CN101017388A - heat sink - Google Patents

Abstract

The present invention provides a heat dissipation device suitable for heat dissipation of a display card. The heat dissipation device at least comprises a plurality of heat dissipation fins and a heat pipe. The heat dissipation fins can be fixedly connected through the heat pipe or in conjunction with at least one fixing column, thereby replacing the heat dissipation fins in the conventional technology that need to be fixedly connected to the display card by a bulky and heavy heat dissipation base.

Description

heat sink

Technical field:

The invention relates to a heat dissipation device, in particular to the technical field of fixing heat dissipation fins with a heat conduction pipe.

Background technique:

With the advent of the multimedia era, relevant multimedia information has been applied to various electronic products such as computers or consumer products. In this regard, how the display card can satisfactorily display the calculation results of these computers or consumer electronic products on the screen or other display devices with its high-speed calculation has become an essential requirement in the market. Just as the public expected, the processing speed of the display cards currently on the market has indeed gradually caught up with the market requirements. In fact, in order to achieve the required processing speed, the processors on the graphics cards already have the same function and performance as the central processing unit on the host computer. In this regard, it is conceivable that the processor on the display card must also encounter the problem that the central processing unit on the host computer has been solving for a long time - heat dissipation. Here, the present invention then discloses the more commonly used cooling devices for display cards in the prior art as follows.

Please refer to FIG. 1 , which is a schematic diagram of a heat dissipation device on a display card in the prior art. In FIG. 1 , the heat dissipation device 1 includes a heat dissipation base 10 and a plurality of heat dissipation fins 11 . Wherein, the heat dissipation base 10 has a top surface 101 and a bottom surface 102 , the bottom surface 102 can be attached to a heat source 121 of a display card 12 , and the top surface 101 can be used to vertically extend the plurality of heat dissipation fins 11 . In addition, the above-mentioned heat source 121 is usually a processor on the display card 12 .

Please refer to FIG. 2 , which is a schematic diagram of a heat dissipation device on a display card in the prior art. In FIG. 2 , the heat dissipation device 2 includes a heat dissipation base 10 , a plurality of heat dissipation fins 11 , a heat pipe 20 and a heat conduction sheet 21 . Wherein, the heat dissipation base 10 has a top surface 101 for vertically extending a plurality of heat dissipation fins 11 . The heat pipe 20 can have two ends, one end can be connected to the heat conduction sheet 21 , and the other end can pass through the heat dissipation base 10 . In addition, the heat conduction sheet 21 can generally be used to attach the heat source 121 on the display card 12, whereby the heat source of the heat source 121 transfers heat to the heat conduction pipe 20 through the heat conduction sheet 21, and the heat conduction pipe 20 is then heated by the capillary in the pipe. The phenomenon conducts the heat source to the heat dissipation base 10 . Finally, the heat dissipation base 10 can perform its heat dissipation action through the heat dissipation fins 11 .

Please refer to FIG. 3 , which is a schematic diagram of a heat dissipation device of a display card in the prior art. In FIG. 3 , the heat dissipation device 3 includes a first heat dissipation base 30 , a plurality of first heat dissipation fins 301 , a second heat dissipation base 31 , a plurality of second heat dissipation fins 311 and a heat pipe 20 . Wherein, the first heat dissipation base 30 has a bottom surface 302 and a top surface 303, and the bottom surface 302 can be attached to a plane with the heat source 121 on the display card 12, and the top surface 303 can vertically extend the plurality of The first cooling fins 301 . In addition, the second heat dissipation base 31 also has a bottom surface 312 and a top surface (not shown), and the bottom surface 312 can be attached to another plane (not shown) of the display card 12, and the top surface can be The plurality of second cooling fins 311 are vertically extended. In addition, the heat pipe 20 can directly wrap around two corresponding surfaces of the display card 12 and pass through the first heat dissipation base 30 and the second heat dissipation base 31 . When the heat source at the heat source 121 conducts its heat source through the bottom surface 302 of the first heat dissipation base 30 , the heat source can simultaneously dissipate heat through the first heat dissipation fins 311 or spread the heat source to the second heat dissipation base 31 through the heat pipe 20 , and the heat is dissipated by the second heat dissipation fins 311 .

