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TWI581972B - A method of manufacturing a connecting body, and a method of connecting an electronic component - Google Patents

A method of manufacturing a connecting body, and a method of connecting an electronic component Download PDF

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Publication number
TWI581972B
TWI581972B TW102109780A TW102109780A TWI581972B TW I581972 B TWI581972 B TW I581972B TW 102109780 A TW102109780 A TW 102109780A TW 102109780 A TW102109780 A TW 102109780A TW I581972 B TWI581972 B TW I581972B
Authority
TW
Taiwan
Prior art keywords
connection
connection region
electronic component
substrate
light
Prior art date
Application number
TW102109780A
Other languages
English (en)
Other versions
TW201345724A (zh
Inventor
Keisuke Inase
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201345724A publication Critical patent/TW201345724A/zh
Application granted granted Critical
Publication of TWI581972B publication Critical patent/TWI581972B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Description

連接體之製造方法、及電子零件之連接方法
本發明係關於一種使用光硬化型之接著劑而連接電子零件等之連接體之製造方法、及使用光硬化型之接著劑連接電子零件等之連接方法。
本申請案係以在日本於2012年3月23日所申請之日本專利申請案編號日本特願2012-68140為基礎而主張優先權，藉由參照將該申請案引用於本申請案中。
自先前以來，作為電視或PC監控器、行動電話、可攜式遊戲機、平板PC或車載用監控器等各種顯示機構，大多使用液晶顯示裝置。近年來，於此種液晶顯示裝置中，就微間距化、輕量薄型化等觀點而言，採用將液晶驅動用IC直接構裝於液晶顯示面板之基板上之所謂之COG(chip on glass)或將形成有液晶驅動電路之可撓性基板直接構裝於液晶顯示面板之基板上之所謂之FOG(film on glass)。
例如採用COG構裝方式之液晶顯示裝置100如圖11所示，具有實現用於液晶顯示之主要功能之液晶顯示面板104，該液晶顯示面板104具有由玻璃基板等所構成之相互對向之兩片透明基板102、103。並且，液晶顯示面板104中，該等兩透明基板102、103藉由框狀之密封件105相互貼合，並且設置有於由兩透明基板102、103及密封件105所圍繞之空間內封入液晶106之面板顯示部107。
透明基板102、103於相互對向之兩內側表面以相互交叉之 方式形成有由ITO(氧化銦錫)等所構成之條紋狀之一對透明電極108、109。並且，兩透明基板102、103藉由該等兩透明電極108、109之該交叉部位而構成作為液晶顯示之最小單位之像素。
兩透明基板102、103中，一個透明基板103形成為平面尺寸大於另一個透明基板102，於該較大地形成之透明基板103之緣部103a形成有透明電極109之端子部109a。又，於兩透明電極108、109上形成有經實施特定之摩擦處理之配向膜111、112，藉由該配向膜111、112，液晶分子之初期配向受到限制。進而，於兩透明電極108、109之外側配設有一對偏光板118、119，藉由該等兩偏光板118、119，自背光裝置等光源120之透過光之振動方向受到限制。
於端子部109a上經由異向性導電膜114而熱壓接有液晶驅動用IC115。異向性導電膜114係於熱硬化型黏合劑樹脂中混入有導電性粒子而製成膜狀者，藉由於2個導體間進行加熱壓接而利用導電粒子取得導體間之電性導通，藉由黏合劑樹脂保持導體間之機械性連接。液晶驅動用IC115可藉由對像素選擇性地施加液晶驅動電壓而使液晶之配向部分地變化而進行特定之液晶顯示。再者，作為構成異向性導電膜114之接著劑，通常使用可靠性最高之熱硬化性之接著劑。
於經由此種異向性導電膜114將液晶驅動用IC115連接於端子部109a之情形時，首先，藉由未圖示之暫時壓接機構將異向性導電膜114暫時壓接於透明電極109之端子部109a上。繼而，將液晶驅動用IC115載置於異向性導電膜114上後，如圖12所示，藉由熱壓頭等熱壓接手段121將液晶驅動用IC115與異向性導電膜114一同向端子部109a側按壓，並且使熱壓接手段121發熱。藉由該熱壓接手段121產生之發熱，異向性導電膜114產生熱硬化反應，藉此，液晶驅動用IC115經由異向性導電膜114而接著於端子部109a上。
然而，於使用此種異向性導電膜之連接方法中，熱加壓溫度高，對液晶驅動用IC115等電子零件或透明基板103之熱衝擊變大。
因此，亦提出有代替此種使用熱硬化型接著劑之異向性導電膜114而使用紫外線硬化型接著劑之連接方法。於使用紫外線硬化型接著劑之連接方法中，加熱至接著劑因熱而軟化流動而於透明電極109之端子部109a與液晶驅動用IC115之電極間夾持導電性粒子所充分之溫度而停止，並藉由紫外線照射使接著劑硬化。
然而，即便於使用該紫外線硬化型接著劑之連接方法中，亦會伴隨藉由紫外線照射之硬化而產生接著劑之收縮。因此，有如下之虞：由於該收縮而於夾持液晶106之透明基板103之IC連接部產生翹曲，因此失去面板顯示部107中之透明基板102、103間之間隙之面均勻性，並且液晶之配向紊亂，引起顯示不均等不良情況。又，亦有因產生於透明基板103之IC連接部之翹曲而引起液晶驅動用IC115之連接不良之虞。
[專利文獻1]WO00/46315號公報
因此，本發明係解決上述課題者，其目的在於提供一種藉由使用紫外線硬化型接著劑而於低溫下進行電子零件之連接，並且抑制因接著劑之硬化收縮而產生之應變，改善電子零件之連接不良的連接體之製造方法、及電子零件之連接方法。
為了解決上述課題，本發明之連接體之製造方法具有經由光硬化型接著劑將電子零件配置於基板上之步驟、及對上述接著劑照射光而使其硬化之步驟，並且將上述基板與上述電子零件連接之區域分割為多個連接區域，對每個上述連接區域錯開上述光之照射開始時間點而進行硬化。
又，本發明之電子零件之連接方法係如下者：其具有經由光 硬化型接著劑將電子零件配置於基板上之步驟、及對上述接著劑照射光而使其硬化之步驟，並且將上述基板與上述電子零件連接之區域分割為多個連接區域，對每個上述連接區域錯開上述光之照射開始時間點而進行硬化。
根據本發明，藉由錯開光照射時間點而使各連接區域硬化開始之時間點不同，可一面依序吸收各連接區域中之因硬化收縮而引起之應變，一面實現電子零件與基板之連接。
1、114‧‧‧異向性導電膜
2‧‧‧剝離膜
3‧‧‧導電性粒子含有層
4‧‧‧導電性粒子
10、104‧‧‧液晶顯示面板
11、12、102、103‧‧‧透明基板
12a、103a‧‧‧緣部
13、105‧‧‧密封件
14、106‧‧‧液晶
15、107‧‧‧面板顯示部
16、17、108、109‧‧‧透明電極
17a、109a‧‧‧端子部
18‧‧‧電子零件
20‧‧‧COG構裝部
21‧‧‧可撓性基板
22‧‧‧FOG構裝部
24、111、112‧‧‧配向膜
25、26、118、119‧‧‧偏光板
30‧‧‧加熱按壓頭
31‧‧‧紫外線照射器
31a、31b、31c、31d、31e、31f、31g、31h、31i‧‧‧紫外線照射部
40‧‧‧玻璃基板
41‧‧‧觸針
42‧‧‧凸塊
43‧‧‧金屬配線
100‧‧‧液晶顯示裝置
115‧‧‧液晶驅動用IC
120‧‧‧光源
121‧‧‧熱壓接手段
CH1、CH2、CH3、CH4、CH5、CH6、CH7、CH8、CH9‧‧‧連接區域
