TWI675614B - server - Google Patents

Abstract

A server is arranged in a cabinet. The server includes a chassis, a motherboard, at least one storage module, and a service access exchange board. The casing is movably disposed in the cabinet. The chassis includes a bottom plate, a first side plate and a second side plate. The first side plate and the second side plate stand on the bottom plate. The motherboard includes a circuit board, at least one central processing unit, and at least one riser card. The circuit board is disposed on the bottom plate. At least one central processing unit and at least one riser card are disposed on the circuit board. At least one storage module is disposed on the bottom plate. At least one storage module includes a back plate and a plurality of storage units. The back plate is disposed on the bottom plate. The storage unit is electrically connected to the backplane. The service access switch board is arranged on the backplane.

Description

server

The invention relates to a server, in particular to a server with a high-density storage unit.

With the development of the Internet, the combination of servers and cloud services provided by the Internet has been rapidly spreading around the world in recent years, and the popularity of cloud services has led to a massive amount of data to be processed by the servers at an alarming rate. growing up. Therefore, the server's requirements for storage space and read / write speed of the storage unit increase with the growth of data.

However, in addition to the storage unit, the server needs to be configured with components such as the motherboard, cooling module, and expansion cards in a limited space. Therefore, it is difficult to set the number of storage units in the server to exceed the server's space limit, resulting in It is difficult to increase the density of the storage unit.

The invention aims to provide a server, so as to solve the problem that the number of storage units in the conventional server is difficult to break through the space limitation of the server, and the density of the storage unit is difficult to be improved.

The server disclosed in one embodiment of the present invention is configured to be installed in a cabinet. The server includes a chassis, a motherboard, at least one storage module, and a service access exchange board. The casing is movably disposed in the cabinet. The chassis includes a bottom plate, a first side plate and a second side plate. The bottom plate has a first side, a second side, a third side, and a fourth side. the first The side is opposite the second side. The third side is opposite to the fourth side, and the third and fourth sides are between the first and second sides. The first side plate and the second side plate stand on the first side and the second side, respectively. The motherboard is located between the first side plate and the second side plate, and is closer to the first side plate. The motherboard includes a circuit board, at least one central processing unit, and at least one riser card. The circuit board is disposed on the bottom plate. At least one central processing unit and at least one riser card are disposed on the circuit board. The at least one riser card is electrically connected to at least one central processing unit. At least one storage module is disposed on the bottom plate and is located between the second side plate and the circuit board. At least one storage module includes a back plate and a plurality of storage units. The back plate is disposed on the bottom plate. The storage unit is electrically connected to the backplane. The service access switch board is disposed on the bottom board and is interposed between the circuit board and the second side board. At least one storage module is located between the service access exchange board and the third side. The backplane electrical connection service of at least one riser card and at least one storage module accesses the exchange version.

According to the server disclosed in the above embodiment, the service access switch board electrically connected to the adapter card and the backplane is interposed between the circuit board and the second side board, and the storage module is interposed between the service access switch board and the first Between three sides, the number of storage units in the server can exceed the original space limit. In this way, the density of the storage unit can be increased, so that the server has a larger storage space and a faster read and write speed.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

