1364060 九、發明說明： 【發明所屬之技術領域】 本發明涉及真空技術領域，尤其涉及一種真空器件的 .封接裝置以及採用該封接裝置封接真空器件的方法。 .【先前技術】 真空技術於真空電子器件的製造中起著重要的作用， 真空問題越來越引起人們的關注（請參見，Vacuum problems of miniaturization of vacuum electronic component: a new • generation of compact photomultipliers，Vacuum V64, P15-31 -(2002))。真空器件的封接品質對器件的使用壽命具有重要 的影響。 請參閱圖1，先前技術提供了一種真空器件的封接裝置 20以及採用該真空器件的封接裝置20對真空器件進行封接 的方法。該真空器件的封接裝置20包括一真空室202 ; —前 容置室204與後容置室206分別通過第一閘門208與第二閘 門210與該真空室202兩端相連通；一抽真空系統214分別與 籲該前容置室204與後容置室206以及真空室202相連通；至少 一運輸裝置212設置於該真空室202内，該運輸裝置212可於 前容置室204與後容置室206以及真空室202之間運動；一聚 光封口裝置216設置於該真空室202外，該聚光封口裝置216 可通過透光孔218對真空室202内的預封接器件220的排氣 管222進行加熱封接。 採用上述真空器件的封接裝置20對預封接器件22〇進 行封接的方法具體包括以下步驟：提供至少一預封接器件 220，該預封接器件220包括一排氣管222 ;將該至少一預封 9 1364060 接器件220置於前容置室204内的運输裝置212上，對前容置 室204抽真空，使前容置室204與真空室202的真空度相同； 打開第一閘門208使載有預封接器件220的運輸裝置212進 入真空室202後關閉第一閘門208 ;對真空室202抽真空一段 « 時間後，使預封接器件220逐個從聚光封口裝置216下方通 過，通過聚光封口裝置216照射排氣管222，對預封接器件 220進行逐個封接；對後容置室206抽真空，使後容置室206 與真空室202的真空度相同；打開第二閘門210，使封接後 癱的預封接器件220進入後容置室206後關閉第二閘門210 ;將 -封接後的預封接器件220從後容置室206取出。重複上述步 .驟，可實現對複數個預封接器件220的連續封接。 然而，採用上述裝置及方法對真空器件進行封接具有 以下不足：第一，需要於預封接器件220上預先設置一排氣 管222，並將該排氣管222與預封接器件220封接，故，工藝 較為複雜，成本也較高。第二，採用排氣管222排氣封接， 於封裝好的真空器件上就會留下一突起的尾巴狀排氣管， _這對真空器件的安全性和穩定性帶來威脅。第三，排氣管 222於加熱時放出的氣體會進入預封接器件220内，從而影 響真空器件的真空度。另外，上述真空器件的封接裝置需 要專門的聚光封口裝置，提高了製備成本。 有鑒於此，確有必要提供一種真空器件的封接裝置以 及封接方法，該封接裝置無需專門的聚光封口裝置，且該 封接方法可降低製備成本，獲得高真空度，且沒有安全隱 患的真空器件。 【發明内容】 U04U60 一種真空器件的封接裝置，其包括：—真空室；一前 谷置室與-後容置室分別通過第一閑門與第二閉門與該真 空室兩端相連通；一抽真空系統分別與該前容置室、後容 .置室以及真空室相連通；至少—運輸裝置，可于前容置室、 .真空室以及後容置室之間運動；其中，該真空器件的封接 裝置進一步包括.一裝有複數個密封件的外置容器設置於 斤述真工至上方’該外置容器通過一輪入管道與真空室相 修連通，所述輸入管道上設有控制部件；一第一加熱襄置設 置於輸入管道與第二閘門之間的真空室内壁上。 -祕帛上述封接裝置對真^件進行封接的方法， 其包括以下步驟：提供至少一預封接器件，所述預封接器 2包括-殼體以及-排氣孔；將該至少—預封接器件置於 月|J谷置室内的運輸裝置上’並通過該抽真空系統對前容置 至進行抽真空；使載有預封接器件的運輸裝置進入真空 室，通過輸入管道的下方，於每個預封接器件的排氣孔上 #設置一密封件，並加熱使該密封件熔化，從而對預封接器 件的排氣孔進行逐個封接，而後凝固；對後容置室進行抽 真空，並使該封接好的真空器件進入後容置室，且通過後 容置室將該封接好的真空器件取出。 與先前技術相比較，本技術方案提供的真空器件的封 接裝置及封接方法具有以下優點：第一，無 件上預先設置一排氣管，後續也無需一將該排氣管與預封 接器件封接的步驟，簡化了製備工藝。第二，製備得到的 真空器件沒有突起的尾巴狀排氣f，提高了真空器件的安 11 1364060 全性和穩定性。第三，無需排氣管，避免了加熱軟化排氣 管時放出的氣體進入預封接器件内，提高了真空器件的真 空度。第四，該真空器件的封接裝置無需專門的聚光封口 .裝置，降低了製備成本。 .【實施方式】 以下將結合附圖詳細說明本技術方案的真空器件的封 接裝置以及真空器件的封接方法。 請參閱圖2,本技術方案實施例提供了 一種真空器件 鲁的封接裝置30。該真空器件的封接裝置30包括：一真空 •室302 ; —前容置室304與後容置室306分別通過第一閘 •門312與第二閘門314與該真空室302兩端相連通；一抽 真空系統308分別與該前容置室304、後容置室306以及 真空室302相連通；至少一運輸裝置310,可于前容置室 304、真空室302以及後容置室306之間運動；一可控溫的 第一加熱裝置336設置於真空室302内；一外置容器316 鲁設置於真空室302上方，且通過一輸入管道334與真空室 302相連通。 所述真空室302與前容置室304以及後容置室306的 容積不限，可根據實際情況設計。其中，真空室302用來 對預封接器件330進行烘烤、排氣和封接。前容置室304 用來對預封接器件330進行預抽真空，以確保真空室302 内具有較高真空度。後容置室306用來對預封接器件330 進行降溫。且，通過後容置室306可將封接好的電子器件 取出，而不會影響真空室302内的正常工作。 12 1364060 所述抽真空系統308為一機械泵配合一分子泵，或為 一機械泵配合一冷凝泵。其中，機械泵用來抽低真空，分 子泵或冷凝泵用來抽高真空。 • 所述運輸裝置310為一托架或其他運輸裝置。該運輸 .裝置310可連續地運輸複數個預封接器件330,且每次可 運輸複數個預封接器件330。 所述外置容器316設置於真空室302上方，用來裝载 密封件322。該外置容器316與上述抽真空系統308相連 *通。該外置容器316裝滿密封件322後可進行抽真空密封。 •該外置容器316的底部通過一輸入管道334與真空室302 相連通，且該管道334延伸至真空室302内部。其中，所 述密封件322為低熔點玻璃球，且密封件322的直徑大於 排氣孔338的直徑。可以理解，該密封件322也可採用板 狀、錐狀或其他形狀。 輸入管道334位於真空室302外部的部分設有一控制 |部件，該控制部件可為一第一真空傳動桿318與一第二真 空傳動桿320。通過該第一真空傳動桿318與第二真空傳 動桿320，可控制外置容器316内的密封件322逐個進入 真空室302内。具體實現過程為：首先，打開第一真空傳 動桿318，使一密封件322進入第一真空傳動桿318與第 二真空傳動桿320之間；其次，關閉第一真空傳動桿318 ; 然後，打開第二真空傳動桿320，該密封件322進入真空 室302内。 所述可控溫的第一加熱裝置336設置於真空室302的 13 1364060 内壁，且位於輸入管道334與第二閘門314之間的位置。 通過該可控溫的第一加熱裝置336可對落於排氣孔338上 的密封件322進行加熱，使密封件322軟化並將排氣孔338 •封接。進一步，本實施例中，還可於第一閘門312與輸入 .管道334之間設置一可控溫的第二加熱裝置340，用來對 預封接器件330進行烘烤排氣。所述第一加熱裝置336與 第二加熱裝置340可為電熱絲、紅外照射器或鐳射照射器 等。 ® 可以理解，通過所述可控溫的第一加熱裝置336與第 二加熱裝置340可使真空室302使用時，從第一閘門312 —到第二閘門314之間分別形成第一溫度梯度空間324、第 二溫度梯度空間326和第三溫度梯度空間328。其中，第 二加熱裝置340對應於位於第一閘門312與輸入管道334 之間的第一溫度梯度空間324，第一加熱裝置336對應於 位於輸入管道334與第二閘門314之間的第二溫度梯度空 春間326,第三溫度梯度空間328位於第二溫度梯度空間326 與第二閘門314之間。 本實施例中，溫度梯度空間的劃分以圖2中虛線為 准。所述第一溫度梯度空間324為中溫區，用來對預封接 器件330進行烘烤排氣。