1333824 - 099年08月19日修正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係指一種散熱裝置，尤係指一種用於冷卻電子元 件之熱管散熱裝置。 【先前技術】 [0002] 隨著電子資訊業不斷發展，電子元件（尤其係中央處理 器）運行頻率和速度於不斷提升，高頻高速運行將使電 子元件產生之熱量隨之增加，致其溫度不斷升高，嚴重 影響其運行時之性能，爲確保電子元件能正常運行，必 須及時排出其所産生之大量熱。 [0003] 爲此，業界使用散熱裝置對電子元件進行輔助散熱，現 有散熱裝置包括一底座及設於底座上之複數散熱鰭片， 該散熱底座底面爲平滑之實體金屬，係供貼設於中央處 理器表面。而隨著中央處理器體積越來越小，其發熱也 更加集中，因局限於金屬之傳熱性能，散熱底座中心處 之熱量往往過於集中，而無法快速傳遞到整個散熱裝置 ，從而限制整體散熱效果。 [0004] 爲克服上述問題，業界採用熱管傳熱之散熱裝置曰益增 多，熱管係於金屬管體内設置毛細結構物（如粉末燒結 物 '溝槽結構、絲網結構等），並密封裝入工作液體（ 如水、酒精等），然後抽至真空狀態，依賴工作液體受 熱後進行液氣兩相變化而吸收、釋放熱量，由於熱管之 傳熱不定向且可遠距離傳熱廣泛應用。台湾专利公告第 532758号揭示一种运用热管之电子元件散热装置，其包 括一基座、设置于基座上之複數散热鳍片及二大致呈“ 094111152 表單编號A0101 第3頁/共15頁 0993296269-0 1333824 099年08月19日修正替换頁 3”形之热管。該基座底面與電子元件表面貼合，該基 座上表面及散熱鰭片下端緣對應開設兩對半圓形凹槽， 每一熱管一端部通過導熱膠黏合或焊接於上述凹槽中。 這些散熱鰭片遠離基座之適當位置開設穿孔，供套設于 熱管另一端部上。電子元件産生之熱量傳遞到基座，然 後通過熱管將熱量傳遞到上部之散熱鰭片上，最後通過 散熱鰭片將熱量散發到周圍空氣中，達到冷卻電子元件 之目的。然，因熱管上端部與散熱鰭片接觸面積小，傳 導至散熱鰭片上部之熱量相對較少，不能充分利用散熱 鰭片之上方部位，充分發揮熱管之傳熱遠、傳熱快之性 能，此種情況於散熱鰭片之縱向及水平尺寸較大時更爲 明顯。 【發明内容】 [0005] 本發明之目的係提供一種散熱效率高之熱管散熱裝置。 [0006] 本發明之熱管散熱裝置包括一散熱器及至少一熱管，該 散熱器包括一可與電子元件接觸之基座及設置於基座上 之散熱鰭片組，該散熱器還包括一蓋板，該蓋板與散熱 鰭片組接觸，該散熱鰭片組一側面形成一凹槽，該熱管 兩端與基座、蓋板接觸，中部與散熱鰭片組之凹槽邊緣 熱接觸。 [0007] 本發明與先前技術相比具有如下優點：基座吸收之熱量 一部分沿散熱鰭片組向上傳遞，一部分由熱管迅速傳遞 至蓋板，使熱量沿散熱器兩端向散熱鰭片之路徑傳遞， 同時夾於散熱鰭片組凹槽内之熱管將熱量沿中間向散熱 器兩端之路徑傳遞，兩條路徑將熱量均勻分佈於散熱鰭 094111152 表單編號A0101 第4頁/共15頁 0993296269-0 1333824 099年08月19日修正替換頁 片上，有利快速散熱，熱管之傳熱遠、傳熱快之性能得 J充刀發揮，且熱官與凹槽充分接觸中部直接向鰭片 傳熱，熱管之利用率提高，散熱裝置整體散熱效率也得 到改善。 【實施方式】 [0008] 請參閱第四圖，本發明熱管散熱裝置係用來安裝於中央 處理器（圖未示）等發熱電子元件上對其進行散熱。該 熱管散熱裝置包括一散熱器1〇、與散熱器1〇底部、中部 及上。卩接合之熱官20及裝設於散熱器1〇一側之風扇結構 30 〇 [0009] 如第一圖、第二圖所示，該散熱器1〇包括一基座12、設 置於基座12上表面之散熱片組η及一將散熱片組η夾於 其與基座12之間之蓋板丨6。該基座12下表面與中央處理 器表面相貼合，其上表面開設一對平行之第一溝槽12〇， 基座12與第一溝槽12 0垂直之一對侧邊開設一對孔口 12 £ 。該蓋板16下表面開設一對平行之第二溝槽16〇，蓋板16 與第一溝槽16 〇垂直之一對側邊開設一對孔口 1 6 2 ^該散 熱片組14包括複數散熱片14〇，每一散熱片14〇相互疊合 形成散熱片組14，每一散熱片140相對兩端分別同向垂直 彎折延伸形成折邊142，折邊142連續形成一平面。該散 熱片組14之一側端形成一缺口，每一散熱片14〇之缺口處 同向設有折邊143，折邊143連續形成一内凹面。其中由 折邊142形成之平面分別與基座12上表面及蓋板16之下表 面相貼合’且該平面上相應基座12之第一溝槽12〇設有第 一凹口 144，第一溝槽120與第一凹口 144共同形成第一 094111152 表單编號A0101 第5頁/共15頁 0993296269-0 1333824 099年08月19日按正替換頁 内通道44。該平面上相應蓋板16之第二溝槽16〇設有第二 凹口 146,第二溝槽160與第二凹口 146共同形成第二内 通道46。該折邊143連續形成之内凹面於散熱片組14一側 面形成凹槽148，該凹槽148包括一坡度較緩之第一凹槽 1480及坡度較陡之第二凹槽1482。 [0010]該熱管20包括一 S形熱管22與一“匚，，字型熱管24，該§ 形熱管2 2連續彎折形成第一水平段2 2 〇 '第二水平段2 2 2 和第三水平段224,從而熱管22整體呈s形。該“匸，，字 型熱管24包括一蒸發段240及一冷凝段244。熱管22之第 一水平段2 20及第三水平段224可通過導熱膠粘接或錫膏 焊接等方式分別貼合於該第―溝槽12〇、第二溝槽16〇内 ，而熱管22之第二水平段222可通過錫膏焊接或過盈配合 等方式卡設於該凹槽148内。其中第一水平段22〇與第二 水平段222之彎折部落入第一凹槽148〇處第二水平段 222夾於第二凹槽1482内，並與其内凹面緊密貼合，增加 熱管22與散熱片140之接觸面積。同樣熱管24之蒸發段 240及冷凝段244亦可通過導歸雜或錫膏焊接等方式 分別貼合於該第一溝槽120、第二溝槽160内。 [0011] 風扇結構30包括-風扇32及—風扇岐架34，該風扇固 疋架34爲丨形框架，該框架—對邊同向設有—對折邊 340，母條折邊34〇兩末端設有與該孔〇122、⑽相對應 之孔洞342， 螺針順次穿過孔洞342 、孔口 122、162將風 094111152 本毛明熱S散熱裝置之傳熱路徑請參閱第 表單編請〇1 第6頁/共15頁 圖，中央處 0993296269-0 [0012] 1333824 _ 099年08月19日修正替換頁 理器工作時，産生之熱量傳遞到散熱器10之基座12，一 部分熱量直接傳遞至散熱片組14，另一部分熱量使熱管 ' 20内工作流體於第一水平段220、蒸發段240受熱蒸發， 於第二水平段222、第三水平段224及冷凝段244被冷凝 ，使散熱器10底部之熱量能夠快速傳導至其中部和上方 ，均勻分佈於散熱鰭片組14中，再通過風扇32提高散熱 器10與周圍空氣之熱對流速度，加強熱管散熱裝置之整 體散熱效率。 [0013] 本發明熱管散熱裝置於該實施方式中，熱管20爲圓筒狀 ，本發明熱管散熱裝置也可使用S形板型熱管，此時，散 熱片組14與基座12及蓋板16上容設熱管20之第一、第二 通道4 4、4 6相對形成方形筒狀通道即可。 [0014] 本實施方式中，散熱器10具有一基座12，該基座12主要 吸收中央處理器産生之熱量，之後將熱量傳遞至散熱片 組14之底部及熱管20。本發明熱管散熱裝置亦可只由散 熱片組14和熱管20組成，此時熱管20之第一水平段220 、蒸發段240與第一散熱片組14下端之平面平齊設置，可 直接與中央處理器等發熱源熱性接觸即可。 [0015] 上述實施方式中，熱管20包括連續彎折形成之一蒸發部 及遠離該蒸發部之二冷凝部。可以理解地，本發明熱管 散熱裝置之熱管還可以根據實際散熱需求，經連續彎折 而形成兩個以上之冷凝部，此時對應該複數冷凝部設置 複數散熱片組14，散熱片組14上對應該等冷凝部分別形 成容置該冷凝部之複數凹槽148。 【圖式簡單說明】 表單编號A0101 094111152 第7頁/共15頁 0993296269-0 1333824 099年08月19日修正替換頁 [0016] 圖1係本發明熱管散熱裝置之立體分解圖。 [0017] 圖2係本發明熱管散熱裝置之組裝狀態圖。 [0018] 圖3係本發明熱管散熱裝置之立體組合圖。 [0019] 圖4係本發明熱管散熱裝置傳熱路徑示意圖。 【主要元件符號說明】 [0020] 散熱器：10 [0021] 熱管：22、24 [0022] 基座：12 [0023] 散熱鰭片組：14 [0024] 蓋：16 [0025] 風扇結構：30 [0026] 風扇：32 [0027] 風扇固定架：34 [0028] 第一通道：44 [0029] 第二通道：4 6 [0030] 第一溝槽：120 [0031] 第二溝槽：160 [0032] 凹槽：148 [0033] 第一水平段：220 [0034] 第二水平段：222 094111152 表單編號A0101 第8頁/共15頁 0993296269-0 1333824 099年08月19日梭正替换頁 [0035] 第三水平段：224 [0036] 蒸發段：240 [0037] 冷凝段：244 094111152 表單編號A0101 第9頁/共15頁 0993296269-01333824 - Aug. 19, 2010, Amendment Replacement Page VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat pipe heat dissipating device for cooling an electronic component. [Prior Art] [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processing unit) are constantly increasing, and high-frequency high-speed operation will increase the heat generated by electronic components, resulting in temperature. Increasingly, it seriously affects the performance of its operation. In order to ensure the normal operation of electronic components, it must discharge a large amount of heat generated in time. [0003] For this reason, the heat dissipation device is used in the industry to assist heat dissipation of an electronic component. The conventional heat dissipation device includes a base and a plurality of heat dissipation fins disposed on the base. The bottom surface of the heat dissipation base is a smooth solid metal and is attached to the center. Processor surface. As the size of the central processing unit is smaller and smaller, the heat is more concentrated. Due to the heat transfer performance of the metal, the heat at the center of the heat dissipation base is often too concentrated, and cannot be quickly transmitted to the entire heat sink, thereby limiting the overall heat dissipation. effect. [0004] In order to overcome the above problems, the heat transfer device using heat pipe heat transfer in the industry has an increased benefit, and the heat pipe is provided with a capillary structure (such as a powder sintered material 'groove structure, a wire mesh structure, etc.) in a metal pipe body, and is sealed. Into the working liquid (such as water, alcohol, etc.), and then pumped to a vacuum state, depending on the working liquid is heated, the liquid and gas two-phase change to absorb and release heat, because the heat transfer of the heat pipe is not oriented and can be widely used for long-distance heat transfer. Taiwan Patent Publication No. 532758 discloses an electronic component heat sink using a heat pipe, comprising a base, a plurality of heat sink fins disposed on the base, and two substantially "094111152 Form No. A0101 Page 3 of 15 0993296269-0 1333824 Modified on August 19, 099, the heat exchanger of the replacement page 3". The bottom surface of the base is attached to the surface of the electronic component, and the upper surface of the base and the lower end edge of the heat dissipation fin are correspondingly formed with two pairs of semicircular grooves, and one end of each heat pipe is bonded or welded into the groove by a heat conductive adhesive. The heat dissipating fins are perforated at appropriate positions away from the base for being sleeved on the other end of the heat pipe. The heat generated by the electronic components is transferred to the susceptor, and then the heat is transferred to the upper fins through the heat pipes, and finally the heat is radiated to