TWI777040B - Blade cover - Google Patents
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- TWI777040B TWI777040B TW108106519A TW108106519A TWI777040B TW I777040 B TWI777040 B TW I777040B TW 108106519 A TW108106519 A TW 108106519A TW 108106519 A TW108106519 A TW 108106519A TW I777040 B TWI777040 B TW I777040B
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 169
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 230000000007 visual effect Effects 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 8
- 239000007921 spray Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
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- 238000003754 machining Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Engineering (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Harvester Elements (AREA)
- Handling Of Sheets (AREA)
- Turbine Rotor Nozzle Sealing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
[課題]形成為能夠有效率地對切割刀片的加工點供給切割水並提升冷卻效果。 [解決手段]覆蓋切割刀片的刀片蓋具備有噴出切割水的切割水構成組。切割水構成組具備有:第1切割水噴射口及第2切割水噴射口,朝向切割刀片的外周端面噴射切割水;第1供給路徑,連通於第1切割水噴射口,且以將通過切割刀片中心之鉛直線與從第1切割水噴射口朝向切割刀片中心所噴射之切割水的行進方向所成的角度形成為比35度更大且比45度更小的角度來進行噴射;及第2供給路徑,連通於第2切割水噴射口,且形成為以通過切割刀片中心之鉛直線與從第2切割水噴射口所噴射之切割水的行進方向為直角的方式來進行噴射。[Problem] It is possible to efficiently supply cutting water to the processing point of the cutting blade and improve the cooling effect. [Solution] The blade cover covering the cutting blade is provided with a cutting water configuration group that sprays cutting water. The cutting water configuration group includes: a first cutting water jetting port and a second cutting water jetting port for jetting cutting water toward the outer peripheral end face of the cutting blade; The angle formed by the vertical line at the center of the blade and the traveling direction of the cutting water jetted from the first cutting water jetting port toward the center of the cutting blade is formed at an angle larger than 35 degrees and smaller than 45 degrees for jetting; and The second supply path communicates with the second cutting water jetting port, and is formed so that the vertical line passing through the center of the cutting blade and the traveling direction of the cutting water jetted from the second cutting water jetting port are at right angles.
Description
發明領域 本發明是有關於一種對切割刀片噴射切割水之刀片蓋。Field of Invention The present invention relates to a blade cover for jetting cutting water to a cutting blade.
發明背景 器件可藉由例如稱為QFN(方形扁平無引線封裝,Quad Flat Non-leaded Package)之技術而進行封裝。被稱為QFN的此項技術是以金屬框體、複數個器件及樹脂層來形成將器件封裝的技術,前述金屬框體是沿對配設有器件的區域進行區劃之分割預定線而形成有複數個電極,且厚度為150μm左右,前述複數個器件是配設於藉由分割預定線所區劃出的區域,前述樹脂層是將樹脂充填於配設有複數個器件之側而形成,且厚度為500μm左右。Background of the Invention Devices can be packaged, for example, by a technique known as QFN (Quad Flat Non-leaded Package). This technology, called QFN, is a technique of encapsulating a device by forming a metal frame, a plurality of devices, and a resin layer. The metal frame is formed along a predetermined dividing line that divides the area where the device is arranged. A plurality of electrodes with a thickness of about 150 μm, the plurality of devices are arranged in the area demarcated by the predetermined dividing lines, and the resin layer is formed by filling the resin on the side where the plurality of devices are arranged, and has a thickness of is about 500 μm.
藉由這樣的QFN所構成的封裝基板在封裝之樹脂充填步驟後的切割步驟中,是藉由切割刀片來切割分割預定線(參照例如專利文獻1)。藉由此切割,可對包夾分割預定線而相鄰的電極間進行分離,並且按一個個的器件進行分割。 先前技術文獻 專利文獻In the dicing step after the resin filling step of the package on the package substrate made of such a QFN, the line to be divided is diced by a dicing blade (see, for example, Patent Document 1). By this dicing, adjacent electrodes can be separated by sandwiching the planned dividing line, and can be divided into individual devices. prior art literature Patent Literature
專利文獻1:日本專利特開2007-258590號公報Patent Document 1: Japanese Patent Laid-Open No. 2007-258590
發明概要 發明欲解決之課題 然而,在上述的分割中存在有下述問題:因為電極具有延展性所以會在切割中延展,而使各個器件中相鄰的電極間的距離變短,使得器件的品質降低。於是,本案的發明人想出了下述的發明:著眼於對加工中的切割刀片噴射的切割水,可以將由該切割水所形成的冷卻效果提高,來改善上述問題。Summary of Invention The problem to be solved by the invention However, in the above-mentioned division, there is a problem in that the electrodes are stretched during the dicing, and the distance between the adjacent electrodes in each device is shortened, and the quality of the device is degraded. Then, the inventors of the present application have come up with an invention that can improve the above-mentioned problems by focusing on the cutting water jetted to the cutting blade during processing, and improving the cooling effect by the cutting water.
