CN102023689B - Adjustable cooling module and computer device with the cooling module - Google Patents

Abstract

The present invention discloses an adjustable heat dissipation module and a computer device having the heat dissipation module. The adjustable heat dissipation module includes a radiator, a fixing plate and at least one heat pipe. The fixing plate can be locked at a position on the back of the radiator or released from the position. The heat pipe has a heat absorption section and a heat dissipation section extending from the heat absorption section. The heat dissipation section is arranged between the back of the radiator and the fixing plate. When the fixing plate is locked at the position on the back of the radiator, the heat dissipation section of the heat pipe is clamped between the back of the radiator and the fixing plate; and when the fixing plate is released from the position, the heat dissipation section of the heat pipe is allowed to be adjusted to an appropriate position.

Description

Adjustable cooling module and computer device with the cooling module

technical field

The present invention relates to the technical field of heat dissipation modules, in particular to an adjustable heat dissipation module and a computer device with the heat dissipation module, wherein the adjustable heat dissipation module can be installed on motherboards of different specifications by adjusting the position of its heat pipes superior.

Background technique

The CPU radiators of traditional computers are mostly designed to match motherboards of different specifications from various manufacturers, so the radiators are often limited to be configured only on specific models of motherboards or on specific locations on the motherboard, such as : A block defined by 4 predetermined perforations on the motherboard. If the user buys a heat sink that does not meet the specifications, he may also face the dilemma of not being able to assemble it on the motherboard.

In order to achieve the purpose of being compatible with motherboards of different specifications, China Taiwan Patent No. M298167 discloses an adjustable heat sink fixing device, which includes a heat sink with a base and a holding mechanism. In this patent, a first adjustment unit and a second adjustment unit of the holding mechanism cooperate and adjust each other, so that the radiator can be applied to motherboards of different specifications.

Although the above-mentioned patent case can achieve the purpose of flexible adjustment, the structure is quite complicated and the range of adjustment is limited. In particular, the two ends of each heat pipe of the radiator are respectively defined in the positioning groove of the base and the through holes defined by the heat dissipation fin group of the radiator, which cannot be adjusted to a large extent.

Contents of the invention

The invention provides an adjustable heat dissipation module suitable for motherboards of different specifications, which is used to make up for the lack of flexible assembly of traditional radiators due to limited specifications.

Specifically, the adjustable cooling module of the present invention includes a radiator, a fixing plate and at least one heat pipe. The fixing plate can be locked in place on the back of the heat sink or released from the position. The heat pipe has a heat absorption section and a heat dissipation section extending from the heat absorption section. The heat dissipation section is arranged between the back surface of the radiator and the fixing plate. Wherein, when the fixing plate is locked at the position on the back of the radiator, the radiating section of the heat pipe is tightly clamped between the back of the radiator and the fixing plate; and when the fixing plate is loosened from the position When, the cooling section of the heat pipe is allowed to be adjusted to a proper position. Since the heat dissipation section of the heat pipe is allowed to be adjusted in position, it can be arranged at a non-specific position on the motherboard according to requirements.

Preferably, the adjustable heat dissipation module further includes a thermal pad, such as a silicone thermal pad. Furthermore, the heat absorbing section of the heat pipe is flat. In this way, the heat-absorbing section of the heat pipe can be bonded to a heat source through the heat-conducting patch, and the thermal energy of the heat source can be effectively exported to the heat-absorbing section of the heat pipe.

On the other hand, the present invention also discloses a computer device with the above-mentioned adjustable heat dissipation module. Besides the adjustable cooling module, the computer device further includes a motherboard. As mentioned above, the heat pipes of the adjustable heat dissipation module can be adjusted in position and glued to a non-specific position on the back of the mainboard by means of heat conduction stickers, so as to be applicable to mainboards of different specifications.

Preferably, the computer device further includes a casing and another heat conduction patch. The other heat-conducting patch is used to bond the heat-absorbing section of the heat pipe and the casing, so that the combination of the motherboard of the computer device and the heat pipe is more stable. If the shell is made of metal, the computer device can use the metal shell to dissipate heat, which further helps to improve the heat dissipation effect.

As for other invention contents and more detailed technical and functional descriptions of the present invention, they will be disclosed in subsequent descriptions.

Description of drawings

FIG. 1 is an exploded perspective view of the first preferred embodiment of the adjustable heat dissipation module of the present invention.

Fig. 2 is a cross-sectional view of the first preferred embodiment combined with the motherboard.

Fig. 3 is a combined appearance view of the first preferred embodiment combined with the motherboard.

FIG. 4 shows that the heat pipe of FIG. 3 is adjusted to another position.

