TWI636102B - 被覆劑及積層體 - Google Patents
被覆劑及積層體 Download PDFInfo
- Publication number
- TWI636102B TWI636102B TW103143410A TW103143410A TWI636102B TW I636102 B TWI636102 B TW I636102B TW 103143410 A TW103143410 A TW 103143410A TW 103143410 A TW103143410 A TW 103143410A TW I636102 B TWI636102 B TW I636102B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- meth
- acrylate
- coating agent
- group
- Prior art date
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- 238000000576 coating method Methods 0.000 title claims abstract description 64
- 239000011248 coating agent Substances 0.000 claims abstract description 98
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 58
- 150000003077 polyols Chemical class 0.000 claims abstract description 54
- 239000000203 mixture Substances 0.000 claims abstract description 52
- 125000003118 aryl group Chemical group 0.000 claims abstract description 45
- 229920005862 polyol Polymers 0.000 claims abstract description 42
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 39
- 239000003822 epoxy resin Substances 0.000 claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 30
- 239000002253 acid Substances 0.000 claims abstract description 26
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 239000011342 resin composition Substances 0.000 claims abstract description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 21
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 21
- 239000012736 aqueous medium Substances 0.000 claims abstract description 13
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 8
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 15
- 229920005906 polyester polyol Polymers 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 125000002947 alkylene group Chemical group 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 claims description 4
- 230000000717 retained effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 53
- 150000001718 carbodiimides Chemical class 0.000 abstract description 10
- 239000000126 substance Substances 0.000 abstract description 10
- 150000005846 sugar alcohols Polymers 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 85
- 239000010408 film Substances 0.000 description 73
- -1 polyethylene terephthalate Polymers 0.000 description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 20
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 18
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000004925 Acrylic resin Substances 0.000 description 11
- 229920006267 polyester film Polymers 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 238000005886 esterification reaction Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 125000001931 aliphatic group Chemical group 0.000 description 8
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 125000000129 anionic group Chemical group 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 6