本發明是有鑒於所述問題點而作成的發明,其目的之一是提供一種可以有效率地對切割刀片的加工點供給切割水並提升冷卻效果的刀片蓋。 用以解決課題之手段The present invention has been made in view of the above-mentioned problems, and one of the objects thereof is to provide a blade cover which can efficiently supply cutting water to the processing point of the cutting blade and improve the cooling effect. means of solving problems
本發明的一態樣的刀片蓋,是覆蓋配設於主軸殼體的前端,且透過凸緣而裝設於主軸之切割刀片,其中前述主軸是在Y方向上具有旋轉軸,前述主軸殼體是旋轉自如地支撐前述主軸,前述刀片蓋的特徵在於: 具備切割水構成組,前述切割水構成組是以可於切割刀片的厚度方向即Y方向上調整的方式安裝,且配設於與供給到切割刀片的切割水因該切割刀片的旋轉而飛散之側為相反的相反側,且與切割刀片的外周端面相向來噴出切割水, 前述切割水構成組具備: 第1切割水噴射口及第2切割水噴射口,朝向切割刀片的外周端面噴射切割水; 第1供給路徑,連通於第1切割水噴射口,且以將通過切割刀片中心之鉛直線與從第1切割水噴射口朝向切割刀片中心所噴射之切割水的行進方向所成的角度形成為比35度更大且比45度更小的角度來進行噴射;及 第2供給路徑,連通於第2切割水噴射口,且形成為以通過切割刀片中心之鉛直線與從第2切割水噴射口所噴射之切割水的行進方向為直角的方式來進行噴射。A blade cover of one aspect of the present invention covers a cutting blade disposed at the front end of a main shaft housing and installed on the main shaft through a flange, wherein the main shaft has a rotation axis in the Y direction, and the main shaft casing It is to rotatably support the aforementioned spindle, and the aforementioned blade cover is characterized by: A cutting water configuration group is provided which is attached so as to be adjustable in the thickness direction of the cutting blade, that is, in the Y direction, and is arranged in a position where the cutting water supplied to the cutting blade is scattered due to the rotation of the cutting blade. The side is the opposite side, and the cutting water is sprayed toward the outer peripheral end face of the cutting blade, The aforementioned cutting water composition group has: The first cutting water jetting port and the second cutting water jetting port jet cutting water toward the outer peripheral end face of the cutting blade; The first supply path communicates with the first cutting water jetting port, and is formed at an angle formed by the vertical line passing through the center of the cutting blade and the traveling direction of the cutting water jetted from the first cutting water jetting port toward the center of the cutting blade spray at an angle greater than 35 degrees and less than 45 degrees; and The second supply path communicates with the second cutting water jetting port, and is formed so that the vertical line passing through the center of the cutting blade and the traveling direction of the cutting water jetted from the second cutting water jetting port are at right angles.
根據這樣的構成,由於將從第1切割水噴射口及第2切割水噴射口噴射的切割水設定成上述之第1供給路徑及第2供給路徑的角度,因此可以有效率地將切割水供給到切割刀片的加工點。藉此,即便在例如對被加工物中的具有延展性之電極部分進行切割的情況下,也可以抑制其電極延展而使相鄰的電極間的距離變短之情形,並且可以提高切割刀片中的冷卻效果,而謀求加工後的器件品質之提升。 發明效果According to such a configuration, since the cutting water jetted from the first cutting water jetting port and the second cutting water jetting port is set at the angle of the above-mentioned first supply path and the second supply path, it is possible to efficiently supply the cutting water to the machining point of the cutting blade. Thereby, even in the case of cutting the ductile electrode portion of the workpiece, for example, the electrode can be prevented from being stretched and the distance between the adjacent electrodes can be shortened, and the cutting blade can be improved in The cooling effect is improved, and the quality of the processed device is improved. Invention effect
依據本發明,由於從角度不同的第1供給路徑及第2供給路徑噴射切割水,因此可以有效率地對切割刀片的加工點供給切割水而提升冷卻效果。According to the present invention, since the cutting water is jetted from the first supply path and the second supply path having different angles, the cutting water can be efficiently supplied to the machining point of the cutting blade, thereby enhancing the cooling effect.