the surrounding air through the fins to cool the electronic components. However, since the contact area between the upper end portion of the heat pipe and the heat dissipating fin is small, the heat conducted to the upper portion of the heat dissipating fin is relatively small, and the upper portion of the heat dissipating fin cannot be fully utilized, and the heat transfer of the heat pipe is far enough, and the heat transfer performance is fast. This is more pronounced when the longitudinal and horizontal dimensions of the fins are large. SUMMARY OF THE INVENTION [0005] An object of the present invention is to provide a heat pipe heat dissipation device with high heat dissipation efficiency. [0006] The heat pipe heat dissipating device of the present invention comprises a heat sink and at least one heat pipe, the heat sink includes a base that can be in contact with the electronic component, and a heat dissipation fin set disposed on the base, the heat sink further includes a cover The cover plate is in contact with the heat dissipation fin group, and a side surface of the heat dissipation fin group forms a groove. The heat pipe has two ends in contact with the base and the cover plate, and the middle portion is in thermal contact with the groove edge of the heat dissipation fin group. [0007] Compared with the prior art, the present invention has the following advantages: a part of the heat absorbed by the susceptor is transmitted upward along the heat radiating fin group, and a part of the heat is quickly transferred to the cover plate, so that the heat is along the heat radiating fin to the path of the heat radiating fin. Passing, while the heat pipe sandwiched in the groove of the heat sink fin transfers heat along the path to the ends of the heat sink, the two paths distribute heat evenly to the heat sink fin 094111152 Form No. A0101 Page 4 / Total 15 Page 0993296269- 0 1333824 On August 19, 099, the replacement page was modified to facilitate rapid heat dissipation. The heat transfer of the heat pipe is far and the heat transfer is fast. The function of the heat filling and the groove is sufficient to directly transfer the heat to the fin. The utilization rate of the heat pipe is improved, and the overall heat dissipation efficiency of the heat sink is also improved. [Embodiment] [0008] Referring to the fourth figure, the heat pipe heat dissipating device of the present invention is used for heat dissipation on a heat-generating electronic component such as a central processing unit (not shown). The heat pipe heat dissipating device comprises a heat sink 1 , and a bottom, a middle portion and a top portion of the heat sink 1 . The heat exchanger 20 and the fan structure 30 mounted on the side of the heat sink 1 〇 [0009] As shown in the first figure and the second figure, the heat sink 1 includes a base 12 and is disposed on the base A heat sink group η on the upper surface of the 12 and a cover 丨 6 sandwiching the heat sink group n between the base and the base 12. The lower surface of the pedestal 12 is in contact with the surface of the central processing unit, and a pair of parallel first grooves 12 开设 are defined on the upper surface thereof, and a pair of holes are formed on one side of the pedestal 12 perpendicular to the first groove 120 Port 12 £. A pair of parallel second grooves 16 开设 are formed on the lower surface of the cover plate 16. The cover plate 16 defines a pair of apertures 