TWI715258B - Display apparatus - Google Patents

Abstract

A display apparatus including a reflective display panel and a micro light emitting diode panel is provided. The display apparatus has a display surface and the reflective display panel has a reflective surface. The micro light emitting diode panel is overlapped with the reflective display panel and includes a driving circuit layer and a plurality of light emitting diode devices. The driving circuit layer is positioned between the reflective display panel and the display surface. The micro light emitting diode devices are electrically bonded to the driving circuit layer. The display surface and the reflective surface are respectively disposed on two opposite sides of the micro light emitting diode devices and the transmittance of the micro light emitting diode panel within a wavelength range of visible light is higher than 50%.

Description

Display device

The present invention relates to a display device, and more particularly to a display device with light emitting diode elements.

With the continuous vigorous development of display technology, in addition to the display performance of display devices, such as resolution, contrast, and frame rate, have been greatly improved, the appearance of display devices has gradually become thinner and lighter. Designs such as flexible and borderless have been developed to meet consumers' needs for visual taste, storage and portability. Among them, the reflective display device achieves the effect of displaying the picture through the irradiation of external ambient light, which can save the configuration of the light source module, which helps to improve the lightness and portability of the reflective display device, and has low energy consumption. The advantages have also prompted the reflective display devices to be widely used in products such as electronic paper, electronic books, or electronic billboards.

However, since the reflective display device needs the illumination of an external light source to produce a display screen, its display effect is more susceptible to the illumination mode of the external ambient light or the viewing position of the user, which causes inconvenience in use. For example: in a slightly dim place, the image of the reflective display device is not clear due to insufficient ambient light irradiation; or in a situation where the directivity of ambient light is high, use The viewing position of the viewer is limited. In other words, the reflective display device has poor adaptability to the operating environment. How to solve the above problems has become an important issue for related manufacturers.

The present invention provides a display device with power saving function, which has better display quality and operational adaptability.

The display device of the present invention has a display surface and includes a reflective display panel and a micro light emitting diode panel. The reflective display panel has a reflective surface. The micro light-emitting diode panel is overlapped and arranged on the reflective display panel, and includes a driving circuit layer and a plurality of light-emitting diode elements. The driving circuit layer is located between the reflective display panel and the display surface. These miniature light-emitting diode elements are electrically connected to the driving circuit layer. The display surface and the reflective surface are respectively located on opposite sides of the micro light emitting diode elements, and the visible light transmittance of the micro light emitting diode panel is greater than 50%.

In an embodiment of the present invention, the reflective display panel of the above-mentioned display device includes a plurality of pixel structures. There is a first period between any two adjacent micro light emitting diode elements, and there is a second period between any two adjacent pixel structures, and the first period is an integer multiple of the second period.

In an embodiment of the present invention, the above-mentioned reflective display panel of the display device includes a plurality of pixel structures superimposed on the display surface, and these pixel structures interact with a plurality of light-emitting diodes in the normal direction of the display surface. The components are staggered.

In an embodiment of the present invention, the above-mentioned micro light emitting diode of the display device The polar body panel further includes multiple pixels. Each of these pixels has at least one miniature light emitting diode element. The number of pixel structures of the reflective display panel is different from the number of pixels of the micro light emitting diode panel.

In an embodiment of the present invention, the number of multiple pixel structures of the reflective display panel of the above-mentioned display device is greater than the number of multiple pixels of the micro light emitting diode panel.

In an embodiment of the present invention, each pixel of the above-mentioned display device has a red micro light emitting diode, a blue micro light emitting diode, and a green micro light emitting diode.

In an embodiment of the present invention, the above-mentioned micro light emitting diode panel of the display device further includes a plurality of dimming patterns. These dimming patterns are overlapped and arranged on a plurality of micro light emitting diode elements, and the micro light emitting diode elements are located between the reflective display panel and the dimming patterns.

In an embodiment of the present invention, the driving circuit layer of the above-mentioned display device includes a plurality of connection pads, which are overlapped and arranged on a plurality of micro light emitting diode elements. The miniature light-emitting diode elements are connected to the connection pads, and the connection pads are a plurality of dimming patterns.

In an embodiment of the present invention, the above-mentioned display device further includes a touch element layer. The touch element layer is overlapped and arranged on the reflective display panel and the micro light emitting diode panel, and the micro light emitting diode panel is located between the touch element layer and the reflective display panel.

In an embodiment of the present invention, the above-mentioned display device further includes a touch element The piece layer is arranged between the display surface and the micro light emitting diode element. The touch element layer includes driving electrodes and sensing electrodes.

In an embodiment of the present invention, the aforementioned micro light emitting diode panel of the display device further includes a substrate. The touch element layer is disposed on the first surface of the substrate, and the driving circuit layer is on the touch element layer.

In an embodiment of the present invention, the substrate of the micro light emitting diode panel of the aforementioned display device is provided with a display surface, and the display surface is opposite to the first surface.

