1255471 玖、發明說明： 【發明所屬之技術領域】 、生且ΐίΓί·於—種平面線_製造方法，尤指—種用來製 k-、有南味見比的平面線圈的製造方法。 、 【先前技術】 μ 電系統是本世紀極具有觸性的技術，此技術的特色在 ΐ ΪΓίΐ的合，達到多重的功效，因此在航^ 機械工鮮各難觸有叙的運Γ 業以及 声技術錢生1的技術領域巾，微平面義是大量且 ίίϊί^ϊ電子藉’為了達到小型化的需求，奈米化的微 七；疋'、…、:的結果，故以往平面線圈的製造方法，最常見的 ^、為下列幾種，其中之一，即屬於微機電(MEMs>々製本， 製，方法來製造平面線圈，所謂半導體的製造方 〆^大眾触知的微影侧的方式，故於此不再贅述。此- s古因為採用微影堆疊的製程，其結構的深寬比可以達 就是說線寬可以很小而線的深度(厚度)可以ί 造的平面線圈之成本極高。 、弋斤衣 與上述半導體製程差異不大，亦係利 屬游向深凹槽並沉積於深凹槽内， iΞΞίH 然而利用半導體製程之微影_的方法使ϊ 上無電鑛的製程僅以觸媒吸引力及重力讓金ί 和，、化費的日寸間甚長，換句話說，時間成本更高。 故由上述兩種方式可見以微機電的製造方法作為平面線圈的 另外，也有一種屬於微機電(MEMS)的製造方法，稱作無带 1255471 ΐΐίΐ，有成本過高、耗時的問題，因此現階段此二種生產技 ，夕，應祕學術研究上，換言之就是停留 段’尚難以落實於產業界。 ^、 亦有利用網版印刷電路的方法製造平面線圈，而這種 千^的k點在於技術成熟、價格低廉、時間短，細_版印刷 式製造平面線圈，有—相當嚴重的缺點，即深寬比極低， ^足甚大，以現在的技術而言最小僅到75微米(聰)而已，與奈米 錄級，微機電製，方法完全*可相比，且因為深寬比低，使得此 刷电路堆豐的方式製造的平面線圈的電感效能不理想，電 甚大於峨影細方柄製造之具有高深寬比的平面線圈， 磁干擾的現象也較紐重，或是為了要達到較佳的電感 义月b不得不加大平面線圈的體積，如此即難以符合微機電所運用 的平面馬達、微發電機、軟電路板的小型化之需求。 因此，為了能夠兼顧成本之低廉與體積之小型的需求，目前 =而要一種製造平面線圈的方法，此方法除了必須能夠製造高深 覓比的平面線圈外，還要保持低廉的製造成本。 【發明内容】 日為解決上述之問題，避免缺失之存在，本發明之主要目的在 t提供一種平面線圈的製造方法，也更可以製造出一個具有高深 覓比的平面線圈，以應付如微機電系統中的驅動裝置之運用。 _為達到上述目的，本發明提供一種平面線圈之製造方法，包 含下列步驟，（1)提供一壓模；（2)提供一基材；（3)在該基材上設置 一硬化層；（4)將該壓模壓印在該硬化層上；（5)使該硬化層加以硬 化；⑹設置一種子層於硬化後之該硬化層上；⑺以電鑄形成一線 圈層於該種子層上；以及(8)將該線圈層上的殘餘層除去以形成一 線圈結構，如此即完成該平面線圈。 •如上所述之方法，其中該壓模係選自以類深刻模造技術 (Lithographie GalVanoformung Abform，LIGA)以及微機電技術中之 1255471 一所製造。 如上所述之方法，其中該步驟(1)之該壓模 的一種所製造而成。 自矽及金屬中 如上所述之方法，其中該步驟(丨)之該壓模 及一滾筒壓模中之-。 自-平板壓模 佈之=上所述之方法’其找硬化層之設置方法係選自旋塗或塗 製成如上所述之方法，其找步驟(2)之紐細高分子聚合物所 ；^磨^所述之方法’更包含—步驟(9)，將該線圈層的多餘部分 如上所述之方法，其中該種子層係由物理 .1255471 玖, invention description: [Technical field of the invention], raw and ΐ Γ Γ 于 于 种 种 种 种 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造[Prior Art] The μ electric system is a very touch-sensitive technology of this century. The characteristics of this technology are combined in the , ΪΓ ΐ ,, to achieve multiple functions, so it is difficult to touch the logistics industry in the aviation machinery Acoustic technology Qiansheng 1 technical field towel, micro-planet is a large number of ί ϊ ϊ ϊ ϊ 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了Manufacturing methods, the most common ^, are the following, one of which belongs to the micro-electromechanical (MEMs> 々 ,, system, method to manufacture planar coils, the so-called semiconductor manufacturing method 大众 ^ public touch lithography side The method is therefore not repeated here. This - s ancient because of the lithography stacking process, the aspect ratio of the structure can be reached, that is, the line width can be small and the depth (thickness) of the line can be made of a planar coil. The cost is extremely high. 弋 衣 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 上述 上述 上述 上述 上述 上述 上述 上述 与 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述The process is only sucked by the catalyst Gravity and gravity make the gold and the price of the fee very long. In other words, the time cost is higher. Therefore, the above two methods can be seen as the manufacturing method of the micro-electromechanical device as a planar coil. The manufacturing method of electromechanical (MEMS), called strapless 1254471 ΐΐίΐ, has the problem of high cost and time consuming. Therefore, at this stage, the two production techniques, on the other