Please refer to FIG. 4 , which is a schematic diagram of a heat dissipation device of a display card in the prior art. In FIG. 4 , the heat dissipation device 4 includes a first heat dissipation base 30, a plurality of first heat dissipation fins 301, a first heat pipe 40, a heat conduction sheet 21, a second heat dissipation base 31, and a plurality of second heat dissipation fins. sheet 311 and a second heat pipe 41 . Wherein, the first heat dissipation base 30 has a top surface 303 that can vertically extend the plurality of first heat dissipation fins 301 . The first heat pipe 40 can have two ends, one end can be connected to the heat conduction sheet 21 , and the other end can pass through the first heat dissipation base 30 . The heat conducting sheet 21 is generally used for the heat source 121 attached to the display card 12 . In addition, the second cooling base 31 also has a bottom surface 312 and a top surface (not shown), and the bottom surface 312 is attached to another plane (not shown) of the display card 12, and the top surface can stand upright. The plurality of second cooling fins 311 are extended. In addition, the second heat pipe 41 can directly wind around two corresponding planes of the display card 12 and run through the first heat dissipation base 30 and the second heat dissipation base 31 . When the heat source of the heat source 121 absorbs heat to the first heat pipe 40 through the heat conduction sheet 21 , the first heat pipe 40 conducts the heat source to the first heat dissipation base 30 by the capillary phenomenon in the pipe. Finally, the first heat dissipation base 30 can perform its heat dissipation action through its heat dissipation fins 301 . Furthermore, when the heat source is conducted to the first heat dissipation base 30, the above heat source can simultaneously disperse the heat source to the second heat dissipation base 31 through the second heat pipe 41 by its capillary phenomenon, and then the second heat dissipation fins 311 carry out the heat dissipation. Heat dissipation.

Looking at the cooling device of the above-mentioned prior art, at least the following deficiencies are included:

(1) The heat dissipation fins in the heat dissipation device all rely on their heat dissipation bases as their extensions and their bearing bases. However, the cooling base in the prior art is usually relatively heavy and its volume usually occupies most of the area of the display card, resulting in a relatively large volume and weight of the display card.

(2) When the heat pipe in the heat dissipation device passes through the heat dissipation base, the heat source is then transmitted through the contact between the outer wall through which the heat pipe penetrates and the inner wall through which the heat dissipation base penetrates. However, the outer wall of the heat pipe and the inner wall of the heat dissipation base are usually not in close contact, so that there is only a relatively small heat transfer area between the heat pipe and the heat dissipation base, thereby affecting the heat transfer effect.

(3) The heat dissipation fins in the heat dissipation device need to be extended and carried by the heat dissipation base, so that it is impossible to flexibly allocate the heat dissipation fins to the electronic components on the display card or their possible heating edges, for example The heat dissipation fins are divided into blocks and can be elastically distributed and intermingled between the electronic components on the display card.

(4) Since the heat dissipation device must rely on the bulky and bulky heat dissipation base, the display card must have sufficient fastening or fastening force so that the heat dissipation device can be tightly fastened or fastened to the display. On the card, so that when the display card is affected by an external force, the cooling device will not be separated from the original position of the display card due to its shaking. This usually makes the heat source on the display card unable to effectively dissipate heat through its cooling device, and may easily cause damage to the electronic components on the display card due to insufficient heat dissipation.

According to the above-mentioned conventional technology, most of the cooling devices conduct heat conduction and heat dissipation to a heat source surface on the display card, such as the heat source on the top surface of the processor on the display card. As everyone knows, the heat source of the display card will also generate some heat source from the other side of the display card, such as the above-mentioned solder joint of the processor. In this regard, how to eliminate this heat source is also a problem to be solved.

