JP5741834B2 - Object carry-out method, object exchange method, object holding apparatus, exposure apparatus, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

  The present invention relates to an object carry-out method, an object exchange method, an object holding apparatus, an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method, and more particularly, an object on an object holding apparatus together with an object support member. A method for carrying out an object carried out from the object holding device, a method for exchanging an object on the object holding device including the method for carrying out the object, an object holding device provided with at least a part of the carrying-out device for carrying out the object, The present invention relates to an exposure apparatus including an object holding apparatus, a flat panel display manufacturing method using the exposure apparatus, and a device manufacturing method using the exposure apparatus.

  Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.), a step-and-repeat type projection exposure apparatus (so-called stepper) or step-and- A scanning projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  As this type of exposure apparatus, one that carries in and out a glass plate or wafer (hereinafter collectively referred to as “substrate”), which is an object to be exposed, with respect to a substrate stage apparatus using a predetermined substrate transfer apparatus is known. (For example, refer to Patent Document 1).

  Here, in the exposure apparatus, when the exposure process on the substrate held by the substrate stage apparatus is completed, the substrate is unloaded from the substrate stage, and another substrate is transported onto the substrate stage, so that a plurality of substrates are transferred. The exposure process is continuously performed on the substrate. Therefore, it is preferable to quickly carry out the substrate from the substrate stage apparatus when performing the exposure process on a plurality of substrates continuously.

US Pat. No. 6,559,928

  The present invention has been made under the circumstances described above, and from a first viewpoint, an object holding device that holds an object holding member that holds an object and an object support member that is used to transport the object, Moving the object from above the object holding member toward an object unloading position, and unloading the object from the object holding member before the object holding device reaches the object unloading position. Starting the object.

  According to this, since the object unloading operation is started before the object holding device reaches the object unloading position, the object unloading operation on the object holding member can be quickly performed.

  According to a second aspect of the present invention, the object carrying-out method according to the first aspect of the present invention and the object holding device supported by another object support member before reaching the object carrying-out position. Waiting another object at a predetermined standby position, and unloading the object and the object support member supporting the object from the object holding apparatus in a state where the object holding apparatus is located at the object unloading position. An object on the object holding device including: bringing the another object located at the standby position and the other object supporting member supporting the other object together onto the object holding device. Is the method.

  From a third viewpoint, the present invention provides an object holding member that holds an object and an object support member used for transporting the object, the object that the object holding member holds, and the object support that supports the object. And an at least part of an unloading device for unloading the member from the object holding member.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus comprising: an object holding device according to the third aspect of the present invention; and a pattern forming apparatus that forms a predetermined pattern on the object using an energy beam. .

  According to a fifth aspect of the present invention, there is provided a flat panel display comprising: exposing the object using the exposure apparatus according to the fourth aspect of the present invention; and developing the exposed object. It is a manufacturing method.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method including: exposing the object using the exposure apparatus according to the fourth aspect of the present invention; and developing the exposed object. is there.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus of 1st Embodiment. 2A is a plan view of a substrate tray used in the liquid crystal exposure apparatus of FIG. 1, and FIG. 2B is a side view of the substrate tray of FIG. It is a top view of the substrate holder and port part which the liquid-crystal exposure apparatus of FIG. 1 has. 4A is a plan view showing a state in which the substrate holder and the substrate tray are combined, and FIG. 4B is a cross-sectional view taken along line AA of FIG. 4A. It is a top view of the board | substrate carrying-in apparatus which the liquid-crystal exposure apparatus of FIG. 1 has. FIGS. 6A to 6C are diagrams (No. 1 to No. 3) for explaining the substrate carry-in operation. FIGS. 7A and 7B are views (No. 1 and No. 2) for explaining the substrate carry-out operation. FIGS. 8A to 8C are views (No. 1 to No. 3) for explaining the substrate exchange operation on the substrate holder. FIG. 9A is a plan view of the substrate tray according to the second embodiment, and FIG. 9B is a side view of the substrate tray of FIG. 9A. It is a top view of the substrate holder and port part concerning a 2nd embodiment. FIG. 11A to FIG. 11C are diagrams (No. 1 to No. 3) for explaining the substrate carry-out operation of the second embodiment. It is a top view of the substrate holder and port part concerning a 3rd embodiment. It is sectional drawing of the substrate holder which concerns on 4th Embodiment. FIG. 14A is a plan view of a substrate holder according to the fifth embodiment, and FIG. 14B is a view showing a state in which the substrate holder and substrate tray of FIG. 14A are combined. FIG. 15A is a plan view of the substrate tray according to the sixth embodiment, and FIG. 15B is a combination of the substrate tray of FIG. 15A and the substrate holder according to the sixth embodiment. It is a figure which shows a state. It is a top view of a substrate holder concerning a 6th embodiment, and a port part. FIG. 17A is a plan view of a substrate tray, a substrate holder, and a port portion according to the seventh embodiment, and FIG. 17B is a diagram for explaining a substrate carry-out operation in the seventh embodiment. FIG. It is a top view of the port part concerning an 8th embodiment. It is a figure for demonstrating operation | movement of the board | substrate at the time of board | substrate carrying out of 8th Embodiment.

<< First Embodiment >>
The first embodiment will be described below with reference to FIGS. 1 to 8C.

  FIG. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 of the first embodiment. The liquid crystal exposure apparatus 10 is a projection exposure apparatus that uses a rectangular (rectangular) glass substrate P (hereinafter simply referred to as a substrate P) used for, for example, a liquid crystal display device (flat panel display) as an exposure object.

  The liquid crystal exposure apparatus 10 holds an illumination system IOP, a mask stage MST that holds a mask M, a projection optical system PL, and a substrate P on which a surface (a surface facing the + Z side in FIG. 1) is coated with a resist (sensitive agent). Including a substrate stage device PST, a substrate carry-in device 50, a port unit 60a for transferring a substrate to and from an external device, and a control system thereof. In the following, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, X-axis, and Y-axis. The direction orthogonal to the axis is defined as the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are described as the θx, θy, and θz directions, respectively. Further, description will be made assuming that the positions in the X-axis, Y-axis, and Z-axis directions are the X position, the Y position, and the Z position, respectively.

  The illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  On the mask stage MST, a mask M on which a circuit pattern or the like is formed is held by suction, for example, by vacuum suction. The mask stage MST is mounted on a lens barrel surface plate 16 which is a part of the apparatus body (body), and has a predetermined length in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including a linear motor, for example. While being driven by a stroke, it is slightly driven as appropriate in the Y-axis direction and the θz direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane is obtained by a mask interferometer system including a laser interferometer (not shown).

  Projection optical system PL is arranged below mask stage MST and supported by lens barrel surface plate 16. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in a staggered pattern, and is a rectangular single unit whose longitudinal direction is the Y-axis direction. Functions in the same way as a projection optical system having one image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used.

  For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL. A projected image (partial upright image) of the pattern is formed in the irradiation region (exposure region) of the illumination light IL conjugate to the illumination region on the substrate P. Then, by synchronous driving of the mask stage MST and the substrate stage apparatus PST, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL). By performing relative movement in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot area. That is, in this embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposure of the sensitive layer (resist layer) on the substrate P by the illumination light IL. Is formed.

  The substrate stage apparatus PST includes a surface plate 12 and a substrate stage 20 a disposed above the surface plate 12.

  The surface plate 12 is made of a rectangular plate-like member in plan view (viewed from the + Z side), and the upper surface thereof is finished with a very high flatness. The surface plate 12 is mounted on a substrate stage frame 13 which is a part of the apparatus main body. The apparatus body including the substrate stage mount 13 is mounted on a vibration isolator 14 installed on the floor 11 of the clean room, whereby the mask stage MST, the projection optical system PL, etc. vibrate with respect to the floor 11. Separated.

  The substrate stage 20a is mounted on the X coarse movement stage 23X and the X coarse movement stage 23X, and together with the X coarse movement stage 23X, forms a so-called gantry-type XY two-axis stage device, the Y coarse movement stage 23Y and the Y coarse movement stage 23Y on the + Z side. A fine movement stage 21 (upper), a substrate holder 30a for holding the substrate P, a weight canceling device 26 for supporting the fine movement stage 21 on the surface plate 12 from below are provided.

  The X coarse movement stage 23X is formed of a rectangular member having a longitudinal direction in the Y-axis direction in a plan view, and a long hole-like opening (not shown) having a longitudinal direction in the Y-axis direction is formed at the center thereof. Yes. The X coarse movement stage 23X is mounted on a guide member (not shown) that extends in the X-axis direction and is installed on the floor 11 separately from the apparatus main body. It is driven with a predetermined stroke in the X-axis direction by an X stage drive system including a linear motor.

  The Y coarse movement stage 23Y is made of a rectangular member in plan view, and an opening (not shown) is formed at the center thereof. The Y coarse movement stage 23Y is mounted on the X coarse movement stage 23X via a Y linear guide device 25. For example, during the Y step operation during exposure, the Y coarse movement is performed by a Y stage drive system including a linear motor. It is driven with a predetermined stroke on the stage 23X in the Y-axis direction. The Y coarse movement stage 23Y is moved in the X-axis direction integrally with the X coarse movement stage 23X by the action of the Y linear guide device 25.

