CN109270311B - Through silicon via channel testing device - Google Patents

Abstract

The invention is applicable to the technical field of microsystem testing, and provides a through silicon via channel testing device which comprises a mounting seat and at least one group of probe assemblies used for testing a through silicon via channel and supporting a through silicon via adapter plate, wherein each probe assembly comprises a first spring testing probe and a second spring testing probe, each mounting seat comprises a first support part and a second support part, each first spring testing probe is arranged on each first support part, and each second spring testing probe is arranged on each second support part. According to the through silicon via channel testing device, the first spring testing probe and the second spring testing probe which can simultaneously test the two ends of the through silicon via channel are arranged, so that the defects that a conventional probe station testing method is high in threshold and not directly faces the through silicon via channel are overcome, compared with the conventional testing method, the operation steps are reduced, the operation is simple and convenient, the through silicon via channel testing device is simple in structure, low in manufacturing cost and easy to popularize.

Description

Through silicon via channel testing device

Technical Field

The invention belongs to the technical field of microsystem testing, and particularly relates to a through silicon via channel testing device.

Background

Referring to fig. 1, through silicon vias (TSV, through Silicon Via) are a key electrical unit vertically interconnected in a 2.5D/3D package structure with a through silicon via interposer as a carrier, and are also a core component in the third generation microsystem packaging technology. The through silicon via adapter plate is of a rectangular or regular polygonal plate body (sheet body) structure.

Microsystem packages based on TSV interconnect technology enable chips to be stacked with a greater number of layers in the vertical direction than the first two generations of packages. Because the TSV technology reduces the area occupied by the gold wires and the bonding pads in a large area, the ratio of the chip area to the packaging area is close to the limit. In addition, the TSV technology has better compatibility with the CMOS technology; TSVs have higher interconnect speeds and lower parasitic power consumption; since the TSV technology significantly reduces the connection length, the operation speed is significantly improved.

The accurate test of the through silicon via channel, namely the extraction of relevant parameters of the through silicon via channel, is an important method for researching TSV technology and an important foundation for simulation analysis and verification, and the main detection device comprises a vector network analyzer and a test platform. Due to the complexity of TSV technology, the testing platform of through-silicon vias is a current technical challenge. At present, a probe station is mainly used as a test platform of a through silicon via channel.

However, the probe station is costly, and thus, there are few scientific research units having the probe station. In addition, since most Probe stations have a single-sided Probe (Probe) structure, only one end section of the through-silicon via channel can be tested at a time, in order to test the through-silicon via channel smoothly, the Probe station test must also be performed by other methods or means: firstly, referring to fig. 2, a de-embedding measurement method is adopted, that is, the test end surfaces are unified to a plane through two TSV channels, the overall parameters are obtained through testing, and then the parameters of the through-silicon-via channels are solved through de-embedding, so that the testing operation steps are more and very complicated; secondly, referring to fig. 3, the TSV test module with a single design is used to assist the probe station in testing, and the TSV test module needs to be designed separately, which indirectly increases the testing cost.

Disclosure of Invention

The invention aims to provide a through silicon via channel testing device, which aims to solve the technical problems of high manufacturing cost and complicated testing operation steps of a testing platform in the process of testing a through silicon via channel in the prior art.

In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a through-silicon via channel testing arrangement, includes mount pad and at least one set of probe subassembly that is used for testing the through-silicon via channel and is used for playing the supporting role to the through-silicon via keysets, probe subassembly include first spring test probe and with the second spring test probe of first spring test probe cooperation test, first spring test probe with the structure of second spring test probe is the same, the mount pad includes first supporting seat portion and is located the second supporting seat portion of first supporting seat portion one side, first spring test probe set up in on the first supporting seat portion, second spring test probe set up in on the second supporting seat portion, first spring test probe with form the space of placing that is used for placing the through-silicon via board between the second spring test probe.

Further, the first stand portion or the second stand portion is further provided with a plurality of balanced elastic probes for enabling the through-silicon-via adapter plate to be in a parallel state relative to the mounting surface of the first spring test probe, the height of each balanced elastic probe is larger than that of the first spring test probe or the second spring test probe, and the elastic acting force of each balanced elastic probe on the through-silicon-via adapter plate is larger than that of each first spring test probe or each second spring test probe on the through-silicon-via adapter plate.