Invention content:

In view of the lack of the first item of the above-mentioned conventional technology, the heat dissipation device of the present invention provides the first structural improvement, which is suitable for a display card and the display card has a first plane and a second plane corresponding to the first plane, The bulky and heavy heat dissipation base in the prior art can be avoided, so that the heat dissipation device has a small volume and relatively light weight. The heat dissipation device mentioned here includes a plurality of heat dissipation fins and a heat pipe. Wherein, the heat pipe can be used as the heat conduction medium and the supporting frame of the plurality of heat dissipation fins at the same time. In the above-mentioned supporting method, one end of the heat dissipation fins can be fixedly connected to the outer wall of the heat conduction pipe, so that the heat dissipation fins can form a vertically extending shape on the outer wall of the heat conduction pipe respectively. Alternatively, the heat dissipation fins can be fixed on the outer wall of the heat conduction pipe through the heat conduction pipe and a fixing post to penetrate through the heat dissipation fins. In addition, the heat dissipation device mentioned here no longer needs the heat dissipation base in the prior art, so the heat dissipation fins of the present invention can be selectively arranged on the first plane or the second plane of the display card, and The above-mentioned heat pipe or at least one fixed column can be wound between the corresponding two planes of the display card to serve as the support and heat conduction medium for the heat dissipation fins.

In view of the lack of the second item of the above-mentioned conventional technology, the heat dissipation device of the present invention provides the second structural improvement, which is suitable for a display card and the display card has a first plane and a second plane corresponding to the first plane, so that In the conventional technology, the heat pipe runs through the heat dissipation base. Instead, the heat pipe can be connected with at least one fixing column to pass through the heat dissipation fins, so that the penetration of the heat pipe and the heat dissipation fin can be more closely bonded. The bonding area can have a certain degree of bonding area, so that a certain degree of heat conduction area can be maintained between the heat pipe and the heat dissipation fin, thereby improving the effect of heat source conduction. In addition, the second structural improvement mentioned here can be combined with the above-mentioned first structural improvement, so that when the heat pipe penetrates or is affixed to the heat dissipation fin, the heat conduction pipe and the heat dissipation fin pass through or are fixed. for a tighter fit. In this way, a certain degree of bonding area can be provided at the penetration or fixed joint, so that a certain degree of heat conduction area can be maintained between the heat pipe and the heat dissipation fin, thereby improving the effect of heat source conduction. The heat dissipation device mentioned here includes a plurality of heat dissipation fins and a heat pipe. When the heat pipe can pass through its heat dissipation fins, each of these heat dissipation fins has a hole and the holes left by the holes are still connected to an edge of the hole. And when the heat pipe runs through the holes of the heat dissipation fins, the holes connected by these holes can be attached to the outer wall through which the heat pipe passes. Or, when the heat pipe can be affixed to one side end of the cooling fin, this side end can extend a bent wing again, and the side end of these cooling fins can be attached to the fixed connection required by the heat conducting tube by means of the bent wing. on the outer wall.

In view of the lack of item 3 of the above-mentioned conventional technology, the heat dissipation device of the present invention provides a third structural improvement, which is suitable for a display card and the display card has a first plane and a second plane corresponding to the first plane, which can eliminate the need for conventional According to the heat dissipation base in the known technology, the heat dissipation fins are grouped according to the actual needs of the designer and the two corresponding planes of the display card are partitioned by the above-mentioned first structural improvement. In this way, the distribution of these cooling fins must be effectively distributed. The heat dissipation device mentioned here at least includes a first heat dissipation block, a second heat dissipation block and a plurality of heat pipes. Wherein, the first heat dissipation block can be arranged on the first plane or the second plane, and a plurality of first heat dissipation fins can be arranged on the block. The second heat dissipation block can be arranged on the first plane or the second plane, and a plurality of second heat dissipation fins can be arranged on the block. Here, these first heat dissipation fins and second heat dissipation fins do not need to be formed on any heat dissipation base, and like the above-mentioned first structural improvement, it means that the above-mentioned plurality of heat pipes or at least one fixed column can be used The first heat dissipation fins and the second heat dissipation fins are selectively penetrated or fixed.

