KR20140043750A - Board exchange method - Google Patents

Abstract

The X-groove 31x which accommodates the board | substrate tray 40a used for conveyance of the board | substrate P is formed in the board | substrate holder 30a. Moreover, in the X groove | channel 31 x, the board | substrate carrying out apparatus 70a which presses the board | substrate tray 40a and moves the board | substrate P with the board | substrate tray 40a is formed. For this reason, after the exposure process with respect to the board | substrate P is complete | finished, carrying out operation | movement of the board | substrate P can be started before positioning the board | substrate stage 20a in the board | substrate exchange position for the exchange of the board | substrate P.

Description

Substitute exchange method {SUBSTRATE-REPLACEMENT METHOD}

The present invention relates to a method of carrying an object, a method of exchanging an object, an object holding apparatus, an exposure apparatus, a manufacturing method of a flat panel display, and a device manufacturing method, and more particularly, an object on an object holding apparatus and an object supporting member. An object holding device comprising at least a part of a carrying device for carrying out the object, a method for carrying out an object on the object holding device, including a method of carrying out an object to be carried out from the object holding device together; An exposure apparatus provided with an object holding apparatus, the manufacturing method of the flat panel display using the said exposure apparatus, and the device manufacturing method using the said exposure apparatus.

Conventionally, in the lithography process which manufactures electronic devices (micro devices), such as a liquid crystal display element and a semiconductor element (integrated circuit, etc.), the projection exposure apparatus (so-called stepper) of a step-and-repeat system mainly, or a step-and-tip Scanning projection exposure apparatuses (so-called scanning steppers (also called scanners)) and the like are used.

As this kind of exposure apparatus, it is known to carry in and carry out a glass plate or a wafer (hereinafter, collectively referred to as a "substrate") to an substrate stage apparatus using a predetermined substrate transfer apparatus (for example, an exposure object). , Patent Document 1).

Here, in the exposure apparatus, when the exposure process with respect to the board | substrate hold | maintained in the board | substrate stage apparatus is complete | finished, the board | substrate is carried out from the board | substrate stage, and another board | substrate is conveyed on a board | substrate stage, and exposure processing is continuously performed with respect to several board | substrate. Is carried out. Therefore, when performing exposure process to a some board | substrate continuously, it is preferable to carry out a board | substrate from a board | substrate stage apparatus quickly.

US Patent No. 6,559,928

The present invention has been made under the above-described circumstances, and from a first viewpoint, an object holding device holding an object holding member for holding an object and an object holding member used for conveying the object is provided on the object holding member. Moving the object toward an object unloading position for carrying out the object, and initiating an unloading operation of unloading the object from the object holding member before the object holding device reaches the object unloading position; It is a way.

According to this, the carrying out operation of the object is started before the object carrying device reaches the carrying out position of the object, so that the carrying out operation of the object on the object holding member can be performed quickly.

According to a second aspect of the present invention, there is provided a method for carrying out an object according to a first aspect of the present invention, and another object supported by another object supporting member before the object holding device reaches the object carrying position. Waiting at a predetermined standby position, withdrawing the object and the object supporting member supporting the object from the object holding apparatus with the object holding apparatus positioned at the object carrying position, and being at the standby position A method of exchanging an object on an object holding device comprising bringing the other object and the other object supporting member supporting the other object together onto the object holding device.

According to a third aspect of the present invention, there is provided an object holding member for holding an object and an object supporting member used for conveying the object, the object held by the object holding member, and the object supporting member for supporting the object. It is an object holding apparatus provided with at least a part of the carrying out apparatus which carries out from the said object holding member together.

This invention is an exposure apparatus provided with the object holding apparatus which concerns on the 3rd viewpoint of this invention from the 4th viewpoint, and the pattern forming apparatus which forms a predetermined pattern using the energy beam on the said object.

According to a fifth aspect, the present invention provides an exposure apparatus for exposing an object with an energy beam to form a pattern on the object, the object holding member for holding the object and an object supporting member used for conveying the object; An object holding device having at least a part of a carrying device for carrying out the object held by the object holding member and the object holding member supporting the object from the object holding member together; It is an exposure apparatus provided with the pattern forming apparatus which forms the pattern of.

This invention is a manufacturing method of the flat panel display containing exposing the said object using the exposure apparatus which concerns on the 4th or 5th viewpoint of this invention, and developing the exposed said object from a 6th viewpoint. .

This invention is a device manufacturing method including exposing the said object using the exposure apparatus which concerns on the 4th or 5th viewpoint of this invention, and developing the exposed said object from a 7th viewpoint.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows roughly the structure of the liquid crystal exposure apparatus of 1st Embodiment.
FIG. 2: (A) is a top view of the board | substrate tray used by the liquid crystal exposure apparatus of FIG. 1, and FIG. 2 (B) is a side view of the board | substrate tray of FIG.
3 is a plan view of the substrate holder and the port portion of the liquid crystal exposure apparatus of FIG. 1.
4: (A) is a top view which shows the state with which the board | substrate holder and the board | substrate tray were combined, and FIG. 4 (B) is sectional drawing of the AA line of FIG. 4 (A).
FIG. 5 is a plan view of the substrate loading apparatus of the liquid crystal exposure apparatus of FIG. 1. FIG.
FIG. 6: (A)-FIG. 6 (C) are the figures (1-3) for demonstrating board | substrate carrying in operation | movement.
FIG. 7: (A) and 7 (B) are figures (1 and 2) for demonstrating board | substrate carrying out operation | movement.
FIG. 8: (A)-FIG. 8 (C) are figures (1-3) for demonstrating the board | substrate exchange operation | movement on a board | substrate holder.
FIG. 9: (A) is a top view of the board | substrate tray which concerns on 2nd Embodiment, and FIG. 9 (B) is a side view of the board | substrate tray of FIG. 9 (A).
10 is a plan view of the substrate holder and the port portion according to the second embodiment.
FIG. 11: (A)-11 (C) are figures (1-3) for demonstrating the board | substrate carrying out operation | movement of 2nd Embodiment.
12 is a plan view of the substrate holder and the port portion according to the third embodiment.
13 is a cross-sectional view of the substrate holder according to the fourth embodiment.
FIG. 14: (A) is a top view of the board | substrate holder which concerns on 5th Embodiment, and FIG. 14 (B) is a figure which shows the state in which the board | substrate holder and board | substrate tray of FIG. 14 (A) were combined.
FIG. 15: (A) is a top view of the board | substrate tray which concerns on 6th Embodiment, and FIG. 15 (B) is a state where the board | substrate tray of FIG. 15 (A) and the board | substrate holder which concerns on 6th Embodiment are combined. It is a figure which shows.
16 is a plan view of the substrate holder and the port portion according to the sixth embodiment.
FIG. 17: (A) is a top view of the board | substrate tray, board | substrate holder, and port part which concerns on 7th Embodiment, and FIG. 17 (B) is a figure for demonstrating the board | substrate carrying out operation in 7th Embodiment. to be.
18 is a plan view of a port portion according to the eighth embodiment.
It is a figure for demonstrating operation | movement of the board | substrate at the time of carrying out the board | substrate of 8th Embodiment.

&Quot; First embodiment "

Hereinafter, 1st Embodiment is described using FIGS. 1-8 (C).

In FIG. 1, the structure of the liquid crystal exposure apparatus 10 of 1st Embodiment is shown schematically. The liquid crystal exposure apparatus 10 is, for example, a projection exposure using a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used as a liquid crystal display device (flat panel display) as an exposure object. Device.

The liquid crystal exposure apparatus 10 has a resist (sensitizer) on the illumination system IOP, the mask stage MST holding the mask M, the projection optical system PL, and the surface (surface facing the + Z side in FIG. 1). The board | substrate stage apparatus PST holding the apply | coated board | substrate P, the board | substrate loading apparatus 50, the port part 60a which transfers a board | substrate between external devices, these control systems, etc. are included. In the following description, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is set as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is Y-axis direction, The description will be made with the directions perpendicular to the X and Y axes being the Z axis direction, and the rotation directions of the X, Y, and Z axis rotations being the θx, θy, and θz directions, respectively. In addition, description will be given by making the positions in the X-axis, Y-axis, and Z-axis directions as X positions, Y positions, and Z positions, respectively.

The illumination system IOP is comprised similarly to the illumination system disclosed, for example in the specification of US patent 6,552,775. That is, the illumination system IOP is configured to pass light emitted from a light source (for example, a mercury lamp) not shown through a reflector, a dichroic mirror, a shutter, a wavelength selective filter, various lenses, and the like, which are not shown, respectively. The mask M is irradiated as the exposure illumination light (illumination light) IL. As the illumination light IL, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm) ) Is used.

In the mask stage MST, the mask M in which a circuit pattern etc. were formed in the pattern surface is adsorbed-held by vacuum suction, for example. The mask stage MST is mounted on the barrel surface plate 16 that is a part of the apparatus main body (body), and is predetermined in the scanning direction (X axis direction) by, for example, a mask stage drive system (not shown) including a linear motor. While being driven by the long stroke of, it is appropriately finely driven in the Y-axis direction and in the θz direction. Position information (including rotation information in the θz direction) in the XY plane of the mask stage MST is obtained by a mask interferometer system including a laser interferometer (not shown).

The projection optical system PL is disposed below the mask stage MST and is supported by the barrel table 16. The projection optical system PL is configured in the same manner as the projection optical system disclosed in, for example, U.S. Patent No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection area of the pattern image of the mask M is arranged in a zigzag shape, and has a rectangular shape in which the Y-axis direction is the longitudinal direction. It functions equivalently to projection optics having a single image field of. In this embodiment, as each of the plurality of projection optical systems, forming a standing top with, for example, two telecentric equalization systems is used.

For this reason, when the illumination region on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination via the projection optical system PL by the illumination light IL which passed through the mask M is carried out. The projected image (partial sizing image) of the circuit pattern of the mask M in the area is formed in the irradiation area (exposure area) of the illumination light IL of the conjugate in the illumination area on the substrate P. The mask M is moved relative to the illumination region (illumination light IL) in the scanning direction by synchronous driving of the mask stage MST and the substrate stage apparatus PST, and the exposure region (illumination light IL) By relatively moving the substrate P in the scanning direction with respect to)), scanning exposure of one shot region on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot region. That is, in the present embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the sensitive layer on the substrate P by the illumination light IL The pattern is formed on the substrate P by the exposure.

The substrate stage apparatus PST is equipped with the surface plate 12 and the substrate stage 20a arrange | positioned above the surface plate 12.

The surface plate 12 is made of a rectangular plate-like member in plan view (viewed from the + Z side), and its top surface is finished with a very high plan view. The surface plate 12 is mounted on a substrate stage mount 13 that is a part of the apparatus main body. It includes a substrate stage mount 13, the device main body is mounted on the vibration isolator 14 provided on the floor 11 of the clean room, thereby the mask stage (MST), the projection optical system (PL), etc. It vibrates with respect to this floor 11.

