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TWI416115B - - Google Patents

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Publication number
TWI416115B
TWI416115B TW98138864A TW98138864A TWI416115B TW I416115 B TWI416115 B TW I416115B TW 98138864 A TW98138864 A TW 98138864A TW 98138864 A TW98138864 A TW 98138864A TW I416115 B TWI416115 B TW I416115B
Authority
TW
Taiwan
Prior art keywords
probe
main body
insulation material
conductive
circuit board
Prior art date
Application number
TW98138864A
Other languages
Chinese (zh)
Other versions
TW201118381A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98138864A priority Critical patent/TW201118381A/en
Publication of TW201118381A publication Critical patent/TW201118381A/en
Application granted granted Critical
Publication of TWI416115B publication Critical patent/TWI416115B/zh

Links

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A test device for high-frequency vertical probe card includes at least a probe and, stacked from top to bottom, a circuit board, conductive cloth, a first insulation material, a conductive material, and a second insulation material. The probe penetrates the first insulation material, the conductive material, and the second insulation material, and the exposed probe tip is used to contact the test point of a to-be-tested chip. The connection part of the probe contacts the conductive cloth to utilize the vertical conductor in the conductive cloth to electrically connect the circuit board so that the probe can transmit high-frequency electrical signals between the circuit board and the test points. The main body of the probe is wrapped by the main body of the conductive material and there is a gap using air as medium between the main body of the probe and the main body of the conductive material; as a result, the main body of the probe has low dielectric property conduction, and therefore the transmission quality of high-frequency electrical signal is improved and test accuracy for the to-be-tested chip can also be enhanced.
TW98138864A 2009-11-16 2009-11-16 Test device for high-frequency vertical probe card TW201118381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98138864A TW201118381A (en) 2009-11-16 2009-11-16 Test device for high-frequency vertical probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98138864A TW201118381A (en) 2009-11-16 2009-11-16 Test device for high-frequency vertical probe card

Publications (2)

Publication Number Publication Date
TW201118381A TW201118381A (en) 2011-06-01
TWI416115B true TWI416115B (en) 2013-11-21

Family

ID=44935625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98138864A TW201118381A (en) 2009-11-16 2009-11-16 Test device for high-frequency vertical probe card

Country Status (1)

Country Link
TW (1) TW201118381A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105588957A (en) * 2014-11-12 2016-05-18 致伸科技股份有限公司 Test seat

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109752574A (en) * 2017-11-07 2019-05-14 特克特朗尼克公司 Probe end and probe assembly
CN113092982B (en) * 2020-01-09 2022-03-18 珠海格力电器股份有限公司 Test seat and test equipment
TWI799834B (en) * 2020-05-22 2023-04-21 南韓商李諾工業股份有限公司 Test socket and method of fabricating the same
TWI730806B (en) * 2020-06-10 2021-06-11 中華精測科技股份有限公司 Vertical probe card having cantilever probe

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200617397A (en) * 2004-09-30 2006-06-01 Yokowo Seisakusho Kk Inspection unit
CN1281966C (en) * 2002-10-02 2006-10-25 株式会社瑞萨科技 Probe sheet, probe card, semiconductor detector and method for producing semiconductor device
TW200813458A (en) * 2006-09-12 2008-03-16 Yokowo Seisakusho Kk Socket for use in inspection

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1281966C (en) * 2002-10-02 2006-10-25 株式会社瑞萨科技 Probe sheet, probe card, semiconductor detector and method for producing semiconductor device
TW200617397A (en) * 2004-09-30 2006-06-01 Yokowo Seisakusho Kk Inspection unit
TW200813458A (en) * 2006-09-12 2008-03-16 Yokowo Seisakusho Kk Socket for use in inspection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105588957A (en) * 2014-11-12 2016-05-18 致伸科技股份有限公司 Test seat
CN105588957B (en) * 2014-11-12 2019-03-22 致伸科技股份有限公司 Test seat

Also Published As

Publication number Publication date
TW201118381A (en) 2011-06-01

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