CN105588957B - Test seat - Google Patents
Test seat Download PDFInfo
- Publication number
- CN105588957B CN105588957B CN201410635334.6A CN201410635334A CN105588957B CN 105588957 B CN105588957 B CN 105588957B CN 201410635334 A CN201410635334 A CN 201410635334A CN 105588957 B CN105588957 B CN 105588957B
- Authority
- CN
- China
- Prior art keywords
- plate body
- test
- conductive plate
- test probe
- seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
本发明关于一种测试座，包括座体、承载座、导电板体、测试探针以及绝缘层。该承载座设置于该座体上，用以承载该被测物。该导电板体设置于该座体上且位于该承载座的上方，用以相对于该座体移动而接近或远离该承载座。该测试探针穿设于该导电板体上，且该测试探针伸出于该导电板体的一下表面，用以于该导电板体接近该承载座时与该电性接点接触。该绝缘层设置于该测试探针上或该导电板体上，用以分隔该测试探针以及该导电板体。由此，本发明测试座不但可避免因静电放电而损坏被测物，且可改善测试准确度下降的问题。
The present invention relates to a test seat, including a seat body, a bearing seat, a conductive plate body, a test probe and an insulating layer. The bearing seat is arranged on the seat body to bear the object to be tested. The conductive plate body is arranged on the seat body and is located above the bearing seat, so as to move relative to the seat body to approach or move away from the bearing seat. The test probe is passed through the conductive plate body, and the test probe extends out of a lower surface of the conductive plate body, so as to contact the electrical contact when the conductive plate body approaches the bearing seat. The insulating layer is arranged on the test probe or on the conductive plate body to separate the test probe and the conductive plate body. Therefore, the test seat of the present invention can not only avoid damage to the object to be tested due to electrostatic discharge, but also improve the problem of decreased test accuracy.
Description
Technical field
The present invention is about a kind of test bench, especially with respect to the test bench to test the object with electrical contact.
Background technique
With the development of science and technology, electronic device universalness to personal use person, common electronic device include desktop
Computer, notebook computer, smartphone and tablet computer etc., wherein all include at least one electricity in those electronic devices
Specific function can be performed in road plate, and a settable at least electronic component on circuit board, those electronic components, and by those electricity
Subcomponent cooperating syringe enables electronic device to be driven and operates.It wherein, include multiple conductive junction points on circuit board, with
It is electrically connected at those electronic components.
For Electronic device manufacturers, electronic device has to pass through test in manufacturing process with ensure can normal work
Make.And the test of electronic device includes that test to the circuit board of electronic device and the electronic device completed to manufacture have carried out
The test of whole property, the test to circuit board are deposited in order to avoid discovery circuit plate is defective after electronic device is completed
, it is necessary to electronic device is dismantled to remove the missing of the waste of working hour caused by mistake.
The structure of the test bench of test circuit board will be illustrated next.Referring to Fig. 1, it is the structural representation of existing test bench
Figure.Existing test bench 1 includes pedestal 11, bearing seat 12, plastics plate body 13 and multiple test probes 14, and bearing seat 12 is set to
On pedestal 11, and its function is the tested circuit board 10 of carrying.Plastics plate body 13 is set on pedestal 11 and is located at bearing seat
12 top, the function of plastics plate body 13 are that multiple test probes 14 are arranged thereon, and wherein plastics plate body 13 can be in response to using
The operation of person and it is mobile relative to pedestal 11, with close to or away from bearing seat 12.Multiple test probes 14 are arranged in plastics plate body
On 13 and multiple test probes 14 are vertical with the lower surface of plastics plate body 14, so that multiple test probes 14 can be in plastics plate body 13
When close to bearing seat 12, contacted with the circuit board 10 on bearing seat 12.
When circuit board 10 be placed on bearing seat 12 and it is to be tested when, user operate and make plastics plate body 13 down
It is mobile, and multiple test probes 14 are contacted with multiple electrical contacts (not shown in the figures) corresponding on circuit board 10 respectively.
Power supply later gives circuit board 10 with the electrical functionalities of multiple electrical contacts on circuit for detecting plate 10 (such as resistance value, capacitance
Or inductance value etc.), finally, capturing the actual numerical value of those electrical functionalities and compared with preset electrical numerical value, and judge those
Electrical contact is normal or abnormal, to determine whether circuit board 10 passes through test.During testing circuit board 10, due to multiple
Test probe 14 contacts with multiple electrical contacts respectively and causes the movement of negative ion and can generate static discharge effect, makes
The probability damaged at circuit board 10 is very high.