The board | substrate stage 20a is mounted on the X coarse motion stage 23X, the X coarse motion stage 23X, and Y coarse motion stage 23Y and Y which comprise a so-called gantry type XY2 axis stage apparatus with the X coarse motion stage 23X. Weight cancellation which supports the fine movement stage 21 from below on the fine movement stage 21 arrange | positioned at the + Z side (upper) of the coarse motion stage 23Y, the board | substrate holder 30a holding the board | substrate P, and the surface plate 12 from below. The apparatus 26 etc. are provided.

The X coarse motion stage 23X is composed of a rectangular member having the Y-axis direction in the longitudinal direction in a plan view, and an elongated opening portion (not shown) is formed in the center at the Y-axis direction in the longitudinal direction. It is. The X coarse motion stage 23X is mounted on a guide member (not shown) extending in the X-axis direction provided separately from the apparatus main body on the floor 11, for example, during scanning operation during exposure and substrate exchange operation. The X stage drive system including a linear motor or the like is driven in a predetermined stroke in the X axis direction.

The Y coarse motion stage 23Y is made of a rectangular member in plan view, and an opening portion (not shown) is formed in the center thereof. The Y coarse motion stage 23Y is mounted on the X coarse motion stage 23X via a Y linear guide device 25, and is, for example, a Y stage drive system including a linear motor or the like at the time of Y step operation at the time of exposure. By the predetermined stroke in the Y-axis direction on the X coarse motion stage 23X. In addition, the Y coarse motion stage 23Y moves in the X axis direction integrally with the X coarse motion stage 23X by the action of the Y linear guide device 25.

The fine motion stage 21 consists of a rectangular parallelepiped member with a substantially square height low in planar view. The fine motion stage 21 is Y by a fine motion stage drive system including a plurality of voice coil motors (or linear motors) comprising a stator fixed to the Y coarse motion stage 23Y and a mover fixed to the fine motion stage 21. The micro stage is finely driven in the six degrees of freedom directions (X-axis, Y-axis, Z-axis, θx, θy, θz directions) with respect to the coarse motion stage 23Y. In the plurality of voice coil motors, the X voice coil motor 29x and the fine motion stage 21 of the plurality of microscopic drivings of the fine movement stage 21 in the X-axis direction (superimposed in the paper inward direction in FIG. 1) are moved in the Y-axis direction. The plurality of Y voice coil motors (not shown) to be micro-driven and the microscopic stages 21 to micro-drive in the Z-axis direction are disposed at positions corresponding to the four corner portions of the microscopic stages 21 (for example, the microscopic stages 21). Z voice coil motor 29z is included.

In addition, the fine motion stage 21 is guided to the Y coarse motion stage 23Y via the plurality of voice coil motors, thereby aligning the XY plane in the X axis direction and / or the Y axis direction together with the Y coarse motion stage 23Y. Therefore, it moves to a predetermined stroke. The positional information in the XY plane of the fine movement stage 21 includes a moving mirror fixed to the fine movement stage 21 via the mirror base 24 (X moving mirror 22x having a reflection surface orthogonal to the X axis, and Y axis). An X interferometer for measuring the X position of the fine motion stage 21 using an interferometer (not shown) that irradiates the side beam to a Y moving mirror having an orthogonal reflective surface (not shown), and an X moving mirror 22x; And a Y interferometer for measuring the Y position of the fine motion stage 21 using the Y moving mirror). The configuration of the fine motion stage drive system and the substrate interferometer system is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

The board | substrate holder 30a consists of a rectangular parallelepiped member with low square height in planar view which makes the X-axis direction the longitudinal direction, and is being fixed on the upper surface of the fine motion stage 21. As shown in FIG. On the upper surface of the substrate holder 30a, a plurality of hole portions (not shown) are formed. The board | substrate holder 30a is connected to the burr apparatus provided in the exterior, and is able to adsorb | suck and hold the board | substrate P by the said burr apparatus. The structure of the board | substrate holder 30a is demonstrated in detail later.

The weight cancel device 26 is composed of one columnar member extending in the Z-axis direction (also called a pontoon), and through the device called the leveling device 27, the center portion of the fine motion stage 21 is moved from below. I support it. The weight canceling device 26 is inserted in the opening of each of the X coarse motion stage 23X and the Y coarse motion stage 23Y. The weight canceling device 26 floats on the surface plate 12 via a minute clearance via a plurality of air bearings 26a attached to the lower surface portion thereof. The weight canceling device 26 is connected to the Y coarse motion stage 23Y via the plurality of coupling devices 26b at the center height position with respect to the Z axis direction, and is pulled by the Y coarse motion stage 23Y, thereby It moves on the surface plate 12 in the Y-axis direction and / or X-axis direction with the Y coarse motion stage 23Y.

The weight cancellation apparatus 26 has the air spring of omission of illustration, for example, and the fine motion stage 21, the leveling device 27, and the board | substrate holder 30a are driven by the vertical direction upward force which an air spring produces | generates. The weight of the back and the like (force in the vertical direction downward) is canceled, thereby reducing the load of the plurality of voice coil motors of the fine motion stage drive system. The leveling device 27 supports the fine motion stage 21 from below to be able to swing (tilt operation) with respect to the XY plane. The leveling device 27 is non-contactedly supported from below by the weight canceling device 26 via an air bearing (not shown). The detailed configuration and operation of the weight canceling device 26 including the leveling device 27 and the connecting device 26b are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

Here, in the liquid crystal exposure apparatus 10, the loading (unloading) of the substrate P to the substrate holder 30a and the unloading (unloading) of the substrate P from the substrate holder 30a are performed on the substrate P. ) Is mounted on a member called the substrate tray 40a shown in Figs. 2A and 2B.

As shown to FIG. 2 (A), the board | substrate tray 40a has the some support member 41, the connection member 42, the some reinforcement member 43, etc. FIG. The support member 41 consists of a rod-shaped member extended in an X-axis direction, and the shape of the cross section (YZ cross section) orthogonal to a longitudinal direction is a rectangle. The plurality of support members 41 are arranged parallel to each other at substantially equal intervals in the Y axis direction. As shown in FIG. 5, the longitudinal direction dimension of the support member 41 is set slightly longer than the dimension of the X-axis direction of the board | substrate P, and the board | substrate tray 40a is a some support member 41 The substrate P is supported from below. On the upper surface of each of the plurality of supporting members 41, a plurality of minute holes (not shown) are formed, and the substrate P can be adsorbed and held through the plurality of holes. In addition, although the board | substrate tray 40a of this 1st Embodiment shown to FIG. 2 (A), FIG. 4, FIG. 5 etc. has three support members 41 as an example, the number of the support members 41 is, It is not limited to this, For example, it can change suitably according to the magnitude | size of a board | substrate P, thickness (easy to bend), etc.

Tapered member 44a (cone member) having a tapered surface tapering from the -X side to the + X side, as shown in FIG. 2 (B), at an end portion on the + X side of each of the plurality of support members 41. Is attached. Moreover, the taper member 44b which has a taper surface tapering toward the -X side from the + X side is attached to the edge part of the -X side of each of the several support members 41. As shown in FIG.

As can be seen from FIGS. 2A and 2B, the connecting member 42 is made of a rod-shaped member of an XZ cross-sectional rectangle extending in the Y-axis direction. The connecting member 42 has the lower part fitted into the recessed part formed in the upper surface in the vicinity of the edge part on the + X side of each of the several support members 41, and has connected the some support member 41 with each other. The some reinforcement member 43 consists of the rod-shaped member of the XZ cross-sectional rectangle extended in a Y-axis direction, respectively, and the thickness is set thinner than the support member 41. FIG. As shown in FIG.2 (B), each recessed part is formed in the upper surface in the some support member 41 at predetermined intervals in the X-axis direction, and the reinforcement member 43 fits each of these recessed parts. It is. The depth of the recessed portion to which the reinforcing member 43 is fitted is set so that the upper surface of the reinforcing member 43 is located on the -Z side (or the same Z position) than the upper surface of the supporting member 41. As for the board | substrate tray 40a, the intermediate part of the longitudinal direction of the some support member 41 is mutually connected by the some reinforcement member 43, and the overall rigidity is improved.

In addition, among the plurality of support members 41 (for example, three in this embodiment), the center support member 41 has a rectangular parallelepiped 45a near the end of the -X side in the lower surface thereof. Have The function of the projection 45a will be described later.

As shown in FIG. 3, the upper surface (substrate mounting surface) of the board | substrate holder 30a respond | corresponds to the some support member 41 (refer FIG. 2 (A)) of the said board | substrate tray 40a. The plurality of X grooves 31x extending in the X axis are formed in the Y axis direction at predetermined intervals (for example, three in this first embodiment). The X groove 31x is opened to each side surface of the + X side and the -X side of the substrate holder 30a. The space | interval with respect to the Y-axis direction of some X groove | channel 31x is substantially same as the space | interval regarding the Y-axis direction of the some support member 41 of the board | substrate tray 40a shown to FIG. 2 (A). As shown to FIG. 4 (A), the support member 41 of the board | substrate tray 40a is accommodated in the X groove 31x in the state in which the board | substrate P was mounted on the board | substrate holder 30a. In addition, the length regarding the X-axis direction of the board | substrate holder 30a is set shorter than the length regarding the X-axis direction of the support member 41, and the board | substrate tray 40a and the board | substrate holder 30a are combined. The connecting member 42 is located outside the substrate holder 30a (+ X side than the end of the + X side of the substrate holder 30a), and the tapered members 44a and 44b are each outside the substrate holder 30a. It protrudes on.

3, the Y groove 31y extended in the Y-axis direction corresponding to the some reinforcement member 43 (refer FIG. 2 (A)) of the said board | substrate tray 40a on the upper surface of the board | substrate holder 30a. ) A plurality (for example, three in the present first embodiment) are formed at predetermined intervals in the X axis direction. The space | interval with respect to the X-axis direction of several Y groove | channel 31y generally coincides with the space | interval regarding the X-axis direction of the some reinforcement member 43 of the board | substrate tray 40a shown to FIG. 2 (A), and FIG. As shown to 4A, the reinforcing member 43 of the board | substrate tray 40a is accommodated in the Y groove 31y in the state which board | substrate tray 40a and board | substrate holder 30a combined.