  Fine movement stage 21 is formed of a rectangular parallelepiped member having a substantially square shape in plan view. The fine movement stage 21 is controlled by a fine movement stage drive system including a plurality of voice coil motors (or linear motors) including a stator fixed to the Y coarse movement stage 23Y and a mover fixed to the fine movement stage 21. The moving stage 23Y is slightly driven in directions of six degrees of freedom (X axis, Y axis, Z axis, θx, θy, θz directions). In the plurality of voice coil motors, a plurality of X voice coil motors 29x (overlapping in the depth direction of the paper surface in FIG. 1) and fine movement stage 21 are slightly driven in the Y-axis direction. A plurality of Y voice coil motors (not shown) and a plurality of Z voice coil motors 29z (for example, arranged at positions corresponding to the four corners of the fine movement stage 21) for finely driving the fine movement stage 21 in the Z-axis direction are included. .

  Further, the fine movement stage 21 is guided to the Y coarse movement stage 23Y via the plurality of voice coil motors, so that the fine movement stage 21 and the Y coarse movement stage 23Y are along the XY plane in the X axis direction and / or the Y axis direction. Move with a predetermined stroke. The positional information of the fine movement stage 21 in the XY plane is obtained by using a movable mirror (an X movable mirror 22x having a reflective surface orthogonal to the X axis and a reflective surface orthogonal to the Y axis) fixed to the fine movement stage 21 via a mirror base 24. An interferometer (not shown) that irradiates a measuring beam to a Y moving mirror (not shown) having X (an X interferometer that measures the X position of fine movement stage 21 using X moving mirror 22x), and a Y moving mirror. And a Y interferometer that measures the Y position of the fine movement stage 21 using a substrate interferometer system. The configurations of the fine movement stage drive system and the substrate interferometer system are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  The substrate holder 30 a is formed of a rectangular parallelepiped member having a rectangular shape in plan view with the X-axis direction as the longitudinal direction, and is fixed on the upper surface of the fine movement stage 21. A plurality of holes (not shown) are formed on the upper surface of the substrate holder 30a. The substrate holder 30a is connected to a vacuum device provided outside, and the substrate P can be sucked and held by the vacuum device. The configuration of the substrate holder 30a will be described in detail later.

  The weight canceling device 26 is composed of a single columnar member extending in the Z-axis direction (also referred to as a core column), and supports the central portion of the fine movement stage 21 from below via a device referred to as a leveling device 27. doing. The weight cancellation device 26 is inserted into the opening of each of the X coarse movement stage 23X and the Y coarse movement stage 23Y. The weight canceling device 26 floats on the surface plate 12 through a small clearance via a plurality of air bearings 26a attached to the lower surface portion thereof. The weight cancellation device 26 is connected to the Y coarse movement stage 23Y via a plurality of coupling devices 26b at the center of gravity height position in the Z-axis direction, and is pulled by the Y coarse movement stage 23Y. It moves on the surface plate 12 in the Y-axis direction and / or the X-axis direction together with the moving stage 23Y.

  The weight cancellation device 26 includes, for example, an air spring (not shown), and the weight (vertical downward force) of the fine movement stage 21, the leveling device 27, the substrate holder 30a, and the like by the upward force generated by the air spring. This reduces the load on the plurality of voice coil motors of the fine movement stage drive system. The leveling device 27 supports the fine movement stage 21 from below so as to be swingable (tilt operation) with respect to the XY plane. The leveling device 27 is supported in a non-contact manner from below on the weight cancellation device 26 via an air bearing (not shown). The detailed configuration and operation of the weight canceling device 26 including the leveling device 27 and the connecting device 26b are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Here, in the liquid crystal exposure apparatus 10, loading (loading) of the substrate P into the substrate holder 30 a and unloading (unloading) of the substrate P from the substrate holder 30 a are performed by moving the substrate P into FIGS. It is carried out by placing it on a member called the substrate tray 40a shown in B).

  As shown in FIG. 2A, the substrate tray 40a includes a plurality of support members 41, a connecting member 42, a plurality of stiffening members 43, and the like. The support member 41 is composed of a rod-shaped member extending in the X-axis direction, and the cross-section (YZ cross-section) orthogonal to the longitudinal direction has a rectangular shape. The plurality of support members 41 are arranged in parallel to each other at substantially equal intervals in the Y-axis direction. As shown in FIG. 5, the longitudinal dimension of the support member 41 is set to be slightly longer than the dimension of the substrate P in the X-axis direction, and the substrate tray 40 a uses the plurality of support members 41 to form the substrate P. Is supported from below. A plurality of minute holes (not shown) are formed on the upper surfaces of the plurality of support members 41, and the substrate P can be sucked and held through the plurality of holes. The substrate tray 40a of the first embodiment shown in FIGS. 2A, 4 and 5 has three support members 41 as an example, but the number of the support members 41 is as follows. However, the present invention is not limited to this, and can be appropriately changed according to, for example, the size and thickness (ease of bending) of the substrate P.

  As shown in FIG. 2B, a taper member 44a (conical truncated conical member) having a tapered surface that narrows from the −X side toward the + X side at the + X side end of each of the plurality of support members 41. ) Is attached. In addition, a taper member 44b having a tapered surface that becomes thinner from the + X side toward the -X side is attached to the −X side end of each of the plurality of support members 41.

  As can be seen from FIGS. 2A and 2B, the connecting member 42 is formed of a rod-shaped member having an XZ cross-sectional rectangle extending in the Y-axis direction. The lower part of the connecting member 42 is fitted into a recess formed on the upper surface in the vicinity of the + X side end of each of the plurality of support members 41, and connects the plurality of support members 41 to each other. The plurality of stiffening members 43 are each composed of a bar-shaped member having a rectangular XZ section extending in the Y-axis direction, and the thickness thereof is set to be thinner than that of the support member 41. As shown in FIG. 2B, recesses are formed in the upper surface of the support members 41 at predetermined intervals in the X-axis direction, and the stiffening members 43 are fitted into the recesses, respectively. doing. The depth of the recess into which the stiffening member 43 is fitted is set so that the upper surface of the stiffening member 43 is positioned on the −Z side (or the same Z position) with respect to the upper surface of the support member 41. The overall rigidity of the substrate tray 40 a is improved by connecting the intermediate portions in the longitudinal direction of the plurality of support members 41 to each other by the plurality of stiffening members 43.

  Of the plurality of support members 41 (three in this embodiment, for example), the center support member 41 has a rectangular parallelepiped protrusion 45a in the vicinity of the −X side end on the lower surface thereof. The function of the protrusion 45a will be described later.

  As shown in FIG. 3, the upper surface (substrate mounting surface) of the substrate holder 30a has an X extending along the X axis corresponding to the plurality of support members 41 (see FIG. 2A) of the substrate tray 40a. A plurality of grooves 31x (for example, three in the first embodiment) are formed at predetermined intervals in the Y-axis direction. The X groove 31x opens on the side surfaces on the + X side and the −X side of the substrate holder 30a. The intervals in the Y-axis direction of the plurality of X grooves 31x generally coincide with the intervals in the Y-axis direction of the plurality of support members 41 of the substrate tray 40a shown in FIG. As shown in FIG. 4A, the support member 41 of the substrate tray 40a is accommodated in the X groove 31x in a state where the substrate P is placed on the substrate holder 30a. Further, the length of the substrate holder 30a in the X-axis direction is set to be shorter than the length of the support member 41 in the X-axis direction, and the coupling member 42 is in a state where the substrate tray 40a and the substrate holder 30a are combined. The taper members 44a and 44b are located on the outside of the substrate holder 30a (on the + X side with respect to the + X side end of the substrate holder 30a), and protrude from the substrate holder 30a.

  Returning to FIG. 3, on the upper surface of the substrate holder 30a, Y grooves 31y extending in the Y-axis direction correspond to the plurality of stiffening members 43 (see FIG. 2A) of the substrate tray 40a in the X-axis direction. A plurality (for example, three in the first embodiment) are formed at predetermined intervals. The intervals in the X-axis direction of the plurality of Y grooves 31y substantially coincide with the intervals in the X-axis direction of the plurality of stiffening members 43 of the substrate tray 40a shown in FIG. As shown, the stiffening member 43 of the substrate tray 40a is accommodated in the Y groove 31y in a state where the substrate tray 40a and the substrate holder 30a are combined.

  Returning to FIG. 3, among the plurality of X grooves 31 x, the X grooves 31 x other than the central X groove 31 x (in the first embodiment, two X grooves 31 x on the + Y side and the −Y side) respectively. Includes a plurality of tray guide devices 32 (in the first embodiment, for example, three for each X groove 31x at a predetermined interval in the X-axis direction). As shown in FIG. 4B, the tray guide device 32 is moved up and down in the X groove 31x by the Z actuator 34 housed in the recess 33 formed in the bottom surface defining the X groove 31x, and the Z actuator 34. The guide member 35 is driven in the (Z-axis) direction. The type of the Z actuator 34 is not particularly limited. For example, a cam device, a feed screw device, an air actuator, or the like that converts a horizontal force into a vertical force can be used. The Z actuators 34 of the plurality of tray guide devices 32 are driven synchronously by a main controller (not shown). The guide member 35 is composed of a plate-like member parallel to the XY plane, and supports the support member 41 of the substrate tray 40a from below. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 35. Pressurized gas (for example, air) is ejected from the holes, and the support member 41 is supported in a floating manner through a minute clearance. Can be done. Further, the guide member 35 can suck and hold the support member 41 placed on the upper surface thereof using the hole (or another hole).