- 230000032050 esterification Effects 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000012788 optical film Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 150000007514 bases Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 5
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical class O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 2
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 2
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 2
- BJXKHCXZXUPUHC-UHFFFAOYSA-N 4-(2-ethoxyethoxy)-4-oxobutanoic acid Chemical compound CCOCCOC(=O)CCC(O)=O BJXKHCXZXUPUHC-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- DNNXXFFLRWCPBC-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C1=CC=CC=C1 DNNXXFFLRWCPBC-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- AMAIUVVQEKFSED-UHFFFAOYSA-N acetic acid;2,2-dimethylpropane-1,3-diol Chemical compound CC(O)=O.OCC(C)(C)CO AMAIUVVQEKFSED-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical class O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000005453 ketone based solvent Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical group [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
- C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
- C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3215—Polyhydroxy compounds containing aromatic groups or benzoquinone groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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Abstract
本發明提供一種被覆劑,其係含有乙烯酯樹脂(A)、具有芳香環之胺基甲酸酯樹脂(B)於水性介質(C)中分散而得之水性樹脂組成物(D),以及碳二亞胺系交聯劑(E)之被覆劑,其中,上述乙烯酯樹脂(A)係使選自酚醛清漆型環氧樹脂及雙酚型環氧樹脂所成群組中之1種以上的環氧樹脂(a1)、與具有酸基及聚合性不飽和基之化合物(a2)反應而得者,上述胺基甲酸酯樹脂(B)係使含有具芳香環之多元醇(b1-1)及具親水性基之多元醇(b1-2)的(b1)、與聚異氰酸酯(b2)反應而得者。本發明之被覆劑可使基材與活性能量線硬化組成物之硬化塗膜的密著性提高,且可形成耐藥性及耐濕熱性優異之底塗層。
Description
本發明係有關在基材表面形成活性能量線硬化性組成物之硬化塗膜時可作為提高基材與上述硬化塗膜之密著性的底漆使用之被覆劑,以及積層體。
水性胺基甲酸酯樹脂組成物,近年來研究對光學用途之膜或薄片的應用。上述光學用途,具體上可列舉如:液晶顯示器、觸摸面板等。上述液晶顯示器等之顯示裝置,一般為了顯示清晰的影像而層積具有各種機能的多數光學膜所構成,而該光學膜可列舉如:抗反射膜、相位差膜及稜鏡片等。
作為該等光學膜之基材,係因聚酯膜,特別是聚對酞酸乙二酯(PET)膜之光學特性、機械強度及耐久性優異而使用。而且,在光學用途方面,藉由在聚酯膜之表面塗布活性能量線硬化性組成物使之硬化而形成硬塗層、或裝設鑄塑活性能量線硬化性組成物之層而將聚酯膜作成稜鏡片,惟因聚酯膜之結晶性高而有與活性能量線硬化性組成物之硬化塗膜之密著性低之問題。
作為提高聚酯膜與活性能量線硬化性組成物之硬化塗膜的密著性之方法,係提案在基材之聚酯膜與活性能量線硬化性組成物的硬化塗膜之間設置包含丙烯酸
樹脂之底塗層(例如:參照專利文獻1)。然而,即使裝設包含丙烯酸樹脂之底塗層,聚酯膜與活性能量線硬化性組成物的硬化塗膜之密著性亦不充分。
而且,使用胺基甲酸酯樹脂作為底塗層者,與活性能量線硬化性組成物的硬化塗膜之密著性雖為充分,然而對於耐濕熱試驗後之密著性及耐藥性卻有無法發揮充分的性能之問題。
因此,要求一種使聚酯膜與活性能量線硬化性組成物的硬化塗膜之密著性充分,且可在具有優異耐藥性及耐濕熱性之底塗層中使用之被覆劑。
[專利文獻1]日本特開2010-215843號公報
本發明所欲解決之課題係提供一種被覆劑,其係對與基材或活性能量線硬化性組成物的硬化塗膜之任一者均具有優異之密著性,且可形成耐藥性及耐濕熱性優異之底塗層。
本發明者等為解決上述問題而專心致志進行研究,結果發現使特定之環氧樹脂與具有酸基及聚合性不飽和基之化合物反應而得之乙烯酯樹脂及具有芳香環之胺基甲酸酯樹脂,藉由使用分散於水性介質中之水性樹脂組成物及交聯劑之組合的底漆,即使為聚酯膜般之不
易接著之基材,亦提高該基材與活性能量線硬化性組成物的硬化塗膜之密著性,以及大幅提升底塗層之耐藥性及耐濕熱性,遂而完成本發明。
亦即,本發明係關於被覆劑及積層體者,該被
覆劑係含有乙烯酯樹脂(A)、具有芳香環之胺基甲酸酯樹脂(B)於水性介質(C)中分散而得之水性樹脂組成物(D),以及碳二亞胺系交聯劑(E)者,上述乙烯酯樹脂(A)係使選自酚醛清漆型環氧樹脂及雙酚型環氧樹脂所成群組中之1種以上的環氧樹脂(a1)、與具有酸基及聚合性不飽和基之化合物(a2)反應而得者,上述胺基甲酸酯樹脂(B)係使含有具芳香環之多元醇(b1-1)及具親水性基之(b1-2)的多元醇(b1)、與聚異氰酸酯(b2)反應而得者。