Returning to FIG. 3, of the plurality of X grooves 31x, other X grooves 31x except for the center X groove 31x (in the first embodiment, two X grooves 31x on the + Y side and the -Y side). The tray guide apparatus 32 is accommodated in each inside of ()) (in this 1st embodiment, three pieces (for example, three) with predetermined space | interval in the X-axis direction with respect to one X groove | channel 31x). As shown in FIG. 4 (B), the tray guide device 32 is formed by the Z actuator 34 accommodated in the recessed portion 33 formed in the bottom face defining the X groove 31x, and the Z actuator 34. A guide member 35 is driven in the X groove 31x in the vertical direction (Z axis). Although the kind of Z actuator 34 is not specifically limited, For example, the cam apparatus, a feed screw apparatus, an air actuator, etc. which convert a horizontal force into a vertical force can be used. The Z actuator 34 of each of the plurality of tray guide devices 32 is synchronously driven by a main control device (not shown). The guide member 35 consists of a plate member parallel to an XY plane, and supports the support member 41 of the board | substrate tray 40a from below. On the upper surface of the guide member 35, a plurality of minute holes (not shown) are formed, and a pressurized gas (for example, air) is blown out from the hole parts, and the support member 41 is opened through the minute clearances. It is designed to support injuries. Moreover, the guide member 35 is able to adsorb | suck and hold the support member 41 mounted on the upper surface using the said hole part (or another hole part).

Returning to FIG. 3, the board | substrate carrying out apparatus 70a is accommodated in the center X groove 31x among the some X groove 31x. The board | substrate carrying out apparatus 70a has the X running guide 71 and the press member 72a. The X running guide 71 is made of a member extending in the X axis direction, and is fixed to a bottom face defining the X groove 31x. The dimension in the long (X-axis) direction of the X travel guide 71 is set longer than the dimension in the X-axis direction of the substrate holder 30a, and each of both ends in the long direction is the outer side of the substrate holder 30a. It protrudes on. As shown in FIG. 7 (A), the pressing member 72a consists of an XZ cross-sectional L-shaped member, and the part parallel to XY plane is slidably engaged with respect to the X travel guide 71 in the X-axis direction. And driven on the X travel guide 71 in a predetermined stroke in the X axis direction. Although the kind of the drive apparatus for driving the press member 72a is not specifically limited, For example, the X linear motor which consists of a stator which the X travel guide 71 has, and a mover which the press member 72a has, or X travels, for example. The feed screw device etc. which consist of the feed screw which the guide 71 has, and the nut which the press member 72a has can be used.

As shown in FIG. 1, the board | substrate loading apparatus 50 has the 1st conveyance unit 51a and the 2nd conveyance unit 51b. The 1st conveyance unit 51a is arrange | positioned above the port part 60a mentioned later, and the 2nd conveyance unit 51b is exchanged of the board | substrate P as the -X side of the 1st conveyance unit 51a. Substrate holder 20a when the substrate stage 20a moves to a position adjacent to the port portion 60a (a position on the end of the + X side of the surface plate 12. Hereinafter, the substrate replacement position). It is arrange | positioned so that it may be located above. In addition, the board | substrate exchange position carries out the board | substrate which carries out the board | substrate P hold | maintained in the board | substrate holder 30a (substrate stage 20a) on the board | substrate holder 30a (substrate stage 20a). It can be replaced with the position (object release position).

As shown in FIG. 5, the first conveying unit 51a includes a pair of X travel guides 52, a pair of X slide members 53 formed corresponding to the pair of X travel guides 52, and The holding member 54a hypothesized between a pair of X slide member 53 is provided. The pair of X running guides 52 are each formed of members extending in the X-axis direction, and the longitudinal direction dimension thereof is set slightly longer than the X-axis direction dimension of the substrate P. As shown in FIG. The pair of X running guides 52 are arranged in parallel to each other at a predetermined interval (slightly wider than the Y-axis direction dimension of the substrate P) in the Y-axis direction. Each of the pair of X slide members 53 is slidably engaged in the X axis direction with respect to the corresponding X travel guide 52, and an actuator (not shown) (for example, a feed screw device, a linear motor, and a belt drive) is omitted. Device, etc.) is synchronously driven at a predetermined stroke along the X travel guide 52.

The holding member 54a consists of a member extended in the Y-axis direction, and the some recessed part 55a is formed in the surface part toward -X side. The plurality of recesses 55a are formed in plural in the Y-axis direction at predetermined intervals (spacings substantially equal to the intervals in the Y-axis direction of the plurality of tapered members 44a of the substrate tray 40a). The recessed part 55a is defined by the taper surface narrowing from the -X side toward the + X side, and the holding member 54a is provided with a plurality of tapered members of the substrate tray 40a in the plurality of recessed parts 55a. 44a) Each edge part is inserted, and the edge part of the + X side of the board | substrate tray 40a is hold | maintained. The pair of X travel guides 52, the pair of X slide members 53, and the holding member 54a are driven at predetermined strokes in the Z axis direction by a Z actuator (not shown). In addition, without changing the Z position of the pair of X travel guides 52 and the pair of X slide members 53, only the holding member 54a is in the Z axis direction with respect to the pair of X travel guides 52. You may make it movable. The structure of the 2nd conveyance unit 51b except the point by which the some recessed part 55b into which the taper member 44b of the board | substrate tray 40a is inserted is formed in the surface part of the + X side of the holding member 54b. In addition, since it is the same as that of the said 1st conveyance unit 51a, description is abbreviate | omitted.

The board | substrate loading apparatus 50 is plurality in the state which hold | maintained the board | substrate tray 40a by the holding member 54a of the 1st conveying unit 51a, and the holding member 54b of the 2nd conveying unit 51b. By synchronously driving the X slide member 53, the substrate tray 40a can be moved between the upper portion of the port portion 60a and the upper side of the substrate exchange position along the XY plane (horizontal plane). In addition, since the 1st conveyance unit 51a and the 2nd conveyance unit 51b are driven in the Z-axis direction in synchronization with the 1st conveyance unit 51a, the board | substrate loading apparatus 50 is located above the port part 60a, or above the board | substrate exchange position. The substrate tray 40a can be moved up and down in each of the regions.

Here, the carrying-in operation | movement of the board | substrate P with respect to the board | substrate holder 30a using the board | substrate carrying apparatus 50 is demonstrated using FIG. 6 (A)-FIG. 6 (C). In addition, in FIG.6 (A)-FIG.6 (C), the member except the board | substrate holder 30a in the board | substrate stage 20a, the holding member 54a in the board | substrate loading apparatus 50 for the sake of simplicity. The illustration of the members except for 54b) is omitted respectively. As shown to FIG. 6 (A), the board | substrate tray 40a hold | maintained by the holding member 54a, 54b is conveyed above the board | substrate holder 30a located in a board | substrate exchange position. The substrate stage 20a has a Y position such that the Y position of the plurality of support members 41 (see FIG. 2A) of the substrate tray 40a and the Y position of the plurality of X grooves 31x generally coincide with each other. Is determined. In the substrate holder 30a, the guide member 35 of each of the plurality of tray guide devices 32 is positioned so that its upper surface is located on the + Z side than the upper surface of the substrate holder 30a (from the upper surface of the substrate holder 30a). Position so that it protrudes. Moreover, the press member 72a of the board | substrate carrying out apparatus 70a is located in the outer side of the board | substrate holder 30a as a position of the most -X side of the movable range. The length of the X travel guide 71 is set so that the press member 72a and the board | substrate tray 40a may not contact at the time of board | substrate loading.

From the state shown in FIG. 6 (A), the main controller of illustration not shown lowers the board | substrate tray 40a by driving each holding member 54a, 54b in a -Z direction (refer the arrow of FIG. 6 (A)). Let's do it. Thereby, as shown to FIG. 6 (B), the board | substrate tray 40a is transmitted to the some tray guide apparatus 32, and is adsorbed-held by the some guide member 35. As shown in FIG. In the main controller, the substrate tray 40a is mounted on the guide members 35 of the plurality of tray guide apparatuses 32, and the holding members 54a and 54b are spaced apart from the substrate tray 40a. After drive (refer the arrow of FIG. 6 (B)), as shown to FIG. 6 (C), it drives upward (refer the arrow of FIG. 6 (C)).

Moreover, in the board | substrate holder 30a, as shown to FIG. 6 (C), the some guide member 35 is driven in the -Z direction synchronously (refer the arrow of FIG. 6 (C)), for this reason, The tray 40a is lowered, and the substrate P is placed on the upper surface of the substrate holder 30a. The plurality of guide members 35 are further driven in the -Z direction even after the substrate P is placed on the upper surface of the substrate holder 30a. Thereby, the lower surface of the board | substrate tray 40a and the board | substrate P spaces apart, and the board | substrate P is hold | maintained by the board | substrate holder 30a.

Returning to FIG. 1, the port part 60a has the mount 61 and the some tray guide apparatus 62 (it is overlapped and covered in a paper inner direction in FIG. 1, see FIG. 3). The mount 61 is provided on the floor 11 at the + X side of the surface plate 12 and is housed in a chamber (not shown) together with the substrate stage device PST.

As shown in FIG. 3, a plurality of tray guide devices 62 (for example, two in this embodiment) are mounted on the mount 61 at predetermined intervals in the Y axis direction. In addition, although the port part 60a of this embodiment has two tray guide apparatus 62 as an example, the number of the some tray guide apparatus 62 is not limited to this, For example, a board | substrate tray ( It can change suitably according to the number of support members 41 (not shown in FIG. 3, see FIG. 2 (A)) of 40a. Specifically, among the plurality of support members 41, the support member 41 (the central support member 41 in the first embodiment) having the projection 45a (see FIG. 2 (B)) is excluded. In addition, the tray guide device 62 is provided on the mount 61 in correspondence with the other supporting members 41. In this embodiment, the space | interval regarding the Y-axis direction of the two tray guide apparatuses 62, for example, as shown in FIG. 5, supports the support member 41 of the most + Y side of the board | substrate tray 40a, and the most. It substantially coincides with the interval of the support member 41 on the -Y side.

As shown in FIG. 1, the tray guide apparatus 62 has the base 63 which consists of a plate-shaped member extended in an X-axis direction, and the plurality mounted on the base 63 at predetermined intervals in the X-axis direction (for example, And a plurality of guide members 65, which are driven in the vertical (Z-axis) direction by three Z actuators 64 and Z actuators 64. The base 63 is fixed to the plurality of X linear guide members 66 fixed to the upper surface of the mount 61 and the lower surface of the base 63, and engaged so as to slide freely on the X linear guide member 66. It is guided straight to the X-axis direction by the X linear guide apparatus which consists of X slide members 67. FIG. In addition, the base 63 is driven by a predetermined stroke in the X-axis direction by an X actuator (for example, a feed screw device, a linear motor, etc.) not shown. Although the kind of Z actuator 64 is not specifically limited, For example, a cam apparatus, a feed screw apparatus, an air actuator, etc. can be used. The Z actuator 64 of each of the plurality of tray guide devices 62 is synchronously driven by a main control device (not shown). The guide member 65 consists of a plate member parallel to an XY plane, and the support member 41 (refer FIG. 2 (A)) of the board | substrate tray 40a is mounted on the upper surface. On the upper surface of the guide member 65, a plurality of minute holes (not shown) are formed. The pressurized gas (for example, air) is blown out from the hole parts, and the substrate tray 40a is opened through the minute clearances. It is designed to support injuries.