  Returning to FIG. 3, the substrate carry-out device 70 a is accommodated in the central X groove 31 x among the plurality of X grooves 31 x. The substrate carry-out device 70a has an X travel guide 71 and a pressing member 72a. The X travel guide 71 is made of a member extending in the X-axis direction, and is fixed to the bottom surface that defines the X groove 31x. The dimension of the X traveling guide 71 in the longitudinal (X-axis) direction is set longer than the dimension of the substrate holder 30a in the X-axis direction, and both end portions in the longitudinal direction protrude to the outside of the substrate holder 30a. As shown in FIG. 7A, the pressing member 72a is made of a member having an L-shaped XZ cross section, and a portion parallel to the XY plane engages with the X traveling guide 71 so as to be slidable in the X-axis direction. It is driven on the X travel guide 71 with a predetermined stroke in the X-axis direction. The type of drive device for driving the pressing member 72a is not particularly limited. For example, an X linear motor composed of a stator included in the X traveling guide 71 and a movable element included in the pressing member 72a, or an X traveling guide 71 is provided. A feed screw device including a feed screw having a nut and a nut included in the pressing member 72a can be used.

  The board | substrate carrying-in apparatus 50 has the 1st conveyance unit 51a and the 2nd conveyance unit 51b, as FIG. 1 shows. The first transport unit 51a is disposed above a port portion 60a described later, and the second transport unit 51b is on the −X side of the first transport unit 51a, and the substrate stage 20a is used to replace the substrate P. When moved to a position adjacent to the port portion 60a (a position on the vicinity of the + X side end of the surface plate 12; hereinafter referred to as a substrate replacement position), it is arranged to be positioned above the substrate holder 30a. . The substrate replacement position is a substrate unloading position (object unloading position) where the substrate P held by the substrate holder 30a (substrate stage 20a) is unloaded from the substrate holder 30a (substrate stage 20a) as described later. be able to.

  As shown in FIG. 5, the first transport unit 51 a includes a pair of X travel guides 52, a pair of X slide members 53 provided corresponding to the pair of X travel guides 52, and a pair of X slide members 53. A holding member 54a is provided. The pair of X travel guides 52 are each composed of a member extending in the X-axis direction, and the longitudinal dimension thereof is set somewhat longer than the X-axis dimension of the substrate P. The pair of X travel guides 52 are arranged in parallel to each other at a predetermined interval in the Y-axis direction (spacing slightly wider than the dimension of the substrate P in the Y-axis direction). Each of the pair of X slide members 53 is engaged with the corresponding X traveling guide 52 so as to be slidable in the X-axis direction, and by an actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive device, etc.). , And are driven synchronously with a predetermined stroke along the X travel guide 52.

  The holding member 54a is made of a member extending in the Y-axis direction, and a plurality of concave portions 55a are formed on the surface portion facing the −X side. The plurality of recesses 55a are formed at a predetermined interval in the Y-axis direction (substantially the same interval as the interval in the Y-axis direction of the plurality of taper members 44a of the substrate tray 40a). The concave portion 55a is defined by a tapered surface that narrows from the −X side toward the + X side, and the holding member 54a is configured such that each of the plurality of tapered members 44a of the substrate tray 40a is inserted into the plurality of concave portions 55a. The end on the + X side of the tray 40a is held. The pair of X traveling guides 52, the pair of X slide members 53, and the holding member 54a are driven with a predetermined stroke in the Z-axis direction by a Z actuator (not shown). Note that the Z position of the pair of X travel guides 52 and the pair of X slide members 53 may not be changed, and only the holding member 54a may be movable in the Z-axis direction with respect to the pair of X travel guides 52. The configuration of the second transport unit 51b is the same as that of the first transport unit 51a except that a plurality of recesses 55b into which the taper member 44b of the substrate tray 40a is inserted are formed on the surface portion on the + X side of the holding member 54b. Therefore, explanation is omitted.

  The substrate carry-in device 50 is configured such that the plurality of X slide members 53 are synchronously driven while the substrate tray 40a is held by the holding member 54a of the first transfer unit 51a and the holding member 54b of the second transfer unit 51b. The substrate tray 40a can be moved along the XY plane (horizontal plane) between the port portion 60a and the substrate replacement position. Further, the substrate carry-in device 50 is driven in the Z-axis direction in synchronization with the first transport unit 51a and the second transport unit 51b, so that each of the regions above the port portion 60a or the region above the substrate replacement position. The substrate tray 40a can be moved up and down.

  Here, the carrying-in operation of the board | substrate P with respect to the board | substrate holder 30a using the board | substrate carrying-in apparatus 50 is demonstrated using FIG. 6 (A)-FIG.6 (C). 6A to 6C, for the sake of simplicity, members other than the substrate holder 30a in the substrate stage 20a and members other than the holding members 54a and 54b in the substrate carry-in apparatus 50 are not shown. ing. As shown in FIG. 6A, the substrate tray 40a held by the holding members 54a and 54b is conveyed above the substrate holder 30a located at the substrate replacement position. The substrate stage 20a is positioned at the Y position so that the Y positions of the plurality of support members 41 (see FIG. 2A) of the substrate tray 40a substantially coincide with the Y positions of the plurality of X grooves 31x. In the substrate holder 30a, the guide members 35 of each of the plurality of tray guide devices 32 are positioned so that the upper surface thereof is positioned on the + Z side with respect to the upper surface of the substrate holder 30a (so as to protrude from the upper surface of the substrate holder 30a). . Further, the pressing member 72a of the substrate carry-out device 70a is located on the outermost side of the substrate holder 30a at the position closest to the −X side of the movable range. The length of the X traveling guide 71 is set so that the pressing member 72a and the substrate tray 40a do not come into contact with each other when the substrate is carried in.

  From the state shown in FIG. 6A, the main controller (not shown) lowers the substrate tray 40a by driving the holding members 54a and 54b in the −Z direction (see the arrows in FIG. 6A). Let As a result, as shown in FIG. 6B, the substrate tray 40 a is transferred onto the plurality of tray guide devices 32 and sucked and held by the plurality of guide members 35. The main controller drives each of the holding members 54a and 54b away from the substrate tray 40a in a state where the substrate tray 40a is placed on the guide members 35 of the plurality of tray guide devices 32 (FIG. 6B). After that, as shown in FIG. 6C, it is driven upward (see the arrow in FIG. 6C).

  In the substrate holder 30a, as shown in FIG. 6C, the plurality of guide members 35 are synchronously driven in the −Z direction (see the arrow in FIG. 6C), whereby the substrate tray 40a. Falls and the substrate P is placed on the upper surface of the substrate holder 30a. The plurality of guide members 35 are further driven in the −Z direction even after the substrate P is placed on the upper surface of the substrate holder 30a. As a result, the substrate tray 40a and the lower surface of the substrate P are separated from each other, and the substrate P is sucked and held by the substrate holder 30a.

  Returning to FIG. 1, the port portion 60 a includes a gantry 61 and a plurality of tray guide devices 62 (in FIG. 1, they are hidden in the depth direction of the drawing sheet, see FIG. 3). The gantry 61 is installed on the floor 11 at a position on the + X side of the surface plate 12, and is housed in a chamber (not shown) together with the substrate stage device PST.

  A plurality of (for example, two in this embodiment) tray guide devices 62 are mounted on the gantry 61 at predetermined intervals in the Y-axis direction, as shown in FIG. In addition, although the port part 60a of this embodiment has the two tray guide apparatuses 62 as an example, the number of the some tray guide apparatuses 62 is not restricted to this, For example, the support member 41 of the board | substrate tray 40a (It is not shown in FIG. 3; see FIG. 2A), and can be changed as appropriate. Specifically, among the plurality of support members 41, other than the support member 41 (the central support member 41 in the first embodiment) having the protrusion 45a (see FIG. 2B), other A tray guide device 62 is installed on the gantry 61 in correspondence with the support member 41. In the present embodiment, for example, the distance between the two tray guide devices 62 in the Y-axis direction is, as shown in FIG. 5, the most + Y side support member 41 and the most −Y side support member 41 of the substrate tray 40a. It is almost the same as the interval.

  As shown in FIG. 1, the tray guide device 62 includes a base 63 made of a plate-like member extending in the X-axis direction, and a plurality of (for example, three) Z actuators mounted on the base 63 at predetermined intervals in the X-axis direction. 64, a plurality of guide members 65 driven in the vertical (Z-axis) direction by the Z actuator 64, and the like. The base 63 is composed of a plurality of X linear guide members 66 fixed to the upper surface of the gantry 61 and an X slide member 67 fixed to the lower surface of the base 63 and slidably engaged with the X linear guide member 66. The guide device guides straight in the X-axis direction. The base 63 is driven at a predetermined stroke in the X-axis direction by an X actuator (not shown) (for example, a feed screw device, a linear motor, etc.). Although the kind of Z actuator 64 is not specifically limited, For example, a cam apparatus, a feed screw apparatus, an air actuator etc. can be used. The Z actuators 64 of the plurality of tray guide devices 62 are driven synchronously by a main control device (not shown). The guide member 65 is made of a plate-like member parallel to the XY plane, and the support member 41 (see FIG. 2A) of the substrate tray 40a is placed on the upper surface thereof. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 65. Pressurized gas (for example, air) is ejected from the holes, and the substrate tray 40a is supported to float through a minute clearance. Can be done.

