201221963 , t w uyjur/Λ 1 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種檢測針腳及應用其之檢測裝 置，且特別是有關於一種具可撓性之檢測針腳及應用其之 檢測裝置。 【先前技術】 當半導體封裝件產出後，都會進行訊號檢測，以淘汰 •不良的半導體封裝件。目前的檢測裝置有懸臂式探針型 (Cantilever type)及垂直式探針型（Verticaltype)。 懸臂式探針型包括多根檢測針腳及電路板。檢測針腳 之-端用以接觸半導體封裝件，其另一端延伸至電性接觸 於電路板，整根檢測針腳位於電路板之同一側◊懸臂式探 針型之多根檢測針腳僅能排列成線形（例如是四邊形）， 無法排列成陣列形，因此只能檢測半導體封裝件周圍的電 性接點。 _ 垂直式探針型包括多根檢測針腳、電路板及轉接板。 2根檢測針腳係位於電路板之同一侧，並透過轉接板電性 連接於電路板。垂直式探針型之檢測針腳排列成陣列形， 雖此，然其檢測針腳中相鄰二者的間距（pitch)太大，無 法符合具微小間距（15〇微米以下）之半導體封裝件的檢測 需求。 【發明内容】 本發明係有關於一種檢測針腳及應用其之檢測裝 1 „ 201221963201221963, tw uyjur/Λ 1 VI. Description of the Invention: [Technical Field] The present invention relates to a detecting pin and a detecting device using the same, and in particular to a flexible detecting pin and applying the same Detection device. [Prior Art] When the semiconductor package is produced, signal detection is performed to eliminate the defective semiconductor package. Current detection devices include a Cantilever type and a Vertical type. The cantilever probe type includes a plurality of detection pins and a circuit board. The end of the detecting pin is for contacting the semiconductor package, the other end of the detecting pin is electrically connected to the circuit board, and the whole detecting pin is located on the same side of the circuit board. The plurality of detecting pins of the cantilever type can only be arranged in a line shape. (for example, quadrilateral), they cannot be arranged in an array, so only electrical contacts around the semiconductor package can be detected. _ Vertical probe type includes multiple detection pins, circuit board and adapter board. The two test pins are located on the same side of the board and are electrically connected to the board through the interposer board. The vertical probe type detection pins are arranged in an array shape. However, the pitch of adjacent ones in the detection pins is too large to meet the detection of semiconductor packages having a small pitch (15 μm or less). demand. SUMMARY OF THE INVENTION The present invention relates to a detecting pin and a detecting device using the same 1 „ 201221963
IW69J0PA 置，檢測裝置具有複數根檢測針腳，該些檢測針腳可排列 成陣列形且二相鄰之檢測針腳的間距甚小，可檢測電性接 點呈陣列形且具微小間距之半導體封裝件。 根據本發明之第一方面，提出一種檢測針腳。檢測針 腳用以檢測一半導體元件，半導體元件具有數個電性接 點。檢測針腳包括一第一部分、一第二部分及一第三部 分。第三部分用以接觸該些電性接點之一者。其中，第二 部分連接第-部分與第三部分、第二部分之截面積係往^ 二部分的方向漸縮且第二部分與第三部分間夾一第一夾 角’第一夹角介於155度至185度之間。 根據本發明之第一方面，提出一種檢測裝置。檢測裝 置用以檢測一半導體元件。半導體元件具有數個電性接 點。檢測裝置包括一第一板件及數根檢測針腳。該些根檢 測針腳穿過第一板件設置。各該檢測針腳包括一第—部 分、-第二部分及一第三部分。第三部分用以接觸電性接 點。其中，第二部分連接第一部分與第三部分、第二部分 之截面積係往第三部分的方向漸縮且第二部分與第三部 刀之間夾一第一夾角，第一夾角介於155度至185产 為了對本發明之上述及其他方面有更佳的瞭^，下曰文 特舉較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 請參照第1 ®，錢示依照本發明—實_之檢測裝 置之剖視圖。檢測裝置剛檢測半導體元件（未緣示）， 例如疋晶片（chip)或半導體封裝件。檢測裝置1〇〇包括 201221963 第一板件102、第二板件1〇4、電路板112、固定元件120 及多根檢測針腳106。其中，檢測針腳1〇6用以接觸半導 體元件之電性接點。 請參照第2圖，其繪示第1圖中局部2,的放大示意 圖。檢測針腳106包括第一部分1〇6a、第二部分1〇6b及 第三部分106c。檢測針腳1〇6之第三部分】06c用以接觸 半導體元件之電性接點。其中，二相鄰之第三部分1〇6c 的間距P1可小至33微米（μπ!)或更小，因此可檢測相鄰 Φ 二電性接點之間距微小（例如是150微米以下）的半導體 元件。 第一部分106a之材質具導電性，其例如是金屬或合 金。合金例如是鎢化銖（ReW)、銶(Re)、鈹化銅（BeCu) 或 Palinery-7TM。其中 palinery_7TM 係由金（Gu)、鈀 (Pa)、顧（Pt)、銀（Au)、銅（Cu)、鋅（Zn)及鎢（W) 所組成。第二部分l〇6b之材質及第三部分i〇6c之材質相 似於第一部分l〇6a之材質。第一部分106a、第二部分1〇6b 瞻與第三部分l〇6c之材質係不同或相同，本實施例之第一 部分106a、第二部分i〇6b及第三部分i〇6c之材質係以相 同為例作說明。 車父佳但非限定地，第一部分1 〇6a、第二部分1 〇处與 第三部分l〇6c係於同一製程中一體成形而形成檢測針腳 106 ° 以下進一步說明第一部分106a、第二部分1〇6b及第 三部分106c的構造。 請繼續參照第2圖，第二部分1〇61)之橫截面（即與 201221963The IW69J0PA is provided, and the detecting device has a plurality of detecting pins which can be arranged in an array shape and the spacing between two adjacent detecting pins is very small, and the semiconductor package in which the electrical contacts are array-shaped and has a small pitch can be detected. According to a first aspect of the invention, a detection stitch is proposed. The sense pin is used to detect a semiconductor component having a plurality of electrical contacts. The detecting stitch includes a first portion, a second portion and a third portion. The third part is used to contact one of the electrical contacts. Wherein, the