Here, transfer operation | movement to the port part 60a from the board | substrate tray 40a using the board | substrate carrying apparatus 70a, and the board | substrate holder 30a of the board | substrate P mounted on the board | substrate tray 40a (substrate carrying out operation | movement). ) Will be described with reference to FIGS. 7A and 7B. In addition, in FIG.7 (A) and FIG.7 (B), the member except the board | substrate holder 30a in the board | substrate stage 20a, and a part of the mount 61 in the port part 60a for the sake of simplicity. Are omitted from each other. When the board | substrate P is carried out from the board | substrate holder 30a, in the board | substrate holder 30a, as shown to FIG. 7 (A), after the adsorption hold | maintenance of the board | substrate P is cancelled | released, 32 is driven synchronously, and the plurality of guide members 35 are driven in the + Z direction. Thereby, the board | substrate tray 40a raises and the board | substrate P is supported by the some support member 41 from below. The main controller further moves the plurality of guide members 35 in the + Z direction even after the substrate P is supported by the substrate tray 40a. Thereby, the board | substrate P and the board | substrate tray 40a are integrally moved to + Z direction, and the lower surface of the board | substrate P is spaced apart from the upper surface of the board | substrate holder 30a. At this time, the main controller is a minimum required to separate the substrate P from the substrate holder 30a and to position the lower surfaces of the plurality of reinforcing members 43 on the + Z side than the upper surface of the substrate holder 30a. The guide member 35 is driven by a stroke. For this reason, the lower half part of the some supporting member 41 of the board | substrate tray 40a is in the state accommodated in X groove 31x.

In addition, in the port part 60a, the some tray guide apparatus 62 is driven in the -X direction (the board | substrate stage 20a side), and the edge part of the -X side of the base 63 moves from the mount 61- It is positioned at the position protruding on the X side. In addition, the plurality of Z actuators 64 are arranged such that the Z positions of the plurality of guide members 65 are substantially the same (or slightly -Z side) of the Z positions of the plurality of guide members 35 in the substrate holder 30a. Controlled.

And in the board | substrate holder 30a, the press member 72a of the board | substrate carrying out apparatus 70a is driven to + X direction. The Z position (height) of the pressing member 72a is a projection (with the substrate tray 40a supported by the plurality of tray guide devices 32 in the substrate holder 30a in order to carry out the substrate P). 45a). For this reason, when the press member 72a is driven to + X direction, as shown to FIG. 7 (B), the board | substrate tray 40a will be pressed by the press member 72a and + X integrally with the press member 72a. Move in the direction of In the port portion 60a, the tray guide device 62 is driven in the + X direction in conjunction with the substrate tray 40a moving in the + X direction.

At this time, the guide member 35 on the substrate holder 30a side and the guide member 65 on the port portion 60a side eject pressurized gas to the lower surface of the support member 41, respectively, and the substrate tray ( Lift and support 40a). Therefore, the board | substrate tray 40a (substrate P) can be carried out from the board | substrate holder 30a to the port part 60a at high speed and low oscillation. In addition, from the point of carrying out the board | substrate P at high speed, the board | substrate tray 40a may adsorb | hold and hold | maintain the board | substrate P so that the position of the board | substrate P may not shift (it may be only holding | maintenance by frictional force). In addition, you may form in the board | substrate tray 40a the regulation member (for example, the pin-shaped member which protruded from the support member 41, etc.) which regulates the movement of the board | substrate P on the board | substrate tray 40a. In addition, since the board | substrate tray 40a is floatingly supported, for example, it presses so that the board | substrate tray 40a and the press member 72a may not be separated when pressing the board | substrate tray 40a with the press member 72a. An adsorption apparatus (for example, a vacuum adsorption apparatus, a magnetic adsorption apparatus, etc.) which adsorb | sucks and hold | maintains the projection 45a may be formed in the member 72a. Alternatively, for example, a mechanism (for example, rock pin or the like) for mechanically engaging the pressing member 72a and the substrate tray 40a may be formed. Further, for example, by applying a light load (braking force) in the −Z direction to the substrate tray 40a by using the suction holding function of the guide member 35, it is possible that the pressing member 72a and the projection 45a fall off. You may prevent it.

In addition, in this 1st Embodiment, although carrying out of the board | substrate P is performed by the board | substrate carrying out apparatus 70a which the board | substrate holder 30a has, this hold | maintains the board | substrate tray 40a in the port part 60a. Another substrate carrying device which moves in the + X direction may be formed, and the substrate carrying out operation by the substrate carrying out device 70a may be switched to the substrate carrying out operation using the other substrate carrying out device during the movement of the substrate tray 40a. In this case, the stroke of the press member 72a can be shortened. In addition, since the board | substrate tray 40a is floating-supported, the board | substrate tray 40a pressed by the press member 72a (thrust of + X direction) was guided from the guide member 35 by inertia. You may make it move to (65). Also in this case, the stroke of the press member 72a can be shortened.

In the liquid crystal exposure apparatus 10 (refer FIG. 1) comprised as mentioned above, under the control of the main control apparatus of omission of illustration, the mask M with respect to the mask stage MST is performed by the mask loader of omission of illustration. While the load is carried out, the load of the substrate P on the substrate holder 30a is performed by the substrate loading device 50. Thereafter, alignment measurement is performed using an alignment detection system (not shown) by the main controller, and after completion of the alignment measurement, a plurality of shot areas set on the substrate P are subjected to a step-and- An exposure operation is performed. In addition, since this exposure operation is the same as the exposure operation of the step-and-scan system conventionally performed, the detailed description is abbreviate | omitted. And while the board | substrate which completed exposure process is carried out from the board | substrate holder 30a, the other board | substrate exposed next is conveyed to the board | substrate holder 30a, and the board | substrate on the board | substrate holder 30a is exchanged, and several The exposure operation or the like is continuously performed on the substrate.

Hereinafter, the board | substrate exchange operation | movement on the substrate holder 30a in the liquid crystal exposure apparatus 10 is demonstrated using FIG. 8 (A)-FIG. 8 (C). 8A to 8C, for the sake of simplicity, other members except the substrate holder 30a in the substrate stage 20a and the holding members 54a and 54b in the substrate loading apparatus 50. In the other members except for the port portion 60a, a part of the mount 61 is omitted. The first embodiment, during the substrate exchange operation on the substrate holder (30a), Fig. 8 (A) ~ as shown in Fig. 8 (C), 2 of a substrate tray (40a) (for convenience, a substrate tray (40a ₁ , 40a ₂ )), and the substrate P is conveyed. Two substrate trays 40a ₁ and 40a ₂ are substantially the same. The following substrate exchange operation is performed under the management of the main controller not shown.

Figure 8 (A) a substrate (P ₁₎ the exposure process is exported exits from the substrate holder (30a), as shown in is, it is placed on the substrate tray (40a ₁₎ of one, the substrate tray (40a ₁ ) Is supported by the plurality of tray guide devices 32 of the substrate holder 30a from below. On the other hand, another substrate will be exposed, processed in the following embodiments (P ₂₎ is, and is placed on the other substrate of the tray (40a _2). Further, the substrate is held on the tray (40a ₂₎ includes a substrate holder (30a) a holding member (54a, 54b) so as to be positioned above the substrate holder that (30a) when located at a substrate exchange position.

Here, the main control unit, the lower side of the substrate (see Fig. ₁₎ (P 1) of the plurality of shot areas set on the image, a projection optical system (PL) for the substrate stage (20a) after the exposure process of the last shot area end From the substrate exchange position (position adjacent to the port portion 60a). And as shown in FIG. 8 (A), the main controller controls the several tray guide apparatus 32 in the board | substrate holder 30a during the movement of the board | substrate stage 20a, ie, before reaching the board | substrate exchange position. As a result, the substrate tray 40a ₁ is raised, the substrate P ₁ is separated from the upper surface of the substrate holder 30a, the substrate discharging device 70a is controlled, and the substrate tray is used using the pressing member 72a. 40a ₁ is moved to the + X side (the port portion 60a side). In this way, the substrate exchange position of the first embodiment, the substrate stage (20a) is out motion of the moving operation and the substrate (P ₁₎ to the substrate exchange position, the portion in parallel (that is, the substrate stage (20a in) The carrying out operation of the substrate P ₁ is performed prior to the positioning of the substrate.

Or less, is performed from the state shown in Fig. 8 (A), in the order shown in Figure 7 taken out by the, above-described (A), and Fig. 7 (B) of the substrate (P _1). That is, the substrate (P ₁₎ a support substrate trays (40a ₁₎ is driven further toward the + X by the substrate carry-out device (70a) in the substrate holder (30a), the substrate tray (40a _1), the port portion (60a, which ) Is transferred to the tray guide device 62.

Subsequently, as shown to FIG. 8 (B), the board | substrate which was waiting previously above the board | substrate holder 30a with respect to the board | substrate holder 30a in the procedure shown to FIG. 6 (A)-FIG. 6 (C) mentioned above. Import of (P ₂ ) is performed. And as shown to FIG. 8 (C), in the board | substrate stage 20a, X coarse motion stage 23X and / or Y coarse motion stage 23Y (not shown in FIG. 8 (C), respectively. See FIG. 1). Is appropriately driven and the exposure operation is performed on the substrate P ₂ held in the substrate holder 30a. In addition, in parallel with the exposure operation of the substrate P ₂ , in the port portion 60a, the exposed substrate P ₁ is transferred from the substrate tray 40a ₁ to an external device (for example, a coater developer device). While being conveyed, another substrate P ₃ is placed on the substrate tray 40a ₁ . The exchange operation of the substrate in the port portion 60a is performed using, for example, a robot arm (not shown), a lift pin device (not shown) formed in the port portion 60a, and the like.

Or less, but is not shown, the substrate (P _3), a substrate tray which supports (40a _1), the holding member (54a, 54b) maintained, the position shown in Figure 8 (A) to (above the substrate exchange position) Is returned. Typically, in the transport operation of the substrate trays (40a ₁₎ by the substrate (P _1, P ₃₎ exchange operation, and the substrate carry-in device 50 in the in the port portion (60a), the substrate (P ₂₎ because of it is terminated earlier than the exposure operation, the main control device includes a substrate (P _2), the exposure operation is terminated on the substrate holder (30a) has a substrate (P ₃₎ until it is moved to the substrate exchange position of the substrate exchange position It can be located above. As described above, in the first embodiment, since the two substrate trays 40a ₁ and 40a ₂ are used, the cycle time of the exchange of the substrate on the substrate holder 30a can be shortened.