用以實施發明之形態
以下,參照附加圖式來說明本實施形態。圖1是本實施形態之切割裝置的立體圖。如圖1所示,切割裝置1是構成為藉由設置於工作夾台3的上方之切割組件4,對在殼體2上的工作夾台3所保持的被加工物W進行加工。被加工物W是以被稱為QFN基板之封裝基板形成為矩形狀。被加工物W的正面是藉由配置排列成格子狀之分割預定線而區劃成複數個區域,且在此區劃出的區域中形成有IC、LSI、LED等的各種器件91。又,被加工物W是以透過貼附膠帶92而被環狀框架93所支撐,且收容於片匣5內的狀態搬入切割裝置1。Form for carrying out the invention
Hereinafter, the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of the cutting device of the present embodiment. As shown in FIG. 1 , the cutting device 1 is configured to process the workpiece W held by the table 3 on the
在殼體2的上表面形成有在X方向上延伸之矩形狀的開口部(圖未示),此開口部是被可與工作夾台3一起移動的移動板31以及蛇腹狀的防水蓋32所被覆。在防水蓋32的下方設有使工作夾台3在X方向上移動之滾珠螺桿式的移動機構(圖未示)。於工作夾台3的正面是藉由多孔陶瓷材而形成有吸引保持被加工物W的保持面33。保持面33是通過工作夾台3內的流路而連接到吸引源。A rectangular opening (not shown) extending in the X direction is formed on the upper surface of the
工作夾台3是在裝置中央的移交位置與面對切割組件4的加工位置之間往返移動。圖1所顯示的是工作夾台3於移交位置待機之狀態。於殼體2中,與此移交位置相鄰的一個角部為下降一階,且在下降部位可升降地設置有載置工作台6。於載置工作台6上可載置收容有被加工物W的片匣5。藉由在載置有片匣5的狀態下使載置工作台6升降,可在高度方向上調整被加工物W的拉出位置及推入位置。The work clamp table 3 reciprocates between a transfer position in the center of the device and a processing position facing the
在載置工作台6的後方設有平行於Y方向的一對導軌7、以及在一對導軌7與片匣5之間搬送被加工物W的推拉機構8。可藉由一對導軌7來導引由推拉機構8所進行的被加工物W的搬送,並且將被加工物W的X方向定位。推拉機構8是構成為除了從片匣5將加工前的被加工物W拉出到一對導軌7以外,還從一對導軌7將加工完的被加工物W推入片匣5。可藉由推拉機構8將被加工物W的Y方向定位。A pair of guide rails 7 parallel to the Y direction, and a push-
在一對導軌7的附近設有第1搬送支臂11,前述第1搬送支臂11是在導軌7與工作夾台3之間搬送被加工物W。第1搬送支臂11的上表面視角下L字形的支臂部16是以旋繞方式來搬送被加工物W。又,於移交位置的工作夾台3的後方設有旋轉式的洗淨機構12。在洗淨機構12中,在朝向旋轉中的旋轉工作台17噴射洗淨水而洗淨被加工物W後,可噴附乾燥空氣取代洗淨水來將被加工物W乾燥。A
在殼體2上設置有支撐切割組件4的支撐台21。切割組件4是定位在工作夾台3的上方,且可藉由滾珠螺桿式的移動機構(未圖示)而在Y方向上及Z方向上移動。切割組件4具有設置於主軸(未圖示)的前端之圓板狀的切割刀片41。切割刀片41是藉由刀片蓋42覆蓋周圍,且可從刀片蓋42朝向切割部分噴射切割水。可一面高速旋轉切割刀片41並供給切割水,一面切割加工被加工物W。A support table 21 for supporting the
於支撐台21的側面22設置有可在工作夾台3與洗淨機構12之間搬送被加工物W的第2搬送支臂13。第2搬送支臂13的支臂部18是朝斜前方延伸,此支臂部18是以朝前後移動的方式搬送被加工物W。又,在支撐台21上設有懸臂支撐部24,前述懸臂支撐部24是形成為於工作夾台3的移動路徑的上方橫切,並支撐拍攝部14。拍攝部14是從懸臂支撐部24的下表面突出,且可藉由拍攝部14拍攝被加工物W。由拍攝部14所形成之拍攝圖像可利用於切割組件4與工作夾台3的校準。A
於殼體2的最前部設有受理對裝置各部的指示之輸入組件26。又,在支撐台21之上載置有監視器27,在監視器27上可顯示以拍攝部14所拍攝到的圖像或加工條件等。在像這樣所構成的切割裝置1中,可將切割刀片41定位於被加工物W的分割預定線上,且從刀片蓋42的各種噴嘴朝向切割刀片41噴射切割水。然後,一邊藉由切割水進行冷卻及洗淨,一邊使切割刀片41切入被加工物W,並沿格子狀的分割預定線來切割被加工物W。An
接著,參照圖2及圖3並針對切割組件來詳細地進行説明。圖2是本實施形態之切割組件的立體圖。圖3是本實施形態之切割組件的平面示意圖。再者,圖3A是切割組件的正面圖,圖3B是切割組件的側面圖。Next, the cutting unit will be described in detail with reference to FIGS. 2 and 3 . FIG. 2 is a perspective view of the cutting assembly of the present embodiment. FIG. 3 is a schematic plan view of the cutting assembly of the present embodiment. 3A is a front view of the cutting unit, and FIG. 3B is a side view of the cutting unit.