FIG. 5 shows that the adjustable cooling module of FIG. 3 is adjusted to another direction.

FIG. 6 shows a cross-sectional view of another preferred embodiment of the adjustable heat dissipation module of the present invention.

Detailed ways

1 to 5 show the first preferred embodiment of the adjustable heat dissipation module of the present invention, wherein it is pointed out that the adjustable heat dissipation module includes a radiator 1, a fixed plate 2, two heat pipes 3 (heat pipes) and two heat conduction modules. Patch 4 (thermal pad).

Referring to FIG. 1 , the radiator 1 is a heat dissipation fin group composed of a plurality of heat dissipation fins. The fixing plate 2 can be locked in a position on the back of the radiator or loosened from the position by a plurality of locking components 5, such as screws. Each heat pipe 3 has a heat absorption section 31 and a heat dissipation section 32 extending from the heat absorption section 31 . As shown in the figure, the heat absorbing section 31 is flat. The heat dissipation section 32 is disposed between the back of the heat sink 1 and the fixing plate 2 . The side of the fixing plate 2 facing the heat sink 1 defines a plurality of positioning grooves 20 arranged in parallel for selectively disposing the heat dissipation sections 32 of the heat pipe 3 . In this way, when the fixing plate 2 is locked at the position on the back of the radiator 1, the heat dissipation section 32 of the heat pipe 3 is tightly clamped between the back of the radiator 1 and the fixing plate 2, as shown in FIG. 3 and when the fixing plate 2 is released from this position, the heat dissipation section 32 of the heat pipe 3 is allowed to be adjusted to a proper position. After being adjusted to the proper position, the heat dissipation section 32 of the heat pipe 3 is then fixed on the back of the radiator 1 by locking the fixing plate 2 , as shown in FIG. 4 .

FIG. 2 shows a schematic diagram of the adjustable heat dissipation module applied to a motherboard 6 . The heat dissipation section 32 of the heat pipe 3 is tightly clamped between the back of the heat sink 1 and the fixing plate 2 . The top surface of the heat-absorbing section 31 of the heat pipe 3 is glued to the bottom surface of the heat-conducting patch 4 , and the top surface of the heat-conducting patch 4 is glued to the bottom surface (or called: the back surface) of the motherboard 6 . The motherboard 6 carries a chip 7 to be dissipated. In this embodiment, the thermally conductive patch 4 is a silicone thermally conductive patch. The silicone heat conduction patch has excellent thermal conductivity and processability, and its soft and self-adhesive properties can be closely attached to various flat or concave-convex surface mechanisms, effectively leading the heat energy on the main board 6 to the The heat absorbing section 31 of the heat pipe 3 .

As shown in FIG. 3 , the heat sink 1 stands vertically on the outside of an edge of the motherboard 6 through the heat pipes 3 . Since the two heat dissipation sections 32 of the two heat pipes 3 can be adjusted to different positions by loosening the fixing plate 2 , as shown in FIG. 4 , the distance between the two heat pipes 3 is relatively allowed to be adjusted. In this way, the heat pipes 3 can be properly adjusted according to the different heat dissipation positions of the motherboard 6 , thus being applicable to motherboards of different specifications.

It is worth mentioning that, since the back of the general motherboard usually has many protruding component feet (not shown), which are not conducive to the configuration of the heat pipe, so few heat pipes are arranged on the back of the motherboard in the known technology. On the contrary, since the positions of the heat pipes of the present invention can be properly adjusted, so when assembling, firstly make the heat-absorbing sections 31 of the two heat pipes 3 elastically avoid the component pins, and then the heat dissipation of the two heat pipes 3 The segments 32 are correspondingly arranged in the two positioning grooves 20 of the fixing plate 2 , so that they can be skillfully laid on the back of the main board 6 . Therefore, the present invention achieves the effect of fully utilizing the back of the motherboard for heat dissipation. However, it must be stated that although the present invention can make full use of the back of the mainboard for heat dissipation, it is not limited to this, and these heat pipes and heat conduction patches can also be laid on the front of the mainboard without affecting its adjustable function. idiosyncratic.

In addition, in order to match the direction of the heat flow in the internal space of the computer, the orientation of the two heat pipes 3 of the present invention can be changed, so that the radiator 1 is arranged outside the other vertical edge of the motherboard 6, as shown in FIG. 5 , so as to adapt to the environment. To improve the cooling effect.