In this 1st Embodiment demonstrated above, since the board | substrate holder 30a is equipped with the board | substrate carrying out apparatus 70a, after completion | finish of an exposure operation | movement, before the board | substrate holder 30a reaches a board | substrate exchange position, the board | substrate P The export operation of can be started. Therefore, the exchange cycle time of the board | substrate on the substrate holder 30a can be shortened, and the number of processes of the board | substrate P per unit time can be increased. On the other hand, when the board | substrate carrying out apparatus is formed in the exterior (for example, the port part 60a) of the board | substrate stage 20a, in order to start a board | substrate carrying out operation, the board | substrate holder 30a is positioned in a board | substrate exchange position. In order to achieve this, the substrate unloading operation takes longer than in the first embodiment.

&Quot; Second Embodiment &

Next, 2nd Embodiment is described using FIG. 9 (A)-FIG. 11 (C). In the liquid crystal exposure apparatus according to the second embodiment, except for the configurations of the substrate holder 30b, the port portion 60b (refer to FIG. 10 respectively), and the substrate tray 40b (see FIG. 9 (A)), Since it is the same as that of the liquid crystal exposure apparatus 10 (refer FIG. 1) of the said 1st Embodiment, only a difference is demonstrated below and the element which has a structure and a function similar to the said 1st Embodiment is said 1st Embodiment The same code | symbol as a form is attached | subjected, and the description is abbreviate | omitted.

While the board | substrate tray 40a (refer FIG. 2 (A)) of the said 1st Embodiment supported the board | substrate from below using 3 (odd) support members 41, for example, FIG. The board | substrate tray 40b of 2nd Embodiment shown to (A) has four (even-numbered) support members 41, for example. The substrate tray 40a (see FIG. 2 (A)) of the first embodiment includes, for example, three intermediate members in the longitudinal direction of the plurality of supporting members 41 by three reinforcing members 43. On the other hand, the board | substrate tray 40b of 2nd Embodiment shown to FIG. 9 (A) adds the reinforcement member 43 which connects the edge vicinity of the -X side of several support member 41 with each other. (Total, for example, has four reinforcing members 43). In addition, the board | substrate tray 40b does not have protrusion 45a (refer FIG. 2 (B)) like the board | substrate tray 40a of the said 1st Embodiment.

As shown in FIG. 10, on the upper surface of the substrate holder 30b, for example, four support members 41 of the substrate tray 40b (not shown in FIG. 10 (see FIG. 9A)), and For example, a plurality of X grooves 31x and Y grooves 31y corresponding to each of the four reinforcing members 43 are formed. In the state where the board | substrate holder 30b and the board | substrate tray 40b were combined, each of the several support member 41 and the reinforcement member 43 is accommodated in the corresponding X groove 31x and Y groove 31y. However, as shown to FIG. 11 (A), the reinforcement member 43 of the most -X side is located in the outer side of the board | substrate holder 30b. Returning to FIG. 10, the plurality of tray guide devices 32 are accommodated in the plurality of X grooves 31x, respectively. Moreover, another X groove 73x is formed in the center part which concerns on the Y-axis direction of the upper surface of the substrate holder 30b. In the X groove 73x, the board | substrate carrying out apparatus 70b is accommodated. In addition, the X groove 73x is formed in order to accommodate the board | substrate carrying out apparatus 70b, and the support member 41 of the board | substrate tray 40b is not accommodated. Moreover, in the port part 60b, for example, four tray guide apparatus 62 is mounted on the mount 61 corresponding to four support members 41, for example.

The board | substrate carrying out apparatus 70b has the X traveling guide 71 and the press member 72b which presses the board | substrate tray 40b. As shown in FIG. 11 (A), the pressing member 72b is made of a plate member parallel to the XY plane, and is driven on the X running guide 71 in the X-axis direction 72b ₁ , The X slide portion 72b ₁ has, for example, a pressing portion 72b ₂ made of a plate member having one end connected to it via a hinge device. The substrate carry-out device (70b) is, and has an actuator not shown, the angle X of the slide portion (72b ₁₎ and pressing portion (72b ₂₎ by the actuator is properly controlled.

Hereinafter, the board | substrate exchange operation | movement using the board | substrate carrying out apparatus 70b is demonstrated using FIG. 11 (A)-FIG. 11 (C). Also in the present second embodiment, two substrate trays 40b (called substrate trays 40b ₁ and 40b _{2 in} FIGS. 11A to 11C) are the same as the first embodiment. Used. From Figure 11 (A) a substrate holder (30b) and a substrate tray (40b ₁₎ a combination of the state shown in, when taken out of the substrate holder (30b) of the substrate (P ₁₎ with a substrate tray (40b _1), Fig. As shown to 11 (B), the angle of the X slide part 72b ₁ and the press part 72b ₂ becomes 90 degrees, for example, and the press member 72b becomes the same as the said 1st Embodiment. The substrate P ₁ is carried out by pressing the substrate tray 40b ₁ . At this time, the press member 72b presses the reinforcement member 43 of the most -X side among the some reinforcement members 43 which the board | substrate tray 40b ₁ has. For this reason, the height (Z-axis) direction dimension of the press member 72b is set slightly longer than the said 1st Embodiment.

Further, after the first exchange of the substrate (P) on the embodiments in the form, the substrate holder (30b) is the same as the first embodiment, the substrate (P ₁₎ taken out from the substrate holder (30b), Fig. as shown in 11 (C), the other substrate (P ₂₎ supported on a substrate other tray (40b ₂₎ is carried out by being brought onto the substrate holder (30b) by the substrate carry-in device not shown.

And, after the end of fetch operation of the substrate (P _2), FIG. 11 as shown in (C), the substrate carry-out device (70b) pressing member (72b) is by an actuator of a not shown, X slide portion of (72b ₁₎ The angle of the pressing portion 72b ₂ is controlled to be an obtuse angle (in an open state than when the substrate is unloaded), and in that state, the angle is driven in the -X direction on the X travel guide 71. Wherein, X slide portion (72b ₁₎ and pressing portion (72b _2), the angle is, the substrate tray (40b ₂₎ is located on the -Z side conditions (substrate supporting the plurality of the tray guide unit 32 of the (P ₂ ) Is placed on the upper surface of the substrate holder 30b and is set so as not to contact the reinforcing member 43 in a state spaced apart from the substrate tray 40b ₂ .

In 2nd Embodiment demonstrated above, even if the board | substrate P is mounted on the board | substrate holder 30b (for example, during exposure), the initial position which shows the press member 72b to FIG. 11 (A) is shown. It is possible to return to the position where the substrate tray 40b can be pressed. Therefore, after carrying out the board | substrate P, the carrying-in operation | movement of another board | substrate P can be started immediately (On the other hand, in the said 1st Embodiment, it is necessary to wait for return to the initial position of the press member 72a. There is).

In addition, in the substrate holder 30b, since the board | substrate carrying out apparatus 70b is accommodated in X groove 73x (exclusive groove | channel which is not used for accommodation of the board | substrate tray 40b), the board | substrate tray 40b is In the substrate holder 30b, all the supporting members 41 are supported from below by the tray guide apparatus 32, and in the port part 60b, all the supporting members 41 are the tray guide apparatus 62. Is supported from below. Therefore, dents in the substrate tray 40b and the substrate P are suppressed.

Further, the pressing member (72b), the pressing portion (72b ₂₎ has been a configuration which is rotated with respect to the X slide portion (72b _1), the configuration of the pressing member (72b) is pressed against a substrate tray (40b) state and If it is possible to move between states movable in the X-axis direction without contacting the substrate tray 40b, the present invention is not limited thereto, and for example, the pressing member 72b (or the entire substrate carrying device 70b) is moved in the Z-axis direction. It may be configured to be movable (up and down). In addition, you may comprise the board | substrate carrying out apparatus 70a of the said 1st embodiment shown in FIG. 3 etc. similarly to the board | substrate carrying out apparatus 70b of this 2nd embodiment.

&Quot; Third Embodiment &

Next, 3rd Embodiment is described using FIG. The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the liquid crystal exposure apparatus of the second embodiment except for the substrate holder 30c (substrate tray 40b (not shown in FIG. 12. (A) reference), including the port portion 60b). Hereinafter, only the differences will be described, and for the elements having the same configuration and function as those of the first and second embodiments, the first and second elements will be described. The same code | symbol as embodiment is attached | subjected, and the description is abbreviate | omitted.

In the said 2nd Embodiment, as shown in FIG. 10, the X groove 73x which accommodates the board | substrate carrying apparatus 70b in the center of the board | substrate holder 30b is the board | substrate tray 40b (not shown in FIG. 10). In contrast to the X groove 31x for accommodating the plurality of support members 41 in FIG. 9A, the substrate holder (as shown in FIG. 12) is shown in FIG. 12. 30c) includes, for example, between the first X groove 31x and the second X groove 31x from the + Y side, and the third X groove 31x and the fourth of the four X grooves 31x. The X groove 73x for accommodating the board | substrate carrying apparatus 70c is formed between each X groove | channel 31x of this. For this reason, the board | substrate holder 30c has two board | substrate carrying apparatus 70c apart from the Y-axis direction. The board | substrate carrying out apparatus 70c is the said agent except the point which has the hemispherical pressing member (not shown in FIG. 12) in the contact part with the board | substrate tray (not shown in FIG. 12) in the press member 72c. It is the same as 2nd Embodiment. In addition, since it is the same as that of the said 2nd Embodiment about board | substrate exchange operation | movement, description is abbreviate | omitted.

According to the third embodiment, for example, two substrate carrying apparatuses 70c are provided, and therefore, movement of the substrate tray and the substrate in the θz direction (yaw direction) at the time of carrying out the substrate can be easily suppressed. . In addition, since the thrust for moving the substrate tray is improved, the substrate tray can be unloaded more smoothly and quickly. In addition, the pressing member 72c may be a point contact or surface contact with respect to a board | substrate tray, without having a hemispherical pressing member.

&Quot; Fourth Embodiment &

Next, 4th Embodiment is described using FIG. The configuration of the liquid crystal exposure apparatus according to the fourth embodiment is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the substrate holder 30d (including the substrate tray 40a). In the following, only the differences will be described below, and the same reference numerals as those in the first embodiment will be given to elements having the same configuration and function as those in the first embodiment, and the description thereof will be omitted.

As shown in FIG. 13, the board | substrate holder 30d has the board | substrate carrying out apparatus 70d containing the rope drive apparatus 74 and the press member 72a. The rope drive device 74 includes a rope 74 ₁ , a plurality of pulleys 74 ₂ , and the like. The pressing member 72a is connected to the intermediate portion of the rope 74 ₁ . A part of the rope 74 ₁ is inserted together with the pressing member 72a in the X groove 31x formed on the upper surface of the substrate holder 30d. In addition, although not shown in FIG. 13, three X groove | channels 31x are formed in the Y-axis direction at predetermined intervals on the upper surface of the board | substrate holder 30d, for example, and the rope 74 ₁ is the center among them. Is inserted into the X groove 31x, and the plurality of tray guide devices 32 are accommodated in the other X groove 31x. Further, in the central portion on the Y-axis direction of the lower face of the substrate holder (30d), the other X groove (74 ₃₎ it is formed, and that in the X groove (74 _3), the other part of the rope (74 ₁₎ is inserted have. The plurality of pulleys 74 ₂ are attached to each of the end surfaces on the + X side and the -X side of the substrate holder 30d in the vertical direction, and are attached, for example, two (four in total). A rope 74 ₁ is wound around each of the plurality of pulleys 74 ₂ . An actuator (for example, a rotating motor) (not shown) is connected to one of the plurality of pulleys 74 ₂ , and the pressing member 72a is X by rotating the pulley 74 ₂ to which the actuator is connected. It moves to a predetermined stroke in the X-axis direction in the groove 31x. Since the board | substrate carrying out operation using the board | substrate carrying apparatus 70d is the same as that of said 1st Embodiment, the description is abbreviate | omitted.