圖1係表示應用有本發明之構裝步驟之剖面圖。
圖2係表示異向性導電膜之剖面圖。
圖3係表示藉由將電子零件及玻璃基板連接而形成之連接區域之立體圖。
圖4A~D係表示應用有本發明之紫外線照射之開始時間點的俯視圖。
圖5A及圖5B係表示本發明之其他實施形態之俯視圖。
圖6A~圖6E係表示本發明之其他實施形態之俯視圖。
圖7A~圖7C係表示本發明之其他實施形態之俯視圖。
圖8係表示本發明之其他實施形態之俯視圖。
圖9係用以說明實施例及比較例之玻璃基板之翹曲之測定方法的圖。
圖10係用以說明實施例及比較例之導通電阻之測定方法的圖。
圖11係表示先前之液晶顯示面板之剖面圖。
圖12係表示先前之液晶顯示面板之COG構裝步驟之剖面圖。
以下，一面參照圖式一面對應用有本發明之連接體之製造方法及連接方法詳細地進行說明。再者，當然，本發明並非僅限定於以下之實施形態，可在不脫離本發明之主旨之範圍內進行各種變更。又，圖式係 模式性者，各尺寸之比率等有時與現實不同。具體之尺寸等應參酌以下之說明進行判斷。又，當然，即便於圖式相互間亦包含相互之尺寸之關係或比率不同之部分。
以下，以將電子零件連接於基板而作為連接對象物及被連接對象物之情形為例進行說明，但本技術亦可應用於基板與電子零件之連接以外。例如，進行於液晶顯示面板之玻璃基板上構裝液晶驅動用之IC晶片之所謂之COG(chip on glass)構裝。該液晶顯示面板10如圖1所示，由玻璃基板等所構成之兩片透明基板11、12係對向配置，且該等透明基板11、12係藉由框狀之密封件13相互貼合。並且，液晶顯示面板10藉由於由透明基板11、12所圍繞之空間內封入液晶14而形成有面板顯示部15。
透明基板11、12於相互對向之兩內側表面以相互交叉之方式形成有由ITO(氧化銦錫)等所構成之條紋狀之一對透明電極16、17。並且，兩透明電極16、17藉由該等兩透明電極16、17之該交叉部位構成作為液晶顯示之最小單位之像素。
兩透明基板11、12中，一個透明基板12形成為平面尺寸大於另一個透明基板11，於該較大地形成之透明基板12之緣部12a，設置有構裝有液晶驅動用IC等電子零件18之COG構裝部20，又，於COG構裝部20之外側附近，設置有構裝有形成有液晶驅動電路之可撓性基板21之FOG構裝部22。
再者，液晶驅動用IC或液晶驅動電路可藉由對像素選擇性地施加液晶驅動電壓而使液晶之配向部分地變化而進行特定之液晶顯示。
於各構裝部20、22形成有透明電極17之端子部17a。於端子部17a上，使用異向性導電膜1作為導電性接著劑而連接有液晶驅動用IC等電子零件18或可撓性基板21。異向性導電膜1係如下者：其含有導電性粒子4，經由導電性粒子4而將電子零件18或可撓性基板21之電極與形成 於透明基板12之緣部12a之透明電極17之端子部17a電性連接。該異向性導電膜1係紫外線硬化型接著劑，藉由下述之利用加熱按壓頭30進行熱壓接而流動化，並於端子部17a與電子零件18或可撓性基板21之各電極之間壓碎導電性粒子4，藉由利用紫外線照射器31照射紫外線而使導電性粒子4以壓碎之狀態硬化。藉此，異向性導電膜1將透明基板12與電子零件18或可撓性基板21電性、機械性地連接。
又，於兩透明電極16、17上形成有經實施特定之摩擦處理之配向膜24，藉由該配向膜24限制液晶分子之初期配向。進而，於兩透明基板11、12之外側配設有一對偏光板25、26，藉由該等兩偏光板25、26限制自背光裝置等光源(未圖示)之透過光之振動方向。
[異向性導電膜]
異向性導電膜(ACF，Anisotropic Conductive Film)1如圖2所示，通常係於成為基材之剝離膜2上形成有導電性粒子含有層3者。異向性導電膜1如圖1所示，係用於藉由於形成於液晶顯示面板10之透明基板12之透明電極17與電子零件18或可撓性基板21之間介隔導電性粒子含有層3而將液晶顯示面板10與電子零件18或可撓性基板21連接並導通。
作為剝離膜2，可使用異向性導電膜中通常所使用之例如聚對苯二甲酸乙二酯膜等基材。
導電性粒子含有層3係將導電性粒子4分散於黏合劑中而成者。黏合劑係含有膜形成樹脂、硬化性樹脂、硬化劑、矽烷偶合劑等者，與通常之異向性導電膜中所使用之黏合劑相同。
作為膜形成樹脂，較佳為平均分子量為10000~80000左右之樹脂。作為膜形成樹脂，可列舉苯氧基樹脂、環氧樹脂、變形環氧樹脂、胺酯樹脂(urethane resin)等各種樹脂。其中，就膜形成狀態、連接可靠性等觀點而言，尤佳為苯氧基樹脂。