cross-sectional area of the second portion connecting the first portion and the third portion and the second portion is tapered toward the second portion and the first angle is sandwiched between the second portion and the third portion. Between 155 degrees and 185 degrees. According to a first aspect of the invention, a detection device is proposed. The detecting device is for detecting a semiconductor component. The semiconductor component has several electrical contacts. The detecting device comprises a first plate and a plurality of detecting pins. The root test pins are disposed through the first panel. Each of the detection pins includes a first portion, a second portion, and a third portion. The third part is used to contact the electrical contacts. Wherein, the cross-sectional area of the second portion connecting the first portion and the third portion and the second portion is tapered toward the third portion, and the first angle is sandwiched between the second portion and the third portion, the first angle is between 155 degrees to 185. In order to improve the above and other aspects of the present invention, the preferred embodiments are described in detail below with reference to the accompanying drawings. ®, the money shows a cross-sectional view of the detecting device according to the present invention. The detecting device has just detected a semiconductor component (not shown), such as a chip or a semiconductor package. The detecting device 1 includes a first plate member 102, a second plate member 1〇4, a circuit board 112, a fixing member 120, and a plurality of detecting pins 106 in 201221963. Wherein, the detecting pin 1〇6 is used to contact the electrical contact of the semiconductor component. Referring to Fig. 2, an enlarged schematic view of a portion 2 in Fig. 1 is shown. The detecting stitch 106 includes a first portion 1〇6a, a second portion 1〇6b, and a third portion 106c. The third part of the detection pin 1〇6] is used to contact the electrical contacts of the semiconductor component. Wherein, the pitch P1 of the two adjacent third portions 1〇6c can be as small as 33 micrometers (μπ!) or less, so that the distance between adjacent Φ two electrical contacts can be detected to be small (for example, 150 micrometers or less). Semiconductor component. The material of the first portion 106a is electrically conductive, such as a metal or alloy. The alloy is, for example, tantalum (ReW), ruthenium (Re), copper beryllide (BeCu) or Palinery-7TM. Among them, palinery_7TM is composed of gold (G), palladium (Pa), Gu (Pt), silver (Au), copper (Cu), zinc (Zn) and tungsten (W). The material of the second part l〇6b and the material of the third part i〇6c are similar to those of the first part l〇6a. The materials of the first part 106a, the second part 1〇6b and the third part l〇6c are different or the same, and the materials of the first part 106a, the second part i〇6b and the third part i〇6c of the embodiment are The same is given as an example. Preferably, the first part 1 〇 6a, the second part 1 〇 and the third part 〇 6c are integrally formed in the same process to form the detection pin 106 °. The first part 106a and the second part are further described. The configuration of 1〇6b and third part 106c. Please continue to refer to Figure 2, the cross section of the second part 1〇61) (ie with 201221963
l'W6930PA » % 針腳之軸向垂直的截面）之形狀可以是圓形、矩形、三角 形或其它外形，本發明對第二部分l〇6b之橫截面的形狀 不作任何限制。第二部分106b之一端106bl連接於第三 部分106c。當第二部分106b之該端106bl之外徑D1愈 小’二相鄰之第二部分1〇6b可愈接近’使間距ρι縮小。 在一實施態樣中’第二部分l〇6b之該端l〇6bl之外徑D1 係約25 μιη ’如此可使間距pi小至33 μιη。 在第一部分106b之該端106Μ之外徑D1係25 μιη 的設計下，第三部分l〇6c之檢測端i〇6cl之外徑大約介於 15至25 μιη之間’其中檢測端106cl用以接觸電性接點。 第二部分106b連接第一部分106a與第三部分1〇&。 第二部分106b之橫截面積係從第一部分1〇6a往第三部分 1〇6c的方向漸縮，即第二部分1〇6b係錐桿。此外，藉由 第二部分106b之漸縮外型，可使二相鄰之第三部分丨 之間的間距縮小。 e 本實施例中，第三部分版之橫截面積係從第二部 分l〇6b往第三部分106c之檢測端106cl的方向漸縮。於 ^它實施態樣中，請參照第3圖，其繪示依照本發明其二 貫施態樣之檢測針腳之第三部分的示意圖。第二部分扣釙 連接於第三部分206c’第三部分2〇6c的橫截面積係均 即第三部分206c係細長圓柱。 —’ ，_ 1 …叫谓你叫哥，卬笫一部分 係細長圓柱，然此非用以限制本發明，第一部分1〇6 可為錐桿。 