Further, the through silicon via channel testing device further comprises a positioning assembly arranged on the mounting seat, and the positioning assembly comprises a positioning structure for positioning the through silicon via adapter plate to a preset position on the second support seat or the first support seat.

Further, the second support portion is located below the first support portion, the positioning structure is arranged on the second support portion, and the positioning structure comprises a first positioning surface and a second positioning surface which are respectively in butt joint with two adjacent side walls of the through silicon via adapter plate.

Further, the positioning assembly further comprises a clamping mechanism for applying a force to the through-silicon-via adapter plate and enabling two adjacent side walls of the through-silicon-via adapter plate to be respectively kept in abutting contact with the first positioning surface and the second positioning surface.

Further, the clamping mechanism comprises a reset elastic piece and a clamping piece, wherein the clamping piece is used for applying acting force to the through-silicon-via adapter plate and is in sliding connection with the second support seat part, one end of the reset elastic piece is connected with the clamping piece, the other end of the reset elastic piece is connected with the second support seat part, and the clamping mechanism forms positioning clamping force to the through-silicon-via adapter plate through the action of the clamping piece and the reset elastic piece.

Further, the first stand portion and the second stand portion are two separate components, and the through-silicon via channel test device further includes a stand positioning mechanism for positioning the first stand portion to a preset position of the second stand portion.

Further, the support positioning mechanism comprises a positioning plug post arranged on the first support seat part or the second support seat part and a positioning hole arranged on the second support seat part or the first support seat part and in plug-in fit with the positioning plug post.

Further, the through silicon via channel test device further comprises an articulating assembly for articulating the first stand portion and the second stand portion.

Further, the through silicon via channel test device further comprises a first test assembly mounted on the first support part and a second test assembly mounted on the second support part, wherein the first test assembly comprises a first printed circuit board and a first connector, and the first printed circuit board is electrically connected with the first connector and the first spring test probe respectively; the second testing assembly comprises a second printed circuit board and a second connector, and the second printed circuit board is respectively and electrically connected with the second connector and the second spring testing probe.

According to the through silicon via channel testing device, the first spring testing probe and the second spring testing probe which can simultaneously test the two ends of the through silicon via channel are respectively arranged on the mounting seat, so that the through silicon via channel is directly tested by the device under the condition that a de-embedding measurement method is not additionally used or a TSV testing module is used, the defects that a conventional probe station testing method has a high threshold and is not directly oriented to the through silicon via channel are overcome, compared with the conventional probe station testing method, the operation steps are reduced, the operation is simple and convenient, and the through silicon via channel testing device is simpler in structure, lower in manufacturing cost and easy to popularize compared with the conventional probe station. Meanwhile, when the through silicon via channel is tested, the through silicon via adapter plate is clamped between the first spring test probe and the second spring test probe elastically, so that the through silicon via adapter plate is prevented from being attached to the mounting seat in a hard contact manner, and the problem of breakage is effectively avoided when the through silicon via adapter plate is tested.

Drawings

FIG. 1 is a schematic diagram of a through-silicon via channel application;

FIG. 2 is a schematic diagram of a through-silicon via channel being tested using a probe station;

FIG. 3 is a schematic diagram of a through silicon via channel being tested using a TSV test module;

fig. 4 is a schematic diagram of a through-silicon via channel testing apparatus according to an embodiment of the present invention after a first stand portion and a second stand portion are separated;

FIG. 5 is a schematic diagram of a through-silicon via channel test apparatus according to an embodiment of the present invention;

FIG. 6 is a schematic view of the first stand portion of FIG. 4;

FIG. 7 is one of the second mount section views of FIG. 4 (including a through-silicon via interposer);

FIG. 8 is a second schematic view of the second stand portion of FIG. 4;

FIG. 9 is a schematic view of the positioning assembly of FIG. 8;

FIG. 10 is a schematic diagram of a through-silicon via channel test apparatus according to an embodiment of the present invention;

FIG. 11 is a schematic view of the first spring test probe of FIG. 6.