According to the board | substrate carrying out apparatus 70d of this 4th embodiment, compared with the case where a feed screw apparatus etc. are used, for example, the press member 72a can be driven more quickly in the X-axis direction, and a board | substrate is quicker. Can be carried out from the substrate holder 30d. (It may be toothed, and without the teeth) In addition, if it can be driven by the pressing member (72a) the direction of + X, and -X directions, instead of a rope (74 _1), a belt, a chain, etc. may be used. In addition, the material of the rope 74 ₁ is not specifically limited, For example, a wire rope may be sufficient and a synthetic resin may be sufficient. Moreover, a part of board | substrate carrying out apparatus 70d, such as an actuator which rotates a pulley, is formed in members other than the board | substrate holder 30d (for example, Y coarse motion stage 23Y (not shown in FIG. 13, see FIG. 1)). In this case, the board | substrate holder 30d can be reduced in weight, and the position controllability of a board | substrate improves, The press member 72a is movable (refer FIG. 11 (A) etc.) like 2nd Embodiment. Moreover, 70 d of board | substrate carrying out apparatuses may be formed in multiple numbers apart in the Y-axis direction like the said 3rd Embodiment. Moreover, the guide member which guides the press member 72a to an X-axis direction is provided. You may form.

&Quot; Fifth Embodiment &

Next, 5th Embodiment is described using FIG. 14 (A) and FIG. 14 (B). The structure of the liquid crystal exposure apparatus which concerns on this 5th Embodiment is the said 1st Embodiment except the board | substrate holder 30e and the board | substrate tray 40e (not shown in FIG. 14 (A). See FIG. 14 (B)). Since it is the same as the liquid crystal exposure apparatus 10 (refer FIG. 1) of the form, only the difference is demonstrated below, and about the element which has the structure and function similar to the said 1st Embodiment, the code | symbol same as the said 1st Embodiment is shown. And omit the description.

As for the board | substrate tray 40e used by the liquid crystal exposure apparatus which concerns on 5th Embodiment, the support member 41 of several (for example, three) is the same as that of said 1st Embodiment (refer FIG. 2 (A)). Although it has, it is different from the said 1st Embodiment in that the lower surface does not have the projection 45a (refer FIG. 2 (B)). Further, a plurality of (for example, three) X grooves 31x corresponding to the plurality of (for example, three) support members 41 are formed on the upper surface of the substrate holder 30e. In the X groove 31x, the plurality of tray guide devices 32 (for example, three at predetermined intervals in the X-axis direction) are accommodated, and the plurality of support members 41 of the substrate tray 40e are all It is supported from below by the tray guide device 32 in the X groove 31x of the substrate holder 30e. In addition, although not shown in figure, the port part of 5th Embodiment has the several (for example, three) tray guide apparatus 62 corresponding to the said plurality (for example, three) support members 41 (FIG. 1).

As shown to FIG. 14 (B), the board | substrate carrying out apparatus 70e which the board | substrate holder 30e has is equipped with a pair of roller apparatus 75. As shown to FIG. + Y side, and it is formed with side -Y, each recess (75 _3), a roller device (75) of the pair of the substrate holders (30e) + X side X groove (31x) of the center in the vicinity of the end of the is accommodated in a state placed between an X-groove (31x), in the middle of the one-way + Y cheukin recess (75 ₃₎ inside, the other -Y cheukin recess (75 _3). Each of the pair of roller devices 75 has a rotation motor 75 ₁ and a roller 75 ₂ which is rotationally driven by the rotation motor 75 ₁ . The Z position of the roller 75 ₂ moves the lower surface of the reinforcing member 43 of the substrate tray 40e in order to carry out the board | substrate P (not shown in FIG. 14 (B). It is set in the position which can hold | support the support member 41 of the board | substrate tray 40e in the state located in the + Z side rather than the upper surface of the top surface). In the substrate carry-out device (70e), when the support member 41, the roller (75 ₂₎ of the pair in the inserted state, each rotating in opposite directions between the rollers (75 ₂₎ of the pair, the rollers of one pairs (75 ₂₎ respectively, and the support member 41 by the frictional force between a substrate tray (40e) is moved in the + X direction with respect to the substrate holder (30e), and is sent out to the port portion of a not shown of the substrate holder (30e) . Since the board | substrate carrying out operation using the board | substrate carrying apparatus 70e is the same as that of said 1st Embodiment, the description is abbreviate | omitted.

According to the board | substrate carrying out apparatus 70e which concerns on this 5th Embodiment, while being compact and lightweight, the board | substrate tray 40e can be carried out from the board | substrate holder 30e quickly. Moreover, when carrying out the board | substrate tray 40e, it does not have the member (for example, the press member 72a (refer FIG. 3) of the said 1st embodiment) moving to a predetermined stroke in the X-axis direction, and the member Since the operation | movement which returns to an initial position after carrying out of the board | substrate tray 40e is not necessary, board | substrate exchange operation can be performed quickly. In addition, in the board | substrate holder 30e (and port part not shown), since the board | substrate tray 40e can be carried out in the state in which all the some support member 41 was supported from below, the board | substrate P ) (Not shown in Figs. 14A and 14B. See Fig. 1) can suppress depression.

In addition, the roller device 75 has, and by forming the elastic member for the elastic roller (75 ₂₎ toward the support member 41, whereby the roller (75 ₂₎ and to suppress the slippage of the support member 41 have. In addition, or may be configured such that the roller (75 ₂₎ of the pair each may minute-drive in the Y-axis direction. Thereby, when inserting the support member 41 into the X-groove 31x, one pair of rollers 75 ₂ are retracted from the support member 41, and one pair is surely taken out at the time of carrying out the substrate tray 40e. It is possible to sandwich the support member 41 by the roller 75 _{2 of} . In addition, the board | substrate carrying out apparatus 70e may be formed in multiple numbers (for example, corresponding to the X groove 31x of the most + Y side and the most -Y side), spaced apart in the Y-axis direction. Moreover, a pair of roller apparatuses (not shown) which have the same structure as a pair of roller apparatus 75 (refer FIG. 14 (A) and FIG. 14 (B)) may be formed in the port part.

&Quot; Sixth Embodiment &

Next, 6th Embodiment is described using FIG. 15 (A)-FIG. The structure of the liquid crystal exposure apparatus which concerns on this 6th Embodiment is the board | substrate holder 30f (not shown in FIG. 15 (A). See FIG. 15 (B)), the board | substrate tray 40f, the port part 60f (FIG. 15 (A) and 15 (B) are not shown. Except for Fig. 16, since they are the same as the liquid crystal exposure apparatus 10 (see Fig. 1) of the first embodiment, only the differences will be described below. In addition, about the element which has the structure and function similar to the said 1st Embodiment, the code | symbol same as the said 1st Embodiment is attached | subjected and the description is abbreviate | omitted.

In the said 1st-5th embodiment, although the board | substrate carrying apparatus is each formed in the board | substrate holder, in this 6th Embodiment, as shown to FIG. 15 (B), 1 which the board | substrate holder 30f has The pair of X linear motors 70f constituted by the pair of X stators 76 and the pair of X movers 45f included in the substrate tray 40f function as the substrate carrying device.

As shown to FIG. 15 (A), the board | substrate tray 40f has the some (for example three) support member 41 similarly to the said 1st Embodiment (refer FIG. 2 (A)). have. And, for example, in each of the surface portions on the + Y side and the -Y side of the center support member 41 of the three support members 41, the X movable including a plurality of permanent magnets arranged at predetermined intervals in the X axis direction. The ruler 45f is attached. 45 M of X movable members are formed over substantially the whole except the vicinity of the both ends of the support member 41. FIG. In addition, the said center support member 41 does not have the projection 45a (refer FIG. 2 (B)) like the board | substrate tray 40a of the said 1st Embodiment.

As illustrated in FIG. 16, a plurality of (for example, three) X grooves 31x corresponding to the plurality of (for example, three) support members 41 are formed on the upper surface of the substrate holder 30f. It is. The plurality of tray guide devices 32 (for example, three at predetermined intervals in the X-axis direction) are accommodated in all of the X grooves 31x, and the plurality of support members 41 of the substrate tray 40f are provided. (Not shown in FIG. 16. See FIG. 15 (B)) are all supported from below by the tray guide device 32 in the X groove 31x of the board | substrate holder 30f. Moreover, in the vicinity of the edge part on the + X side of the board | substrate holder 30f, for example, in each of a pair of opposing surface parts which define the center X groove 31x among three X groove 31x, FIG. 15 (B) As shown in the figure, an X stator 76 including a coil unit is housed. In addition, FIG. 15 (B) corresponds to the sectional view along the line B-B in FIG. 16 (however, in FIG. 16, the substrate tray 40f is not shown). The Z position of each of the pair of X stators 76 moves the lower surface of the reinforcing member 43 of the substrate tray 40f to carry out the substrate P (not shown in Fig. 15 (B). It is set in the position which opposes the X mover 45f attached to the support member 41 of the board | substrate tray 40f in the state located on the + Z side rather than the upper surface of the board | substrate holder 30f.

In addition, as shown in FIG. 16, the port part 60f is a plurality corresponding to the said plurality (for example, three) support members 41 (not shown in FIG. 16. See FIG. 15 (A)). (For example, three) The tray guide apparatus 62 is provided. And a pair of X stator 68 is attached to the edge vicinity of the -X side of the base 63 of the center tray guide apparatus 62 among three tray guide apparatuses 62, for example. Each pair of X stators 68 includes a coil unit in the same manner as X stator 76. A pair of X stator 68 is arrange | positioned apart from the Y-axis direction at intervals wider than the dimension (width) regarding the Y-axis direction of the support member 41 of the said board | substrate tray 40f, The Z position is In the state in which the supporting member 41 is mounted on the plurality of guide members 65, the X movable member 45f (not shown in Fig. 16. See Fig. 15 (A)) attached to the supporting member 41. It is set so as to be approximately equal to the Z position (as opposed to the X mover 45f).