此外，第二部分106b與第三部分1〇6c之間夾—第— 201221963 ^角A1’第—夾角A1係鈍角，其角度值例如是介於約155 度至185度之間’藉此可使笛_ 、 .. 吏第—邛为l〇6b與第三部分i06c f成一可撓性元件。如此，當第三部分黯接觸於電性 接點而受到電性接點之作用力時，第三部分驗係可動 =避免強迫到壞電性接點。此外，藉由第二部分祕盘 m可撓性’第三部分邮可刮除電性接點 上之雜貝（例如是氧化層）’使第三部分驗確實地電性 接觸到電性接點的導電本體。 由於第-夾角A1之設計，使第二部分祕 又IJ弟一板件刚的止擔而避免第三部分版脫離 二板件104。 #L'W6930PA » % axially perpendicular cross section of the stitch) may be circular, rectangular, triangular or other shape, and the shape of the cross section of the second portion 16b is not limited in the present invention. One end 106bl of the second portion 106b is coupled to the third portion 106c. The smaller the outer diameter D1 of the end 106bl of the second portion 106b, the closer the second adjacent portion 1〇6b can be, the smaller the pitch ρι. In an embodiment, the outer diameter D1 of the end l〇6b1 of the second portion l6b is about 25 μm so that the pitch pi can be as small as 33 μm. In the design of the outer diameter D1 of the end portion 106b of the first portion 106b is 25 μm, the outer diameter of the detecting end i〇6cl of the third portion 106c is approximately between 15 and 25 μm, wherein the detecting end 106cl is used. Contact electrical contacts. The second portion 106b connects the first portion 106a with the third portion 1 & The cross-sectional area of the second portion 106b is tapered from the first portion 1〇6a to the third portion 1〇6c, i.e., the second portion 1〇6b is a tapered rod. Moreover, by the tapered shape of the second portion 106b, the spacing between the two adjacent third portions 丨 can be reduced. e In this embodiment, the cross-sectional area of the third partial plate is tapered from the second portion 16b to the detecting end 106cl of the third portion 106c. In its embodiment, please refer to Fig. 3, which is a schematic view showing a third portion of the detecting stitch of the second embodiment thereof according to the present invention. The second portion of the buckle is connected to the third portion 206c'. The third portion 2〇6c has a cross-sectional area, that is, the third portion 206c is an elongated cylinder. —’ , _ 1 ... is called a brother, and a part of it is an elongated cylinder. However, this is not intended to limit the invention. The first part 1〇6 may be a cone. In addition, the second portion 106b and the third portion 1〇6c are sandwiched between -201221963^the angle A1'-the angle A1 is an obtuse angle, and the angle value is, for example, between about 155 degrees and 185 degrees. Let the flute _, .. 吏 first - 〇 l 〇 6b and the third part i06c f become a flexible element. Thus, when the third portion is in contact with the electrical contact and is subjected to the force of the electrical contact, the third portion of the system is movable = avoiding forced to the bad electrical contact. In addition, by the second part of the secret disk m flexible 'the third part can scrape off the miscellaneous shell on the electrical contact (for example, the oxide layer) 'the third part is positively electrically contacted to the electrical contact Conductive body. Due to the design of the first angle A1, the second part of the board and the IJ brother are just stopped, and the third part is prevented from coming off the second board 104. #
此外，該些第一部分1〇6a大致上互相平行且該些 第二部分H}6e大致上互相平行，第—部分_的平行方 向與第三部分1G6e的平行方向大致上同向，然此非用以 限制本發明。第一部分黯與第二部分l〇6b之間夹—第 一夹角A2，由於第一部分1〇6a的平行方向與第三部分 106C的平行方向大致上同向，因此第一夾角A1與第二2 角A2係内錯角，其角度值大致上相等。 A 此外，由於第二夾角A2之設計，使第二部分1〇6b 可受到第一板件102的止擋而避免第一部分1〇6a脫離第 一板件102。 檢測針腳可穿過電路板設置。例如，請回到第丨圖， 電路板112具有貫穿部114及相對之第一面1123與第二面 u2b。第一板件ι〇2設於電路板112之第一面U2a 測針腳106係穿過電路板112之貫穿部114、第一板件1〇2 201221963 t ν» \jyj\j\ r\ ' r 及第二板件104。其中，第一部分106a延伸至電路板U2 之第二面112b，第一部分106a係採用例如是焊接的方式 電性連接於電路板112，而第三部分i〇6c係突出於第二板 件104之下表面。詳細而言’檢測針腳1〇6係從電路板112 之第一面112a之側穿過電路板112而延伸至電路板112 之第二面112b。 部分106a穿過第一板件102設 如第2圖所示 置，第三部分106c穿過第二板件1〇4設置。詳細而言 第一板件102具有第一凹槽116 (第一凹槽116繪示:第 1圖）、多個第一貫孔108及相對之第一面1〇2a與第二面 102b，其中第一貫孔108從第一面1〇2&延伸至第二面， 忒些第一貫孔108大致上彼此平行地排列。檢測針腳1〇( 之第一部分106a穿過對應之第一貫孔1〇8而延伸至電路 板112之第二面112b (第二面mb繪示於第i圖）並電 ，連接於電路板112之第二面mb，亦即，第一部分脱 第一板件102之第—面咖之側延伸至連接於電 路板112之第二面102b。 之望此，—相鄰之第—貫孔⑽的間距係可改變二相鄰 之第一部分106a的間距。 祁㈤ 第一板件1 〇4且右笛一 於第！圖）與多個第二^凹槽118 (第二凹槽118繪示 穿第二板件H)4之相Lll〇。其中，第二貫孔110貫 此平行地排列。复中;面，該些第二貫孔110大致上彼 分l〇6c之最大外獲，一貫孔110之内徑略大於第三部 輕易地穿過對應之第針腳106之第三部分可 ―貝孔110設置。當第三部分1〇6( 201221963 i wo^v>ur/\ » 接觸於電性接點而受㈣，$三部分iQ6e no導引而上下移動。在其它實施態樣中，亦可省略第二 板件104’如此，第三部分i〇6c仍可與電性接點接觸而完 成檢測。 此外，二相鄰之第二貫孔110的間距以及第二部分 06b之β知i〇6bl❾外徑D1係可改變二相鄰之第三部分 106c的間距pi。舉例來說，當二相鄰之第二貫孔I!。之 間距愈小或第二部分1Q6b之該端1G6M的外徑〇ι愈小 時一相鄰之第二部分1〇6c之間距ρι可設計得愈小；反 之’當一相鄰之第二貫孔110之間距愈大或第二部分106b 之。亥化l〇6bl W外技D1愈大時，二相鄰之第三部分剛〇 之間距P1可设計得愈大。藉此，間距ρι之值可介於一範 圍内’該範圍例如是介於約180 μιη至33 μιη之間，然此 f用以限制本發明。該範圍之上限值亦可高於180 _，該 犯圍之下限值亦低於33卿，實際的數值可依據受檢測之 半導體元件之電性接點的間距而定，本發明不作任何限 制。 此外，第一板件102與第二板件1〇4在接合後，第一 凹槽116與第二凹槽118相通，第二部分106b位於第一 凹槽116與第二凹槽118内。 如第2圖所示，固定元件12〇係黏膠或環氧樹脂 (epoxy)，其結合第一板件1〇2與檢測針腳，以將檢 測針腳H)6固定於第一板件1〇2上。本實施例中，固定元 件120連接第一板件1〇2之第二面1〇沘與第一部分1〇如， 以將第-部分l〇6a固定於第一板件1〇2上；於其它實施 201221963 農 丨 態樣中’固定元件120可連接第一板件102之第一面1〇2a 與第一部分106a’以將第一部分l〇6a固定於第一板件1〇2 上。當固定元件120設於第一板件1〇2之第一面1〇2a時， 固定元件120較佳地係完全不接觸到第二部分i〇6b，可使 第二部分l〇6b產生較佳可撓性，然此非用以限制本發明。 在其它實施態樣中’當固定元件120設於第一板件1〇2之 第一面102a時，固定元件120亦可接觸到部分之第二部 分 106b 。 在其它實施態樣中’亦可省略固定元件120。如此， 第一部分106a藉由第一貫孔108之限制而不致與第一板 件102脫離。在此情況下，第一貫孔丨之内徑可與第一 部分106a之外徑較精密地配合或緊配，以增進檢測針腳 106的穩固性。 如第2圖所示，在一實施態樣中，第三部分1〇6c之 長度L3大約係508 μπι，而第一板件丨〇2與第二板件1〇4 之間的距離L1大約介於7000 μιη至8000 μιη之間。較佳 但非限定地’每根第二部分1〇6b之長度大致上相等，如 此使得連接於該些長度大致上相等之第二部分l〇6b的該 些第三部分l〇6c ’其受力較一致。 一些第一貫孔之排列外形與對應之該些第二貫孔之 排列外形可以不同或相似。例如，請參照第4圖，其繪示 第1圖之第一板件之第一貫孔與第二板件之第二貫孔的排 列外形示意圖。第4圖僅繪示第一板件1〇2中局部區域的 此些第一貫孔108以及第二板件1〇4中局部區域的此些第 二貫孔110。檢測針腳1〇6 (未繪示於第4圖）可穿過第4 201221963 1 1 * 圖Γ、^帛一貫孔】08與對應之第二貫孔no。該些第 貝孔108之排列外形與該些第二貫孔11〇之排列外形係 不同’例如’該些第一貫孔1〇8排列成六邊形，而該些第 貫孔110排列成四邊形。雖此，請參照第5圖其繪示 本實施例之檢測針腳交叉以意圖。藉由該些第二部分 l〇6b彼此交又設置，可使設於第—板件搬與第二板件Further, the first portions 1〇6a are substantially parallel to each other and the second portions H}6e are substantially parallel to each other, and the parallel direction of the first portion _ is substantially the same as the parallel direction of the third portion 1G6e, but It is used to limit the invention. The first angle 黯 is sandwiched between the second portion 〇6b—the first angle A2, since the parallel direction of the first portion 〇6a is substantially the same as the parallel direction of the third portion 106C, the first angle A1 and the second 2 Angle A2 is a wrong angle inside the system, and the angle values are substantially equal. Further, due to the design of the second angle A2, the second portion 1〇6b can be stopped by the first plate member 102 to prevent the first portion 1〇6a from coming off the first plate member 102. The detection pins can be placed through the board settings. For example, returning to the second diagram, the circuit board 112 has a through portion 114 and opposite first and second faces 1123 and 2bb. The first plate ι 2 is disposed on the first surface U2a of the circuit board 112. The stylus 106 is passed through the through portion 114 of the circuit board 112, and the first plate member 1〇2 201221963 t ν» \jyj\j\ r\ ' r and the second plate 104. The first portion 106a extends to the second surface 112b of the circuit board U2. The first portion 106a is electrically connected to the circuit board 112 by soldering, for example, and the third portion i6c protrudes from the second board 104. lower surface. In detail, the detection pin 1〇6 extends from the side of the first face 112a of the circuit board 112 through the circuit board 112 to the second face 112b of the circuit board 112. The portion 106a is disposed through the first panel 102 as shown in Fig. 2, and the third portion 106c is disposed through the second panel 1〇4. In detail, the first plate member 102 has a first recess 116 (the first recess 116 is shown in FIG. 1 ), a plurality of first through holes 108 and opposite first and second faces 102a and 102b, The first through hole 108 extends from the first surface 1〇2& to the second surface, and the first through holes 108 are substantially parallel to each other. The detecting pin 1 〇 (the first portion 106a extends through the corresponding first through hole 1 〇 8 and extends to the second surface 112b of the circuit board 112 (the second surface mb is shown in the ith diagram) and is electrically connected to the circuit board The second side mb of 112, that is, the first portion of the first side of the first board member 102 extends to the second side 102b of the circuit board 112. The adjacent first through hole The spacing of (10) is such that the spacing of the two adjacent first portions 106a can be changed. 