第二溫度梯度空間326為高溫區， 用來對排氣孔338上的密封件322進行加熱軟化。第三溫 度梯度空間328為低溫區，使軟化的密封件322凝固，將 預封接器件330的排氣孔338封接。其中，第二溫度梯度 空間326的溫度應偏高於密封件322的軟化溫度。 14 1364060 所述第一溫度梯度空間324,第二溫度梯度空間 以及第三溫度梯度空間328的溫度範圍與所選低熔點玻璃 粉的軟化溫度有關。本實施例中，採用軟化溫度為3〇〇它 .的低溶點玻璃粉製備密封件322 〇所述第一溫度梯度空間 .324的溫度範圍為200〜300。(：，第二溫度梯度空間326的 溫度範圍為300〜350Ϊ，第三溫度梯度空間328的溫度範 圍為 50~200°C。 本實施例提供的真空器件的封接裝置30,通過真空室 302内的溫度梯度分佈實現對預封接器件33〇的烘烤排氣 和封接，無需專門的聚光封口裝置，降低了製備成本。 請參閱圖2及圖3,本技術方案實施例進一步提供了 一種採用上述真空器件的封接裝置3〇 •封接真空器件的方 法，其具體包括以下步驟： 步驟一，提供至少一預封接器件33〇，所述預封接器 件330包括一殼體332以及一排氣孔338。 • 所述預封接器件33〇包括一殼體332的材料可為玻 璃，金屬等任何可通過低熔點玻璃粉封接的材料。所述預 封接器件330的大小根據實際情況選擇。所述排氣孔3邓 的孔徑不限，可儘^:開大，然，要根據預封接器件3如的 大小選擇。 本實施例中的預封接器件330為一真空電子器件。殼 體332為玻璃，殼體332上開有一排氣孔338。該預封接 益件330還進一步包括了置於該殼體332内的其他電子元 件（圖中未顯示）。該排氣孔338的孔徑優選為2〜1〇毫米。 15 1364060 可以理解，#氣孔338的孔徑不s太小或太大。孔徑太小 不利於快速㈣，但孔徑太大會料封接後的穩固性。 可以理解，所述預封接器件33〇不限於真空電子器 •件，任何需進行永久性封裝的器件均可。 . 步驟二’將該至少一預封接器件330置於前容置室3〇4 内的運輸裝置310上，並對前容置室3〇4進行抽真空。 首先將預封接器件330按照預定順序排列於運輸裝 籲置310上，且要確保預封接器件33〇的排氣孔向上。 然後，關閉前容置室304，並對前容置室3〇4進行抽 真空。 可以理解，本實施例中，可僅用機械泵對前容置室3〇4 抽低真空，也可先用機械泵對前容置室3〇4抽低真空再 用分子泵或冷凝泵對前容置室3〇4抽高真空，使前容置室 304與真空室302的真空度相同。 步驟三，使該至少一預封接器件330進入真空室302, 鲁並對該至少一預封接器件330進行逐個封接。 首先，打開第一閘門312，使裝有預封接器件33〇的 運輸裝置310進入真空室3〇2後，關閉第一閘門312。 可以理解，預封接器件330進入真空室302後，需要 進一步對真空室3〇2進行抽高真空’以確保預封接器件33〇 可有較咼的真空度。尤其步驟二中沒有對前容置室3〇4抽 鬲真空的情況下，該進一步對真空室3〇2進行抽高真空的 步驟更為必要。 其次，使裝有預封接器件330的運輸裝置310通過第 16 1364060 一溫度梯度空間324。 此過程中完成對預封接器件330的烘烤排氣，並於排 氣結束後使預封接器件330在運輸裝置310的帶動下逐個 *通過輸入管道334的下方。提前打開第一真空傳動桿318, ，使一密封件322進入第一真空傳動桿318與一第二真空傳 動桿320之間，然後關閉第一真空傳動桿318。當預封接 器件330的排氣孔338到達輸入管道334的下方時，打開 第二真空傳動桿320，使一個密封件322通過該輸入管道 鲁334由外置容器316進入真空室302内的預封接器件330 的排氣孔338處。由於密封件322的直徑大於排氣孔338 的直徑，使得該密封件322卡在排氣孔338 口，而不落入 預封接器件330的内部。 本實施例中，所述密封件322的直徑為2〜10毫米， 材料為低熔點玻璃粉。所述第一溫度梯度空間324，第二 溫度梯度空間326以及第三溫度梯度空間328的溫度範圍 φ與所選低熔點玻璃粉的軟化溫度有關。本實施例中，採用 軟化溫度為300°C的低熔點玻璃粉製備密封件322。所述第 一溫度梯度空間324的溫度範圍為200〜300°C，第二溫度 梯度空間326的溫度範圍為300〜350°C，第三溫度梯度空 間328的溫度範圍為50〜200°C。 進一步，該低熔點玻璃粉於製備成密封件322之前先 於真空環境下熔煉約30〜60分鐘。採用真空熔煉後的低熔 點玻璃粉製作的密封件322於後續加熱軟化封接的過程 中，就不會有氣體排出，從而避免了有氣體進入預封接器 17 1364060 件300内，使得封接的真空器件可具有較高的真空度。 再次，使裝有預封接器件330的運輸裝置310通過第 二溫度梯度空間326。 . 此過程中，由於第二溫度梯度空間326的溫度偏高於 ,密封件322的軟化溫度。故，位於排氣孔338上的密封件 322開始軟化，並將排氣孔338封住。 最後，使裝有預封接器件330的運輸裝置310通過第 三溫度梯度空間328。 > 此過程中，由於第三溫度梯度空間328為低溫區，故， 位於排氣孔338上軟化的密封件322開始凝固，並將排氣 '孔338封接。 步驟四，對後容置室306進行抽真空，並使該至少一 預封接器件330進入後容置室306，且通過後容置室306 將該預封接器件330取出。 對後容置室306進行抽真空的過程與對前容置室304 >進行抽真空的步驟相同。當後容置室306的真空度與真空 室302内的真空度相同時，打開第二閘門314。使裝有預 封接器件330的運輸裝置310進入後容置室306後，關閉 第二閘門314。然後，向後容置室306通入氣體，當氣體 的壓強達到大氣壓強後，將封接好的真空器件取出。 進一步，將封接好的真空器件取出前，還包括一對封 接好的真空器件進行冷卻的步驟。冷卻可為自然冷卻，也 可為水冷或風冷。 本技術方案提供的真空器件的封接方法具有以下優 18 1364060 點 弟-，無冶於預封接器件上預先設置—排氣管，後續 也無需-將該排氣管與冊接器件封料 梦 備:藝。第二直製備得到的真空器件沒有突起的二』 ===件的安全性和穩定性。第三，無需排 二7 2 管時放出的氣體進入預封接器 件内，提高了真空器件的真空度。 綜上所述，本發明確已符合發明專利之要件，遂依法 #^出專射請。惟，以上所述者僅為本發明之較佳實施例， 自不能MFM彳本案之申請專利範。舉凡熟悉本案技藝 以士援依本發明之精神所作之等效修飾或變化，皆應涵 盍於以下申請專利範圍内。 【圖式簡單說明】 圖1為先前技術的真空器件的封接裝置的結構示意1364060 IX. Description of the Invention: [Technical Field] The present invention relates to the field of vacuum technology, and more particularly to a vacuum device, a sealing device and a method for sealing a vacuum device using the sealing device. [Prior Art] Vacuum technology plays an important role in the manufacture of vacuum electronic devices, and vacuum problems are attracting more and more attention (see, Vacuum problems of miniaturization of vacuum electronic component: a new • generation of compact photomultipliers, Vacuum V64, P15-31 - (2002)). The sealing quality of vacuum devices has a significant impact on the life of the device. Referring to Fig. 1, the prior art provides a sealing device 20 for a vacuum device and a sealing device 20 using the vacuum device for sealing a vacuum device. The sealing device 20 of the vacuum device comprises