first surface. The second circuit board is disposed on the base plate and is erected on the reference plane. The second circuit board has a second surface. The first surface and the second surface face each other and are spaced apart from each other. The first slot is arranged on the first surface. The second slot is arranged on the second surface. The projection of the first slot to the reference plane at least partially overlaps the projection of the second slot to the reference plane. The I-shaped support frame includes a central section and two side sections. The two side sections are respectively connected to two ends of the central section so that the I-shaped support frame is formed into an I-shaped. The two side sections are arranged on the carrying tray. The central section passes between the first surface and the second surface and passes between the first slot and the second slot. The first electronic component is arranged on the I-shaped support frame. The first electronic component is inserted into the first slot and is electrically connected to the substrate through the first circuit board. The second electronic component is arranged on the I-shaped support frame. The second electronic component is inserted into the second slot and is electrically connected to the substrate through the second circuit board. The projection of the first electronic element to the reference plane at least partially overlaps the projection of the second electronic element to the reference plane.

According to the electronic device and its rack structure according to the above-mentioned embodiments, the projection through the first slot to the reference plane and the projection of the second slot to the reference plane at least partially overlap, or the first slot of the second slot The two edges are closer to the first circuit board than the first edge of the first socket, so that the sum of the widths of the two first electronic components and the widths of the two second electronic components can be equal to or slightly smaller than the width of the carrier plate.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

1: Electronic device

10: Rack structure

20: The first electronic component

30: Second electronic component

100: Carrier plate

110: Through opening

200: Substrate

210: Intermediate circuit board

211: Datum

212: Back

220: First Intermediate Slot

230: Second Intermediate Slot

240: Third Intermediate Slot

300: First circuit board

310: First Surface

320: top edge

400: Second circuit board

410: Second Surface

420: Make way for an opening

500: first slot

510: First Edge

600: Second slot

610: Second Edge

620: Bottom edge

700: I-shaped support frame

710: Central Section

720: Side Section

800: transfer circuit board

P1, P2: Projection

W1, W2, WT: width

FIG. 1 is a schematic perspective view of an electronic device according to a first embodiment of the present invention.

FIG. 2 is an exploded schematic view of FIG. 1 .

FIG. 3 is a three-dimensional schematic view of the substrate, the first circuit board, the second circuit board, the first slot and the second slot in FIG. 2 being assembled.

FIG. 4 is a schematic top view of FIG. 1 .

See Figures 1 to 2. FIG. 1 is a schematic perspective view of an electronic device 1 according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of FIG. 1 .

The electronic device 1 of this embodiment is, for example, a server, and its height is, for example, 1U. The electronic device 1 includes a rack structure 10 , two first electronic components 20 and two second electronic components 30 . The first electronic component 20 and the second electronic component 30 are, for example, display cards, and are installed in the rack structure 10 . In this embodiment, the number of the first electronic components 20 and the second electronic components 30 is two, but not limited to this, and for the convenience of description, the following will only use a single first electronic component 20 and a single second electronic component 30 . The electronic components 30 are used to describe the connection relationship between the components, and the description of the rack structure 10 is also adjusted accordingly.

The rack structure 10 includes a carrier plate 100 , a substrate 200 , a first circuit board 300 , a second circuit board 400 , a first slot 500 and a second slot 600 . The carrier tray 100 is, for example, a casing of a server or a tray that is retracted into the casing of the server. In addition, in this embodiment and other embodiments, the rack structure 10 may further include an I-shaped support frame 700 . The I-shaped support frame 700 includes a central section 710 and two side sections 720 . The two side sections 720 are respectively connected to two ends of the central section 710 so that the I-shaped support frame 700 is formed into an I-shaped shape. The two side segments 720 are disposed on the carrier tray 100 .

Please refer to Figure 2 and Figure 3. FIG. 3 is a schematic perspective view of the substrate 200 , the first circuit board 300 , the second circuit board 400 , the first socket 500 and the second socket 600 of FIG. 2 being assembled together.

