TWI564986B - Carry-out method of object, exchange method of object, object holding apparatus, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method - Google Patents

Description

Method for carrying out object, method for replacing object, object holding device, exposure device, method for manufacturing flat panel display, and device manufacturing method

The present invention relates to an object carrying-out method, an object replacing method, an object holding device, an exposure device, a flat display display manufacturing method, and a component manufacturing method, and more particularly, relating to an object on an object holding device together with an object supporting member a method for removing an object carried out by the object holding device, a method for replacing an object on the object holding device including the method for carrying out the object, and an object holding device including at least one part for carrying out the unloading device of the object, and the object An exposure apparatus for a holding device, a method of manufacturing a flat display using the above exposure apparatus, and a method of manufacturing an element using the exposure apparatus described above.

Conventionally, a lithography process for manufacturing electronic components (microcomponents) such as a liquid crystal display element or a semiconductor element (integrated circuit) is mainly a step-and-repeat projection exposure apparatus (a so-called stepping machine). ), or a step-and-scan type projection exposure apparatus (so-called scanning stepper (also called a scanner)).

As such an exposure apparatus, it is known that a glass plate or a wafer (hereinafter collectively referred to as "substrate") of an object to be exposed is carried in and out of the substrate stage device using a predetermined substrate transfer device (for example, refer to Patent Document 1) ).

Here, in the exposure apparatus, when the exposure processing for the substrate held by the substrate stage apparatus is completed, the substrate is carried out from the substrate stage, and the other substrate is transferred to the substrate stage, and the continuous operation is performed. For plural Exposure processing of the substrate. Therefore, when the exposure processing is continuously performed on a plurality of substrates, it is preferable that the substrate can be quickly carried out from the substrate stage device.

Advanced technical literature

[Patent Document 1] US Patent No. 6,559,928

The present invention has been made in view of the above circumstances, and a first aspect thereof is a method for carrying out an object, comprising: an object holding device for holding an object holding member for holding an object and an object supporting member for transporting the object, facing the object The object carrying-out position is moved by the holding member, and the object holding device is moved out of the object holding member before the object holding device reaches the object carrying-out position.

According to this method, since the object carrying operation is started before the object holding device reaches the object carrying-out position, the object carrying-out operation on the object holding member can be quickly performed.

According to a second aspect of the present invention, a method for replacing an object on an object holding device includes: an operation of carrying out an object carrying out method according to the first aspect of the present invention; and supporting the object holding device before reaching the object carrying-out position The other object supporting the other object supporting member moves in a predetermined standby position; and the object holding member and the object supporting member supporting the object are carried out from the object holding device in a state where the object holding device is located at the object carrying-out position; And an action of loading the other object located at the standby position with the other object supporting member supporting the other object into the object holding device.

According to a third aspect of the present invention, an object holding device includes: an object holding member that holds an object and an object supporting member for transporting the object; and the object held by the object holding member and the object supporting the object At least a portion of the unloading device with which the members are carried out from the object holding member.

A fourth aspect of the present invention provides an exposure apparatus comprising: the object holding device according to the third aspect of the present invention; and a pattern forming device that forms a predetermined pattern using the energy beam in the object.

A fifth aspect of the present invention is an exposure apparatus for exposing an object by an energy beam to form a pattern on the object, comprising: an object holding device having an object for holding the object and an object supporting member for transporting the object a holding member, at least one portion of a carrying device that carries out the object held by the object holding member from the object holding member together with the object supporting member for supporting the object; and a pattern forming device that uses an energy beam The object forms a predetermined pattern.

According to a sixth aspect of the invention, there is provided a method of manufacturing a flat panel display comprising: an operation of exposing the object using an exposure apparatus according to the fourth or fifth aspect of the invention; and an operation of developing the object after exposure.

According to a seventh aspect of the invention, there is provided a device manufacturing method comprising: an operation of exposing the object using an exposure apparatus according to the fourth or fifth aspect of the invention; and an operation of developing the object after exposure.

"First Embodiment"

Hereinafter, the first embodiment will be described with reference to Figs. 1 to 8(C).

The configuration of the liquid crystal exposure apparatus 10 of the first embodiment is schematically shown in Fig. 1 . The liquid crystal exposure device 10 is a projection exposure device in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) such as a liquid crystal display device (planar display) is used as an exposure target.

The liquid crystal exposure apparatus 10 includes an illumination system IOP, a mask stage MST holding the mask M, a projection optical system PL, and a surface (the surface facing the +Z side in FIG. 1) coated with a photoresist (sensing agent). The substrate stage device PST of the substrate P, the substrate carrying device 50, and the top portion 60a for receiving the substrate between the external device and the like, and the like. Hereinafter, the direction in which the exposure mask M and the substrate P are scanned with respect to the projection optical system PL is defined as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis and the Y-axis. The directions in the Z-axis direction and the directions around the X-axis, the Y-axis, and the Z-axis are defined as θ x , θ y , and θ z directions, respectively. In addition, the positions of the X-axis, the Y-axis, and the Z-axis direction are assumed to be the X position, the Y position, and the Z position, respectively.

The illumination system IOP has the same configuration as the illumination system disclosed in, for example, the specification of U.S. Patent No. 6,552,775. In other words, the illumination system IOP emits light emitted from a light source (for example, a mercury lamp) (not shown) via an unillustrated mirror, a dichroic mirror, a blind, a filter, various lenses, or the like as an illumination light for exposure (illumination) Light) IL illuminates the mask M. For the illumination light IL, for example, an i-line (wavelength: 365 nm), a g-line (wavelength: 436 nm), an h-line (wavelength: 405 nm), or the like (or the above-described i-line, g-line, and h-line combined light) is used.

The reticle stage MST is adsorbed and held by, for example, vacuum adsorption. A mask M having a circuit pattern or the like is formed on the pattern surface. The mask stage MST is mounted on the barrel stage 16 of a part of the apparatus body (body), and is driven in the scanning direction by a predetermined length stroke, for example, by a mask stage driving system (not shown) including a linear motor. The axis direction) is appropriately micro-driven in the Y-axis direction and the θ z direction. The position information (including the rotation information in the θ z direction) of the mask stage MST in the XY plane is obtained by a mask interferometer system including a laser interferometer (not shown).

The projection optical system PL is disposed below the mask stage MST and supported by the barrel stage 16. The projection optical system PL has the same configuration as the projection optical system disclosed in the specification of U.S. Patent No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the pattern image of the mask M is arranged in a zigzag pattern, and has a rectangular shape with a longitudinal direction in the Y-axis direction. The projection optics of a single image field have the same function. In the present embodiment, each of the plurality of projection optical systems is formed by using, for example, a double-centered telecentric system and forming an erect image.

Therefore, when the illumination area on the reticle M is illuminated by the illumination light IL from the illumination system IOP, that is, by the illumination light IL passing through the reticle M, the circuit of the reticle M in the illumination area is transmitted through the projection optical system PL. The pattern projection image (partial erect image) forms an irradiation region (exposure region) of the illumination light IL conjugated to the illumination region on the substrate P. Then, by the synchronous driving of the mask stage MST and the substrate stage device PST, the mask M is moved in the scanning direction with respect to the illumination area (illumination light IL), and the substrate P is moved relative to the exposure area (illumination light IL). In the scanning direction, scanning exposure of one irradiation region on the substrate P is performed, and the pattern formed on the mask M is transferred to the irradiation region. that is, In the present embodiment, the pattern of the mask M is formed on the substrate P by the illumination system IOP and the projection optical system PL, and the exposure layer (photoresist layer) on the substrate P is irradiated onto the substrate P by the illumination light IL. pattern.

The substrate stage device PST includes a stage 12 and a substrate stage 20a disposed above the stage 12.

The platform 12 is formed of a rectangular plate-like member in plan view (viewed from the +Z side), and the upper surface thereof is processed to a very high flatness. The stage 12 is mounted on a substrate stage stand 13 of a part of the apparatus body. The apparatus including the substrate stage gantry 13 is mounted on the vibration isolating device 14 provided on the floor 11 of the clean room, whereby the reticle stage MST, the projection optical system PL, and the like are vibrated with respect to the ground 11 Separation.

The substrate stage 20a includes an X coarse movement stage 23X, and a Y coarse movement stage which is mounted on the X coarse motion stage 23X and the X coarse movement stage 23X to constitute a so-called gantry type XY biaxial stage apparatus. 23Y, a fine movement stage 21 disposed on the +Z side (upper side) of the Y coarse movement stage 23Y, a substrate holder 30a holding the substrate P, and a weight eliminating device 26 for supporting the fine movement stage 21 from below on the stage 12 .

The X coarse movement stage 23X is formed of a rectangular member having a longitudinal direction in the Y-axis direction in plan view, and a long hole-shaped opening portion (not shown) having a longitudinal direction in the Y-axis direction is formed in a central portion thereof. The X coarse movement stage 23X is mounted on a guide (not shown) that is provided on the floor 11 and extends in the X-axis direction, and includes a linear motor, for example, during a scanning operation during exposure or a substrate replacement operation. The X stage drive is driven in the X-axis direction with a predetermined stroke.

The Y coarse movement stage 23Y is composed of a member having a rectangular shape in plan view, and a central portion thereof An opening (not shown) is formed. The Y coarse movement stage 23Y is mounted on the X coarse motion stage 23X through the Y linear guide device 25, and is, for example, a Y stage drive system including a linear motor or the like in the Y step operation during exposure. The stage 23X is driven in the Y-axis direction with a predetermined stroke. Further, the Y coarse movement stage 23Y is moved integrally with the X coarse motion stage 23X in the X-axis direction by the action of the Y linear guide device 25.

The fine movement stage 21 is constituted by a rectangular parallelepiped member having a substantially square shape in plan view. The fine movement stage 21 is a micro-motion stage drive system including a plurality of voice coil motors (or linear motors) composed of a stator fixed to the Y coarse movement stage 23Y and a movable body fixed to the fine movement stage 21, The Y coarse movement stage 23Y is micro-driven in the six-degree-of-freedom direction (X-axis, Y-axis, Z-axis, θ x, θ y, and θ z directions). The plurality of voice coil motors include a plurality of (in FIG. 1 overlapped in the depth direction of the drawing) X-coil motor 29x that micro-drives the micro-motion stage 21 in the X-axis direction, and micro-drives the micro-motion stage 21 to the Y-axis. a plurality of Y-coil motors (not shown) in the direction, and a Z-voice coil that micro-drives the fine movement stage 21 in the Z-axis direction (for example, at positions corresponding to the four corners of the micro-motion stage 21) Motor 29z.