In the sixth embodiment, at the time of carrying out the substrate tray 40f from the substrate holder 30f, the pair of X stators 76 of the substrate holder 30f and the pair of X movers of the substrate tray 40f are carried out. By a pair of X linear motors 70f constituted by 45f, and a pair of X stators 68 of the port portion 60f and a pair of X movers 45f of the substrate tray 40f. A total of four X linear motors of another pair of X linear motors constituted are suitably used as the substrate carrying device. Since the board | substrate carrying out operation is the same as that of said 1st Embodiment, the description is abbreviate | omitted.

In the sixth embodiment, since the substrate tray 40f can be unloaded at high speed from the substrate holder 30f in a non-contact manner, oscillation is prevented. In addition, in the board | substrate holder 30f and the port part 60f, since the board | substrate tray 40f can be carried out in the state in which all the some supporting member 41 was supported from below, the board | substrate P (Not shown in FIGS. 15A to 16. See FIG. 1) can suppress depression. In addition, like the said 3rd Embodiment, X linear motor may be formed in multiple numbers (for example, corresponding to the support member 41 of the most + Y side and the most -Y side) in the Y-axis direction.

&Quot; Seventh Embodiment &

Next, 7th Embodiment is described using FIG. 17 (A) and FIG. 17 (B). The configuration of the liquid crystal exposure apparatus according to the seventh embodiment is the liquid crystal exposure apparatus 10 according to the first embodiment except for the substrate holder 30g, the substrate tray 40g, and the port portion 60g (FIG. 1). Note that only the differences will be described below, and the same reference numerals as those in the first embodiment will be given to elements having the same configuration and function as those in the first embodiment, and the description thereof will be omitted.

In the first to sixth embodiments, in the seventh embodiment, the substrate holders 30a to 30f (refer to FIGS. 1 to 16, respectively) have a substrate carrying device (or a part of the substrate carrying device). As shown to FIG. 17 (A), the board | substrate carrying out apparatus 70g is arrange | positioned at the + Y side and -Y side of the board | substrate holder 30g as the exterior of the board | substrate holder 30g, respectively. For example, the structure of each of two board | substrate carrying out apparatuses 70g is the board | substrate carrying out apparatus 70a of the said 1st embodiment except the point where the Z-axis direction dimension of the press member 72g is set slightly longer ( 3).

As shown to FIG. 17 (A), the board | substrate tray 40g has the support member 41 of several (for example, five). The substrate tray 40a (see FIG. 2 (A)) of the first embodiment includes, for example, three intermediate members in the longitudinal direction of the plurality of supporting members 41 by three reinforcing members 43. On the other hand, the board | substrate tray 40g further has 45g of reinforcement members which connect the edge part of the -X side of the some support member 41 with each other. In addition, the board | substrate tray 40g does not have the processus | protrusion 45a (refer FIG. 2 (B)) like the board | substrate tray 40a of the said 1st Embodiment.

In addition, among the plurality of reinforcing members 43 and 45g, the reinforcing member 45g on the -X side is longer than the other reinforcing members 43 whose longitudinal direction is different, and the dimensions thereof are shown in Fig. 17A. As shown in the figure, in the state where the substrate tray 40g is accommodated in the substrate holder 30g, the end on the -Y side protrudes from the end on the -Y side of the substrate holder 30g to the -Y side, and on the + Y side. The end part is set so that the end part may protrude to the + Y side from the end of the + Y side of the substrate holder 30g. As shown to FIG. 17 (B), the board | substrate tray 40g is the press member of the board | substrate carrying out apparatus 70g in which the edge vicinity of the + Y side of the reinforcement member 45g is arrange | positioned at the + Y side of the board | substrate holder 30g. While being pressed by 72g, the vicinity of the end portion on the -Y side of the reinforcing member 45g is pressed by the pressing member 72g of the substrate discharging device 70g disposed on the -Y side of the substrate holder 30g, It is carried out from the board | substrate holder 30g.

Here, the board | substrate holder 30g of the board | substrate stage 20g of 7th Embodiment is Y-coarse stage 23Y (FIG. 17 (A) and FIG. 17 (B)) similarly to the said 1st Embodiment shown in FIG. Is omitted). And each of the two board | substrate carrying out apparatuses 70g shown to FIG. 17 (A) and FIG. 17 (B) is attached to the Y coarse motion stage 23Y via the support member of omission of illustration, and a board | substrate It is mechanically (and vibratory) separated with respect to the holder 30g. For example, since the board | substrate carrying out operation using the two board | substrate carrying apparatus 70g is the same as that of said 1st Embodiment, the description is abbreviate | omitted. In addition, except that the port part 60g and the board | substrate carrying-in apparatus not shown are comprised corresponding to the board | substrate tray 40g which has five support members 41, the function is the said, Since it is the same as that of the first embodiment, the description thereof is omitted.

In the seventh embodiment, for example, each of the two substrate carrying apparatuses 70g is disposed outside the substrate holder 30g, so that the substrate carrying apparatus 70g is accommodated in the substrate holder 30g. It is not necessary to form a groove or the like, and it is possible to suppress a decrease in rigidity of the substrate holder 30g. In addition, since the substrate P can be adsorbed and held in a larger area, the flatness of the substrate P can be improved. Moreover, since the board | substrate holder 30g can be reduced in weight, and reaction force at the time of driving the press member 72g does not act on the board | substrate holder 30g, the position of the board | substrate holder 30g (substrate P) is carried out. Controllability is improved. Moreover, since the board | substrate carrying out apparatus 70g is arrange | positioned outside the board | substrate holder 30g, it is also excellent in maintenance property.

Further, the plurality of Z voice coil motors 29z (see FIG. 1) are used to drive the substrate holder 30g finely in the + Z direction by using a plurality of Z voice coil motors 29z (for example, each of the two substrate discharging devices 70g). By being located at the -Z side of the reinforcing member 45g, the pressing member 72g can pass below the reinforcing member 45g even when the substrate P is placed on the substrate holder 30g. . Thereby, it becomes possible to carry out another board | substrate promptly after the effect similar to the said 2nd Embodiment, ie, board | substrate carrying out. In addition, you may make it possible to move up and down each two board | substrate carrying out apparatuses 70g on the Y coarse motion stage 23Y, for example.

When the pressing member 72g is configured to not adsorb (only abut) the reinforcing member 45g, the θz direction of the substrate tray 40g and the substrate P (yaw direction) is the same as in the third embodiment. Can easily be suppressed. In addition, when the pressing member 72g adsorbs-holds the reinforcing member 45g, only one board | substrate carrying apparatus 70g may be provided in the outer side of the board | substrate holder 30g. In addition, the pressing member 72g may be towed by a rope or the like as in the fourth embodiment. Moreover, you may arrange | position the roller apparatus 75 like the board | substrate carrying out apparatus 70e (refer FIG. 14 (A)) which concerns on the said 5th embodiment in the outer side of a board | substrate holder like this 7th embodiment. In addition, as in the sixth embodiment, the mover may be attached to the substrate tray, and the X stator may be disposed outside the substrate holder.

&Quot; Eighth embodiment "

Next, an eighth embodiment will be described with reference to FIGS. 18 and 19. The configuration of the liquid crystal exposure apparatus according to the eighth embodiment is the same as that of the liquid crystal exposure apparatus (including the substrate holder 30g and the substrate tray 40g) of the seventh embodiment except for the port portion 60h. Therefore, only the difference is demonstrated below and the same code | symbol as the said 7th Embodiment is attached | subjected about the element which has a structure and a function similar to the said 7th Embodiment, and the description is abbreviate | omitted.

As shown in FIG. 18, the port part 60h has the tray guide apparatus 62h on the -X side of the mount 61. As shown in FIG. The tray guide device 62h includes a base 63h mounted on a floor (not shown) and a guide member 65h mounted on a base 63h. In addition, in the eighth embodiment, the plurality of tray guide devices 62 mounted on the mount 61 do not move in the X axis direction. The guide member 65h is formed of a member extending in the Y-axis direction, and the longitudinal direction dimension thereof is longer than the length (width) of the substrate tray 40g (and the substrate P) in the Y-axis direction ( Wide). The guide member 65h is provided at the same height position as the other guide member 65 on the mount 61, and ejects the pressurized gas from its upper surface to float the substrate tray 40g similarly to the guide member 65. I can support it. For this reason, when moving the board | substrate stage 20g to a board | substrate exchange position in order to transfer the board | substrate tray 40g from the board | substrate holder 30g to the port part 60h, it protrudes from the edge part at the + X side of the board | substrate holder 30g. The substrate tray 40g thus obtained is supported by the guide member 65h from below. Therefore, dents in the substrate tray 40g and the substrate P can be suppressed.

Here, for example, in the case where a plurality of shot regions are set in the substrate P, the shot region to be subjected to the exposure treatment at the end of the substrate P is usually used to reduce the total amount of movement of the substrate P. It is set on the + Y side or the -Y side. Accordingly, the substrate stage 20g after the end of the exposure process to the last shot region is moved in the X-axis direction as well as in the Y-axis direction when moving toward the substrate exchange position. Move in the direction of the photo). On the other hand, in this eighth embodiment, since the dimension regarding the Y-axis direction of the guide member 65h is set longer than the dimension regarding the Y-axis direction of the board | substrate tray 40g, the board | substrate stage 20g is X Even when it moves in the direction inclined with respect to an axis | shaft, the part which protruded from the edge part at the + X side of the board | substrate holder 30g of the board | substrate tray 40g is supported from below by the guide member 65h. For this reason, the board | substrate P can be carried out more quickly.

Specifically, with reference to FIG. 19, six shot regions are set on the substrate P, for example, the last shot region of which is the shot region S set on the + Y side and the + X side of the substrate P. FIG. ₆ ). In addition, the center of the shot area substrate (P) at the time when the center of the substrate (P) before the start of the exposure operation for the (S ₆₎ is located at a position (CP _1), that the exposure operation is completed, the position (CP ₂ ) In addition, illustration of the board | substrate tray 40a, the board | substrate carrying out apparatus 70g, the tray guide apparatuses 62 and 62h, etc. (refer FIG. 18, respectively) is abbreviate | omitted in FIG.

And in 8th Embodiment, before the board | substrate stage 20g reaches a board | substrate exchange position, the board | substrate P (and the board | substrate tray of illustration not shown) by the board | substrate carrying out apparatus 70g (refer FIG. 18) of illustration is omitted. 40 g) is carried out. For this reason, the board | substrate P (and the board | substrate tray 40g of illustration not shown) protrude from the edge part at the + X side of the board | substrate holder 30g, and the part which protruded together is guide member 65h of the tray guide apparatus 62h. (Not shown in FIG. 19. See FIG. 18) is supported from below by preceding the guide member 65 on the mount 61.

