TW202246943A - Mother board - Google Patents

Abstract

A mother board includes a substrate, a first connector, a power slot board, a second connector, and a first connecting wire. The first connector is disposed on the substrate. An edge of the power socket board is separated from an edge of the substrate. The second connector is disposed on the power socket board. The first connecting wire electrically connects the first connector and the second connector.

Description

motherboard

The present invention relates to a motherboard, in particular to a motherboard applicable to electronic equipment of different models.

In electronic devices such as computers and servers, it is usually necessary to set up a motherboard for the interaction of processing units, memory and other components. As times change, users usually have various requirements for electronic devices. Manufacturers of electronic equipment will develop various models to meet various needs of users. In order to cope with various models, motherboard manufacturers will design a single motherboard to match various models. However, such a single motherboard is usually oversized to accommodate various models, and usually has one redundant part for one model and another redundant part for another model.

Furthermore, motherboard manufacturers need special machines to manufacture such oversized single motherboards. Such a special machine is usually expensive, so the cost of the manufactured motherboard is relatively high.

In view of the above problems, the present invention proposes a motherboard. By dividing the motherboard into a base board and a power slot board, the motherboard can be applied to different types of electronic equipment, and the size of a single board can be reduced. Motherboards can be manufactured at lower cost.

An embodiment of the present invention provides a motherboard, which includes a substrate, a first connector, a power slot board, a second connector and a first connecting wire. The first connector is disposed on the substrate. One edge of the power socket board is separated from one edge of the base plate. The second connector is arranged on the power socket board. The first connection wire is electrically connected to the first connector and the second connector.

According to the motherboard of an embodiment of the present invention, the edge of the substrate is separated from the edge of the power socket board, so that the motherboard can be divided into the base board and the power socket board. By adjusting the relative positions of the base board and the power slot board, the main board can be applied to different types of electronic equipment without redundant parts. Moreover, the size of a single board in the main board can be reduced, so that the main board can be manufactured at a lower cost. Therefore, in addition to improving the flexibility of the motherboard, the manufacturing cost of the motherboard can also be reduced.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and provide a further explanation of the patent application scope of the present invention.

The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

In the so-called schematic diagrams in this specification, the dimensions, proportions and angles may be exaggerated for illustration purposes, but are not intended to limit the present invention. Various changes are possible without departing from the gist of the present invention. The up, down, front and back orientations mentioned in the descriptions of the embodiments and drawings are for illustration rather than limitation of the present invention.

Please refer to FIG. 1 , which is a schematic top view of a motherboard according to an embodiment of the present invention.

In this embodiment, the motherboard 1 includes a substrate 10 , a first connector 11 , a power slot board 20 , a second connector 21 and a first connecting wire 31 . An edge 201 of the power socket board 20 is separated from an edge 101 of the substrate 10 , so that the power socket board 20 and the substrate 10 belong to two separated circuit boards. The first connector 11 is disposed on the substrate 10 . The second connector 21 is disposed on the power socket board 20 . The first connection wire 31 is electrically connected to the first connector 11 and the second connector 21 . The power slot board 20 can be plugged into a power source (not shown). The power required by the substrate 10 can be obtained from the power slot board 20 through the first connector 11 , the first connecting wire 31 and the second connector 21 .

The substrate 10 has a substrate short direction D1 and a substrate long direction D2 substantially perpendicular to each other. The substrate 10 has a substrate short-side width W1 along the short-side direction D1 of the substrate. In this embodiment, the width W1 of the short side of the substrate may be about 10.58 inches. The substrate 10 has a substrate long side length L1 along the substrate long side direction D2. In this embodiment, the length L1 of the long side of the substrate may be about 19.53 inches.

The power socket board 20 has a sub-board long side width W2 along the short side direction D1 of the substrate. The mainboard 1 has a total width W3 along the direction D1 of the short side of the substrate, and the total width W3 is greater than or equal to the sum of the width W1 of the short side of the substrate plus the width W2 of the long side of the sub-board (ie W3≧W1+W2). When the edge 201 of the power socket board 20 is close to the edge 101 of the substrate 10 , W3 = W1 + W2 is established. The motherboard 1 has a total length L2 along the long side direction D2 of the substrate, and the total length L2 is substantially equal to the length L1 of the long side of the substrate. In this embodiment, the overall width W3 may be approximately 16.7 inches. Therefore, when manufacturing the main board 1, only a manufacturing machine capable of manufacturing boards with a width W1 or less of the short side of the substrate and a length L1 or less of the long side of the substrate is required, and it is not necessary to manufacture a board with a total width W3 and a total length L2. Expensive manufacturing machines for panels. Therefore, the manufacturing cost of the motherboard 1 can be reduced.