In an embodiment of the present invention, the aforementioned micro light emitting diode panel of the display device further includes a substrate. The driving circuit layer is arranged on the first surface of the substrate. These micro light emitting diode elements are joined on the driving circuit layer, and the substrate and the driving circuit layer are located between the reflective display panel and the plurality of micro light emitting diode elements.

In an embodiment of the present invention, the above-mentioned micro light emitting diode panel of the display device further includes a plurality of dimming patterns. These dimming patterns are overlapped and arranged on a plurality of micro light emitting diode elements, and the micro light emitting diode elements are located between the reflective display panel and the dimming patterns.

In an embodiment of the present invention, when the above-mentioned display device is operated in the light source mode, the micro light emitting diode panel provides the light source to the reflective display panel. When operating in the display mode, the micro light emitting diode panel is a display panel.

In an embodiment of the present invention, when the above-mentioned display device is operated in the mixed mode, the micro light emitting diode panel and the reflective display panel respectively display different images.

Based on the above, in the display device of an embodiment of the present invention, the The configuration relationship between the photodiode panel and the reflective display panel can increase the operational flexibility of the reflective display panel, and help improve the operational adaptability of the display device to different usage scenarios. On the other hand, the transmittance of the LED panel is greater than 50%, which can effectively reduce the external ambient light and the light energy loss of the light beam reflected by the self-reflective display panel after passing through the LED panel, thereby increasing The light energy usage rate of the display device helps to improve the overall display quality.

10, 10A, 11, 11A, 12, 13, 20, 21: display device

100: reflective display panel

100A: Absorption surface

100R: reflective surface

105, 105A: display medium layer

110: Microcapsule

120: Electronic ink

121: white particles

122: black particles

123: Transparent liquid

130: third electrode

140: Fourth electrode

200, 200-1, 200A, 200B, 200C: Mini LED panel

201, 202: substrate

201a: first surface

201b: second surface

202a: third surface

202b: fourth surface

210, 210A: drive circuit layer

215, 215A, 215B: connection pad

220, 220A, 220-1: miniature light-emitting diode components

221: first electrode

222: second electrode

223: first type semiconductor layer

224: light-emitting layer

225: second type semiconductor layer

230, PL: flat layer

240: encapsulation layer

250: Dimming pattern

300, 300A: Touch element layer

301: Substrate

310, 310A: drive electrode

320, 320A: sensing electrode

AX1, AX2: central axis

D: Dip pole

DS: display surface

ES: epitaxial structure

G: Gate

GI: Gate insulation layer

LB1, LB2, LB1a, LB2a, LB3a, LB4a: beam

P1: First cycle

P2: second cycle

PX: Pixel structure

S: source

SC: Semiconductor pattern

T: Active component

FIG. 1 is a schematic diagram of a display device according to a first embodiment of the invention.

2A to 2C are cross-sectional views of partial regions of the display device of FIG. 1 in different operation modes.

FIG. 3 is a top view of a display device according to a second embodiment of the invention.

4 is a cross-sectional view of a display device according to a third embodiment of the invention.

Fig. 5 is a cross-sectional view of a display device according to a fourth embodiment of the present invention.

Fig. 6 is a cross-sectional view of a display device according to a fifth embodiment of the present invention.

Fig. 7 is a cross-sectional view of a display device according to a sixth embodiment of the present invention.

Fig. 8 is a cross-sectional view of a display device according to a seventh embodiment of the present invention.

Fig. 9 is a cross-sectional view of a display device according to an eighth embodiment of the present invention.

In the drawings, the layers, films, panels, regions are exaggerated for clarity And other thickness. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connection" can refer to physical and/or electrical connection. Furthermore, "electrical connection" can mean that there are other components between the two components.

Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.

FIG. 1 is a schematic diagram of a display device according to a first embodiment of the invention. 2A to 2C are cross-sectional views of partial regions of the display device of FIG. 1 in different operation modes. FIG. 3 is a top view of a display device according to a second embodiment of the invention. In particular, for the sake of clarity, FIG. 3 only shows the display medium layer 105 and the micro light emitting diode element 220-1 of the display device 10A.

Please refer to FIG. 1, the display device 10 includes a reflective display panel 100 and a micro light emitting diode panel 200. In this embodiment, the reflective display panel 100 is, for example, an electrophoretic display (EPD) panel, but the invention is not limited thereto. In other embodiments, the reflective display panel may also be a cholesterol liquid crystal (CLC) panel, a reflective LCD panel, an electrowetting display (EWD) panel, or a fast response liquid crystal panel. Display (quick response-liquid powder display, QR-LPD) panel.

In particular, the display device 10 can have multiple operation modes, and according to the operation mode of the micro light emitting diode panel 200, it can be divided into a light source mode, a display mode, and a mixed mode. For example, when the display device 10 (or the micro light emitting diode panel 200) is operated in the light source mode, the micro light emitting diode panel 200 provides the light source to the reflective display panel 100; when the display device 10 (or the micro light emitting diode panel 200) When the diode panel 200) is operated in the display mode, the micro light emitting diode panel 200 is a display panel. However, the present invention is not limited to this. According to other embodiments, the display device can also be operated in a mixed mode. In this case, the reflective display panel and the micro light emitting diode panel display different images respectively. On the other hand, when the micro light emitting diode panel 200 is not enabled, the display device 10 can present the display image of the reflective display panel 100 through the illumination of external ambient light.