作為硬化性樹脂，並無特別限定，可列舉環氧樹脂、丙烯酸樹脂等。
作為環氧樹脂，並無特別限制，可根據目的適當選擇。作為具體例，例如可列舉萘型環氧樹脂、聯苯型環氧樹脂、酚系酚醛清漆型環氧樹脂、雙酚型環氧樹脂、茋型環氧樹脂、三苯酚甲烷型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚型環氧樹脂、二環戊二烯型環氧樹脂、三苯基甲烷型環氧樹脂等。該等可為單獨，亦可為2種以上之組合。
作為丙烯酸樹脂，並無特別限制，可根據目的適當選擇，作為具體例，例如可列舉丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸異丁酯、環氧丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯，三羥甲基丙烷三丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、1,4-丁二醇四丙烯酸酯、2-羥基-1,3-二丙烯醯氧基丙烷、2,2-雙[4-(丙烯醯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧基乙氧基)苯基]丙烷、丙烯酸二環戊烯酯、丙烯酸三環癸酯、異氰尿酸三(丙烯醯氧基乙基)酯、丙烯酸胺酯、環氧丙烯酸酯等。該等可為單獨，亦可為2種以上之組合。
作為硬化劑，只要為光硬化型則並無特別限制，可根據目的適當選擇，於硬化性樹脂為環氧樹脂之情形時較佳為陽離子系硬化劑，於硬化性樹脂為丙烯酸樹脂之情形時較佳為自由基系硬化劑。
作為陽離子系硬化劑，並無特別限制，可根據目的適當選擇，例如可列舉鋶鹽、鎓鹽等，該等之中較佳為芳香族鋶鹽。作為自由基系硬化劑，並無特別限制，可根據目的適當選擇，例如可列舉有機過氧化物。
作為矽烷偶合劑，可列舉環氧系、胺基系、巰基-硫系、脲系等。藉由添加矽烷偶合劑，可提高有機材料與無機材料之界面上之接著性。
作為導電性粒子4，可列舉於異向性導電膜中所使用之公知之任何導電性粒子。作為導電性粒子4，例如可列舉鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或金屬合金之粒子、於金屬氧化物、碳、石墨、玻璃、陶瓷、塑膠等之粒子之表面塗覆有金屬者，或於該等粒子之表面進而塗覆有絕緣薄膜者等。於為在樹脂粒子之表面塗覆有金屬者之情形時，作為樹脂粒子，例如可列舉環氧樹脂、酚系樹脂、丙烯酸系樹脂、丙烯腈-苯乙烯(AS)樹脂、苯并胍胺樹脂、二乙烯基苯系樹脂、苯乙烯系樹脂等之粒子。
[製造方法]
繼而，對經由異向性導電膜1而將電子零件18或可撓性基板21連接於透明基板12之透明電極17上之連接體之製造步驟進行說明。首先，將異向性導電膜1暫時壓接於透明電極17上。暫時壓接異向性導電膜1之方法係以導電性粒子含有層3成為透明電極17側之方式將異向性導電膜1配置於液晶顯示面板10之透明基板12之透明電極17上。
繼而，將導電性粒子含有層3配置於透明電極17上之後，例如藉由加熱按壓頭30自剝離膜2側對導電性粒子含有層3進行加熱及加壓，使加熱按壓頭30離開剝離膜2，並將剝離膜2自透明電極17上之導電性粒子含有層3剝離，藉此，僅將導電性粒子含有層3暫時壓接於透明電極17上。藉由加熱按壓頭30之暫時壓接係一面以微弱之壓力(例如0.1MPa~2MPa左右)將剝離膜2之上表面按壓至透明電極17側一面進行加熱。其中，加熱溫度係設為異向性導電膜1中之環氧樹脂或丙烯酸樹脂等熱硬化性樹脂未硬化之程度之溫度(例如70~100℃左右)。
繼而，以透明基板12之透明電極17與電子零件18之電極端子經由導電性粒子含有層3而相對向之方式配置電子零件18。
繼而，藉由配置於透明基板12之下部之紫外線照射器31而 照射紫外線，使導電性粒子含有層3硬化，將電子零件18連接於透明基板12。此時，本連接步驟中，透明電極17之端子部17a與電子零件18連接之區域係如圖3所示般分割為多個連接區域，對各連接區域錯開紫外線之照射開始時間點而進行硬化。