In the figure: 1-a mounting base; 101-a first stand part; 102-a second mount part; 103-fixing piece; 2-a first spring test probe; 201-tip plunger; 202-a spring; 203-a cylinder; 204-bottom end plunger; 3-a second spring test probe; 4-balancing an elastic probe; 5-positioning structure; 501-positioning piece; 5011—a first positioning surface; 5012-a second positioning surface; 6-a clamping mechanism; 601-clamping piece; 6011-V-shaped groove; 602-resetting the elastic member; 7-positioning the inserted column; 8-positioning holes; 9-a movable connection assembly; 10-a first printed circuit board; 11-a first connector; 12-a second printed circuit board; 13-a second connector; 14-mounting a substrate; 15-through silicon via interposer; 1501-through silicon via channels; 16-top layer device; 17-underlying device.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

It should be noted that, unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. Furthermore, the meaning of "a plurality of", "a number" is two or more, unless explicitly defined otherwise.

Referring to fig. 4 to 8, 10 and 11, an embodiment of the through-silicon via channel test apparatus provided by the present invention will now be described. The through silicon via channel testing device comprises a mounting seat 1 and at least one group of probe assemblies. Each probe assembly includes a first spring test probe 2 and a second spring test probe 3 that cooperates with the first spring test probe 2 for testing through-silicon via channels 1501.

The mounting base 1 includes a first mount part 101 and a second mount part 102 located on one side of the first mount part 101, the first spring test probe 2 is provided on the first mount part 101, and the second spring test probe 3 is provided on the second mount part 102. It should be understood here that the mounting base 1 comprises a first mount part 101 and a second mount part 102, which does not necessarily mean that the first mount part 101 and the second mount part 102 are two parts, but that the first mount part 101 and the second mount part 102 may also be two artificially separate defined parts in the same part.

The first spring test probe 2 and the second spring test probe 3 are identical in structure, and the first spring test probe 2 and the second spring test probe 3 are existing spring test probes. The first spring test probe 2 comprises a top plunger 201, a bottom plunger 204 and a cylinder 203 which are electrically connected with the top plunger 201, wherein the top plunger 201 and the bottom plunger 204 are arranged in the cylinder 203, a spring 202 is arranged between the top plunger 201 and the bottom plunger 204, and thus the bottom plunger 204 can elastically move relative to the top plunger 201 and the cylinder 203, namely, the bottom plunger 204 of the first spring test probe 2 can elastically move relative to the first support part 101, and the bottom plunger 204 of the second spring test probe 3 can elastically move relative to the second support part 102. Alternatively, both the first spring test probe 2 and the second spring test probe 3 may select existing spring test probes of a parameter specification in which the test force is very small (the vision force is less than or equal to 30 g).

Meanwhile, the first spring test probe 2 and the second spring test probe 3 are oppositely arranged, a placing space for placing the through-silicon-via adapter plate 15 is formed between the first spring test probe 2 and the second spring test probe 3, the first spring test probe 2 and the second spring test probe 3 are elastically clamped on two sides (namely, two sections) of the through-silicon-via channel 1501, and namely, the probe assembly can also support the through-silicon-via adapter plate 15. The first spring test probe 2 and the second spring test probe 3 are respectively and electrically connected with an external vector network analyzer or an external digital multimeter analyzer, and the analyzer transmits test signals to the through silicon via channel 1501 for testing through the first spring test probe 2 and the second spring test probe 3.

Thus, when the through-silicon via channel testing device provided by the embodiment of the invention is used for testing the through-silicon via channel 1501 of the through-silicon via adapter plate 15, the through-silicon via adapter plate 15 is located in the placing space between the first spring test probe 2 and the second spring test probe 3, and the through-silicon via adapter plate 15 (the through-silicon via channel 1501) is elastically supported by the first spring test probe 2 and the second spring test probe 3, so that the through-silicon via adapter plate 15 is attached to the first support portion 101 or the second support portion 102 without hard contact.

According to the through silicon via channel testing device provided by the embodiment of the invention, the first spring testing probe and the second spring testing probe which can simultaneously test the two ends of the through silicon via channel are respectively arranged on the mounting seat, so that the through silicon via channel is directly tested by the device under the condition of not additionally using a de-embedding measurement method or by means of a TSV testing module, the defects of high threshold of a conventional probe station testing method, indirect through silicon via channel orientation and the like are overcome, compared with the existing probe station testing method, the operation steps are reduced, the operation is simple and convenient, and the through silicon via channel testing device provided by the embodiment of the invention has the advantages of simple structure, low manufacturing cost and easiness in popularization compared with the existing probe station. Meanwhile, when the through silicon via channel is tested, the through silicon via adapter plate is clamped between the first spring test probe and the second spring test probe elastically, so that the through silicon via adapter plate is prevented from being attached to the mounting seat in a hard contact manner, and the problem of breakage is effectively avoided when the through silicon via adapter plate is tested.