  Here, the substrate tray 40a using the substrate carry-out device 70a, and the transfer operation (substrate carry-out operation) of the substrate P placed on the substrate tray 40a from the substrate holder 30a to the port portion 60a (FIG. 7A) and FIG. This will be described with reference to FIG. In FIGS. 7A and 7B, for the sake of simplification, members other than the substrate holder 30a in the substrate stage 20a and a part of the gantry 61 in the port portion 60a are not shown. When the substrate P is unloaded from the substrate holder 30a, as shown in FIG. 7A, the substrate holder 30a releases the suction holding of the substrate P, and then the plurality of tray guide devices 32 are synchronously driven. The plurality of guide members 35 are driven in the + Z direction. As a result, the substrate tray 40a is raised, and the substrate P is supported by the plurality of support members 41 from below. The main controller further moves the plurality of guide members 35 in the + Z direction even after the substrate P is supported by the substrate tray 40a. Accordingly, the substrate P and the substrate tray 40a are integrally moved in the + Z direction, and the lower surface of the substrate P is separated from the upper surface of the substrate holder 30a. At this time, the main control device guides the guide member with the minimum stroke necessary for separating the substrate P from the substrate holder 30a and positioning the lower surfaces of the plurality of stiffening members 43 on the + Z side with respect to the upper surface of the substrate holder 30a. 35 is driven. For this reason, the lower half part of the plurality of support members 41 of the substrate tray 40a is in a state of being accommodated in the X groove 31x.

  In the port portion 60a, the plurality of tray guide devices 62 are driven in the −X direction (substrate stage 20a side), and the end portion on the −X side of the base 63 is positioned at a position protruding from the mount 61 to the −X side. ing. Further, the plurality of Z actuators 64 are controlled so that the Z positions of the plurality of guide members 65 are substantially the same (or somewhat to the −Z side) as the Z positions of the plurality of guide members 35 in the substrate holder 30a.

  In the substrate holder 30a, the pressing member 72a of the substrate carry-out device 70a is driven in the + X direction. The Z position (height) of the pressing member 72a is set so as to contact the protrusion 45a in a state where the substrate tray 40a is supported by the plurality of tray guide devices 32 in the substrate holder 30a in order to carry out the substrate P. ing. Therefore, when the pressing member 72a is driven in the + X direction, as shown in FIG. 7B, the substrate tray 40a is pressed by the pressing member 72a and moves in the + X direction integrally with the pressing member 72a. In the port portion 60a, the tray guide device 62 is driven in the + X direction in conjunction with the substrate tray 40a moving in the + X direction.

  At this time, the guide member 35 on the side of the substrate holder 30a and the guide member 65 on the side of the port portion 60a respectively jet pressurized gas to the lower surface of the support member 41 to support the substrate tray 40a in a floating manner. Therefore, the substrate tray 40a (substrate P) can be carried out from the substrate holder 30a to the port portion 60a at high speed and with low dust generation. Since the substrate P is carried out at a high speed, the substrate tray 40a may hold the substrate P by suction so that the position of the substrate P does not shift (only holding by frictional force). Further, a regulating member (for example, a pin-like member protruding from the support member 41) that regulates the movement of the substrate P on the substrate tray 40a may be provided on the substrate tray 40a. Further, since the substrate tray 40a is supported in a floating manner, for example, the pressing member 72a is sucked and held so that the substrate tray 40a and the pressing member 72a are not separated when the substrate tray 40a is pressed by the pressing member 72a. An adsorption device (for example, a vacuum adsorption device or a magnetic adsorption device) may be provided. Alternatively, for example, a mechanism (for example, a lock pin) that mechanically engages the pressing member 72a and the substrate tray 40a may be provided. Further, for example, by applying a light load (braking force) in the −Z direction to the substrate tray 40a using the suction holding function of the guide member 35, the pressing member 72a and the protrusion 45a can be prevented from separating. good.

  Further, in the first embodiment, the substrate P is unloaded by the substrate unloading device 70a included in the substrate holder 30a. At the same time, the substrate tray 40a is held in the port portion 60a and moved in the + X direction. Another substrate carry-out device may be provided, and the substrate carry-out operation using the substrate carry-out device 70a may be switched to the substrate carry-out operation using the other substrate carry-out device during the movement of the substrate tray 40a. In this case, the stroke of the pressing member 72a can be shortened. Further, since the substrate tray 40a is supported in a floating manner, even if the substrate tray 40a pressed by the pressing member 72a (applied with thrust in the + X direction) is moved from the guide member 35 to the guide member 65 by inertia. good. Also in this case, the stroke of the pressing member 72a can be shortened.

  In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage MST by a mask loader (not shown) under the control of the main controller (not shown). At the same time, the substrate loading device 50 loads the substrate P onto the substrate holder 30a. Thereafter, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after completion of the alignment measurement, a plurality of shot areas set on the substrate P are sequentially exposed in a step-and-scan manner. Operation is performed. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted. Then, the substrate on which the exposure processing has been completed is carried out of the substrate holder 30a, and another substrate to be exposed next is transferred to the substrate holder 30a, whereby the substrate on the substrate holder 30a is exchanged, and a plurality of substrates are exchanged. An exposure operation or the like is continuously performed on the substrate.

Hereinafter, the substrate replacement operation on the substrate holder 30a in the liquid crystal exposure apparatus 10 will be described with reference to FIGS. 8 (A) to 8 (C). 8A to 8C, for the sake of simplification, the substrate stage 20a is a member other than the substrate holder 30a, and the substrate carry-in apparatus 50 is a member other than the holding members 54a and 54b. In the port portion 60a, a part of the gantry 61 is not shown. In the first embodiment, during the substrate replacement operation on the substrate holder 30a, as shown in FIGS. 8A to 8C, two substrate trays 40a (for convenience, the substrate trays 40a ₁ and 40a _{2 are used.} The substrate P is transported using the above. The two substrate trays 40a ₁ and 40a ₂ are substantially the same. The following board replacement operation is performed under the control of a main controller (not shown).

As shown in FIG. 8 (A), finished substrate P ₁ of the exposure process is unloaded from the substrate holder 30a is placed on one substrate tray 40a _1, the substrate tray 40a ₁ comprises a substrate It is supported from below by a plurality of tray guide devices 32 of the holder 30a. On the other hand, another substrate P ₂ to be subjected to the exposure processing next is placed on the other substrate tray 40a ₂ . Further, the substrate tray 40a _2, the substrate holder 30a is held by the holding member 54a, 54b so as to be located above the substrate holder 30a when positioned at the substrate exchange position.

Here, the main control unit, among the plurality of shot areas set on the substrate P _1, below after exposure for the last shot area has been completed, the substrate stage 20a projection optical system PL (see FIG. 1) To the substrate replacement position (position adjacent to the port portion 60a). Then, as shown in FIG. 8A, the main control device controls the plurality of tray guide devices 32 in the substrate holder 30a during the movement of the substrate stage 20a, that is, before reaching the substrate replacement position. To raise the substrate tray 40a ₁ to separate the substrate P ₁ from the upper surface of the substrate holder 30a, further control the substrate carry-out device 70a, and use the pressing member 72a to move the substrate tray 40a ₁ to the + X side (port portion 60a side). ). Thus, in this first embodiment, the movement of the substrate exchange position of the substrate stage 20a, and unloading operation of the substrate P ₁ is partially parallel (i.e., to the substrate exchange position of the substrate stage 20a unloading operation of the substrate P ₁ prior to the positioning) is performed.

Hereinafter, the state shown in FIG. 8 (A), out of the substrate P ₁ is carried out in the procedure shown in FIG. 7 described above (A), and 7 (B). That is, the substrate tray 40a ₁ for supporting a substrate _{P 1} is further driven in the + X side by the substrate carry-out device 70a in the substrate holder 30a, the substrate tray 40a ₁ is delivered to the tray guide unit 62 of the port portion 60a.

Next, as shown in FIG. 8B, the substrate that has been waiting in advance above the substrate holder 30a with respect to the substrate holder 30a in the procedure shown in FIGS. 6A to 6C described above. loading of the P ₂ is carried out. As shown in FIG. 8C, in the substrate stage 20a, the X coarse movement stage 23X and / or the Y coarse movement stage 23Y (not shown in FIG. 8C, respectively, see FIG. 1) are appropriately driven. is the exposure operation for the substrate P ₂ which is held by the substrate holder 30a is performed. Furthermore, the port portion 60a in parallel with the exposure operation of the substrate P _2, the external device from the exposed substrate P ₁ is on the substrate tray 40a ₁ (e.g., coater developer device) while being conveyed to another substrate P ₃ is placed on the substrate tray 40a _1. The substrate replacement operation in the port portion 60a is performed using, for example, a robot arm (not shown), a lift pin device (not shown) provided in the port portion 60a.

Hereinafter, although not shown, the substrate tray 40a ₁ for supporting the substrate _{P 3,} the holding member 54a, is held in 54b, it is conveyed to the position (above the substrate exchange position) shown in FIG. 8 (A). Usually, the operation of exchanging the substrates P ₁ and P ₃ in the port portion 60a and the operation of transporting the substrate tray 40a ₁ by the substrate carry-in device 50 are completed earlier than the exposure operation for the substrate P _2, so that the main controller the exposure operation for the substrate P ₂ is completed, the substrate holder 30a can be positioned to the substrate P ₃ until coming moved to the substrate exchange position above the substrate exchange position. As described above, in the first embodiment, since the two substrate trays 40a ₁ and 40a ₂ are used, the cycle time for replacing the substrate on the substrate holder 30a can be shortened.