Therefore, it is necessary to a kind of test benches that can avoid damaging measured object because of static discharge.
Summary of the invention
The technical problem to be solved in the present invention is that In view of the above shortcomings of the prior art, provide one kind avoid because
Static discharge and the test bench for damaging measured object.
The technical solution adopted by the present invention to solve the technical problems is to provide a kind of test bench, tested to test one
Object, and have an electrical contact on the measured object, the test bench include pedestal, bearing seat, conductive plate body, test probe and absolutely
Edge layer.The bearing seat is set on the pedestal, to carry the measured object.The conduction plate body is set on the pedestal and is located at should
The top of bearing seat, to mobile relative to the pedestal close to or away from the bearing seat.The test probe is arranged in the conduction
On plate body and the test probe stretches out in a lower surface of the conduction plate body, to when the conduction plate body is close to the bearing seat with
Electrical contact contact.The insulating layer is set on the test probe or on the conduction plate body, to separate the test probe with
And the conduction plate body.
Preferably, the insulating layer is set on an outer surface of the test probe, and separate the test probe and this is led
Battery plate body and avoid leaky.
Preferably, the insulating layer is to be formed by dielectric ink, and be set to the test with coating method or mode of printing and visit
On the outer surface of needle.
Preferably, the test probe includes outer tube, inner tube, elastic element and needle shaft, which is set to the outer tube
An outer surface on；The inner pipe portion is placed in the outer tube；The elastic element is placed in the inner tube, to provide an elasticity
Power；The needle shank partial volume is placed in the inner tube and the first end and the resilient element contacts of the needle shaft, and the 1 of the needle shaft the
Two ends are contacted with the electrical contact；Wherein when the second end of the needle shaft and the electrical contact contact, the needle shaft is by the electrical property
Contact is pushed against and can be moved relative to the inner tube.
Preferably, an electric current of the measured object is by the electricity when the second end of the needle shaft and the electrical contact contact
Property contact flow to the needle shaft, the inner tube and the outer tube, and the insulating layer that the electric current is arranged on the outer tube is obstructed to keep away
Exempt to enter the conduction plate body, to avoid leaky.
Preferably, the conduction plate body has an aperture, which runs through the conduction plate body, and the insulating layer is set to this and opens
On the side wall in hole, to separate the test probe and the conduction plate body.
Preferably, the insulating layer is that dielectric ink is formed, and is set to being somebody's turn to do for the aperture with coating method or mode of printing
On side wall.
Preferably, an electric current of the measured object is by the electrical contact when the test probe and the electrical contact contact
It flow to the test probe, and the electric current is arranged at the barrier of the insulating layer in the aperture to avoid the conduction plate body is entered, from
And avoid leaky.
Preferably, the bearing seat has multiple fixed cylinders, opened to pass through corresponding multiple fixations in the measured object
Hole, and the measured object is fixed on the bearing seat.
Preferably, the conduction plate body is made by metal material.
Test bench of the present invention solves the problems, such as static discharge by replacing traditional plastics plate body with conductive plate body, and
Insulating layer is set between test probe and conductive plate body and separates test probe and conductive plate body, to avoid electric current by testing
Probe is conducted to conductive plate body and leaks electricity.Therefore, test bench of the present invention can solve asking for static discharge and electric leakage simultaneously
Topic, not only can ensure that measured object is not damaged in test process, and can avoid leading to the problem of test accuracy decline.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing test bench.
Fig. 2 is structural schematic diagram of the test bench of the present invention in the first preferred embodiment.
Fig. 3 is the STRUCTURE DECOMPOSITION signal of the conductive plate body and test probe of test bench of the present invention in the first preferred embodiment
Figure.
Fig. 4 is partial structural diagram of the test bench of the present invention in the first preferred embodiment.
Fig. 5 is that the partial structurtes that the test probe of test bench of the present invention contacts in the first preferred embodiment with measured object are shown
It is intended to.
Fig. 6 is the STRUCTURE DECOMPOSITION signal of the conductive plate body and test probe of test bench of the present invention in the second preferred embodiment
Figure.