Further, the fine movement stage 21 is induced by the Y coarse movement stage 23Y through the plurality of voice coil motors, and moves along the XY plane along the Y-axis direction and/or the Y-axis direction along the XY plane together with the Y coarse motion stage 23Y. . The position information in the XY plane of the fine movement stage 21 is obtained by a substrate interferometer system including a moving mirror fixed to the fine movement stage 21 to the transmission mirror mount 24 (including having an orthogonal to the X axis) The X moving mirror 22x of the reflecting surface and the Y moving mirror (not shown) having the reflecting surface orthogonal to the Y axis illuminate the ranging An interferometer (not shown) (including an X interferometer that measures the X position of the fine movement stage 21 using the X moving mirror 22x and a Y interferometer that measures the Y position of the fine movement stage 21 using the Y moving mirror). The configuration of the micro-motion stage drive system and the substrate interferometer system is disclosed, for example, in the specification of U.S. Patent Application Serial No. 2010/0018950.

The substrate holder 30a is composed of a low-height rectangular parallelepiped member having a rectangular shape in the longitudinal direction of the X-axis direction, and is fixed to the upper surface of the fine movement stage 21. A plurality of holes (not shown) are formed on the upper surface of the substrate holder 30a. The substrate holder 30a is connected to a vacuum device provided outside, and the substrate P can be adsorbed and held by the vacuum device. The configuration of the substrate holder 30a will be described later.

The weight eliminating device 26 is constituted by a column-like member extending from the Z-axis direction (also referred to as a stem), and is supported by a device called a leveling device 27 to support the central portion of the fine movement stage 21 from below. The weight eliminating device 26 is inserted into each of the openings of the X coarse movement stage 23X and the Y coarse motion stage 23Y. The weight eliminating device 26 is suspended on the platform 12 via a plurality of air bearings 26a mounted on the lower portion thereof with a small gap therebetween. The weight eliminating device 26 is connected to the Y coarse movement stage 23Y through a plurality of coupling devices 26b at a position of the center of gravity of the Z-axis direction, and is pulled by the Y coarse movement stage 23Y together with the Y coarse movement stage 23Y on the platform. 12 moves in the Y-axis direction and/or the X-axis direction.

The weight eliminating device 26 has, for example, an air spring (not shown), and the force in the vertical direction by the air spring is eliminated (offset) by the weight of the fine movement stage 21, the leveling device 27, the substrate holder 30a, etc. (vertical direction) Under the force), according to this, reduce the number of voice coil motors of the micro-motion stage drive system load. The leveling device 27 supports the fine movement stage 21 from below to be swingable (tilting motion) with respect to the XY plane. The leveling device 27 supports the weight eliminating device 26 in a non-contact manner from below by an air bearing (not shown). The leveling device 27, the connecting device 26b, and the like are included, and the detailed configuration and operation of the weight eliminating device 26 are disclosed, for example, in the specification of US Patent Publication No. 2010/0018950.

At this time, in the liquid crystal exposure apparatus 10, the loading of the substrate P into the substrate holder 30a and the unloading of the substrate P from the substrate holder 30a are performed by loading the substrate P in FIG. 2(A) and FIG. 2 ( B) is shown as being referred to as a member of the substrate tray 40a.

As shown in FIG. 2(A), the substrate tray 40a includes a plurality of support members 41, a connection member 42, a plurality of reinforcing members 43, and the like. The support member 41 is formed of a rod-shaped member extending in the X-axis direction, and has a rectangular cross section (YZ cross section) orthogonal to the longitudinal direction. The plurality of support members 41 are arranged in parallel with each other at substantially equal intervals in the Y-axis direction. As shown in FIG. 5, the dimension of the longitudinal direction of the support member 41 is set to be slightly longer than the dimension of the substrate P in the X-axis direction, and the substrate tray 40a supports the substrate P from below using a plurality of support members 41. A plurality of minute holes (not shown) are formed on each of the plurality of support members 41, and the substrate P can be adsorbed and held through the plurality of holes. Further, the substrate tray 40a of the first embodiment shown in FIG. 2(A), FIG. 4, FIG. 5 and the like has three support members 41, for example, but the number of the support members 41 is not limited thereto, for example, visible. The size, thickness (flexibility) of the substrate P, and the like are appropriately changed.

On the +X side end of each of the plurality of support members 41, as shown in Fig. 2(B) A taper member 44a (conical trapezoidal member) having a tapered surface that tapers from the -X side to the +X side is attached. Further, a tapered member 44b having a tapered surface which tapers from the +X side to the -X side is attached to the -X side end portion of each of the plurality of support members 41.

As shown in FIGS. 2(A) and 2(B), the connecting member 42 is formed of a rod-shaped member having a rectangular XZ cross section extending in the Y-axis direction. The connecting member 42 has a lower portion fitted to a concave portion formed on the upper side of the +X side end portion of each of the plurality of supporting members 41, and connects the plurality of supporting members 41 to each other. The plurality of reinforcing members 43 are formed of a rod-shaped member having a rectangular XZ cross section extending in the Y-axis direction, and the thickness thereof is set to be thinner than the supporting member 41. As shown in FIG. 2(B), each of the plurality of support members 41 has a concave portion formed at a predetermined interval in the X-axis direction, and the reinforcing member 43 is fitted to each of the plurality of concave portions. The depth of the concave portion in which the reinforcing member 43 is fitted is set such that the upper surface of the reinforcing member 43 is located on the -Z side (or the same Z position) than the upper surface of the supporting member 41. The substrate tray 40a is connected to each other by a plurality of reinforcing members 43 at the intermediate portion in the longitudinal direction of the plurality of support members 41, thereby increasing the rigidity of the entire body.

Further, in the plurality of support members 41 (for example, three in the present embodiment), the central support member 41 has a rectangular parallelepiped projection 45a near the -X side end portion of the lower surface. The function of the protrusion 45a is left to be described later.

As shown in FIG. 3, a plurality of support members 41 (see FIG. 2(A)) corresponding to the substrate tray 40a on the upper surface (substrate mounting surface) of the substrate holder 30a are extended to the X-axis Xx of the X-axis in the Y-axis direction. A plurality of strips are formed at predetermined intervals (for example, three in the first embodiment). The X groove 31x is open on each of the +X side and the -X side of the substrate holder 30a. Multiple X The interval between the grooves 31x in the Y-axis direction substantially coincides with the interval between the plurality of support members 41 of the substrate tray 40a shown in Fig. 2(A) in the Y-axis direction. As shown in FIG. 4(A), in a state where the substrate P is mounted on the substrate holder 30a, the support member 41 of the substrate tray 40a is housed in the X groove 31x. Further, the length of the substrate holder 30a in the X-axis direction is set to be shorter than the length of the support member 41 in the X-axis direction, and the connection member 42 is positioned in the substrate holder 30a in a state where the substrate tray 40a is combined with the substrate holder 30a. The outer side (more on the +X side than the +X side end of the substrate holder 30a), the tapered members 44a and 44b respectively protrude from the outer side of the substrate holder 30a.

Referring back to Fig. 3, on the upper surface of the substrate holder 30a, a plurality of reinforcing members 43 corresponding to the substrate tray 40a (see Fig. 2(A)), Y grooves 31y extending in the Y-axis direction are formed at predetermined intervals in the X-axis direction. There are a plurality of strips (for example, three in the first embodiment). The interval between the plurality of Y grooves 31y in the X-axis direction is substantially the same as the interval between the plurality of reinforcing members 43 of the substrate tray 40a shown in FIG. 2(A) in the X-axis direction, as shown in FIG. 4(A), on the substrate. In a state where the tray 40a is combined with the substrate holder 30a, the reinforcing member 43 of the substrate tray 40a is housed in the Y groove 31y.

Referring back to Fig. 3, in the X slots 31x of the plurality of X slots 31x, except for the X slots 31x of the center X slots 31x (in the first embodiment, the two X slots 31x on the +Y side and the -Y side), respectively In the first embodiment, in the first embodiment, one X-slot 31x accommodates, for example, three at a predetermined interval in the X-axis direction. As shown in FIG. 4(B), the tray guide 32 has a Z actuator 34 housed in a recess 33 formed in a bottom surface for defining the X slot 31x, and a Z actuator 34 in the X slot. Drive up and down (Z axis) in 31x Directional guide 35. The type of the Z actuator 34 is not particularly limited, and for example, a cam device that converts a force in the horizontal direction into a force in the vertical direction, a feed screw device, an air actuator, or the like can be used. The Z actuators 34 of the plurality of tray guides 32 are synchronously driven by a main control unit (not shown). The guide 35 is composed of a plate-like member parallel to the XY plane, and supports the support member 41 of the substrate tray 40a from below. A plurality of micro-hole portions (not shown) are formed on the upper surface of the guide member 35, and a pressurized gas (for example, air) can be ejected from the hole portion, and the support member 41 can be suspended and supported via a small gap. Further, the guide member 35 can adsorb and hold the support member 41 mounted thereon on the above-described hole portion (or another hole portion).

Referring back to Fig. 3, the substrate carrying device 70a is housed in the X slot 31x in the center among the plurality of X slots 31x. The substrate carrying-out device 70a has an X traveling guide 71 and a pressing member 72a. The X traveling guide 71 is constituted by a member extending in the X-axis direction, and is fixed to a bottom surface for defining the X groove 31x. The long side (X-axis) direction dimension of the X traveling guide 71 is set to be longer than the X-axis direction dimension of the substrate holder 30a, and both end portions in the longitudinal direction thereof protrude from the outside of the substrate holder 30a. As shown in FIG. 7(A), the pressing member 72a is formed of an L-shaped member having an XZ cross section, and the portion parallel to the XY plane is engaged with the X traveling guide 71 so as to be slidable in the X-axis direction, with a predetermined stroke. The X traveling guide 71 is driven in the X-axis direction. The type of the driving means for driving the pressing member 72a is not particularly limited, and for example, an X linear motor composed of a stator having the X traveling guide 71 and a movable member of the pressing member 72a, or an X traveling guide can be used. A feed screw device or the like which has a feed screw and a nut having a pressing member 72a.

As shown in FIG. 1, the substrate loading device 50 includes a first transport unit 51a and a second transport unit 51b. The first transfer unit 51a is disposed above the crotch portion 60a, and the second transfer unit 51b is disposed on the -X side of the first transfer unit 51a, and the substrate stage 20a is moved to the crotch portion when the substrate P is replaced. The position adjacent to 60a (the position on the vicinity of the +X side end of the stage 12, hereinafter referred to as the substrate replacement position) is located above the substrate holder 30a. In addition, the substrate replacement position can be referred to as a substrate carry-out position (object removal position) in which the substrate P held by the substrate holder 30a (substrate stage 20a) is carried out from the substrate holder 30a (substrate stage 20a). ).