hand, should be studied in academic research, in other words, it is difficult to implement In the industry. ^, There are also methods of using screen printing circuits to manufacture planar coils, and this k-point is in the mature technology, low in price, short in time, fine-printed manufacturing of planar coils, there is - quite serious The shortcoming, that is, the aspect ratio is extremely low, and the size is very large. In the current technology, the minimum is only 75 micrometers (Cong). Compared with the nanometer recording level, the micro-electromechanical system, the method is completely * comparable, and because of the deep The low aspect ratio makes the inductive performance of the planar coil manufactured by the method of stacking the brush circuit unsatisfactory, and the electric coil is much larger than the planar coil manufactured by the thin square handle with high aspect ratio, and the phenomenon of magnetic interference is also relatively heavy, or In order to achieve a better inductance, the moon has to increase the volume of the planar coil, which makes it difficult to meet the miniaturization requirements of the planar motor, micro-generator, and flexible circuit board used by MEMS. Therefore, in order to be able to balance The need for low cost and small size is currently a method of manufacturing a planar coil, which requires a low-cost manufacturing cost in addition to a planar coil having a high aspect ratio. The above problem, to avoid the existence of the missing, the main object of the present invention is to provide a method for manufacturing a planar coil, and also to manufacture a planar coil having a high aspect ratio to cope with the application of a driving device such as a MEMS system. In order to achieve the above object, the present invention provides a method for manufacturing a planar coil, comprising the following steps, (1) providing a stamper; (2) providing a substrate; (3) providing a hardened layer on the substrate; (4) imprinting the stamper on the hardened layer; (5) hardening the hardened layer; (6) providing a sublayer on the hardened layer after hardening In electroforming ⑺ line circle on the seed layer; and (8) removing the residue layer on the coil layer to form a coil structure, the planar coil is now complete. • The method as described above, wherein the stamper is selected from the group consisting of Lithographie GalVanoformung Abform (LIGA) and Microwave Technology 1255471. The method as described above, wherein one of the stampers of the step (1) is produced. The method as described above, wherein the step (丨) of the stamper and a roller stamper are -. The method for setting the hardened layer from the method of the flat-plate molding cloth is selected from the method of spin coating or coating as described above, and the method for finding the high-molecular polymer of the step (2) The method described further includes the step (9), the excess portion of the coil layer being as described above, wherein the seed layer is physically.
