TWI495885B - Semiconductor test device - Google Patents

Description

Semiconductor test device

The present invention relates to a semiconductor test apparatus.

During the test of the semiconductor test device to be tested, the wafer to be tested needs to be connected to the IC test carrier, and the probe is generally used for contact, and the probe is directly mounted on the measurement function board. When the automatic test program is executed, the robot arm first loads the wafer to be tested on the IC test carrier. However, when the robot arm moves, it tends to generate minute vibrations, which will affect the contact state between the semiconductor test device and the IC test carrier. Not only that, but the actuators in the semiconductor test device (for example, the cooling fan) also have slight vibrations, which also affect the contact state of the two.

In addition, a typical semiconductor test device typically has two modes when combined with an IC test carrier: (1) direct connection; and (2) use of a cable mount. However, for the direct connection method, the disadvantage is that the vibration during the automatic test will affect the test stability. For the way of using the wire group connection, the disadvantage is that the installation of the IC test carrier board is time consuming, and the IC test carrier board needs to be moved to the wire group every time, so that the wire group is easily damaged.

Therefore, how to provide a semiconductor test device that can reduce the vibration generated during the automatic test and help to improve the stability during the test is one of the problems that the industry is currently eager to invest in research and development resources.

Accordingly, the present invention provides a semiconductor test apparatus to solve the above problems.

The present invention provides a semiconductor test apparatus for testing a wafer to be tested. The semiconductor testing device includes a casing, at least one measuring function board, a first substrate, at least one elastic supporting module, a second substrate, at least one probe module, at least one transmission line group, a test carrier, and a socket. The measurement function board is disposed in the casing. The first substrate is fixed to the outer wall of the casing. The elastic support module is disposed on the first substrate. The second substrate is connected to the elastic support module. The elastic support module is located between the first substrate and the second substrate. The probe module is disposed on the second substrate. The transmission line group is electrically connected to the measurement function board via the first substrate, and electrically connected to the probe module via the second substrate. The test carrier is electrically connected to the probe module. The probe module is located between the second substrate and the test carrier. The socket is disposed on the test carrier for electrically connecting the wafer to be tested.

1‧‧‧Semiconductor test set

10‧‧‧Chassis

136‧‧ ‧ spring

14‧‧‧second substrate

11‧‧‧Measurement function board

12‧‧‧First substrate

120‧‧‧First board

120a‧‧‧first pin

13‧‧‧Flexible support module

130‧‧‧Anti-vibration parts

132‧‧‧Fixed parts

132a‧‧‧容槽

132b‧‧‧through hole

134‧‧‧ positioning parts

134a‧‧‧Abutment

134b‧‧‧Cylinder

140‧‧‧second board

140a‧‧‧second pin

15‧‧‧ Probe Module

16‧‧‧Transmission line group

160‧‧‧Wire

160a‧‧‧Isolated metal layer

17‧‧‧Test carrier

18‧‧‧ socket

2‧‧‧Samps to be tested

3‧‧‧ Robotic arm

A‧‧‧ direction

FIG. 1 is a schematic view showing a semiconductor testing device according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view showing the elastic supporting module of Fig. 1.

FIG. 3 is a perspective assembled view of the elastic support module in FIG. 1 .

4 is a schematic view showing the first substrate, the second substrate, and the transmission line group in FIG. 1.

Please refer to FIG. 1 , which is a schematic diagram of a semiconductor testing device 1 according to an embodiment of the present invention. As shown in FIG. 1, in the present embodiment, the semiconductor testing device 1 is used to test the wafer 2 to be tested. The semiconductor test device 1 includes a casing 10, a plurality of measurement function boards 11, a first substrate 12, two elastic support modules 13, a second substrate 14, a plurality of probe modules 15, a plurality of transmission line groups 16, and a test load. The plate 17 and the socket 18, wherein the casing 10 is shown in cross section. The structure, function, and connection relationship between the above elements will be described in detail below.

As shown in FIG. 1, the measurement function boards 11 are disposed side by side in the casing 10. The first substrate 12 is fixed to the outer wall of the cabinet 10. The two elastic support modules 13 are disposed on the first substrate 12 and connected to the second substrate 14 . The two elastic support modules 13 are connected between the first substrate 12 and the second substrate 14 and are located on both sides of the first substrate 12 and the second substrate 14. The probe modules 15 are disposed on the second substrate 14 and respectively correspond to the measurement function boards 11 in the casing 10. Each of the transmission line groups 16 is electrically connected to the corresponding measurement function board 11 via the first substrate 12 and electrically connected to the corresponding probe module 15 via the second substrate 14 . The back surface of the test carrier 17 (i.e., the bottom surface of the test carrier 17 in FIG. 1) is electrically connected to the probe module 15. The probe module 15 is located between the second substrate 14 and the back surface of the test carrier 17 to support the test carrier 17. The socket 18 is disposed on the front side of the test carrier 17 (i.e., the top surface of the test carrier 17 in Fig. 1). When the automatic test program is executed, the robot arm 3 will grab the wafer 2 to be tested, and after moving to the fixed point alignment, the wafer 2 to be tested is loaded on the socket 18, so that the wafer 2 to be tested is electrically connected to the socket 18.

