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TWI877030B - Server device - Google Patents

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Publication number
TWI877030B
TWI877030B TW113121570A TW113121570A TWI877030B TW I877030 B TWI877030 B TW I877030B TW 113121570 A TW113121570 A TW 113121570A TW 113121570 A TW113121570 A TW 113121570A TW I877030 B TWI877030 B TW I877030B
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Taiwan
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movable tray
motherboard
server device
electrical connector
adapter
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TW113121570A
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Chinese (zh)
Inventor
王瑋
耿朝
田光召
林宏州
陳俞帆
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英業達股份有限公司
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Publication of TWI877030B publication Critical patent/TWI877030B/en

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Abstract

A server device is configured to install a backplane and a motherboard, and includes a casing, a movable tray and a rising module. The casing includes a bottom plate and two side plates. The two side plates are connected to opposite sides of the bottom plate, respectively. The bottom plate is configured to install the motherboard. The movable tray is movably disposed on the two side plates. The rising module is disposed on the movable tray. The rising module and the movable tray are movable relative to the casing. The rising module is configured to electrically connect the backplane and the motherboard.

Description

伺服器裝置Server device

本發明係關於一種伺服器裝置,特別是一種設有活動式托盤與轉接模組的伺服器裝置。The present invention relates to a server device, in particular to a server device with a movable tray and a switching module.

在伺服器中,擴充卡具有多種用途,例如圖像處理、網路介面、外圍設備介面、儲存資料等。使用者可以根據自身需求於伺服器中安裝所需用途的擴充卡,以擴充伺服器的功能。In a server, expansion cards have many uses, such as image processing, network interface, peripheral device interface, data storage, etc. Users can install expansion cards of the required purpose in the server according to their own needs to expand the functions of the server.

一般來說,使用者會將擴充卡插接於轉接板以構成擴充模組,並將擴充模組裝設於伺服器。此外,製造廠商會將伺服器設計為雙層結構,以提升伺服器內的空間利用率,並將擴充模組與主機板分別設置於伺服器內之上下層。然而,在一般具有雙層結構的伺服器中,當使用者欲更換設置於下層的主機板之電子零件時,需先移除設置於上層的擴充模組,待設置於下層的主機板之電子零件更換完成後,再將擴充模組組裝於上層,使得更換電子零件的步驟過於繁瑣,而造成使用者操作上不便。因此,如何提升主機板與擴充模組拆裝的便利性,即為研發人員應解決的問題之一。Generally speaking, users will plug expansion cards into adapter boards to form expansion modules, and install the expansion modules in servers. In addition, manufacturers will design servers as double-layer structures to improve space utilization within the server, and will place expansion modules and motherboards on the upper and lower layers of the server, respectively. However, in a general double-layer server, when a user wants to replace electronic components of the motherboard on the lower layer, the user must first remove the expansion module on the upper layer, and after the electronic components of the motherboard on the lower layer are replaced, the expansion module must be assembled on the upper layer, making the steps for replacing electronic components too cumbersome and causing inconvenience to the user. Therefore, how to improve the convenience of disassembling and assembling the motherboard and expansion modules is one of the problems that researchers should solve.

本發明在於提供一種伺服器裝置,藉以提升主機板與擴充模組拆裝的便利性。The present invention provides a server device to improve the convenience of disassembly and assembly of a mainboard and an expansion module.

本發明之一實施例所揭露之伺服器裝置用以供一背板以及一主機板裝設,並包含一殼體、一活動式托盤以及一轉接模組。殼體包含一底板以及二側板。二側板分別與底板之相對兩側相連。底板用以供主機板裝設。活動式托盤可活動地設置於二側板。轉接模組設置於活動式托盤。轉接模組與活動式托盤可相對殼體活動。轉接模組用以電性連接背板與主機板。The server device disclosed in one embodiment of the present invention is used for installing a backplane and a motherboard, and includes a housing, a movable tray and an adapter module. The housing includes a bottom plate and two side plates. The two side plates are respectively connected to the opposite sides of the bottom plate. The bottom plate is used for installing the motherboard. The movable tray can be movably arranged on the two side plates. The adapter module is arranged on the movable tray. The adapter module and the movable tray can move relative to the housing. The adapter module is used to electrically connect the backplane and the motherboard.