Specific embodiment
In view of problem of the prior art, the present invention provides a kind of test bench that can solve prior art problem.It is simple first
Illustrate the structure of test bench of the present invention.Please refer to Fig. 2 and Fig. 3, Fig. 2 is test bench of the present invention in a preferred embodiment
Structural schematic diagram, and Fig. 3 is the conductive plate body of test bench of the present invention and tests structure of the probe in the first preferred embodiment
Decomposition diagram.Test bench 2 of the present invention includes pedestal 21, bearing seat 22, conductive plate body 23, multiple test probes 24, corresponds to
The multiple insulating layers 25 (referring to figure 4.) and transmission line 26 of multiple test probes 24.Bearing seat 22 is set on pedestal 21, and
Its function is carrying measured object 20, and conductive plate body 23 is set to the top on pedestal 21 and being located at bearing seat 22, conductive plate body 23
Can be mobile relative to pedestal 21 in response to the operation of user, with close to or away from bearing seat 22.Multiple test probes 24 are worn
In on conductive plate body 23 and multiple lower surfaces 231 tested probe 24 and stretch out in conductive plate body 23, so that multiple test probes 24
When conductive plate body 23 is close to bearing seat 22, contacted with the measured object 20 on bearing seat 22.The function of insulating layer 25 is that separation is more
A test probe 24 and conductive plate body 23.The function of transmission line 26 is to establish test bench 2 and computer system (not shown in the figures)
Between connection, and transmit the test data of measured object 20 to computer system.In this preferred embodiment, conductive plate body 23 be with
Made by metal material, and measured object 20 is the circuit board with multiple electrical contacts 201.
The invention hair that test bench 2 of the present invention will be illustrated next is thought.Since asking for static discharge can occur for existing test bench 1
Topic, therefore used in test bench 2 of the present invention with conductive plate body 23 made by metal material, conductive plate body 23 has conductive
Effect, bootable negative ion is mobile and static discharge is avoided to damage measured object 20.However, the conductive function of conductive plate body 23
Effect causes measured object 20 that leaky can occur instead, the problem of to cause test accuracy to decline.It is accurate in order to solve test
The problem of degree decline, multiple insulating layers 25 are set in test bench 2 of the present invention, to prevent leaky.
Please refer to Fig. 2~Fig. 4, Fig. 4 is partial structural diagram of the test bench of the present invention in a preferred embodiment.
Conductive plate body 23 has the multiple apertures 232 for corresponding to multiple test probes 24, and Fig. 3 only shows a test probe 24 and phase
Corresponding aperture 232.It tests probe 24 and includes outer tube 241, inner tube 242, elastic element 243, needle shaft 244 and connecting line 245,
242 part of inner tube is placed in outer tube 241, and elastic element 243 is placed in inner tube 242, and function is to provide an elastic force.Needle
In 244 part of axis accommodating inner tube 242 and the first end 2441 of needle shaft 244 is contacted with elastic element 243, and the second of needle shaft 244
End 2442 contacts when conductive plate body 23 is close to bearing seat 22 with the electrical contact 201 on measured object 20.Multiple insulating layers 25 divide
It is not set on the outer surface 2411 of corresponding outer tube 241, connecting line 245 is set on outer tube 241 and is electrically connected at biography
Defeated line 26.In this preferred embodiment, insulating layer 25 is to be formed by dielectric ink, and be arranged with coating method or mode of printing
In on the outer surface of outer tube 241 2411.Whereby, outer tube 241 is not contacted with the aperture 232 of conductive plate body 23, but may pass through aperture
232.And the aperture 232 that probe 24 is arranged in conductive plate body 23 is tested, and insulating layer 25 separates outer tube 241 and aperture 232
Situation is as shown in Figure 4.
The operation situation that the test of measured object 20 is carried out using test bench 2 of the present invention will be illustrated next.Please refer to Fig. 2
~Fig. 5, Fig. 5 are the partial structurtes signal that the test probe of test bench of the present invention contacts in the first preferred embodiment with measured object
Figure.When user's measured object 20 to be tested, measured object 20 is first placed on bearing seat 22, making multiple fixations on bearing seat 22
Cylinder 221 is each passed through the fixation aperture 202 of measured object 20, to fix measured object 20 on bearing seat 22.Next, operation and
So that conductive plate body 23 is moved down, and the second end 2442 of multiple needle shafts 244 respectively with multiple electricity corresponding on measured object 20
Property contact 201 contact.At this point, can not be moved since measured object 20 is fixed, so that electrical contact 201 applies a pushing force extremely
On needle shaft 244, that is, needle shaft 244 pushed against by electrical contact 201 and can be mobile relative to inner tube 242, meanwhile, the of needle shaft 244
One end 2441 pushes against elastic element 243, and elastic element 243 is made to accumulate elastic force by compression.