如圖2及圖3所示,切割組件4是將裝設有切割刀片41之主軸(未圖示)可旋轉地裝設。主軸是在Y方向上具有旋轉軸且可旋轉自如地被主軸殼體43所支撐,並且配設於主軸殼體43的前端。於主軸殼體43上裝設有刀片蓋42的蓋本體42A。切割刀片41的外周是除了下半部以外被刀片蓋42所覆蓋。切割刀片41為輪轂型刀片,且是在輪轂基台51的外周設置切割被加工物W的切割刃52而構成。切割刀片41是以透過主軸的前端的安裝凸緣(未圖示)來將環狀的固定螺帽53鎖緊的方式而裝設。As shown in FIGS. 2 and 3 , the
切割刃52是例如以黏結劑結合鑽石等的磨粒而形成為圓環狀。切割刃52是以約10μm到約500μm的厚度所形成。再者,在本實施形態中,雖然作為切割刀片41是例示輪轂型刀片來說明,但切割刀片41的種類並未特別限定。作為切割刀片41,亦可使用墊圈型刀片來取代輪轂型刀片。The
在刀片蓋42的上部設有刀片破損檢測器44。刀片破損檢測器44具有相向配置成包夾切割刀片41的上部的發光元件及受光元件。從發光元件射出的光束是藉由切割刀片41的前端而部分地被遮光並被受光元件所接收。藉此,刀片破損檢測器44是因應於受光元件中的受光量(透射率)的增加,而檢測切割刀片41的全面損壞或缺口等的破損狀態。刀片破損檢測器44是藉由調整螺絲55來調整相對於切割刀片41的上下位置,並藉由固定螺絲56在已調整的位置上固定。A
刀片蓋42具備有在蓋本體42A的切割方向後方以可在Z方向上調整的方式安裝的切割水構成組45。在切割水構成組45中固定有側面視角下L字型的一對切割水噴嘴61。在一對切割水噴嘴61中是從供給軟管62通過切割水構成組45來供給切割水。一對切割水噴嘴61是在從切割水構成組45朝下方延伸之後,朝切割方向前方延伸成包夾切割刀片41的下部。在一對切割水噴嘴61的前端側,在包夾切割刀片41而相向之相向面上形成有複數個狹縫63。可藉由複數個狹縫63從側邊噴射切割水,來進行加工點的冷卻及洗淨。The
在此,供給到切割刀片41的切割水,在切割刀片41朝圖3A的箭頭S所示的方向旋轉的情形下,是朝切割方向後方飛散。因為將所述的切割水導向後方,所以在切割水構成組45設有一對飛沫蓋47。一對飛沫蓋47會將因切割刀片41的旋轉而飛散之冷卻水及切割屑引導到後方,而排出到刀片蓋42的外側。Here, the cutting water supplied to the
刀片蓋42具備有切割水構成組46,前述切割水構成組46是在蓋本體42A的切割方向前方,以可在切割刀片41的厚度方向即Y方向上進行調整的方式安裝。切割水構成組46是配設在切割方向前方,換言之,即與供給到切割刀片41的切割水因切割刀片41的旋轉而飛散之側為相反的相反側。從而,切割水構成組46是與切割刀片41的切割方向前方中的外周端面相向而配設。The
圖4是切割水構成組的概略立體圖。如圖3及圖4所示,在切割水構成組46中形成有從切割方向前方朝向切割刀片41(在圖4中未圖示)的外周端面噴射切割水的第1切割水噴射口65及第2切割水噴射口66。第1切割水噴射口65是在Z方向上比第2切割水噴射口66更+側,亦即第1切割水噴射口65是配設在第2切割水噴射口66的上方。又,第1切割水噴射口65及第2切割水噴射口66是將其等的中心位置配設成在Y方向上成為相同的位置。4 is a schematic perspective view of a cutting water configuration group. As shown in FIGS. 3 and 4 , the cutting
第1切割水噴射口65是連通於第1供給路徑68的一端。第1供給路徑68的另一端是通過在Y方向上延伸之第1連結路徑69而連通到在Z方向上延伸的第1流路70。又,第2切割水噴射口66是連通於第2供給路徑72的一端,且第2供給路徑72的另一端是通過在Y方向延伸之第2連結路徑73而連通到在Z方向上延伸的第2流路74。The first cutting
如圖3A所示,第1供給路徑68是形成隨著朝向切割方向後方而下降的角度,並且是以此角度噴射來自第1切割水噴射口65的切割水。具體而言,是將第1供給路徑68形成為以通過切割刀片41的中心C之鉛直線CL與從第1切割水噴射口65朝向切割刀片41的中心C噴射之切割水的行進方向所成的角度θ為比35度更大且比45度更小的角度來進行噴射。換言之,第1供給路徑68的延伸方向是設定成與切割水的行進方向相同的方向。As shown in FIG. 3A , the
第2供給路徑72是朝切割方向後方且形成為水平角度,並且是以此角度噴射來自第2切割水噴射口66的切割水。具體而言,是將第2供給路徑72形成為以通過切割刀片41的中心C之鉛直線CL與從第2切割水噴射口66所噴射之切割水的行進方向為直角的方式來進行噴射。以藉由各個切割水噴射口65、66從切割方向前方朝向後方對切割刀片41噴射切割水的方式,可將切割水捲入切割刀片41來進行加工點的冷卻及洗淨。The
在此,如圖3B所示,第1切割水噴射口65的中心位置(第1供給路徑68的中心線)是形成為與第2切割水噴射口66的中心位置(第2供給路徑72的中心線)在Y方向上一致,而位於相同的XZ平面D上。Here, as shown in FIG. 3B , the center position of the first cutting water jetting port 65 (the center line of the first supply path 68 ) is formed so that Centerlines) coincide in the Y direction and lie on the same XZ plane D.