As shown in FIG. 5, the first transport unit 51a has a pair of X traveling guides 52, a pair of X sliders 53 corresponding to the pair of X traveling guides 52, and a holding between the pair of X sliders 53. Member 54a. Each of the pair of X traveling guides 52 is formed of a member extending in the X-axis direction, and its longitudinal direction dimension is set to be slightly longer than the dimension of the substrate P in the X-axis direction. The pair of X traveling guides 52 are disposed in parallel with each other at a predetermined interval (a space which is slightly wider than the dimension of the substrate P in the Y-axis direction) in the Y-axis direction. The pair of X sliders 53 are respectively engaged with the corresponding X traveling guides 52 so as to be slidable in the X-axis direction, and are not shown (for example, a feed screw device, a linear motor, a belt drive device, etc.) The X-travel guide 52 is driven synchronously with a predetermined stroke.

The holding member 54a is constituted by a member extending in the Y-axis direction, and a plurality of concave portions 55a are formed on the surface facing the -X side. The plurality of concave portions 55a are formed in plural at a predetermined interval (at substantially the same interval from the interval between the plurality of tapered members 44a of the substrate tray 40a in the Y-axis direction) in the Y-axis direction. The concave portion 55a is defined by a tapered surface that is tapered from the -X side toward the +X side, and the holding member 54a is A plurality of tapered members 44a that have passed through the substrate tray 40a are inserted into a plurality of recessed portions 55a, thereby holding the +X side end portions of the substrate tray 40a. The pair of X traveling guides 52, the pair of X sliders 53, and the holding member 54a are driven in the Z-axis direction by a Z actuator (not shown) with a predetermined stroke. Further, the Z position of the pair of X traveling guides 52 and the pair of X sliders 53 may be changed, and only the holding member 54a may be moved in the Z-axis direction with respect to the pair of X traveling guides 52. In the configuration of the second transport unit 51b, the plurality of concave portions 55b inserted by the tapered member 44b of the substrate tray 40a are formed on the +X side surface portion of the holding member 54b, and are the same as the first transport unit 51a. Therefore, the description thereof is omitted. .

In the substrate loading device 50, the plurality of X sliders 53 can be synchronously driven while the substrate tray 40a is held by the holding member 54a of the first transport unit 51a and the holding member 54b of the second transport unit 51b, so that the substrate tray 40a is driven along The XY plane (horizontal plane) moves between the top portion 60a and the upper portion of the substrate replacement position. Further, the substrate loading device 50 can drive the first transfer unit 51a and the second transfer unit 51b in the Z-axis direction in synchronization with each other, and the substrate tray 40a can be respectively disposed above the crotch portion 60a or above the substrate replacement position. Move up and down.

Next, the loading operation of loading the substrate P into the substrate holder 30a by using the substrate loading device 50 will be described with reference to FIGS. 6(A) to 6(C). In addition, in FIGS. 6(A) to 6(C), for the sake of simplification of description, members other than the substrate holder 30a in the substrate stage 20a, and members other than the holding members 54a and 54b in the substrate loading device 50 are illustrated. , omitted separately. As shown in FIG. 6(A), the substrate tray 40a held by the holding members 54a and 54b is conveyed to the upper side of the substrate holder 30a at the substrate replacement position. Substrate stage 20a The y position is substantially equal to the Y position of the plurality of support members 41 (see FIG. 2(A)) positioned in the substrate tray 40a and the Y positions of the plurality of X grooves 31x. In the substrate holder 30a, the guides 35 of the plurality of tray guides 32 are positioned such that they are positioned on the +Z side (projecting from the upper surface of the substrate holder 30a) above the substrate holder 30a. Further, the pressing member 72a of the substrate carrying-out device 70a is positioned at the most X-side position of the movable range and outside the substrate holder 30a. The length of the X traveling guide 71 is set such that the pressing member 72a does not come into contact with the substrate tray 40a when the substrate is loaded.

From the state shown in FIG. 6(A), the main control unit (not shown) drives the holding members 54a and 54b in the -Z direction (see the arrow of FIG. 6(A)), whereby the substrate tray 40a is driven. lower. Accordingly, as shown in FIG. 6(B), the substrate tray 40a is delivered to a plurality of tray guides 32, and is adsorbed and held by the plurality of guides 35. In the state in which the substrate tray 40a is mounted on the guides 35 of the plurality of tray guides 32, the main control device drives the holding members 54a and 54b in the direction away from the substrate tray 40a (refer to FIG. 6(B). After the arrow), as shown in FIG. 6(C), it is driven upward (refer to the arrow of FIG. 6(C)).

Further, in the substrate holder 30a, as shown in FIG. 6(C), a plurality of guides 35 are synchronously driven in the -Z direction (see an arrow in FIG. 6(C)), whereby the substrate tray 40a and the substrate are lowered. P is mounted on the upper surface of the substrate holder 30a. Further, the plurality of guides 35 are further driven in the -Z direction after the substrate P is mounted on the upper surface of the substrate holder 30a. Thereby, the substrate tray 40a is separated from the lower surface of the substrate P, and the substrate P is adsorbed and held by the substrate holder 30a.

Referring back to Fig. 1, the dam portion 60a has a gantry 61 and a plurality of tray guides 62 (which are covered in the depth direction of the paper in Fig. 1 and are shielded. See Fig. 3). The gantry 61 is provided on the floor 11 and at the +X side of the stage 12, and is housed in a chamber (not shown) together with the substrate stage device PST.

As shown in FIG. 3, the plurality of tray guides 62 (for example, two in the present embodiment) are mounted on the gantry 61 at predetermined intervals in the Y-axis direction. Further, the crotch portion 60a of the present embodiment has, for example, two tray guiding devices 62, but the number of the plurality of tray guiding devices 62 is not limited thereto, for example, the supporting member 41 of the substrate tray 40a (not shown in FIG. 3) The number of the reference Fig. 2(A)) is appropriately changed. Specifically, the support members 41 other than the support members 41 having the projections 45a (see FIG. 2(B)) (the central support members 41 in the first embodiment) are associated with the plurality of support members 41, The tray guide 62 is disposed on the gantry 61. In the present embodiment, for example, the interval between the two tray guides 62 in the Y-axis direction is as shown in FIG. 5 between the support member 41 on the most +Y side of the substrate tray 40a and the support member 41 on the most-Y side. The intervals are roughly the same.

As shown in FIG. 1, the tray guide 62 has a susceptor 63 composed of a plate-like member extending in the X-axis direction, and a plurality of (for example, three) mounted on the susceptor 63 at a predetermined interval in the X-axis direction. The Z actuator 64 and a plurality of guides 65 and the like that are driven by the Z actuator 64 in the up and down (Z axis) direction. The pedestal 63 is composed of a plurality of X linear guides 66 fixed to the upper surface of the gantry 61 and an X linear guide 67 fixed to the lower surface of the pedestal 63 and slidably engaged with the X linear guide 66 of the X linear guide 66. , straight forward guides the X-axis direction. Further, the base 63 is an X actuator (not shown) (for example, a feed screw device, a linear horse) 达, etc.) is driven in the X-axis direction with a predetermined stroke. The type of the Z actuator 64 is not particularly limited, and for example, a cam device, a feed screw device, an air actuator, or the like can be used. The Z actuators 64 of the plurality of tray guides 62 are synchronously driven by a main control unit (not shown). The guide 65 is composed of a plate-like member parallel to the XY plane, and a support member 41 of the substrate tray 40a is mounted on the upper surface thereof (see FIG. 2(A)). A plurality of micro hole portions (not shown) are formed on the upper surface of the guide member 65, and by pressing a pressurized gas (for example, air) from the hole portion, the substrate tray 40a can be suspended and supported via a small gap.

Next, the transfer operation (substrate unloading operation) of transferring the substrate P loaded on the substrate tray 40a and the substrate tray 40a from the substrate holder 30a to the crotch portion 60a by using the substrate unloading device 70a, using FIGS. 7(A) and 7 (B) Explain. In addition, in FIGS. 7(A) and 7(B), in order to simplify the description, the components other than the substrate holder 30a and the portion of the gantry 61 in the crotch portion 60a of the substrate stage 20a are omitted. When the substrate P is carried out from the substrate holder 30a, the substrate holder 30a is driven by the plurality of tray guides 32 to drive the plurality of tray guides 35 synchronously after the substrate P is sucked and held as shown in Fig. 7(A). In the +Z direction. As a result, the substrate tray 40a rises, and the substrate P is supported by the plurality of support members 41 from below. Further, after the substrate P is supported by the substrate tray 40a, the main control device further moves the plurality of guides 35 in the +Z direction. As a result, the substrate P moves integrally with the substrate tray 40a in the +Z direction, and the lower surface of the substrate P is separated from the upper surface of the substrate holder 30a. At this time, the main control device separates the substrate P from the substrate holder 30a, and drives the guide 35 with the minimum stroke required for the lower surface of the plurality of reinforcing members 43 to be located on the +Z side of the upper surface of the substrate holder 30a. Therefore, the substrate tray 40a The plurality of support members 41 are in a state in which the lower half thereof is housed in the X groove 31x.

Further, in the crotch portion 60a, a plurality of tray guiding devices 62 are driven in the -X direction (on the substrate stage 20a side), and the -X side end portion of the susceptor 63 is positioned at a position protruding from the gantry 61 toward the -X side. . Further, a plurality of Z actuators 64 are controlled such that the Z positions of the plurality of guides 65 are substantially the same as the Z positions of the plurality of guides 35 in the substrate holder 30a (or slightly - Z side).

Next, in the substrate holder 30a, the pressing member 72a of the substrate unloading device 70a is driven in the +X direction. The Z position (height) of the pressing member 72a is set to be in contact with the projection 45a in a state in which the substrate P is carried out and the substrate tray 40a is supported by the plurality of tray guiding devices 32 in the substrate holder 30a. Therefore, when the pressing member 72a is driven in the +X direction, as shown in FIG. 7(B), the substrate tray 40a is pressed by the pressing member 72a, and moves integrally with the pressing member 72a in the +X direction. Further, the dam portion 60a is driven in the +X direction in conjunction with the substrate tray 40a moving in the +X direction.