An adhesive layer (not shown) can be optionally provided between the reflective display panel 100 and the micro LED panel 200 to connect the reflective display panel 100 and the micro LED panel 200. For example, the adhesive layer may be Pressure Sensitive Adhesive (PSA), Optically Clear Adhesive (OCA), photosensitive water glue (UV glue), or optical clear resin (Optical Clear Resin, OCR). ). In this embodiment, the adhesive layer can overlap the reflective display panel 100 and the micro light emitting diode panel 200 over the entire surface. That is, the reflective display panel 100 and the micro light emitting diode panel 200 can be combined in a direct bond manner. It should be noted that the present invention does not limit the joining method between the two panels. For example, the reflective display panel 100 can also be connected to the micro light emitting diode panel 200 through other suitable components, such as a frame assembly. system.

Furthermore, the reflective display panel 100 has a reflective surface 100R, and the micro light emitting diode panel 200 is overlapped and arranged on the side of the reflective display panel 100 where the reflective surface 100R is provided. Specifically, external environmental light can penetrate the micro light emitting diode panel 200 and be incident on the reflective surface 100R of the reflective display panel 100. Then, after being reflected by the reflective surface 100R and passing through the micro light emitting diode panel 200 again, the display device 10 is emitted from the display surface DS to display the image to be played by the reflective display panel 100. In particular, the visible light transmittance through the micro light emitting diode panel 200 is greater than 50%, which can effectively reduce the light energy loss of the external ambient light after passing through the light emitting diode panel, thereby increasing the light energy of the display device 10. Utilization rate helps to improve the overall display quality.

2A, in this embodiment, the micro light emitting diode panel 200 includes a substrate 201, a driving circuit layer 210, and a plurality of micro light emitting diode elements 220. The substrate 201 has a first surface 201 a and a second surface 201 b opposite to each other. The first surface 201 a faces the reflective surface 100R of the reflective display panel 100, and the second surface 201 b can define the display surface DS of the display device 10. The driving circuit layer 210 is disposed on the first surface 201 a of the substrate 201 and has a plurality of connection pads 215. A plurality of micro light emitting diode elements 220 are disposed on the driving circuit layer 210 and are electrically connected to the connection pads 215 respectively. In other words, the display surface DS and the reflective surface 100R are located on opposite sides of the micro light emitting diode element 220 respectively.

For example, the micro light emitting diode device 220 includes an epitaxial structure ES, a first electrode 221 and a second electrode 222. In this embodiment, the first electrode 221 and the The two electrodes 222 can be respectively disposed on opposite sides of the epitaxial structure ES, and are electrically connected to the epitaxial structure ES; that is, the micro light emitting diode element 220 of this embodiment can be a vertical type light emitting diode. Polar body. However, the present invention is not limited to this. According to other embodiments, the light-emitting diode device can also be adjusted to flip-chip type or lateral type light-emitting diode according to actual design requirements, and Such a light emitting diode device may optionally include an insulating layer, and the first electrode and the second electrode located on the same side of the epitaxial structure penetrate the insulating layer to electrically connect the epitaxial structure.

More specifically, the vertical projection of the micro light emitting diode element 220 on the substrate 201 of this embodiment has a length, and the length is between 3 μm and 60 μm. For example, the length of the vertical micro light emitting diode device can be between 3 μm and 15 μm, and the length of the flip chip or horizontal type micro light emitting diode device can be between 15 μm and 60 μm. On the other hand, the micro light emitting diode device has a thickness in the normal direction of the substrate 201, and the thickness is between 5 μm and 10 μm.

Furthermore, the plurality of micro light emitting diode elements 220 can define a plurality of pixels of the micro light emitting diode panel 200. In this embodiment, each micro light emitting diode element 220 can be defined as a pixel of the micro light emitting diode panel 200, but the invention is not limited thereto. In other embodiments, the number of micro light emitting diode elements 220 included in each pixel of the micro light emitting diode panel can also be more than two. For example, in one embodiment, each pixel includes three micro light-emitting diodes (micro light-emitting diode, Micro LED), each of which is red Color micro light emitting diodes, blue micro light emitting diodes and green micro light emitting diodes.

On the other hand, the miniature light-emitting diode device 220 is electrically connected to the driving circuit layer 210 through the connection pad 215. In this embodiment, the micro light emitting diode panel 200 may further include a flat layer 230 covering the epitaxial structure ES, and the plurality of second electrodes 222 of the plurality of micro light emitting diode elements 220 extend on the flat layer 230. They are connected to each other and form a common electrode, but the invention is not limited to this. The material of the flat layer 230 includes inorganic materials (for example: silicon oxide, silicon nitride, silicon oxynitride, spin on glass (SOG), other suitable materials, or a stacked layer of at least two of the above materials), organic Materials, or other suitable materials, or a combination of the above.