第1流路70及第2流路74是在Y方向上間隔規定間隔而排列並配設。於第1流路70及第2流路74的各個上端連接有供給軟管76(參照圖2)。可從供給軟管76通過第1流路70、第1連結路徑69、及第1供給路徑68而將切割水供給到第1切割水噴射口65。又,可從供給軟管76通過第2流路74、第2連結路徑73、及第2供給路徑72而將切割水供給到第2切割水噴射口66。The
在成為切割水構成組46之外側面的前表面85上,形成有切割水構成組46的調整用的目視孔78。於切割水構成組46內,是從目視孔78貫通到切割刀片41側而形成有目視路徑79。目視孔78及目視路徑79是形成為可進行目視辨識的程度的內徑(例如3mm到5mm)。目視路徑79是延伸成在上表面視角下相對於Y方向正交,並且是在Y方向上位於第1流路70及第2流路74之間,且形成於遠離其等的位置上。又,目視路徑79是在Z方向上形成於第1連結路徑69及第1供給路徑68、及第2連結路徑73及第2供給路徑72之間,形成為通過遠離其等的位置。從而,目視路徑79是形成在既不交叉於第1切割水噴射口65、第1供給路徑68、第1連結路徑69、第1流路70的任一個,也不交叉於第2切割水噴射口66、第2供給路徑72、第2連結路徑73、第2流路74的任一個的位置上。又,目視孔78的中心位置(目視路徑79的中心線)是在Y方向上與各個切割水噴射口65、66的中心位置一致,而形成為位於相同的XZ平面D上。In the
又,因為切割水構成組46是藉由目視路徑79而貫通,所以變得可通過目視孔78來對切割刀片41的厚度方向進行目視辨識。據此,可一邊通過目視孔78直接目視辨識切割刀片41的厚度方向的中央,一邊將相對於切割刀片41之目視孔78的Y方向的位置定位。伴隨於目視孔78的定位,可將相同的XZ平面D內的各切割水噴射口65、66的位置也定位。目視路徑79是以作業人員容易目視的方式,從目視孔78朝切割刀片41並朝斜下方延伸。Moreover, since the cutting
切割水構成組45、46是各自螺鎖固定於蓋本體42A。在切割水構成組45的側面81上,形成有上下方向較長的長孔82。在長孔82中插通有一對調整螺絲83,以將調整螺絲83鬆開並將切割水構成組45沿長孔82移動的方式,可調整切割水噴嘴61相對於切割刀片41的Z方向的位置。在切割水構成組46的前表面85上形成有於Y方向較長的一對長孔86。在各個長孔86中插通有調整螺絲87,以將調整螺絲87鬆開並將切割水構成組46沿長孔86移動的方式,可調整各個切割水噴射口65、66相對於切割刀片41的Y方向的位置。再者,各個長孔86是形成於不與第1流路70及第2流路74交叉而遠離的位置上。The cutting water
參照圖5,針對切割水噴射口相對於切割刀片的位置調整進行說明。圖5是本實施形態之切割水噴射口相對於切割刀片的位置調整的說明圖。5 , the position adjustment of the cutting water jetting port with respect to the cutting blade will be described. FIG. 5 is an explanatory view of the positional adjustment of the cutting water jetting port with respect to the cutting blade according to the present embodiment.
在圖5A所示的初期狀態中,是各個切割水噴射口65、66的中心相對於切割刀片41的厚度方向的中心,在Y方向上形成位置偏離。據此,若在此初期狀態原樣從各個切割水噴射口65、66對切割刀片41供給切割水時,會無法以切割刀片41的切割刃52將切割水二等分平分。據此,會使來自切割水的壓力對切割刀片41的兩側面不平衡地作用,且對切割刀片41產生晃動或傾斜,恐有在切割加工時產生破裂等之疑慮。又,在切割刀片41的兩側面當中僅將單側冷卻,恐有引發異常磨耗的疑慮。In the initial state shown in FIG. 5A , the center of each of the cutting
於是,在本實施形態中,是在相同的XZ平面D上設置各個切割水噴射口65、66的中心與目視孔78的中心,而通過目視孔78一邊直接目視辨識切割刀片41一邊對各個切割水噴射口65、66進行位置調整。在這種情況下,是將已插通於一對長孔86之各個調整螺絲87鬆開,並將切割水構成組46相對於蓋本體42A(參照圖2)在Y方向上移動而形成為可調整。並且,一邊於目視孔78窺視,一邊將目視孔78的中心位置對準切割刀片41的厚度方向的中央,而定位成以切割刀片41的切割刃52將目視孔78二等分平分。然後,可藉由一對調整螺絲87的鎖緊來固定切割水構成組46。Therefore, in the present embodiment, the center of each of the cutting
藉此,如圖5B所示,可伴隨於目視孔78的位置調整,而將各個切割水噴射口65、66的中心相對於切割刀片41的厚度方向的中心在Y方向上進行對位。然後,可將各個切割水噴射口65、66定位在被切割刀片41的切割刃52二等分平分的位置上,而可對切割刀片41的兩側面均一地供給切割水。據此,可以防止因各個切割水噴射口65、66的中心未能定位在切割刀片41的中心之情形所造成的加工品質的偏差的產生,且可以有效地冷卻切割刀片41並且抑制切割刀片41的晃動或傾斜而提升加工精度。再者,為了易於實施目視孔78相對於切割刀片41的對位,亦可在目視孔78的周圍附加定位用的標記等。Thereby, as shown in FIG. 5B , the center of each of the cutting
藉由上述的位置調整,可以一邊通過目視孔78直接目視辨識切割刀片41的厚度方向的中央,一邊將目視孔78定位成以切割刀片41的切割刃52形成二等分平分。由於可伴隨於目視孔78的定位,而將各個切割水噴射口65、66精度良好地定位成以切割刀片41的切割刃52形成二等分平分,因此可以對切割刀片41的兩側面均一地供給切割水。據此,可以有效地冷卻切割刀片41,並且不會有對切割刀片41產生晃動或傾斜之情形,而可以提升對被加工物W的切割精度。又,由於可通過目視孔78直接目視辨識切割刀片41的厚度方向的中央,因此可以容易地進行切割水構成組46的位置調整。By the above-described position adjustment, the
接著,參照圖1針對由上述切割裝置1所進行之被加工物W的切割加工方法進行說明。首先,藉由搬送組件(未圖示),將透過貼附膠帶92被環狀框架93所支撐之被加工物W作為單元來搬送到工作夾台3,並且進行吸引保持。接著,對被加工物W進行校準後,將工作夾台3朝X方向移動,而將被加工物W朝成為切割區域之切割組件4的下方接近來定位。又,將切割組件4在Y方向上移動,並且定位到因應於被加工物W的分割預定線的位置。Next, the cutting method of the workpiece W by the cutting device 1 described above will be described with reference to FIG. 1 . First, the workpiece W supported by the
在如上述地進行定位後,將切割組件4下降,並且因應於被加工物W的切入深度在Z方向上進行定位。在此定位後,相對於高速旋轉之切割刀片41將工作夾台3朝X方向相對移動,而沿被加工物W的分割預定線形成切割溝。在切割溝形成時,對切割刀片41與被加工物W之接觸部位,是從切割水噴嘴61、第1切割水噴射口65及第2切割水噴射口66(參照圖4)來供給切割水。然後,每當形成一條切割溝,就將切割組件4朝Y方向移動分割預定線的Y方向的間距間隔量,並藉由重覆同樣的動作,而依序形成切割溝。After positioning as described above, the