Further, when the to-be-tested chip 2 electrically contacts the socket 18, each measurement function board 11 sequentially passes through the first substrate 12, the corresponding transmission line group 16, the second substrate 14, and the corresponding probe module 15, The test carrier 17 and the socket 18 are electrically connected to the wafer 2 to be tested.

Based on the above configuration, the semiconductor testing device 1 of the present invention can absorb the vibration between the first substrate 12 and the second substrate 14 by the two elastic supporting modules 13. In other words, the minute vibration generated by the robot arm 3 during the loading of the wafer 2 to be tested on the test carrier 17 is not transmitted to the first substrate 12 by the second substrate 14, and the movement in the casing 10 is performed. A slight vibration generated by a member (not shown, for example, a heat radiating fan) is also not transmitted from the first substrate 12 to the second substrate 14. It can be seen that the two elastic supporting modules 13 of the semiconductor testing device 1 can be used as a soft joint component between the measuring function board 11 and the probe module 15, thereby achieving the effect of improving the stability during testing.

Please refer to Figure 2 and Figure 3. FIG. 2 is an exploded perspective view showing the elastic support module 13 in FIG. 1 . FIG. 3 is a perspective assembled view of the elastic support module 13 in FIG. 1 .

As shown in FIGS. 2 and 3, in the present embodiment, the elastic support module 13 includes an anti-vibration member 130, a fixing member 132 (shown in a perspective view in FIG. 2), a positioning member 134, and a spring 136. Elastic support module 13 The anti-vibration member 130 is connected to the first substrate 12. The fixing member 132 of the elastic supporting module 13 is connected to the anti-vibration member 130 and has a receiving groove 132a. The positioning member 134 of the elastic supporting module 13 is connected to the second substrate 14 and sleeved in the receiving groove 132a of the fixing member 132 to move relative to the fixing member 132 in the direction A. The spring 136 of the elastic support module 13 is received in the receiving groove 132a of the fixing member 132 and compressed between the fixing member 132 and the positioning member 134.

Further, the fixing member 132 of the elastic supporting module 13 has a through hole 132b. The through hole 132b of the fixing member 132 penetrates the bottom of the accommodating groove 132a. The positioning member 134 of the elastic support module 13 includes an abutting portion 134a and a cylinder 134b. The abutting portion 134a of the positioning member 134 is connected to the second substrate 14 and is limited by the receiving groove 132a of the fixing member 132. The post 134b of the positioning member 134 is coupled to the abutting portion 134a, passes through the through hole 132b of the fixing member 132, and is restricted by the through hole 132b. The spring 136 of the elastic support module 13 is sleeved outside the cylinder 134b of the positioning member 134 and compressed between the fixing member 132 and the abutting portion 134a of the positioning member 134.

Therefore, the semiconductor testing device 1 of the present invention can prevent the first substrate 12 and the second substrate 14 between the first substrate 12 and the second substrate 14 by the matching between the fixing member 132 and the positioning member 134 of the two elastic supporting modules 13 . Horizontal relative displacement (because the positioning member 134 can only move relative to the fixing member 132 along the direction A), and can absorb the first substrate 12 and the second substrate by the spring 136 compressed between the fixing member 132 and the positioning member 134. The function of vibration between 14 degrees.

In the present embodiment, for the convenience of manufacture, the fixing member 132 of the elastic supporting module 13 can be combined by two parts, as shown in FIG. 2, but The invention is not limited thereto. In another embodiment, the fixing member 132 of the elastic support module 13 is manufactured in an integrally formed manner.

Please refer to FIG. 4 , which is a schematic diagram showing the first substrate 12 , the second substrate 14 , and the transmission line group 16 in FIG. 1 . As shown in FIGS. 1 and 4, in the present embodiment, the first substrate 12 includes a plurality of first circuit boards 120. Each of the first circuit boards 120 is electrically connected to the corresponding measurement function board 11 and has a plurality of first pins 120a. The second substrate 14 includes a plurality of second circuit boards 140 corresponding to the first circuit boards 120 on the first substrate 12, respectively. Each of the second circuit boards 140 is electrically connected to the corresponding probe module 15 and has a plurality of second pins 140a. Each transmission line group 16 includes a plurality of wires 160. The two ends of each wire 160 are respectively soldered to the corresponding first pin 120a and the corresponding second pin 140a. Thereby, each transmission line group 16 can be electrically connected between the corresponding first circuit board 120 and the corresponding second circuit board 140.