Referring to fig. 6 and 10, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, a plurality of balanced elastic probes 4 for keeping the through-silicon via interposer 15 parallel with respect to the mounting surface of the first spring test probe 2 are further disposed on the mounting base 1. The balance spring probe 4 may be installed on the first stand part 101 or on the second stand part 102.

Since the through-silicon via channel 1501 requires that the first spring test probes 2 and the second spring test probes 3 on both sides are simultaneously contacted to complete the test, when the surface of the through-silicon via interposer 15 to be tested is uneven or the mounting heights of the first spring test probes 2 (or the second spring test probes 3) are inconsistent, the through-silicon via channel interposer 15 may turn over to cause test failure. In this regard, the through silicon via channel test device provided by the embodiment of the invention is additionally provided with at least two balanced elastic probes 4. It should be understood here that the mounting surface of the first spring test probe 2 and the mounting surface of the second spring test probe 3 are necessarily arranged in parallel, when the through-silicon via interposer 15 is parallel with respect to the mounting surface of the first spring test probe 2, the through-silicon via interposer 15 is parallel with respect to the mounting surface of the second spring test probe 3.

The height of the balance spring probe 4 (the length extending out of the first support part 101 or the second support part 102) is larger than the height of the first spring test probe 2 (the length extending out of the first support part 101) or the height of the second spring test probe 3 (the length extending out of the second support part 102), and the acting force of the balance spring probe 4 on the through-silicon via interposer 15 is larger than the acting force of the first spring test probe 2 or the second spring test probe 3 on the through-silicon via interposer 15. If the through-silicon via adapter 15 is turned slightly, the through-silicon via adapter 15 is subjected to the force exerted by the plurality of balanced elastic probes 4, so that under the combined action of the balanced elastic probes 4, the first spring test probes 2 and the second spring test probes 3, the through-silicon via adapter 15 cannot deflect relative to the mounting surface of the first spring test probes 2, and both sides of the through-silicon via channel 1501 can be simultaneously contacted with the first spring test probes 2 and the second spring test probes 3.

As a specific embodiment of the through-silicon via channel test apparatus provided by the present invention, the structure of the balanced spring probe 4 is the same as the structures of the first spring test probe 2 and the second spring test probe 3. Optionally, the spring elastic modulus of the balanced spring probe 4 is greater than the spring elastic moduli of the first spring test probe 2 and the second spring test probe 3.

Referring to fig. 7 to fig. 9, as a specific implementation manner of the through-silicon via channel testing apparatus provided by the embodiment of the present invention, the through-silicon via channel testing apparatus further includes a positioning assembly disposed on the mounting base 1, where the positioning assembly includes a positioning structure 5 for positioning the through-silicon via interposer 15 to a preset position on the second stand portion 102 or the first stand portion 101. The positioning structure 5 may be disposed on the first stand portion 101 or the second stand portion 102, which may be a conventional positioning structure such as a clamping groove, a positioning column, or the like that can be clamped and positioned with the through-silicon via interposer 15. Through setting up location structure 5, can be with the accurate location to corresponding probe subassembly department of through-silicon via passageway 1501 on the through-silicon via keysets 15, avoid artifical loaded down with trivial details location operation.

Referring to fig. 4 to 8 and fig. 10, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, a first stand portion 101 is located above a second stand portion 102, a balance spring probe 4, a first spring test probe 2 and a second spring test probe 3 are arranged up and down, and under the combined action of the balance spring probe 4, the first spring test probe 2 and the second spring test probe 3, a through-silicon via interposer 15 is kept horizontally arranged.

Referring to fig. 7 to fig. 9, as a specific embodiment of the through-silicon via channel testing device provided by the present invention, the positioning structure 5 is disposed on the second stand portion 102, and the positioning structure 5 includes a first positioning surface 5011 and a second positioning surface 5012 respectively abutting and positioning two adjacent sidewalls of the through-silicon via interposer 15 respectively. When testing the through-silicon via channel 1501, the through-silicon via interposer 15 is first positioned to a predetermined location of the second mount section 102. Because one side of the through silicon via adapter plate 15 is abutted against the second spring test probe 3 by gravity, two adjacent side walls of the through silicon via adapter plate 15 with a polygonal structure are abutted and positioned.