本發明之被覆劑,即使為聚酯膜般之不易接著之基材,由於可提高該基材與活性能量線硬化性組成物的硬化塗膜之密著性,以及作為耐藥性及耐濕熱性優異之底漆使用,故適合以聚酯膜為基材,於該表面形成活性能量線硬化性組成物之硬化塗膜的積層體。作為如此之積層體之例可列舉如:抗反射膜、相位差膜及稜鏡片等之光學膜。並且,該等光學膜可應用在包括液晶顯示器之影像顯示裝置。
本發明之被覆劑係含有乙烯酯樹脂(A)、具有
芳香環之胺基甲酸酯樹脂(B)於水性介質(C)中分散而得之水性樹脂組成物(D),以及碳二亞胺系交聯劑(E)者。
上述乙烯酯樹脂(A)係使選自酚醛清漆型環氧
樹脂及雙酚型環氧樹脂所成群組中之1種以上的環氧樹脂(a1)、與具有酸基及聚合性不飽和基之化合物(a2)反應而得者。
上述化合物(a2)所具有之聚合性不飽和基,係
在與上述環氧樹脂之反應中,因不參與該反應,故以結果而言使上述乙烯酯樹脂(A)具有源自上述化合物(a2)之聚合性不飽和基。該乙烯酯樹脂(A)所具有之聚合性不飽和基,藉由與後述活性能量線硬化性組成物中所含之樹脂或單體所具有的聚合性不飽和基進行聚合反應,形成共價鍵,成為與包含本發明之被覆劑之底塗層之間的密著強固者。
上述乙烯酯樹脂(A)所具有之聚合性不飽和基
的當量係以250至2,000g/eq.之範圍為佳。
上述環氧樹脂(a1)係選自酚醛清漆型環氧樹脂
及雙酚型環氧樹脂所成群組中之1種以上者,具體而言,可使用以下者。
上述酚醛清漆型環氧樹脂可列舉例如:甲酚酚
醛清漆型環氧樹脂、酚酚醛清漆型環氧樹脂等。並且,上述雙酚型環氧樹脂可列舉如:雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、四溴雙酚A型環氧樹脂等。該等環氧樹脂(a1)可單獨使用,亦可將2種以上併
用。
上述環氧樹脂(a1)中,係以使用具有大量可與
上述化合物(a2)所具有之酸基反應的環氧基之酚醛清漆型環氧樹脂者為佳。
並且,上述環氧樹脂(a1)之環氧當量係以150
至2,000g/eq.之範圍為佳,以160至1,000g/eq.之範圍更佳。
更且,以使上述環氧樹脂(a1)所具有之環氧基
之總量中的80至100莫耳%與上述化合物(a2)之酸基反應者為佳,使上述環氧基全部與上述化合物(a2)之酸基反應者為更佳。
上述化合物(a2)係具有酸基與聚合性不飽和基
者。藉由使上述化合物(a2)具有之酸基與上述環氧樹脂(a1)具有之環氧基反應,即可在上述乙烯酯樹脂(A)中導入聚合性不飽和基。
上述化合物(a2)可列舉例如:丙烯酸、甲基丙
烯酸、伊康酸、2-丙烯醯氧基乙基琥珀酸酯、2-甲基丙烯醯氧基乙基琥珀酸酯、2,2,2-參丙烯醯氧基甲基乙基酞酸酯等。該等化合物之中,亦以可將容易與後述活性能量線硬化性組成物中之樹脂或單體所具有之聚合性不飽和基進行聚合反應之丙烯醯基導入上述乙烯酯樹脂(A)之丙烯酸為佳。並且,該等化合物(a2)可單獨使用,亦可將2種以上併用,惟在上述化合物(a2)之總量中,所使用之丙烯酸以50質量%以上為佳。
上述環氧樹脂(a1)與上述化合物(a2)之反應溫
度係以60至150℃之範圍為佳,以80至120℃之範圍更佳。
並且,當上述環氧樹脂(a1)與上述化合物(a2)
反應時,為了防止上述化合物(a2)所具有之聚合性不飽和基的熱聚合,以使用聚合抑制劑為佳。聚合抑制劑之添加量,相對於上述環氧樹脂(a1)與上述化合物(a2)之合計質量,以500至5,000ppm之範圍為佳。
上述聚合抑制劑可列舉例如:2,6-雙(三級丁基
)-4-甲基酚、氫醌、甲基氫醌、氫醌單甲醚(對苯二酚單甲醚)、對-三級丁基兒茶酚、硝基苯、硝基苯甲酸、鄰-二硝基苯、間-二硝基苯、對-二硝基苯、2,4-二硝基酚、三硝基苯等。該等聚合抑制劑可單獨使用,亦可將2種以上併用。
更且,當上述環氧樹脂(a1)與上述化合物(a2)
反應時,可使用反應觸媒。上述反應觸媒之使用量,相對於上述環氧樹脂(a1)100質量份,以0.1至5質量份之範圍為佳。
上述反應觸媒可列舉例如:胺觸媒、咪唑觸媒
、磷觸媒、硼觸媒、磷-硼觸媒等。具體上可列舉如:乙基胍、三甲基胍、苯基胍、二苯基胍等之烷基取代胍;3-(3,4-二氯苯基)-1,1-二甲基脲、3-苯基-1,1-二甲基脲、3-(4-氯苯基)-1,1-二甲基脲等之3-取代苯基-1,1-二甲基脲;2-甲基咪唑啉、2-苯基咪唑啉、2-十一烷基咪唑啉、2-十七烷基咪唑啉等之咪唑啉;2-胺基吡啶等之單胺基吡啶;N,N-二甲基-N-(2-羥基-3-烯丙氧基丙基)胺-N'-乳
醯亞胺等之胺醯亞胺;乙膦、丙膦、丁膦、苯膦、三甲膦、三乙膦、三丁膦、三辛膦、三苯膦、三環己膦、三苯膦-三苯硼烷錯合物、四苯鏻四苯硼酸鹽等之有機磷觸媒;1,8-二氮雜雙環[5.4.0]十一烯-7、1,4-二氮雜雙環[2.2.2]辛烷等之二氮雜雙環十一烯等。該等反應觸媒可單獨使用,亦可將2種以上併用。
以上述方法所得之乙烯酯樹脂(A)之重量平均
分子量,從樹脂粒子之分散安定性的改善來看,以500至10,000之範圍為佳,以1,000至6,000之範圍更佳。
具有芳香環之胺基甲酸酯樹脂(B)係使含有具
芳香環之多元醇(b1-1)及具親水性基之(b1-2)的多元醇(b1)、與聚異氰酸酯(b2)反應而得者。
在使用上述多元醇(b1-1)作為上述胺基甲酸酯
樹脂(B)之原料使用時,上述胺基甲酸酯樹脂(B)成為具有芳香環者。並且,上述多元醇(b1-1)中之芳香環濃度係以1.5至8mol/kg之範圍為佳,以1.6至5mol/kg之範圍更佳。
上述多元醇(b1-1)可列舉例如:芳香族聚酯多
元醇、芳香族聚碳酸酯多元醇、芳香族聚醚多元醇、雙酚之環氧烷加成物等。該等可單獨使用,亦可將2種以上併用。
並且,即使在上述多元醇(b1-1)之中,芳香族
聚酯多元醇、雙酚之環氧烷加成物之1種的雙酚A之環氧烷加成物因基材密著性與抗黏結性(Blocking resistance)優異,因而為佳。因此,上述多元醇(b1-1)係以使用包含
芳香族聚酯多元醇及雙酚A之環氧烷加成物之中的至少1種者為佳。
上述芳香族聚酯多元醇係使多元羧酸與多元醇
進行酯化反應而得者,惟使用上述多元羧酸與多元醇中之至少1個具有芳香環者。
上述多元羧酸脂之中具有芳香環者可列舉例如
:酞酸、間酞酸、對酞酸、萘二羧酸等之芳香族二羧酸或其酯化物。不具芳香環者可列舉例如:琥珀酸、戊二酸、己二酸、馬來酸、庚二酸、辛二酸、壬二酸、伊康酸、癸二酸、氯橋酸、1,2,4-丁烷三羧酸、癸烷二羧酸、環己二羧酸、二聚物酸、延胡索酸等之脂肪族二羧酸或其酯化物,該等多元羧酸或其酯化物可單獨使用,亦可將2種以上併用。
上述多元醇之中,具有芳香環者可列舉例如:
苯二甲醇、甲苯二甲醇、二甲苯甲醇等之芳香族二醇。
並且,不具芳香環者可列舉例如:乙二醇、丙二醇、1,3-丙二醇、1,4-丁二醇、1,6-己二醇、1,8-辛二醇、二乙二醇、三乙二醇、環己烷-1,4-二醇、環己烷-1,4-二甲醇、新戊二醇乙二醇等之脂肪族多元醇。該等多元醇可單獨使用,亦可將2種以上併用。