The epitaxial structure ES may include a first-type semiconductor layer 223, a light-emitting layer 224, and a second-type semiconductor layer 225. The first type semiconductor layer 223 and the second type semiconductor layer 225 are respectively located on opposite sides of the light emitting layer 224, and are electrically connected to the first electrode 221 and the second electrode 222, respectively. In this embodiment, the first-type semiconductor layer 223 is, for example, a P-type semiconductor, the second-type semiconductor layer 225 is, for example, an N-type semiconductor, and the light-emitting layer 224 may be a multiple quantum well (MWQ) layer, but not Limit this.

For example, when the micro light emitting diode panel 200 is enabled, the first electrode 221 may have a high potential, and the second electrode 222 may have a ground potential (Ground) or a low potential. The current generated through the potential difference between the first electrode 221 and the second electrode 222 enables the corresponding epitaxial structure ES and emits (visible) light bundle. More specifically, the micro light emitting diode panel 200 can be controlled by the active components of the driving circuit layer 210. For example, the plurality of first electrodes 221 have substantially the same high potential respectively, so that the epitaxial structure ES emits The light beams with roughly the same intensity then form a uniform illumination light source; or the multiple first electrodes 221 have different high potentials respectively, so that these epitaxial structures ES emit light beams of different intensities due to different driving currents. In turn, an image frame is formed to be seen by the human eye.

In this embodiment, the first electrode 221 and the second electrode 222 are, for example, light-transmitting electrodes, and the material of the light-transmitting electrodes includes metal oxides, such as indium tin oxide, indium zinc oxide, and aluminum tin. Oxide, aluminum zinc oxide, or other suitable oxides, or a stacked layer of at least two of the above. However, the present invention is not limited to this. In other embodiments, the first electrode 221 may also be a reflective electrode. The material of the reflective electrode includes metals, alloys, nitrides of metallic materials, oxides of metallic materials, and metallic materials. Nitrogen oxide, or other suitable materials, or stacked layers of metal materials and other conductive materials.

In this embodiment, the micro light emitting diode element 220 may also optionally include an encapsulation layer 240 to cover the second electrode 222 of the micro light emitting diode element 220. The material of the encapsulation layer 240 may include silicon nitride, aluminum oxide, aluminum carbide oxynitride, silicon oxynitride, acrylic resin, hexamethyldisiloxane (HMDSO) or glass.

Further, the reflective display panel 100 may include a display medium layer 105 overlapping the display surface DS, a plurality of third electrodes 130 and a plurality of fourth electrodes 140, and the third electrode 130 and the fourth electrode 140 are located on the display medium respectively. Layer 105 Opposite sides. For example, the display medium layer 105 may include a plurality of microcapsules 110 and electronic ink 120 filled in the microcapsules 110. These microcapsules 110 may respectively correspond to a plurality of third electrodes 130 (or fourth electrodes 140). The electronic ink 120 may optionally include a plurality of white particles 121, a plurality of black particles 122 and a transparent liquid 123, and one of the white particles 121 and the black particles 122 may be positively charged and the other negatively charged. However, the present invention is not limited to this. In some embodiments, the electronic ink may also include charged particles of multiple different colors.

In particular, the microcapsule 110, the electronic ink 120, and the corresponding third electrode 130 and the fourth electrode 140 can define the pixel structure PX of the reflective display panel 100. In this embodiment, the number of pixel structures PX of the reflective display panel 100 can be selectively different from the number of pixels of the micro light emitting diode panel 200. For example, the number of pixel structures PX of the reflective display panel 100 may be more than the number of pixels of the micro light emitting diode panel 200, but the invention is not limited thereto. In other embodiments, the number of pixel structures PX of the reflective display panel may also be substantially equal to the number of pixels of the micro light emitting diode panel.

When the reflective display panel 100 is enabled, one of the third electrode 130 and the fourth electrode 140 of each pixel structure PX can have a positive potential, and the other has a negative potential. For example, when the white particles 121 of the electronic ink 120 are negatively charged, the third electrode 130 of the pixel structure PX has a positive potential, so that the white particles 121 can move toward the side of the microcapsule 110 that is adjacent to the third electrode 130. Accumulation; In contrast, since the fourth electrode 140 of the pixel structure PX has a negative potential, the positively charged black particles 122 will move toward the fourth electrode 140 and accumulate near the microcapsule 110 One side of the third electrode 130. At this time, a side surface of the microcapsule 110 of the pixel structure PX adjacent to the third electrode 130 can define the reflective surface 100R of the reflective display panel 100. Conversely, when the third electrode 130 of the pixel structure PX has a negative potential, the positively charged black particles 122 move toward the third electrode 130 and accumulate on the side of the microcapsule 110 adjacent to the third electrode 130; at this time, the pixel The side of the microcapsule 110 with the PX structure adjacent to the third electrode 130 can define the absorption surface 100A of the reflective display panel 100.