Please refer to the sixth FIG. 6 , which is another preferred embodiment of the present invention. As shown in the figure, the composition of each part of this preferred embodiment is generally the same as that described in Fig. 1 to Fig. 5, and these heat pipes 3 and heat conduction patches 4 are also arranged on the back side of the motherboard 6, but in this comparative In a preferred embodiment, another heat conduction patch 4a is added below the heat absorbing section 31 of each heat pipe 3 . Since the heat dissipating structure of the present invention is arranged on the back of the motherboard, the heat absorbing section 31 of the heat pipe 3 and a casing 9 of the computer device can be bonded together by the another heat conducting patch 4a. That is to say, the top surface of the other heat conduction patch 4 a is glued to the bottom surface of the heat absorbing section 31 of the heat pipe 3 , and the bottom surface of the other heat conduction patch 4 a is glued to the inner wall of the housing 9 . In this way, the motherboard 6 can be firmly fixed on the casing 9 . More particularly, since the casing 9 of the computer device is usually made of metal, the heat conducted from the heat-absorbing section 31 by the other heat-conducting patch 4a can be conducted out through the metal casing 9, which helps to improve the heat dissipation effect. Therefore, this embodiment further combines the superior thermal conductivity of the metal shell to give full play to its heat dissipation effect, which is rarely seen in the prior art. The other structures and functions of this preferred embodiment have been described in detail in the embodiments shown in FIGS. 1-5 , so details are not repeated here.

From the above description, it can be understood that the adjustable heat dissipation module of the computer device of the present invention can be assembled in accordance with the heat dissipation position of the motherboard or the direction of the heat flow, and can be applied to motherboards of different specifications, and can be easily assembled on the motherboard. The back side of the main board fully utilizes the function of the back side of the main board. In particular, the present invention gives full play to the heat conduction properties of the metal shell and endows it with an additional heat dissipation function.

In any case, anyone can obtain sufficient teaching from the description of the above examples, and understand that the content of the present invention is indeed different from the prior art, and has industrial applicability and sufficient creativity. It is this invention that has clearly met the patent requirements, and an application is now filed according to law.

Claims (6)

1. An adjustable cooling module, characterized in that it comprises: a radiator; a retaining plate that can be locked into position on the back of the heat sink or released from said position; and At least one heat pipe has a heat absorption section and a heat dissipation section extending from the heat absorption section, the heat dissipation section is arranged between the back side of the heat sink and the fixing plate; Wherein, when the fixing plate is locked at the position on the back of the heat sink, the heat dissipation section of the heat pipe is clamped between the back of the heat sink and the fixing plate; and when the When the fixing plate is loosened from the position, the heat dissipation section of the heat pipe is allowed to be adjusted to a proper position; Wherein, the side of the fixing plate facing the heat sink is defined with a plurality of positioning grooves arranged in parallel, for selectively setting the heat dissipation section of the heat pipe. 2. The adjustable heat dissipation module according to claim 1, further comprising a thermal pad, and the heat-absorbing section of the heat pipe is flat, and the bottom surface of the thermal pad is adhesive On the top surface of the heat absorbing section, and the top surface of the heat conduction patch is for sticking to a heat source. 3. The adjustable heat dissipation module according to claim 2, further comprising another heat conduction patch, the top surface of which is glued to the bottom surface of the heat-absorbing section, and the bottom surface of the other heat conduction patch is For sticking to the inner wall of an enclosure. 4. A computer device, characterized in that it comprises a motherboard and an adjustable heat dissipation module, and the adjustable heat dissipation module comprises: a radiator; a retaining plate lockable in position on the back of the heat sink or released from said position; at least one heat pipe having a heat-absorbing section and a heat-dissipating section extending from the heat-absorbing section, the heat-dissipating section being disposed between the back of the radiator and the fixing plate; and A thermal pad, the bottom surface of which is glued to the top surface of the heat-absorbing section of the heat pipe, and the top surface of the thermal pad is glued to the back of the motherboard; Wherein, when the fixing plate is locked at the position on the back of the heat sink, the heat dissipation section of the heat pipe is clamped between the back of the heat sink and the fixing plate; and when the When the fixing plate is loosened from the position, the heat dissipation section of the heat pipe is allowed to be adjusted to a proper position; Wherein, the side of the fixing plate facing the heat sink is defined with a plurality of positioning grooves arranged in parallel, for selectively setting the heat dissipation section of the heat pipe. 5. The computer device according to claim 4, wherein the heat absorbing section of the heat pipe is flat. 6. The computer device according to claim 5, further comprising a housing and another heat conduction patch, the top surface of the other heat conduction patch is glued to the bottom surface of the heat-absorbing section of the heat pipe, and The bottom surface of the other heat conduction patch is glued to an inner wall of the housing.

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