10‧‧‧Server

100‧‧‧chassis

101‧‧‧ floor

102‧‧‧First side plate

103‧‧‧Second side plate

150‧‧‧Motherboard

151‧‧‧Circuit Board

152‧‧‧Central Processing Unit

153‧‧‧Transfer Card

154‧‧‧first network interface

155‧‧‧Mask

156‧‧‧Signal connection board

200‧‧‧Storage Module

201‧‧‧ back plate

202‧‧‧Storage unit

2020‧‧‧shell

2021‧‧‧Storage Element

2022‧‧‧Heat dissipation structure

2023‧‧‧Cooling channel

203‧‧‧Hard disk space

250‧‧‧Service Access Switch Board

300‧‧‧ Expansion Network Card

301‧‧‧Second network interface

350‧‧‧ Distribution Board

400‧‧‧cable

450‧‧‧ cable management rack

500‧‧‧First electric connector

550‧‧‧Second electrical connector

600‧‧‧ Calibration Screw

601‧‧‧locking screw

602‧‧‧Elastic element

20‧‧‧ Cabinet

21‧‧‧Chute

F1‧‧‧Cooling surface

F2‧‧‧Top

F3‧‧‧Circular side

S1‧‧‧First side

S2‧‧‧Second side

S3‧‧‧ Third side

S4‧‧‧ Fourth side

A‧‧‧cooling airflow

D‧‧‧distance

H‧‧‧ height

FIG. 1 is a perspective view of a server according to a first embodiment of the present invention.

FIG. 2 is an exploded view of the server of FIG. 1.

FIG. 3 is an exploded view of a storage module of the server of FIG. 1.

FIG. 4 is a perspective view of the storage element and the heat dissipation structure of the server of FIG. 1 turned 180 degrees.

5 is a perspective view of a signal connection board, a power distribution board, a cable, a cable management rack, a first electrical connector, a second electrical connector, and a calibration screw of the server of FIG. 1.

FIG. 6 is a partial enlarged view of a schematic cross-sectional view of the server of FIG. 1.

FIG. 7 is a perspective view of the server of FIG. 1 installed in a cabinet.

FIG. 8 is a perspective view when the server of FIG. 1 is installed in a cabinet and is located at a plug-in position.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a perspective view of a server according to a first embodiment of the present invention. FIG. 2 is an exploded view of the server of FIG. 1.

The height H of the server 10 in this embodiment is, for example, 2U. Generally speaking, the height H of the server 10 is in units of U, and 1U is equivalent to 1.75 inches, which is also equivalent to 44.45 mm. The server 10 includes a chassis 100, a motherboard 150, two storage modules 200, a service access exchange board 250, an expansion network card 300, a power distribution board 350, a cable 400, and a cable management rack 450 , A plurality of first electrical connectors 500, a plurality of second electrical connectors 550, and a plurality of correction screws 600.

The casing 100 includes a bottom plate 101, a first side plate 102 and a second side plate 103. The bottom plate 101 has a first side S1, a second side S2, a third side S3, and a fourth side S4. The first side S1 is opposite to the second side S2. The third side S3 is opposite to the fourth side S4. The third side S3 and the fourth side S4 are interposed between the first side S1 and the second side S2. First side plate 102 and the second side plate 103 stand on the first side S1 and the second side S2, respectively.

The motherboard 150 is interposed between the first side plate 102 and the second side plate 103, and is closer to the first side plate 102. The motherboard 150 includes a circuit board 151, two central processing units 152, two adapter cards 153, two first network interfaces 154, a cover 155, and a signal connection board 156. The circuit board 151 is disposed on the bottom plate 101. The two central processing units 152 are disposed on the circuit board 151. The two riser cards 153 are disposed on the circuit board 151. The two riser cards 153 are electrically connected to the two central processing units 152 through two PCI-E slots with high-density X16 channel bandwidth, respectively. The two first network interfaces 154 are disposed on the circuit board 151. The cover 155 is disposed on the circuit board 151. The signal connection board 156 is disposed on the circuit board 151. In this embodiment, the motherboard 150 includes two central processing units 152, but is not limited thereto. In other embodiments, the motherboard may also include only one central processing unit. In addition, in this embodiment, the motherboard 150 includes two adapter cards 153, but is not limited thereto. In other embodiments, the motherboard may also include only one adapter card. Furthermore, in this embodiment, the motherboard 150 includes two first network interfaces 154, but is not limited thereto. In other embodiments, the motherboard may also include only a first network interface.

The two storage modules 200 are disposed on the bottom plate 101 and are located between the second side plate 103 and the motherboard 150. That is, the two storage modules 200 and the motherboard 150 are disposed side by side between the first side plate 102 and the second side plate 103. A distance D is maintained between the two storage modules 200 to form a hard disk insertion space 203. In this embodiment, the server 10 includes two storage modules 200, but is not limited thereto. In other embodiments, the server may include only one storage module.