根據上述實施例之伺服器裝置,由於伺服器裝置設有可相對殼體活動的活動式托盤,且轉接模組設置於活動式托盤,故當使用者需安裝或更換設置於下層底板的主機板以及插接線纜時,無需移除設置於上層之活動式托盤以及轉接模組,僅需透過翻轉活動式托盤即可露出設置下層底板的主機板,以提升主機板與擴充模組之拆裝以及理線的便利性。According to the server device of the above-mentioned embodiment, since the server device is provided with a movable tray that can move relative to the casing, and the adapter module is arranged on the movable tray, when the user needs to install or replace the motherboard and the plug-in cable arranged on the lower bottom plate, there is no need to remove the movable tray and the adapter module arranged on the upper layer. The motherboard arranged on the lower bottom plate can be exposed by simply flipping the movable tray, thereby improving the convenience of disassembly and assembly of the motherboard and the expansion module and cable management.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

請參閱圖1與圖2。圖1為根據本發明實施例所述之伺服器裝置之立體示意圖。圖2為圖1之伺服器裝置的另一視角之立體示意圖。Please refer to Figures 1 and 2. Figure 1 is a three-dimensional schematic diagram of a server device according to an embodiment of the present invention. Figure 2 is a three-dimensional schematic diagram of the server device of Figure 1 from another perspective.

本實施例之伺服器裝置10用以供例如設有擴充卡(未繪示)之一背板20以及一主機板30裝設。其中,背板20與主機板30例如用以兼容不同類型的擴充卡。伺服器裝置10包含一殼體11、一活動式托盤12、一轉接模組13、二樞接件14以及一導流支撐架15。殼體11包含一底板111以及二側板112。二側板112分別與底板111之相對兩側相連。底板111用以供主機板30裝設。The server device 10 of the present embodiment is used for installing a backplane 20 and a motherboard 30, for example, provided with an expansion card (not shown). The backplane 20 and the motherboard 30 are used, for example, to be compatible with different types of expansion cards. The server device 10 includes a housing 11, a movable tray 12, an adapter module 13, two hinges 14, and a guide support frame 15. The housing 11 includes a bottom plate 111 and two side plates 112. The two side plates 112 are respectively connected to the opposite sides of the bottom plate 111. The bottom plate 111 is used for installing the motherboard 30.

請一併參閱圖3至圖5。圖3為圖1之伺服器裝置之分解示意圖。圖4為圖1之伺服器裝置的活動式托盤與轉接模組之分解示意圖。圖5為圖1之伺服器裝置之剖視示意圖。Please refer to Figures 3 to 5 together. Figure 3 is an exploded schematic diagram of the server device of Figure 1. Figure 4 is an exploded schematic diagram of the movable tray and the adapter module of the server device of Figure 1. Figure 5 is a cross-sectional schematic diagram of the server device of Figure 1.

二樞接件14設置於活動式托盤12之相對兩側。活動式托盤12透過二樞接件14樞接於二側板112,以令活動式托盤12可相對殼體11轉動而位於一使用位置以及一翻轉位置。此外,二樞接件14包含二第一定位結構141。二側板112各包含一第二定位結構1121。二第一定位結構141例如為定位凸柱,且二第二定位結構1121例如為定位孔。二第一定位結構141用以分別與二第二定位結構1121相定位。其中,活動式托盤12自使用位置轉動至翻轉位置之角度例如為115度,但不以此為限。The two hinges 14 are disposed on opposite sides of the movable tray 12. The movable tray 12 is hinged to the two side panels 112 through the two hinges 14 so that the movable tray 12 can rotate relative to the housing 11 and be located at a use position and a flip position. In addition, the two hinges 14 include two first positioning structures 141. The two side panels 112 each include a second positioning structure 1121. The two first positioning structures 141 are, for example, positioning protrusions, and the two second positioning structures 1121 are, for example, positioning holes. The two first positioning structures 141 are used to position with the two second positioning structures 1121, respectively. The angle of rotation of the movable tray 12 from the use position to the flip position is, for example, 115 degrees, but is not limited thereto.