祁 (5) The first panel 1 〇 4 and the right flute 1 is in the figure!) and the plurality of second grooves 118 (the second groove 118 is drawn The phase L11〇 of the second plate member H)4 is shown. The second through holes 110 are arranged in parallel. The second through hole 110 is substantially the largest outer portion of the first through hole 110, and the inner diameter of the consistent hole 110 is slightly larger than the third portion of the third portion easily passing through the corresponding first pin 106. Beacon 110 is set. When the third part 1〇6(201221963 i wo^v>ur/\ » is exposed to the electrical contact and is subjected to (4), the three parts iQ6e no are guided to move up and down. In other implementations, the The second plate member 104' is so that the third portion i〇6c can still be in contact with the electrical contact to complete the detection. In addition, the spacing of the two adjacent second through holes 110 and the second portion of the second portion 06b are known as The diameter D1 can change the pitch pi of the two adjacent third portions 106c. For example, the smaller the distance between the two adjacent second through holes I! or the outer diameter of the end 1G6M of the second portion 1Q6b〇 When ι is smaller, the distance between the adjacent second part 1〇6c is designed to be smaller; otherwise, the distance between the adjacent second through holes 110 is larger or the second part 106b is. Haihua l〇6bl The larger the W outer skill D1 is, the larger the distance between the two adjacent third portions can be designed. Therefore, the value of the pitch ρι can be within a range, for example, the range is about 180 μm. Between 33 μιηη, but f is used to limit the invention. The upper limit of the range may also be higher than 180 _, and the lower limit of the guilt is also lower than 33 qing, the actual number The present invention is not limited in any way according to the spacing of the electrical contacts of the semiconductor component to be inspected. Further, after the first plate member 102 and the second plate member 1〇4 are joined, the first groove 116 and the second groove The groove 118 is in communication, and the second portion 106b is located in the first groove 116 and the second groove 118. As shown in Fig. 2, the fixing member 12 is made of adhesive or epoxy, which is combined with the first plate. The member 1〇2 and the detecting pin are used to fix the detecting stitch H)6 to the first plate member 1〇2. In this embodiment, the fixing member 120 is connected to the second surface 1〇沘 of the first plate member 1〇2, for example, to fix the first portion l〇6a to the first plate member 1〇2; Other implementations 201221963 The 'fixing element 120' can connect the first face 1〇2a of the first plate member 102 with the first portion 106a' to secure the first portion 16a to the first plate member 1〇2. When the fixing member 120 is disposed on the first surface 1〇2a of the first plate member 1〇2, the fixing member 120 preferably does not contact the second portion i〇6b at all, so that the second portion 16b can be produced. It is not flexible to limit the invention. In other embodiments, when the fixing member 120 is disposed on the first face 102a of the first panel member 〇2, the fixing member 120 may also contact the second portion 106b of the portion. In other embodiments, the fixation element 120 may also be omitted. As such, the first portion 106a is not constrained from the first panel 102 by the restriction of the first through hole 108. In this case, the inner diameter of the first through