上述多元醇(b1-2)係具有親水性基之多元醇。
上述親水性基可列舉如:陰離子性基、陽離子性基及非離子性基,惟以陰離子性基為佳,在陰離子性基之中亦以羧基、磺酸基為佳。
具有作為親水性基之羧基的多元醇之例可列舉
如:2,2-二羥甲基丙酸、2,2-二羥甲基丁酸及2,2-二羥甲基戊酸等。該等之中,以2,2-二羥甲基丙酸為佳。並且,亦可使用使具有上述羧基之多元醇與多元羧酸反應而得之具有羧基的聚酯多元醇。
具有作為親水性基之磺酸基的多元醇之例可列
舉如:5-磺基間酞酸、磺基對酞酸、4-磺基酞酸、5-(4-磺基苯氧基)間酞酸等之二羧酸或該等之鹽,與乙二醇、丙二醇、1,4-丁二醇、1,6-己二醇、二乙二醇及新戊二醇等之低分子多元醇反應而得之聚酯多元醇等。
將上述陰離子性基的一部分或全部,藉由鹼性
化合物中和,即可對上述胺基甲酸酯樹脂(B)賦予良好的水分散性,因而為佳。
上述鹼性化合物之例可列舉如:氨;三乙胺、
嗎福林、單乙醇胺、二乙基乙醇胺等之有機胺;氫氧化鈉、氫氧化鉀、氫氧化鋰等之金屬氫氧化物等。從可進一步提升本發明之水性樹脂組成物的水分散安定性來看,上述鹼性化合物之使用量,以鹼性化合物與陰離子性基之莫耳比[鹼性化合物/陰離子性基],係以0.5至3之範圍為佳,以0.7至1.5之範圍更佳。
在製造上述芳香族聚酯多元醇時之酯化反應中
,以促進酯化反應之目的,以使用酯化觸媒為佳。上述酯化觸媒之例可列舉如:鈦、錫、鋅、鋁、鋯,鎂、鉿、鍺等之金屬;四異丙氧基鈦、四丁氧基鈦、乙醯丙酮氧鈦、二丁基錫氧化物、二乙酸二丁基錫、二月桂酸二丁基錫、辛酸錫、2-乙基己烷錫、乙醯丙酮鋅、四氯化
鋯、四氯化鋯四氫呋喃錯合物、四氯化鉿、四氯化鉿四氫呋喃錯合物、氧化鍺、四乙氧基鍺等之金屬化合物等。
上述雙酚A之環氧烷加成物係在雙酚A所具有
之酚性羥基加成有環氧烷者。上述環氧烷係可列舉如:環氧乙烷、環氧丙烷等。並且,相對於1莫耳之雙酚A,環氧烷之平均加成莫耳數係以1至8之範圍為佳,以1至4之範圍更佳。
本發明中,多元醇(b1)含有上述多元醇(b1-1)
及上述多元醇(b1-2)作為必要成分,惟亦可含有此外之多元醇(b1-3)。上述多元醇(b1-3)之例可列舉如:脂肪族聚酯多元醇、脂肪族聚碳酸酯多元醇、脂肪族聚醚多元醇、氫化雙酚之環氧烷加成物等。並且,上述多元醇(b1-3)亦可使用作為上述芳香族聚酯多元醇之原料所列舉之上述多元醇。該等多元醇(b1-3)可單獨使用,亦可將2種以上併用。
並且,多元醇(b1)中所含之具有芳香環之多元
醇(b1-1)的比例,從進一步提高對基材之密著性來看,係以40至98質量%之範圍為佳,以60至98質量%之範圍更佳。
上述胺基甲酸酯樹脂(B)之原料的聚異氰酸酯
(b2)之例可列舉如:4,4'-二苯基甲烷二異氰酸酯、2,4'-二苯基甲烷二異氰酸酯、碳二亞胺改質二苯基甲烷二異氰酸酯、粗二苯基甲烷二異氰酸酯(crude diphenyl methane diisocyanate)、伸苯二異氰酸酯、甲苯二異氰酸
酯、萘二異氰酸酯等之芳香族聚異氰酸酯;六亞甲基二異氰酸酯、離胺酸二異氰酸酯、苯二甲基二異氰酸酯、四甲基苯二甲基二異氰酸酯等之脂肪族聚異氰酸酯;環己烷二異氰酸酯、二環己基甲烷二異氰酸酯、異佛爾酮二異氰酸酯等。該等聚異氰酸酯(b2)可單獨使用,亦可將2種以上併用。
上述聚異氰酸酯(b2)之中,從對基材之密著性進一步提升來看,又以包含芳香族聚異氰酸酯者為佳。此時,上述聚異氰酸酯(b2)中之芳香族聚異氰酸酯之含量係以15至35質量%之範圍為佳。
上述胺基甲酸酯樹脂(B)係例如可藉由在無溶劑下或有機溶劑之存在下,將上述多元醇(b1)與上述聚異氰酸酯(b2)混合,在40至120℃之溫度下,使其反應3至20小時而製造。並且,上述胺基甲酸酯樹脂(B)之製造時,可依需要而使用鏈伸長劑。
上述多元醇(b1)與上述聚異氰酸酯(b2)之反應,係以上述多元醇(b1)所具有之羥基與上述聚異氰酸酯(b2)所具有之異氰酸酯基之當量比[異氰酸酯基/羥基]在0.5至3.5之範圍下進行者為佳,以在0.9至2.5之範圍下進行者更佳。
可在上述胺基甲酸酯樹脂(B)之製造時使用之有機溶劑,其例可列舉如:丙酮、甲基乙基酮等之酮溶劑;四氫呋喃、二烷等之醚溶劑;乙酸乙酯、乙酸丁酯等之乙酸酯溶劑;乙腈等之腈溶劑;二甲基甲醯胺、N-甲基吡咯啶酮等之醯胺溶劑等。該等有機溶劑可單獨
使用,亦可將2種以上併用。
以上述方法而得之上述胺基甲酸酯樹脂(B)的
重量平均分子量,從更提高基材與活性能量線硬化性組成物之硬化塗膜的密著性來看,以3,000至200,000之範圍為佳,以3,000至100,000之範圍更佳。
水性介質(C)係可列舉如:水、與水混合之有
機溶劑及該等之混合物。與水混合之有機溶劑,其例可列舉如:甲醇、乙醇、正丙醇、異丙醇等之純溶劑;丙酮、甲基乙基酮等之酮溶劑;乙二醇、二乙二醇、丙二醇等之聚烷二醇;聚烷二醇之烷基醚溶劑;N-甲基-2-吡咯啶酮等之內醯胺溶劑等。該等之與水混合之有機溶劑可單獨使用,亦可將2種以上併用。
並且,上述水性介質(C),如考量對安全性及
環境負荷之降低,則以單獨之水、或水及與水混合之有機溶劑的混合物為佳,以單獨之水更佳。
上述水性介質(C)之比例係以10至90質量%之
範圍為佳,以30至70質量%之範圍更佳。
水性樹脂組成物(D)係上述乙烯酯樹脂(A)及上
述胺基甲酸酯樹脂(B)分散在上述水性介質(C)中者。此時,上述乙烯酯樹脂(A)與上述胺基甲酸酯樹脂(B)在上述水性介質(C)中可存在作為個別的樹脂粒子,惟以使用形成有上述乙烯酯樹脂(A)之一部分或全部存在於上述胺基甲酸酯樹脂(B)粒子中之樹脂粒子(F)者為佳。更具體而言,係以上述乙烯酯樹脂(A)形成芯部且上述胺基甲酸酯樹脂(B)形成殼部之芯-殼型樹脂粒子(F)者為佳。
上述樹脂粒子(F)係預先製造上述乙烯酯樹脂
(A)及上述胺基甲酸酯樹脂(B),接著,可藉由在上述胺基甲酸酯樹脂(B),將中和上述乙烯酯樹脂(A)、上述胺基甲酸酯樹脂(B)所具有之陰離子性基的鹼性化合物及上述水性介質(C)進行混合而製造。
以上述方法所得之水性樹脂組成物(D)中包含
有機溶劑時,為了降低對安全性及環境之負擔,可藉由蒸餾法等而去除上述有機溶劑。藉此,可得到上述水性介質(C)中分散有上述樹脂粒子(F)之水性樹脂組成物(D)。
上述乙烯酯樹脂(A)與上述胺基甲酸酯樹脂(B)
之質量比例[(A)/(B)],從更提升與活性能量線硬化性組成物之硬化塗膜的密著性來看,以60/40至10/90之範圍為佳,以55/45至20/80之範圍更佳。另外,該範圍係將上述乙烯酯樹脂(A)與上述胺基甲酸酯樹脂(B)作為上述樹脂粒子(F)使用時亦為相同。
而且,上述水性樹脂組成物(D)總量中之上述
乙烯酯樹脂(A)與上述胺基甲酸酯樹脂(B)之合計量的比例,係以10至90質量%之範圍為佳,以30至70質量%之範圍更佳。