轉接模組13設置於活動式托盤12。也就是說,轉接模組13與主機板30分別位於伺服器裝置10內的上下層,且轉接模組13可隨活動式托盤12相對殼體11活動。轉接模組13用以電性連接背板20與主機板30。The adapter module 13 is disposed on the movable tray 12. That is, the adapter module 13 and the motherboard 30 are located at the upper and lower layers of the server device 10, respectively, and the adapter module 13 can move relative to the housing 11 along with the movable tray 12. The adapter module 13 is used to electrically connect the backplane 20 and the motherboard 30.

當活動式托盤12位於使用位置時,活動式托盤12平躺以及轉接模組13電性連接於背板20,且二第一定位結構141分別與二第二定位結構1121相分離。當活動式托盤12位於翻轉位置時,轉接模組13與背板20分離,且二第一定位結構141分別與二第二定位結構1121相定位,使得活動式托盤12固定於翻轉位置。When the movable tray 12 is in the use position, the movable tray 12 lies flat and the adapter module 13 is electrically connected to the back plate 20, and the two first positioning structures 141 are separated from the two second positioning structures 1121. When the movable tray 12 is in the flip position, the adapter module 13 is separated from the back plate 20, and the two first positioning structures 141 are positioned with the two second positioning structures 1121, so that the movable tray 12 is fixed in the flip position.

詳細來說,轉接模組13包含一轉接板131、多個第一電連接器132以及多個第二電連接器133。這些第一電連接器132例如為顯示卡電連接器以及網路卡電連接器,並設置於例如為電路板之轉接板131。舉例來說,這些第一電連接器132例如為高密度ExaMax電連接器,並用以供高性能網路卡等擴充卡插接。這些第一電連接器132部分設置於轉接板131靠近主機板30之一側,並例如板對板地電性連接於轉接卡(Riser card)的電連接器(未繪示)。這些第一電連接器132另一部分設置於轉接板131遠離主機板30之一側,並例如板對板地電性連接於背板20之GPU(未繪示)。這些第二電連接器133設置於轉接板131,並透過線纜(未繪示)自活動式托盤12樞接於殼體11之一側線對線地電性連接於主機板30之CPU(未繪示)。如此一來,可便於使用者進行理線。舉例來說,這些第二電連接器133例如為MCIO電連接器。這些第一電連接器132與這些第二電連接器133電性連接,而令背板20透過這些第一電連接器132與這些第二電連接器133電性連接主機板30。In detail, the adapter module 13 includes an adapter board 131, a plurality of first electrical connectors 132, and a plurality of second electrical connectors 133. These first electrical connectors 132 are, for example, display card electrical connectors and network card electrical connectors, and are disposed on the adapter board 131, for example, a circuit board. For example, these first electrical connectors 132 are, for example, high-density ExaMax electrical connectors, and are used for plugging in expansion cards such as high-performance network cards. These first electrical connectors 132 are partially disposed on one side of the adapter board 131 close to the motherboard 30, and are, for example, electrically connected to an electrical connector (not shown) of a riser card in a board-to-board manner. The other part of these first electrical connectors 132 is disposed on one side of the adapter board 131 away from the motherboard 30, and is electrically connected to the GPU (not shown) of the backplane 20, for example, in a board-to-board manner. These second electrical connectors 133 are disposed on the adapter board 131, and are electrically connected to the CPU (not shown) of the motherboard 30 in a line-to-line manner through cables (not shown) pivoted to one side of the housing 11 by the movable tray 12. In this way, it is convenient for users to organize cables. For example, these second electrical connectors 133 are MCIO electrical connectors. The first electrical connectors 132 are electrically connected to the second electrical connectors 133 , so that the backplane 20 is electrically connected to the motherboard 30 through the first electrical connectors 132 and the second electrical connectors 133 .