At this time, the guide 35 on the substrate holder 30a side and the guide 65 on the side of the flange portion 60a respectively eject pressurized gas to the lower surface of the support member 41 to suspend and support the substrate tray 40a. Therefore, the substrate tray 40a (substrate P) can be carried out from the substrate holder 30a to the crotch portion 60a at a high speed and with low dust generation. Further, since the substrate P is carried out at a high speed, the substrate tray 40a can avoid the positional deviation of the substrate P, and the adsorption holding substrate P can be held only by the frictional force. Further, a regulating member that restricts movement of the substrate P on the substrate tray 40a (for example, a pin-shaped member protruding from the supporting member 41, etc.) may be provided on the substrate holder. Disk 40a. Further, since the substrate tray 40a is suspended and supported, in order to prevent the substrate tray 40a from being separated from the pressing member 72a when the pressing member 72a is pressed against the substrate tray 40a, for example, an adsorption device (for example, vacuum suction) in which the adsorption holding projection 45a is provided to the pressing member 72a can be provided. Device, magnetic gas adsorption device, etc.). Alternatively, for example, a mechanism (for example, a lock pin or the like) that mechanically engages the pressing member 72a and the substrate tray 40a may be provided. Further, for example, the suction holding device of the guide 35 can apply a light load (braking force) in the -Z direction to the substrate tray 40a, thereby preventing the pressing member 72a from being separated from the projection 45a.

Further, in the first embodiment, the substrate P is carried out by the substrate carrying device 70a included in the substrate holder 30a, but it may be used in combination with the holding portion of the substrate tray 40a in the +X direction. The other substrate unloading device switches from the substrate unloading operation using the substrate unloading device 70a to the substrate unloading operation using the other substrate unloading device during the movement of the substrate tray 40a. In this case, the stroke of the pressing member 72a can be shortened. Further, since the substrate tray 40a is suspended and supported, the substrate tray 40a pressed by the pressing member 72a (the thrust applied to the +X direction) can be moved from the guide 35 to the guide 65 by inertia. Also in this case, the stroke of the pressing member 72a can be shortened.

In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is attached to the mask stage MST by a mask loader (not shown) under the management of a main control unit (not shown). Loading and loading of the substrate P onto the substrate holder 30a is performed by the substrate loading device 50. Thereafter, the main control device performs the alignment measurement using an alignment detection system (not shown). After the alignment measurement is completed, the plurality of illumination regions set on the substrate P are successively performed. Exposure action in step & scan mode. Since this exposure operation is the same as the exposure operation of the step-and-scan method which has been conventionally performed, detailed description thereof will be omitted. Then, the substrate on which the exposure process is completed is carried out from the substrate holder 30a, and the other substrate to be exposed next is transferred to the substrate holder 30a to perform substrate replacement on the substrate holder 30a. The sheet substrate is continuously subjected to an exposure operation or the like.

Next, the substrate replacement operation on the substrate holder 30a of the liquid crystal exposure apparatus 10 will be described with reference to FIGS. 8(A) to 8(C). In addition, in FIGS. 8(A) to 8(C), members other than the substrate holder 30a on the substrate stage 20a and members other than the holding members 54a and 54b in the substrate loading device 50 are used in the crotch portion. In the case of 60a, part of the illustration of the gantry 61 is omitted. In the first embodiment, in the substrate replacement operation on the substrate holder 30a, as shown in Figs. 8(A) to 8(C), two substrate trays 40a are used (for convenience, the substrate is referred to as a substrate). The trays 40a ₁ and 40a ₂ ) convey the substrate P. The two substrate trays 40a ₁ and 40a ₂ are substantially identical. The following substrate replacement operation is performed under the management of a main control device (not shown).

FIG 8 (A), the unloaded from the substrate holder 30a of the exposure process has been completed the substrate P ₁ is loaded on a substrate tray 40a _1, 40a ₁ of the substrate by the substrate holder tray having a plurality of trays 30a of the guide The device 32 is supported from below. On the other hand, the other substrate P _{2 which} is to be subjected to exposure processing in the next sheet is loaded on the other substrate tray 40a ₂ . Further, the substrate tray 40a ₂ is held by the holding members 54a, 54b, and is positioned above the substrate holder 30a when the substrate holder 30a is at the substrate replacement position.

At this time, the main control means is set on a plurality of shot areas on the _substrate P, the final process after the exposure of one shot area of the substrate below the table 20a from the projection optical system PL (refer to FIG. 1) to move The substrate replacement position (the position adjacent to the crotch portion 60a). Next, as shown in FIG. 8(A), the main control device controls a plurality of tray guides 32 in the substrate holder 30a to move the substrate tray during the movement of the substrate stage 20a, that is, before reaching the substrate replacement position. 40a ₁ P ₁ rises to the substrate from the substrate holder 30a having left the above, the substrate carry-out and further control means 70a, 72a of the substrate using the pressing member toward the pallet 40a ₁ + X side (port portion 60a side). As described above, according to the first embodiment, the operation of moving the substrate and the substrate exchange position of the substrate P to the unloading station 20a of _a simultaneous operation system part (i.e., before the substrate is positioned in the exchange position of the station 20a to the substrate, The substrate P ₁ is carried out.

Or less, i.e., the substrate unloaded from P ₁ of FIG. 8 (A) the state shown in the FIG. 7 (A) and FIG. 7 (B) shown in order. That is, the support substrate ₁ tray 40a of the substrate P by the substrate holder ₁ within a substrate carry-out device 30a 70a driven further in the + X side, the substrate tray 40a to _a port cross-section 60a of the tray guide 62.

Then, as shown in FIG. 8(B), in the order shown in FIG. 6(A) to FIG. 6(C), the substrate P ₂ which is previously placed on the substrate holder 30a in advance is carried into the substrate holder 30a. . As shown in Fig. 8(C), the substrate stage 20a, the X coarse movement stage 23X and/or the Y coarse movement stage 23Y (not shown in Fig. 8(C). See Fig. 1) It is driven to perform an exposure operation on the substrate P ₂ held by the substrate holder 30a. In addition, the substrate P with the exposure operation ₂ of the parallel port to a portion 60a of the substrate then exposure is _{completed. 1} P is conveyed to an external device (e.g., coating and developing apparatus) from the substrate tray 40a _1, and the other to load the substrate P ₃ On the substrate tray 40a ₁ . The substrate replacement operation of the crotch portion 60a is performed by, for example, a mechanical arm (not shown), a lift pin device (not shown) provided on the crotch portion 60a, or the like.

The following, although not shown, the supporting substrate ₃ of the substrate P tray 40a ₁ is held by the holding member 54a, 54b, and is conveyed to FIG. 8 (A) as shown in position (over the exchange position of the substrate). In general, since the replacement operation of the substrates P ₁ and P ₃ in the crotch portion 60 a and the transfer operation of the substrate tray 40 a ₁ using the substrate loading device 50 are earlier than the exposure operation on the substrate P ₂ , the main control device can be Before the exposure operation of the substrate P ₂ is completed and the substrate holder 30a is moved to the substrate replacement position, the substrate P ₃ is positioned above the substrate replacement position. As described above, in the first embodiment, since the two substrate trays 40a ₁ and 40a _{2 are used} , the cycle time of substrate replacement on the substrate holder 30a can be shortened.

In the first embodiment described above, since the substrate holder 30a includes the substrate unloading device 70a, the substrate P can be ejected after the exposure operation is completed and before the substrate holder 30a reaches the substrate replacement position. Therefore, the substrate replacement cycle time on the substrate holder 30a can be shortened, and the number of processed substrates of the substrate P per unit time can be increased. On the other hand, when the substrate carrying device is provided outside the substrate stage 20a (for example, the crotch portion 60a), the substrate holder 30a must be positioned at the substrate replacement position in order to start the substrate unloading operation. In comparison, the substrate unloading operation takes time.

"Second Embodiment"

The second embodiment will be described with reference to Figs. 9(A) to 11(C). In the liquid crystal exposure apparatus of the second embodiment, the substrate holder 30b and the crotch portion 60b are divided. The liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment is the same as the configuration of the substrate tray 40b (see FIG. 9(A)), and therefore, only the differences will be described below. The first embodiment has the same configuration and function, and the same reference numerals are given to the first embodiment, and the description thereof is omitted.

In the substrate tray 40a (see FIG. 2(A)) of the first embodiment, the substrate is supported from below by using, for example, three (odd-numbered) support members 41. In contrast, the second embodiment shown in FIG. 9(A) is used. The substrate tray 40b has, for example, four (even-numbered) support members 41. Further, in the substrate tray 40a (see FIG. 2(A)) of the first embodiment, the intermediate portions of the plurality of support members 41 in the longitudinal direction are connected to each other by, for example, three reinforcing members 43. Further, the substrate tray 40b of the second embodiment shown in (A) further includes reinforcing members 43 for connecting the -X side end portions of the plurality of support members 41 to each other (for example, four reinforcing members 43 in total). Further, the substrate tray 40b does not have the projection 45a like the substrate tray 40a of the above-described first embodiment (see FIG. 2(B)).

As shown in FIG. 10, on the upper surface of the substrate holder 30b, for example, each of the four support members 41 and, for example, four reinforcing members 43 corresponding to the substrate tray 40b (not shown in FIG. 10, see FIG. 9(A)). A plurality of X slots 31x and Y slots 31y are formed. In a state where the substrate holder 30b is combined with the substrate tray 40b, each of the plurality of support members 41 and the reinforcing members 43 is housed in the corresponding X groove 31x and Y groove 31y. However, as shown in Fig. 11(A), the reinforcing member 43 on the most-X side is located on the outer side of the substrate holder 30b. Returning to FIG. 10, a plurality of tray guides are respectively accommodated in the plurality of X slots 31x. Device 32. Further, another X groove 73x is formed in the central portion of the upper surface of the substrate holder 30b in the Y-axis direction. The substrate unloading device 70b is housed in the X groove 73x. Further, the X-groove 73x is formed to accommodate the substrate unloading device 70b, and the support member 41 of the substrate tray 40b is not housed. Further, in the crotch portion 60b, for example, four support members 41 are supported on the gantry 61, and for example, four tray guides 62 are mounted.

The substrate unloading device 70b has an X traveling guide 71 and a pressing member 72b that presses the substrate tray 40b. The pressing member 72b, as shown in FIG 11 (A), the plate-shaped member parallel to the XY plane configuration, the slide portion is driven in the X direction of the X axis 72b ₁ is connected to, for example, through a hinge means at one end of the X-guide 71 travels The X sliding portion 72b ₁ and the pressing portion 72b _{2 of the} plate member. The substrate unloading device 70b includes an actuator (not shown), and the angle between the X sliding portion 72b ₁ and the pressing portion 72b ₂ is appropriately controlled by the actuator.