In view of the lack of item 4 of the above-mentioned conventional technology, the heat dissipation device of the present invention provides a fourth structural improvement, which is suitable for a display card and the display card has a first plane and a second plane corresponding to the first plane, which can provide a Sufficient locking and a locking force enable the cooling device to be tightly locked and locked on the graphics card. The heat dissipation device here at least includes a plurality of heat dissipation fins, a back plate structure and a heat pipe. Wherein, the cooling fins can be arranged on the first plane. The backplane structure can be arranged on the second plane and have at least one stud passing through the first plane from the second plane, so that the backplane structure can be pre-locked on the second plane of the display card. In addition, the heat pipe can be arranged on the first plane and run through the heat dissipation fins. In addition, the back plate structure can further include a fastening member, and the fastening member can extend from the back plate structure, so as to perform a fastening action with a fastening plate extended from the heat dissipation fins. The backplane structure here can also be applied to a heat dissipation device with a heat dissipation base as in the prior art or a heat dissipation device without a heat dissipation base as in the above-mentioned first structural improvement. When the heat dissipation device has a heat dissipation base, the back plate structure can directly pass through the above-mentioned studs from the second plane to the first plane, and then lock the heat dissipation base on the first plane by the nuts corresponding to the above-mentioned studs. In addition, when the heat dissipation device does not have a heat dissipation base, the back plate structure can be locked on the second plane by the studs of the back plate structure and the corresponding nuts first, and then the above-mentioned fastening member can be used to lock the back plate structure on the second plane. And the fastening plate, so that the backplane structure can be fastened to these cooling fins. Please note that the back plate structure here can also be used as a heat dissipation panel, and the fastening member and the fastening plate can be a heat conductor. In this regard, when the studs contact the heat dissipation base or the fastening member and the fastening plate contact the heat dissipation fins, part of the heat source of the heat dissipation device can be guided to the back plate structure for heat dissipation.

In view of the lack of the fifth item of the above-mentioned conventional technology, the heat dissipation device of the present invention provides a fifth structural improvement, which is suitable for a display card and the display card has a first plane and a second plane corresponding to the first plane, which can simultaneously provide Dissipating heat source of electronic components or their welding places on the first plane and the second plane. The heat dissipation device mentioned here at least includes a plurality of heat dissipation fins and a back plate structure. Wherein, a plurality of cooling fins can be arranged on the first plane, and a heat pipe can pass through the cooling fins. The back plate structure can be arranged on the second plane and has at least one flange attached to a heat source on the second plane. In addition, the backplane structure may have a stud passing through the first plane and the second plane for the backplane structure to be locked on the second plane. Furthermore, the back plate structure further includes extending a fastening member from the second plane around to the first plane to fasten a fastening plate extending correspondingly to the cooling fins. The backplane structure here can also be applied to heat dissipation devices with heat dissipation bases in the prior art. At this time, the backplane structure can directly penetrate the first plane from the second plane through the above-mentioned studs, and continue by corresponding to the above-mentioned The nuts of the studs lock the heat dissipation base on the first plane for the backplane structure and the heat dissipation base to be locked on the display card.

Description of drawings:

1 to 4 are schematic diagrams of four heat dissipation devices of a display card in the prior art;

Fig. 5 is a three-dimensional schematic diagram of the heat dissipation device proposed by the first structural improvement of the present invention;

FIG. 6 is another schematic perspective view of the heat sink provided by the first structural improvement of the present invention;

FIG. 7 is a three-dimensional schematic diagram of the heat dissipation device provided by the second structural improvement of the present invention;

FIG. 8 is another schematic perspective view of the heat sink provided by the second structural improvement of the present invention;

FIG. 9 is a three-dimensional schematic diagram of a second structural improvement of the present invention and a heat dissipation device;