導流支撐架15設置於活動式托盤12遠離轉接模組13之一側,以令導流支撐架15可相對殼體11活動。透過設置導流支撐架15,除了可支撐活動式托盤12而無需額外裝設導風罩外,還可以導引伺服器裝置10內中散熱器(未繪示)所產生的風流,使得風流可更均勻地對主機板30散熱,以提升散熱器對主機板30的散熱效率。也就是說,導流支撐架15可兼顧支撐活動式托盤12以及提升散熱器對主機板30散熱效率的功能。The air guide support frame 15 is disposed on a side of the movable tray 12 away from the adapter module 13 so that the air guide support frame 15 can move relative to the housing 11. By disposing the air guide support frame 15, in addition to supporting the movable tray 12 without the need for an additional air guide cover, the airflow generated by the heat sink (not shown) in the server device 10 can also be guided so that the airflow can dissipate heat from the motherboard 30 more evenly, thereby improving the heat dissipation efficiency of the heat sink for the motherboard 30. In other words, the air guide support frame 15 can take into account the functions of supporting the movable tray 12 and improving the heat dissipation efficiency of the heat sink for the motherboard 30.

在本實施例中,由於伺服器裝置10設有可相對殼體11翻轉的活動式托盤12,且轉接模組13設置於活動式托盤12,故當使用者需安裝或更換設置於下層底板111的主機板30以及插接線纜時,無需移除設置於上層之活動式托盤12以及轉接模組13,僅需透過翻轉活動式托盤12即可露出設置下層底板111的主機板30,以提升主機板30與擴充模組之拆裝以及理線的便利性。In the present embodiment, since the server device 10 is provided with a movable tray 12 that can be flipped relative to the housing 11, and the adapter module 13 is disposed on the movable tray 12, when the user needs to install or replace the motherboard 30 disposed on the lower bottom plate 111 and the plug-in cable, there is no need to remove the movable tray 12 and the adapter module 13 disposed on the upper layer. The motherboard 30 disposed on the lower bottom plate 111 can be exposed by simply flipping the movable tray 12, thereby improving the convenience of disassembly and assembly of the motherboard 30 and the expansion module and wiring.

在本實施例中,轉接模組13還可以包含多個第一導引結構134以及多個第二導引結構135。這些第一導引結構134例如為導引槽,並設置於轉接板131。這些第二導引結構135例如為導引凸柱,並設置於這些第一電連接器132。當活動式托盤12位於使用位置時,轉接模組13用以透過這些第一導引結構134以及這些第二導引結構135之導引而固定於背板20。In this embodiment, the adapter module 13 may further include a plurality of first guide structures 134 and a plurality of second guide structures 135. The first guide structures 134 are, for example, guide grooves, and are disposed on the adapter plate 131. The second guide structures 135 are, for example, guide bosses, and are disposed on the first electrical connectors 132. When the movable tray 12 is in the use position, the adapter module 13 is used to be fixed to the back plate 20 through the guidance of the first guide structures 134 and the second guide structures 135.

在本實施例中,伺服器裝置10還可以包含多個緊固件16。這些緊固件16例如為螺絲。當活動式托盤12位於使用位置時,活動式托盤12透過這些緊固件16固定於二側板112。In this embodiment, the server device 10 may further include a plurality of fasteners 16. These fasteners 16 are, for example, screws. When the movable tray 12 is in the use position, the movable tray 12 is fixed to the two side plates 112 through these fasteners 16.