hole can be closely fitted or tightly fitted to the outer diameter of the first portion 106a to enhance the stability of the detecting stitch 106. As shown in FIG. 2, in an embodiment, the length L3 of the third portion 1〇6c is approximately 508 μm, and the distance L1 between the first panel 丨〇2 and the second panel 1〇4 is approximately Between 7000 μηη and 8000 μηη. Preferably, but not limited to, the lengths of each of the second portions 1 〇 6b are substantially equal such that the third portions 16 ' 6c ' connected to the second portions 16 b of substantially equal length are subject to The force is more consistent. The arrangement shape of the first through holes may be different or similar to the arrangement shape of the corresponding second through holes. For example, please refer to FIG. 4, which is a schematic view showing the arrangement of the first through holes of the first plate and the second through holes of the second plate of FIG. The fourth figure only shows the first through holes 108 in a partial area of the first plate member 1 and the second through holes 110 in a partial area of the second plate member 1〇4. The detection pin 1〇6 (not shown in Fig. 4) can pass through the 4th 201221963 1 1 * Figure 帛, ^ 帛 consistent hole 08 and the corresponding second through hole no. The arrangement shapes of the first holes 108 are different from the arrangement shapes of the second through holes 11', for example, the first through holes 1〇8 are arranged in a hexagonal shape, and the through holes 110 are arranged in a quadrilateral. However, please refer to Fig. 5 to illustrate the intention of detecting the intersection of the stitches of this embodiment. By the second portions l〇6b being disposed and arranged with each other, the first plate member and the second plate member can be disposed.
10:之間的该些第二部分1〇6b的長度差異縮小甚至使該 些第二部分106b之長度大致上相等。 a在其它實施態樣中，請參照第6圖，其繪示其它實施 態樣之第-板件之第-貫孔與第二板件之第二貫孔的排列 外形示意圖。第-板件2〇2具有數個第—貫孔細，第二 板件204具有數個第二貫孔21〇 ’該些第一貫孔對應 於該些第二貫孔210。該些第一貫孔雇之排列外形相似 於該些第二貫孔2H)的排列外形，例如，第一貫孔鹰排 列成四邊形，而第二貫孔11〇亦排列成相似的四邊形。相 似地，可藉由該些第二部分祕彼此交又設置，使設於 第-板件202與第二板件2〇4間之該些第二部分祕的 長度差異縮小，甚至使該些第二部分1〇补之長度大致上 相等。 义 综上所述’無論多個第一貫孔1〇8的排列外形與對應 之該些第二貫孔11G的排列外形係相同或相異，藉由第^ 部分106b彼此交叉設置，可縮小該些第二部分1〇曰讣之^ 度差異，使對應之该些檢測針腳1 06的受力較一致。 此外，當該些第一貫孔施（繪示於第6圖）之 外形相似於該些第二貫孔210的排列外形(如第6圖所示、 20122196310: The difference in length between the second portions 1 〇 6b is reduced or even the lengths of the second portions 106b are substantially equal. In other embodiments, please refer to FIG. 6 , which is a schematic diagram showing the arrangement of the first through hole of the first plate member and the second through hole of the second plate member in other embodiments. The first plate member 2〇2 has a plurality of first through holes, and the second plate member 204 has a plurality of second through holes 21〇'. The first through holes correspond to the second through holes 210. The first through holes are arranged similarly to the arrangement of the second through holes 2H). For example, the first through holes are arranged in a quadrangular shape, and the second through holes 11 are also arranged in a similar quadrilateral shape. Similarly, the length differences of the second portions disposed between the first plate member 202 and the second plate member 2〇4 may be reduced by the second portion secrets being disposed, and even The length of the second part 1 is substantially equal. In summary, the arrangement shape of the plurality of first through holes 1〇8 is the same as or different from the arrangement shape of the corresponding second through holes 11G, and can be reduced by the intersection of the second portions 106b. The difference in the degree of the second portion is such that the force of the corresponding detecting pins 106 is relatively uniform. In addition, the shape of the first through holes (shown in FIG. 6) is similar to the arrangement of the second through holes 210 (as shown in FIG. 6, 201221963).