The substrate 200 is disposed on the carrier tray 100 . The first circuit board 300 is disposed on the substrate 200 so that the first circuit board 300 is electrically connected to the substrate 200 . The first circuit board 300 has a first surface 310 . The second circuit board 400 is disposed on the substrate 200 so that the second circuit board 400 is electrically connected to the substrate 200 . The second circuit board 400 has a second surface 410 . The first surface 310 and the second surface 410 face each other and are spaced apart from each other.

In this embodiment, the substrate 200 includes an interposer circuit board 210 , a first interposer slot 220 and a second interposer slot 230 . The intermediate circuit board 210 has a reference surface 211 and a back surface 212 . The first interposer slot 220 and the second interposer slot 230 are disposed on the reference plane 211 . The first circuit board 300 is inserted into the first interposer slot 220 and is electrically connected to the interposer circuit board 210 and stands on the reference plane 211 . The second circuit board 400 is inserted into the second intermediate slot 230 and is electrically connected to the intermediate circuit board 210 and is erected on the reference plane 211 .

The first socket 500 is disposed on the first surface 310 and is electrically connected to the first circuit board 300 . The projection of the first socket 500 to the extending surface of the second surface 410 avoids the second circuit board 400 . The second socket 600 is disposed on the second surface 410 and is electrically connected to the second circuit board 400 . The projection of the second socket 600 to the extending surface of the first surface 310 avoids the first circuit board 300 . In addition, the central section 710 of the I-shaped support frame 700 passes between the first surface 310 and the second surface 410 and passes between the first slot 500 and the second slot 600 .

In this embodiment, the first slot 500 is located between the first surface 310 and the extending surface of the second surface 410 , and the second slot 600 is located between the extending surface of the first surface 310 and the second surface between 410. In addition, the bottom edge 620 of the second socket 600 is farther from the reference plane 211 than the top edge 320 of the first circuit board 300 , the second circuit board 400 defines an opening 420 , the first socket 500 is relatively The second slot 600 is close to the reference surface 211 and corresponds to the vacant opening 420 . That is to say, the direction of the insertion ports of the first socket 500 and the second socket 600 is not blocked by the first circuit board 300 or the second circuit board 400 .

In this embodiment, the projection of the first socket 500 to the reference plane 211 and the projection of the second socket 600 to the reference plane 211 at least partially overlap, so as to reduce the total width required when the electronic components lie flat. In detail, the first electronic component 20 is disposed on the I-shaped support frame 700 . The first electronic component 20 is inserted into the first socket 500 and is electrically connected to the substrate 200 through the first circuit board 300 . The second electronic component 30 is disposed on the I-shaped support frame 700 . The second electronic component 30 is inserted into the second socket 600 and is electrically connected to the substrate 200 through the second circuit board 400 . The projection of the first slot 500 to the reference plane 211 and the projection of the second slot 600 to the reference plane 211 at least partially overlap, so that the projection of the first electronic component 20 to the reference plane 211 and the second The projection of the electronic component 30 to the reference plane 211 at least partially overlaps, thereby reducing the total width required when the first electronic component 20 and the second electronic component 30 lie flat.

However, the projection of the first socket 500 to the reference plane 211 and the projection of the second socket 600 to the reference plane 211 at least partially overlap is not intended to limit the invention. In other embodiments, the first socket to the reference plane The projection of the surface and the projection of the second slot to the reference surface may not overlap. In detail, the first socket 500 has a side close to the second circuit board 400 There is a first edge 510 . The second socket 600 has a second edge 610 on a side close to the first circuit board 300 . As long as the second edge 610 of the second socket 600 is closer to the first circuit board 300 than the first edge 510 of the first socket 500 , it is possible to reduce the overall width required when the electronic components lie flat.