a vacuum chamber 202; the front receiving chamber 204 and the rear receiving chamber 206 are respectively connected to the two ends of the vacuum chamber 202 through the first gate 208 and the second gate 210; The system 214 is in communication with the front accommodating chamber 204 and the rear accommodating chamber 206 and the vacuum chamber 202; at least one transport device 212 is disposed in the vacuum chamber 202, and the transport device 212 can be disposed in the front accommodating chamber 204 and Moving between the accommodating chamber 206 and the vacuum chamber 202; a concentrating sealing device 216 is disposed outside the vacuum chamber 202, and the concentrating sealing device 216 can pass through the transparent hole 218 to the pre-sealing device 220 in the vacuum chamber 202. The exhaust pipe 222 is heat sealed. The method for sealing the pre-sealing device 22 by using the sealing device 20 of the vacuum device specifically includes the following steps: providing at least one pre-sealing device 220, the pre-sealing device 220 including an exhaust pipe 222; At least one pre-sealing 9 1364060 is placed on the transport device 212 in the front accommodating chamber 204, and the front accommodating chamber 204 is evacuated to make the front accommodating chamber 204 and the vacuum chamber 202 have the same degree of vacuum; The gate 208 closes the first gate 208 after the transport device 212 carrying the pre-sealing device 220 enters the vacuum chamber 202; after vacuuming the vacuum chamber 202 for a period of time, the pre-sealing device 220 is made one by one from the concentrating and sealing device 216 The pre-sealing device 220 is sealed one by one by the concentrating and sealing device 216, and the vacuum is removed from the rear accommodating chamber 206 to make the vacuum of the rear accommodating chamber 206 and the vacuum chamber 202 the same; The second gate 210 closes the second gate 210 after the sealed pre-sealing device 220 enters the rear housing chamber 206; the sealed sealed pre-sealing device 220 is taken out from the rear housing chamber 206. Repeating the above steps, a continuous sealing of the plurality of pre-sealing devices 220 can be achieved. However, the sealing of the vacuum device by the above device and method has the following disadvantages: First, an exhaust pipe 222 is required to be pre-sealed on the pre-sealing device 220, and the exhaust pipe 222 and the pre-sealing device 220 are sealed. Therefore, the process is more complicated and the cost is higher. Second, the exhaust pipe 222 is used to seal the exhaust, leaving a protruding tail-shaped exhaust pipe on the packaged vacuum device, which poses a threat to the safety and stability of the vacuum device. Third, the gas evolved by the exhaust pipe 222 upon heating enters the pre-sealing device 220, thereby affecting the vacuum of the vacuum device. In addition, the sealing device of the above vacuum device requires a special concentrating sealing device, which increases the manufacturing cost. In view of the above, it is indeed necessary to provide a sealing device for a vacuum device and a sealing method, which does not require a special concentrating sealing device, and the sealing method can reduce the manufacturing cost, obtain a high vacuum, and is not safe. Hidden vacuum devices. SUMMARY OF THE INVENTION U04U60 A sealing device for a vacuum device, comprising: a vacuum chamber; a front valley chamber and a rear housing chamber are respectively connected to the two ends of the vacuum chamber through the first idle door and the second closed door; a vacuum system is respectively connected to the front accommodating