電子零件18之電極端子與透明電極17之端子部17a連接之區域被適當分割為多個連接區域，例如於藉由使電子零件18之電極端子與透明電極17連接而形成多通道之情形時係分割為各通道。或，電子零件18之電極端子與透明電極17之端子部17a連接之區域亦可以均等之面積將整個區域分割為多個區域。圖3中，作為一例，顯示如下情形：於電子零件18及透明電極17之端子部17a設置有藉由連接而構成通道之第1~第5之5個連接區域CH1~CH5。第1~第5連接區域CH1~CH5係大致均等地配置於經由異向性導電膜1而連接電子零件18之端子部與透明電極17之端子部17a的整個區域。
又，紫外線照射器31例如對應於第1~第5連接區域CH1~CH5而設置有第1~第5紫外線照射部31a~31e。紫外線照射器31可對紫外線照射部31a~31e分別進行照射控制，藉此，本連接步驟中，可對每個連接區域錯開紫外線照射時間點而進行硬化。再者，使各紫外線照射部31a~31e與鄰接之紫外線照射部之照射範圍一部分重複，不存在紫外線照射不到之部分。
如此，藉由錯開紫外線照射之時間點，各連接區域之硬化開始之時間點不同，可一面依序吸收各連接區域中之因硬化收縮而產生之應變，一面實現電子零件18與透明基板12之連接。認為其原因在於：藉由使各連接區域之硬化開始之時間點不同，於最先照射到紫外線之連接區域開始硬化而產生黏合劑之硬化收縮時，鄰接於該連接區域之未照射紫外線之連接區域中黏合劑未硬化而具有流動性，因此流動至照射到紫外線之連接 區域側，藉此，可吸收紫外線照射之連接區域中之因硬化收縮而產生之應變。
具體而言，圖3所示之第1~第5連接區域CH1~CH5中，如圖4A所示，自第3紫外線照射部31c開始紫外線之照射，自位於中央部之第3連接區域CH3進行硬化。繼而，開始自第3紫外線照射部31c之照射後，經過特定時間後，例如1秒後，如圖4B所示，開始自鄰接之第2、第4紫外線照射部31b、31d之紫外線照射，使第2、第4連接區域CH2、CH4硬化。最後，開始自第2、第4紫外線照射部31b、31d之照射後，經過特定時間後，例如1秒後，如圖4C所示，開始自兩端之第1、第5紫外線照射部31a、31e之紫外線照射，使第1、第5連接區域CH1、CH5硬化。
如此，根據本連接步驟，藉由使對第1~第5連接區域CH1~CH5之紫外線照射時間點不同而利用鄰接之第2、第4連接區域CH2、CH4之未硬化之黏合劑吸收位於中央部之第3連接區域CH3之硬化時之應變，並利用鄰接之第1、第5連接區域CH1、CH5之未硬化之黏合劑吸收第2、第4連接區域CH2、CH4之硬化時之應變。
與此相對，於對第1~第5連接區域CH1~CH5同時照射紫外線之情形時，由於各連接區域CH1~CH5同時開始硬化，因此無法吸收鄰接之連接區域之應變。因此，根據本連接步驟，可抑制透明基板12之應變，並且可防止電子零件18之連接不良。
又，於對未與未紫外線照射之連接區域鄰接之連接區域照射紫外線之情形時，藉由照射紫外線硬化所需之最低限度之照射量，可將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。
具體而言，本連接步驟中，可於對最後照射到紫外線之第1、第5連接區域CH1、CH5照射紫外線硬化所需之最低限度之照射量之後，停止對整個連接區域CH1~CH5之紫外線照射。例如，紫外線照射器31於 開始自第1、第5紫外線照射部31a、31e之照射後經過特定時間後，例如2秒後，如圖4D所示，停止自全部紫外線照射部31a~31e之照射。
如此，由於最後照射到紫外線之第1、第5連接區域CH1、CH5不存在具備吸收硬化收縮之未硬化之黏合劑之鄰接區域，因此藉由停止於照射紫外線硬化所需之最低限度之照射量，可將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。
再者，本連接步驟中，只要錯開開始紫外線照射時間點而進行硬化即可，未必需要使紫外線照射之結束時期於各連接區域CH1~CH5中一致。
將電子零件18連接於透明基板12之透明電極17上之後，以相同之方式進行將可撓性基板21構裝於透明基板12之透明電極17上之所謂之FOG(film on glass)構裝。藉此，可製造經由異向性導電膜1將透明基板12與電子零件18或可撓性基板21連接之連接體。再者，該等COG構裝與FOG構裝亦可同時進行。
以上，以將液晶驅動用IC直接構裝於液晶顯示面板之玻璃基板上之COG構裝、及將可撓性基板直接構裝於液晶顯示面板之基板上之FOG構裝為例進行了說明，但本技術可用於COG構裝、FOG構裝以外之其他各種連接。
[其他時間點1]