1 6 2 perpendicular to the first groove 16 ^. The heat sink group 14 includes a plurality of holes Each of the fins 14A is stacked on each other to form a fin group 14. The opposite ends of each fin 140 are bent perpendicularly to form a flange 142, and the flange 142 continuously forms a plane. One side of the heat dissipating fin group 14 is formed with a notch, and each of the fins 14 is provided with a flange 143 in the same direction, and the flange 143 continuously forms an inner concave surface. The plane formed by the flange 142 is respectively in contact with the upper surface of the base 12 and the lower surface of the cover plate 16 and the first groove 12 of the corresponding base 12 of the plane is provided with a first recess 144, A groove 120 and the first recess 144 together form a first 094111152 Form No. A0101 Page 5 / Total 15 Page 0993296269-0 1333824 On August 19, 1999, the in-page passage 44 is replaced by positive. The second groove 16 of the corresponding cover plate 16 on the plane is provided with a second recess 146, and the second groove 160 and the second recess 146 together form a second inner passage 46. The concave portion 143 is continuously formed with a concave surface formed on the side of the fin group 14 to form a groove 148. The groove 148 includes a first groove 1480 having a gentle slope and a second groove 1482 having a steep slope. [0010] The heat pipe 20 includes an S-shaped heat pipe 22 and a "匚," heat pipe 24, which is continuously bent to form a first horizontal section 2 2 〇 'second horizontal section 2 2 2 and The three horizontal sections 224, such that the heat pipe 22 is generally s-shaped. The "匸," heat pipe 24 includes an evaporation section 240 and a condensation section 244. The first horizontal section 2 20 and the third horizontal section 224 of the heat pipe 22 can be respectively adhered to the first groove 12 〇 and the second groove 16 通过 by thermal conductive adhesive bonding or solder paste welding, and the heat pipe 22 The second horizontal section 222 can be inserted into the recess 148 by solder paste soldering or interference fit. The first horizontal section 22〇 and the second horizontal section 222 are bent into the first groove 148, and the second horizontal section 222 is clamped in the second groove 1482, and is closely adhered to the concave surface thereof to increase the heat pipe 22 Contact area with the heat sink 140. Similarly, the evaporation section 240 and the condensation section 244 of the heat pipe 24 may be respectively adhered to the first trench 120 and the second trench 160 by means of solder or solder paste bonding. [0011] The fan structure 30 includes a fan 32 and a fan truss 34. The fan truss 34 is a 丨-shaped frame, and the frame is provided with a folded edge 340, a female hem 34, and two ends. A hole 342 corresponding to the hole 122, (10) is provided, and the screw needle passes through the hole 342, the hole 122, 162 passes the wind 094111152, and the heat transfer path of the heat dissipation device is referred to in the first form. Page 6 of 15, the central part is 0993296269-0 [0012] 1333824 _ August 19, 1999 When the replacement pager is modified, the generated heat is transferred to the base 12 of the heat sink 10, and a part of the heat is directly transmitted. To the heat sink group 14, another portion of the heat causes the working fluid in the heat pipe '20 to be thermally evaporated in the first