chamber, the rear accommodating chamber and the vacuum chamber; at least a transport device is movable between the front accommodating chamber, the vacuum chamber and the rear accommodating chamber; wherein The sealing device of the vacuum device further comprises: an external container with a plurality of sealing members disposed at the upper side of the working body. The external container is connected to the vacuum chamber through a round-in pipe, and the input pipe is provided There is a control component; a first heating device is disposed on the inner wall of the vacuum between the input pipe and the second gate. - a method for sealing a genuine device by the above sealing device, comprising the steps of: providing at least one pre-sealing device, the pre-sealing device 2 comprising - a housing and a venting opening; - the pre-sealing device is placed on the transport device in the month of the valley; and the front is housed to evacuate through the vacuum system; the transport device carrying the pre-sealed device enters the vacuum chamber through the input pipe Below, a sealing member is disposed on the vent hole of each pre-sealing device, and heating is performed to melt the sealing member, thereby sealing the vent holes of the pre-sealing device one by one, and then solidifying; The chamber is evacuated, and the sealed vacuum device is introduced into the rear accommodating chamber, and the sealed vacuum device is taken out through the rear accommodating chamber. Compared with the prior art, the sealing device and the sealing method of the vacuum device provided by the technical solution have the following advantages: First, an exhaust pipe is preset on the component, and the exhaust pipe and the pre-sealing need not be subsequently required. The step of sealing the device simplifies the preparation process. Second, the prepared vacuum device has no protruding tail-shaped exhaust gas f, which improves the integrity and stability of the vacuum device. Thirdly, the exhaust pipe is not required, and the gas released when the heating softens the exhaust pipe is prevented from entering the pre-sealing device, thereby improving the vacuum of the vacuum device. Fourth, the sealing device of the vacuum device does not require a special concentrating seal. The device reduces the manufacturing cost. [Embodiment] Hereinafter, a sealing device for a vacuum device and a sealing method for a vacuum device according to the present invention will be described in detail with reference to the accompanying drawings. Referring to FIG. 2, an embodiment of the present technical solution provides a sealing device 30 for a vacuum device. The sealing device 30 of the vacuum device comprises: a vacuum chamber 302; the front housing chamber 304 and the rear housing chamber 306 are connected to the two ends of the vacuum chamber 302 through the first gate 312 and the second gate 314, respectively. A vacuum system 308 is in communication with the front housing chamber 304, the rear housing chamber 306, and the vacuum chamber 302; at least one transport device 310 is disposed in the front housing chamber 304, the vacuum chamber 302, and the rear housing chamber 306. The movement between the first temperature control unit 336 is disposed in the vacuum chamber 302; an external container 316 is disposed above the vacuum chamber 302 and communicates with the vacuum chamber 302 through an input conduit 334. The volume of the vacuum chamber 302 and the front accommodating chamber 304 and the rear accommodating chamber 306 is not limited and can be designed according to actual conditions. The vacuum chamber 302 is used to bake, vent, and seal the pre-sealing device 330. The front housing chamber 304 is used to pre-vacuate the pre-sealing device 330 to ensure a higher degree of vacuum within the vacuum chamber 302. The rear housing chamber 306 is used to cool the pre-sealing device 330. Moreover, the sealed electronic device can be taken out through the rear accommodating chamber 306 without affecting the normal operation in the vacuum chamber 302. 