  In the first embodiment described above, since the substrate holder 30a includes the substrate carry-out device 70a, the substrate P is carried out after the exposure operation is finished and before the substrate holder 30a reaches the substrate exchange position. The operation can be started. Therefore, the cycle time for exchanging the substrate on the substrate holder 30a can be shortened, and the number of substrates P processed per unit time can be increased. On the other hand, when the substrate carry-out device is provided outside the substrate stage 20a (for example, the port 60a), the substrate holder 30a must be positioned at the substrate exchange position in order to start the substrate carry-out operation. In addition, it takes time to carry out the substrate compared to the first embodiment.

<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. 9 (A) to 11 (C). The liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except for the configuration of the substrate holder 30b, the port portion 60b (see FIG. 10 respectively), and the substrate tray 40b (see FIG. 9A). The liquid crystal exposure apparatus 10 (see FIG. 1) is the same, so only the differences will be described below. Elements having the same configuration and function as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment. A description thereof will be omitted.

  The substrate tray 40a (see FIG. 2A) of the first embodiment supports the substrate from below using, for example, three (odd number) support members 41, whereas FIG. The substrate tray 40b of the second embodiment shown includes, for example, four (even number) support members 41. In addition, although the substrate tray 40a of the first embodiment (see FIG. 2A) has the longitudinal intermediate portions of the plurality of support members 41 connected to each other by, for example, three stiffening members 43. On the other hand, the substrate tray 40b of the second embodiment shown in FIG. 9A further includes a stiffening member 43 that connects the vicinity of the −X side end portions of the plurality of support members 41 to each other (total). For example, it has four stiffening members 43). The substrate tray 40b does not have the protrusion 45a (see FIG. 2B) like the substrate tray 40a of the first embodiment.

  As shown in FIG. 10, on the upper surface of the substrate holder 30b, for example, four support members 41 and, for example, four auxiliary members of the substrate tray 40b (not shown in FIG. 10, refer to FIG. 9A). A plurality of X grooves 31 x and Y grooves 31 y corresponding to the rigid members 43 are formed. In the state in which the substrate holder 30b and the substrate tray 40b are combined, the plurality of support members 41 and the stiffening member 43 are accommodated in the corresponding X grooves 31x and Y grooves 31y, respectively. However, as shown in FIG. 11A, the most -X side stiffening member 43 is located outside the substrate holder 30b. Returning to FIG. 10, a plurality of tray guide devices 32 are accommodated in the plurality of X grooves 31x, respectively. In addition, another X groove 73x is formed at the center of the upper surface of the substrate holder 30b in the Y-axis direction. A substrate carry-out device 70b is accommodated in the X groove 73x. The X groove 73x is formed to accommodate the substrate carry-out device 70b, and the support member 41 of the substrate tray 40b is not accommodated. In the port portion 60b, for example, four tray guide devices 62 are mounted on the gantry 61 in correspondence with, for example, the four support members 41.

The substrate carry-out device 70b has an X travel guide 71 and a pressing member 72b that presses the substrate tray 40b. The pressing member 72b, as shown in FIG. 11 (A), consists of parallel plate-like member to the XY plane, the X slide portion 72b ₁ which is driven in the X-axis direction on X running guide 71, X slide portion 72b ₁ has a pressing portion 72b ₂ made of a plate-like member connected at one end via a hinge device, for example. Substrate carry-out device 70b has an actuator (not shown), the angle between the X slide portion 72b ₁ and the pressing part 72b ₂ is appropriately controlled by the actuator.

Hereinafter, the substrate replacement operation using the substrate carry-out device 70b will be described with reference to FIGS. 11 (A) to 11 (C). Also in the second embodiment, as in the first embodiment, two substrate trays 40b (in FIG. 11A to FIG. 11C, substrate trays 40b ₁ and 40b ₂ ) are used. . From a state where the substrate holder 30b and the substrate tray 40b ₁ are combined as shown in FIG. 11 (A), when unloading the substrate _{P 1} together with the substrate tray 40b ₁ from the substrate holder 30b is shown in FIG. 11 (B) As shown, the angle between the X slide portion 72b ₁ and the pressing portion 72b ₂ is, for example, 90 °, and the pressing member 72b presses the substrate tray 40b ₁ to press the substrate P as in the first embodiment. ₁ is carried out. At this time, the pressing member 72b presses the stiffening member 43 on the most -X side of the plurality of stiffening members 43 having a substrate tray 40b _1. For this reason, the height (Z-axis) direction dimension of the pressing member 72b is set to be somewhat longer than that in the first embodiment.

Also in the second embodiment, exchange of the substrate P on the substrate holder 30b, as in the first embodiment, after the substrate P ₁ is unloaded from the substrate holder 30b, FIG. 11 (C) as shown, another substrate P ₂ which is supported on another substrate tray 40b ₂ is performed by being carried on a substrate holder 30b by a substrate carrying apparatus (not shown).

The angle after the loading operation is completed the substrate _{P 2,} as shown in FIG. 11 (C), the pressing member 72b of the substrate carry-out device 70b is by an actuator (not shown), an X slide portion 72b ₁ and the pressing portion 72b ₂ Is controlled to be an obtuse angle (in a more open state than when the substrate is unloaded), and in this state, it is driven in the −X direction on the X travel guide 71. Here, an angle between the X slide portion 72b ₁ and the pressing part 72b ₂ shows a state in which the substrate tray 40b ₂ which is supported on a plurality of the tray guide 32 is located at the most -Z side (the substrate _{P 2} is the substrate holder 30b is placed on the upper surface, it is set so as not to contact the stiffening member 43 in a spaced apart state) and the substrate tray 40b _2.

  In the second embodiment described above, even when the substrate P is placed on the substrate holder 30b (for example, during exposure), the pressing member 72b is moved to the initial position shown in FIG. The substrate tray 40b can be returned to a position where it can be pressed. Therefore, after unloading the substrate P, the loading operation of another substrate P can be started immediately (in contrast, in the first embodiment, it is necessary to wait for the pressing member 72a to return to the initial position).

  In the substrate holder 30b, the substrate carry-out device 70b is accommodated in the X groove 73x (a dedicated groove not used for accommodating the substrate tray 40b). The member 41 is supported from below by the tray guide device 32, and all the support members 41 are supported from below by the tray guide device 62 in the port portion 60b. Therefore, the bending of the substrate tray 40b and the substrate P is suppressed.

The pressing member 72b is pressed portion 72b ₂ is configured to be rotated relative to the X slide portion 72b _1, configuration of the pressing member 72b is a substrate tray 40b and depressible state, the substrate tray 40b For example, the pressing member 72b (or the entire substrate carry-out device 70b) can be moved (vertically moved) in the Z-axis direction as long as it can move between the states that can move in the X-axis direction without contact. It may be configured. Moreover, you may comprise the board | substrate carrying-out apparatus 70a of the said 1st Embodiment shown by FIG. 3 etc. similarly to the board | substrate carrying-out apparatus 70b of this 2nd Embodiment.

<< Third Embodiment >>
Next, a third embodiment will be described with reference to FIG. The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the liquid crystal exposure apparatus of the second embodiment except for the substrate holder 30c (substrate tray 40b (not shown in FIG. 12, see FIG. 9A). Therefore, only the differences will be described below, and elements having the same configurations and functions as those of the first and second embodiments are the same as those of the first and second embodiments. Reference numerals are assigned and explanations thereof are omitted.

  In the second embodiment, as shown in FIG. 10, the X groove 73 x that accommodates the substrate carry-out device 70 b in the center of the substrate holder 30 b is the substrate tray 40 b (not shown in FIG. 10, see FIG. 9A). In the third embodiment, as shown in FIG. 12, the substrate holder 30c includes, for example, 4 in the substrate holder 30c. Among the X grooves 31x, from the + Y side, between the first X groove 31x and the second X groove 31x, and between the third X groove 31x and the fourth X groove 31x, respectively. Further, an X groove 73x for accommodating the substrate carry-out device 70c is formed. For this reason, the substrate holder 30c has two substrate carry-out devices 70c that are spaced apart from each other in the Y-axis direction. The substrate carry-out device 70c has the above-described second configuration except that the pressing member 72c has a hemispherical pressing member (not shown in FIG. 12) at a contact portion with the substrate tray (not shown in FIG. 12). This is the same as the embodiment. Further, the substrate replacement operation is also the same as that in the second embodiment, and the description thereof is omitted.

  According to the third embodiment, for example, since the two substrate carry-out devices 70c are provided, the movement of the substrate tray and the substrate in the θz direction (yawing direction) during substrate carry-out can be easily suppressed. . Further, since the thrust for moving the substrate tray is improved, the substrate tray can be carried out more smoothly and quickly. The pressing member 72c may not have a hemispherical pressing member (point contact or surface contact with respect to the substrate tray).