Alternatively, the first positioning surface 5011 and the second positioning surface 5012 may be two positioning surfaces provided on the structure of the second stand portion 102, or may be two positioning surfaces of two different positioning blocks. Alternatively, the first positioning surface 5011 and the second positioning surface 5012 may also be two positioning surfaces provided on the positioning member 501, and the positioning member 501 is mounted on the second mount portion 102, which is a positioning member specifically for positioning the through silicon via interposer 15.

Referring to fig. 7 to fig. 9, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, the positioning member 501 is provided with a slot adapted to the shape of the through-silicon via interposer 15, and the first positioning surface 5011 and the second positioning surface 5012 are two adjacent vertical surfaces of the slot, respectively. Optionally, the dimension of the slot in both the lateral and longitudinal dimensions is slightly greater than the external dimension of the through-silicon via interposer 15 by 0.2mm.

Referring to fig. 6, 8 and 10, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, the balanced elastic probe 4 is disposed on the first stand portion 101.

Referring to fig. 6, 8 and 10, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, four groups of probe assemblies are provided, four first spring test probes 2 are disposed on the first stand portion 101, and four second spring test probes 3 are disposed on the second stand portion 102 correspondingly. The first spring test probes 2 are arranged in a matrix, and four first spring test probes 2 are respectively arranged at four vertexes of the first rectangle.

Referring to fig. 6, 8 and 10, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, there are eight balanced elastic probes 4, eight balanced elastic probes 4 are disposed at the periphery of the first spring testing probe 2, and in order to ensure that the eight balanced elastic probes 4 can apply a balanced force to the through-silicon via interposer 15, the eight balanced elastic probes 4 are also evenly distributed on the second rectangle, three balanced elastic probes 4 are disposed on each second rectangle edge, and at the same time, the second rectangle on which the eight balanced elastic probes 4 are distributed coincides with the center of the first rectangle on which the four first spring testing probes 2 are distributed.

Referring to fig. 7 to fig. 9, as a specific embodiment of the through-silicon via channel testing device provided by the present invention, the positioning assembly further includes a clamping mechanism 6, and the clamping mechanism 6 keeps applying a force to the through-silicon via interposer 15, so that two adjacent sidewalls of the through-silicon via interposer 15 respectively keep abutting with the first positioning surface 5011 and the second positioning surface 5012, and thus, during the subsequent detection, the through-silicon via interposer 15 will remain stationary relative to the second stand portion 102 and will not move back and forth, thereby providing a guarantee for the subsequent reliable detection.

Referring to fig. 7 to fig. 9, as a specific embodiment of the through-silicon via channel testing device provided by the present invention, the clamping mechanism 6 includes a clamping member 601 slidably connected to the second stand portion 102 and a reset elastic member 602, one end of the reset elastic member 602 is connected to the clamping member 601, the other end of the reset elastic member 601 is connected to the second stand portion 102, and the clamping mechanism 6 forms a positioning clamping force on the through-silicon via adapter plate 15 through the actions of the clamping member 601 and the reset elastic member 602. When the through silicon via adapter plate 15 is positioned on the second support part 102, an operator firstly dials the clamping piece 601 to enable the clamping piece 601 to be far away from the first positioning surface 5011 and the second positioning surface 5012, then places the through silicon via adapter plate 15 on the second spring test probe 3, at this time, the through silicon via adapter plate 15 is positioned near the first positioning surface 5011 and the second positioning surface 5012, the operator loosens the clamping piece 601, the clamping piece 601 moves towards the positioning structure 5 under the action of the reset elastic piece 602, and the clamping piece 601 pushes the through silicon via adapter plate 15 to move towards the first positioning surface 5011 and the second positioning surface 5012, and finally two adjacent side edges of the through silicon via adapter plate 15 are respectively abutted to the first positioning surface 5011 and the second positioning surface 5012 and positioned.