In this embodiment, the third electrode 130 and the fourth electrode 140 are, for example, light-transmissive electrodes, and the material of the light-transmissive electrodes includes metal oxides, such as indium tin oxide, indium zinc oxide, and aluminum tin. Oxide, aluminum zinc oxide, or other suitable oxides, or a stacked layer of at least two of the above. However, the present invention is not limited to this. In other embodiments, the fourth electrode 140 may be a reflective electrode, and the material of the reflective electrode includes metals, alloys, nitrides of metallic materials, oxides of metallic materials, and metallic materials. Oxynitride, or other suitable materials, or stacked layers of metal materials and other conductive materials.

Furthermore, the micro light emitting diode element 220 and the pixel structure PX have a central axis AX1 and a central axis AX2, respectively. In this embodiment, the multiple central axes AX1 of the multiple micro light emitting diode elements 220 are offset from the central axes AX2 of the multiple pixel structures PX in the normal direction of the display surface DS (ie, the second surface 201b). Accordingly, it is possible to improve the moiré generated by the visually superimposed periodic structures of the two panels. however. The present invention is not limited to this. In other embodiments, the multiple central axes AX1 of the multiple micro light emitting diode elements 220 may also coincide with the multiple central axes AX1 of the multiple pixel structures PX; that is, the micro light emitting Two poles The body element 220 may be aligned with the corresponding pixel structure PX.

On the other hand, there is a first period P1 between any two adjacent micro light emitting diode elements 220 (that is, the central axis AX1) of the micro light emitting diode panel 200, and any two adjacent pictures of the reflective display panel 100 There is a second period P2 between the prime structures PX (ie, the central axis AX2), and the first period P1 is an integer multiple of the second period P2. For example, in this embodiment, the first period P1 of the plurality of micro light emitting diode elements 220 is four times the second period P2 of the plurality of pixel structures PX. However, the present invention is not limited to this. According to other embodiments, the multiple relationship between the first period P1 of the plurality of micro light emitting diode elements 220 and the second period P2 of the plurality of pixel structures PX can also be based on actual design requirements ( For example, the size of the lighting area, the resolution of the light emitting diode panel, or the viewing angle requirements of the display device) can be adjusted to more than one time, two times, three times, or five times.

The various operation modes of the display device 10 will be described below. Please continue to refer to FIG. 2A. When the operating environment of the display device 10 is brighter, only the reflective display panel 100 is enabled to form a reflective surface 100R (or absorbing surface 100A) distribution corresponding to the display screen, and transmits through the outside The ambient light is irradiated to form a corresponding image beam which is seen by the human eye. For example, the external environment light source can provide multiple light beams. When the light beam LB1 is incident on the micro light emitting diode panel 200 and transmitted to the display medium layer 105 of the reflective display panel 100, it can be transmitted by the electrons of a pixel structure PX. The ink 120 is stacked on the microcapsule 110 and is reflected by a plurality of white particles 121 on the side adjacent to the third electrode 130 and forms a corresponding image beam; while the other beam LB2 can be transmitted to another pixel structure PX by this pixel Structure PX electronic ink 120 stacking The black particles 122 on the side of the microcapsule 110 adjacent to the third electrode 130 are absorbed and cannot be emitted from the reflective display panel 100. In particular, since the penetration rate of the micro light emitting diode panel 200 is greater than 50%, the light energy loss of the light beam after passing through the micro light emitting diode panel 200 can be effectively reduced, thereby increasing the light energy usage rate of the display device 10 , Which helps to improve the overall display quality.

2B, when the operating environment of the display device 10 is dim or the directivity of the external ambient light is high, in order to increase the visibility of the reflective display panel 100, the micro light emitting diode panel 200 can be enabled As an auxiliary light source. In other words, when the display device 10 is operating in the light source mode, the micro light emitting diode panel 200 provides the light source to the reflective display panel 100. For example, when the light beam LB1a emitted by the micro light emitting diode element 220 is transmitted to the display medium layer 105 of the reflective display panel 100, it can be deposited by the electronic ink 120 of a pixel structure PX on the microcapsule 110 adjacent to the third The multiple white particles 121 on one side of the electrode 130 reflect and form a corresponding image beam; while the other beam LB2a is transmitted to another pixel structure PX, it can be deposited in the microcapsule by the electronic ink 120 of this pixel structure PX The black particles 122 on the side of 110 adjacent to the third electrode 130 are absorbed and cannot be emitted from the reflective display panel 100.

In particular, since the first electrode 221 of this embodiment is a reflective electrode, the light beam LB3a emitted by the micro light emitting diode element 220 toward the first electrode 221 can be reflected to the display medium layer 105 to form an image light beam (or absorbed). On the other hand, when the micro light emitting diode panel 200 is used as an auxiliary light source, the light beam intensity provided by the multiple micro light emitting diode elements 220 is substantially the same, but the present invention does not This is limited. In other embodiments, the plurality of miniature light-emitting diode elements 220 may also provide illumination beams of different intensities corresponding to the pixel gray scale distribution of the reflective display panel 100 to achieve local dimming. Effect, thereby enhancing the (dynamic) contrast performance of the display device.