Please refer to FIG. 3 and FIG. 4. FIG. 3 is an exploded view of a storage module of the server of FIG. 1. Figure 4 is a perspective view of the storage element and heat dissipation structure of the server of Figure 1 turned 180 degrees schematic diagram. Each of the two storage modules 200 includes a back plate 201 and a plurality of storage units 202. The two back plates 201 are disposed on the bottom plate 101. These storage units 202 are, for example, non-volatile memory standards (NVMe) solid-state hard drives, and are electrically connected to the backplane 201 in the same storage module 200. The number of these storage units 202 is, for example, sixteen, and each of the two storage modules 200 is provided with eight storage units 202. Each of these storage units 202 includes a housing 2020, a storage element 2021, and a heat dissipation structure 2022. In each storage unit 202, the storage element 2021 has a heat dissipation surface F1, a top surface F2, and an annular side surface F3. The heat dissipation surface F1 is located on a side of the storage element 2021 near the bottom plate 101. The top surface F2 is opposite to the heat radiation surface F1. The annular side surface F3 is connected to the heat dissipation surface F1 and the top surface F2. The housing 2020 only covers the top surface F2 and the annular side surface F3 of the storage element 2021 to expose the heat dissipation surface F1 to the outside, and a heat dissipation channel 2023 is formed on the side of the storage element 2021 near the bottom plate 101. The heat dissipation structure 2022 is located in the heat dissipation channel 2023 and thermally contacts the heat dissipation surface F1 to dissipate the heat generated by the storage element 2021 from the heat dissipation channel 2023 to the outside of the server 10.

The service access exchange board 250 is disposed on the bottom board 101 and is interposed between the main board 150 and the second side board 103. The two storage modules 200 are interposed between the service access exchange board 250 and the third side S3. The two transfer cards 153 and the back plate 201 of the two storage modules 200 are electrically connected to the service access exchange board 250. In addition, the service access exchange board 250, the main board 150, and the two backplanes 201 of the two storage modules 200 are all parallel to the bottom plate 101, for example, to reduce the impedance to the airflow passing through the two storage modules 200.

The extended network card 300 is, for example, a network card that complies with the Open Compute Project (OCP) specification, and is disposed on the circuit board 151. The side of the expansion network card 300 near the third side S3 has two second network interfaces 301. Data transmission of the second network interface 301 The transmission rate is greater than the data transmission rate of the two first network interfaces 154. For example, the data transmission rate of the two first network interfaces 154 is, for example, 10 Gbps. The data transmission rate of the two second network interfaces 301 is, for example, 25 Gbps. In this embodiment, the side of the expansion network card 300 near the third side S3 has two second network interfaces 301, but it is not limited thereto. In other embodiments, the expansion network card 300 is near the third side. One side may have only a second network interface.

Please refer to FIG. 1 and FIG. 5. 5 is a perspective view of a signal connection board, a power distribution board, a cable, a cable management rack, a first electrical connector, a second electrical connector, and a calibration screw of the server of FIG. 1. The power distribution board 350 is detachably connected to the base plate 101. The cable 400 is electrically connected to the signal connection board 156 and the power distribution board 350. The cable management rack 450 is movably disposed on the power distribution board 350. The cable 400 is disposed on the cable management frame 450. In this embodiment, the server 10 includes a cable 400, but is not limited thereto. In other embodiments, the server may also include multiple cables.

These first electrical connectors 500 are disposed on the signal connection board 156. These second electrical connectors 550 are provided on the power distribution board 350. The cable 400 is electrically connected to the first electrical connectors 500 and the second electrical connectors 550, so that the signal connection board 156 and the power distribution board 350 can transmit signals to each other.

Each of the correction screws 600 includes a locking screw 601 and an elastic element 602. In each of the calibration screws 600, a locking screw 601 is locked to the power distribution board 350. The elastic element 602 is, for example, a spring, and is sleeved on the locking screw 601. Opposite sides of the elastic element 602 are respectively connected to the locking screw 601 and the power distribution board 350 to correct the relative positions of the cabinet 100 and the power distribution board 350 by the elastic force of the elastic element 602.

