US20090151909A1

US20090151909A1 - Heat-Dissipating Unit

Info

Publication number: US20090151909A1
Application number: US12/082,706
Authority: US
Inventors: Hsiuwei Yang
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2007-12-13
Filing date: 2008-04-11
Publication date: 2009-06-18
Also published as: TWM339197U

Abstract

A heat-dissipating unit is provided. The heat-dissipating unit includes a board. The board is thermally conductive and includes a contact portion planar in shape. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch portion extends outward from at least one end of the contact portion. With the contact portion being in immediate contact with the heat-generating source, heat is transferred from the heat-generating source to a remote end via the branch portion, thereby enhancing heat dissipation.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a heat-dissipating unit and, more particularly, to application of a thermally conductive board highly efficient in heat transfer.
2. Description of the Prior Art
Owing to rapid development of industrial sectors, such as information, communication, and optoelectronics, in recent years, the trend of electronic products is toward high levels and miniaturization. Given the demand for high-speed, high-frequency, and miniaturized electronic products, electronic components nowadays feature increasingly high heat-generation density. Hence, cooling efficiency has become an important factor in the stability of electronic products. Highly efficient in heat transfer, heat pipes and heat spreaders are thermally conductive components in wide use with electronic products. A heat pipe or a heat spreader comprises a sealed vacuum copper pipe or plate, wherein a capillary layer is sintered to the inner wall of the copper pipe or plate. A working fluid inside the copper pipe or plate is exposed to a heat source (for example, CPU) at the evaporator end and vaporizes as a result. The vapor from the heated end ends up releasing heat at the condenser end (for example, heat-dissipating fins, and a fan) and thereby condensing into liquid. The liquid returns to the evaporator end due to capillary action of the capillary layer, thereby providing closed circulation.
Referring to FIG. 1, which is a perspective view of a conventional heat-dissipating module, a heat-dissipating module 1 comprises a heat-dissipating fin set 11 and a heat pipe 12. The heat-dissipating fin set 11 is formed with at least one through hole 112. The bottom of the heat-dissipating fin set 11 is coupled to a base 111 and gains access to a heat-generating source 13 via the base 111. The heat pipe 12 penetrates the through hole 112 of the heat-dissipating fin set 11 and is coupled to the base 111. Heat generated by the heat-generating source 13 is transferred to the heat pipe 12 via the base 111. Afterward, the heat pipe 12 transfers the heat to the heat-dissipating fin set 11 for heat dissipation.
Nevertheless, the prior art illustrated with the heat-dissipating module 1 is not free of any drawbacks. The heat pipe 12 has to be coupled to the heat-dissipating fin set 11 before being coupled to the base 111, otherwise the base 111 cannot come into immediate contact with the heat-generating source 13, and the heat from the heat-generating source 13 cannot be transferred to the heat pipe 12 and dissipated at a remote end. The heat pipe 12 is not in immediate contact with the heat-generating source 13; instead, the heat pipe 12 has to be coupled to the base 111, because the base 111 is indispensable to heat transfer, and the heat pipe 12 cannot work without the base 111. A gap is likely to appear between the heat pipe 12 and the base 111 despite firm adhesion or thermal grease therebetween, resulting in thermal resistance and great reduction of heat transfer.
Another conventional heat-dissipating module comprises a thermally conductive board for heat dissipation. The thermally conductive board is usually for use with a notebook computer or a compact device that requires heat dissipation. The thermally conductive board comprises two superimposed metal plates and is inwardly formed with channels and/or a capillary structure carrying a working fluid. The working fluid is exposed to a heat source (for example, CPU) at the evaporator end and vaporizes as a result. The vapor from the heated end ends up releasing heat at the condenser end (for example, heat-dissipating fins, and a fan) and thereby condensing into liquid. The liquid returns to the evaporator end due to capillary action of the capillary structure. However, the thermally conductive board has a drawback, that is, a short path from the evaporator end to the condenser end, which accounts for inefficient heat dissipation of the thermally conductive board.
Hence, the drawbacks of the prior art are as follows:

- 1. The coupling of the heat pipe and the base is compromised by a gap likely to appear therebetween, resulting in thermal resistance.
- 2. Bulky and space-consuming.
- 3. Inefficient heat dissipation.

Accordingly, the inventor of this patent application and related manufacturers need urgent solution to overcome the drawbacks of the aforementioned prior art.