During the semiconductor test, in order to make the test signal transmitted in the semiconductor test device 1 of the present invention have the characteristics of high frequency width and low noise, the selection and processing of the wire 160 in the transmission line group 16 must be paid special attention. In the present embodiment, each of the wires 160 in the transmission line group 16 is a coaxial cable, but the invention is not limited thereto. In another embodiment, each of the wires 160 in the transmission line set 16 is a triaxial cable.

Further, in the same transmission line group 16, each of the wires 160 includes an isolation metal layer 160a. A portion of the isolation metal layer 160a of each of the wires 160 on the first circuit board 120 is partially soldered to the first circuit board At 120, a portion of the isolation metal layer 160a on the second circuit board 140 is partially soldered to the second circuit board 140. Moreover, in the same transmission line group 16, the portions of the isolation metal layer 160a of all the wires 160 on the first circuit board 120 are soldered to each other, and the portions of the isolation metal layers 160a of all the wires 160 on the second circuit board 140 are mutually connected. welding. For the same transmission line group 16, since the isolation metal layer 160a of the plurality of wires 160 is soldered to the corresponding first circuit board 120 and the corresponding second circuit board 140, the transmission line group 16 can be reinforced on the first circuit board. Tensile strength between the second circuit boards 140.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the semiconductor testing device of the present invention connects the measuring function board and the probe module by the elastic supporting module and the transmission line group, and further Soft contact between the test function board and the probe module. Therefore, the semiconductor testing device of the present invention can reduce the vibration generated during the automatic test by the elastic supporting module and the transmission line group, thereby contributing to improving the stability during testing.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

1‧‧‧Semiconductor test set

10‧‧‧Chassis

11‧‧‧Measurement function board

12‧‧‧First substrate

120‧‧‧First board

13‧‧‧Flexible support module

14‧‧‧second substrate

140‧‧‧second board

15‧‧‧ Probe Module

16‧‧‧Transmission line group

160‧‧‧Wire

17‧‧‧Test carrier

18‧‧‧ socket

2‧‧‧Samps to be tested

3‧‧‧ Robotic arm

Claims (8)

A semiconductor testing device for testing a wafer to be tested, the semiconductor testing device comprising: a casing; at least one measuring function plate disposed in the casing; and a first substrate fixed to the outer wall of the casing At least one elastic support module is disposed on the first substrate; a second substrate is connected to the elastic support module, wherein the elastic support module is located between the first substrate and the second substrate; a needle module is disposed on the second substrate; at least one transmission line group is electrically connected to the measurement function board via the first substrate, and electrically connected to the probe module via the second substrate; The carrier module is electrically connected to the probe module, wherein the probe module is located between the second substrate and the test carrier; and a socket is disposed on the test carrier for electrically connecting the probe Test the wafer. The semiconductor test device of claim 1, wherein the measuring function board sequentially passes the first substrate, the transmission line group, the second substrate, and the same when the chip to be tested electrically contacts the socket The probe module, the test carrier and the socket are electrically connected to the wafer to be tested, and the elastic support module absorbs vibration between the first substrate and the second substrate. A semiconductor test device as claimed in claim 1, wherein The elastic support module comprises: an anti-vibration member connected to the first substrate; a fixing member connecting the anti-vibration member and having a receiving groove; a positioning member connecting the second substrate and sleeved in the capacity And a spring is received in the receiving groove and compressed between the fixing member and the positioning member. The semiconductor test device of claim 3, wherein the fixing member has a through hole penetrating through the bottom of the receiving groove, the positioning member comprises an abutting portion and a column, the abutting portion Connecting the second substrate and being constrained by the accommodating groove, the column is connected to the abutting portion, passes through the through hole, and is restricted by the through hole, the spring is sleeved outside the column and compressed The fixing member is between the abutting portion. The semiconductor test device of claim 1, wherein the first substrate comprises at least one first circuit board, the first circuit board is electrically connected to the measuring function board, and has a plurality of first pins, The second substrate comprises at least one second circuit board electrically connected to the probe module and having a plurality of second pins, the transmission line group comprising a plurality of wires, two of each of the wires The ends are respectively soldered to the corresponding first pin and the corresponding second pin. The semiconductor test device of claim 5, wherein each of the wires is a coaxial cable. The semiconductor test device of claim 6, wherein each of the wires comprises an isolation metal layer, and a portion of the isolation metal layer on the first circuit board is partially soldered to the first circuit board. And the portion of the isolation metal layer on the second circuit board is partially soldered to the second circuit board. The semiconductor test device of claim 7, wherein the portions of the wires of the plurality of isolation metal layers on the first circuit board are soldered to each other, and the plurality of isolation metal layers of the wires are located at the first The parts on the two boards are soldered to each other.