<< Fourth Embodiment >>
Next, a fourth embodiment will be described with reference to FIG. The configuration of the liquid crystal exposure apparatus according to the fourth embodiment is the same as that of the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the substrate holder 30d (including the substrate tray 40a). Only differences will be described, and elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

As shown in FIG. 13, the substrate holder 30d includes a rope drive device 74 and a substrate carry-out device 70d including a pressing member 72a. Rope drive device 74 including a rope 74 _1, a plurality of pulleys 74 _2. The middle portion of the rope 74 _1, the pressing member 72a are connected. Rope 74 ₁ is partially the pressing member 72a is inserted into the X groove 31x formed on the upper surface of the substrate holder 30d. Although it is not shown in FIG. 13, X groove 31x is at a predetermined interval in the Y-axis direction on the upper surface of the substrate holder 30d, for example, are three forms, the rope 74 _1, in the X grooves 31x in the center of which A plurality of tray guide devices 32 are accommodated in the other X grooves 31x. Further, the center in the Y axis direction of the lower surface of the substrate holder 30d, another X groove ₇₄₃ is formed, on its X groove 74 in the _3, another part of the rope 74 ₁ is inserted. ₂ plurality of pulleys 74, at a distance from each other in each end face of the + X side and the -X side substrate holder 30d in the vertical direction, for example two by two (four in total) are attached. The plurality of pulleys 74 _2, respectively, the rope 74 ₁ is wound. The one of a plurality of pulleys 74 _2, an actuator (not shown) (e.g., rotary motor) is connected, by a pulley 74 ₂ to which the actuator is connected is rotated, the pressing member 72a is X groove It moves with a predetermined stroke in the X-axis direction within 31x. Since the substrate carry-out operation using the substrate carry-out device 70d is the same as that in the first embodiment, the description thereof is omitted.

According to the substrate carry-out device 70d of the fourth embodiment, the pressing member 72a can be driven in the X-axis direction at a higher speed than when a feed screw device or the like is used, for example, and the substrate can be quickly moved to the substrate holder 30d. Can be taken out of. Incidentally, if pulling the pressing member 72a + X direction, and the -X direction, instead of the ropes 74 _1, the belt (or without teeth with a tooth), etc. may be used a chain. Also, the rope 74 _1, the material is not particularly limited, for example, may be a wire rope, it may be made of synthetic resin. Further, a part of the substrate carry-out device 70d such as an actuator for rotating the pulley may be provided on a member other than the substrate holder 30d (for example, the Y coarse movement stage 23Y (not shown in FIG. 13, refer to FIG. 1)). In this case, the weight of the substrate holder 30d can be reduced, and the position controllability of the substrate is improved, and the pressing member 72a may be movable (see FIG. 11A, etc.) as in the second embodiment. Further, a plurality of substrate carry-out devices 70d may be provided apart from each other in the Y-axis direction as in the third embodiment, or a guide member for guiding the pressing member 72a in the X-axis direction may be provided. good.

<< Fifth Embodiment >>
Next, a fifth embodiment will be described with reference to FIGS. 14 (A) and 14 (B). The configuration of the liquid crystal exposure apparatus according to the fifth embodiment is the liquid crystal according to the first embodiment except for the substrate holder 30e and the substrate tray 40e (not shown in FIG. 14A, see FIG. 14B). Since it is the same as the exposure apparatus 10 (see FIG. 1), only the differences will be described below, and elements having the same configuration and function as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment. The description is omitted.

  The substrate tray 40e used in the liquid crystal exposure apparatus according to the fifth embodiment has a plurality of (for example, three) support members 41 as in the first embodiment (see FIG. 2A). However, it differs from the first embodiment in that it does not have a protrusion 45a (see FIG. 2B) on its lower surface. In addition, a plurality of (for example, three) X grooves 31x corresponding to the plurality of (for example, three) support members 41 are formed on the upper surface of the substrate holder 30e, and in all the X grooves 31x, A plurality of (for example, three at a predetermined interval in the X-axis direction) tray guide devices 32 are accommodated, and the plurality of support members 41 of the substrate tray 40e are all placed in the X groove 31x of the substrate holder 30e by the tray guide device 32. Supported from below. Although not shown, the port portion of the fifth embodiment includes a plurality (for example, three) of tray guide devices 62 (see FIG. 1) corresponding to the plurality of (for example, three) support members 41. Have.

As shown in FIG. 14B, the substrate carry-out device 70e included in the substrate holder 30e includes a pair of roller devices 75. + Y side of the central X grooves 31x in the vicinity of the end portion of the + X side of the substrate holder 30e, and the -Y side, a concave portion 75 ₃ are formed respectively, a pair of rollers 75, the recess 75 ₃ one of the + Y side among them, the other is a recess 75 in the _third -Y side, are accommodated in a state sandwiching the center in the X grooves 31x. Each of the pair of roller devices 75 includes a rotation motor 75 ₁ and a roller 75 ₂ that is rotationally driven by the rotation motor 75 ₁ . Z position of the roller 75 _2, the substrate P (FIG. 14 (B) in not shown. See FIG. 1) the lower surface of the stiffening member 43 of the substrate tray 40e for unloading the the + Z side than the upper surface of the substrate holder 30e In this state, the position is set to a position where the support member 41 of the substrate tray 40e can be sandwiched. In the substrate carry-out device 70e, the pair of rollers 75 _2, respectively in a state where the supporting member 41 between the pair of rollers 75 ₂ is inserted is rotated in the opposite directions, and the pair of rollers 75 ₂ respectively and the support member 41 The substrate tray 40e is moved in the + X direction with respect to the substrate holder 30e by the friction force between the substrate holder 30e and sent out to a port portion (not shown). Since the substrate carry-out operation using the substrate carry-out device 70e is the same as that in the first embodiment, the description thereof is omitted.

  According to the substrate carry-out device 70e according to the fifth embodiment, the substrate tray 40e can be quickly carried out of the substrate holder 30e while being small and light. Further, there is no member (for example, the pressing member 72a of the first embodiment described above (see FIG. 3)) that moves with a predetermined stroke in the X-axis direction when the substrate tray 40e is carried out. Since it is not necessary to return to the initial position after unloading, the substrate replacement operation can be performed quickly. Further, in the substrate holder 30e (and a port portion not shown), the substrate tray 40e can be carried out with all of the plurality of support members 41 being supported from below, so that the substrate P (FIG. 14A and FIG. The bending of FIG. 14B (not shown in FIG. 1) can be suppressed.

Note that the roller device 75 may be provided a biasing member for biasing the roller 75 ₂ to the support member 41, which can suppress the slippage between the roller 75 ₂ and the support member 41. The pair of rollers 75 ₂ each may be configured so as to be finely driven in the Y-axis direction. Thus, the retracting the pair of rollers 75 ₂ from the support member 41 when inserting the support member 41 in the X grooves 31x, and reliably sandwiching the support member 41 by a pair of rollers 75 ₂ during unloading of the substrate tray 40e Can do. Further, a plurality of substrate carry-out devices 70e may be provided apart from each other in the Y-axis direction (for example, corresponding to the most + Y side and −Y side X grooves 31x). Further, a pair of roller devices (not shown) having the same configuration as the pair of roller devices 75 (see FIGS. 14A and 14B) may be provided in the port portion.

<< Sixth Embodiment >>
Next, a sixth embodiment will be described with reference to FIGS. The configuration of the liquid crystal exposure apparatus according to the sixth embodiment includes a substrate holder 30f (not shown in FIG. 15A, see FIG. 15B), a substrate tray 40f, a port portion 60f (FIG. 15A) and Since it is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for (not shown in FIG. 15B, see FIG. 16), only the differences will be described below, and the first embodiment will be described. Elements having the same configuration and function as those of the embodiment are denoted by the same reference numerals as those of the first embodiment and description thereof is omitted.

  In the first to fifth embodiments, the substrate carry-out device is provided in each substrate holder, whereas in the sixth embodiment, as shown in FIG. A pair of X linear motors 70f including a pair of X stators 76 and a pair of X movers 45f included in the substrate tray 40f function as a substrate carry-out device.

  As shown in FIG. 15A, the substrate tray 40f has a plurality of (for example, three) support members 41, as in the first embodiment (see FIG. 2A). For example, each of the + Y side and −Y side surface portions of the central support member 41 of the three support members 41 includes an X mover 45f including a plurality of permanent magnets arranged at predetermined intervals in the X axis direction. Is attached. The X mover 45f is provided over substantially the entire portion excluding the vicinity of both ends of the support member 41. The central support member 41 does not have the protrusion 45a (see FIG. 2B) like the substrate tray 40a of the first embodiment.

  As shown in FIG. 16, a plurality (eg, three) of X grooves 31x corresponding to the plurality of (eg, three) support members 41 are formed on the upper surface of the substrate holder 30f. A plurality of (for example, three at a predetermined interval in the X-axis direction) tray guide devices 32 are accommodated in all the X grooves 31x, and a plurality of support members 41 (not shown in FIG. 16) of the substrate tray 40f. (See FIG. 15B) are all supported from below by the tray guide device 32 in the X groove 31x of the substrate holder 30f. Further, in the vicinity of the + X side end portion of the substrate holder 30f, for example, each of the pair of opposed surface portions defining the central X groove 31x among the three X grooves 31x is shown in FIG. Thus, the X stator 76 including the coil unit is accommodated. FIG. 15B corresponds to a cross-sectional view taken along the line BB in FIG. 16 (however, the substrate tray 40f is not shown in FIG. 16). The Z position of each of the pair of X stators 76 is such that the lower surface of the stiffening member 43 of the substrate tray 40f is moved from the upper surface of the substrate holder 30f to carry out the substrate P (not shown in FIG. 15B, see FIG. 1). Is also set to a position facing the X movable element 45f attached to the support member 41 of the substrate tray 40f in a state where the position is also located on the + Z side.