Hereinafter, the substrate replacement operation using the substrate unloading device 70b will be described with reference to FIGS. 11(A) to 11(C). In the second embodiment, as in the first embodiment, two substrate trays 40b (the substrate trays 40b ₁ and 40b _{2 in} Figs. 11(A) to 11(C)) are used. When the substrate holder state 30b of the tray 40b ₁ composition from FIG 11 (A) of FIG substrate, the substrate P ₁ and the substrate holder tray 40b ₁ 30b unloaded from the substrate together, as shown in FIG 11 (B) shown, X _a sliding portion 72b and the angle of the pressing portion 72b of Room _2, for example 90 °, with the first embodiment of the same, by the pressing member 72b presses the tray 40b of the substrate ₁ to the substrate P unloaded _1. At this time, the pressing member 72b presses the substrate tray system 40b ₁ has a plurality of the reinforcing member 43 of the reinforcement member 43 most -X side. Therefore, the height (Z-axis) direction dimension of the pressing member 72b is set to be slightly longer than the above-described first embodiment.

Further, the second embodiment of this aspect, the substrate on the substrate holder 30b P replacement, the above-described first embodiment are also the same shape, _a rear plate P is unloaded from the holder 30b, such as 11 (C) shown in FIG. The other substrate P ₂ supported by the tray 40b ₂ is carried by the substrate carrying device (not shown) into the substrate holder 30b.

When the loading operation of the substrate P ₂ is completed, as shown in FIG. 11(C), the pressing member 72b of the substrate carrying device 70b is controlled by an actuator (not shown) to be between the X sliding portion 72b ₁ and the pressing portion 72b ₂ . The angle becomes an obtuse angle (a state in which it is more open than when the substrate is carried out), and in this state, it is driven in the -X direction on the X traveling guide 71. Here, the angle between the X sliding portion 72b ₁ and the pressing portion 72b ₂ is set such that the substrate tray 40b ₂ supported by the plurality of tray guiding devices 32 is located on the most-Z side (the substrate P ₂ is loaded on the substrate P _{2 )} The upper surface of the substrate holder 30b is separated from the substrate tray 40b ₂ ) without contacting the reinforcing member 43.

In the second embodiment described above, even when the substrate P is mounted on the substrate holder 30b (for example, during exposure), the pressing member 72b can be returned (returned) (shown in FIG. 11(A)). In the initial position (the position of the substrate tray 40b can be pressed), the loading operation of the other substrate P can be started immediately after the substrate P is carried out. (In contrast, in the first embodiment, it is necessary to wait for the pressing member 72a to return. The return of the initial position).

Further, in the substrate holder 30b, since the substrate carrying device 70b is housed in the X groove 73x (a dedicated groove not used for housing the substrate tray 40b), the substrate tray 40b is placed on the substrate holder 30b, and all the support members 41 are Support The disk guide 32 is supported from below, and in the crotch portion 60b, all the support members 41 are supported by the tray guide 62 from below. Therefore, the deflection of the substrate tray 40b and the substrate P is suppressed.

Further, the pressing member 72b, although based creating 72b ₂ relative X slidable portion pressing portion configured _{72b. 1} swiveling, but the pressing member constituting 72b of long as it is in the state depressible substrate tray 40b of, and not in contact with the substrate tray 40b and can go The switching member 72b (or the entire substrate carrying device 70b) may be configured to be movable in the Z-axis direction (up and down), for example, when the state in which the X-axis direction is shifted is not limited thereto. In addition, the substrate carrying-out device 70a of the first embodiment shown in FIG. 3 and the like can be configured in the same manner as the substrate carrying-out device 70b of the second embodiment.

"Third Embodiment"

Next, a third embodiment will be described using FIG. The liquid crystal exposure apparatus of the third embodiment is the same as the liquid crystal exposure apparatus of the second embodiment except for the substrate holder 30c (including the substrate tray 40b (not shown in FIG. 12, see FIG. 9(A)). In the following description, only the different points are described in the following description, and the same components and functions as those in the first and second embodiments are given the same reference numerals as in the first and second embodiments, and the description is omitted. Its description.

In the second embodiment, as shown in FIG. 10, the X-groove 73x for accommodating the substrate unloading device 70b in the center of the substrate holder 30b is for accommodating the substrate tray 40b (not shown in FIG. 10; see FIG. In the third embodiment, as shown in FIG. 12, the substrate holder 30c is, for example, in four X-slots 31x, as shown in FIG. 12, in the X-slot 31x of the plurality of support members 41. Between the first X slot 31x and the second X slot 31x from the +Y side, and between the third X slot 31x and the fourth X slot 31x, a substrate for carrying out the substrate unloading device 70c is formed. X slot 73x. Therefore, the substrate holder 30c has two substrate carrying-out devices 70c that are separated in the Y-axis direction. The substrate carrying-out device 70c is the same as the second embodiment except that the pressing member 72c has a hemispherical pressing member (not shown in FIG. 12) in contact with the substrate tray (not shown in FIG. 12). Further, the substrate replacement operation is also the same as that of the second embodiment described above, and thus the description thereof will be omitted.

According to the third embodiment, since the two substrate carrying devices 70c are provided, for example, the movement of the substrate tray and the substrate in the θ z direction (yawing direction) during the substrate unloading can be easily suppressed. Moreover, since the thrust for moving the substrate tray is improved, the substrate tray can be carried out more smoothly and quickly. Further, the pressing member 72c may not have a hemispherical pressing member (the substrate tray may be in point contact or in surface contact).

"Fourth Embodiment"

Next, a fourth embodiment will be described using FIG. The liquid crystal exposure apparatus of the fourth embodiment is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment (including the substrate tray 40a) except for the substrate holder 30d. Therefore, only the following description will be explained. In the first embodiment, the same components as those in the above-described first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.

As shown in FIG. 13, the substrate holder 30d has a substrate carrying device 70d including a rope driving device 74 and a pressing member 72a. The rope drive unit 74 includes a rope 74 ₁ , a plurality of pulleys 74 _{2 ,} and the like. A pressing member 72a is connected to an intermediate portion of the rope 74 ₁ . _One portion of the cord 74 ₁ is inserted into the X groove 31x formed on the substrate holder 30d together with the pressing member 72a. In addition, although not shown in FIG. 13, the X-groove 31x is formed, for example, three at a predetermined interval in the Y-axis direction on the substrate holder 30d, and the rope 74 _{1 is} inserted into the X-slot 31x at the center thereof, and the other X A plurality of tray guides 32 are accommodated in the slots 31x. Further, another X groove 74 ₃ is formed in a central portion of the lower surface of the substrate holder 30d in the Y-axis direction, and the other portion of the rope 74 ₁ is inserted into the X groove 74 ₃ . The plurality of pulleys 74 ₂ are separated from the +X side and the -X side end surface of the substrate holder 30 d in the vertical direction, for example, two (four in total). A rope 74 _{1 is} wound around each of the plurality of pulleys 74 ₂ . An actuator (not shown) (for example, a rotary motor) is connected to one of the plurality of pulleys 74 ₂ and is rotationally driven by a pulley 74 _{2 that} is connected to the actuator. The pressing member 72a is in the X slot 31x. The predetermined stroke moves in the X-axis direction. The substrate carrying-out operation using the substrate unloading device 70d is the same as that of the above-described first embodiment, and thus the description thereof will be omitted.

According to the substrate carrying device 70d of the fourth embodiment, the pressing member 72a can be driven at a higher speed in the X-axis direction than the feeding screw device 70d, and the substrate can be quickly carried out from the substrate holder 30d. Further, if the pressing member 72a can be pulled in the +X direction and the -X direction, it can be used instead of the rope 74 ₁ , a belt (with or without teeth), a chain, or the like. Further, the material of the rope 74 ₁ is not particularly limited, and may be, for example, a steel cord or a synthetic resin. Further, a part of the substrate carrying device 70d such as an actuator that rotates the pulley may be provided in a member other than the substrate holder 30d (for example, the Y coarse movement stage 23Y (not shown in FIG. 13).). In this case, the substrate holder 30d can be made lighter and the positional controllability of the substrate can be improved. The pressing member 72a may be of a movable type as in the second embodiment described above (see FIG. 11(A) and the like). Further, the substrate carrying-out device 70d may be provided in plural in the Y-axis direction as in the third embodiment described above. Further, a guide for guiding the pressing member 72a in the X-axis direction may be provided.

"Fifth Embodiment"

Next, a fifth embodiment will be described with reference to Figs. 14(A) and 14(B). In addition to the substrate holder 30e and the substrate tray 40e (not shown in FIG. 14(A), see FIG. 14(B)), the liquid crystal exposure apparatus according to the fifth embodiment is exposed to the liquid crystal of the first embodiment. The device 10 (see FIG. 1) is the same as the first embodiment, and the same reference numerals are given to the above-described first embodiment, and the description thereof will be omitted.

The substrate tray 40e used in the liquid crystal exposure apparatus of the fifth embodiment has a plurality of (for example, three) support members 41 similar to the above-described first embodiment (see FIG. 2(A)), but has no projections 45a on its lower surface. Referring to Fig. 2(B)), it is different from the above-described first embodiment. Further, a plurality of (for example, three) X slots 31x corresponding to the plurality of (for example, three) support members 41 are formed on the upper surface of the substrate holder 30e, and a plurality of X slots 31x are accommodated in the X slots 31x (for example, in the X-axis direction). The tray guiding device 32 of the predetermined interval, and the plurality of supporting members 41 of the substrate tray 40e are all supported by the tray guiding device 32 from below in the X groove 31x of the substrate holder 30e. Further, although not shown, the crotch portion of the fifth embodiment has a plurality of (for example, three) tray guiding devices 62 (see FIG. 1) corresponding to the plurality of (for example, three) supporting members 41.

As shown in FIG. 14(B), the substrate carrying device 70e included in the substrate holder 30e is provided with a pair of roller devices 75. A concave portion 75 _{3 is} formed on the +Y side and the -Y side of the X groove 31x at the center of the +X side end portion of the substrate holder 30e, and the pair of roller devices 75 are in the concave portion 75 ₃ on the +Y side. The other side is housed in the recessed portion 75 ₃ on the -Y side in a state in which the central X slot 31x is interposed. The pair of roller devices 75 each have a roller 75 _{2 that is} rotationally driven by a rotary motor 75 ₁ and a rotary motor 75 ₁ . The Z position of the roller 75 ₂ is set such that the lower surface of the reinforcing member 43 of the substrate tray 40e is higher than the substrate holder 30e in order to carry out the substrate P (not shown in FIG. 14(B). See FIG. 1). In the state of the Z side, the position of the support member 41 of the substrate tray 40e can also be sandwiched. The substrate carry-out device 70e, in the state where the insertion of the support member 41 of ₇₅₂ between a pair of rollers, a pair of rollers ₇₅₂ separately from each other to rotate in opposite directions, since 41 between the pair of rollers of each support member ₇₅₂ of the The frictional force causes the substrate tray 40e to move in the +X direction with respect to the substrate holder 30e, and is sent out from the substrate holder 30e to a crotch portion (not shown). Since the substrate carrying-out operation using the substrate unloading device 70e is the same as that of the above-described first embodiment, the description thereof will be omitted.