在與X方向平行的分割預定線上全部都形成切割溝後,當透過θ工作台(未圖示)將工作夾台3旋轉90°,並進行與上述同樣的切割時,即可在所有的分割預定線都形成切割溝而將被加工物W縱橫地切割。藉此,可從由QFN所形成之封裝基板所構成的被加工物W,形成如圖6所示之一個個的封裝器件PD。圖6是封裝器件的平面示意圖。在封裝器件PD中,成為外部連接端子之各個電極PDa的外部電極部分露出於與充填樹脂PDb同一平面上。
[實施例]After all the cutting grooves are formed on the planned dividing line parallel to the X direction, the
作為實施例1~4及比較例1~11,改變圖3A所示的角度θ,並且使用形成第1供給路徑68及第1切割水噴射口65之切割水構成組46來進行實驗。角度θ與實施例1~4及與比較例1~11的對應關係是顯示於表1。在實施例1~4及比較例1~11中,對上述實施形態的切割裝置1及切割方法,如表1地變更角度θ,並且,停止來自第2供給路徑72的切割水的噴射。又,其他加工條件是設成相同,對由同種的QFN所形成之封裝基板所構成的被加工物W進行切割,以形成封裝器件PD。As Examples 1 to 4 and Comparative Examples 1 to 11, the angle θ shown in FIG. 3A was changed, and experiments were performed using the cutting
[表1]
對於在實施例1~4及比較例1~11中所形成的封裝器件PD,對圖6B所示的電極間距離d進行測定並評價。其結果顯示於表1。表1的評價是形成為:○:在容許值內(比容許值更大),△:容許值(與容許值相同或大致相同),×:超出容許值(比容許值更小)。容許值是因應於電極PDa的尺寸或形狀、佈置、封裝器件PD的尺寸或形狀、對封裝器件PD所要求的性能而變化。For the packaged devices PD formed in Examples 1 to 4 and Comparative Examples 1 to 11, the inter-electrode distance d shown in FIG. 6B was measured and evaluated. The results are shown in Table 1. The evaluations in Table 1 are formed as follows: ○: within the allowable value (larger than the allowable value), Δ: the allowable value (same or approximately the same as the allowable value), and ×: outside the allowable value (smaller than the allowable value). The allowable value varies according to the size or shape of the electrode PDa, the arrangement, the size or shape of the packaged device PD, and the performance required for the packaged device PD.
如從表1所可以理解地,在角度θ為35°以上且45°以下的情況(實施例1~3)、與角度θ為90°的情況下(實施例4),電極間距離d變得比容許值更大,而可以實現良好的加工品質、器件品質。其理由是源自:因為可以有效率地對切割刀片41接觸於被加工物W之加工點供給切割水而提高冷卻效果,所以可以抑制電極PDa因延展性而延展之情況。又,在實施例1~4中,可以確認到下述情形:從切割刀片41的加工點一直到第1切割水噴射口65之間成為以切割水覆蓋切割刃52周邊之所謂的帶動旋轉的狀態,而可以有效率地供給切割水。As can be understood from Table 1, when the angle θ is 35° or more and 45° or less (Examples 1 to 3), and when the angle θ is 90° (Example 4), the inter-electrode distance d changes. If the ratio is larger than the allowable value, good processing quality and device quality can be achieved. The reason for this is that cutting water can be efficiently supplied to the processing point where the
實施例1~3的角度θ是上述實施形態之第1供給路徑68的包含角度θ的實施例,又,實施例4是對應於上述實施形態的第2供給路徑72之實施例。據此,如上述實施形態,藉由通過2條供給路徑68、72從各個切割水噴射口65、66噴射切割水,可以更有效率地進行對加工點之切割水的供給。藉此,可以更進一步提升在加工點的冷卻效果而防止加工中電極PDa延展之情形,且可以謀求加工後的器件品質的提升。The angle θ of Examples 1 to 3 is an example including the angle θ of the
再者,在本發明中,作為加工對象之基板,亦可使用例如其他的封裝基板、半導體器件晶圓、光器件晶圓、半導體基板、無機材料基板、壓電基板等的各種基板。作為半導體器件晶圓,亦可使用器件形成後之矽晶圓或化合物半導體晶圓。作為光器件晶圓,亦可使用器件形成後之藍寶石晶圓或碳化矽晶圓。又,作為封裝基板亦可使用CSP(晶片尺寸封裝,Chip Size Package)基板等的矩形狀的封裝基板,且亦可使用矽或砷化鎵等作為半導體基板,亦可使用藍寶石、陶瓷、玻璃等作為無機材料基板。Furthermore, in the present invention, as the substrate to be processed, various substrates such as other package substrates, semiconductor device wafers, optical device wafers, semiconductor substrates, inorganic material substrates, and piezoelectric substrates can also be used. As the semiconductor device wafer, a silicon wafer or a compound semiconductor wafer after device formation can also be used. As the optical device wafer, a sapphire wafer or a silicon carbide wafer after device formation can also be used. Further, as the package substrate, a rectangular package substrate such as a CSP (Chip Size Package) substrate may be used, silicon, gallium arsenide, or the like may be used as a semiconductor substrate, and sapphire, ceramic, glass, or the like may be used as an inorganic material substrate.