SUMMARY OF THE INVENTION

Accordingly, to solve the drawbacks of the aforementioned prior art, it is a primary objective of the present invention to provide a heat-dissipating unit in immediate contact with a heat-generating source, capable of heat transfer, and comprising a branch portion extending outward from the body of the heat-dissipating unit, thereby transferring heat to a remote end for heat dissipation.
Another objective of the present invention is to provide a heat-dissipating unit that is space-saving.
Yet another objective of the present invention is to provide a heat-dissipating unit that is structurally simple and cost-saving.
In order to achieve the above and other objectives, the present invention provides a heat-dissipating unit. The heat-dissipating unit comprises a board. The board is thermally conductive and defined with a plane functioning as a contact portion. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch portion extends outward from at least one end of the contact portion. With the contact portion being in immediate contact with the heat-generating source, heat is transferred from the heat-generating source to a remote end via the branch portion, thus enabling heat dissipation.
Accordingly, the present invention has the following advantages:

- 1. The board is in immediate contact with a heat-generating source, such that heat is transferred from the heat-generating source to a remote end via the branch portion, thus enabling efficient heat dissipation.
- 2. With the board being in immediate contact with the heat-generating source, thermal resistance never occurs.
- 3. The structure is simple enough to be space-saving.
- 4. The structure is simple enough to be time-saving and cost-saving as far as fabrication is concerned.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 (PRIOR ART) is a perspective view of a conventional heat-dissipating module;

FIG. 2 is an exploded view of a preferred embodiment according to the present invention;

FIG. 3 is a perspective view of the preferred embodiment according to the present invention;

FIG. 4 is an exploded view of another preferred embodiment according to the present invention;

FIG. 5 is a perspective view of the other preferred embodiment according to the present invention; and

FIG. 6 is a perspective view of the other preferred embodiment according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In order to achieve the aforesaid objectives and advantages, the technical means employed, structure, features, and functions of the present invention are illustrated with the appended drawings and preferred embodiments.
Referring to FIGS. 2 and 3, which are an exploded view and a perspective view of a preferred embodiment according to the present invention respectively, a heat-dissipating unit comprises a board 2. The board 2 is thermally conductive and internally disposed with a working fluid and a capillary structure (with the same structure as a conventional heat pipe, heat plate, or heat spreader, and thus the description thereof is omitted herein). The board 2 is defined with a plane. A contact portion 21 is formed on the plane. The contact portion 21 is in immediate contact with a heat-generating source 3. An integrally formed branch portion 22 extends outward from at least one end of the contact portion 21. With the contact portion 21 being in immediate contact with the heat-generating source 3, heat is transferred from the heat-generating source to a remote end via the contact portion 21 and the branch portion 22 extending outward, thus enabling heat dissipation. With the contact portion 21 and the branch portion 22, the present invention improves a drawback of the prior art, that is, thermal resistance occurs to a conventional heat-dissipating module for transferring heat from a heat-generating source to a heat pipe via a base.
Referring to FIGS. 4 and 5, which are an exploded view and a perspective view of another preferred embodiment according to the present invention respectively, heat-dissipating fins 4 penetrated by the branch portion 22 allow the branch portion 22 to dissipate heat rapidly to the surroundings via the heat-dissipating fins 4.
Referring to FIG. 6, which is a perspective view of the other preferred embodiment according to the present invention, the heat-dissipating fins 4 penetrated by the branch portion 22 are further provided with a fan 5 for cooling. The contact portion 21 of the board 2 is in immediate contact with the heat-generating source 3, and thus heat is transferred from the heat-generating source 3 to the contact portion 21, the branch portion 22, and the heat-dissipating fins 4 in sequence. The fan 5 cools down the heat-dissipating fins 4, and enhances heat dissipation performed by the heat-dissipating fins 4.
The aforesaid embodiments merely serve as the preferred embodiments of the present invention but are not intended to limit the present invention. It will be apparent to those skilled in the art that all equivalent modifications or changes made, without departing from the spirit and the technical concepts disclosed by the present invention, should fall within the scope of the appended claims.
Summarizing the above, the heat-dissipating unit of the present invention is efficacious, has high industrial applicability, and meets the conditions for patentability. Hence, the applicant files the application for a patent. The applicant would appreciate, if a patent is issued to the application. An examiner should not hesitate to write and instruct the applicant to answer a question about the application document, and the applicant will spare no effort to follow instructions given by the examiner.

Claims

1. A heat-dissipating unit, comprising:

a board being thermally conductive and defined with a plane;

a contact portion formed on said plane of said board, said contact portion being in immediate contact with a heat-generating source; and

at least one branch portion extending outward from at least one end of said contact portion;

wherein heat is transferred to a remote end via said branch portion, thereby enabling heat dissipation.

2. The heat-dissipating unit of claim 1, wherein said branch portion is coupled to heat-dissipating fins.

3. The heat-dissipating unit of claim 2, wherein said heat-dissipating fins are further provided with a fan for cooling, to enhance heat dissipation.