  Further, as shown in FIG. 16, the port portion 60f has a plurality (for example, three) of the plurality of (for example, three) support members 41 (not shown in FIG. 16, refer to FIG. 15A). The tray guide device 62 is provided. For example, of the three tray guide devices 62, a pair of X stators 68 are attached in the vicinity of the −X side end portion of the base 63 of the central tray guide device 62. Each of the pair of X stators 68 includes a coil unit similar to the X stator 76. The pair of X stators 68 are spaced apart from each other in the Y-axis direction at a larger interval than the dimension (width) of the support member 41 of the substrate tray 40f in the Y-axis direction. In a state where the support member 41 is mounted thereon, it is substantially the same as the Z position of the X mover 45f (not shown in FIG. 16, refer to FIG. 15A) attached to the support member 41 (X It is set so as to face the movable element 45f).

  In the sixth embodiment, when the substrate tray 40f is unloaded from the substrate holder 30f, a pair of X linear elements constituted by the pair of X stators 76 of the substrate holder 30f and the pair of X movers 45f of the substrate tray 40f. A total of four X linear motors including a pair of X stators 68 of the motor 70f and the port portion 60f and a pair of X movers 45f of the substrate tray 40f are appropriately used as a substrate carry-out device. Used. Since the substrate carry-out operation is the same as that in the first embodiment, description thereof is omitted.

  In the sixth embodiment, since the substrate tray 40f can be carried out at high speed without contact from the substrate holder 30f, dust generation is prevented. Further, since the substrate tray 40f can be carried out in a state where all of the plurality of support members 41 are supported from below in the substrate holder 30f and the port portion 60f, the substrate P (in FIGS. 15A to 16). (Refer to FIG. 1). Note that a plurality of X linear motors may be provided apart from each other in the Y-axis direction (for example, corresponding to the support member 41 on the most + Y side and the most -Y side) as in the third embodiment.

<< Seventh Embodiment >>
Next, a seventh embodiment will be described with reference to FIGS. 17 (A) and 17 (B). The configuration of the liquid crystal exposure apparatus according to the seventh embodiment is the same as that of the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the substrate holder 30g, the substrate tray 40g, and the port portion 60g. Only differences will be described, and elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

  In the first to sixth embodiments, the substrate holders 30a to 30f (see FIGS. 1 to 16 respectively) have the substrate carry-out device (or a part of the substrate carry-out device), whereas the seventh embodiment. In this embodiment, as shown in FIG. 17A, the substrate carry-out device 70g is arranged outside the substrate holder 30g and on each of the + Y side and the −Y side of the substrate holder 30g. For example, the configuration of each of the two substrate carry-out devices 70g is the same as that of the substrate carry-out device 70a (see FIG. 3) of the first embodiment, except that the dimension in the Z-axis direction of the pressing member 72g is set somewhat longer. It is.

  As shown in FIG. 17A, the substrate tray 40g has a plurality of (for example, five) support members 41. In addition, although the substrate tray 40a of the first embodiment (see FIG. 2A) has the longitudinal intermediate portions of the plurality of support members 41 connected to each other by, for example, three stiffening members 43. On the other hand, the substrate tray 40g further includes a stiffening member 45g for connecting the −X side ends of the plurality of support members 41 to each other. The substrate tray 40g does not have the protrusion 45a (see FIG. 2B) like the substrate tray 40a of the first embodiment.

  Of the plurality of stiffening members 43 and 45g, the most -X side stiffening member 45g has a longer longitudinal dimension than the other stiffening members 43, and the dimensions are shown in FIG. As shown, with the substrate tray 40g housed in the substrate holder 30g, the −Y side end protrudes from the −Y side end of the substrate holder 30g to the −Y side, and the + Y side end. The portion is set so as to protrude from the + Y side end of the substrate holder 30g to the + Y side. In the substrate tray 40g, as shown in FIG. 17B, the vicinity of the + Y side end of the stiffening member 45g is pressed by the pressing member 72g of the substrate carry-out device 70g disposed on the + Y side of the substrate holder 30g. At the same time, the vicinity of the −Y side end of the stiffening member 45g is pressed by the pressing member 72g of the substrate carry-out device 70g disposed on the −Y side of the substrate holder 30g, so that the substrate holder 30g is carried out. .

  Here, the substrate holder 30g of the substrate stage 20g of the seventh embodiment is similar to the Y coarse movement stage 23Y (FIGS. 17A and 17B) as in the first embodiment shown in FIG. (Not shown). 17A and 17B, for example, each of the two substrate carry-out devices 70g is attached to the Y coarse movement stage 23Y via a support member (not shown), and is attached to the substrate holder 30g. On the other hand, it is separated mechanically (and vibrationally). For example, the substrate unloading operation using the two substrate unloading devices 70g is the same as that in the first embodiment, and a description thereof will be omitted. The port portion 60g and the substrate carry-in device (not shown) have the same functions as those in the first embodiment except that the port portion 60g and the substrate carry-in device (not shown) are configured corresponding to the substrate tray 40g having five support members 41, for example. Therefore, the explanation is omitted.

  In the seventh embodiment, for example, each of the two substrate carry-out devices 70g is arranged outside the substrate holder 30g, so that a groove or the like for accommodating the substrate carry-out device 70g needs to be formed in the substrate holder 30g. Therefore, a decrease in rigidity of the substrate holder 30g can be suppressed. Further, since the substrate P can be sucked and held in a wider area, the flatness of the substrate P can be improved. Moreover, since the substrate holder 30g can be reduced in weight and the reaction force when driving the pressing member 72g does not act on the substrate holder 30g, the position controllability of the substrate holder 30g (substrate P) is improved. Moreover, since the board | substrate carrying-out apparatus 70g is arrange | positioned outside the board | substrate holder 30g, it is excellent also in maintainability.

  Further, the substrate holder 30g is slightly driven in the + Z direction by using a plurality of Z voice coil motors 29z (see FIG. 1), for example, each of the two substrate carry-out devices 70g is -Z of the stiffening member 45g of the substrate tray 40g. By being positioned on the side, the pressing member 72g can pass under the stiffening member 45g even when the substrate P is placed on the substrate holder 30g. As a result, the same effect as in the second embodiment, that is, another substrate can be carried in immediately after the substrate is carried out. For example, each of the two substrate carry-out devices 70g may be movable up and down on the Y coarse movement stage 23Y.

  If the pressing member 72g is configured not to adsorb (only abut) the stiffening member 45g, it is easy to move the substrate tray 40g and the substrate P in the θz direction (yawing direction) as in the third embodiment. Can be suppressed. Further, when the pressing member 72g sucks and holds the stiffening member 45g, only one substrate carry-out device 70g may be provided outside the substrate holder 30g. Further, the pressing member 72g may be pulled by a rope or the like as in the fourth embodiment. Also, a roller device 75 such as the substrate carry-out device 70e (see FIG. 14A) according to the fifth embodiment may be arranged outside the substrate holder, as in the seventh embodiment. Similarly to the sixth embodiment, a mover may be attached to the substrate tray, and the X stator may be disposed outside the substrate holder.

<< Eighth Embodiment >>
Next, an eighth embodiment will be described with reference to FIGS. The configuration of the liquid crystal exposure apparatus according to the eighth embodiment is the same as that of the liquid crystal exposure apparatus of the seventh embodiment (including the substrate holder 30g and the substrate tray 40g) except for the port portion 60h. Only elements having the same configuration and function as those of the seventh embodiment are denoted by the same reference numerals as those of the seventh embodiment, and description thereof is omitted.

  As shown in FIG. 18, the port portion 60 h has a tray guide device 62 h on the −X side of the gantry 61. The tray guide device 62h includes a base 63h mounted on a floor (not shown) and a guide member 65h mounted on the base 63h. In the eighth embodiment, the plurality of tray guide devices 62 mounted on the gantry 61 do not move in the X-axis direction. The guide member 65h is made of a member extending in the Y-axis direction, and its longitudinal dimension is set longer (wider) than the length (width) of the substrate tray 40g (and the substrate P) in the Y-axis direction. The guide member 65h is installed at the same height as the other guide members 65 on the gantry 61, and, like the guide member 65, the pressurized gas can be ejected from the upper surface thereof to support the substrate tray 40g in a floating manner. . Thus, when the substrate stage 20g is moved to the substrate replacement position in order to transfer the substrate tray 40g from the substrate holder 30g to the port portion 60h, the substrate tray 40g protruding from the + X side end of the substrate holder 30g is guided by the guide member 65h. Supported from below. Therefore, the bending of the substrate tray 40g and the substrate P can be suppressed.

  Here, for example, when a plurality of shot areas are set on the substrate P, the shot area where the exposure process is performed last is usually the + Y side of the substrate P or -Y to reduce the total movement amount of the substrate P. Set to the side. Therefore, the substrate stage 20g after the exposure processing for the last shot region is completed moves in the X-axis direction and also in the Y-axis direction when moving toward the substrate exchange position (with respect to the X-axis). To move diagonally). In contrast, in the eighth embodiment, the dimension of the guide member 65h in the Y-axis direction is set to be longer than the dimension of the substrate tray 40g in the Y-axis direction. Even when moving in an oblique direction, a portion of the substrate tray 40g protruding from the + X side end of the substrate holder 30g is supported from below by the guide member 65h. Thereby, the board | substrate P can be carried out more rapidly.