In addition, the motherboard 1 further includes a first signal slot 12 and a second signal slot 13 with the same specifications. For example, both the first signal slot 12 and the second signal slot 13 can be slimline connectors for transmitting SATA signals. The first signal slot 12 has a first longitudinal direction D3. The first signal socket 12 is disposed on the substrate 10 . The second signal slot 13 has a second longitudinal direction D4. The second signal socket 13 is disposed on the substrate 10 . The second longitudinal direction D4 is different from the first longitudinal direction D3. Specifically, the second longitudinal direction D4 is substantially perpendicular to the first longitudinal direction D3. The first long-side direction D3 is substantially parallel to the short-side direction D1 of the substrate. The second longitudinal direction D4 is substantially parallel to the substrate longitudinal direction D2.

When different signal lines are respectively inserted into the first signal slot 12 and the second signal slot 13, since the first long side direction D3 is different from the second long side direction D4, it is possible to avoid the first signal line The slot 12 and the second signal slot 13 are confused and misused with each other, so as to achieve a fool-proof effect.

In addition, the motherboard 1 further includes a plurality of first fan slots 14 . The first fan slots 14 are disposed on the substrate 10 , arranged along the short side direction D1 of the substrate and adjacent to one short side 10 a of the substrate 10 . In this embodiment, the number of the first fan slots 14 is four, but not limited thereto. In other embodiments, the number of the first fan slots 14 can also be other numbers.

In addition, the motherboard 1 further includes a plurality of second fan slots 15 . The second fan slot 15 is disposed on the base plate 10 , arranged along the length direction D2 of the base plate and adjacent to a corner 10 b of the base plate 10 . In this embodiment, the number of the second fan slots 15 is two, but not limited thereto. In other embodiments, the number of the second fan slots 15 can also be other numbers.

In addition, the main board 1 may further include a fan slot expansion board 40 , a third connector 16 , a fourth connector 41 , a second connecting wire 32 and a plurality of second fan slots 42 . An edge 401 of the fan slot expansion board 40 is separated from the edge 101 of the base board 10 and separated from the edge 201 of the power slot board 20, so that the fan slot expansion board 40, the power slot board 20 and the base board 10 belong to three pieces separate circuit boards. The third connector 16 is disposed on the substrate 10 . The fourth connector 41 is disposed on the fan slot expansion board 40 . The second connecting wire 32 is electrically connected to the third connector 16 and the fourth connector 41 . The second fan slot 42 is disposed on the fan slot expansion board. In this embodiment, the number of the second fan slots 42 is two, but not limited thereto. In other embodiments, the number of the second fan slots 42 can also be other numbers.

In addition, the motherboard 1 further includes a plurality of PCI-E slots 171 and a handle 172 , which are all arranged on the base plate 10 . The long-side direction D5 of each PCI-E slot 171 is substantially perpendicular to the short-side direction D1 of the substrate, that is, substantially parallel to the long-side direction D2 of the substrate. The handle 172 is located on one side of the long side D5 of the PCI-E slot 171 . The handle 172 is used for locking a PCI-E expansion card (not shown) disposed in the PCI-E slot 171 .

In addition, the motherboard 1 further includes a plurality of memory slots 18 and a processing unit socket 19 . The memory slots 18 are disposed on the substrate 10 and arranged along the short side direction D1 of the substrate. The long-side direction D6 of each memory slot 18 is substantially perpendicular to the short-side direction D1 of the substrate, that is, substantially parallel to the long-side direction D2 of the substrate. The processing unit socket 19 is disposed on the substrate 10 and located between two adjacent memory sockets 18 among the memory sockets 18 .

The base board 10 , the power slot board 20 and the fan slot expansion board 40 can be fixed together on the tray (not shown) of the electronic equipment. The power slot board 20 and the fan slot expansion board 40 can be disposed on the same side of the base board 10 . Alternatively, the relative positions of the base plate 10 , the power slot board 20 and the fan slot expansion board 40 can be adjusted according to the size and specification of the tray. In this embodiment, the board utilization rate of the main board 1 can reach 87%. Moreover, compared to a single motherboard with the same overall length L2 and overall width W3, the cost of the motherboard 1 in this embodiment can be reduced by 60%.