FIG. 10 is a three-dimensional schematic diagram of the heat dissipation device provided by the third structural improvement of the present invention;

Fig. 11 is a schematic perspective view of the heat sink provided by the fourth structural improvement of the present invention;

Fig. 12 is another schematic perspective view of the heat sink provided by the fourth structural improvement of the present invention;

Fig. 13 is a schematic perspective view of the heat dissipation device proposed by the fifth structural improvement of the present invention;

Fig. 14 is another schematic perspective view of the heat sink provided by the fifth structural improvement of the present invention;

FIG. 15 is a three-dimensional schematic view of the heat dissipation device provided by the third structural improvement of the present invention.

Description of figure number:

1: cooling device; 10: cooling base; 11: cooling fins;

101: top surface; 102: bottom surface; 12: display card;

121: heat source; 2: cooling device; 20: heat pipe;

21: heat conduction sheet; 3: heat dissipation device; 30: first heat dissipation base;

301: the first cooling fin; 302: the bottom surface; 303: the top surface;

31: second heat dissipation base; 311: second heat dissipation fins; 312: bottom surface;

4: cooling device; 40: the first heat pipe; 41: the second heat pipe;

5: cooling device; 50: cooling fins; 51: heat pipe;

511: fixed column; 52: first plane; 53: heat conduction plate;

6: cooling device; 7: cooling device; 70: cooling fins;

701: hole; 702: hole sheet; 703: outer wall;

71: second plane; 711: heat source; 8: cooling device;

80: heat dissipation base; 9: heat dissipation device; 90: curved wing;

91: Outer wall; 100: Heat dissipation device; 1001: The first heat dissipation block;

1002: the second cooling block; 1003: the third cooling block;

1004: the fourth heat dissipation block; 1005: the first heat dissipation fin;

1006: the second cooling fin; 1007: the third cooling fin;

1008: the fourth cooling fin; 1009: electronic components;

1101: cooling fins; 11011: fastening plate 1102: back plate structure;

11021: Stud; 11022: Fastening component; 11023: Opening;

1301: back plate structure; 13011: flange.

Detailed ways:

Please refer to FIG. 5 , which is a three-dimensional schematic view of the heat dissipation device proposed by the present invention for the above-mentioned first structural improvement. In FIG. 5 , the heat dissipation device 5 includes a plurality of heat dissipation fins 50 , a heat pipe 51 and at least one fixing column 511 . Wherein, these heat dissipation fins 50 can be arranged on a first plane 52 of a display card 12 and can use the heat pipe 51 and can cooperate with the fixing column 511 to penetrate these heat dissipation fins 50, as the support between the heat dissipation fins 50 Fixed use. In addition, in FIG. 5 , the heat source can be transmitted between the heat dissipation fins 50 and the heat source 121 through a heat conduction plate 53 . The heat dissipation fins 50 pass the heat source from the heat conduction plate 53 through the heat conduction tube 51 to surround these heat dissipation fins 50 , so that the heat source can be conducted and distributed on each heat dissipation fin 50 to perform its heat dissipation action. Furthermore, the heat pipe 51 can optionally surround the first plane 52 and the second plane (not shown in the figure) of the display card, so that these cooling fins 50 can be selectively arranged on the first plane 52 and the second plane (not shown in the figure). not shown).

Please refer to FIG. 6 , which is another three-dimensional schematic view of the heat dissipation device proposed by the present invention for the above-mentioned first structural improvement. In FIG. 6 , the heat dissipation device 6 may include a plurality of heat dissipation fins 50 , a heat pipe 51 and at least one fixing column 511 . Here, the cooling fins 50 can have one end 501 fixed on an outer wall of the heat pipe 51 . Wherein, the heat dissipation fins 50 and the outer wall of the heat pipe 51 may form a vertically extending shape. Furthermore, the fixing posts 511 can penetrate through the heat dissipation fins 50 to make the connection between the heat dissipation fins 50 more stable.