Furthermore, when the micro light emitting diode panel 200 of the display device 10 is used as a display panel, the pixel structure PX in the partial area where the reflective display panel 100 overlaps the micro light emitting diode element 220 can define the reflection The reflective surface 100R of the reflective display panel 100 (that is, this local area is the reflective area of the reflective display panel 100), and the pixel structure PX located outside the local area defines the absorption surface 100A of the reflective display panel 100. As shown in Figure 2C. In other words, when the micro light emitting diode panel 200 is used as a display panel, the reflective display panel 100 may have multiple reflective areas and multiple light-absorbing areas, and the reflective areas and light-absorbing areas are alternately arranged.

In accordance with the above, the plurality of micro light emitting diode elements 220 can emit light beams of different intensities (ie, image light beams), which are respectively reflected by a plurality of reflective areas of the reflective display panel 100 and then transmitted to the user to form a display screen. In this embodiment, the reflective display panel 100 may be provided with two pixel structures PX in a partial area corresponding to the micro light emitting diode element 220, but the invention is not limited to this. In other embodiments, the number of pixel structures PX in this local area can also be adjusted according to actual design requirements (for example, the resolution of the reflective display panel or the viewing angle range of the display device).

In particular, due to the arrangement of the micro light emitting diode 220 The period is longer than the arrangement period of the pixel structure PX, and the display resolution of the micro light emitting diode panel 200 can be smaller than that of the reflective display panel 100 to meet the minimum display requirements, but the invention is not limited to this. In other embodiments, as shown in FIG. 3, at least one micro light emitting diode element 220-1 is provided between any two adjacent microcapsules 110 of the reflective display panel 100. In other words, the display resolution of the micro light emitting diode panel 200-1 of the display device 10A may also be substantially equal to the display resolution of the reflective display panel 100 or greater than the display resolution of the reflective display panel 100.

Other embodiments will be listed below to describe the disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and will not be repeated hereafter.

4 is a cross-sectional view of a display device according to a third embodiment of the invention. Please refer to FIG. 4, the main difference between the display device 11 of this embodiment and the display device 10 of FIG. 2C is that the composition of the connection pad is different. In this embodiment, the connection pad 215A of the driving circuit layer 210 may have a specific transparency (transparency), for example, a light transmittance of less than 50%; that is, the connection pad 215A of this embodiment can be used as a dimming pattern. Specifically, when the micro light emitting diode panel 200A is used as a display panel, the light beam LB4a emitted from the micro light emitting diode element 220 toward the connection pad 215A may be directly transmitted to the user through the connection pad 215A. Accordingly, it is possible to further increase the light energy utilization rate when the micro light emitting diode panel 200A is used for display. Furthermore, the display device 11 can also be operated in a mixed mode. At this time, the micro light emitting diode panel 200A and the reflective display panel 100 respectively display different images (not shown Illustrated).

In particular, when the micro light emitting diode panel 200A is used as an illumination light source, the micro light emitting diode element 220 can provide an illumination beam with a relatively small light output power. Therefore, the light beam LB4a transmitted toward the outside is not easily noticed by the user after passing through the dimming pattern (ie, the connection pad 215A), which can reduce the visibility of the light source (ie, the micro light emitting diode element 220). However, the present invention is not limited to this. According to other unshown embodiments, the dimming pattern can also be another member different from the connection pad, and the light-emitting diode element can be located between the reflective display panel and the dimming pattern. .

Fig. 5 is a cross-sectional view of a display device according to a fourth embodiment of the present invention. Referring to FIG. 5, the main difference between the display device 11A of this embodiment and the display device 11 of FIG. 4 lies in the different types of micro light emitting diode elements and the different configurations of the dimming patterns. In this embodiment, the miniature light-emitting diode element 220A is, for example, a lateral type (lateral type) miniature light-emitting diode or a flip-chip type (flip-chip type) miniature light-emitting diode, and is electrically connected to the driving circuit layer. Two connection pads 215B of 210A.

Furthermore, the driving circuit layer 210A of the micro light emitting diode panel 200B has a plurality of active elements T, and the method of forming the active elements T may include: sequentially forming gate electrodes G and gate electrodes on the first surface 201a of the substrate 201 The insulating layer GI, the semiconductor pattern SC, the source S and the drain D, and the flat layer PL, wherein a connection pad 215B electrically connected to the micro light emitting diode device 220A penetrates the flat layer PL to electrically connect the drain of the active device T Extreme D. For example, the active device T of the driving circuit layer 210A can be used to control the driving current of the micro light emitting diode device 220A, but it is not limited thereto.

It is worth mentioning that the drain D of the active device T and the connection pad 215B of this embodiment can have specific transparency respectively; that is, the drain D and the connection pad 215B of the active device T can be used as Dimming pattern. However, the present invention is not limited to this. In other embodiments, the source S or the gate G of the active device can also be used as the dimming pattern according to the arrangement relationship between the active device and the micro light emitting diode device. It should be noted that the gate electrode G, the source electrode S, the drain electrode D, the gate insulating layer GI, and the flat layer PL can be used for any gate electrode of the active device array substrate, which is well known to those skilled in the art. , Any source, any drain, any gate insulating layer, and any flat layer are implemented, and the gate G, source S, drain D, gate insulating layer GI and flat layer PL can be implemented by any It is formed by any method well known to those with ordinary knowledge in the technical field, so it will not be repeated here.