又,雖然在本實施形態中,是設成切割水構成組46的第1流路70及第2流路74為在Z方向上延伸的構成,但並非限定於此構成。各個流路70、74是連接於切割水構成組46外部中的供給軟管76等的供給源,且只要不交叉於目視路徑79,亦可將延伸方向設為相對Z方向而傾斜的方向、或者設成曲線狀地延伸。In addition, in the present embodiment, the
又,雖然在本實施形態中,為了使作業人員易於目視,而將目視路徑79形成為從目視孔78朝向切割刀片41並朝斜下方延伸,但並非限定於此構成。目視路徑79的延伸方向只要形成在與各個切割水噴射口65、66相同的XZ平面上,且不與切割水的供給路線交叉即可,亦可為例如在水平方向上延伸。In addition, in the present embodiment, in order to make it easier for the operator to see, the
又,雖然說明了本發明的實施形態及變形例,但是作為本發明的其他實施形態,亦可為將上述實施形態及變形例整體或部分地組合而成的形態。In addition, although the embodiment and modification of the present invention have been described, as another embodiment of the present invention, the above-described embodiment and modification may be combined in whole or in part.
又,本發明之實施形態並不限定於上述之實施形態,且亦可在不脫離本發明之技術思想的主旨的範圍內進行各種變更、置換、變形。此外,若能經由技術之進步或衍生之其他技術而以其他的方式來實現本發明之技術思想的話,亦可使用該方法來實施。從而,申請專利範圍涵蓋了可包含在本發明之技術思想的範圍內的所有的實施形態。 產業上之可利用性In addition, the embodiment of the present invention is not limited to the above-described embodiment, and various changes, substitutions, and deformations can be made within the scope of not departing from the spirit of the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used to implement. Therefore, the scope of the patent application covers all the embodiments that can be included in the scope of the technical idea of the present invention. industrial availability
如以上說明,本發明具有可以有效率地對切割刀片的加工點供給切割水之效果,特別是對藉由具備有厚度薄的切割刃之切割刀片來切割被加工物的切割裝置而言是有用的。As described above, the present invention has the effect of efficiently supplying cutting water to the processing point of the cutting blade, and is particularly useful for a cutting device for cutting a workpiece with a cutting blade having a thin cutting edge of.
1‧‧‧切割裝置 2‧‧‧殼體 3‧‧‧工作夾台 4‧‧‧切割組件 5‧‧‧片匣 6‧‧‧載置工作台 7‧‧‧導軌 8‧‧‧推拉機構 11‧‧‧第1搬送支臂 12‧‧‧洗淨機構 13‧‧‧第2搬送支臂 14‧‧‧拍攝部 16、18‧‧‧支臂部 17‧‧‧旋轉工作台 21‧‧‧支撐台 22、81‧‧‧側面 24‧‧‧懸臂支撐部 26‧‧‧輸入組件 27‧‧‧監視器 31‧‧‧移動板 32‧‧‧防水蓋 33‧‧‧保持面 41‧‧‧切割刀片 42‧‧‧刀片蓋 42A‧‧‧蓋本體 43‧‧‧主軸殼體 44‧‧‧刀片破損檢測器 45、46‧‧‧切割水構成組 47‧‧‧飛沫蓋 51‧‧‧輪轂基台 52‧‧‧切割刃 53‧‧‧固定螺帽 55、83、87‧‧‧調整螺絲 56‧‧‧固定螺絲 61‧‧‧切割水噴嘴 62、76‧‧‧供給軟管 63‧‧‧狹縫 65‧‧‧第1切割水噴射口 66‧‧‧第2切割水噴射口 68‧‧‧第1供給路徑 69‧‧‧第1連結路徑 70‧‧‧第1流路 72‧‧‧第2供給路徑 73‧‧‧第2連結路徑 74‧‧‧第2流路 78‧‧‧目視孔 79‧‧‧目視路徑 82、86‧‧‧長孔 85‧‧‧前表面 91‧‧‧器件 92‧‧‧貼附膠帶 93‧‧‧環狀框架 C‧‧‧中心 CL‧‧‧鉛直線 D‧‧‧XZ平面 d‧‧‧電極間距離 PD‧‧‧封裝器件 PDa‧‧‧電極 PDb‧‧‧充填樹脂 S‧‧‧箭頭 W‧‧‧被加工物 θ‧‧‧角度 X、Y、Z‧‧‧方向1‧‧‧Cutting device 2‧‧‧Shell 3‧‧‧Working table 4‧‧‧Cutting components 5‧‧‧Cassette 6‧‧‧Place table 7‧‧‧Guide 8‧‧‧Push-pull mechanism 11‧‧‧The first conveying arm 12‧‧‧Cleaning mechanism 13‧‧‧Second conveying arm 14‧‧‧Photography