上述水性樹脂組成物(D)可依需要而調配成膜
助劑、硬化劑、塑化劑、抗靜電劑、蠟、光穩定劑、流動調節劑、染料、調平劑、流變調節劑、紫外線吸收劑、抗氧化劑、光觸媒性化合物、無機顏料、有機顏料、體質顏料等之添加劑;聚酯樹脂、胺基甲酸酯樹脂、丙
烯酸樹脂等之其它樹脂等。
本發明之被覆劑係將碳二亞胺系交聯劑(E)作
為必要成分。上述交聯劑(E)具有之碳二亞胺基,係與上述胺基甲酸酯樹脂(B)所具有之羧基等的親水性基反應而形成3維交聯構造時,使基材與活性能量線硬化性組成物之硬化塗膜的密著性提高,且在使用本發明之被覆劑作為底漆時,可對所形成之底塗層在耐濕熱試驗後賦予高的密著性及優異之耐藥性。
上述交聯劑(E)係以具有2個以上之碳二亞胺基
者為佳,作為如此者,其例可列舉如:聚(4,4'-二苯基甲烷碳二亞胺)、聚(對-伸苯碳二亞胺)、聚(間-伸苯碳二亞胺)、聚(二異丙基苯基碳二亞胺)、聚(三異丙基苯基碳二亞胺)等之芳香族聚碳二亞胺;聚(二環己基甲烷碳二亞胺)等之脂環族聚碳二亞胺、聚(二異丙基碳二亞胺)等之脂肪族聚碳二亞胺等。
並且,上述交聯劑(E),由於本發明之被覆劑
係上述乙烯酯樹脂(A)及上述胺基甲酸酯樹脂(B)分散在上述水性介質(C)中者,故以水溶性或水分散性(乳液型)者為佳。
作為可作為上述交聯劑(E)使用之市售品,可
列舉如:日清紡化工股份有限公司製造之「CARBODILITE SV-02」、「CARBODILITE V-02」、「CARBODILITE V-02-L2」、「CARBODILITE V-04」、「CARBODILITE E-01」、「CARBODILITE E-02」等。
上述交聯劑(E)之使用量,從呈現充分的交聯
性能來看,以與可和碳二亞胺基反應之上述胺基甲酸酯樹脂(B)所具有之親水性基的80至100莫耳%反應之量者為佳,以與100莫耳%反應之量者更佳。
並且上述交聯劑(E),從提高密著性、與上述
水性樹脂組成物(D)之保存安定性來看,相對於上述水性樹脂組成物(D),以在3至5質量%之範圍添加為佳。
本發明之積層體,係具有使用上述說明之本發
明的被覆劑所形成之底塗層,在上述底塗層之表面具有使用活性能量線硬化性組成物所形成之硬化塗膜者。
上述活性能量線硬化性組成物,係以含有具有
聚合性不飽和基之樹脂及具有聚合性不飽和基之單體者為佳,該等具有聚合性不飽和基之樹脂及具有聚合性不飽和基之單體的種類,係以因應上述活性能量線硬化性組成物之硬化塗膜所要求之特性而適當地選擇者為佳。
上述具有聚合性不飽和基之樹脂可列舉如:胺
基甲酸酯(甲基)丙烯酸酯樹脂、不飽和聚酯樹脂、環氧(甲基)丙烯酸酯樹脂、聚酯(甲基)丙烯酸酯樹脂、丙烯(甲基)丙烯酸酯樹脂、具有馬來醯亞胺基之樹脂等。該等具有聚合性不飽和基之樹脂可單獨使用,亦可將2種以上併用。
本發明中,「(甲基)丙烯酸酯」係指丙烯酸酯
及(甲基)丙烯酸酯之一者或兩者,「(甲基)丙烯醯基」係指丙烯醯基及(甲基)丙烯醯基之一者或兩者。
上述胺基甲酸酯(甲基)丙烯酸酯樹脂之例可列
舉如:使脂肪族聚異氰酸酯或芳香族聚異氰酸酯與具有
羥基之(甲基)丙烯酸酯進行胺基甲酸酯化反應而得之具有胺基甲酸酯鍵與(甲基)丙烯醯基之樹脂等。
上述脂肪族聚異氰酸酯之例可列舉如:四亞甲
基二異氰酸酯、五亞甲基二異氰酸酯、六亞甲基二異氰酸酯、七亞甲基二異氰酸酯、八亞甲基二異氰酸酯、十亞甲基二異氰酸酯、2-甲基-1,5-戊烷二異氰酸酯、3-甲基-1,5-戊烷二異氰酸酯、十二亞甲基二異氰酸酯、2-甲基五亞甲基二異氰酸酯、2,2,4-三甲基六亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、降莰烷二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯、氫化四甲基苯二甲基二異氰酸酯、環己基二異氰酸酯等。並且,上述芳香族聚異氰酸酯可列舉如:甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二亞甲基二異氰酸酯、1,5-萘二異氰酸酯、聯甲苯胺二異氰酸酯、對苯二異氰酸酯等。
上述具有羥基之(甲基)丙烯酸酯之例可列舉如
:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、1,5-戊二醇單(甲基)丙烯酸酯、1,6-己二醇單(甲基)丙烯酸酯、新戊二醇單(甲基)丙烯酸酯、羥基三甲基乙酸新戊二醇單(甲基)丙烯酸酯等之二元醇的單(甲基)丙烯酸酯;三羥甲基丙烷二(甲基)丙烯酸酯、乙氧基化三羥甲基丙烷(甲基)丙烯酸酯、丙氧基化三羥甲基丙烷二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、雙(2-(甲基)丙烯醯氧基乙
基)羥基乙基三聚異氰酸酯等之3元醇之單或二(甲基)丙烯酸酯,或者該等之醇性羥基之一部分以ε-己內酯改質之具有羥基的單及二(甲基)丙烯酸酯;新戊四醇三(甲基)丙烯酸酯、二-三羥甲基丙烷三(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯等之具有1個官能基的羥基與3個官能基以上之(甲基)丙烯醯基之化合物,或者該化合物進一步以ε-己內酯改質之具有羥基的多官能(甲基)丙烯酸酯;二丙二醇單(甲基)丙烯酸酯、二乙二醇單(甲基)丙烯酸酯、聚丙二醇單(甲基)丙烯酸酯、聚乙二醇單(甲基)丙烯酸酯等之具有氧伸烷基鏈之(甲基)丙烯酸酯化合物;聚乙二醇-聚丙二醇單(甲基)丙烯酸酯、聚氧丁烯-聚氧丙烯單(甲基)丙烯酸酯等之嵌段構造之具有氧伸烷基鏈之(甲基)丙烯酸酯化合物;聚(乙二醇-丁二醇)單(甲基)丙烯酸酯、聚(丙二醇-丁二醇)單(甲基)丙烯酸酯等之無規構造之具有氧伸烷基鏈之(甲基)丙烯酸酯化合物等。
上述不飽和聚酯樹脂係藉由α,β-不飽和二元酸
或其酸酐、芳香族飽和二元酸或其酸酐、及二醇之縮聚得到的硬化性樹脂。上述α,β-不飽和二元酸或其酸酐之例可列舉如:馬來酸、馬來酸酐、丁烯二酸、伊康酸、檸康酸、氯馬來酸及該等之酯等。上述芳香族飽和二元酸或其酸酐可列舉如:酞酸、酞酸酐、間酞酸、對酞酸、硝基酞酸、四氫酞酸酐、橋亞甲基四氫酞酸酐、鹵化酞酸酐及該等之酯等。脂肪族或脂環族飽和二元酸可列舉如:草酸、丙二酸、琥珀酸、己二酸、癸二酸、壬二
酸、戊二酸、六氫酞酸酐及該等之酯等。上述二醇可列舉如:乙二醇、丙二醇、二乙二醇、二丙二醇、1,3-丁二醇、1,4-丁二醇、2-甲基丙烷-1,3-二醇、新戊二醇、三乙二醇、四乙二醇、1,5-戊二醇、1,6-己二醇、雙酚A、氫化雙酚A、碳酸乙二醇酯、2,2-二-(4-羥基丙氧基二苯基)丙烷等,此外,亦可同樣地使用環氧乙烷、環氧丙烷等之氧化物。
上述環氧(甲基)丙烯酸酯樹脂係可列舉如:使
雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂等之環氧樹脂的環氧基與(甲基)丙烯酸反應而得者。