Physical Vapor Deposition)所設置。 關 貝(PVD· 化中H桃之方法’其巾該硬化層的㈣係選自熱硬化與光硬 如上所述之方法，其中該光硬化材料係選自 及負型光阻中的-種。 【實施方式】 勺人至第主頂,本發明之實施例的製造流程圖， 卜此壓模1係在-模材10上開設出凹痕12 f成^ Μ，接著步驟(2):提供-基材2，通妓以 ^^^废 再來是步驟⑶：在該基材2上設置—硬化層3，其 的設置方式可賤轉塗布、平塗布或姆之 【 或負型光阻的硬化層3設置在基材2之上;請再化型 驟(4) ··將該壓模i壓印在該硬化層3上，由模 凸痕Μ與凹痕U的高低差，因此，請同時配合第3圖斤开壓= 在硬化層3上即壓印出深凹槽31 ;之後，步驟(5):使該硬化， 1255471 加以硬化；步驟(6):設置一種子層4於硬化後之該硬化層3上， 種子層4的5又置方式現今多以滅鏡或物理氣相沉積(pvD: phySicaiPhysical Vapor Deposition) is set. The method of the method for the hardening of the hardened layer is selected from the group consisting of thermosetting and hardening, wherein the photohardening material is selected from the group consisting of and the negative resist. [Embodiment] From the spoon to the main top, the manufacturing flow chart of the embodiment of the present invention, the stamper 1 is provided with a dimple 12 f on the - mold material 10, followed by step (2): Providing - substrate 2, by means of ^^^, is the step (3): providing a hardened layer 3 on the substrate 2, which can be disposed by twist coating, flat coating or negative light The hardened layer 3 of the resist is disposed on the substrate 2; the re-formation step (4) is performed on the hardened layer 3, and the height difference between the stamp ridge and the dent U is Therefore, please simultaneously press the 3rd pin to open the pressure = emboss the deep groove 31 on the hardened layer 3; then, step (5): harden the hardening, 1255471; step (6): set a sub-layer 4 On the hardened layer 3 after hardening, the 5 layer of the seed layer 4 is now mostly destroyed by mirror or physical vapor deposition (pvD: phySicai)
Vap+orDeposition)的方式施行；接著請參閱第4圖，是步驟(7):以 電鑄之方式將一線圈層5形成於該種子層4上；最後以步驟: 將殘餘層51加以研磨除去，以防止短路的情形發生，並進而形成 一線圈結構5’，如此即完成本發明所欲製造的平面線圈。 雖然平面線圈不只一層，但各層之製造方法相同，故僅需舉 一層之例即可。至於多層的製造請參閱第6圖，也就是將步驟(1) 至步驟(8)重複施行以形成多層的線圈結構5，，並將各線圈結構5, 以鑽孔之方式貫通後，再以電鑄之方式導通，如此即完成了具有 多層構造之平面線圈。 此外，為使硬化層3上的深凹槽31具有高深寬比，因此將 f凹槽31壓印出來的凸痕14需具有高長寬比，為使凸痕14具有 咼長寬比，則凹痕12就必須做的深，故通常在壓模丨上開設凹痕 時f以微機電的方式加以製造，以目前來說較佳的技術是以類 深刻模造技術（LithographieGalVanoformungAbform，LIGA)，即 UGA-like (又稱為準分子雷射)的製造方法所製造，而壓模1的材 料y選自矽或金屬。當然，以微影蝕刻的方式製造亦無不可，只 要是能夠達到將凸痕14製造成具有高長寬比的方法皆可。 ^ 由此可知，固然以製造壓模1的技術而言，其所需之水準較 ^，成本也不低，然而，本發明以壓模1的方式將深凹槽31壓印 出+來的特點即在於壓模1可以重複使用多次，如此即可將壓 核1的成本平均分攤在大量生產的平面線圈上，所以她而二之， 又’壓模！除可以平板狀製造外，亦可啼筒(圖 =方式製造而成，如此更能方便連續壓印深凹槽31， 的生產線的-貫蚊為加強。 計崎囿 至於，該硬化層3的材料可從熱硬化材料與光硬化材料中選 1255471 以;擇:咖咖則得自紫她 從上述實施例可知，本發明的 造深凹槽，此-方摘㈣方式來製 影侧或是無電鍍方式，而且比^製造方法中的微 3比此本外發Τ-ΪΓΛΐΓ/然在製造*具有 可細j,故極卩二動re, r麵1 上。在本發明中’又可以細分為兩種略為J同:次=:面= ，化層可以光硬化材料或是熱硬化材料製造。二 材質以及壓印的型態係平壓或滾壓，以及種^二j 方式係以濺鍍或物理氣相沉積來達成，則可互通。 曰σ又置 飾，圍t:r匠思而為各式各樣之修 【圖式簡單說明】 以及 第1圖，係本發明一實施例之製造流程圖 第2圖’係本發明一實施例之製造流程圖 第3圖，係本發明一實施例之製造流程圖 第4圖’係本發明一實施例之製造流程圖 第5圖，係本發明一實施例之製造流程圖 第6圖，係本發明一實施例之製造流程圖 【符號簡單說明】 12 :凹痕 31 :深凹槽 1 :壓模 10 :模材 14 ·凸痕 2 :基材 3 :硬化層 1255471 4 :種子層 5 :線圈層 5’ ：線圈結構 51 :殘餘層Vap+orDeposition) is carried out; then, referring to FIG. 4, is step (7): forming a coil layer 5 on the seed layer 4 by electroforming; finally, by the step: grinding the residual layer 51 In order to prevent a short circuit from occurring, and further to form a coil structure 5', the planar coil to be manufactured by the present invention is completed. Although there are more than one layer of planar coils, the manufacturing methods of the layers are the same, so only one example is required. As for the manufacture of the multilayer, please refer to FIG. 6, that is, the steps (1) to (8) are repeatedly