在本實施例中,二第一定位結構141為定位凸柱,且二第二定位結構1121為定位孔,但不以此為限。在其他實施例中,二第一定位結構也可以為定位孔,且二第二定位結構也可以為定位凸柱。In this embodiment, the two first positioning structures 141 are positioning protrusions, and the two second positioning structures 1121 are positioning holes, but the present invention is not limited thereto. In other embodiments, the two first positioning structures may also be positioning holes, and the two second positioning structures may also be positioning protrusions.

在本實施例中,第一電連接器132的數量以及第二電連接器133的數量各為多個,但不以此為限。在其他實施例中,第一電連接器的數量以及第二電連接器的數量也可以各僅為單個。In this embodiment, the number of the first electrical connectors 132 and the number of the second electrical connectors 133 are multiple, but not limited to this. In other embodiments, the number of the first electrical connectors and the number of the second electrical connectors can also be only one.

在本實施例中,這些第一導引結構134為導引槽,且這些第二導引結構135為導引凸柱,但不以此為限。在其他實施例中,這些第一導引結構也可以為導引凸柱,且這些第二導引結構也可以為導引槽。In this embodiment, these first guiding structures 134 are guiding grooves, and these second guiding structures 135 are guiding protruding columns, but the present invention is not limited thereto. In other embodiments, these first guiding structures can also be guiding protruding columns, and these second guiding structures can also be guiding grooves.

在本實施例中,導流支撐架15還可以包含多個第三導引結構(未繪示)。這些第三導引結構例如為導引槽,但不以此為限。在其他實施例中,這些第三導引結構也可以為導引凸柱。當活動式托盤12位於使用位置時,導流支撐架15用以透過第三導引結構之導引而令轉接模組13進一步地固定於背板20。In this embodiment, the guide support frame 15 may further include a plurality of third guide structures (not shown). These third guide structures are, for example, guide grooves, but are not limited thereto. In other embodiments, these third guide structures may also be guide bosses. When the movable tray 12 is in the use position, the guide support frame 15 is used to further fix the adapter module 13 to the back plate 20 through the guidance of the third guide structures.

請參閱圖6至圖9。圖6為圖1之伺服器裝置的活動式托盤位於使用位置之立體示意圖。圖7為圖1之伺服器裝置的活動式托盤位於使用位置之剖視示意圖。圖8為圖1之伺服器裝置的活動式托盤位於翻轉位置之立體示意圖。圖9為圖1之伺服器裝置的活動式托盤位於翻轉位置之剖視示意圖。Please refer to Figures 6 to 9. Figure 6 is a three-dimensional schematic diagram of the movable tray of the server device of Figure 1 in the use position. Figure 7 is a cross-sectional schematic diagram of the movable tray of the server device of Figure 1 in the use position. Figure 8 is a three-dimensional schematic diagram of the movable tray of the server device of Figure 1 in the flip position. Figure 9 is a cross-sectional schematic diagram of the movable tray of the server device of Figure 1 in the flip position.

如圖6與圖7所示,活動式托盤12平躺於使用位置。此時二第一定位結構141分別與二第二定位結構1121相分離。如圖8與圖9所示,當使用者欲裝設主機板30以及將轉接模組13電性連接於主機板30時,首先,將活動式托盤12自使用位置沿方向A翻轉至翻轉位置。此時二第一定位結構141分別與二第二定位結構1121相定位,以令活動式托盤12固定於翻轉位置。接著,將主機板30以及例如為散熱器(未繪示)等其他元件裝設於底板111,並將線纜(未繪示)之一端插接於主機板30,以及將線纜之另一端穿過活動式托盤12樞接於殼體11之一側。As shown in FIG6 and FIG7, the movable tray 12 lies flat in the use position. At this time, the two first positioning structures 141 are separated from the two second positioning structures 1121. As shown in FIG8 and FIG9, when the user wants to install the motherboard 30 and electrically connect the adapter module 13 to the motherboard 30, first, the movable tray 12 is flipped from the use position along direction A to the flip position. At this time, the two first positioning structures 141 are positioned with the two second positioning structures 1121, so that the movable tray 12 is fixed in the flip position. Next, the motherboard 30 and other components such as a heat sink (not shown) are mounted on the bottom plate 111 , and one end of a cable (not shown) is plugged into the motherboard 30 , and the other end of the cable is passed through the movable tray 12 and pivoted to one side of the housing 11 .