Please refer to FIG. 1 and FIG. 6. FIG. 6 is a partial enlarged view of a schematic cross-sectional view of the server of FIG. 1. When a cooling fan (not shown) guides a cooling airflow A from the server 10, two The storage module 200 and the motherboard 150 are arranged side by side between the first side plate 102 and the second side plate 103, so that the heat dissipation pathway of the two storage modules 200 and the heat dissipation pathway of the motherboard 150 are independent of each other.

The arrangement of the service access exchange board 250, the main board 150, and the two backplanes 201 parallel to the bottom board 101 enables the heat dissipation airflow A to be smoothly guided to each heat dissipation channel in the two storage modules 200 in a horizontal manner. 2023 to further improve the heat convection efficiency in each heat dissipation channel 2023.

On the other hand, for each storage unit 202, when the heat-dissipating airflow A flows through the heat-dissipating channel 2023, the heat-dissipating structure 2022 in thermal contact with the heat-dissipating surface F1 can be directly dissipated without being disturbed by the housing 2020. In this way, the heat dissipation structure 2022 can more effectively exclude the heat generated by the storage unit 202 to prevent heat from being accumulated in the storage unit 202 and causing the storage unit 202 to be damaged.

Please refer to FIG. 7 and FIG. 8. FIG. 7 is a perspective view of the server of FIG. 1 installed in a cabinet. FIG. 8 is a perspective view when the server of FIG. 1 is installed in a cabinet and is located at a plug-in position. The server 10 is configured to be installed in a cabinet 20. The cabinet 20 has two sliding grooves 21 on opposite sides thereof. The first side plate 102 and the second side plate 103 are slidably disposed in two sliding grooves 21 of the cabinet 20, respectively. Generally speaking, before pulling the server 10 out of the cabinet 20 to the insertion position of the pluggable storage unit 202 (as shown in FIG. 7), the cable 400 must be disconnected before the server 10 can be freely placed in the cabinet. Slide in 20. However, the server 10 in this embodiment is detachably connected to the base plate 101 and the cable management frame 450 is movably disposed on the power distribution board 350, so that users can hot-plug each storage unit 202. In other words, the user can perform the insertion and removal of each storage unit 202 in the hard disk insertion space 203 of the server 10 without removing the cable 400. The insertion and removal of each storage unit 202 will not affect the operation of other components in the server 10. When the server 10 is intended to be retracted into the cabinet 20, the correction screws 600 can help the user smoothly join the signal connection board 156 and the power distribution board 350.

According to the server of the above embodiment, the service access switch board electrically connected to the adapter card and the backplane is interposed between the circuit board and the second side board, and the storage module is interposed between the service access switch board and the third side. The number of storage units in the server can exceed the original space limitation. In this way, the density of the storage unit can be increased, so that the server has a larger storage space and a faster read and write speed.

Next, because the casing only covers the top surface and the annular side of the storage element, and the exposed heat dissipation surface is outside, the heat dissipation airflow can directly dissipate the heat dissipation structure that is in thermal contact with the heat dissipation surface without interference from the shell. The heat dissipation efficiency can be effectively improved.

Then, because the two storage modules and the motherboard are arranged side by side between the first side plate and the second side plate, the heat dissipation path of the two storage modules and the heat dissipation path of the main board are independent from each other, and then the two storage modules are upgraded together. And the heat dissipation efficiency of the circuit board.

Then, because the service access switch board, the main board, and the second backplane are all parallel to the bottom plate, the heat dissipation airflow can be smoothly guided to each heat dissipation channel in the two storage modules in a horizontal manner, thereby improving each heat dissipation channel. Internal convection efficiency.

Next, because the power distribution board is detachably connected to the bottom plate, the cable management frame is movably disposed on the power distribution board, and the cables are electrically connected to the first electrical connector provided on the signal connection board and the second electrical connector provided on the power distribution board. , So that the server can slide freely in the casing without removing the cable, thereby improving the efficiency of the user to replace the storage unit and the maintenance staff to maintain the server.

