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TWI372148B - Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process - Google Patents

Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process

Info

Publication number
TWI372148B
TWI372148B TW097103335A TW97103335A TWI372148B TW I372148 B TWI372148 B TW I372148B TW 097103335 A TW097103335 A TW 097103335A TW 97103335 A TW97103335 A TW 97103335A TW I372148 B TWI372148 B TW I372148B
Authority
TW
Taiwan
Prior art keywords
photosensitive
production process
forming method
resist pattern
pattern forming
Prior art date
Application number
TW097103335A
Other languages
English (en)
Other versions
TW200846333A (en
Inventor
Toshiki Ito
Takako Yamaguchi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200846333A publication Critical patent/TW200846333A/zh
Application granted granted Critical
Publication of TWI372148B publication Critical patent/TWI372148B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/01Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by replacing functional groups bound to a six-membered aromatic ring by hydroxy groups, e.g. by hydrolysis
    • C07C37/055Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by replacing functional groups bound to a six-membered aromatic ring by hydroxy groups, e.g. by hydrolysis the substituted group being bound to oxygen, e.g. ether group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28Chemically modified polycondensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14Modified phenol-aldehyde condensates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/108Polyolefin or halogen containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW097103335A 2007-02-06 2008-01-29 Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process TWI372148B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007027367 2007-02-06
JP2007284378 2007-10-31

Publications (2)

Publication Number Publication Date
TW200846333A TW200846333A (en) 2008-12-01
TWI372148B true TWI372148B (en) 2012-09-11

Family

ID=39436739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097103335A TWI372148B (en) 2007-02-06 2008-01-29 Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process

Country Status (6)

Country Link
US (2) US7615332B2 (zh)
EP (1) EP1956430A1 (zh)
JP (1) JP2009132854A (zh)
KR (1) KR100948213B1 (zh)
CN (1) CN101256358B (zh)
TW (1) TWI372148B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132425A1 (en) * 2005-06-08 2006-12-14 Canon Kabushiki Kaisha Near-field exposure mask, method of producing that mask, near-field exposure apparatus having that mask, and resist pattern forming method
JP2008098263A (ja) * 2006-10-10 2008-04-24 Canon Inc 近接場露光用マスク及び該マスクを用いたレジストパターンの形成方法
KR102447189B1 (ko) * 2018-03-02 2022-09-26 에이에스엠엘 네델란즈 비.브이. 재료의 패터닝된 층을 형성하기 위한 방법 및 장치
JP7344001B2 (ja) * 2019-04-11 2023-09-13 株式会社Adeka 重合体
CN110386720A (zh) * 2019-06-25 2019-10-29 广州安赛化工有限公司 一种电镀高盐废水纯化及盐分离系统以及处理工艺

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61185741A (ja) 1985-02-13 1986-08-19 Mitsubishi Chem Ind Ltd ポジ型フオトレジスト組成物
JPH09208574A (ja) * 1996-02-08 1997-08-12 Mitsui Toatsu Chem Inc ビスクマリン化合物およびその用途
JP2003066600A (ja) * 2001-06-12 2003-03-05 Canon Inc フォトレジスト、これを用いた基板の加工方法、及びフォトレジストの製造方法
WO2003073168A1 (fr) * 2002-02-28 2003-09-04 Hitachi Chemical Co., Ltd. Composition de resine photosensible, procede de formation, avec cette composition, d'elements photosensibles ou de structures de reserve, et procede de production de cartes de circuits imprimes
JP2005070319A (ja) * 2003-08-22 2005-03-17 Canon Inc 近接場露光用フォトレジスト、及びこれを用いた微細パターンの作製方法
CN1856742B (zh) * 2003-09-24 2010-11-24 日立化成工业株式会社 感光性元件、光阻图型的形成方法及印刷电路板制造方法
US7867687B2 (en) 2003-10-15 2011-01-11 Intel Corporation Methods and compositions for reducing line wide roughness
US20050221222A1 (en) * 2004-03-22 2005-10-06 Canon Kabushiki Kaisha Photosensitive resin composition, resist pattern forming method, substrate processing method, and device manufacturing method
JP2006013216A (ja) * 2004-06-28 2006-01-12 Canon Inc 近接場露光によるレジストパターンの形成方法、及び該レジストパターンの形成方法を用いた基板の加工方法、デバイスの作製方法
JP2006019447A (ja) * 2004-06-30 2006-01-19 Canon Inc レジストパターンの形成方法、基板の加工方法及びデバイスの作製方法
JP2007246418A (ja) 2006-03-14 2007-09-27 Canon Inc 感光性シランカップリング剤、パターン形成方法およびデバイスの製造方法
JP2007246417A (ja) 2006-03-14 2007-09-27 Canon Inc 感光性シランカップリング剤、表面修飾方法、パターン形成方法およびデバイスの製造方法
JP5137410B2 (ja) * 2006-06-09 2013-02-06 キヤノン株式会社 感光性化合物、感光性組成物、レジストパターンの形成方法及び基板の加工方法
US20080085479A1 (en) 2006-10-10 2008-04-10 Canon Kabushiki Kaisha Pattern forming method and device production process using the method
US7776509B2 (en) 2007-02-06 2010-08-17 Canon Kabushiki Kaisha Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process

Also Published As

Publication number Publication date
TW200846333A (en) 2008-12-01
US20080187864A1 (en) 2008-08-07
US20090233232A1 (en) 2009-09-17
EP1956430A1 (en) 2008-08-13
CN101256358B (zh) 2011-06-22
CN101256358A (zh) 2008-09-03
US7615332B2 (en) 2009-11-10
KR20080073655A (ko) 2008-08-11
JP2009132854A (ja) 2009-06-18
KR100948213B1 (ko) 2010-03-18

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