When the motherboard 1 is used, since the memory socket 18 and the processing unit socket 19 are both disposed on the base plate 10, high-frequency signal transmission is allowed between the two without attenuation. In addition, the frequency of the power required by the base board 10 is usually extremely low, so even if the base board 10 and the power socket board 20 are connected by the first connection wire 31 , a stable power supply can still be provided to the base board 10 .

When using the motherboard 1 , four main fans (not shown) can be connected to the first fan slots 14 respectively, and two secondary fans (not shown) can be connected to the second fan slots 42 respectively. In the normal heat dissipation state, the four main fans can be operated only through the first fan slot 14 . In the state of enhanced heat dissipation, four main fans and two secondary fans can be operated simultaneously through the first fan slot 14 and the second fan slot 42 .

Alternatively, four main fans (not shown) may be respectively connected to the first fan slots 14 , and two secondary fans (not shown) may be respectively connected to the second fan slots 15 . In the normal heat dissipation state, the four main fans can be operated only through the first fan slot 14 . In the enhanced heat dissipation state, four main fans and two secondary fans can be operated simultaneously through the first fan slot 14 and the second fan slot 15 .

Please refer to FIG. 2 , which is a schematic top view of a motherboard according to another embodiment of the present invention.

The mainboard 1' of this embodiment has a similar structure to the mainboard 1 shown in FIG.

In this embodiment, the substrate 10 has a substrate short-side width W1 along the short-side direction D1 of the substrate, which may be about 10.58 inches. The substrate 10 has a substrate long side length L1 along the substrate long side direction D2, which may be about 19.53 inches.

The power socket board 20 has a sub-board long side width W2 along the short side direction D1 of the substrate. The mainboard 1 has a total width W3 along the direction D1 of the short side of the substrate, and the total width W3 is greater than or equal to the sum of the width W1 of the short side of the substrate plus the width W2 of the long side of the sub-board (ie W3≧W1+W2). When the edge 201 of the power socket board 20 is close to the edge 101 of the substrate 10 , W3 = W1 + W2 is established. The motherboard 1 has a total length L2 along the long side direction D2 of the substrate, and the total length L2 is substantially equal to the length L1 of the long side of the substrate. In this embodiment, the overall width W3 may be approximately 16.7 inches. Therefore, when manufacturing the main board 1', only a manufacturing machine capable of manufacturing boards with a width W1 or less of the short side of the substrate and a length L1 or less of the long side of the substrate is required, and it is not necessary to be able to manufacture a board with a total width W3 and a total length L2. Expensive manufacturing machines for panels. Therefore, the manufacturing cost of the motherboard 1 can be reduced.

The substrate 10 and the power socket board 20 can be fixed together on the tray (not shown) of the electronic equipment. The power slot board 20 can be disposed on one side of the substrate 10 . Alternatively, the relative positions of the substrate 10 and the power socket board 20 can be adjusted according to the size and specification of the tray. In this embodiment, the board utilization rate of the main board 1 can reach more than 87%. Moreover, compared to a single motherboard with the same overall length L2 and overall width W3, the cost of the motherboard 1 in this embodiment can be reduced by more than 60%.

When using the motherboard 1 , four main fans (not shown) can be connected to the first fan slots 14 respectively, and two secondary fans (not shown) can be connected to the second fan slots 15 respectively. In the normal heat dissipation state, the four main fans can be operated only through the first fan slot 14 . In the enhanced heat dissipation state, four main fans and two secondary fans can be operated simultaneously through the first fan slot 14 and the second fan slot 15 .

To sum up, the motherboard of one embodiment of the present invention separates the edge of the base board from the edge of the power slot board, and separates the edge of the base board from the edge of the fan slot expansion board, so that the motherboard can be divided into base boards , power slot board and fan slot expansion board. By adjusting the relative positions of the base board, the power supply slot board and the fan slot expansion board, the main board can be applied to different types of electronic equipment without redundant parts. Moreover, the size of a single board in the main board can be reduced, so that the main board can be manufactured at a lower cost. Therefore, in addition to improving the flexibility of the motherboard, the manufacturing cost of the motherboard can also be reduced. What's more, the fan slot expansion board can also be omitted according to requirements. In addition, the first signal slot and the second signal slot with the same specification on the substrate can avoid confusion and cause misuse of each other due to the different directions of their long sides, so as to achieve a fool-proof effect.

Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, all changes and modifications are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.

1, 1': Motherboard 10: Substrate 101: Edge 10a: short side 10b: corner 11: First connector 12: The first signal slot 13: Second signal slot 14: The first fan slot 15: Second fan slot 16: Third connector 171: PCI-E slot 172: handle 18:Memory slot 19: Processing unit socket 20: Power slot board 201: Edge 21: Second connector 31: The first connecting line 32: The second connection line 40: Fan slot expansion board 401: edge 41: Fourth connector 42: Second fan slot D1: The direction of the short side of the substrate D2: The direction of the long side of the substrate D3: The direction of the first long side D4: The direction of the second long side D5: Long side direction D6: Long side direction L1: The length of the long side of the substrate L2: total length W1: Width of the short side of the substrate W2: The width of the long side of the sub-board W3: total width

FIG. 1 is a schematic top view of a motherboard according to an embodiment of the present invention.

FIG. 2 is a schematic top view of a motherboard according to another embodiment of the present invention.

1: Motherboard

10: Substrate

101: Edge

10a: short side

10b: corner

11: First connector

12: The first signal slot

13: Second signal slot

14: The first fan slot

15: Second fan slot

16: Third connector

171: PCI-E slot

172: handle

18:Memory slot

19: Processing unit socket

20: Power slot board

201: Edge

21: Second connector

31: The first connecting line

32: The second connection line

40: Fan slot expansion board

401: edge

41: Fourth connector

42: Second fan slot

D1: The direction of the short side of the substrate

D2: The direction of the long side of the substrate

D3: The direction of the first long side

D4: The direction of the second long side

D5: Long side direction

D6: Long side direction

L1: The length of the long side of the substrate

L2: total length

W1: Width of the short side of the substrate

W2: The width of the long side of the sub-board

W3: total width

Claims (10)

A motherboard, comprising: a substrate; a first connector arranged on the substrate; a power socket board, one edge of the power socket board is separated from an edge of the substrate; a second connector arranged on the power slot board; and a first connection wire electrically connected to the first connector and the second connector. The main board as described in claim 1, wherein the base board has a width of a short side of the base board and a length of a long side of the base board, the power slot board has a width of a long side of a sub-board, and a total length of the main board is the length of the base board Side length, the total width of one of the main boards is the width of the short side of the substrate plus the width of the long side of the sub-board. The motherboard as described in claim 1 further includes a first signal slot and a second signal slot with the same specifications, the first signal slot has a first long side direction, and the first signal slot is set On the substrate, the second signal slot has a second longitudinal direction, the second signal slot is disposed on the substrate, and the second longitudinal direction is different from the first longitudinal direction. The motherboard according to claim 3, wherein the second long-side direction is substantially perpendicular to the first long-side direction. The motherboard according to claim 3, wherein the substrate has a short direction of the substrate, and the first long direction of the first signal slot is substantially parallel to the short direction of the substrate. The motherboard as described in claim 1 further includes a plurality of first fan slots, the base board has a short side direction of the base board, the first fan slots are arranged on the base board, and the first fan slots are arranged along the The substrates are arranged in the short side direction and adjacent to one of the short sides of the substrate. The main board as described in claim 6, further comprising a plurality of second fan slots, the base board has a base board long side direction substantially perpendicular to the base board short side direction, and the second fan slots are arranged on the base board Above, the second fan slots are arranged along the long side of the base board and adjacent to a corner of the base board. The motherboard as described in claim 6 further includes a fan slot expansion board, a third connector, a fourth connector and a second connection line, the third connector is arranged on the base plate, and the fan slot One edge of the slot expansion board is separated from the edge of the base board, the fourth connector is arranged on the fan slot expansion board, and the second connecting line is electrically connected to the third connector and the fourth connector. The motherboard as described in Claim 8 further includes a plurality of second fan slots disposed on the fan slot expansion board. The motherboard as described in claim 1 further includes a PCI-E slot and a handle, both of which are arranged on the base plate, the base plate has a short side direction of the base board, and the long side direction of the PCI-E slot is substantially Perpendicular to the short side direction of the substrate, the handle is located on one side of the long side direction of the PCI-E slot, and the handle is used for locking a PCI-E expansion card arranged in the PCI-E slot.

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