上述聚酯(甲基)丙烯酸酯樹脂之例可列舉如:
使聚酯多元醇之羥基與(甲基)丙烯酸反應而得者。
上述丙烯酸(甲基)丙烯酸酯樹脂之例可列舉如
:使甲基丙烯酸縮水甘油酯及依所需之(甲基)丙烯酸烷酯等之(甲基)丙烯酸酯單體聚合,得到具有環氧基之丙烯酸樹脂後,使該環氧基與(甲基)丙烯酸反應而得者。
上述具有馬來醯亞胺基之樹脂可列舉如:將N-
羥乙基馬來醯亞胺與異佛爾酮二異氰酸酯進行胺基甲酸酯化而得之2官能馬來醯亞胺胺基甲酸酯化合物、馬來醯亞胺乙酸與聚丁二醇進行酯化而得之2官能馬來醯亞胺酯化合物、馬來醯亞胺己酸與新戊四醇的四環氧乙烷加成物進行酯化而得之4官能馬來醯亞胺酯化合物、馬來醯亞胺乙酸與多元醇化合物進行酯化而得之多官能馬來醯亞胺酯化合物等。
上述具有聚合性不飽和基之單體之例可列舉如
:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、數量平均分子量在150至1000之範圍的聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、數量平均分子量在150至1000之範圍的聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、羥基三甲基乙酸酯新戊二醇二(甲基)丙烯酸酯、雙酚A二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯等之脂肪族(甲基)丙烯酸烷酯、(甲基)丙烯酸甘油酯、(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸3-氯-2-羥丙酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸2-丁氧基乙酯、2-(二乙基胺基)乙基(甲基)丙烯酸酯、2-(二甲基胺基)乙基(甲基)丙烯酸酯、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、(甲基)丙烯酸2-甲氧基乙酯、甲氧基二乙二醇(甲基)丙烯酸酯、甲氧基
二丙二醇(甲基)丙烯酸酯、壬基苯氧基聚乙二醇(甲基)丙烯酸酯、壬基苯氧基聚丙二醇(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基乙酯、苯氧基二丙二醇(甲基)丙烯酸酯、苯氧基聚丙二醇(甲基)丙烯酸酯、聚丁二烯(甲基)丙烯酸酯、聚乙二醇-聚丙二醇(甲基)丙烯酸酯、聚乙二醇-聚丁二醇(甲基)丙烯酸酯、(甲基)丙烯酸聚苯乙烯基乙酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸異莰酯、甲氧基化環癸三烯(甲基)丙烯酸酯、(甲基)丙烯酸苯酯;馬來醯亞胺、N-甲基馬來醯亞胺、N-乙基馬來醯亞胺、N-丙基馬來醯亞胺、N-丁基馬來醯亞胺、N-己基馬來醯亞胺、N-辛基馬來醯亞胺、N-十二烷基馬來醯亞胺、N-硬脂基馬來醯亞胺、N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、2-馬來醯亞胺乙基-碳酸乙酯、2-馬來醯亞胺乙基-碳酸丙酯、N-乙基-(2-馬來醯亞胺乙基)胺基甲酸酯、N,N-六亞甲基雙馬來醯亞胺、聚丙二醇-雙(3-馬來醯亞胺基丙基)醚、雙(2-馬來醯亞胺基乙基)碳酸酯、1,4-二馬來醯亞胺環己烷等之馬來醯亞胺化合物等。該等具有聚合性不飽和基之單體可單獨使用,亦可將2種以上併用。
上述活性能量線硬化性組成物可在塗布於基材
等之後照射活性能量線作成硬化塗膜。該活性能量線可列舉如:紫外線、電子束、α射線、β射線、γ射線等之電離輻射。在照射紫外線作為活性能量線,將上述活性能量線硬化性組成物作成硬化塗膜時,以在上述活性能量
線硬化性組成物中添加光聚合起始劑,使硬化性提高者為佳。並且,如有需要,亦可添加光敏劑使硬化性提高。另一方面,在照射電子束、α射線、β射線或γ射線作為活性能量線,將上述活性能量線硬化性組成物作成硬化塗膜時,由於不使用光聚合起始劑或光敏劑亦可迅速硬化,因此不需要添加光聚合起始劑或光敏劑。
上述光聚合起始劑之例可列舉如:1-羥基環己
基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-甲基-1-丙烷-1-酮、2-甲基-1-[4-(甲基硫基)苯基]-2-N-嗎福林基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎福林基苯基)-丁酮、雙(2,6-二甲氧基苄醯基)-2,4,4-三甲基戊基膦氧化物、雙(2,4,6-三甲基苯甲醯基)苯基膦氧化物等。
上述光敏劑之例可列舉如:脂肪族胺、芳香族
胺等之胺化合物、鄰-甲苯基硫脲(o-tolylthiourea)等之脲化合物、二乙基二硫代磷酸鈉、對甲苯磺酸S-苄基異硫脲陽離子鹽(S-benzyl-isothiouronium-p-toluene sulfonate)等之硫化合物等。
本發明之積層體中使用之基材之例可列舉如:
金屬基材、塑膠基材、玻璃基材、紙基材、木材基材、纖維質基材等。該等基材之中,為提高上述活性能量線硬化性組成物之硬化塗膜與基材之密著性,在使用本發明之水性樹脂組成物作為底漆使用時,以塑膠基材為理想。
上述塑膠基材之材質之例可列舉如:聚酯、丙
烯酸樹脂(聚甲基丙烯酸甲酯等)、聚碳酸酯、丙烯腈-丁二烯-苯乙烯共聚物(ABS樹脂)、ABS樹脂與聚碳酸酯之複合樹脂、聚苯乙烯、聚胺基甲酸酯、環氧樹脂、聚氯乙烯、聚醯胺、聚烯烴(聚乙烯、聚丙烯)、聚環烯烴(COP)等)、三乙酸纖維素(TAC)等。
本發明之被覆劑,即使在上述塑膠基材之中,
作為聚酯基材之底漆亦極為有用。上述聚酯之具體例可列舉如:聚對酞酸乙二酯(PET)、聚對酞酸丁二酯(PBT)等。
上述塑膠基材之例可列舉如:行動電話、家電
製品、汽車內外裝材料、OA設備等之塑膠成形品。而且,亦可列舉以塑膠作為材料之膜基材。將膜基材作為本發明之積層體的基材時,可在抗反射膜、相位差膜、稜鏡片等之光學膜;鋁蒸鍍膜等食品包裝等的高機能膜中使用。
並且,將本發明之積層體作為抗反射膜、相位
差膜、稜鏡片等之光學膜時,可作為液晶顯示器(LCD)、有機EL顯示器(OLED)、電漿顯示器(PDP)等之各種畫面顯示裝置的構件使用。
本發明之被覆劑例如可藉由在上述基材之表面
直接塗布,接著使其乾燥、硬化而可在基材之表面形成塗膜。將本發明之被覆劑進行乾燥而使其硬化之方法可為在常溫下熟化1至10日左右之方法,惟能夠迅速地進行固化,故以在100℃至150℃之溫度下加熱1至600秒鐘左右的方法為佳。並且,如使用在相對高的溫度下容易變
形或變色的塑膠基材時,以在70℃至100℃左右之相對低的溫度下加熱者為佳。
在上述基材的表面塗布本發明之被覆劑之方法