In this embodiment, the rack structure 10 may further include a plurality of switching circuit boards 800 . The substrate 200 may further include a plurality of third interposer slots 240, the plurality of third interposer slots 240 are disposed on the back surface 212, and the plurality of riser circuit boards 800 are electrically inserted into the plurality of third interposers, respectively Slot 240.

In this embodiment, the number of the adapter circuit board 800 and the third interposer slot 240 is multiple, but not limited thereto. In other embodiments, the number of the transition circuit board and the third interposer slot can also be changed to a single one.

In this embodiment, the carrier plate 100 has a through opening 110 , the intermediate circuit board 210 is disposed on the carrier plate 100 and overlaps the through opening 110 , and the at least one third intermediate slot 240 passes through the through opening 110 .

In this embodiment, the I-shaped support frame 700 is fixed to the carrier plate 100 through the side section 720, but it is not limited thereto. In other embodiments, the I-shaped support frame is fixed to the carrier plate through the central section.

In this embodiment, the first electronic component 20 , the two second electronic components 30 , the substrate 200 , the first circuit board 300 , the second circuit board 400 , the first socket 500 and the second socket 600 pass through the I-shaped The support frame 700 is fixed on the carrier plate 100, but is not limited thereto. First electronic component 20, two second electronic components 30, substrate 200, first circuit board 300 , the second circuit board 400 , the first slot 500 and a second slot 600 can also be fixed on the carrier plate 100 through other shapes of support frames.

See Figure 4. FIG. 4 is a schematic top view of FIG. 1 . The two first electronic components 20 and the two second electronic components 30 are respectively inserted into the two first sockets 500 and the two second sockets 600 . Because the projection of the first socket 500 to the reference plane 211 and the projection of the second socket 600 to the reference plane 211 at least partially overlap, or the second edge 610 of the second socket 600 is closer to the first socket The first edge 510 of the groove 500 is close to the first circuit board 300 , and the total width required when the first electronic component 20 and the second electronic component 30 lie flat is reduced to the width WT of the carrier tray 100 . That is to say, originally the sum of the widths W1 of the two first electronic components 20 and the widths W2 of the two second electronic components 30 is greater than the width WT of the carrier tray 100 , but the width W1 through the first slot 500 to the reference surface 211 The projection at least partially overlaps with the projection of the second socket 600 to the reference plane 211 , or the second edge 610 of the second socket 600 is closer to the first circuit board than the first edge 510 of the first socket 500 The design of 300 allows the two first electronic components 20 and the two second electronic components 30 to be placed in the carrier tray 100 with a width of WT.

According to the electronic device and its rack structure according to the above-mentioned embodiments, the projection through the first slot to the reference plane and the projection of the second slot to the reference plane at least partially overlap, or the first slot of the second slot The two edges are closer to the first circuit board than the first edge of the first socket, so that the sum of the widths of the two first electronic components and the widths of the two second electronic components can be equal to or slightly smaller than the width of the carrier plate.

Although the present invention is disclosed above by the aforementioned embodiments, it is not intended to limit the present invention, and any person familiar with the similar arts, without departing from the spirit and scope of the present invention, Slight changes and modifications may be made, so the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

200: Substrate

210: Intermediate circuit board

211: Datum

212: Back

220: First Intermediate Slot

230: Second Intermediate Slot

240: Third Intermediate Slot

300: First circuit board

310: First Surface

320: top edge

400: Second circuit board

410: Second Surface

420: Make way for an opening

500: first slot

510: First Edge

600: Second slot

610: Second Edge

620: Bottom edge

P1, P2: Projection

Claims (10)