Department 16, 18‧‧‧arm 17‧‧‧Rotary table 21‧‧‧Support 22、81‧‧‧Side 24‧‧‧Cantilever support 26‧‧‧Input Components 27‧‧‧Monitor 31‧‧‧Mobile Board 32‧‧‧Waterproof cover 33‧‧‧Maintaining surface 41‧‧‧Cutting blades 42‧‧‧Blade cover 42A‧‧‧Cap body 43‧‧‧Spindle housing 44‧‧‧Blade breakage detector 45, 46‧‧‧Cut water composition group 47‧‧‧Droplet cover 51‧‧‧Wheel Abutment 52‧‧‧Cutting edge 53‧‧‧Fixing Nut 55, 83, 87‧‧‧Adjustment screw 56‧‧‧Fixing screws 61‧‧‧Cutting water nozzle 62, 76‧‧‧Supply hose 63‧‧‧Slit 65‧‧‧First cutting water jet 66‧‧‧Second cutting water jet 68‧‧‧First supply path 69‧‧‧First Link Path 70‧‧‧First flow path 72‧‧‧Second supply path 73‧‧‧Second Link Path 74‧‧‧Second stream 78‧‧‧Sight hole 79‧‧‧Visual path 82, 86‧‧‧long hole 85‧‧‧Front surface 91‧‧‧Devices 92‧‧‧Attaching tape 93‧‧‧Ring frame C‧‧‧ Center CL‧‧‧Plumb line D‧‧‧XZ plane d‧‧‧Distance between electrodes PD‧‧‧packaged device PDa‧‧‧electrode PDb‧‧‧filling resin S‧‧‧arrow W‧‧‧Processing θ‧‧‧angle X, Y, Z‧‧‧ directions
圖1是本實施形態之切割裝置的立體圖。 圖2是本實施形態之切割組件的立體圖。 圖3是本實施形態之切割組件的平面示意圖。 圖4是本實施形態之切割水構成組的概略立體圖。 圖5是供給孔相對於切割刀片的位置調整的說明圖。 圖6是封裝器件的平面示意圖。FIG. 1 is a perspective view of the cutting device of the present embodiment. FIG. 2 is a perspective view of the cutting assembly of the present embodiment. FIG. 3 is a schematic plan view of the cutting assembly of the present embodiment. FIG. 4 is a schematic perspective view of the cutting water configuration group of the present embodiment. FIG. 5 is an explanatory diagram of position adjustment of the supply hole with respect to the cutting blade. 6 is a schematic plan view of a packaged device.
4‧‧‧切割組件 4‧‧‧Cutting components
41‧‧‧切割刀片 41‧‧‧Cutting blades
42‧‧‧刀片蓋 42‧‧‧Blade cover
42A‧‧‧蓋本體 42A‧‧‧Cap body
45、46‧‧‧切割水構成組 45, 46‧‧‧Cut water composition group
47‧‧‧飛沫蓋 47‧‧‧Droplet cover
52‧‧‧切割刃 52‧‧‧Cutting edge
61‧‧‧切割水噴嘴 61‧‧‧Cutting water nozzle
63‧‧‧狹縫 63‧‧‧Slit
65‧‧‧第1切割水噴射口 65‧‧‧First cutting water jet
66‧‧‧第2切割水噴射口 66‧‧‧Second cutting water jet
68‧‧‧第1供給路徑 68‧‧‧First supply path
69‧‧‧第1連結路徑 69‧‧‧First Link Path
70‧‧‧第1流路 70‧‧‧First flow path
72‧‧‧第2供給路徑 72‧‧‧Second supply path
73‧‧‧第2連結路徑 73‧‧‧Second Link Path
74‧‧‧第2流路 74‧‧‧Second stream
78‧‧‧目視孔 78‧‧‧Sight hole
79‧‧‧目視路徑 79‧‧‧Visual path
81‧‧‧側面 81‧‧‧Side
82、86‧‧‧長孔 82, 86‧‧‧long hole
83、87‧‧‧調整螺絲 83, 87‧‧‧Adjustment screw
85‧‧‧前表面 85‧‧‧Front surface
C‧‧‧中心 C‧‧‧ Center
CL‧‧‧鉛直線 CL‧‧‧Plumb line
D‧‧‧XZ平面 D‧‧‧XZ plane
S‧‧‧箭頭 S‧‧‧arrow
θ‧‧‧角度 θ‧‧‧angle
X、Y、Z‧‧‧方向 X, Y, Z‧‧‧ directions
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