TWI475362B - Adjustable heat-dissipating module and a computing device having the same - Google Patents

Description

Adjustable heat dissipation module and computer device having the same

The invention relates to the technical field of a heat dissipation module, in particular to an adjustable heat dissipation module and a computer device having the same, wherein the adjustable heat dissipation module can be installed in different specifications by adjusting the position of the heat pipe. On the motherboard.

The CPU coolers of traditional computers are mostly designed to match the motherboards of different specifications of different manufacturers. Therefore, the heat sinks are often limited to being able to be configured only on a specific model of the motherboard or at a specific location on the motherboard, for example. : A block defined by 4 predetermined perforations on the motherboard. If users buy radiators with different specifications, they may face the dilemma that they cannot be assembled on the motherboard.

In order to achieve the purpose of being compatible with different specifications of the motherboard, Taiwan Patent No. M298167 discloses an adjustable heat sink fixing device comprising a heat sink having a base and a holding mechanism. The patent is mainly matched and adjusted by a first adjusting unit and a second adjusting unit of the holding mechanism, so that the heat sink can be applied to different specifications of the motherboard.

Although the above patents can achieve the purpose of elastic adjustment, the structure is quite complicated and the adjustment range is limited. In particular, the two ends of each heat pipe of the heat sink are respectively defined in the positioning groove of the base and the perforation defined by the heat dissipation fin set of the heat sink, and cannot be adjusted greatly.

The invention provides an adjustable heat dissipation module suitable for different size motherboards, which is used to make up for the limitation that the conventional heat sink is limited by specifications and lacks elastic assembly.

In detail, the adjustable heat dissipation module of the present invention comprises a heat sink, a fixing plate and at least one heat pipe. The retaining plate can be locked to a position on the back of the heat sink or can be released from the position. The heat pipe has a heat absorption section and a heat dissipation section extending from the heat absorption section. The heat dissipating section is disposed between the back surface of the heat sink and the fixing plate. Wherein, when the fixing plate is locked at the position of the back surface of the heat sink, the heat dissipation portion of the heat pipe is tightly clamped between the back surface of the heat sink and the fixing plate; and when the fixing plate is loosened from the position At this time, the heat dissipating section of the heat pipe is allowed to be adjusted to an appropriate position. Since the heat dissipating section of the heat pipe is allowed to be adjusted in position, it can be disposed at a non-specific position of the main board as needed.

Preferably, the adjustable heat dissipation module further comprises a thermal pad, such as a silicone thermal conductive patch. Furthermore, the heat absorption section of the heat pipe is flat. In this way, the heat-dissipating section of the heat pipe can be bonded to a heat source through the heat-conductive patch, and the heat energy of the heat source can be effectively led to the heat-absorbing section of the heat pipe.

In another aspect, the present invention also discloses a computer device having the above-described adjustable heat dissipation module. In addition to the adjustable heat dissipation module, the computer device further includes a motherboard. As described above, the heat pipe of the adjustable heat dissipation module can be adjusted in position and adhered to a non-specific position on the back side of the motherboard by a heat-conductive patch, so as to be suitable for different specifications of the motherboard.

Preferably, the computer device further comprises a casing and another heat conducting patch. The other thermal conductive patch is used for bonding the heat absorption section of the heat pipe to the outer casing, so that the combination of the main board of the computer device and the heat pipe is more stable. If the outer casing is made of metal, the computer device can use its metal casing to dissipate heat, which further improves the heat dissipation effect.

Other inventive aspects and more detailed technical and functional descriptions of the present invention are disclosed in the following description.

The first to fifth figures show a first preferred embodiment of the adjustable heat dissipation module of the present invention, wherein the adjustable heat dissipation module includes a heat sink 1, a fixed plate 2, two heat pipes 3 (heat pipe), and Two thermal pads 4 (thermal pad).

Referring to the first figure, the heat sink 1 is a heat sink fin group composed of a plurality of heat radiating fins. The fixing plate 2 can be locked to a position on the back side of the heat sink or loosened from the position by a plurality of locking elements 5, such as screws. Each heat pipe 3 has a heat absorption section 31 and a heat dissipation section 32 extending from the heat absorption section 31. As shown, the heat absorbing section 31 is flat. The heat dissipating section 32 is disposed between the back surface of the heat sink 1 and the fixing plate 2 . The fixing plate 2 faces the one side of the heat sink 1 and defines a plurality of positioning grooves 20 arranged in parallel for the heat dissipating section 32 of the heat pipe 3 to be selectively disposed. Thus, when the fixing plate 2 is locked at the position of the back surface of the heat sink 1, the heat dissipation portion 32 of the heat pipe 3 is clamped between the back surface of the heat sink 1 and the fixing plate 2, as shown in the third figure. As shown; and when the fixing plate 2 is loosened from the position, the heat dissipating section 32 of the heat pipe 3 is allowed to be adjusted to an appropriate position. After being adjusted to the proper position, the heat dissipating section 32 of the heat pipe 3 is fixed to the back surface of the heat sink 1 by locking the fixing plate 2, as shown in the fourth figure.