A rack structure of an electronic device, comprising: a base plate with a reference plane; a first circuit board disposed on the base plate and erected on the reference plane, the first circuit board having a first surface; a second circuit The board is arranged on the base plate and is erected on the reference plane, the second circuit board has a second surface, the first surface and the second surface face each other and are spaced apart from each other; a first slot is arranged in the first a surface; and a second slot disposed on the second surface, the projection of the first slot to the reference plane and the projection of the second slot to the reference plane at least partially overlap. The rack structure of an electronic device as claimed in claim 1, wherein the bottom edge of the second slot is farther from the reference plane than the top edge of the first circuit board, the second circuit board defines an opening for a space, the first A slot is closer to the reference plane than the second slot, and corresponds to the opening. The rack structure of an electronic device as claimed in claim 1, wherein the first slot is located between the first surface and the extending surface of the second surface, and the second slot is located between the extending surface of the first surface and the extending surface of the second surface. between the second surfaces. The rack structure of an electronic device as claimed in claim 1, wherein the substrate comprises an intermediate circuit board, a first intermediate slot and a second intermediate slot, the intermediate circuit board has the reference plane, the first intermediate The slot and the second intermediate slot are arranged on the reference plane, the first circuit board is inserted into the first intermediate slot and is electrically connected to the intermediate circuit board, and the second circuit board is inserted into the second intermediate slot The intermediate slot is electrically connected to the intermediate circuit board. The rack structure of an electronic device as claimed in claim 4, further comprising at least one transfer circuit board, the substrate further comprising at least a third intermediate slot, the intermediate circuit board further having a back surface opposite to the reference plane, The at least one third intermediary slot is disposed on the back surface, and the at least one transfer circuit board is electrically inserted into the at least one third intermediary slot. The rack structure of an electronic device according to claim 5, further comprising a carrier plate having a through opening, the intermediate circuit board is disposed on the carrier plate and overlapped with the through opening, and the at least one third intermediate interposer A slot passes through the through opening. The rack structure of an electronic device according to claim 6, further comprising an I-shaped support frame, the I-shaped support frame includes a central section and two side sections, the two side sections are respectively connected to both ends of the central section and The I-shaped support frame is formed into an I-shaped shape, the two side sections are arranged on the carrier plate, and the central section passes between the first surface and the second surface and passes through the first slot and the second slot between the slots. A rack structure of an electronic device, comprising: a substrate; a first circuit board, disposed on the substrate, the first circuit board having a first surface; a second circuit board, disposed on the substrate, the second circuit board The board has a second surface, the first surface and the second surface face each other and are spaced apart from each other; a first slot is arranged on the first surface, the first slot is close to one of the second circuit boards The side has a first edge; and a second slot is disposed on the second surface, the second slot has a second edge on a side close to the first circuit board, and the second edge is larger than the first edge. The edge is close to the first circuit board. An electronic device, comprising: a rack structure, comprising: a carrier plate; a base plate, which is arranged on the bearing plate, and the substrate has a reference plane; The first circuit board has a first surface; a second circuit board is disposed on the substrate and erected on the reference plane, the second circuit board has a second surface, and the first surface and the second surface face each other opposite and spaced apart from each other; a first slot, disposed on the first surface, the projection of the first slot to the extending surface of the second surface avoids the second circuit board; a second slot, disposed on the second surface The second surface, the projection of the second slot to the extension surface of the first surface avoids the first circuit board, the projection of the first slot to the reference surface and the projection of the second slot to the reference surface at least partially overlapping; and an I-shaped support frame, comprising a central section and two side sections, the two side sections are respectively connected to both ends of the central section so that the I-shaped support frame is formed into an I-shape, and the two side sections are arranged On the carrier plate, the central section passes between the first surface and the second surface and passes between the first slot and the second slot; a first electronic component is disposed on the I-shaped support a frame, the first electronic component is inserted into the first slot and is electrically connected to the substrate through the first circuit board; and a second electronic component is arranged on the I-shaped support frame, the second electronic component is inserted The projection of the first electronic element to the reference plane and the projection of the second electronic element to the reference plane at least partially overlap. The electronic device as claimed in claim 9, wherein a bottom edge of the second socket is farther from the reference plane than a top edge of the first circuit board, an opening opening is formed on the second circuit board, and the first socket is relatively The second slot is close to the reference plane, and corresponds to the escaping opening.

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