According to the substrate unloading device 70e of the fifth embodiment, the substrate tray 40e can be quickly carried out from the substrate holder 30e while being small and lightweight. In addition, since there is no member that moves in the X-axis direction at a predetermined stroke when the substrate tray 40e is carried out (for example, the pressing member 72a (see FIG. 3) of the first embodiment), it is not necessary to carry the member out after the substrate tray 40e is carried out. By returning to the initial position, the substrate replacement operation can be performed quickly. Further, in the substrate holder 30e (and the crotch portion not shown), all of the plurality of support structures can be used. Since the substrate 41 is carried out from the lower side, the substrate tray 40e is carried out. Therefore, the deflection of the substrate P (not shown in FIGS. 14(A) and 14(B). See FIG. 1) can be suppressed.

Further, if the roller device 75 is provided in the roller ₇₅₂ to the biasing member biasing the support member 41 of the preferred, as a result, can suppress the sliding of the roller 41 and the support member _752. Further, the pair of rollers 75 ₂ may be made to be micro-driven in the Y-axis direction. As described above, when the support member 41 is inserted into the X-groove 31x, the pair of rollers 75 ₂ can be surely retracted from the support member 41, and the support member 41 can be surely sandwiched by the pair of rollers 75 ₂ when the substrate tray 40e is carried out. Further, the substrate carrying-out device 70e can be provided in plural in the Y-axis direction (for example, the X-slot 31x corresponding to the most +Y side and the most-Y side). Further, a pair of roller devices (not shown) having the same configuration as the pair of roller devices 75 (see FIGS. 14(A) and 14(B)) may be provided in the crotch portion.

"Sixth Embodiment"

Next, a sixth embodiment will be described with reference to Figs. 15(A) to 16 . In the liquid crystal exposure apparatus of the sixth embodiment, the substrate holder 30f (not shown in FIG. 15(A). See FIG. 15(B)), the substrate tray 40f, and the crotch portion 60f (FIG. 15(A) and 15(B) is not shown. Referring to FIG. 16), it is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment. Therefore, only the difference is described in the following description, and the first aspect is described. In the embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and their description is omitted.

In the above-described first to fifth embodiments, the substrate carrying device is provided in the substrate holder, and the sixth embodiment is as shown in Fig. 15(B). One of the pair of X holders 76 and one of the pair of X movable members 45f of the substrate holder 30f, which is provided by the substrate holder 30f, constitutes a pair of X linear motors 70f, and functions as a substrate carrying device.

As shown in Fig. 15(A), the substrate tray 40f has a plurality of (for example, three) support members 41 similarly to the above-described first embodiment (see Fig. 2(A)). For example, the X movable member 45f including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction is attached to each of the +Y side and the -Y side of the support member 41 at the center of the three support members 41. The X movable member 45f is provided substantially in the entirety except for the vicinity of both end portions of the support member 41. Further, the center support member 41 does not have the projection 45a like the substrate tray 40a of the first embodiment (see Fig. 2(B)).

As shown in FIG. 16, a plurality of (for example, three) X-grooves 31x corresponding to the plurality (for example, three) of the support members 41 are formed on the upper surface of the substrate holder 30f. A plurality of tray guides 32 (for example, three at a predetermined interval in the X-axis direction) and a plurality of support members 41 of the substrate tray 40f are accommodated in all the X slots 31x (not shown in Fig. 16). See Fig. 15 (B). )), all of which are supported by the tray guide 32 from below in the X groove 31x of the substrate holder 30f. Further, in the vicinity of the +X side end portion of the substrate holder 30f, for example, one of the three X grooves 31x for defining the center of the X groove 31x is opposite to the facing surface, as shown in Fig. 15(B), respectively. X holder 76 of the coil unit. 15(B) corresponds to a cross-sectional view taken along line B-B of FIG. 16 (however, the substrate tray 40f is not shown in FIG. 16). The Z position of each of the pair of X stators 76 is set so as to carry out the substrate P (not shown in FIG. 15(B). See FIG. 1), and the reinforcing member 43 of the substrate tray 40f is positioned below the substrate holder 30f. Above +Z side In the state, it is opposed to the X movable member 45f of the support member 41 of the substrate tray 40f.

Further, as shown in FIG. 16, the crotch portion 60f has a plurality of (for example, three) tray guiding devices 62 corresponding to the plurality of (for example, three) supporting members 41 (not shown in FIG. 16 and referring to FIG. 15(A)). . Further, a pair of X stators 68 are mounted in the vicinity of the -X side end of the base 63 of the tray guide 62 in the center of, for example, the three tray guides 62. Each of the pair of X stators 68 includes a coil unit similarly to the X stator 76. The pair of X stators 68 are disposed apart from each other in the Y-axis direction at a larger dimension (width) than the support member 41 of the substrate tray 40f in the Y-axis direction, and the Z position is set to be on the plurality of guides 65. In the state in which the support member 41 is mounted, it is substantially the same as the Z position of the X movable member 45f (not shown in FIG. 16 (see FIG. 15(A)) attached to the support member 41 (opposite to the X movable member 45f).

In the sixth embodiment, when the substrate tray 40f is carried out from the substrate holder 30f, one pair of the X holder 76 and one of the substrate tray 40f and the X movable member 45f is appropriately used by one of the substrate holders 30f. The X linear motor 70f and the total of four X linear motors of the other pair of X linear motors, which are formed by one of the dam portions 60f, one of the X stator 68 and one of the substrate trays 40f and the X movable member 45f, are used as the substrate unloading device. Since the substrate carrying-out operation is the same as that of the above-described first embodiment, the description thereof will be omitted.

In the sixth embodiment, since the substrate tray 40f can be carried out at a high speed from the substrate holder 30f in a non-contact manner, dust generation (dust generation) can be prevented. Further, in the substrate holder 30f and the crotch portion 60f, the substrate tray 40f can be carried out while the plurality of support members 41 are all supported from below. The deflection of the substrate P (not shown in Fig. 15 (A) to Fig. 16 and referring to Fig. 1) can be suppressed. Further, as in the third embodiment described above, the X linear motor can be provided in plural in the Y-axis direction (for example, the support member 41 corresponding to the most +Y side and the most-Y side).

"Seventh Embodiment"

Next, a seventh embodiment will be described with reference to Figs. 17(A) and 17(B). The liquid crystal exposure apparatus of the seventh embodiment is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the substrate holder 30g, the substrate tray 40g, and the crotch portion 60g. In the first embodiment, the same components as those in the above-described first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

In the above-described first to sixth embodiments, the substrate holders 30a to 30f (see FIGS. 1 to 16 respectively) have a substrate carrying device (or a part of the substrate unloading device), whereas in the seventh embodiment, As shown in Fig. 17(A), the substrate unloading device 70g is disposed outside the substrate holder 30g and on the +Y side and the -Y side of the substrate holder 30g. For example, the configuration of each of the two substrate carrying-out devices 70g is the same as that of the substrate carrying-out device 70a (see FIG. 3) of the above-described first embodiment except that the dimension of the pressing member 72g in the Z-axis direction is set to be slightly longer.

As shown in FIG. 17(A), the substrate tray 40g has a plurality of (for example, five) support members 41. In the substrate tray 40a (see FIG. 2(A)) of the first embodiment, the intermediate portions of the plurality of support members 41 in the longitudinal direction are connected to each other by, for example, three reinforcing members 43. In contrast, the substrate tray 40g is connected to each other. Further having the -X side ends of the plurality of support members 41 connected to each other A reinforcing member 45g is formed. Further, the substrate tray 40g does not have the projection 45a like the substrate tray 40a of the above-described first embodiment (see FIG. 2(B)).

Further, among the plurality of reinforcing members 43 and 45g, the reinforcing member 45g on the most-X side has a longer longitudinal dimension than the other reinforcing members 43, and the size thereof is set to be on the substrate tray as shown in Fig. 17(A). 40g is accommodated in the substrate holder 30g, and the -Y side end portion protrudes from the -Y side end portion of the substrate holder 30g toward the -Y side, and the +Y side end portion is supported from the substrate holder 30g+ The Y-side end protrudes toward the +Y side. As shown in Fig. 17 (B), the substrate tray 40g is pressed by the pressing member 72g of the substrate carrying device 70g disposed on the +Y side of the substrate holder 30g by the +Y side end portion of the reinforcing member 45g, and the reinforcing member is pressed. The 45-g-Y-side end portion is pressed by the pressing member 72g of the substrate carrying-out device 70g disposed on the -Y side of the substrate holder 30g, and is carried out from the substrate holder 30g.

Here, the substrate holder 30g of the substrate stage 20g of the seventh embodiment is disposed on the Y coarse movement stage 23Y similarly to the first embodiment shown in Fig. 1 (Fig. 17(A) and Fig. 17 ( Above B) is not shown). As shown in Fig. 17 (A) and Fig. 17 (B), for example, each of the two substrate carrying devices 70g is attached to the Y coarse movement stage 23Y via a support member (not shown), and the substrate holder 30g is formed. Mechanical (and vibrating) separation. The substrate carrying-out operation using, for example, the two substrate carrying-out devices 70g is the same as that of the above-described first embodiment, and thus the description thereof will be omitted. In addition, the shank portion 60g and the substrate loading device (not shown) are configured similarly to the substrate tray 40g having five support members 41, and the functions thereof are the same as those of the above-described first embodiment, and thus the description thereof will be omitted.

In the seventh embodiment, for example, each of the two substrate carrying devices 70g is disposed outside the substrate holder 30g. Therefore, it is not necessary to form a groove for accommodating the substrate carrying device 70g in the substrate holder 30g, and the substrate holding can be suppressed. With a rigidity of 30g reduced. Moreover, since the substrate P can be adsorbed and held with a large area, the flatness of the substrate P can be improved. In addition, since the substrate holder 30g can be made lighter and the reaction force when the pressing member 72g is driven does not act on the substrate holder 30g, the positional controllability of the substrate holder 30g (substrate P) can be improved. Further, since the substrate carrying-out device 70g is disposed outside the substrate holder 30g, the maintenance property is also excellent.