又，最先開始紫外線照射之區域亦可不為一處，可於不相互鄰接之複數處同時開始紫外線照射。例如，亦可如圖5A所示，自第2及第4連接區域CH2、CH4開始紫外線照射。
此情形時亦可藉由鄰接於照射到紫外線之連接區域之連接區域、例如第1、第3、第5連接區域CH1、CH3、CH5中之未硬化之黏合劑向第2及第4連接區域CH2、CH4流動而吸收照射到紫外線之第2及第4 連接區域CH2、CH4中之應變。又，此情形時亦如圖5B所示，於對第1、第3、第5連接區域CH1、CH3、CH5等未與未紫外線照射之連接區域鄰接之連接區域照射紫外線之情形時，可藉由照射紫外線硬化所需之最低限度之照射量而將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。
[其他時間點2]
又，本連接步驟中，亦可自分割為多個之連接區域之一個端部照射紫外線。例如，如圖6A所示，紫外線照射器31開始自第1紫外線照射部31a向第1連接區域CH1之紫外線照射，經過特定時間後，例如1秒後，開始自第2紫外線照射部31b向第2連接區域CH2之紫外線照射(圖6B)，依序每經過1秒開始向鄰接之連接區域之紫外線照射(圖6C~圖6E)直到達第5連接區域CH5。
此情形時亦可藉由鄰接於照射到紫外線之連接區域之連接區域、例如鄰接於第1連接區域CH1之第2連接區域CH2中之未硬化之黏合劑向第1連接區域CH1流動而吸收照射到紫外線之第1連接區域CH1中之應變。又，此情形時亦於對未與未照射紫外線之連接區域鄰接之連接區域例如連接區域CH5照射紫外線之情形時，可藉由照射紫外線硬化所需之最低限度之照射量而將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。
[其他時間點3]
又，本連接步驟中，亦可自分割為多個之連接區域之多個端部照射紫外線。例如，如圖7A所示，紫外線照射器31開始自第1紫外線照射部31a向第1連接區域CH1之紫外線照射，同時開始自第5紫外線照射部31e向第5連接區域CH5之紫外線照射。經過特定時間後，例如1秒後，如圖7B所示，開始自第2紫外線照射部31b向第2連接區域CH2之紫外線照射，同時開始自第4紫外線照射部31d向第4連接區域CH4之紫外線照射。進 而，經過特定時間後，例如1秒後，如圖7C所示，開始自第3紫外線照射部31c向第3連接區域CH3之紫外線照射。
此情形時亦可藉由鄰接於照射到紫外線之連接區域之連接區域、例如鄰接於第1、第5連接區域CH1、CH5之第1、第4連接區域CH2、CH4中之未硬化黏合劑向第1、第5連接區域CH1、CH5流動而吸收照射到紫外線之第1、第5連接區域CH1、CH5中之應變。又，此情形時亦於對未與未照射紫外線之連接區域鄰接之第3連接區域CH3照射紫外線之情形時，可藉由照射紫外線硬化所需之最低限度之照射量而將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。
[其他時間點4]
上述中，將透明電極17之端子部17a與電子零件18連接之區域分割為排列成一行之連接區域，但亦可如圖8所示，分割為於平面上在XY方向上劃分之連接區域。此情形時亦可藉由以自中央向端部、自端部向端部、或自多個端部向中央等之方式錯開各連接區域之紫外線照射開始之時間點進行硬化而吸收伴隨黏合劑之硬化收縮而產生之應變。
又，上述中，使用紫外線硬化型黏合劑，但本發明只要可藉由照射而使黏合劑硬化，則亦可使用紫外線以外之光。又，上述中，作為導電性接著劑，對具有膜形狀之異向性導電膜1進行了說明，但即便為膏狀亦無問題。本申請案中，將含有導電性粒子4之異向性導電膜1等膜狀之導電性接著膜或膏狀之導電性接著膏定義為「接著劑」。
[實施例]
繼而，對本發明之實施例進行說明。本實施例中，形成設置有藉由將設置於玻璃基板上之透明電極與設置於IC晶片上之電極端子連接而構成5個通道之第1~第5連接區域CH1~CH5的連接體樣品(參照圖3)，對各連接體樣品根據導通電阻值(Ω)評價IC晶片與基板之連接狀態， 對顯示不均藉由測定基板之翹曲量(μm)而進行代替評價。
用於連接之異向性導電膜係由接著劑層所構成，該接著劑層係由厚度18μm之導電性粒子含有層(ACF層)所構成。ACF層係使如下成分於溶劑中熔融而製作混合溶液，並將該混合溶液塗佈於PET膜上，利用烘箱進行乾燥，成形為膜狀：苯氧基樹脂(YP-70：新日鐵化學股份有限公司製造)：20質量份
液狀環氧樹脂(EP-828：三菱化學股份有限公司製造)：30質量份