After measured object 20 is fixed in bearing seat 20, user is powered work, keeps measured object 20 conductive, this
When, multiple test probes 24 can detect electrical numerical value (such as the resistance value, capacitance of corresponding electrical contact 201 respectively
Or inductance value etc.).Later, those electrical numerical value can be transferred to computer system by connecting line 245 and transmission line 26.It is another
Aspect is equipped with test program in computer system, and record has default electrical numerical value, when computer system receives electrical numerical value
When, it can be judged whether measured object 20 passes through test compared with default electrical numerical value.Wherein, when electrical numerical value is equal to or connects
When being bordering on default electrical numerical value, test program can determine whether that electrical contact is normal, and determine that measured object 20 passes through test.Conversely, electric
Property numerical value and when excessive default electrical numerical value difference, test program then judges electrical contact exception, and determines that measured object 20 does not lead to
Cross test.
After the test of measured object 20 is completed, user's operation and control conductive plate body 23 far from bearing seat 22, so as to
Measured object 20 is taken out, meanwhile, multiple test probes 24 are no longer pushed against, and are discharged elastic force in response to elastic element 243 and made to survey
It sounds out needle 24 and returns back to the position before not pushed against.Later, user can place next measured object on bearing seat 22, to carry out
The test of next measured object.
Specifically have two, first, contacted respectively with corresponding electrical contact 201 in multiple test probes 24
When, the electric current caused by conductive measured object 20 flow to needle shaft 244, inner tube 242 and outer tube 241 by electrical contact 201,
Finally the electric current is obstructed by the insulating layer 25 on outer tube 241, to avoid leaky generation.Therefore, the survey of test bench 2 of the present invention
Not but not by electrostatic discharge effect during examination, leaky will not also occur.Second, in this preferred embodiment, insulating layer
25 are set on the outer surface 2411 of outer tube 241, but non-as limit.In another preferred embodiment, insulating layer 35 is arranged
In on the side wall 2321 of the aperture 232 of conductive plate body 23, as shown in Figure 6.When test probe 24 passes through aperture 232 and it is arranged in and leads
When on battery plate body 23, insulating layer 35 can also separate test probe 24 and conductive plate body 23 and avoid test probe 24 and conductive plate
Body 23 contacts, and occurs to avoid electric leakage.
According to above content it is found that test bench of the present invention is by replacing traditional plastics plate body with conductive plate body, and solve
The problem of static discharge, and insulating layer is set between test probe and conductive plate body and separates test probe and conductive plate
Body is conducted to conductive plate body by test probe to avoid electric current.Therefore, test bench of the present invention can solve simultaneously static discharge with
And the problem of electric leakage, not but not measured object is damaged, and test accuracy decline will not be led to the problem of.
The foregoing is merely presently preferred embodiments of the present invention, the scope of the claims being not intended to limit the invention, therefore
It is all other without departing from the equivalent change or modification completed under disclosed spirit, it is intended to be limited solely by patent of the invention
In protection scope.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410635334.6A CN105588957B (en) | 2014-11-12 | 2014-11-12 | Test seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410635334.6A CN105588957B (en) | 2014-11-12 | 2014-11-12 | Test seat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105588957A CN105588957A (en) | 2016-05-18 |
| CN105588957B true CN105588957B (en) | 2019-03-22 |
Family
ID=55928698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410635334.6A Expired - Fee Related CN105588957B (en) | 2014-11-12 | 2014-11-12 | Test seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105588957B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107436382A (en) * | 2016-05-27 | 2017-12-05 | 上海北京大学微电子研究院 | Static discharge current waveforms detection system and method for testing |