The second figure shows a schematic diagram of the adjustable heat dissipation module applied to a motherboard 6. The heat dissipating section 32 of the heat pipe 3 is clamped between the back surface of the heat sink 1 and the fixing plate 2. The top surface of the heat absorbing section 31 of the heat pipe 3 is adhered to the bottom surface of the heat conductive patch 4, and the top surface of the heat conductive patch 4 is adhered to the bottom surface (or the back surface) of the motherboard 6. The motherboard 6 carries a wafer 7 to be cooled. In this embodiment, the thermal conductive patch 4 is a silicone thermal conductive patch. The silicone thermal conductive patch has excellent thermal conductivity and processability, and its soft and self-adhesive property can be closely adhered to various flat or concave surface mechanisms, and the heat energy on the motherboard 6 is effectively exported to the The heat absorption section 31 of the heat pipe 3.

As shown in the third figure, the heat sink 1 is vertically erected on the outer side of one edge of the main board 6 by the heat pipes 3. Since the two heat dissipating segments 32 of the two heat pipes 3 can be adjusted to different positions by slackening the fixing plate 2, as shown in the fourth figure, the distance between the two heat pipes 3 is relatively allowed to be adjusted. In this way, the heat pipes 3 can be appropriately adjusted according to different heat dissipation positions of the motherboard 6, and thus are suitable for motherboards of different specifications.

It is worth mentioning that since the back surface of a common motherboard is usually formed with a plurality of component legs (not shown) for energizing the protrusions, which is disadvantageous for the arrangement of the heat pipes, it is rare in the prior art to provide the heat pipes on the back side of the motherboard. . On the contrary, since the position of the heat pipe of the present invention can be appropriately adjusted, the heat dissipation section 31 of the heat pipes 3 can be elastically avoided by the heat absorption sections 31 of the heat pipes 3, and the heat dissipation sections of the heat pipes 3 are further disposed. 32 correspondingly disposed on two of the positioning grooves 20 of the fixing plate 2 can be skillfully laid on the back surface of the motherboard 6. Therefore, the present invention achieves the effect of making full use of the back surface of the motherboard for heat dissipation. However, it must be stated that although the present invention can fully utilize the back surface of the motherboard for heat dissipation, it is not limited thereto, and the heat pipes and the heat conductive patches can also be laid on the front surface of the motherboard without affecting the adjustable characteristics thereof. .

In addition, in order to cooperate with the heat flow of the internal space of the computer, the two heat pipes 3 of the present invention can be changed in orientation such that the heat sink 1 is disposed on the outer side of the other vertical edge of the motherboard 6, as shown in FIG. Environment to improve heat dissipation.

Please refer to the sixth figure, which is another preferred embodiment of the present invention. As shown in the figure, the components of the preferred embodiment are substantially the same as those described in the first to fifth figures, and the heat pipes 3 and the heat-dissipating patch 4 are also disposed on the back surface of the motherboard 6. In a preferred embodiment, another thermally conductive patch 4a is added below the endothermic section 31 of each heat pipe 3. Since the heat dissipation structure of the present invention is disposed on the back surface of the motherboard, the heat absorption section 31 of the heat pipe 3 and the outer casing 9 of the computer device are bonded together by the other heat conductive patch 4a. That is, the top surface of the other heat-conductive patch 4a is adhered to the bottom surface of the heat-absorbing section 31 of the heat pipe 3, and the bottom surface of the other heat-conductive patch 4a is adhered to the inner wall of the outer casing 9. As such, the motherboard 6 can be securely attached to the housing 9. More specifically, since the outer casing 9 of the computer device is usually made of metal, the heat radiated from the heat absorbing section 31 of the other heat-conductive patch 4a can be further led out by the metal casing 9, which helps to improve the heat dissipation effect. Therefore, the present embodiment further combines the superior thermal conductivity of the metal casing to fully exert its heat dissipation effect, which is a rare phenomenon in the prior art. Other structures and functions of the preferred embodiment have been described in detail in the embodiments shown in the first to fifth figures, and therefore will not be described again.