接著,解除二第一定位結構141與二第二定位結構1121之定位,以令二第一定位結構141分別與二第二定位結構1121相分離,並將活動式托盤12自翻轉位置沿方向A之反向翻轉至使用位置。接著,將轉接模組13透過這些第一電連接器132電性連接於背板20,並透過這些第二電連接器133與線纜電性連接於主機板30。也就是說,背板20與主機板30透過轉接模組13電性連接。接著,透過這些緊固件16將活動式托盤12固定於二側板112。如此一來,即可完成主機板30與轉接模組13之組裝。Next, the positioning of the two first positioning structures 141 and the two second positioning structures 1121 is released, so that the two first positioning structures 141 are separated from the two second positioning structures 1121, and the movable tray 12 is flipped from the flip position in the opposite direction of direction A to the use position. Next, the adapter module 13 is electrically connected to the back plate 20 through the first electrical connectors 132, and is electrically connected to the motherboard 30 through the second electrical connectors 133 and the cables. In other words, the back plate 20 and the motherboard 30 are electrically connected through the adapter module 13. Next, the movable tray 12 is fixed to the two side plates 112 through the fasteners 16. In this way, the assembly of the motherboard 30 and the adapter module 13 can be completed.

根據上述實施例之伺服器裝置,由於伺服器裝置設有可相對殼體翻轉的活動式托盤,且轉接模組設置於活動式托盤,故當使用者需安裝或更換設置於下層底板的主機板以及插接線纜時,無需移除設置於上層之活動式托盤以及轉接模組,僅需透過翻轉活動式托盤即可露出設置下層底板的主機板,以提升主機板30與擴充模組之拆裝以及理線的便利性。According to the server device of the above-mentioned embodiment, since the server device is provided with a movable tray that can be flipped relative to the casing, and the adapter module is arranged on the movable tray, when the user needs to install or replace the motherboard and the plug-in cable arranged on the lower bottom plate, there is no need to remove the movable tray and the adapter module arranged on the upper layer. The motherboard arranged on the lower bottom plate can be exposed by simply flipping the movable tray, thereby improving the convenience of disassembly and assembly of the motherboard 30 and the expansion module and cable management.

雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

10:伺服器裝置 11:殼體 111:底板 112:側板 1121:第二定位結構 12:活動式托盤 13:轉接模組 131:轉接板 132:第一電連接器 133:第二電連接器 134:第一導引結構 135:第二導引結構 14:樞接件 141:第一定位結構 15:導流支撐架 16:緊固件 20:背板 30:主機板 A:方向 10: Server device 11: Casing 111: Bottom plate 112: Side plate 1121: Second positioning structure 12: Movable tray 13: Adapter module 131: Adapter plate 132: First electrical connector 133: Second electrical connector 134: First guide structure 135: Second guide structure 14: Hub 141: First positioning structure 15: Guide support 16: Fastener 20: Back plate 30: Motherboard A: Direction