12 1364060 The vacuuming system 308 is a mechanical pump coupled to a molecular pump, or a mechanical pump coupled to a condensing pump. Among them, the mechanical pump is used to pump low vacuum, and the molecular pump or condensate pump is used to pump high vacuum. • The transport device 310 is a carrier or other transport device. The transport 310 device can continuously transport a plurality of pre-sealed devices 330 and can transport a plurality of pre-sealed devices 330 at a time. The outer container 316 is disposed above the vacuum chamber 302 for loading the seal 322. The external container 316 is connected to the vacuuming system 308. The outer container 316 can be vacuum sealed after filling the sealing member 322. • The bottom of the outer container 316 is in communication with the vacuum chamber 302 through an input conduit 334 and extends into the interior of the vacuum chamber 302. Wherein, the sealing member 322 is a low-melting glass ball, and the diameter of the sealing member 322 is larger than the diameter of the vent hole 338. It will be appreciated that the seal 322 can also take the form of a plate, a cone or other shape. The portion of the input conduit 334 that is external to the vacuum chamber 302 is provided with a control member that can be a first vacuum transmission rod 318 and a second vacuum transmission rod 320. Through the first vacuum transmission rod 318 and the second vacuum transmission rod 320, the seals 322 in the outer container 316 can be controlled to enter the vacuum chamber 302 one by one. The specific implementation process is as follows: first, the first vacuum transmission rod 318 is opened to make a sealing member 322 enter between the first vacuum transmission rod 318 and the second vacuum transmission rod 320; secondly, the first vacuum transmission rod 318 is closed; then, open The second vacuum transmission rod 320 enters the vacuum chamber 302. The temperature-controllable first heating device 336 is disposed on the inner wall of the 13 1364060 of the vacuum chamber 302 and is located between the input pipe 334 and the second gate 314. The seal 322 falling on the vent 338 can be heated by the temperature-controllable first heating means 336 to soften the seal 322 and seal the vent 338. Further, in this embodiment, a temperature-controllable second heating device 340 is further disposed between the first gate 312 and the input conduit 334 for baking and exhausting the pre-sealing device 330. The first heating device 336 and the second heating device 340 may be electric heating wires, infrared illuminators or laser illuminators, and the like. It will be understood that the first temperature gradient space is formed between the first gate 312 and the second gate 314 by the first temperature control device 336 and the second heating device 340 when the vacuum chamber 302 is used. 324, a second temperature gradient space 326 and a third temperature gradient space 328. Wherein, the second heating device 340 corresponds to the first temperature gradient space 324 between the first gate 312 and the input pipe 334, and the first heating device 336 corresponds to the second temperature between the input pipe 334 and the second gate 314. The gradient air spring 326, the third temperature gradient space 328 is located between the second temperature gradient space 326 and the second gate 314. In this embodiment, the division of the temperature gradient space is based on the broken line in Fig. 2. The first temperature gradient space 324 is a medium temperature zone for baking the pre-sealing device 330. The second temperature gradient space 326 is a high temperature zone for heating and softening the seal 322 on the vent 338. The third temperature gradient space 328 is a low temperature zone that solidifies the softened seal 322 to seal the venting opening 338 of the pre-sealing device 330. Wherein, the temperature of the second temperature gradient space 326 should be higher than the softening temperature of the sealing member 322. 14 1364060 The temperature ranges of the first temperature gradient space 324, the second temperature gradient space, and the third temperature gradient space 328 are related to the softening temperature of the selected low-melting glass frit. In the present embodiment, the sealing member 322 is prepared using a low melting point glass frit having a softening temperature of 3 〇. The temperature of the first temperature gradient space .324 is in the range of 200 to 300. (: The temperature range of the second temperature gradient space 326 is 300 to 350 Ϊ, and the temperature of the third temperature gradient space 328 is 50 to 200 ° C. The sealing device 30 of the vacuum device provided in this embodiment passes through the vacuum chamber 302. The internal temperature gradient distribution realizes the baking and sealing of the pre-sealing device 33〇, and does not require a special concentrating sealing device, which reduces the manufacturing cost. Referring to FIG. 2 and FIG. 3 , the embodiment of the present technical solution further provides A sealing device for sealing a vacuum device using the above vacuum device, which comprises the following steps: Step 1: providing at least one pre-sealing device 33, the pre-sealing device 330 comprising a housing 332 and a venting hole 338. The material of the pre-sealing device 33A including a casing 332 may be glass, metal or the like which can be sealed by a low-melting glass frit. The size of the venting hole 3 is not limited, and the opening of the venting hole 3 is not limited, and may be selected according to the size of the pre-sealing device 3. The pre-sealing device 330 in this embodiment is Vacuum electronic device The housing 332 is glass, and the housing 332 is provided with a venting opening 338. The pre-sealing benefit member 330 further includes other electronic components (not shown) disposed within the housing 332. The venting opening The pore diameter of 338 is preferably 2 to 1 mm. 15 1364060 It can be understood that the pore diameter of #孔孔338 is not too small or too large. The pore size is too small to be fast (4), but the pore size is too large to ensure the stability after sealing. It is understood that the pre-sealing device 33 is not limited to a vacuum electronic device, any device that needs to be permanently packaged. Step 2 'Place the at least one pre-sealing device 330 in the front housing chamber 3〇 The transporting device 310 in the 4, and the front housing chamber 3〇4 are evacuated. First, the pre-sealing devices 330 are arranged on the transport device 310 in a predetermined order, and the pre-sealing device 33 is ensured. The vent hole is upward. Then, the front accommodating chamber 304 is closed, and the front accommodating chamber 3 〇 4 is evacuated. It can be understood that in the present embodiment, the front accommodating chamber 3 〇 4 can be pumped down only by the mechanical pump. Vacuum, you can also use a mechanical pump to pump the low pressure in the front housing chamber 3〇4 and then use the molecular pump or The condensing pump draws a high vacuum to the front accommodating chamber 3〇4, so that the vacuum degree of the front accommodating chamber 304 and the vacuum chamber 302 is the same. Step 3, the at least one pre-sealing device 330 enters the vacuum chamber 302, and At least one pre-sealing device 330 is sealed one by one. First, the first gate 312 is opened, and after the transport device 310 equipped with the pre-sealing device 33〇 enters the vacuum chamber 3〇2, the first gate 312 is closed. After the pre-sealing device 330 enters the vacuum chamber 302, it is necessary to further evacuate the vacuum chamber 3〇2 to ensure that the pre-sealing device 33 can have a relatively high degree of vacuum. In particular, there is no front housing chamber in the second step. In the case of a vacuum of 3〇4, it is more necessary to further evacuate the vacuum chamber 3〇2. Next, the transport device 310 incorporating the pre-sealed device 330 is passed through a temperature gradient space 324 of 16 1364060. In this process, the baking venting of the pre-sealing device 330 is completed, and after the exhausting is completed, the pre-sealing device 330 is driven by the transport device 310 one by one through the input pipe 334. The first vacuum transmission rod 318 is opened in advance so that a seal member 322 enters between the first vacuum transmission rod 318 and a second vacuum transmission rod 320, and then the first vacuum transmission rod 318 is closed. When the venting opening 338 of the pre-sealing device 330 reaches below the input conduit 334, the second vacuum transmission rod 320 is opened, and a seal 322 is passed through the input conduit 334 from the external container 316 into the vacuum chamber 302. The venting opening 338 of the device 330 is sealed. Since the diameter of the seal member 322 is larger than the diameter of the vent hole 338, the seal member 322 is caught in the vent hole 338 without falling into the interior of the pre-sealing device 330. In this embodiment, the sealing member 322 has a diameter of 2 to 10 mm, and the material is a low-melting glass frit. The temperature range φ of the first temperature gradient space 324, the second temperature gradient space 326, and the third temperature gradient space 328 is related to the softening temperature of the selected low-melting glass frit. In the present embodiment, the sealing member 322 was prepared using a low-melting glass frit having a softening temperature of 300 °C. The temperature of the first temperature gradient space 324 ranges from 200 to 300 ° C, the temperature of the second temperature gradient space 326 ranges from 300 to 350 ° C, and the temperature of the third temperature gradient space 328 ranges from 50 to 200 ° C. Further, the low-melting glass frit is smelted in a vacuum environment for about 30 to 60 minutes before being prepared into the sealing member 322. In the process of subsequent heating and softening sealing, the sealing member 322 made of the vacuum melting smelting low-melting glass powder does not have gas discharge, thereby preventing gas from entering the pre-sealing device 17 1364060, and sealing is performed. The vacuum device can have a higher degree of vacuum. Again, the transport device 310 incorporating the pre-sealed device 330 is passed through the second temperature gradient space 326. During this process, since the temperature of the second temperature gradient space 326 is higher than the softening temperature of the sealing member 322. Therefore, the seal 322 located on the vent 338 begins to soften and seals the vent 338. Finally, the transport device 310 incorporating the pre-sealed device 330 is passed through a third temperature gradient space 328. > In this process, since the third temperature gradient space 328 is a low temperature zone, the softened seal 322 located on the vent 338 begins to solidify and seals the venting 'hole 338. In the fourth step, the rear housing chamber 306 is evacuated, and the at least one pre-sealing device 330 enters the rear housing chamber 306, and the pre-sealing device 330 is taken out through the rear housing chamber 306. The process of evacuating the rear accommodating chamber 306 is the same as the step of evacuating the front accommodating chamber 304 > When the degree of vacuum of the rear accommodating chamber 306 is the same as the degree of vacuum in the vacuum chamber 302, the second shutter 314 is opened. After the transport device 310 equipped with the pre-sealing device 330 is brought into the rear accommodating chamber 306, the second gate 314 is closed. Then, the gas is introduced into the rear accommodating chamber 306, and when the pressure of the gas reaches a high atmospheric pressure, the sealed vacuum device is taken out. Further, before the sealed vacuum device is taken out, a step of cooling the pair of sealed vacuum devices is further included. Cooling can be either natural cooling or water or air cooling. The sealing method of the vacuum device provided by the technical solution has the following excellent 18 1364060. - No pre-setting of the pre-sealing device - the exhaust pipe, and subsequent need - the exhaust pipe and the sealing device sealing material Dream: Art. The vacuum device obtained by the second straight preparation has no safety and stability of the protrusions. Third, the gas released when the two tubes are not required to enter the pre-sealing device increases the vacuum of the vacuum device. In summary, the present invention has indeed met the requirements of the invention patent, and # 专 专 专 专 专 专. However, the above is only a preferred embodiment of the present invention, and it is not possible to apply for a patent in the present invention. Equivalent modifications or variations made by the Society in accordance with the spirit of the present invention should be within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the structure of a sealing device of a prior art vacuum device.
圖2為本技術方案的真空器件的封接裝置的結構示意 圖3為採用本技術方案的真空器件的封接裝置封接 空器件的流程圖。 【主要元件符號說明】 真空器件的封接裝置 20, 3〇 真空室 202, 302 刖容置室 204, 304 後容置室 206, 306 第一閘門 208, 312 19 1364060 第二閘門 210, 314 運輸裝置 212, 310 抽真空系統 214, 308 •聚光封口裝置 216 .過透光孔 218 預封接器件 220, 330 排氣管 222 外置容器 316 B第一真空傳動桿 318 第二真空傳動桿 320 密封件 322 第一溫度梯度空間 324 第二溫度梯度空間 326 第三溫度梯度空間 328 殼體 332 |輸入管道 334 第一加熱裝置 336 排氣孔 338 第二加熱裝置 340Fig. 2 is a schematic view showing the structure of a sealing device for a vacuum device of the present invention. Fig. 3 is a flow chart showing a sealing device for a vacuum device of the present invention. [Main component symbol description] Vacuum device sealing device 20, 3〇 vacuum chamber 202, 302 刖 accommodating chamber 204, 304 rear accommodating chamber 206, 306 first gate 208, 312 19 1364060 second gate 210, 314 transportation Apparatus 212, 310 evacuation system 214, 308 • concentrating sealing device 216. through light transmission hole 218 pre-sealing device 220, 330 exhaust pipe 222 external container 316 B first vacuum transmission rod 318 second vacuum transmission rod 320 Seal 322 First Temperature Gradient Space 324 Second Temperature Gradient Space 326 Third Temperature Gradient Space 328 Housing 332 | Input Pipe 334 First Heating Device 336 Vent Hole 338 Second Heating Device 340