Referring to fig. 9, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, a clamping member 601 is provided with a V-shaped groove 6011 for abutting and matching with the through-silicon via interposer 15. Because the through-silicon via interposer 15 is a regular polygonal plate body structure (generally a rectangular plate body), the V-shaped groove 6011 can better abut against the through-silicon via interposer 15 and push the through-silicon via interposer 15 to move.

As a specific embodiment of the through-silicon via channel testing device provided by the invention, the second support part 102 is further provided with a guide rail, the clamping piece 601 is provided with a guide rail hole in sliding fit with the guide rail, and the clamping piece 601 can more accurately push the two side walls of the through-silicon via adapter plate 15 to be abutted with the first positioning surface 5011 and the second positioning surface 5012 along a preset set direction through the cooperation of the guide rail and the guide rail hole.

Referring to fig. 4 to 8, as a specific embodiment of the through-silicon via channel test apparatus provided by the present invention, the first stand portion 101 and the second stand portion 102 are two independent separate components, and the through-silicon via channel test apparatus provided by the embodiment of the present invention further includes a stand positioning mechanism for positioning the first stand portion 101 to a preset position of the second stand portion 102. After the through-silicon via interposer 15 is positioned at the preset position on the second mount section 102, the through-silicon via channel 1501 on the through-silicon via interposer 15 is also abutted against the second spring test probe 3, and at this time, the first spring test probe 2 on the first mount section 101 needs to be positioned and abutted against the through-silicon via channel 1501 by rapidly positioning the first mount section 101.

Referring to fig. 6 to 8, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, the support positioning mechanism includes a positioning post 7 disposed on the first support portion 101 or the second support portion 102, and a positioning hole 8 disposed on the second support portion 102 or the first support portion 101 and in plug-in fit with the positioning post 7. The first stand part 101 can be quickly positioned to a preset position on the second stand part 102 through the plug-in fit of the positioning plug 7 and the positioning hole 8.

Alternatively, the positioning plunger 7 is provided on the first mount part 101, and the positioning hole 8 is provided on the second mount part 8.

Referring to fig. 4 and fig. 5, as a specific implementation manner of the through-silicon via channel testing apparatus provided by the present invention, the through-silicon via channel testing apparatus provided by the embodiment of the present invention further includes an movable connection assembly 9 for movably connecting the first stand portion 101 and the second stand portion 102. Thus, the first mount part 101 and the second mount part 102 which are positioned can be fixed, a stable environment is provided for testing the through silicon via channel 1501, and the first mount part 101 is prevented from moving relative to the second mount part 102 to influence the test result.

Referring to fig. 4 and 5, as a specific embodiment of the through-silicon via channel test apparatus provided by the present invention, the movable connection assembly 9 includes a bolt and a threaded hole provided on the second stand portion 102, and the bolt passes through the first stand portion 101 and then is screwed with the threaded hole so as to fix the first stand portion 101 and the second stand portion 102.

Referring to fig. 6 to 8, as a specific implementation manner of the through-silicon via channel test device provided by the embodiment of the invention, the through-silicon via channel test device further includes a first test component mounted on the first stand portion 101 and a second test component mounted on the second stand portion 102, wherein the first test component includes a first Printed Circuit Board (PCB) 10 and a first connector 11, the first printed circuit board 10 is electrically connected with the first connector 11 and the first spring test probe 2, respectively, the second test component includes a second Printed Circuit Board (PCB) 12 and a second connector 13, and the second printed circuit board 12 is electrically connected with the second connector 13 and the second spring test probe 3, respectively. The first connector 11 is mounted on both sides of the first stand part 101, and the second connector 13 is mounted on both sides of the second stand part 102.

By arranging the first test component and the second test component, an external detector (such as a vector network analyzer or a digital multimeter and the like) can be more conveniently connected with the through silicon via channel test device provided by the embodiment of the invention.

Referring to fig. 6 to 8, as a specific embodiment of the through-silicon via channel test apparatus provided by the present invention, a first printed circuit board 10 is disposed on a surface of a first stand portion 101, and a second printed circuit board 12 is disposed on a surface of a second stand portion 102.

