TWI372148B - Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process - Google Patents
Photosensitive compound, photosensitive composition, resist pattern forming method, and device production processInfo
- Publication number
- TWI372148B TWI372148B TW097103335A TW97103335A TWI372148B TW I372148 B TWI372148 B TW I372148B TW 097103335 A TW097103335 A TW 097103335A TW 97103335 A TW97103335 A TW 97103335A TW I372148 B TWI372148 B TW I372148B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive
- production process
- forming method
- resist pattern
- pattern forming
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
- C07C37/01—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by replacing functional groups bound to a six-membered aromatic ring by hydroxy groups, e.g. by hydrolysis
- C07C37/055—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by replacing functional groups bound to a six-membered aromatic ring by hydroxy groups, e.g. by hydrolysis the substituted group being bound to oxygen, e.g. ether group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007027367 | 2007-02-06 | ||
JP2007284378 | 2007-10-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200846333A TW200846333A (en) | 2008-12-01 |
TWI372148B true TWI372148B (en) | 2012-09-11 |
Family
ID=39436739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097103335A TWI372148B (en) | 2007-02-06 | 2008-01-29 | Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process |
Country Status (6)
Country | Link |
---|---|
US (2) | US7615332B2 (zh) |
EP (1) | EP1956430A1 (zh) |
JP (1) | JP2009132854A (zh) |
KR (1) | KR100948213B1 (zh) |
CN (1) | CN101256358B (zh) |
TW (1) | TWI372148B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006132425A1 (en) * | 2005-06-08 | 2006-12-14 | Canon Kabushiki Kaisha | Near-field exposure mask, method of producing that mask, near-field exposure apparatus having that mask, and resist pattern forming method |
JP2008098263A (ja) * | 2006-10-10 | 2008-04-24 | Canon Inc | 近接場露光用マスク及び該マスクを用いたレジストパターンの形成方法 |
KR102447189B1 (ko) * | 2018-03-02 | 2022-09-26 | 에이에스엠엘 네델란즈 비.브이. | 재료의 패터닝된 층을 형성하기 위한 방법 및 장치 |
JP7344001B2 (ja) * | 2019-04-11 | 2023-09-13 | 株式会社Adeka | 重合体 |
CN110386720A (zh) * | 2019-06-25 | 2019-10-29 | 广州安赛化工有限公司 | 一种电镀高盐废水纯化及盐分离系统以及处理工艺 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61185741A (ja) | 1985-02-13 | 1986-08-19 | Mitsubishi Chem Ind Ltd | ポジ型フオトレジスト組成物 |
JPH09208574A (ja) * | 1996-02-08 | 1997-08-12 | Mitsui Toatsu Chem Inc | ビスクマリン化合物およびその用途 |
JP2003066600A (ja) * | 2001-06-12 | 2003-03-05 | Canon Inc | フォトレジスト、これを用いた基板の加工方法、及びフォトレジストの製造方法 |
WO2003073168A1 (fr) * | 2002-02-28 | 2003-09-04 | Hitachi Chemical Co., Ltd. | Composition de resine photosensible, procede de formation, avec cette composition, d'elements photosensibles ou de structures de reserve, et procede de production de cartes de circuits imprimes |
JP2005070319A (ja) * | 2003-08-22 | 2005-03-17 | Canon Inc | 近接場露光用フォトレジスト、及びこれを用いた微細パターンの作製方法 |
CN1856742B (zh) * | 2003-09-24 | 2010-11-24 | 日立化成工业株式会社 | 感光性元件、光阻图型的形成方法及印刷电路板制造方法 |
US7867687B2 (en) | 2003-10-15 | 2011-01-11 | Intel Corporation | Methods and compositions for reducing line wide roughness |
US20050221222A1 (en) * | 2004-03-22 | 2005-10-06 | Canon Kabushiki Kaisha | Photosensitive resin composition, resist pattern forming method, substrate processing method, and device manufacturing method |
JP2006013216A (ja) * | 2004-06-28 | 2006-01-12 | Canon Inc | 近接場露光によるレジストパターンの形成方法、及び該レジストパターンの形成方法を用いた基板の加工方法、デバイスの作製方法 |
JP2006019447A (ja) * | 2004-06-30 | 2006-01-19 | Canon Inc | レジストパターンの形成方法、基板の加工方法及びデバイスの作製方法 |
JP2007246418A (ja) | 2006-03-14 | 2007-09-27 | Canon Inc | 感光性シランカップリング剤、パターン形成方法およびデバイスの製造方法 |
JP2007246417A (ja) | 2006-03-14 | 2007-09-27 | Canon Inc | 感光性シランカップリング剤、表面修飾方法、パターン形成方法およびデバイスの製造方法 |
JP5137410B2 (ja) * | 2006-06-09 | 2013-02-06 | キヤノン株式会社 | 感光性化合物、感光性組成物、レジストパターンの形成方法及び基板の加工方法 |
US20080085479A1 (en) | 2006-10-10 | 2008-04-10 | Canon Kabushiki Kaisha | Pattern forming method and device production process using the method |
US7776509B2 (en) | 2007-02-06 | 2010-08-17 | Canon Kabushiki Kaisha | Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process |
-
2008
- 2008-01-28 US US12/021,250 patent/US7615332B2/en not_active Expired - Fee Related
- 2008-01-29 TW TW097103335A patent/TWI372148B/zh not_active IP Right Cessation
- 2008-02-04 JP JP2008024483A patent/JP2009132854A/ja active Pending
- 2008-02-05 KR KR1020080011497A patent/KR100948213B1/ko not_active IP Right Cessation
- 2008-02-05 CN CN200810004858XA patent/CN101256358B/zh not_active Expired - Fee Related
- 2008-02-05 EP EP08151053A patent/EP1956430A1/en not_active Withdrawn
-
2009
- 2009-05-19 US US12/468,830 patent/US20090233232A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW200846333A (en) | 2008-12-01 |
US20080187864A1 (en) | 2008-08-07 |
US20090233232A1 (en) | 2009-09-17 |
EP1956430A1 (en) | 2008-08-13 |
CN101256358B (zh) | 2011-06-22 |
CN101256358A (zh) | 2008-09-03 |
US7615332B2 (en) | 2009-11-10 |
KR20080073655A (ko) | 2008-08-11 |
JP2009132854A (ja) | 2009-06-18 |
KR100948213B1 (ko) | 2010-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |