1339332 丨〇妁^11^15日接正热百j 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤係附加卡之散熱裝置。 【先前技術】 [0002] 隨著近年來高頻圖像處理、無線通訊等技術不斷發展， 散熱將影響圖像卡之正常表面安 裝一散熱器進行散熱。 為使電腦能快速、直接運用最新發展技術，包括顯卡、 視頻圖像卡（VGA卡）在内之附加卡通常裝設在電腦裝置 中用來提高其運算速度、操作能力。例如圖像卡，一般 包括一單獨之處理器，稱作圖像處理器（GPU) ’記憶體 及其他電路元件一同組裝在電路板上。裝設在各種卡上 之電子元件尤其係GPU容量Ί變隹如不能有效 [0003]典型散熱器係通過鋁擠成型，具有較大體積及較高高度 ，包括一從GPU等發熱電子元件上吸熱之底座及從底座延 .^ ' ... 伸出之、用以將熱量向外界.散發之複數散熱片。然而， 附加卡間之距離狹小，無法容納如此大體積之散熱器。 【發明内容】 [0004] 一種散熱裝置，用於對附加卡上之電子元件散熱，該附 加卡具有一頂表面及與該頂表面相對之底表面，該散熱 裝置包括貼設於附加卡頂表面電子元件上之第一散熱體 、與第一散熱體間隔設置之第二散熱體及連接該二散熱 體之一熱管，該熱管包括一蒸發段及一冷凝段，其中該 第二散熱體包括位於附加卡外側之第一散熱部及由該第 一散熱部延伸至附加卡底表面之第二散熱部，熱管之蒸 096126540 表單編號A0101 0993408595-0 1339332 [0005] [0006] [0007] [0008] 096126540 099年11月15日梭正替换頁 發段穿設於第一散熱體中，熱管之冷凝段穿設於第二散 熱體之第二散熱部中。 與習知技術相比，本發明散熱裝置之第二散熱體延伸至 附加卡之底表面，能更好地利用附加卡之背面空間進行 散埶。 »，》、 【實施方式】 請參閱圖1至圖3，為本發明散熱裝置之第一實施例。該 散熱裝置包括給附加卡50之電子元件40散熱之第一散熱 體10、與第一散熱體10間隔設置之第二散熱體20及連接 第一及第二散熱體10、20之熱管30。該附加卡50具有頂 表面及與頂表面相對之底表两，電子元件40設置在頂表 面上，且附加卡50上靠近電子元_.'件:40之四周開設有四個 • . . * 通孔5 9。 第一散熱體10包括貼設在電子元件40表面之一基板120、 一與基板120結合之一散熱器160。固定元件如螺釘180 用於將基板120固定到散熱器160底部。該基板120為一 矩形金屬板體，其上表面中部設丨置有一半圓形溝槽122， 該半圓形溝槽1 22之相對兩側分別設置有一矩形凸條124 ，基板120之四角上分別設置有一通孔126。 該散熱器160通過鋁擠成型，包括一底座161及位於底座 161上間隔設置之複數散熱鰭片162。該底座161朝向附 加卡5 0的一側設有一矩形凹陷部16 3，以收容基板12 0。 基板120收容於凹陷部163後，其底平面與散熱器160底 座161凹陷部163兩側之底平面齊平。該底座161凹陷部 163中央設有一與基板120之溝槽122對應之半圓形溝槽 表單編號A0101 第5頁/共17頁 0993408595-0 1339332 I Γ» ri n λ Λ a ο r~ r-i -Ύ- 11339332 丨〇妁^11^15日正正热百j 六, invention description: [Technical field of invention] [0001] The present invention relates to a heat sink device, particularly a heat sink for an additional card. [Prior Art] [0002] With the continuous development of high-frequency image processing, wireless communication and other technologies in recent years, heat dissipation will affect the normal surface of the image card to mount a heat sink for heat dissipation. In order to enable the computer to quickly and directly use the latest development technology, additional cards, including graphics cards and video image cards (VGA cards), are usually installed in computer devices to improve their computing speed and operation capability. For example, an image card typically includes a separate processor, called a graphics processing unit (GPU)' memory and other circuit components that are assembled on a circuit board. The electronic components mounted on various cards are especially GPU-capable, such as incapable of being effective [0003] Typical heat sinks are extruded through aluminum, having a large volume and a high height, including heat absorption from heat-generating electronic components such as GPUs. The base and the plurality of fins extending from the base. ^ ' ... extending to dissipate heat to the outside. However, the distance between the additional cards is small enough to accommodate such a large volume of heat sink. SUMMARY OF THE INVENTION [0004] A heat sink for dissipating heat from an electronic component on an add-on card having a top surface and a bottom surface opposite the top surface, the heat sink comprising a top surface attached to the additional card a first heat sink disposed on the electronic component, a second heat sink disposed at a distance from the first heat sink, and a heat pipe connecting the heat sinks, the heat pipe including an evaporation section and a condensation section, wherein the second heat sink comprises a first heat dissipating portion outside the additional card and a second heat dissipating portion extending from the first heat dissipating portion to the additional card bottom surface, steaming of the heat pipe 096126540 Form No. A0101 0993408595-0 1339332 [0005] [0006] [0007] 096126540 On November 15, 099, the shuttle replacement section is disposed in the first heat sink, and the condensation section of the heat pipe is disposed in the second heat dissipation portion of the second heat sink. Compared with the prior art, the second heat dissipating body of the heat dissipating device of the present invention extends to the bottom surface of the additional card, and can better utilize the back space of the additional card for diverging. [Embodiment] Please refer to FIG. 1 to FIG. 3, which is a first embodiment of a heat dissipation device of the present invention. The heat sink includes a first heat sink 10 for dissipating heat from the electronic component 40 of the add-on card 50, a second heat sink 20 spaced apart from the first heat sink 10, and a heat pipe 30 connecting the first and second heat sinks 10, 20. The add-on card 50 has a top surface and a bottom surface opposite to the top surface. The electronic component 40 is disposed on the top surface, and the add-on card 50 is adjacent to the electronic component. Through hole 5 9. The first heat sink 10 includes a substrate 120 attached to one surface of the electronic component 40 and a heat sink 160 coupled to the substrate 120. A fixing member such as a screw 180 is used to fix the substrate 120 to the bottom of the heat sink 160. The substrate 120 is a rectangular metal plate body, and a semicircular groove 122 is disposed in a middle portion of the upper surface of the substrate 120. A rectangular rib 124 is disposed on opposite sides of the semicircular groove 12, and the four corners of the substrate 120 are disposed. A through hole 126 is respectively provided. The heat sink 160 is extruded by aluminum and includes a base 161 and a plurality of heat dissipation fins 162 spaced apart from the base 161. A side of the base 161 facing the additional card 50 is provided with a rectangular recess 16 3 for receiving the substrate 120. After the substrate 120 is received in the recessed portion 163, the bottom plane thereof is flush with the bottom plane of both sides of the recessed portion 163 of the bottom plate 161 of the heat sink 160. The bottom of the recess 163 of the base 161 is provided with a semi-circular groove corresponding to the groove 122 of the substrate 120. Form No. A0101 Page 5 / Total 17 Page 0993408595-0 1339332 I Γ» ri n λ Λ a ο r~ ri - Ύ-1
I 丄丄少J 丄 J g K^iill^WR 164，該溝槽122兩側形成與基板120之凸條124相配合之 臺階部（圖未示），該半圓形溝槽164位於該臺階部之中 部。半圓形溝槽164之兩側設置有與基板120之通孔126 相對應之四個螺紋孔168。螺釘180穿過基板12 0之通孔 126並與散熱器160底座161上之螺紋孔168螺合，使基板 120固定於散熱器160之底座161上。在該散熱器160與附 加卡50之通孔59對應處開設有四個通孔166，以供螺桿件 190穿設從而將第一散熱體10固定至附加卡50頂表面。 [0009] 該第二散熱體20由複數相互平行之散熱鰭片依次扣合組 成。每一散熱鰭片均呈L形，包括一第一散熱部221及自 第一散熱部221垂直延伸之一第三政讀辦2¾。其中，該 第一散熱部221位於附加卡^於附加卡50 頂表面所在平面之上方；第二散熱部225由第一散熱部 221之底部邊緣垂直延伸而成且延伸至附加卡50之底表面 ，即，第二散熱部225整體位於附加卡50底表面所在平面 之下方，第二散熱部225之一部分延伸至附加卡50之底表 面，另一部分則同第一散熱部221位於附加卡50之外侧面 ;每一散熱鰭片22之第二散熱部225位於附加卡50外側之 部分開設一通孔，複數散熱鰭片相互連接形成一圓形通 道226。 [0010] 請進一步參閱圖2至圖3，熱管30呈U形，包括一蒸發段32 、平行于蒸發段32之一冷凝段36及連接該蒸發段32、冷 凝段36之連接段34。該蒸發段32通過焊接收容於基板 120之凹槽122與散熱器160底座161之凹槽164共同組成 之孔洞中，該冷凝段36通過焊接收容於第二散熱體20之 096126540 表單編號Α0101 第6頁/共17頁 0993408595-0 1339332 099年11月15日修正替换頁 通道226中。該連接段34包括從蒸發段32彎折延伸而出' 且位於於附加卡50頂表面之第一段342，及從第一段342 向下傾斜彎折延伸而出、且位於附加卡5 0底表面下方之 第二段344。該第二段344位於附加卡50之外側。 [0011] 為增強附加卡50之強度，避免由於第一散熱體10過重而 導致附加卡50變形，該散熱裝置進一步包括一背板60。 該背板60位於附加卡50之底表面、第二散熱體20之第二 散熱部225之上方。該背板60呈十字形，四角上各設有一 螺柱62。四個螺桿件190依次穿過夾合部160上之通孔 166、附加卡50上之通孔59，並與螺柱62螺合而將散熱 裝置固定在附加卡50上。背板60:無附加卡50間設置有隔 • · · · 離墊（圖未示），當該散熱裝置受到外力震動時以提供 緩衝作用。 [0012] 當散熱裝置固定於附加卡50後，第一散熱體10之基板120 之下表面貼合在電子元件40之上表面;同時，熱管30之 蒸發段32緊密收容於散熱器160與基板120形成之通道中 ，熱管30之冷凝段36緊密收容於彳第二散熱體20之通道 226中。此時，熱管30可以將與電子元件40貼合之第一散 熱體10上之熱量傳遞到遠離電子元件40之第二散熱體20 上，進而散發到外界環境中去。 [0013] 請參閱圖4至圖5，為本發明之第二實施例。此散熱裝置 與第一實施例中之散熱裝置相似，同樣包括熱管30及第 二散熱體20。該散熱裝置進一步包括一第一散熱體10a。 該第一散熱體10a包括一基板120a及一夾合部160a，其 中該基板120a之結構與第一實施例中之基板120相同，其 096126540 表單編號A0101 0993408595-0 1339332I 丄丄J 丄J g K^iill^WR 164, a step portion (not shown) is formed on both sides of the groove 122 to cooperate with the ribs 124 of the substrate 120, and the semicircular groove 164 is located at the step Ministry of the Ministry. Four threaded holes 168 corresponding to the through holes 126 of the substrate 120 are disposed on both sides of the semicircular groove 164. The screw 180 is threaded through the through hole 126 of the substrate 12 and screwed into the threaded hole 168 of the base 161 of the heat sink 160 to fix the substrate 120 to the base 161 of the heat sink 160. Four through holes 166 are defined in the heat sink 160 corresponding to the through holes 59 of the additional card 50 for the screw member 190 to pass through to fix the first heat sink 10 to the top surface of the additional card 50. [0009] The second heat dissipating body 20 is composed of a plurality of heat dissipating fins that are parallel to each other. Each of the heat dissipation fins has an L shape, and includes a first heat dissipation portion 221 and a third government office 23b extending perpendicularly from the first heat dissipation portion 221 . The first heat dissipating portion 221 is located above the plane of the top surface of the additional card 50; the second heat dissipating portion 225 extends perpendicularly from the bottom edge of the first heat dissipating portion 221 and extends to the bottom surface of the additional card 50. That is, the second heat dissipation portion 225 is entirely located below the plane of the bottom surface of the additional card 50, one portion of the second heat dissipation portion 225 extends to the bottom surface of the additional card 50, and the other portion is located at the additional card 50 with the first heat dissipation portion 221 The outer side surface of each of the heat dissipating fins 22 defines a through hole in a portion of the outer side of the additional card 50, and the plurality of heat dissipating fins are connected to each other to form a circular channel 226. [0010] Referring further to FIGS. 2 through 3, the heat pipe 30 is U-shaped and includes an evaporation section 32, a condensation section 36 parallel to one of the evaporation sections 32, and a connection section 34 connecting the evaporation section 32 and the condensing section 36. The evaporation section 32 is received in a hole formed by the groove 122 of the substrate 120 and the groove 164 of the base 161 of the heat sink 160 by welding. The condensation section 36 is received by the second heat sink 20 by welding 096126540. Form No. 1010101 No. 6 Page / Total 17 pages 0993408595-0 1339332 Fixed the replacement page channel 226 on November 15, 099. The connecting section 34 includes a first section 342 which is bent from the evaporation section 32 and which is located on the top surface of the additional card 50, and extends downwardly from the first section 342, and is located at the additional card 50. A second section 344 below the bottom surface. This second segment 344 is located on the outside of the add-on card 50. [0011] In order to enhance the strength of the add-on card 50 and avoid deformation of the add-on card 50 due to the excessive weight of the first heat sink body 10, the heat sink further includes a backing plate 60. The back plate 60 is located above the bottom surface of the add-on card 50 and above the second heat sink portion 225 of the second heat sink 20. The back plate 60 has a cross shape, and each of the four corners is provided with a stud 62. The four screw members 190 sequentially pass through the through holes 166 in the nip 160, the through holes 59 in the add-on card 50, and are screwed with the studs 62 to fix the heat sink to the add-on card 50. Back plate 60: No additional card 50 is provided with a partition. • · · · Off-cushion (not shown), when the heat sink is shaken by external force to provide a cushioning effect. [0012] After the heat sink is fixed to the add-on card 50, the lower surface of the substrate 120 of the first heat sink 10 is attached to the upper surface of the electronic component 40; meanwhile, the evaporation section 32 of the heat pipe 30 is closely received in the heat sink 160 and the substrate. In the passage formed by 120, the condensation section 36 of the heat pipe 30 is tightly received in the passage 226 of the second heat sink 20. At this time, the heat pipe 30 can transfer the heat on the first heat sink 10 attached to the electronic component 40 to the second heat sink 20 remote from the electronic component 40, thereby being radiated to the external environment. [0013] Please refer to FIG. 4 to FIG. 5, which are second embodiments of the present invention. This heat sink is similar to the heat sink of the first embodiment, and includes the heat pipe 30 and the second heat sink 20. The heat sink further includes a first heat sink 10a. The first heat sink 10a includes a substrate 120a and a sandwiching portion 160a. The structure of the substrate 120a is the same as that of the substrate 120 in the first embodiment. 096126540 Form No. A0101 0993408595-0 1339332
I ι~ι Ο i~> Ί Ί α Λ τ~ η “ι ι ·*-*· I I 丄丄大I lb 口 中部設置有一半圓形溝槽及四角上分別設置有通孔126a 。該夾合部160a包括一平整之頂部161a、從該頂部161a 相對兩側垂直向下延伸出之連接部162a及從連接部162a 底邊垂直向外延伸之接合部163a。在接合部163a之四角 上分別開設有一通孔166a。該夹合部160a之頂部161a與 基板120a—同形成一通道以收容熱管30之蒸發部32。鏍 杆件190穿過接合部163a上之通孔166a、底座上之通孔 126a及附加卡50上之通孔59而將第一散熱體10a固定在 附加卡50上。第二實施例之其他特徵請參照第一實施例 之對應特徵，在此不贅述。 [0014] 综上所述，本發明符合發明;事利法提出專利 申請。惟，以上所述者僅例，舉凡 、+ ik *· ： 了 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 .I ι~ι Ο i~> Ί Ί α Λ τ~ η “ι ι ·*-*· II 丄丄 Large I lb is provided with a semi-circular groove in the middle of the mouth and a through hole 126a in each of the four corners. The clamping portion 160a includes a flat top portion 161a, a connecting portion 162a extending vertically downward from opposite sides of the top portion 161a, and a joint portion 163a extending perpendicularly outward from a bottom edge of the connecting portion 162a. At the four corners of the engaging portion 163a A through hole 166a is defined in each case. The top portion 161a of the clamping portion 160a forms a channel with the substrate 120a to receive the evaporation portion 32 of the heat pipe 30. The mast member 190 passes through the through hole 166a of the joint portion 163a and the base. The first heat sink 10a is fixed to the additional card 50 through the through hole 126a and the through hole 59 on the additional card 50. For other features of the second embodiment, refer to the corresponding features of the first embodiment, and details are not described herein. In summary, the present invention is in accordance with the invention; the patent application is filed by the benefit method. However, the above-mentioned examples are only examples, and those who are familiar with the skill of the present invention are in accordance with the spirit of the present invention. Modifications or changes shall be covered by the following patents. Brief Description of the drawings].
[0015] 圖1係本發明散熱裝置第一實施例之立體組合圖。 [0016] 圖2係圖1之立體分解圖。 [0017] 圖3係圖1另一視角之立體分解圖。 [0018] 圖4係本發明散熱裝置第二實施例之立體組合圖。 [0019] 圖5係圖4之立體分解圖。 【主要元件符號說明】 [0020] 第一散熱體：10 [0021] 第二散熱體：20 096126540 表單編號A0101 第8頁/共17頁 0993408595-0 1339332 099年11月15日核正替换π [0022] 熱管：30 [0023] 連接段：34 [0024] 蒸發段：32 [0025] 冷凝段：36 [0026] 電子元件：40 [0027] 附加卡：50 [0028] 背板：60 [0029] 螺柱：62 [0030] 第一散熱體：10a [0031] 基板：120、120a [0032] 溝槽：122、164 [0033] 凸條：124 [0034] 底座：161 [0035] 散熱鰭片：162 [0036] 凹陷部：1 6 3 [0037] 螺紋孔：168 [0038] 散熱器：160 [0039] 夾合部：160a [0040] 頂部：161a 096126540 表單編號A0101 第9頁/共17頁 0993408595-0 13393321 is a perspective assembled view of a first embodiment of a heat sink according to the present invention. 2 is an exploded perspective view of FIG. 1. 3 is an exploded perspective view of another perspective of FIG. 1. 4 is a perspective assembled view of a second embodiment of the heat sink of the present invention. [0019] FIG. 5 is an exploded perspective view of FIG. 4. [Main component symbol description] [0020] First heat sink: 10 [0021] Second heat sink: 20 096126540 Form No. A0101 Page 8 / Total 17 pages 0993408595-0 1339332 On November 15, 099, the core is replacing π [ 0022] Heat pipe: 30 [0023] Connection section: 34 [0024] Evaporation section: 32 [0025] Condensation section: 36 [0026] Electronic component: 40 [0027] Additional card: 50 [0028] Backplane: 60 [0029] Stud: 62 [0030] First heat sink: 10a [0031] Substrate: 120, 120a [0032] Trench: 122, 164 [0033] Rib: 124 [0034] Base: 161 [0035] Heat sink fins: 162 [0036] Depression: 1 6 3 [0037] Threaded hole: 168 [0038] Radiator: 160 [0039] Clamping part: 160a [0040] Top: 161a 096126540 Form number A0101 Page 9 / Total 17 page 0993408595 -0 1339332
I Ο Ο 1*^ *1 Λ α Λ Γ- r-1 A*»·—ψ— I 丄丄月丄3 口 [0041] 接合部：l 63a [0042] 螺釘：180 [0043] 螺桿件：190 [0044] 第一散熱部：221 [0045] 第二散熱部：225 [0046] 通道：22 6 [0047] 第一段：342 [0048] 第二段：344 [0049] 通孔：59、126a、126、1 6獻.、’:l:6 6'a: ·/ 、 ....I Ο Ο 1*^ *1 Λ α Λ Γ- r-1 A*»·—ψ— I 丄丄月丄3 口 [0041] Joint: l 63a [0042] Screw: 180 [0043] Screw: 190 [0044] First heat dissipation portion: 221 [0045] Second heat dissipation portion: 225 [0046] Channel: 22 6 [0047] First segment: 342 [0048] Second segment: 344 [0049] Through hole: 59, 126a, 126, 1 6 offer., ':l:6 6'a: ·/, ....
+.W 096126540 表單編號A0101 第10頁/共Π頁 0993408595-0+.W 096126540 Form No. A0101 Page 10 / Total Page 0993408595-0