Please refer to FIG. 7 , which is a three-dimensional schematic diagram of the heat dissipation device proposed by the present invention for the above-mentioned second structural improvement. In FIG. 7 , the heat dissipation device 7 includes a plurality of heat dissipation fins 70 , a heat pipe 51 and at least one fixing column 511 . Wherein, each thermal fin 70 may be provided with a hole 701 and a corresponding hole 702 is left on an edge of the hole 701 . The heat pipe 51 can then pass through the holes 701 and make the holes 702 adhere to the outer wall 703 where the heat pipe 51 passes. Here, the heat dissipation device 7 can be pasted on the heat source 121 of the first plane 52 of the display card 12 by using a heat conduction plate 53 . In addition, the heat pipe 51 can be selectively wound around the first plane 52 and the second plane 71 of the display card 12 , so that the cooling fins 70 can be selectively disposed on the first plane 52 and the second plane 71 . Furthermore, the fixing posts 511 can penetrate through the heat dissipation fins 70 , so that the connection relationship between the heat dissipation fins 70 is more stable.

Please refer to FIG. 8 , which is another schematic perspective view of the heat dissipation device proposed by the present invention for the above-mentioned second structural improvement. In FIG. 8 , the heat dissipation device 8 includes a heat dissipation base 80 , a plurality of heat dissipation fins 70 and a heat pipe 51 . Wherein, the heat dissipation base 80 can be arranged on the first plane 52 or the second plane 71 of the display card 12 according to the designer's design requirement. The heat dissipation fins 70 can be disposed on the heat dissipation base 80 and form an upright extension. In addition, as shown in FIG. 7 , these cooling fins 70 can each have a hole 701 and a hole 702 can be left at an edge of the holes 701 . The heat pipe 51 can pass through the holes 701 so that the holes 702 can be attached to the outer wall 703 of the heat pipe 51 .

Please refer to FIG. 9 , which is a three-dimensional schematic diagram of a heat dissipation device according to the second structural improvement of the present invention. In FIG. 9 , the heat dissipation device 9 includes a plurality of heat dissipation fins 70 , a heat pipe 51 and at least one fixing column 511 . The cooling fins 70 can be disposed on the first plane 52 of the display card 12 , and each of the cooling fins 70 has a curved wing 90 extending from one end thereof. The heat pipe 51 can be attached to the outer wall 91 where the heat pipe 51 is connected by using the curved wings 90 to form an upright extension. In addition, the heat pipe 51 can be selectively wound around the first plane 52 and the second plane 71 of the display card 12, so that the cooling fins 70 can be selectively arranged on the first plane 52 and the second plane 71. In addition, the fixing posts 511 can pass through the heat dissipation fins 70 to make the connection between the heat dissipation fins 70 more stable.

Please refer to FIG. 10 and FIG. 15 , which are three-dimensional schematic diagrams of the heat dissipation device proposed by the present invention for the above-mentioned third structural improvement. In Fig. 10, the heat dissipation device 100 includes a first heat dissipation block 1001, a second heat dissipation block 1002, a third heat dissipation block 1003, a fourth heat dissipation block 1004, a plurality of heat dissipation pipes 51 and a plurality of fixed Column 511. Wherein, the above-mentioned cooling blocks 1001, 1002, 1003 and 1004 can be set on the first plane 52 of the display card 12 or its second plane (not shown in the figure) and each cooling block 1001, 1002, 1003 and 1004 can be There are respectively a plurality of first heat dissipation fins 1005 , a plurality of second heat dissipation fins 1006 , a plurality of third heat dissipation fins 1007 and a plurality of fourth heat dissipation fins 1008 . Here, the heat dissipation pipe 51 and the fixing column 511 can be selectively connected to the heat dissipation fins 1005 , 1006 , 1007 and 1008 of the above heat dissipation blocks 1001 , 1002 , 1003 and 1004 . In addition, the cooling blocks 1001, 1002, 1003, and 1004 described here can be grouped or partitioned according to the needs of the designer. For example, the partitions of the designer can be based on the electronic components 1009 such as capacitors on the display card 12. Set up a position to avoid. In addition, the heat dissipation block can protrude from the display card 12 as needed, such as the heat dissipation block 1002 shown in FIG. 15 .