固形環氧樹脂(YD014：新日鐵化學股份有限公司製造)：20質量份
導電性粒子(AUL704：積水化學工業股份有限公司製造)：30質量份
陽離子系硬化劑(LW-S1：San-Apro股份有限公司製造)：5質量份。
以厚度成為18μm之方式調整該ACF而進行積層層壓，藉此獲得異向性導電膜。實施例及比較例中所使用之異向性導電膜係寬4.0mm×長40.0mm。
作為評價元件，使用外形：1.8mm×34.0mm
厚度：0.5mm
且形成有導通測定用配線之評價用IC。
作為評價用IC所連接之評價基材，使用玻璃厚度0.5mm且形成有導通測定用配線之玻璃基板。
於該玻璃基板上經由上述異向性導電膜配置評價用IC，藉由利用加熱按壓頭之熱加壓及紫外線照射進行連接，藉此形成連接體樣品。加熱按壓頭之熱加壓面為10.0mm×40.0mm，於加熱按壓頭之熱加壓面實施厚度0.05mm之氟樹脂加工作為緩衝材料。加熱按壓頭之溫度條件均為110℃，按壓條件均為70MPa、5秒。
紫外線照射係於利用設定為特定溫度之加熱按壓頭之 評價用IC之熱加壓開始後5秒之間進行，對各連接區域自熱加壓開始後經過特定時間後開始照射，自利用加熱按壓頭之熱加壓開始5秒後一律停止照射。自利用加熱按壓頭之評價用IC之熱加壓開始起至對實施例及比較例之各連接區域CH1~CH5之紫外線照射之經過時間係如表1所示。
實施例1中，將至對第3連接區域CH3之紫外線照射前之經過時間設為0秒，將至對第1、第2、第4、第5連接區域CH1、CH2、CH4、CH5之紫外線照射前之經過時間均設為1秒。即，實施例1中，第3連接區域CH3之紫外線照射時間為5秒，第1、第2、第4、第5連接區域CH1、CH2、CH4、CH5之紫外線照射時間為4秒。
實施例2中，將至對第3~第5連接區域CH3~CH5之紫外線照射前之經過時間設為1秒，將至對第2連接區域CH2之紫外線照射前之經過時間設為2秒，將至對第1連接區域CH1之紫外線照射前之經過時間設為3秒。即，實施例2中，第3~第5連接區域CH3~CH5之紫外線照射時間為4秒，第2連接區域CH2之紫外線照射時間為3秒，第1連接區域CH1之紫外線照射時間為2秒。
實施例3中，將至對第3連接區域CH3之紫外線照射前之經過時間設為1秒，將至對第2、第4連接區域CH2、CH4之紫外線照射前之經過時間設為2秒，將至對第1、第5連接區域CH1、CH5之紫外線照射前之經過時間設為3秒。即，實施例3中，第3連接區域CH3之紫外線照射時間為4秒，第2、第4連接區域CH2、CH4之紫外線照射時間為3秒，第1、第5連接區域CH1、CH5之紫外線照射時間為2秒。
實施例4中，將至對第1、第5連接區域CH1、CH5之紫外線照射前之經過時間設為1秒，將至對第2、第4連接區域CH2、CH4之紫外線照射前之經過時間設為3秒，將至對第3連接區域CH3之紫外線照射前之經過時間設為4秒。即，實施例4中，第1、第5連接區域CH1、CH5之紫外線照射時間為4秒，第2、第4連接區域CH2、CH4之紫外線照射時間為2秒，第3連接區域CH3之紫外線照射時間為1秒。
比較例1中，將至對第1~第5連接區域CH1~CH5之紫外 線照射前之經過時間一律設為0秒。即，比較例1中，第1~第5連接區域CH1~CH5之紫外線照射時間一律為5秒。
比較例2中，將至對第1~第5連接區域CH1~CH5之紫外線照射前之經過時間一律設為4秒。即，比較例2中，第1~第5連接區域CH1~CH5之紫外線照射時間一律為1秒。
再者，將紫外線照射時間與實施例及比較例之異向性導電膜之硬化收縮率之關係示於表2中。所謂硬化收縮率係指異向性導電膜伴隨紫外線硬化而收縮之比率，可藉由下式求出：硬化收縮率=(接著劑層之硬化物比重-接著劑層之樹脂液比重)/接著劑層之硬化物比重×100。
於以上條件下進行加熱按壓及紫外線照射而形成評價用IC連接於玻璃基板之連接體樣品，對各樣品測定翹曲(μm)之大小及導通電阻值(Ω)。
翹曲之測定方法係使用觸針式表面粗糙度計(SE-3H：小阪研究所股份有限公司製造)，如圖9所示，使觸針41自接合體樣品之玻璃基板40下面掃描，測定評價用IC之連接後之玻璃基板面之翹曲量(μm)。
導通電阻值之測定係於實施將連接體樣品於85℃、85%RH之環境下放置500小時之高溫高濕試驗之後，如圖10所示，將電流計A、電壓計V連接於與評價用IC之凸塊42連接之玻璃基板40之金屬配線43，藉由所謂之四端子法測定流通1mA電流時之導通電阻值。將結果示於表2中。