Further, by using a plurality of Z voice coil motors 29z (see FIG. 1), the substrate holder 30g is micro-driven in the +Z direction, and for example, two substrate carrying devices 70g are respectively positioned on the -Z side of the reinforcing member 45g of the substrate tray 40g. Then, in a state in which the substrate P is placed on the substrate holder 30g, the pressing member 72g can pass under the reinforcing member 45g. According to this, it is possible to obtain the same effect as the second embodiment described above, that is, to carry out the loading of another substrate quickly after the substrate is carried out. Further, for example, two substrate carrying-out devices 70g can be moved up and down on the Y-stacking stage 23Y, respectively.

In addition, when the pressing member 72g is configured to prevent (only abutting) the reinforcing member 45g, the movement of the substrate tray 40g and the substrate P in the θ z direction (yawing direction) can be easily suppressed as in the third embodiment. . Further, when the pressing member 72g is the adsorption holding reinforcing member 45g, the substrate carrying-out device 70g may be provided only on the outer side of the substrate holder 30g. Further, the pressing member 72g can be pulled by a rope or the like similarly to the above-described fourth embodiment. Further, the substrate of the fifth embodiment can be carried out The roller device 75 similar to the device 70e (see Fig. 14(A)) is provided on the outer side of the substrate holder in the same manner as in the seventh embodiment. Further, similarly to the sixth embodiment, the movable member may be attached to the substrate tray, and the X stator may be disposed outside the substrate holder.

"Eighth Embodiment"

Next, an eighth embodiment will be described with reference to Figs. 18 and 19 . The liquid crystal exposure apparatus of the eighth embodiment is the same as the liquid crystal exposure apparatus (including the substrate holder 30g and the substrate tray 40g) of the seventh embodiment except for the dam portion 60h. Therefore, only the differences will be described. The components having the same configurations and functions as those in the seventh embodiment are denoted by the same reference numerals as in the seventh embodiment, and the description thereof will be omitted.

As shown in Fig. 18, the crotch portion 60h has a tray guiding device 62h on the -X side of the gantry 61. The tray guide device 62h includes a base 63h mounted on a floor (not shown) and a guide 65h mounted on the base 63h. Further, in the eighth embodiment, the plurality of tray guides 62 mounted on the gantry 61 are not moved in the X-axis direction. The guide 65h is composed of a member extending in the Y-axis direction, and its longitudinal dimension is set to be longer (wider) than the length (width) of the substrate tray 40g (and the substrate P) in the Y-axis direction. The guide 65h is provided at the same height position as the other guides 65 on the gantry 61. Similarly to the guide 65, pressurized gas can be ejected from above to suspend and support the substrate tray 40g. When the substrate tray 20g is moved from the substrate holder 30g to the crotch portion 60h to move the substrate stage 20g to the substrate replacement position, the substrate tray 40g protruding from the +X side end portion of the substrate holder 30g is The guide 65h is supported from below. Therefore, the deflection of the substrate tray 40g and the substrate P can be suppressed.

Here, for example, when a plurality of irradiation regions are set on the substrate P, generally, the last irradiation region for performing the exposure processing is set on the +Y side of the substrate P, or -Y in order to reduce the total amount of movement of the substrate P. side. Therefore, when the substrate stage 20g after the end of the exposure processing in the last irradiation region is moved toward the substrate replacement position, it moves not in the X-axis direction but also in the Y-axis direction (moving in the oblique direction with respect to the X-axis). On the other hand, in the eighth embodiment, since the dimension of the guide 65h in the Y-axis direction is set to be longer than the dimension of the substrate tray 40g in the Y-axis direction, the substrate stage 20g is moved in the oblique direction with respect to the X-axis. In other cases, the portion of the substrate tray 40g that protrudes from the +X side end portion of the substrate holder 30g is also supported by the guide 65h from below. In this way, the substrate P can be carried out more quickly.

The details will be described later using FIG. For example, six irradiation regions are set on the substrate P, and the last one of the irradiation regions is set on the +Y side of the substrate P and the irradiation region S ₆ on the +X side. Further, the center of the substrate P before the start of the exposure operation in the irradiation region S ₆ is located at the position CP ₁ , and the center of the substrate P at the end of the exposure operation is located at the position CP ₂ . In addition, in FIG. 19, illustration of the board|substrate tray 40a, the board|substrate carrying-out apparatus 70g, the tray guide apparatus 62 and 62h, and FIG.

In the eighth embodiment, before the substrate stage 20g reaches the substrate replacement position, the substrate carrying device 70g (see FIG. 18) (not shown) starts the loading operation of the substrate P (and the substrate tray 40g (not shown)). As a result, the substrate P (and the substrate tray 40g (not shown) protrudes from the +X side end portion of the substrate holder 30g, and the guide 65h of the tray guide 62h (not shown in FIG. 19. See FIG. The guide 65 on the gantry 61 first supports the protruding portion from below.

Further, in the eighth embodiment, the position of the substrate stage 20g can be controlled in such a manner that the center of the substrate P passes through the positions CP ₁ → CP ₂ → CP ₃ in Fig. 19 in order. In other words, when the crotch portion 60h does not have the tray guiding device 62h (not shown in Fig. 19, see Fig. 18), the substrate tray 40g is not shown in Fig. 19 when the substrate P is unloaded. 18) is moved in parallel with the X-axis direction. Therefore, it is necessary to control the Y position of the substrate stage 20g so that a plurality of tray guiding devices 62 (not shown in FIG. 19, see FIG. 18) on the gantry 61 are in the Y-axis direction. The position and the plurality of support members 41 included in the substrate tray 40g (not shown in Fig. 19, see Fig. 18) substantially coincide with each other in the Y-axis direction. In this case, it is necessary to sequentially pass the center of the substrate P. The position control of the substrate stage 20g is performed in the manner of position CP ₁ → CP ₂ → CP ₄ → CP ₃ in 19.

On the other hand, in the eighth embodiment, the substrate tray 40g (not shown in FIG. 19 (see FIG. 18) is adjacent to the Y position of the substrate stage 20g (see FIG. 18). Although not shown in Fig. 19. Referring to Fig. 18), the substrate stage 20g can be directly moved from the position (position CP ₂ ) at the end of the exposure processing of the final irradiation region to the substrate replacement position (position CP ₃ ), and rapidly The substrate P is carried out. Further, the auxiliary tray guiding device 62h and the substrate P carrying method in the eighth embodiment can be applied to the above-described first to seventh embodiments. However, when the amount of protrusion of the substrate P from the substrate holder is small (in the case where the substrate replacement position does not contact the tray guiding device 62), even if the auxiliary tray guiding device 62h is not provided, The substrate stages 20a to 20f are directly moved from the position at the end of the exposure processing of the final irradiation region to the substrate replacement position.

Further, the configuration of the liquid crystal exposure apparatus is not limited to those described in the first to eighth embodiments, and can be appropriately changed. For example, each of the guides 35 and 65 of the tray guides 32 and 62 supports the substrate trays 40a to 40g in a non-contact (suspended) manner, but is not limited thereto, and may be performed with low friction, for example, using a rotating body such as a ball. Contact support. Further, each of the tray guiding devices 32 and 62 may be configured to guide the substrate trays 40a to 40g in the X-axis direction by using the guides 35 and 65.

Further, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Further, as the illumination light, for example, a single-wavelength laser light of an infrared band or a visible light band emitted from a DFB semiconductor laser or a fiber laser may be used, for example, an optical fiber amplifier doped with germanium (or both germanium and germanium). The amplitude is converted to the harmonics of ultraviolet light using nonlinear optical crystallization. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like can also be used.

Further, in each of the above embodiments, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described, but the number of projection optical units is not limited thereto, and only one is More than that. Further, it is not limited to the multi-lens type projection optical system, and may be, for example, a projection optical system using an OFNER type large-sized mirror. In the above-described embodiment, the case where the projection magnification is equal to the projection optical system PL is described. However, the present invention is not limited thereto, and the projection optical system may be either a reduction system or an amplification system.

Further, in the above embodiment, the light transmissive mask base is used. A light-transmitting type reticle having a predetermined light-shielding pattern (or a phase pattern, a light-reducing pattern) is formed on the board, but the reticle may be replaced with an electronic material according to a pattern to be exposed, such as disclosed in the specification of US Pat. No. 6,778,257. An electronic mask (variable shaping mask) for forming a transmission pattern or a reflection pattern or a light-emitting pattern, for example, a DMD (Digital Micro-mirror Device) using a non-light-emitting type image display element (also referred to as a spatial light modulator) )) Variable shaped reticle.

Further, as an exposure apparatus, in particular, an exposure apparatus for exposing a substrate having a size (including at least one of an outer diameter, a diagonal, and one side) of 500 mm or more, or a large-sized substrate such as a liquid crystal display element (FPD), is particularly effective. .

Further, the exposure apparatus can be applied to an exposure apparatus of a step & repeat method and an exposure apparatus of a step & stitch type.

Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus for transferring a liquid crystal display element pattern to a square glass plate, and can be widely applied to, for example, an exposure apparatus for semiconductor manufacturing, for manufacturing a thin film magnetic head, a micromachine, and DNA. An exposure device such as a wafer. Further, the present invention can be applied not only to micro-elements such as semiconductor element elements, but also to manufacturing photomasks or reticle for use in a photo-exposure device, an EUV exposure device, an X-ray exposure device, and an electron beam exposure device. The circuit pattern is transferred to an exposure device such as a glass substrate or a germanium wafer. Further, the object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. Further, when the object to be exposed is a substrate for a flat panel display, the substrate is The thickness is not particularly limited, and for example, it is also a film-like (flexible sheet member).

In addition, the substrate (object) described in the first to eighth embodiments can be applied to an object handling device that performs predetermined processing on an object such as an object inspection device for inspection of a predetermined object. Replacement method.

An electronic component such as a liquid crystal display element (or a semiconductor element) is a step of fabricating a photomask (or a reticle) according to the design of the functional performance of the component, and a step of fabricating a glass substrate (or wafer) In the exposure apparatus and the exposure method thereof according to the above embodiments, the photomask (reticle) pattern is transferred to the lithography step of the glass substrate, the development step of developing the exposed glass substrate, and the remaining resist portion The exposed portions of the other portions are etched by etching, the resist removal step of removing the etching is completed, the resist removal step of the resist, the component assembly step, the inspection step, and the like are performed. In this case, since the exposure method is carried out by using the exposure apparatus of the above-described embodiment in the lithography step, the element pattern is formed on the glass substrate, so that a high-complexity element can be manufactured with good productivity.

In addition, the disclosures of all publications, the International Publications, the U.S. Patent, and the U.S. Patent Application Publications, which are incorporated herein by reference, are incorporated by reference.