Please refer to FIG. 11 , which is a three-dimensional schematic diagram of the heat dissipation device proposed by the present invention for the above-mentioned fourth structural improvement. In FIG. 11 , the heat dissipation device includes a plurality of heat dissipation fins 1101 , a back plate structure 1102 and a heat pipe 51 . Wherein, the cooling fins 1101 can be disposed on the first plane (not shown) of the display card 12 . The back plate structure 1102 can include at least one stud 11021 and a fastening member 11022 . The heat pipe 51 can cooperate with at least one fixing column 511 to pass through the cooling fins 1101 . In addition, the backplane structure 1102 can be arranged on the second plane 71 of the display card 12 and penetrate the second plane 71 and the first plane (not shown) of the display card 12 through the studs 11021, so that the backplane structure 1102 can be pre-installed. After being locked on the second plane 71 , the fastening member 11022 of the back plate structure 1102 is fastened with a fastening plate 11011 extending from the cooling fin 1101 . Moreover, the designer can further provide at least one opening 11023 on the backplane structure 1102 according to the ventilation or avoidance of electronic components.

Please refer to FIG. 12 , which is another schematic perspective view of the heat dissipation device proposed by the present invention for the fourth structural improvement. In FIG. 12 , the heat dissipation device includes a heat dissipation base 80 , a plurality of heat dissipation fins 1101 , a back plate structure 1102 and a heat pipe 51 . Wherein, the heat dissipation fins 1101 can be disposed on a first plane (not shown) of the display card 12 and can form a vertically extending shape from the heat dissipation base 80 . The backboard structure 112 can include at least one stud 11021 and a fastening member 11022 . The heat pipe 51 can cooperate with at least one fixing column 511 to pass through the cooling fins 1101 . In addition, the backplane structure 1102 can be arranged on the second plane 71 of the display card 12 and can pass through the second plane 71 and the first plane (not shown) of the display card 12 through the studs 11021 . The nut (not shown) of the stud 11021 locks the heat dissipation base 80 on the first plane (not shown). In addition, the fastening member 11022 of the back plate structure 1102 can be fastened with a fastening plate 11011 extending from the heat dissipation bottom plate 80 . Furthermore, the designer may further provide at least one opening 11023 on the backplane structure 1102 to satisfy the designer's need to design possible ventilation or possible avoidance of electronic components.

The back plate structure 1102 mentioned above in FIG. 11 and FIG. 12 can also be used as a heat dissipation panel, and the fastening member 11022 and the fastening plate 11011 can be a heat conductor. In this regard, when the path of the stud 11021 contacts the heat dissipation base 80 or the fastening member 1122 and the fastening plate 1110 contact each other, part of the heat source of the heat dissipation device can be guided to the back plate structure 1102 for heat dissipation.

Please refer to FIG. 13 , which is a three-dimensional schematic diagram of the heat dissipation device proposed by the present invention for the above-mentioned fifth structural improvement. In FIG. 13 , the heat dissipation device includes a plurality of heat dissipation fins 1101 , a heat pipe 51 and a back plate structure 1301 . Wherein, the heat dissipation fins 1101 are disposed on the first plane 52 and are penetrated and fixed through the heat pipe 51 . The back plate structure 1301 is disposed on the second plane 71 and has at least one flange 13011 that can fit at least one heat source 711 on the second plane 71 . In addition, the backplane structure 1301, like the backplane structure described in FIG. 11 , may have a stud (not shown) passing through the second plane 71 and the first plane 52 for locking the backplane structure 1301 on the second plane 71. superior. Furthermore, the backplane structure 1301, like the backplane structure described in FIG. 11 , may further include extending a fastening member (not shown) from the second plane 71 around the first plane 52 to buckle the cooling fins 1101. Correspondingly extending a fastening plate (not shown).