performed to form a multi-layered coil structure 5, and each coil structure 5 is penetrated by drilling, and then The electroforming is turned on, thus completing the planar coil having a multilayer structure. Further, in order to make the deep groove 31 on the hardened layer 3 have a high aspect ratio, the bump 14 imprinted by the f groove 31 needs to have a high aspect ratio, so that the burr 14 has a 咼 aspect ratio, and the dent 12 must be done deep, so it is usually fabricated in a micro-electromechanical manner when a dent is formed on the stamper. For the time being, the preferred technique is Lithographie Gal Vanoformung Abform (LIGA), ie UGA- The manufacturing method of like (also called excimer laser) is manufactured, and the material y of the stamper 1 is selected from ruthenium or metal. Of course, it is also possible to manufacture by lithography, as long as the method of manufacturing the bumps 14 to have a high aspect ratio can be achieved. ^ It can be seen from this that although the technique for manufacturing the stamper 1 is required to be of a lower quality and lower cost, the present invention embosses the deep groove 31 by + in the manner of the stamper 1. The characteristic is that the stamper 1 can be reused many times, so that the cost of the pressurizing core 1 can be evenly distributed on the mass-produced planar coil, so that she and the 'die! In addition to being made of a flat plate, it can also be made of a cylinder (Fig. = way of manufacture, so that it is more convenient to continuously emboss the deep groove 31, and the production line of the mosquito line is reinforced. 计崎囿, the hardened layer 3 The material may be selected from the thermosetting material and the photohardening material by 1255471; the choice: the coffee coffee is obtained from the purple. From the above embodiments, the deep groove of the present invention, the side-by-side (four) way to the shadow side or The electroless plating method, and the micro-3 in the manufacturing method is thinner than the micro-spinning in the manufacturing method*, so it is extremely movable, r-plane 1. In the present invention, Subdivided into two kinds of J: the same =: = = face =, the layer can be made of photohardenable material or thermosetting material. The second material and the embossed type are flat or rolled, and the two types are If it is achieved by sputtering or physical vapor deposition, it can be intercommunicated. 曰σ is also decorated, and the surrounding t:r is a variety of repairs [simple description of the drawing] and the first figure, which is an implementation of the present invention. 2 is a manufacturing flow chart of a first embodiment of the present invention, which is a manufacturing process according to an embodiment of the present invention. Figure 4 is a manufacturing flow chart of an embodiment of the present invention, and is a manufacturing flow chart of an embodiment of the present invention. Figure 6 is a flow chart of manufacturing according to an embodiment of the present invention. : Dent 31 : Deep groove 1 : Die 10 : Mold 14 · Bulge 2 : Substrate 3 : Hardened layer 1254471 4 : Seed layer 5 : Coil layer 5 ' : Coil structure 51 : Residual layer