Industrial availability

As described above, the object carrying out method of the present invention is suitable for carrying out an object from the object holding device. Further, the method of replacing the object of the present invention is suitable for replacing an object held by the object holding device. Also, the present invention The body holding device is suitable for quickly moving out objects. Further, the exposure apparatus of the present invention is suitable for exposing an object. Further, the method of manufacturing a flat panel display of the present invention is suitable for the manufacture of a flat panel display. Further, the component manufacturing method of the present invention is suitable for the manufacture of microcomponents.

10‧‧‧Liquid exposure device

11‧‧‧The ground of the clean room

12‧‧‧ platform

13‧‧‧Substrate carrier

14‧‧‧Anti-vibration device

16‧‧‧Mirror platform

20a, 20g‧‧‧ substrate carrier

21‧‧‧Micro-motion stage

22x‧‧‧X moving mirror

23X‧‧‧X coarse moving stage

23Y‧‧‧Y coarse moving stage

24‧‧‧Mirror mount

25‧‧‧Y linear guide

26‧‧‧Weight elimination device

26a‧‧‧Air bearing

26b‧‧‧Linking device

27‧‧‧ Leveling device

29x‧‧‧X voice coil motor

29z‧‧‧Z voice coil motor

30a~30g‧‧‧Substrate holder

31x‧‧‧X slot

31y‧‧‧Y slot

32, 62, 62h‧‧‧Tray guide

33‧‧‧ recess

34, 64‧‧‧Z actuators

35, 65, 65h‧‧‧ Guides

40a, 40b, 40e, 40f, 40g‧‧‧ substrate tray

41‧‧‧Support members

42‧‧‧Connected components

43‧‧‧Reinforcing components

44a, 44b‧‧‧Cone members

45a‧‧‧ Protrusion

45f‧‧‧X movable

45‧‧‧Reinforcing components

50‧‧‧Substrate loading device

51a, 51b‧‧‧1st and 2nd transport units

52‧‧‧X travel guide

53‧‧‧X slider

54a, 54b‧‧‧ holding components

55a, 55b‧‧‧ recess

60a, 60b, 60f, 60g, 60h‧‧‧埠

61‧‧‧ 台台

63, 63h‧‧‧ base

66‧‧‧X linear guide

67‧‧‧X slider

70a, 70b, 70c, 70d, 70g‧‧‧ substrate carrying out device

70f‧‧‧X linear motor

71‧‧‧X travel guide

72a, 72b, 72c, 72g‧‧‧ ‧ pressing members

72b ₁ ‧‧‧X sliding part

72b ₂ ‧‧‧ Pressing Department

73x‧‧‧X slot

74 ₁ ‧‧‧ rope

74 ₂ ‧‧‧ pulley

74 ₃ ‧‧‧X slot

76‧‧‧X fixator

IL‧‧‧Lights

IOP‧‧‧Lighting Department

M‧‧‧Photo Mask

MST‧‧‧Photomask stage

P‧‧‧Substrate

PL‧‧‧Projection Optics

PST‧‧‧Substrate stage device

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to a first embodiment.

2(A) is a plan view of a substrate tray used in the liquid crystal exposure apparatus of FIG. 1, and FIG. 2(B) is a side view of the substrate tray of FIG. 2(A).

Fig. 3 is a plan view showing a substrate holder and a flange portion of the liquid crystal exposure apparatus of Fig. 1.

4(A) is a plan view showing a state in which the substrate holder and the substrate tray are combined, and FIG. 4(B) is a cross-sectional view taken along line A-A of FIG. 4(A).

Fig. 5 is a plan view showing a substrate carrying device included in the liquid crystal exposure apparatus of Fig. 1.

6(A) to 6(C) are diagrams for explaining the substrate loading operation (1 to 3).

7(A) and 7(B) are views for explaining the substrate unloading operation (1 and 2).

8(A) to 8(C) are views for explaining the substrate replacement operation on the substrate holder (1 to 3).

Fig. 9(A) is a plan view of the substrate tray of the second embodiment, and Fig. 9(B) is a side view of the substrate tray of Fig. 9(A).

Fig. 10 is a plan view showing a substrate holder and a crotch portion according to the second embodiment.

11(A) to 11(C) are views for explaining the substrate unloading operation of the second embodiment (the first to third aspects thereof).

Fig. 12 is a plan view showing a substrate holder and a crotch portion according to a third embodiment;

Figure 13 is a cross-sectional view showing a substrate holder according to a fourth embodiment.

Fig. 14 (A) is a plan view of the substrate holder of the fifth embodiment, and Fig. 14 (B) is a view showing a state of combination of the substrate holder of Fig. 14 (A) and the substrate tray.

Fig. 15(A) is a plan view of the substrate tray of the sixth embodiment, and Fig. 15(B) is a view showing a state in which the substrate tray of Fig. 15(A) and the substrate holder of the sixth embodiment are combined.

Fig. 16 is a plan view showing a substrate holder and a crotch portion according to a sixth embodiment.

17(A) is a plan view of a substrate tray, a substrate holder, and a dam portion according to a seventh embodiment, and FIG. 17(B) is a view for explaining a substrate unloading operation in the seventh embodiment.

Fig. 18 is a plan view showing a crotch portion of the eighth embodiment.

Fig. 19 is a view for explaining the operation of the substrate when the substrate is carried out in the eighth embodiment.

20a‧‧‧Substrate stage

30a‧‧‧Substrate holder

31x‧‧‧X slot

32, 62‧‧‧Tray guide

34, 64‧‧‧Z actuators

35, 65‧‧‧ Guides

40a‧‧‧Substrate tray

41‧‧‧Support members

43‧‧‧Reinforcing components

45a‧‧‧ Protrusion

60a‧‧‧埠

61‧‧‧ 台台

63‧‧‧Base

70a‧‧‧Substrate removal device

71‧‧‧X travel guide

72a‧‧‧ Pressing members

P‧‧‧Substrate

Claims (27)

A method for carrying out an object, comprising: moving an object holding device having an object holding member for holding a first object, moving toward an object carrying-out position from which the first object is carried out from the object holding member; and reaching the object holding device Before the object is carried out, the unloading operation of the first object from the object holding member is started. The method of unloading an object according to claim 1, wherein the first object is moved relative to the object holding member by the unloading device at the beginning of the unloading operation. The method of unloading an object according to the second aspect of the invention, wherein the first object system is carried out from the object holding device by moving the object carrying position in the first direction; and the carrying out operation is performed with the object holding device The movement in the second direction intersecting the first direction is performed simultaneously. The method of carrying out an object according to claim 1, wherein the object holding device has a first object supporting member that supports the first object; and the object holding device is moved to hold the object holding member, The object holding device that moves the first object supporting member that supports the first object moves. The method of loading an object according to the fourth aspect of the invention, wherein the loading and unloading device of the object holding device starts the first object supporting member that supports the first object with respect to the object holding member. mobile. The method of unloading an object according to claim 5, wherein the first object and the first object supporting member are carried out from the object holding device by moving the object carrying position in the first direction; And moving simultaneously with the object holding device in the second direction intersecting the first direction. The method of unloading an object according to any one of claims 4 to 6, wherein the first object supporting member is separated from the first object while the first object is held by the object holding member And being held by the object holding device; at the beginning of the unloading operation, the object holding device drives the first object supporting member to support the first object with respect to the first object, and supports the operation of the first object The movement of the first object supporting member of the first object to the object holding member together with the first object. A method for replacing an object on an object holding device, comprising: an action of carrying out an unloading method of an object according to any one of claims 1 to 6; and before the object holding device reaches the object carrying-out position (1) an operation in which a second object having a different object waits at a predetermined standby position; and an operation of moving the first object out of the object holding device while the object holding device is located at the object carrying-out position; and being placed at the standby position The second object is moved into the object holding device. The method for replacing an object according to claim 8 , wherein the moving out movement moves the first object along a predetermined two-dimensional plane; The loading operation moves the second object in a direction orthogonal to the predetermined two-dimensional plane. The method of replacing an object according to the eighth aspect of the invention, wherein the second object system is supported by a second object supporting member different from the first object supporting member; and the standby operation is supported by the second object. The second object of the support member waits at a predetermined standby position, and the loading operation moves the second object supporting member located at the standby position into the object holding device. An object holding device includes: an object holding member that holds an object and is movable along a predetermined two-dimensional plane between an object processing position at which the object is subjected to predetermined processing and an object carrying-out position at which the object is carried out; And at least a part of the unloading device that carries the object out of the object holding member before the object holding member reaches the object carrying-out position. The object holding device of claim 11, wherein the unloading device has a pressing member that presses the object from the object holding member. The object holding device of claim 11, wherein the object holding member has an object supporting member that supports the object and is used for conveying the object. The object holding device of claim 13, wherein the unloading device has a pressing member that presses the object supporting member that supports the object, thereby moving the object from the object holding member Out. The object holding device of claim 14, wherein the pressing member is capable of being pressed against the object supporting member held by the object holding member and the object supporting member held from the object holding member Move between retreating positions. The object holding device according to claim 13, wherein the object holding member has a concave portion for accommodating at least a part of the object supporting member on the object holding surface of the object; the unloading device is housed in the concave portion. The object holding device according to claim 13, wherein the object holding member has a first recessed portion for accommodating at least a part of the object supporting member and an accommodating the unloading device on the object holding surface on which the object is placed 2 recesses. The object holding device of claim 13, wherein the unloading device is disposed on an outer side of the object holding member. The object holding device of claim 18, further comprising: an inducing device for inducing the object holding member along the predetermined two-dimensional plane with a predetermined stroke; the unloading device is provided in the inducing device. The object holding device according to any one of claims 11 to 19, wherein the carry-out device is provided in plurality. The object holding device according to any one of claims 13 to 19, wherein the unloading device has a rotating body that can abut against the object supporting member, and the object supporting member is moved by rotating the rotating body . The object holding device according to any one of claims 13 to 19, wherein the part of the unloading device forms a stator of a linear motor together with a movable member provided in the object supporting member; the object supporting member is Driven by the linear motor. An exposure apparatus comprising: the object holding device according to any one of claims 11 to 22; and a pattern forming device that forms a predetermined pattern on the object using an energy beam. The exposure apparatus of claim 23, wherein the object system is used for a substrate of a flat display device. The exposure apparatus of claim 24, wherein at least one side of the substrate has a length of 500 mm or more. A method of manufacturing a flat panel display comprising: an action of exposing the object using an exposure device of claim 24 or 25; and an action of developing the object after exposure. A method of manufacturing a component, comprising: an action of exposing the object using an exposure device of claim 23; and an action of developing the object after exposure.