圖1為根據本發明實施例所述之伺服器裝置之立體示意圖。 圖2為圖1之伺服器裝置的另一視角之立體示意圖。 圖3為圖1之伺服器裝置之分解示意圖。 圖4為圖1之伺服器裝置的活動式托盤與轉接模組之分解示意圖。 圖5為圖1之伺服器裝置之剖視示意圖。 圖6為圖1之伺服器裝置的活動式托盤位於使用位置之立體示意圖。 圖7為圖1之伺服器裝置的活動式托盤位於使用位置之剖視示意圖。 圖8為圖1之伺服器裝置的活動式托盤位於翻轉位置之立體示意圖。 圖9為圖1之伺服器裝置的活動式托盤位於翻轉位置之剖視示意圖。 FIG. 1 is a three-dimensional schematic diagram of a server device according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of the server device of FIG. 1 from another perspective. FIG. 3 is a disassembled schematic diagram of the server device of FIG. 1. FIG. 4 is a disassembled schematic diagram of a movable tray and a transfer module of the server device of FIG. 1. FIG. 5 is a cross-sectional schematic diagram of the server device of FIG. 1. FIG. 6 is a three-dimensional schematic diagram of the movable tray of the server device of FIG. 1 in a use position. FIG. 7 is a cross-sectional schematic diagram of the movable tray of the server device of FIG. 1 in a use position. FIG. 8 is a three-dimensional schematic diagram of the movable tray of the server device of FIG. 1 in a flip position. FIG. 9 is a cross-sectional schematic diagram of the movable tray of the server device of FIG. 1 in a flip position.

11:殼體 11: Shell

111:底板 111: Base plate

112:側板 112: Side panels

1121:第二定位結構 1121: Second positioning structure

12:活動式托盤 12: Movable tray

13:轉接模組 13: Adapter module

131:轉接板 131: Adapter plate

132:第一電連接器 132: First electrical connector

133:第二電連接器 133: Second electrical connector

134:第一導引結構 134: First guide structure

135:第二導引結構 135: Second guide structure

14:樞接件 14: Joints

141:第一定位結構 141: First positioning structure

15:導流支撐架 15: Diversion support frame

16:緊固件 16: Fasteners

30:主機板 30: Motherboard

Claims (9)