| CN106199081A (en) * | 2016-08-25 | 2016-12-07 | 安徽汇展热交换系统股份有限公司 | A kind of Hi-pot Tester auxiliary fixture |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3975680A (en) * | 1975-06-25 | 1976-08-17 | Honeywell Information Systems, Inc. | Non-contact coupling plate for circuit board tester |
| US5204615A (en) * | 1991-10-24 | 1993-04-20 | Interconnect Devices, Inc. | Module attachment for printed circuit board test fixtures |
| US6384618B1 (en) * | 2000-03-15 | 2002-05-07 | Advanced Micro Devices, Inc. | Chip scale electrical test fixture with isolation plate having an angled test hole |
| CN1495870A (en) * | 1994-11-15 | 2004-05-12 | ��ķ�����عɷ�����˾ | Composite intermediate connection element of microelectronic component and its making method |
| TWI416115B (en) * | 2009-11-16 | 2013-11-21 | ||
| TW201403073A (en) * | 2012-06-18 | 2014-01-16 | Jae-Hak Lee | Test socket with conductive powder having through-hole and fabrication method thereof |
| CN203587616U (en) * | 2013-09-05 | 2014-05-07 | 致茂电子股份有限公司 | Detection device with biaxial positioning mechanism |
| TWM485408U (en) * | 2014-04-22 | 2014-09-01 | Chroma Ate Inc | Chip inspection device having horizontal positioning mechanism |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050168231A1 (en) * | 2003-12-24 | 2005-08-04 | Young-Gon Kim | Methods and structures for electronic probing arrays |
| WO2007088395A1 (en) * | 2006-02-03 | 2007-08-09 | Bae Systems Plc | Improvements relating to damage sensors |
| US8478549B2 (en) * | 2010-05-14 | 2013-07-02 | Apple Inc. | Weld check stations |
-
2014
- 2014-11-12 CN CN201410635334.6A patent/CN105588957B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3975680A (en) * | 1975-06-25 | 1976-08-17 | Honeywell Information Systems, Inc. | Non-contact coupling plate for circuit board tester |
| US5204615A (en) * | 1991-10-24 | 1993-04-20 | Interconnect Devices, Inc. | Module attachment for printed circuit board test fixtures |
| CN1495870A (en) * | 1994-11-15 | 2004-05-12 | ��ķ�����عɷ�����˾ | Composite intermediate connection element of microelectronic component and its making method |
| US6384618B1 (en) * | 2000-03-15 | 2002-05-07 | Advanced Micro Devices, Inc. | Chip scale electrical test fixture with isolation plate having an angled test hole |
| TWI416115B (en) * | 2009-11-16 | 2013-11-21 | ||
| TW201403073A (en) * | 2012-06-18 | 2014-01-16 | Jae-Hak Lee | Test socket with conductive powder having through-hole and fabrication method thereof |
| CN203587616U (en) * | 2013-09-05 | 2014-05-07 | 致茂电子股份有限公司 | Detection device with biaxial positioning mechanism |
| TWM485408U (en) * | 2014-04-22 | 2014-09-01 | Chroma Ate Inc | Chip inspection device having horizontal positioning mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105588957A (en) | 2016-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI512302B (en) | Detection system and its detection method | |
| CN101408403B (en) | Height detecting device of elastic contact piece | |
| CN109991528A (en) | A MEMS chip test socket and heating temperature measurement method | |
| CN105588957B (en) | Test seat | |
| CN207689572U (en) | A kind of resistance monitor of mobile fingerprint ring | |
| TW201617626A (en) | Testing base | |
| TWI383160B (en) | Electrical connection defect detection system and method | |
| CN101995525B (en) | Testing device and method | |
| TWI455222B (en) | Testing method for stacked semiconductor device structure | |
| TW201321760A (en) | Printed circuit board testing device | |
| CN105372455A (en) | Camera module test fixture | |
| CN101329379A (en) | Method and device for detecting electronic component pin | |
| TWM429878U (en) | Testing equipment for circuit boards | |
| CN106124832B (en) | A kind of method for measurement and measurement system of component saturation current | |
| CN105789077A (en) | Fingerprint identification chip detection device and operation method thereof | |
| CN105868063B (en) | Method, system and device for writing function detection result and mobile terminal | |
| CN111443279B (en) | Detection auxiliary device and detection device | |
| CN109900962A (en) | Keyboard matrix impedance test device | |
| CN206479563U (en) | Probe apparatus | |
| CN113805006B (en) | A resistance loop electrical testing device | |
| KR101428661B1 (en) | Apparatus for testing | |
| CN106323110A (en) | Simple jig for measuring size of female head interface of cable terminal | |
| CN108615543A (en) | Self checking method for discrete magnitude signal processing chip | |
| TWM547673U (en) | Improved structure of wafer testing probe | |
| JP2012186354A (en) | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190322 Termination date: 20191112 |