Specifically, referring to FIG. 19, for example, six shot areas are set on the substrate P, and the last shot area is a shot area S ₆ set on the + Y side and the + X side of the substrate P. is there. The center of the substrate P before the start of the exposure operation for the shot areas S ₆ is located at the position CP _1, the center of the substrate P when the exposure operation is completed, located at position CP _2. In FIG. 19, illustration of the substrate tray 40a, the substrate carry-out device 70g, the tray guide devices 62 and 62h, etc. (see FIG. 18 respectively) is omitted.

  In the eighth embodiment, before the substrate stage 20g reaches the substrate replacement position, the unloading operation of the substrate P (and the unillustrated substrate tray 40g) is performed by the unillustrated substrate unloading device 70g (see FIG. 18). Is started. As a result, the substrate P (and the substrate tray 40g (not shown)) protrudes from the + X side end of the substrate holder 30g, and the attached portion is a guide member 65h (not shown in FIG. 19) of the tray guide device 62h. Is supported from below in advance of the guide member 65 on the gantry 61.

In the eighth embodiment, the position of the substrate stage 20g can be controlled so that the center of the substrate P passes through the positions CP ₁ → CP ₂ → CP ₃ in FIG. That is, if it is assumed that the port portion 60h does not have the tray guide device 62h (not shown in FIG. 19, see FIG. 18), the substrate tray 40g (not shown in FIG. 19, see FIG. 18) when the substrate P is unloaded. Moves in parallel with the X-axis direction, so that the positions of the plurality of tray guide devices 62 (not shown in FIG. 19, not shown in FIG. 19) on the gantry 61 in the Y-axis direction and the substrate tray 40g (not shown in FIG. 19). 18), the Y position control of the substrate stage 20g must be performed so that the positions of the plurality of support members 41 in the Y-axis direction substantially coincide with each other. In this case, the center of the substrate P is the center of FIG. It is necessary to control the position of the substrate stage 20g so that it passes through the positions CP ₁ → CP ₂ → CP ₄ → CP ₃ in this order.

On the other hand, in the eighth embodiment, the vicinity of the + X side end of the substrate tray 40g (not shown in FIG. 19, refer to FIG. 18) is the guide member 65h (in FIG. 19) regardless of the Y position of the substrate stage 20g. (See FIG. 18), the substrate stage 20g is moved directly from the position (position CP ₂ ) when the exposure processing of the final shot area is completed to the substrate replacement position (position CP ₃ ). The substrate P can be carried out quickly. Note that the auxiliary tray guide device 62h and the method for carrying out the substrate P according to the eighth embodiment are also applicable to the first to seventh embodiments. However, when the amount of protrusion of the substrate P from the substrate holder is small (when the substrate guide does not contact the tray guide device 62 even at the substrate replacement position), the substrate stages 20a to 20f are not provided even if the auxiliary tray guide device 62h is not provided. May be moved directly from the position when the exposure processing of the final shot area is completed to the substrate replacement position.

  The configuration of the liquid crystal exposure apparatus is not limited to those described in the first to eighth embodiments, and can be changed as appropriate. For example, each of the guide members 35 and 65 of the tray guide devices 32 and 62 is configured to support the substrate trays 40a to 40g in a non-contact (floating) manner, but is not limited thereto, and is a rolling element such as a ball. May be used for contact support with low friction. In addition, each of the tray guide devices 32 and 62 may be configured to guide the substrate trays 40a to 40g straightly in the X-axis direction using the guide members 35 and 65.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In the above-described embodiment, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described. However, the number of projection optical units is not limited to this, and the number of projection optical units is one. That's all you need. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above-described embodiment, the case where the projection optical system PL has an equal magnification is described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In the above embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used. As disclosed in US Pat. No. 6,778,257, based on electronic data of a pattern to be exposed, an electronic mask (variable shaping mask) that forms a transmission pattern or a reflection pattern, or a light emission pattern, for example, You may use the variable shaping | molding mask using DMD (Digital Micro-mirror Device) which is 1 type of a non-light-emitting type image display element (it is also called a spatial light modulator).

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  The exposure apparatus can also be applied to a step-and-repeat type exposure apparatus and a step-and-stitch type exposure apparatus.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).

  The substrate (object) described in the first to eighth embodiments is not limited to the exposure apparatus, but may be applied to an object treatment apparatus that performs a predetermined process on an object, such as an object inspection apparatus used for inspection of a predetermined object. An exchange method may be applied.

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the object carrying-out method of the present invention is suitable for carrying out an object from the object holding device. Further, the object exchanging method of the present invention is suitable for exchanging an object held by the object holding device. The object holding device of the present invention is suitable for quickly carrying out an object. The exposure apparatus of the present invention is suitable for exposing an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for manufacturing micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20a ... Substrate stage, 30a ... Substrate holder, 31x ... X groove, 32 ... Tray guide apparatus, 40a ... Substrate tray, 41 ... Support member, 45a ... Projection, 50 ... Substrate carrying-in apparatus, 60a ... Port 70a ... substrate carry-out device, 71 ... X travel guide, 72a ... pressing member, P ... substrate, PST ... substrate stage device.

Claims (22)

Moving an object holding device that holds an object holding member that holds an object and an object support member that is used to transport the object toward an object unloading position where the object is unloaded from the object holding member;
Starting an unloading operation of unloading the object from the object holding member before the object holding device reaches the object unloading position.   2. The object carrying-out method according to claim 1, wherein by starting the carrying-out operation, the object supporting member that supports the object is moved with respect to the object holding member by using a carrying-out device included in the object holding device. . The object and the object support member are unloaded from the object holding device by being moved in the first direction at the object unloading position,
The method of carrying out an object according to claim 1 or 2, wherein the carry-out operation is performed in parallel with a movement of the object holding device in a second direction intersecting the first direction. The object support member is held by the object holding device apart from the object in a state where the object is held by the object holding member;
Starting the unloading operation includes driving the object support member with respect to the object on the object holding device to support the object, and supporting the object support member supporting the object together with the object. The object carrying-out method according to any one of claims 1 to 3, further comprising: moving the object holding member. The method for carrying out the object according to any one of claims 1 to 4,
Waiting another object supported by another object support member at a predetermined standby position before the object holding device reaches the object carry-out position;
Carrying out the object and the object support member supporting the object from the object holding device in a state where the object holding device is located at the object carrying-out position;
A method for exchanging an object on the object holding device, comprising: bringing the another object positioned at the standby position and the another object supporting member supporting the other object together onto the object holding device. In the unloading, the object and the object support member that supports the object are moved along a predetermined two-dimensional plane,
The object exchange method according to claim 5, wherein in the carrying-in, the another object and the another object support member that supports the other object are moved in a direction orthogonal to the predetermined two-dimensional plane. An object holding member for holding an object and an object support member used for conveying the object;
An object holding device comprising: at least a part of a carry-out device that carries out the object held by the object holding member and the object support member supporting the object from the object holding member. The object holding member is formed with a recess in which at least a part of the object support member is accommodated in an object holding surface portion on which the object is placed,
The object holding device according to claim 7, wherein the carry-out device is accommodated in the recess.   The object holding member has a first recess in which at least a part of the object support member is accommodated in an object holding surface portion on which the object is placed, and a second recess in which the carry-out device is accommodated. The object holding device according to claim 7.   The object holding device according to claim 7, wherein the carry-out device is disposed outside the object holding member. A guidance device for guiding the object holding member along a predetermined two-dimensional plane with a predetermined stroke;
The object holding device according to claim 10, wherein the carry-out device is provided in the guide device.   The object holding device according to claim 7, wherein a plurality of the carry-out devices are provided.   The said holding | maintenance apparatus is an object holding | maintenance apparatus as described in any one of Claims 7-12 which has a press member which carries out the said object from the said object support member by pressing the said object support member which supported the said object.   The pressing member is movable between a position where the object supporting member held by the object holding member can be pressed and a position where the pressing member is retracted from the object supporting member held by the object holding member. Item 14. The object holding device according to Item 13.   The said holding | maintenance apparatus has a rotary body which can contact | abut the said object support member, and moves the said object support member by rotating this rotary body, The object holding | maintenance as described in any one of Claims 7-12 apparatus. The part of the unloading device is a stator that constitutes a linear motor together with a mover provided on the object support member,
The object holding device according to claim 7, wherein the object support member is driven by the linear motor. The object holding member is provided movably between an object processing position where a predetermined process is performed on the object and an object unloading position where the object is unloaded,
The object according to any one of claims 7 to 16, wherein the unloading device starts an unloading operation for unloading the object from the object holding member before the object holding member reaches the object unloading position. Holding device. An object holding device according to claim 17,
An exposure apparatus comprising: a pattern forming apparatus that forms a predetermined pattern on the object using an energy beam.   The exposure apparatus according to claim 18, wherein the object is a substrate used in a flat panel display device.   The exposure apparatus according to claim 19, wherein the substrate has a length of at least one side of 500 mm or more. Exposing the object using the exposure apparatus according to claim 19 or 20,
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure apparatus of claim 18;
Developing the exposed object.

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