From the above description, it can be understood that the adjustable heat dissipation module of the computer device of the present invention can be assembled according to the heat dissipation position of the motherboard or the heat flow direction, and can be applied to different specifications of the motherboard, and can be easily assembled. On the back of the motherboard, the function of the back of the motherboard is fully utilized. In particular, the present invention fully utilizes the heat transfer characteristics of the metal casing, giving it an additional heat dissipation function.

In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

1. . . heat sink

2. . . Fixed plate

20. . . Positioning groove

3. . . Heat pipe

31. . . Endothermic section

32. . . Heat sink

4, 4a. . . Thermal patch

5. . . Locking element

6. . . motherboard

7. . . Wafer

9. . . shell

The first figure is an exploded perspective view of a first preferred embodiment of the adjustable heat dissipation module of the present invention.

The second figure is a cross-sectional view of the first preferred embodiment incorporated on a motherboard.

The third figure is a combined appearance of the first preferred embodiment incorporated on the motherboard.

In the fourth figure, it is shown that the heat pipe of the third figure is adjusted to another position.

In the fifth figure, the adjustable heat dissipation module of the third figure is adjusted to the other direction.

Figure 6 is a cross-sectional view showing another preferred embodiment of the adjustable heat dissipation module of the present invention.

1. . . heat sink

2. . . Fixed plate

20. . . Positioning groove

3. . . Heat pipe

31. . . Endothermic section

32. . . Heat sink

4. . . Thermal patch

6. . . motherboard

7. . . Wafer

Claims (6)

An adjustable heat dissipation module includes: a heat sink having a plurality of heat dissipation fins; and a fixing plate that can be locked at a position on the back side of the heat sink or loosened from the position, and the fixing plate faces the One side of the heat sink defines a plurality of positioning grooves arranged in parallel; and two heat pipes each having a heat absorption section and a heat dissipation section extending from the heat absorption section, the heat dissipation section being disposed on the back surface of the heat sink and the heat dissipation section Between the fixing plates, and selectively disposed in one of the positioning grooves; wherein, when the fixing plate is locked at the position of the back surface of the heat sink, the heat dissipating portion of the two heat pipes is clamped to the Between the back surface of the heat sink and the fixing plate; and when the fixing plate is loosened from the position, the heat dissipating portion of the two heat pipes is allowed to be adjusted to an appropriate position between the positioning grooves, and the two are adjusted The distance between the heat pipes. The adjustable heat dissipation module of claim 1, further comprising a thermal pad, wherein the heat absorption section of the heat pipe is flat, and the bottom surface of the heat conductive patch is adhered to the heat absorption section. The top surface of the heat-conducting patch is attached to a heat source. The adjustable heat dissipation module of claim 2, further comprising another heat conductive patch, the top surface of which is adhered to the bottom surface of the heat absorption section, and the bottom surface of the other heat conduction patch is adhered to The inner wall of the outer casing. A computer device includes a motherboard and an adjustable heat dissipation module, and the adjustable heat dissipation module includes: a heat sink having a plurality of heat dissipating fins; a fixing plate that can be locked at a position on the back side of the heat sink or loosened from the position, and the side of the fixing plate facing the heat sink defines a plurality of parallel Arranging positioning grooves; each of the heat pipes has a heat absorption section and a heat dissipation section extending from the heat absorption section, the heat absorption section is disposed on the motherboard, and the heat dissipation section is disposed on the back surface of the heat sink and the heat dissipation section Between the fixing plates, and selectively disposed in one of the positioning grooves; and a heat-conducting patch, the bottom surface of which is adhered to the top surface of the heat-absorbing portion of the heat pipe, and the top surface of the heat-conductive patch is adhesive a back surface of the motherboard; wherein, when the fixing plate is locked at the position of the rear surface of the heat sink, the heat dissipation portion of the heat pipe is clamped between the back surface of the heat sink and the fixing plate; When the fixing plate is loosened from the position, the heat dissipating section of the two heat pipes is allowed to be adjusted to an appropriate position, and the distance between the heat absorption sections of the two heat pipes is adjusted. The computer device according to claim 4, wherein the heat absorption section of the heat pipe is flat. The computer device of claim 5, further comprising a casing and another heat-conductive patch, the top surface of the other heat-dissipating patch is adhered to the bottom surface of the heat-absorbing section of the heat pipe, and the other heat-conductive sticker The bottom surface of the sheet is adhered to an inner wall of the outer casing.