Referring to fig. 6 to 8, as a specific embodiment of the through-silicon via channel test apparatus provided by the present invention, the first spring test probe 2, the balanced spring probe 4 and the positioning plunger 7 are disposed on the first stand portion 101 through a mounting substrate 14, the first spring test probe 2, the balanced spring probe 4 and the positioning plunger 7 are mounted on the mounting substrate 14, and the mounting substrate 14 is disposed on the first stand portion 101. The second spring test probes 3 and the positioning holes 8 are provided on the second mount section 102 through another mounting substrate 14, the second spring test probes 3 and the positioning holes 8 are mounted on the mounting substrate 14, and the mounting substrate 14 is provided on the first mount section 101.

As a specific implementation manner of the through silicon via channel testing device provided by the invention, the first connector 11 and the second connector 13 are all SMA connectors.

Referring to fig. 4 to 5, as a specific embodiment of the through-silicon via channel test device provided by the present invention, the second connector 13 is disposed on the front and rear sides of the mounting base 1, and the first connector 11 is disposed on the left and right sides of the mounting base 1, which can avoid confusion between the wires connected to the second connector 13 and the wires connected to the first connector 11.

Referring to fig. 4 to 5, as a specific embodiment of the through-silicon via channel testing apparatus provided by the present invention, the mounting base 1 further includes a fixing member 103, the second stand portion 102 is fixed on the fixing member 103, and the threaded hole of the movable connecting component 9 is disposed on the fixing member 103.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (3)

1. The through silicon via channel testing device is characterized by comprising a mounting seat and at least one group of probe assemblies used for testing a through silicon via channel and supporting a through silicon via adapter plate, wherein each probe assembly comprises a first spring testing probe and a second spring testing probe matched with the first spring testing probe for testing, the first spring testing probe and the second spring testing probe have the same structure, each mounting seat comprises a first support seat part and a second support seat part positioned at one side of the first support seat part, each first spring testing probe is arranged on the corresponding first support seat part, each second spring testing probe is arranged on the corresponding second support seat part, and a placing space used for placing the through silicon via adapter plate is formed between each first spring testing probe and each second spring testing probe;

the first support part or the second support part is also provided with a plurality of balance elastic probes for enabling the through silicon via adapter plate to keep parallel state relative to the mounting surface of the first spring test probe, the height of each balance elastic probe is larger than that of the first spring test probe or the second spring test probe, and the elastic acting force of each balance elastic probe on the through silicon via adapter plate is larger than that of each first spring test probe or each second spring test probe on the through silicon via adapter plate;

the through silicon via channel testing device further comprises a positioning assembly arranged on the mounting seat, wherein the positioning assembly comprises a positioning structure for positioning the through silicon via adapter plate to a preset position on the second support seat part or the first support seat part;

the second support part is positioned below the first support part, the positioning structure is arranged on the second support part, and the positioning structure comprises a first positioning surface and a second positioning surface which are respectively in butt joint and positioning with two adjacent side walls of the through silicon via adapter plate;

the positioning assembly further comprises a clamping mechanism which is used for applying acting force to the through silicon via adapter plate and enabling two adjacent side walls of the through silicon via adapter plate to be respectively kept in abutting connection with the first positioning surface and the second positioning surface;

the clamping mechanism comprises a reset elastic piece and a clamping piece, wherein the clamping piece is used for applying acting force to the through silicon via adapter plate and is in sliding connection with the second support seat part, one end of the reset elastic piece is connected with the clamping piece, the other end of the reset elastic piece is connected with the second support seat part, and the clamping mechanism forms positioning clamping force on the through silicon via adapter plate through the action of the clamping piece and the reset elastic piece;

the first support seat part and the second support seat part are two separated parts, and the through silicon via channel testing device further comprises a support seat positioning mechanism for positioning the first support seat part to a preset position of the second support seat part;

the through silicon via channel testing device further comprises a first testing component and a second testing component, wherein the first testing component is installed on the first support part and the second testing component is installed on the second support part, the first testing component comprises a first printed circuit board and a first connector, and the first printed circuit board is electrically connected with the first connector and the first spring testing probe respectively; the second testing assembly comprises a second printed circuit board and a second connector, and the second printed circuit board is respectively and electrically connected with the second connector and the second spring testing probe.

2. The through-silicon via channel test apparatus of claim 1, wherein the support positioning mechanism comprises a positioning plug provided on the first support portion or the second support portion and a positioning hole provided on the second support portion or the first support portion and in plug-in engagement with the positioning plug.

3. The through-silicon via channel test apparatus of claim 1, further comprising an articulation component for articulating the first mount section and the second mount section.