horizontal section 220 and the evaporation section 240, and is condensed in the second horizontal section 222, the third horizontal section 224, and the condensation section 244 to dissipate heat. The heat at the bottom of the device 10 can be quickly transmitted to the middle portion and the upper portion thereof, evenly distributed in the heat dissipation fin group 14, and the heat convection speed of the heat sink 10 and the surrounding air is increased by the fan 32 to enhance the overall heat dissipation efficiency of the heat pipe heat dissipation device. [0013] In the embodiment, the heat pipe 20 is cylindrical, and the heat pipe heat dissipating device of the present invention can also use an S-shaped plate type heat pipe. At this time, the heat sink group 14 and the base 12 and the cover plate 16 The first and second passages 4 4 and 4 6 of the upper heat pipe 20 may form a square tubular passage. In the present embodiment, the heat sink 10 has a susceptor 12 that mainly absorbs heat generated by the central processing unit and then transfers heat to the bottom of the heat sink group 14 and the heat pipe 20. The heat pipe heat dissipating device of the present invention may also be composed only of the heat sink group 14 and the heat pipe 20. At this time, the first horizontal section 220 and the evaporation section 240 of the heat pipe 20 are flush with the plane of the lower end of the first heat sink group 14, and can be directly connected to the center. The heat source such as a processor can be in thermal contact. [0015] In the above embodiment, the heat pipe 20 includes one of the evaporation portions continuously formed and the two condensation portions away from the evaporation portion. It can be understood that the heat pipe of the heat pipe heat dissipating device of the present invention can further form two or more condensation portions by continuous bending according to actual heat dissipation requirements. At this time, a plurality of heat sink groups 14 are disposed corresponding to the plurality of condensation portions, and the heat sink group 14 is disposed. The plurality of grooves 148 for accommodating the condensation portion are respectively formed corresponding to the condensing portions. BRIEF DESCRIPTION OF THE DRAWINGS Form number A0101 094111152 Page 7 of 15 0993296269-0 1333824 Revision of page 19, 1999 [0016] FIG. 1 is an exploded perspective view of a heat pipe heat sink of the present invention. 2 is an assembled state view of a heat pipe heat dissipation device of the present invention. 3 is a perspective assembled view of a heat pipe heat dissipating device of the present invention. 4 is a schematic view showing a heat transfer path of a heat pipe heat dissipation device of the present invention. [Main component symbol description] [0020] Heat sink: 10 [0021] Heat pipe: 22, 24 [0022] Base: 12 [0023] Heat sink fin set: 14 [0024] Cover: 16 [0025] Fan structure: 30 Fan: 32 [0027] Fan holder: 34 [0028] First channel: 44 [0029] Second channel: 4 6 [0030] First groove: 120 [0031] Second groove: 160 [ 0032] Groove: 148 [0033] First horizontal segment: 220 [0034] Second horizontal segment: 222 094111152 Form number A0101 Page 8/Total 15 page 0993296269-0 1333824 August 19, 2017 Shuttle replacement page [ 0035] Third horizontal segment: 224 [0036] Evaporation segment: 240 [0037] Condensation segment: 244 094111152 Form number A0101 Page 9 / Total 15 pages 0993296269-0