TW6930PA i f 時：藉由檢測針腳10 6 ?過位置相對應之第一貫孔2 0 8與 第、，貫孔210 ’使母根檢測針腳106之第二部分106b大致 上平行地配置。例如，第一貫孔2〇8,位於排列外形（四邊 开v )之相對立置，與第二貫孔21〇，位於排列外形（四邊形） 之相對位置大致上一致，而第一貫孔2〇8，，位於排列外形之 相=位置，與第二貫孔21〇，，位於排列外形之相對位置大致 上致？過對應之第一貫孔2〇8，與第二貫孔21〇,的檢測 針腳與穿過對應之第一貫孔2〇8，，與第二貫孔21〇”的檢測 針腳其第一部分的長度大致上相同。 、本發明縮小該些第二部分l〇6b之長度差異並不侷限 於士，方法。在其它實施態樣中，請參照第7圖，其繪示 其匕實施態樣之第一板件、第二板件及檢測針腳的剖視 圖第板件402具有第一段差面4〇2c卜第二段差面4〇2c2 以及相對之第一面402a與第二面4〇2b。其中第一面 402a、第一段差面4〇2cl及第二段差面4〇2c2朝向第二板 件404。第一面402a與第一段差面4〇2cl相距一段差距離 2卓{又差面4〇2c 1與第二段差面402c2相距一段差距 離S3，使得第一面402a、第一段差面402cl及第二段差 面402c2分別與第二板件404相距不同距離。藉此段差結 構，可增加第二部分l〇6b之長度的設計彈性，使設於第 板件402與第一板件404之間的該些第二部分i〇6b的 長度差異縮小。 此外’多個第一貫孔的分布區域與對應之該些第二貫 孔的分布區域可重疊或彼此錯開一距離。例如，請參照第 8圖，其繪示第1圖之第一板件之第一貫孔與第二板件之 12 201221963 k i wu^Jur/A · 第二貫孔的分布區域示意圖。一些第一貫孔108的分布區 域R1與對應之該些第二貫孔110的分布區域R2係重疊， 進一步地說，分布區域R1之至少一部分與分布區域R2 之至少一部分係沿著貫孔（第一貫孔108或第二貫孔110) 之延伸方向重疊。 又例如，請參照第9圖，其繪示其它實施態樣之第一 板件之第一貫孔與第二板件之第二貫孔的分布區域示意 圖。其它實施態樣中，第一板件302具有多個第一貫孔 • 308,第二板件304具有多個第二貫孔310。其中一些第一 貫孔308的分布區域R3與對應之該些第二貫孔310的分 布區域R4係不重疊。進一步地說，分布區域R3與分布區 域R4係沿著與貫孔（第一貫孔108或第二貫孔110)之延 伸方向垂直的方向錯開一距離S1。 本發明上述實施例之檢測針腳及應用其之檢測裝 置，檢測針腳可排列成陣列形且二相鄰之檢測針腳的間距 甚小，可檢測電性接點呈陣列形且其間距甚小的半導體封 • 裝件。 綜上所述，雖然本發明已以較佳實施例揭露如上，然 其並非用以限定本發明。本發明所屬技術領域中具有通常 知識者，在不脫離本發明之精神和範圍内，當可作各種之 更動與潤飾。因此，本發明之保護範圍當視後附之申請專 利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示依照本發明一實施例之檢測裝置之剖視 13 201221963 i woyjuKA * « 」_ 圖。 第2圖繪示第1圖中局部2’的放大示意圖。 第3圖繪示依照本發明其它實施態樣之檢測針腳之第 三部分的示意圖。 第4圖繪示第1圖之第一板件之第一貫孔與第二板件 之第二貫孔的排列外形示意圖。 第5圖繪示本實施例之檢測針腳交叉之示意圖。 第6圖繪示其它實施態樣之第一板件之第一貫孔與第 二板件之第二貫孔的排列外形示意圖。 · 第7圖繪示其它實施態樣之第一板件、第二板件及檢 測針腳的剖視圖。 第8圖繪示第1圖之第一板件之第一貫孔與第二板件 之第二貫孔的分布區域示意圖。 第9圖繪示其它實施態樣之第一板件之第一貫孔與 第二板件之第二貫孔的分布區域示意圖。 【主要元件符號說明】 β 100 :檢測裝置 102、202、302、402 :第一板件 402cl :第一段差面 402c2 :第二段差面 102a、112a、402a :第一面 102b、112b、402b :第二面 104、204、304、404 :第二板件 106 :檢測針腳 14 201221963 - 1 * 106a :第一部分 106b、206b :第二部分 106bl :第二部份之一端 106c、206c :第三部分 106cl :檢測端 108、208、208’、208，，、308 :第一貫孔 110、210、210’、210”、310 :第二貫孔 112 :電路板 • 114 :貫穿部 116 :第一凹槽 118 :第二凹槽 120 :固定元件 A1 :第一夾角 A2 :第二夾角 D1 :外徑 LI、S1 :距離 • L3 :長度 P1 :間距TW6930PA i f: The second portion 106b of the mother detecting pin 106 is disposed substantially in parallel by detecting the first through hole 2 0 8 corresponding to the position of the stitch 106 and the through hole 210'. For example, the first through holes 2〇8 are located opposite to each other in the arrangement shape (four sides open v), and substantially coincide with the second through holes 21〇 at the relative positions of the arrangement shape (quadrilateral shape), and the first through holes 2 〇8, in the phase of the arrangement shape = position, and the second through hole 21 〇, the relative position of the arrangement shape is substantially the same? The first through hole corresponding to the first through hole 2〇8, the second through hole 21〇, the detection pin and the first through hole corresponding to the first through hole 2〇8, and the second through hole 21〇” The length of the second portion l〇6b is not limited to the method of the present invention. In other embodiments, please refer to FIG. 7 , which illustrates the implementation aspect. The first plate member, the second plate member, and the cross-sectional view of the detecting pin plate member 402 have a first step surface 4〇2c, a second step surface 4〇2c2, and an opposite first surface 402a and second surface 4〇2b. The first surface 402a, the first differential surface 4〇2cl, and the second differential surface 4〇2c2 face the second plate member 404. The first surface 402a is spaced apart from the first differential surface 4〇2cl by a distance of 2 4〇2c 1 is spaced apart from the second differential surface 402c2 by a distance S3, such that the first surface 402a, the first differential surface 402cl and the second differential surface 402c2 are respectively at different distances from the second plate 404. Increasing the design flexibility of the length of the second portion 16b to make the first portion between the first plate member 402 and the first plate member 404 The length difference of the portion i〇6b is reduced. Further, the distribution area of the plurality of first through holes and the corresponding