Fig. 6 is a cross-sectional view of a display device according to a fifth embodiment of the present invention. Please refer to FIG. 6, the main difference between the display device 12 of this embodiment and the display device 11 of FIG. 4 is that the composition and configuration of the micro light emitting diode panel are different. In this embodiment, the micro light emitting diode panel 200C may further include a substrate 202 and a plurality of dimming patterns 250. The dimming patterns 250 are disposed on the third surface 202a of the substrate 202, and are overlapped on the plurality of micro light emitting diode elements 220A. The third surface 202a of the substrate 202 faces the reflective display panel 100, and the fourth surface 202b of the substrate 202 relative to the third surface 202a can define the display surface DS of the display device 12. In other words, the substrate 201 and the driving circuit layer 210A may be located between the reflective display panel 100 and the micro light emitting diode device 220A.

In this embodiment, the miniature light-emitting diode element 220A is, for example, a horizontal type A (lateral type) micro light emitting diode or flip-chip type micro light emitting diode is electrically connected to the two connection pads 215B of the driving circuit layer 210A. In this embodiment, the connection pad 215B and the light-reducing pattern 250 of the micro light-emitting diode panel 200C may have specific transparency respectively. For example, the light transmittance of the connection pad 215B of the driving circuit layer 210A may be greater than the light transmittance of the dimming pattern 250 to improve the performance of the micro light emitting diode panel 200C as the light source (that is, when the display device 12 is operating in the light source mode) Light energy usage rate. On the other hand, since the type of the micro light emitting diode element 220A of this embodiment is different from the type of the micro light emitting diode element 220 (for example, vertical micro light emitting diode) of FIG. 4, the micro light emitting diode panel 200C It may not have the flat layer 230 and the encapsulation layer 240 as shown in FIG. 4.

Fig. 7 is a cross-sectional view of a display device according to a sixth embodiment of the present invention. Referring to FIG. 7, the main difference between the display device 13 of this embodiment and the display device 10 of FIG. 2B is that the composition of the reflective display panel is different. In this embodiment, the display medium layer 105A of the reflective display panel 100A may be a liquid crystal layer and is sandwiched between the third electrode 130A and the fourth electrode 140. In other words, the reflective display panel 100A of this embodiment is a reflective liquid crystal display panel, and the surface 100Ra of the fourth electrode 140 can define the reflective surface of the reflective display panel 100A. On the other hand, the reflective display panel 100A further includes a polarizer 150 disposed between the third electrode 130A and the micro light emitting diode panel 200.

For example, the light beams LB1 and LB2 from the outside, and the light beams LB1a and LB3a from the micro light emitting diode element 220 are polarized after passing through the polarizer 150. Then, after passing through the display medium layer 105A, these light beams pass through the fourth The electrode 140 reflects and passes through the display medium layer 105A to the polarizer 150 again. At this time, the polarization states of the light beam LB1, the light beam LB1a, and the light beam LB3a are not orthogonal to the transmission axis (not shown) of the polarizer 150 but can partially (or completely) pass through the polarizer 150; on the contrary, the light beam LB2 The polarization state of is perpendicular to the transmission axis of the polarizer 150 and is absorbed by the polarizer 150.

FIG. 8 is a cross-sectional view of a partial area of a display device according to a seventh embodiment of the present invention. Please refer to FIG. 8. The main difference between the display device 20 of this embodiment and the display device 10 of FIG. 1 (or FIG. 2A) is that the display device 20 of this embodiment further includes a touch element layer 300. The touch element layer 300 is overlapped and disposed on the reflective display panel 100 and the micro light emitting diode panel 200, and the micro light emitting diode panel 200 is located between the reflective display panel 100 and the touch element layer 300.

In this embodiment, the touch element layer 300 may include a substrate 301 and driving electrodes 310 and sensing electrodes 320 disposed on opposite sides of the substrate 301, but the invention is not limited thereto. For example, the driving electrode 310 and the sensing electrode 320 can be used to transmit a driving pulse signal and a sensing signal, respectively, to achieve the effect of multi-touch sensing, but the invention is not limited thereto. In this embodiment, the driving electrode 310 and the sensing electrode 320 are, for example, light-transmissive electrodes, and the material of the light-transmissive electrodes includes metal oxides, such as indium tin oxide, indium zinc oxide, and aluminum tin oxide. Or other suitable oxides, or a stacked layer of at least two of the above.

Fig. 9 is a cross-sectional view of a display device according to an eighth embodiment of the present invention. Please refer to FIG. 9, the main difference between the display device 21 of this embodiment and the display device 20 of FIG. 8 is that the configuration of the touch element layer is different. In this embodiment, the touch element layer The driving electrode 310A and the sensing electrode 320A of 300A are disposed on the first surface 201a of the substrate 201. The driving circuit layer 210 is located on the touch element layer 300A, and the driving electrode 310A (or the sensing electrode 320A) does not overlap the micro light emitting diode element 220 in the normal direction of the first surface 201a. Accordingly, the overall thickness of the display device 21 with touch function can be further reduced. In this embodiment, the driving electrode 310A and the sensing electrode 320A can selectively belong to the same film layer, but the invention is not limited thereto.