Then, by setting a first network interface with a different data transmission rate and The second network interface can take into account the flexibility of the user in selecting the network interface and the user's requirements for the high performance of the network interface.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in similar arts can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of patent protection of an invention shall be determined by the scope of patent application attached to this specification.

Claims (10)

A server is provided in a cabinet. The server includes: a casing for movably disposed in the cabinet. The casing includes a bottom plate, a first side plate, and a second side plate. The bottom plate has A first side, a second side, a third side, and a fourth side, the first side is opposite the second side, the third side is opposite the fourth side, the third side, and the fourth side are interposed Between the first side and the second side, the first side plate and the second side plate stand on the first side and the second side, respectively; a motherboard, the motherboard is interposed between the first side plate and the Between the second side boards and closer to the first side board, the motherboard includes a circuit board, at least one central processing unit, and at least one adapter card. The circuit board is disposed on the bottom plate, the at least one central processing unit and the At least one adapter card is disposed on the circuit board, the at least one adapter card is electrically connected to the at least one central processing unit; at least one storage module, the at least one storage module is disposed on the bottom plate, and is located on the second side plate And between the motherboard, the at least one storage module includes A backplane and a plurality of storage units, the backplane being disposed on the backplane, the storage units being electrically connected to the backplane; and a service access exchange board, the service access exchange board being disposed on the backplane and interposed between the backplane Between the motherboard and the second side plate, the at least one storage module is interposed between the service access exchange board and the third side, the at least one riser card and the back plate of the at least one storage module are electrically connected. Sexually connect the service access switch board. The server according to item 1 of the scope of patent application, wherein the number of the at least one storage module is two, and a distance is maintained between the two storage modules to form a hard disk insertion space. The server according to item 1 of the scope of patent application, wherein each of the storage units includes a casing, a storage element, and a heat dissipation structure. In each of the storage units, a side of the storage element near the bottom plate has a heat dissipation. Surface, the casing covers the storage element and exposes the heat dissipation surface to the outside, and a heat dissipation channel is formed on a side of the storage element near the bottom plate, and the heat dissipation structure is located in the heat dissipation channel and thermally contacts the heat dissipation surface. The server according to item 1 of the scope of patent application, wherein the service access switch board, the main board and the back plate of the at least one storage module are all parallel to the bottom plate. The server according to item 1 of the patent application scope, wherein the motherboard further includes at least a first network interface, the at least one first network interface is disposed on the circuit board, and the server further includes at least one expansion network. Road card, the at least one expansion network card is disposed on the circuit board, and a side of the at least one expansion network card near the third side has at least a second network interface, and the at least one second network interface The data transmission rate is greater than the data transmission rate of the at least one first network interface. The server described in item 1 of the scope of the patent application further includes a power distribution board and a cable. The power distribution board is detachably connected to the backplane, and the cable is electrically connected to the main board and the power distribution board. The server described in item 6 of the scope of patent application, further includes a cable management frame, which can be movably disposed on the power distribution board, and the cable is disposed on the cable management frame. The server described in item 7 of the scope of patent application further includes a plurality of first electrical connectors and a plurality of second electrical connectors. The first electrical connectors are disposed on the motherboard and the second electrical connectors. And the electrical connector is disposed on the power distribution board, and the cable is electrically connected to the first electrical connector and the second electrical connector so that the motherboard and the power distribution board can transmit signals to each other. The server described in item 6 of the patent application scope further includes a plurality of calibration screws, Each of the correction screws includes a locking screw and an elastic element. In each of the correction screws, the locking screw is locked to the power distribution board, the elastic element is sleeved on the locking screw, and the opposite of the elastic element is The two sides are respectively connected to the locking screw and the power distribution board, so as to correct the relative positions of the cabinet and the power distribution board by the elastic force of the elastic element. The server described in item 2 of the scope of patent application, wherein the height of the server is 1U, the number of the at least one storage module is two, the number of the storage units is sixteen, and each of the two storage modules includes Eight storage units.