distribution areas of the second through holes may overlap or be offset from each other by a distance. For example, refer to FIG. FIG. 1 is a schematic view showing a distribution area of the first through hole and the second plate of the first plate of the first plate. The distribution area of the first through hole 108 is corresponding to the distribution area of the first through hole 108. The distribution regions R2 of the second through holes 110 are overlapped. Further, at least a portion of the distribution region R1 and at least a portion of the distribution region R2 are along the through holes (the first through holes 108 or the second through holes 110). For example, please refer to FIG. 9 , which is a schematic view showing a distribution area of the first through hole of the first plate member and the second through hole of the second plate member in other embodiments. The first plate member 302 has a plurality of first through holes 308, and the second plate member 304 has a plurality of second through holes 310. The distribution regions R3 of some of the first through holes 308 and the corresponding second portions The distribution area R4 of the holes 310 does not overlap. Further, the distribution area R3 The distribution area R4 is shifted by a distance S1 in a direction perpendicular to the extending direction of the through hole (the first through hole 108 or the second through hole 110). The detecting pin of the above embodiment of the present invention and the detecting device using the same, the detecting pin The semiconductor package can be arranged in an array shape and the distance between two adjacent detection pins is small, and the semiconductor contacts can be detected in an array shape with a small pitch. In summary, although the present invention has been preferred The embodiments are disclosed above, but are not intended to limit the invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a detecting device according to an embodiment of the present invention. 13 201221963 i woyjuKA * « _ _ Figure. Fig. 2 is an enlarged schematic view showing a portion 2' in Fig. 1. Figure 3 is a schematic illustration of a third portion of a test pin in accordance with other embodiments of the present invention. Figure 4 is a schematic view showing the arrangement of the first through hole of the first plate member and the second through hole of the second plate member in Fig. 1. FIG. 5 is a schematic view showing the intersection of the detection stitches in the embodiment. Figure 6 is a schematic view showing the arrangement of the first through hole of the first plate member and the second through hole of the second plate member in other embodiments. Fig. 7 is a cross-sectional view showing the first plate member, the second plate member, and the detecting stitch of the other embodiment. Figure 8 is a schematic view showing a distribution area of the first through hole of the first plate member and the second through hole of the second plate member in Fig. 1. Figure 9 is a schematic view showing the distribution of the first through hole of the first plate member and the second through hole of the second plate member in other embodiments. [Description of main component symbols] β 100 : detection devices 102, 202, 302, 402: first plate 402cl: first segment difference surface 402c2: second segment difference surface 102a, 112a, 402a: first surface 102b, 112b, 402b: Second face 104, 204, 304, 404: second plate 106: detecting stitch 14 201221963 - 1 * 106a: first portion 106b, 206b: second portion 106bl: one end of the second portion 106c, 206c: third portion 106cl: detection end 108, 208, 208', 208,, 308: first through hole 110, 210, 210', 210", 310: second through hole 112: circuit board • 114: penetration portion 116: first Groove 118: second groove 120: fixing element A1: first angle A2: second angle D1: outer diameter LI, S1: distance • L3: length P1: spacing
Rl、R2、R3、R4 :分布區域 S2、S3 :段差距離 15Rl, R2, R3, R4: distribution area S2, S3: step distance 15