,可列舉如使用例如:凹版塗布機、輥塗機、缺角輪塗布機、刮刀塗布機、氣刀塗布機、簾式塗布機、吻合式塗布機、淋浴塗布機、流塗機、旋塗機、浸塗機、網版印刷、噴塗、刷塗、點塗器、棒塗布機等之塗布方法。
使用本發明之被覆劑所形成之塗膜的膜厚可依
所使用之用途而適當地調整,一般係以0.01至20μm之範圍為佳。
本發明之積層體,係在如上述操作所得的本發
明之被覆劑的塗膜之底塗層表面,進一步塗布上述活性能量線硬化性組成物,藉由活性能量線的照射,即可藉由形成上述活性能量線硬化性組成物之硬化塗膜而得。
而且,上述活性能量線硬化性組成物之塗布方法係可使用與上述本發明之被覆劑的塗布方法相同之方法。
以下,藉由實施例及比較例以具體說明本發明。
(合成例1:芳香族聚酯多元醇(1)之合成)
在具備溫度計、氮氣導入管及攪拌器之反應容器中導入氮氣之同時饋入間酞酸27.6質量份、對酞酸27.6質量份、二乙二醇19.9質量份以及氧化二丁錫0.03質量份,在180至230℃下,在230℃進行24小時之縮聚反應直到酸值成為1以下為止,得到芳香族聚酯多元醇(1)[酸值0.6、羥
值50.0、芳香環濃度4.77mol/kg]。
(製造例1:乙烯酯樹脂(1)之合成)
在反應容器中饋入甲酚酚醛清漆型環氧樹脂(DIC股份有限公司製造之「EPICLON N-673-80M」、固體成分環氧當量:209g/eq、不揮發成分:80質量%、溶劑:甲基乙基酮)46.7質量份、丙烯酸13.3質量份、氫醌單甲醚0.08質量份、甲基乙基酮13.3質量份,進行攪拌使其均勻混合。接著,加入三苯膦0.37質量份,在反應溫度80℃下使其反應直到酸值成為1.5以下為止,得到乙烯酯樹脂(1)之不揮發成分75質量%溶液。
將製造例1所合成之乙烯酯樹脂(1)之原料呈示於表1。
(製造例2:具有芳香環之胺基甲酸酯樹脂(1)之合成)
在反應容器中,將合成例1所得之芳香族聚酯多元醇(1)100.0質量份在減壓下100℃中進行脫水,然後冷卻
至80℃後,加入甲基乙基酮66.6質量份,進行攪拌使其均勻混合。接著,加入2,2'-二羥甲基丙酸6.1質量份,然後再加入異佛爾酮二異氰酸酯23.1質量份,使其在80℃反應12小時,進行胺基甲酸酯化步驟。經確認異氰酸酯值成為0.1%以下,加入正丁醇3質量份,進一步反應2小時後,冷卻至50℃,得到具有芳香環之胺基甲酸酯樹脂(1)之不揮發成分65質量%溶液。
(調製例1:水性樹脂組成物(1)之調製)
在製造例2所得之具有芳香環的胺基甲酸酯樹脂(1)之不揮發成分65質量%溶液147.7質量份(以上述胺基甲酸酯樹脂(1)而言為96質量份)中,加入製造例1所得之乙烯酯樹脂(1)之不揮發成分75質量%溶液128.0質量份(以上述乙烯酯樹脂(1)而言為96質量份)及三乙胺5.5質量份,緩慢加入離子交換水938.5質量份以實施水溶化。然後於減壓下,在30至50℃中去除甲基乙基酮,得到不揮發成分40質量%之水性樹脂組成物(1)。
調製例1所得的水性樹脂組成物(1)之組成呈示於表2。而且,表中之組成表示不揮發成分量(僅為樹脂之量)。
(調製例2:紫外線硬化性組成物(UV-1)之調製
)
藉由將胺基甲酸酯丙烯酸酯樹脂(DIC股份有限公司製造之「UNIDIC V-4260」)50質量份、三丙二醇二丙烯酸酯50質量份及光聚合起始劑(BASF JAPAN股份有限公司製造之「IRGACURE 184」;1-羥基環己基苯基酮)3質量份進行混合,得到紫外線硬化性組成物(UV-1)。
(調製例3:紫外線硬化性組成物(UV-2)之調製)
藉由將環氧丙烯酸酯樹脂(DIC股份有限公司製造之「UNIDIC V-5500」)50質量份、三丙二醇二丙烯酸酯50重量份及光聚合起始劑(BASF JAPAN股份有限公司製造之「IRGACURE 184」)3質量份進行混合,得到紫外線硬化性組成物(UV-2)。
(實施例1:底漆(1)之製作)
藉由將調製例1所得之水性樹脂組成物(1)100質量份、碳二亞胺交聯劑(日清紡化工股份有限公司製造之「CARBODILITE E-02」)2.8質量份及離子交換水593質量份混合,得到底漆(P-1)。
(實施例2:底漆(2)之製作)
藉由將調製例1所得之水性樹脂組成物(1)100質量份、碳二亞胺交聯劑(日清紡化工股份有限公司製造之「CARBODILITE V-02」)2.8質量份及離子交換水589質量份混合,得到底漆(P-2)。
(實施例3:底漆(3)之製作)
藉由將調製例1所得之水性樹脂組成物(1)100質量
份、碳二亞胺交聯劑(日清紡化工股份有限公司製造之「CARBODILITE SV-02」)2.8質量份及離子交換水593質量份混合,得到底漆(P-3)。
(實施例4:積層體(1)之製作)
在聚對酞酸乙二酯(以下簡稱為「PET」)製膜基材(厚度125μm)之表面,以乾燥後之膜厚成為約1μm之方式塗布實施例1所得的底漆(P-1),在150℃中加熱5分鐘,藉此在上述基材之表面形成底塗層。然後,以15μm之塗布厚度,在上述底塗層表面塗布調製例2所得之紫外線硬化性組成物(UV-1),在該塗布面上,藉由將高壓水銀燈作為光源,以照射強度0.5J/cm2照射紫外線,得到上述基材之表面具有底塗層,且在該底塗層表面具備紫外線硬化性組成物之硬化塗膜(以下簡稱為「UV塗膜」)的積層體(1)。
(實施例5:積層體(2)之製作)
除了使用調製例3所得之紫外線硬化性組成物(UV-2)以取代實施例4所使用之紫外線硬化性組成物(UV-1)以外,進行與實施例4相同之操作,得到積層體(2)。
(實施例6:積層體(3)之製作)
在PET膜基材之表面,以乾燥後之膜厚成為約1μm之方式塗布實施例2所得的底漆(P-2),在150℃加熱5分鐘,藉此在上述基材之表面形成底塗層。接著,在上述底塗層之表面以15μm之塗布厚度塗布調製例3所得之紫外線硬化性組成物(UV-2),在該塗布面上,藉由將高壓水
銀燈作為光源,以照射強度0.5J/cm2照射紫外線,得到上述基材之表面具有底塗層,且在該底塗層表面具備UV塗膜的積層體(3)。
(實施例7:積層體(4)之製作)
除了使用實施例3所得之底漆(P-3)以取代實施例6所使用之底漆(P-2)以外,進行與實施例6相同之操作,得到積層體(4)。
使用上述實施例及比較例所得之被覆劑及積層體,進行下述密著性之評定。
[基材與底塗層之密著性(初期)之評定方法]
藉由在膜厚125μm之包含聚對酞酸乙二酯的基材之表面,以乾燥時之膜厚成為約1μm之方式塗布底漆,並在150℃下加熱5分鐘,藉此製作包含上述基材之表面積層有底塗層之構件的試驗板。
在以上述方法製作之試驗板的底塗層表面黏貼有NICHIBAN股份有限公司製造之24mm寬度的黏著膠帶。
接著,將上述黏著膠帶朝相對於上述底塗層而言為垂直方向拉伸,依據下述評定基準以肉眼評定將上述黏著膠帶從底塗層之表面剝離時,上述底塗層之表面狀態。
◎:底塗層完全不會從構成試驗板之基材表面剝離。
○:雖有極小部分的底塗層從構成試驗板之基材表面剝離,惟相對於構成試驗板之皮膜總面積,該剝離之範圍小於10%。