And, in the eighth embodiment, it is possible to carry out position control of the substrate stage (20g) to pass through the center of the sequence are the position of Figure _{19 CP 1 → CP 2 → CP} 3 of the substrate (P). That is, if it is assumed that the port portion 60h does not have the tray guide device 62h (not shown in Fig. 19. See Fig. 18), the substrate tray 40g (in Fig. 19) at the time of carrying out the substrate P is shown. 18, the position with respect to the Y-axis direction of the some tray guide apparatus 62 (not shown in FIG. 19, FIG. 18) on the mount 61 in that it moves parallel to an X-axis direction. And Y position control of the substrate stage 20g so as to substantially coincide with the positions of the plurality of support members 41 of the substrate tray 40g (not shown in FIG. 19, see FIG. 18). In this case, it is necessary to perform the position control of the substrate stage 20g so that the center of the substrate P passes through the sequence of the positions CP ₁ → CP ₂ → CP ₄ → CP ₃ in FIG. 19.

In contrast, in the eighth embodiment, regardless of the Y position of the substrate stage 20g, the vicinity of the end portion on the + X side of the substrate tray 40g (not shown in FIG. 19. Figure 19, the not shown. since the support in Fig. 18), the substrate stage directly to the substrate exchange position (position (CP from (20g), the position (position (CP ₂ when the exposure process of the last shot area has ended)) ₃ )), and the carrying out operation | movement of the board | substrate P can be performed quickly. In addition, the auxiliary tray guide apparatus 62h which concerns on this 8th embodiment, and the carrying method of the board | substrate P are applicable also to said 1st-7th embodiment. However, when the protrusion amount of the board | substrate P from a board | substrate holder is small (it does not contact the tray guide apparatus 62 also in a board | substrate exchange position), even if it does not have the auxiliary tray guide apparatus 62h, the board | substrate stage 20a- 20f) may be moved to the substrate exchange position directly from the position when the exposure process of the final shot region is completed.

In addition, the structure of a liquid crystal exposure apparatus is not limited to what was described in said 1st-8th embodiment, It can change suitably. For example, although each of the guide members 35 and 65 of the tray guide apparatuses 32 and 62 was a structure which supports non-contact (injury) of the board | substrate tray 40a-40g, it is not limited to this, For example, a ball etc. You may contact-support by low friction using the rolling element of. Moreover, each of the tray guide apparatuses 32 and 62 may be comprised so that the board | substrate tray 40a-40g may be guided straight to an X-axis direction using the guide member 35,65.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Further, as illumination light, for example, an infrared or visible single wavelength laser light oscillated from a DFB semiconductor laser or a fiber laser is amplified with, for example, a fiber amplifier doped with erbium (or both erbium and ytterbium). The harmonics obtained by converting the wavelength into ultraviolet light using a nonlinear optical crystal may be used. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

In addition, in the said embodiment, although the case where the projection optical system PL was the projection optical system of the multi-lens system provided with several projection optical units was demonstrated, the number of projection optical units is not limited to this, and if there is one or more, do. Further, the present invention is not limited to a projection optical system of a multi-lens type, and may be, for example, a projection optical system using an opener-type large-sized mirror. In addition, in the said embodiment, although the case where the projection magnification is equal magnification was used as projection optical system PL, it is not limited to this, The projection optical system may be any of a reduction system and an enlargement system.

In addition, in the said embodiment, although the light transmissive mask which provided the predetermined light shielding pattern (or phase pattern and photosensitive pattern) on the light transmissive mask substrate was used, it replaces this mask, for example, US patent 6,778,257. As disclosed in the specification, on the basis of the electronic data of the pattern to be exposed, an electronic mask (variable molding mask) for forming a transmission pattern or a reflection pattern or a light emission pattern, for example, a non-light-emitting image display element ( You may use the variable shaping mask using DMD (Digital Micro-mirror Device) which is a kind of spatial light modulator.

The exposure apparatus may be an exposure apparatus that exposes a substrate having a size (including an outer diameter, a diagonal length, and at least one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display Is particularly effective.

Also, the exposure apparatus can be applied to a step-and-repeat exposure apparatus or a step-and-stitch exposure apparatus.

The exposure apparatus is not limited to a liquid crystal exposure apparatus for transferring a liquid crystal display element pattern to a rectangular glass plate. For example, an exposure apparatus, a thin film magnetic head, a micromachine, a DNA chip The present invention can be widely applied to an exposure apparatus for manufacturing an exposure apparatus. In addition, in order to manufacture masks or reticles used in not only microdevices such as semiconductor devices but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a circuit pattern is transferred to a glass substrate or a silicon wafer or the like. The present invention can also be applied to an exposure apparatus. Further, the object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank, for example. In addition, when an exposure object is a board | substrate for flat panel displays, the thickness of the board | substrate is not specifically limited, For example, the thing of a film form (sheet-like member which has flexibility) is also included.

The substrate described in the first to eighth embodiments of the present invention is not limited to an exposure apparatus, but is applied to an object treating apparatus that performs a predetermined process on an object, such as an object inspecting apparatus used for inspecting a predetermined object. Object) may be applied.

Electronic devices, such as a liquid crystal display element (or a semiconductor element), perform the function and performance design of a device, the manufacture of the mask (or reticle) based on this design step, and the manufacture of a glass substrate (or wafer) The lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure apparatus of each embodiment described above, and the exposure method thereof, the developing step of developing the exposed glass substrate, and a portion other than the portion where the resist remains It is manufactured through an etching step of removing the exposed member of the portion by etching, a resist removing step of removing the resist which is unnecessary after the etching, a device assembly step, an inspection step and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate, whereby a device with high integration can be manufactured with good productivity.

In addition, the disclosure of the US patent application publication and the US patent specification relating to the exposure apparatus and the like cited in the above description are incorporated herein by reference.

Industrial availability

As described above, the method for carrying out the object of the present invention is suitable for carrying out the object from the object holding apparatus. In addition, the method for exchanging an object of the present invention is suitable for exchanging an object held in an object holding apparatus. Moreover, the object holding apparatus of this invention is suitable for quick carrying out of an object. Moreover, the exposure apparatus of this invention is suitable for exposing an object. Further, the method of manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. Moreover, the device manufacturing method of this invention is suitable for manufacture of a microdevice.

Claims (25)

Moving the object holding member for holding the object and the object holding device for holding the object supporting member used for conveying the object toward an object discharging position for carrying out the object from the object holding member;
Initiating an unloading operation of unloading the object from the object holding member before the object holding device reaches the object unloading position. The method according to claim 1,
In starting the said carrying out operation, the object carrying member which moves the said object support member which supports the said object with respect to the said object holding member is carried out using the carrying out apparatus which the said object holding apparatus has. 3. The method according to claim 1 or 2,
The object and the object supporting member are carried out from the object holding device by being moved in a first direction at the object carrying position,
And said carrying out operation is carried out in parallel with the movement with respect to the 2nd direction which cross | intersects the said 1st direction of the said object holding apparatus. 4. The method according to any one of claims 1 to 3,
The object supporting member is held by the object holding device apart from the object while the object is held by the object holding member,
Initiating the carrying out operation includes driving the object supporting member with respect to the object on the object holding apparatus to support the object, and attaching the object supporting member supporting the object to the object holding member together with the object. A method of discharging an object, comprising moving relative to the object. Carrying out the method for carrying out the object according to any one of claims 1 to 4,
Before the object holding device reaches the object discharging position, waiting another object supported by another object supporting member at a predetermined standby position;
Unloading the object and the object supporting member supporting the object from the object holding device with the object holding device positioned at the object discharging position;
Bringing the other object located in the standby position and the other object supporting member supporting the other object together onto the object holding device. 6. The method of claim 5,
In the carrying out, the object and the object supporting member supporting the object are moved along a predetermined two-dimensional plane,
In the carrying in, the other object and the other object supporting member supporting the other object are moved in a direction orthogonal to the predetermined two-dimensional plane. An object holding member for holding an object and an object supporting member used for conveying the object,
And at least a part of a carrying-out device for carrying out the object held by the object holding member and the object holding member supporting the object from and on the object holding member together. The method of claim 7, wherein
The object holding member is provided with a recess in which at least a portion of the object holding member is accommodated in an object holding surface portion on which the object is placed,
The said carrying apparatus is accommodated in the said recessed part. The method of claim 7, wherein
The object holding member includes: a first recessed portion in which at least a part of the object supporting member is accommodated, and a second recessed portion in which the carrying out device is accommodated, is formed in an object holding surface on which the object is mounted. The method of claim 7, wherein
The said carrying apparatus is arrange | positioned outside the said object holding member. 11. The method of claim 10,
Further comprising an induction device for guiding the object holding member to a predetermined stroke along a predetermined two-dimensional plane,
The said carrying apparatus is formed in the said induction apparatus. 12. The method according to any one of claims 7 to 11,
The carrying-out apparatus is provided in multiple numbers. 13. The method according to any one of claims 7 to 12,
The said carrying apparatus has a press member which carries out the said object from the said object support member by pressing the said object support member which supported the said object. 14. The method of claim 13,
The pressing member is movable between a position capable of pressing the object supporting member held by the object holding member and a position withdrawn from the object supporting member held by the object holding member. 13. The method according to any one of claims 7 to 12,
The said carrying apparatus has a rotating body which can abut on the said object supporting member, and moves the said object supporting member by rotating the said rotating body. 13. The method according to any one of claims 7 to 12,
The part of the said carrying out apparatus is a stator which comprises a linear motor with the movable member formed in the said object support member,
The object holding member is driven by the linear motor. 17. The method according to any one of claims 7 to 16,
The object holding member is formed to be movable between an object processing position at which a predetermined process is applied to the object and an object carrying position at which the object is carried out,
And said carrying device starts a carrying out operation of carrying out said object from said object holding member before said object holding member reaches said object carrying position. The object holding device according to claim 17,
And a pattern forming apparatus for forming a predetermined pattern on the object by using an energy beam. An exposure apparatus for exposing an object with an energy beam to form a pattern on the object,
An object holding member for holding the object and an object supporting member used for conveying the object, and the object held by the object holding member and the object supporting member for supporting the object together to be carried out from the object holding member; An object holding device having at least a portion of the carrying device,
And a pattern forming apparatus for forming a predetermined pattern on the object by using an energy beam. 20. The method of claim 19,
The object holding member is formed so as to be movable between an object processing position at which a predetermined process is applied to the object and an object carrying position at which the object is carried out. 21. The method of claim 20,
The said carrying out apparatus is an exposure apparatus which starts the carrying out operation | movement which carries out the said object from the said object holding member, before the said object holding member reaches the said object carrying position. 22. The method according to any one of claims 18 to 21,
The object is an exposure apparatus, which is a substrate used in a flat panel display device. 23. The method of claim 22,
At least one side of the said board | substrate has an exposure apparatus of 500 mm or more. Exposing the object using the exposure apparatus according to claim 22 or 23;
A method of manufacturing a flat panel display, comprising developing the exposed object. Exposing the said object using the exposure apparatus as described in any one of Claims 18-21,
And developing the exposed object.

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