一種伺服器裝置,用以供一背板以及一主機板裝設,該伺服器裝置包含: 一殼體,包含一底板以及二側板,該二側板分別與該底板之相對兩側相連,該底板用以供該主機板裝設;一活動式托盤,可活動地設置於該二側板;一轉接模組,設置於該活動式托盤,該轉接模組與該活動式托盤可相對該殼體活動,且該轉接模組用以電性連接該背板與該主機板;以及二樞接件,設置於該活動式托盤之相對兩側,該活動式托盤透過該二樞接件樞接於該二側板,以令該活動式托盤可相對該殼體轉動而位於一使用位置以及一翻轉位置,當該活動式托盤位於該使用位置時,該轉接模組用以電性連接該背板,當該活動式托盤位於該翻轉位置時,該轉接模組用以與該背板分離。 A server device for installing a backplane and a motherboard, the server device comprising: A housing, comprising a bottom plate and two side plates, the two side plates being connected to opposite sides of the bottom plate respectively, the bottom plate being used for installing the motherboard; a movable tray being movably arranged on the two side plates; an adapter module being arranged on the movable tray, the adapter module and the movable tray being movable relative to the housing, and the adapter module being used for electrically connecting the backplane and the motherboard; and two hubs , arranged on two opposite sides of the movable tray, the movable tray is hinged to the two side panels through the two hinges, so that the movable tray can rotate relative to the housing and be located in a use position and a flip position. When the movable tray is located in the use position, the adapter module is used to electrically connect to the back plate, and when the movable tray is located in the flip position, the adapter module is used to separate from the back plate. 如請求項1所述之伺服器裝置,其中該轉接模組包含一轉接板以及至少一第一電連接器,該至少一第一電連接器設置於該轉接板,並用以電性連接該背板或一轉接卡之一電連接器。A server device as described in claim 1, wherein the adapter module includes an adapter board and at least one first electrical connector, the at least one first electrical connector is disposed on the adapter board and is used to electrically connect to an electrical connector of the backplane or an adapter card. 如請求項2所述之伺服器裝置,其中該轉接模組更包含至少一第二電連接器,該至少一第二電連接器設置於該轉接板,並用以透過線纜電性連接於該主機板,該至少一第一電連接器與該至少一第二電連接器電性連接,而用以令該背板透過該至少一第一電連接器與該至少一第二電連接器電性連接該主機板。A server device as described in claim 2, wherein the adapter module further includes at least one second electrical connector, which is arranged on the adapter board and is used to be electrically connected to the motherboard through a cable, and the at least one first electrical connector is electrically connected to the at least one second electrical connector, so that the backplane is electrically connected to the motherboard through the at least one first electrical connector and the at least one second electrical connector. 如請求項2所述之伺服器裝置,其中該至少一第一電連接器的數量為多個,且該些第一電連接器分別為顯示卡電連接器以及網路卡電連接器,該些第一電連接器用以部分設置於該轉接板靠近該主機板之一側而電性連接於該轉接卡之該電連接器,以及另一部分設置於該轉接板遠離該主機板之一側而電性連接於該背板。A server device as described in claim 2, wherein the number of the at least one first electrical connector is multiple, and the first electrical connectors are respectively a display card electrical connector and a network card electrical connector, and the first electrical connectors are partially disposed on a side of the adapter board close to the motherboard and electrically connected to the electrical connector of the adapter card, and the other part is disposed on a side of the adapter board away from the motherboard and electrically connected to the backplane. 如請求項2所述之伺服器裝置,其中該轉接模組包含至少一第一導引結構以及至少一第二導引結構,該至少一第一導引結構設置於該轉接板,該至少一第二導引結構設置於該至少一第一電連接器,當該活動式托盤位於該使用位置時,該轉接模組用以透過該至少一第一導引結構以及該至少一第二導引結構之導引而固定於該背板。A server device as described in claim 2, wherein the adapter module includes at least one first guide structure and at least one second guide structure, the at least one first guide structure is arranged on the adapter plate, and the at least one second guide structure is arranged on the at least one first electrical connector, and when the movable tray is in the use position, the adapter module is used to be fixed to the back plate through the guidance of the at least one first guide structure and the at least one second guide structure. 如請求項1所述之伺服器裝置,更包含一導流支撐架,該導流支撐架設置於該活動式托盤遠離該轉接模組之一側,以令該導流支撐架可相對該殼體活動,該導流支撐架用以兼顧支撐該活動式托盤以及導引對該主機板散熱之風流而提升對主機板的散熱效率。The server device as described in claim 1 further includes an air guide support frame, which is arranged on a side of the movable tray away from the adapter module so that the air guide support frame can move relative to the casing. The air guide support frame is used to both support the movable tray and guide the airflow for cooling the motherboard to improve the cooling efficiency of the motherboard. 如請求項1所述之伺服器裝置,其中該活動式托盤包含至少一第一定位結構,該二側板之至少一者包含一第二定位結構,該至少一第一定位結構用以與該第二定位結構相定位,當該活動式托盤自該使用位置轉動至該翻轉位置時,透過該至少一第一定位結構與該第二定位結構之定位,使得該活動式托盤固定於該翻轉位置。A server device as described in claim 1, wherein the movable tray includes at least one first positioning structure, at least one of the two side panels includes a second positioning structure, and the at least one first positioning structure is used to position with the second positioning structure. When the movable tray is rotated from the use position to the flip position, the movable tray is fixed in the flip position through the positioning of the at least one first positioning structure and the second positioning structure. 如請求項1所述之伺服器裝置,更包含至少一緊固件,當該活動式托盤位於該使用位置時,該活動式托盤透過該至少一緊固件固定於該二側板。The server device as described in claim 1 further includes at least one fastener, and when the movable tray is in the use position, the movable tray is fixed to the two side panels through the at least one fastener. 如請求項1所述之伺服器裝置,其中該活動式托盤自該使用位置轉動至該翻轉位置之角度為115度。A server device as described in claim 1, wherein the angle at which the movable tray rotates from the use position to the flip position is 115 degrees.
TW113121570A 2024-06-12 Server device TWI877030B (en)

Publications (1)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110116226A1 (en) 2009-11-16 2011-05-19 Yi-Lin Yang Server chassis

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110116226A1 (en) 2009-11-16 2011-05-19 Yi-Lin Yang Server chassis

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