△:相對於構成試驗板之底塗層面積而言為10%以上且小於50%之範圍的底塗層,從構成試驗板之基材表面剝離。
×:相對於構成試驗板之底塗層總面積而言為50%以上之範圍的底塗層,從構成試驗板之基材表面剝離。
[底塗層與UV塗膜之密著性(初期)的評定方
法]
在構成實施例及比較例所得之積層體的UV塗膜之表面,黏貼NICHIBAN股份有限公司製造之24mm寬度的黏著膠帶。
接著,將上述黏著膠帶朝相對於上述UV塗膜
而言為垂直方向拉伸,依據下述評定基準以肉眼評定將上述黏著膠帶從UV塗膜之表面剝離時,上述UV塗膜之表面狀態。
◎:UV塗膜完全不會從構成積層體之基材表面剝離。
○:雖有極小部分的UV塗膜從構成積層體之基材表面剝離,惟相對於構成積層體之UV塗膜的總面積,該剝離之範圍小於10%。
△:相對於構成積層體之UV塗膜面積而言為10%以上且小於50%之範圍的UV塗膜,從構成積層體之基材表面剝離。
×:相對於構成積層體之UV塗膜總面積而言為50%以上之範圍的UV塗膜,從構成積層體之基材表面剝離。
[底塗層與UV塗膜之密著性(耐濕熱試驗後)]
將上述所得之積層體投入溫度60℃、相對溼度90%之高溫恆濕器50小時。然後,取出上述積層體,以與上述[底塗層與UV塗膜之密著性(初期)]相同之方法評定底塗層與UV塗膜之密著性。
[底塗層與UV塗膜之密著性(耐藥性試驗後)]
將上述所得之積層體投入溫度25℃、5%氫氧化鈉水溶液30分鐘。然後,取出上述積層體,經水洗、乾燥後,以與上述[底塗層與UV塗膜之密著性(初期)之評定方法]相同之方法評定底塗層與UV塗膜之密著性。
[成膜性之評定方法]
藉由在膜厚125μm之包含聚對酞酸乙二酯的基材之表面,以乾燥時之膜厚成為約1μm之方式塗布上述底漆,並在150℃下加熱5分鐘,藉此於上述基材之表面形成底塗層。
○:以肉眼觀察底塗層之表面時,為透明。
△:以肉眼觀察底塗層之表面時,雖為透明但可確認有裂痕。
×:以肉眼觀察底塗層之表面時,發現白化程度的裂痕,部分底塗層容易從聚對酞酸乙二酯基材剝離。
將實施例4至7所得之積層體(1)至(4)中使用的基材、底漆及紫外線硬化性組成物,與評定結果呈示於表3。
(比較例1:底漆(P'-1)之製作)
藉由將水性樹脂組成物(1)100質量份與離子交換水577質量份混合,得到底漆(P'-1)。
(比較例2:底漆(P'-2)之製作)
藉由將水性樹脂組成物(1)100質量份與三聚氰胺交聯劑(DIC股份有限公司製造之「BECKAMINE M-3」)3質量份與離子交換水613質量份混合,得到底漆(P'-2)。
(比較例3:底漆(P'-3)之製作)
藉由將水性樹脂組成物(1)100質量份與唑啉交聯劑(日本觸媒股份有限公司製造之「EPOCROS WS-700」)9.2質量份與離子交換水606質量份混合,得到底漆(P'-3)。
(比較例4:底漆(P'-4)之製作)
藉由將水性樹脂組成物(1)100質量份與環氧系交聯劑(DIC股份有限公司製造之「CR-5L」)3質量份與離子交換水648質量份混合,得到底漆(P'-4)。
(比較例5:積層體(R1)之製作)
在PET膜基材之表面,以乾燥後之膜厚成為約1μm之方式塗布比較例2所得之底漆(P'-1),並在150℃下加熱5分鐘,藉此在上述基材之表面形成底塗層。然後,以15μm之塗布厚度,在上述底塗層之表面塗布調製例3所得之紫外線硬化性組成物(UV-2),在該塗布面上,藉由將高壓水銀燈作為光源,以照射強度0.5J/cm2照射紫外線,得到上述基材之表面具有底塗層,且在該底塗層表面具備UV塗膜之積層體(R1)。
(比較例6至8:積層體(R2)至(R4)之製作)
除了分別使用比較例2至4所得之底漆(P'-2)至(P'-4)以取代比較例5所得之底漆(P'-1)之外,進行與比較例5相同之操作,得到積層體(R2)至(R4)。
將比較例5至8所得之積層體(R1)及(R2)中使用的基材、底漆及紫外線硬化性組成物,與評定結果呈示於表4。
由表3所示之評定結果,可確認使用本發明之
被覆劑所形成之底塗層係與基材之密著性優異,與活性能量線硬化性組成物之硬化塗膜之密著性亦優異。
可確認使用本發明之被覆劑所形成之底塗層,
在耐濕熱試驗後具有高密著性及優異的耐藥性。
另一方面,比較例5係使用不含交聯劑之被覆
劑之例者。相較於使用本發明之被覆劑所形成之底塗層,可確認耐濕熱試驗後之密著性不足,並且,耐藥性亦為不足。
比較例6係使用三聚氰胺交聯劑之例者。相較
於使用本發明之含碳二亞胺交聯劑之被覆劑所形成之底塗層,可確認耐藥性不足。
比較例7係使用唑啉交聯劑之例者。相較於
使用本發明之含碳二亞胺交聯劑之被覆劑所形成之底塗層,可確認耐濕熱試驗後之密著性不足,並且,耐藥性亦為不足。
比較例8係使用環氧交聯劑之例者。相較於使
用本發明之含碳二亞胺交聯劑之被覆劑所形成之底塗層,可確認耐藥性不足。
Claims (9)
- 一種被覆劑,其係含有乙烯酯樹脂(A)、具有芳香環之胺基甲酸酯樹脂(B)於水性介質(C)中分散而得之水性樹脂組成物(D),以及碳二亞胺系交聯劑(E)之被覆劑,其特徵為:該乙烯酯樹脂(A)係使選自酚醛清漆型環氧樹脂及雙酚型環氧樹脂所成群組中之1種以上的環氧樹脂(a1)、與具有酸基及聚合性不飽和基之化合物(a2)反應而得者,該胺基甲酸酯樹脂(B)係使含有具芳香環之多元醇(b1-1)及具親水性基之(b1-2)的多元醇(b1)、與聚異氰酸酯(b2)反應而得者,該交聯劑(E)之使用量係和可與碳二亞胺基反應之該胺基甲酸酯樹脂(B)所具有之親水性基的80至100莫耳%反應之量,該乙烯酯樹脂(A)與該胺基甲酸酯樹脂(B)之質量比例[(A)/(B)]係在60/40至10/90之範圍。
- 如請求項1之被覆劑,其中該多元醇(b1-1)中之芳香環濃度係在1.5至8mol/kg之範圍。
- 如請求項1之被覆劑,其中該具有芳香環之多元醇(b1-1)係包含芳香族聚酯多元醇(b1-a)及雙酚A之環氧烷加成物(b1-b)中之至少1個的多元醇。
- 如請求項1之被覆劑,其中該多元醇(b1)中所含之具有芳香環的多元醇(b1-1)之比例係在40至98質量%之範圍。
- 如請求項1之被覆劑,其中該聚異氰酸酯(b2)係包含芳香族聚異氰酸酯者。
- 如請求項1之被覆劑,其中該化合物(a2)係丙烯酸或甲基丙烯酸。
- 如請求項1之被覆劑,其中該乙烯酯樹脂(A)之部分或全部係留存在該胺基甲酸酯樹脂(B)粒子中而形成樹脂粒子(F)者。
- 一種積層體,其特徵為:在基材之表面具有藉由塗布如請求項1至7項中任一項之被覆劑並加以乾燥所形成之底塗層,並且在該底塗層表面具有使用活性能量線硬化性組成物所形成之硬化塗膜。
- 如請求項8之積層體,其中該活性能量線硬化性組成物係含有具有聚合性不飽和基之樹脂、與具有聚合性不飽和基之單體者。
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