如表2所示，各實施例中，由於在第1~第5連接區域CH1~CH5間錯開紫外線之照射時間點而進行硬化，因此利用鄰接之連接區域之未硬化之黏合劑吸收先前進行紫外線照射之連接區域之硬化時之應變。因此，根據各實施例，翹曲量亦抑制為最大11.3μm，又，連接電阻亦最大為12.4Ω。因此可知：藉由本連接步驟，可抑制玻璃基板之應變，並且可防止評價用IC之連接不良。
與此相對，與熱加壓同時地對第1~第5連接區域CH1~CH5開始照射紫外線之比較例1中，各連接區域CH1~CH5同時開始硬化，又，紫外線照射時間亦較長，硬化收縮率亦較大為2.7%，因此無法吸收鄰接之連接區域之應變，翹曲量較大為14.5μm，又，連接電阻亦成為15.1Ω。
又，自熱加壓經過4秒後對第1~第5連接區域CH1~CH5開始照射紫外線之比較例2中，硬化收縮率較小為1.1%，因此翹曲抑制為 5.0μm，但硬化不充分，高溫高濕試驗後之連接電阻成為110.8Ω。
觀察各實施例，於自中央之第3連接區域CH3開始照射且依次朝向端部照射紫外線之實施例3或自端部之連接區域CH1、CH5朝向中央部照射紫外線之實施例4中，翹曲量及連接電阻較良好。認為其原因在於：由於對照射到紫外線之連接區域必定設置有未照射紫外線之連接區域，因此於較多之連接區域中，可藉由鄰接之連接區域之未硬化之黏合劑吸收硬化時之應變。
其中，實施例3中，將對端部之連接區域CH1、CH5之紫外線照射設為最後，並且照射時間亦較短，硬化收縮率亦降低。由於玻璃基板之翹曲自中央部朝外側增大，因此外側(端部)之硬化收縮率變低之實施例3最可抑制翹曲。
3‧‧‧導電性粒子含有層
12‧‧‧透明基板
17‧‧‧透明電極
18‧‧‧電子零件
31‧‧‧紫外線照射器
31a、31b、31c、31d、31e‧‧‧紫外線照射部
CH1、CH2、CH3、CH4、CH5‧‧‧連接區域

Claims (9)

  1. 一種連接體之製造方法，該連接體係於下述基板上連接有下述電子零件者，該製造方法具有下述步驟：經由光硬化型接著劑將電子零件配置於基板上，及利用複數光源來對該接著劑照射光而使其硬化；將該基板與該電子零件連接之區域分割為多個連接區域，被分割為多個的該連接區域相互鄰接地並列，對每個該連接區域，分別對對應之該光源進行照射控制，並錯開該光照射開始時間點而進行硬化。
  2. 如申請專利範圍第1項之連接體之製造方法，其中，自分割為多個之該連接區域的任意一個或多個開始該光照射，經過特定時間後，開始對該任意一個或多個連接區域以外之連接區域照射該光。
  3. 如申請專利範圍第2項之連接體之製造方法，其中，對最後照射該光之連接區域照射光硬化所需之最低限度的照射量後，停止對整個連接區域之光照射。
  4. 如申請專利範圍第2項之連接體之製造方法，其中，自分割為多個之該連接區域中該基板與該電子零件連接區域的中央連接區域開始該光之照射，經過特定時間後，開始對該中央連接區域以外之連接區域照射該光。
  5. 如申請專利範圍第4項之連接體之製造方法，其中，自該中央連接區域朝向該基板與該電子零件連接區域的端部之該連接區域分階段地延遲開始該光照射之時間點。
  6. 如申請專利範圍第2項之連接體之製造方法，其中，自該基板與該電子零件連接區域的一個或多個端部之該連接區域開始該光照射， 經過特定時間後，對該一個或多個端部之連接區域以外的連接區域開始該光照射。
  7. 如申請專利範圍第6項之連接體之製造方法，其中，自該基板與該電子零件連接區域的一個端部之該連接區域開始該光照射，朝向該基板與該電子零件連接區域的其他端部之該連接區域分階段地延遲開始該光照射之時間點。
  8. 如申請專利範圍第6項之連接體之製造方法，其中，自該基板與該電子零件連接區域的多個端部之該連接區域開始該光照射，朝向該基板與該電子零件連接區域的中央之該連接區域分階段地延遲開始該光照射之時間點。
  9. 一種電子零件之連接方法，其將下述電子零件連接於下述基板上，具有下述步驟：經由光硬化型接著劑將電子零件配置於基板上，及利用複數光源來對該接著劑照射光而使其硬化；將該基板與該電子零件連接之區域分割為多個連接區域，被分割為多個的該連接區域相互鄰接地並列，對每個該連接區域，分別對對應之該光源進行照射控制，並錯開該光照射開始之時間點而進行硬化。
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