In summary, in the display device of an embodiment of the present invention, the configuration relationship between the light-emitting diode panel and the reflective display panel can increase the operational flexibility of the reflective display panel, and help improve the display Operational adaptability of the context of use. On the other hand, the transmittance of the LED panel is greater than 50%, which can effectively reduce the external ambient light and the light energy loss of the light beam reflected by the self-reflective display panel after passing through the LED panel, thereby increasing The light energy usage rate of the display device helps to improve the overall display quality.

10: Display device 100: reflective display panel 100R: reflective surface 105: display medium layer 110: Microcapsule 120: Electronic ink 121: White particles 122: black particles 123: Transparent liquid 130: Third electrode 140: Fourth electrode 200: Mini LED panel 201: Substrate 201a: First surface 201b: second surface 210: Drive circuit layer 215: Connection pad 220: Miniature LED components 221: First electrode 222: Second electrode 230: Flat layer 240: Encapsulation layer DS: Display surface LB1a, LB2a, LB3a: beam PX: Pixel structure

Claims (16)

A display device having a display surface, the display device comprising: A reflective display panel having a reflective surface; and A miniature light-emitting diode panel is overlapped and arranged on the reflective display panel, the miniature light-emitting diode panel is provided with the display surface, and includes: A driving circuit layer located between the reflective display panel and the display surface; and A plurality of miniature light-emitting diode elements are electrically connected to the driving circuit layer, The display surface and the reflective surface are respectively located on opposite sides of the micro light emitting diode elements, and the visible light transmittance of the micro light emitting diode panel is greater than 50%. According to the display device described in claim 1, wherein the reflective display panel includes a plurality of pixel structures, and any two adjacent micro light-emitting diode elements have a first period between any two phases. There is a second period between the adjacent pixel structures, and the first period is an integer multiple of the second period. As for the display device described in claim 1, wherein the reflective display panel includes a plurality of pixel structures overlapped on the display surface, and the pixel structures are aligned with the display surface in the normal direction of the display surface. The micro light emitting diode elements are staggered. The display device according to item 3 of the scope of patent application, wherein the micro light emitting diode panel further includes: Each pixel has at least one micro light emitting diode element, wherein the number of the pixel structures of the reflective display panel is different from the number of the pixels of the micro light emitting diode panel. According to the display device described in claim 4, the number of the pixel structures of the reflective display panel is more than the number of the pixels of the micro light emitting diode panel. According to the display device described in item 4 of the scope of patent application, each pixel has a red micro light emitting diode, a blue micro light emitting diode, and a green micro light emitting diode. According to the display device described in item 1 of the scope of patent application, the miniature light-emitting diode panel further includes: A plurality of dimming patterns are overlapped and arranged on the micro light emitting diode elements, and the micro light emitting diode elements are located between the reflective display panel and the dimming patterns. According to the display device described in item 7 of the scope of patent application, the driving circuit layer includes: A plurality of connection pads are overlapped and arranged on the micro light emitting diode devices, wherein the micro light emitting diode devices are bonded to the connection pads, and the connection pads are the light reduction patterns. The display device described in item 1 of the scope of patent application further includes: A touch element layer is arranged to overlap the reflective display panel and the micro light emitting diode panel, wherein the micro light emitting diode panel is located between the touch element layer and the reflective display panel. According to the display device described in item 1 of the scope of patent application, the miniature light-emitting diode panel further includes: A touch element layer is arranged between the display surface and the micro light emitting diode elements, and the touch element layer includes a driving electrode and a sensing electrode. The display device according to claim 10, wherein the micro light-emitting diode panel further includes a substrate, the touch element layer is disposed on a first surface of the substrate, and the driving circuit layer is located on the touch On the component layer. According to the display device described in claim 11, the substrate of the micro light emitting diode panel is provided with the display surface, and the display surface is opposite to the first surface. According to the display device described in claim 1, wherein the micro light emitting diode panel further includes a substrate, the driving circuit layer is disposed on a first surface of the substrate, and the micro light emitting diode elements are bonded On the driving circuit layer, the substrate and the driving circuit layer are located between the reflective display panel and the miniature light-emitting diode elements. The display device according to claim 13, wherein the micro light emitting diode panel further includes a plurality of dimming patterns, which are overlapped and arranged on the micro light emitting diode elements, and the micro light emitting diode elements Located between the reflective display panel and the dimming patterns. As for the display device described in claim 1, wherein when operating in a light source mode, the micro light emitting diode panel provides a light source to the reflective display panel, and when operating in a display mode, the micro light emitting diode The polar body panel serves as a display panel. According to the display device described in claim 15, wherein when operating in a hybrid mode, the micro light emitting diode panel and the reflective display panel display different images respectively.

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