Please refer to FIG. 14 , which is another three-dimensional schematic diagram of the heat dissipation device proposed by the present invention for the above-mentioned fifth structural improvement. In FIG. 14 , the heat dissipation device includes a heat dissipation base 80 , a plurality of heat dissipation fins 1101 , a heat pipe 51 and a back plate structure 1301 . Wherein, the heat dissipation base 80 can be disposed on the first plane 52 of the display card 12 according to the designer's design requirement. The heat dissipation fins 70 can be disposed on the heat dissipation base 80 and form an upright extension. In addition, the heat dissipation fins 1101 can conduct heat through the heat pipe 51 . In addition, the back plate structure 131 is disposed on the second plane 71 and has at least one flange 13011 attached to at least one heat source 711 on the second plane 71 . In addition, the backplane structure 1301, like the backplane structure described in FIG. 12 , may have a stud (not shown) passing through the second plane 71 and the first plane 52 for locking the backplane structure 131 on the second plane 71. superior. Moreover, the backplane structure 1301, like the backplane structure described in FIG. 12 , may further include extending a fastening member (not shown) from the second plane 71 to the first plane 52 to fasten the corresponding extension of the heat dissipation base 80. A fastening plate (not shown).

The above description is to illustrate the present invention with preferred embodiments, but not to limit the scope of the present invention. All those who are familiar with this type of art can understand that appropriate and slight changes and adjustments will still not lose the gist of the present invention, nor depart from the spirit and scope of the present invention.

Claims (12)

1, a kind of heat abstractor is used for that a display card and this display card have one first plane and to one second plane that should first plane, this heat abstractor comprises:

A plurality of radiating fins are located on this first plane;

One heat pipe is in order to support those radiating fins.

As the 1st described heat abstractor of claim, it is characterized in that 2, those radiating fins have respectively holds an outer wall place that is fixed in this heat pipe on one side.

As the 2nd described heat abstractor of claim, it is characterized in that 3, this radiating fin forms a upright shape that extends from this outer wall place.

4, as the 1st described heat abstractor of claim, it is characterized in that this heat pipe runs through this those radiating fins, for this heat pipe and the affixed usefulness of this radiating fin.

As the 1st described heat abstractor of claim, it is characterized in that 5, this heat pipe is that selectivity is around on this first plane and this second plane, is that selectivity is located at respectively on this first plane and this second plane for those radiating fins.

6, a kind of heat abstractor is used for that a display card and this display card have one first plane and to one second plane that should first plane, this heat abstractor comprises:

A plurality of radiating fins are located on this first plane;

One heat pipe has an outer wall place for the affixed usefulness of those radiating fins.

As the 6th described heat abstractor of claim, it is characterized in that 7, this radiating fin forms a upright shape that extends from this outer wall place.

8, as the 6th described heat abstractor of claim, it is characterized in that this heat pipe runs through this those radiating fins, for this heat pipe and the affixed usefulness of this radiating fin.

As the 6th described heat abstractor of claim, it is characterized in that 9, this heat pipe is that selectivity is around on this first plane and this second plane, is that selectivity is located at respectively on this first plane and this second plane for those radiating fins.

10, a kind of heat abstractor is used for that a display card and this display card have one first plane and to one second plane that should first plane, this heat abstractor comprises:

A plurality of radiating fins are located on this first plane;

One heat pipe runs through those radiating fins, supports an outer wall place that is fixed in this heat pipe for this radiating fin.

As the 10th described heat abstractor of claim, it is characterized in that 11, this radiating fin forms a upright shape that extends from this outer wall place.

As the 10th described heat abstractor of claim, it is characterized in that 12, this heat pipe is that selectivity is around on this first plane and this second plane, is that selectivity is located at respectively on this first plane and this second plane for those radiating fins.

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