CN113835295B - Imprinting method of micro-nano features - Google Patents
Imprinting method of micro-nano features Download PDFInfo
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- 238000002360 preparation method Methods 0.000 claims abstract description 14
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- 238000012546 transfer Methods 0.000 abstract description 10
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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Abstract
The invention relates to the technical field of micromachining, in particular to an imprinting method of micro-nano features, which comprises a die preparation step and an imprinting and demolding step, wherein the tail end of a metal wire is promoted to form a metal ball by controlling electronic ignition of a wire bonding instrument, micro-nano features on the surface of an original die are promoted to be imprinted on an imprinting plane of the metal ball by utilizing bonding force and bonding temperature so as to form a metal ball die, and finally the micro-nano features are imprinted on a mask layer on the surface of a target substrate through the metal ball die, and the die preparation step and the imprinting and demolding step are completed through a standard wire bonding instrument, so that flexible and efficient transfer of different micro-nano scale features from the original die to the target substrate is realized; compared with the existing methods such as photoetching, nanoimprint and the like, the method provided by the invention has the advantages that the number of required original molds is small, and different micro-nano scale features can be flexibly selected and combined.
Description
Technical Field
The invention relates to the technical field of micro-machining, in particular to an imprinting method of micro-nano features.
Background
The transfer of micro-nano scale features (patterns) from templates to different substrate surfaces is a key and initial step of a micro-processing process flow in the technical fields of microelectronics and microelectromechanical, and is also the basis for the subsequent preparation of various microstructures through processes such as deposition, etching and the like.
Conventional photolithography processes, which use photoresist and masks to accomplish the transfer of microscale features, have been applied on a large scale, however, their resolution is difficult to reach the nanoscale. In recent years, the nanoimprint technology overcomes the defect of insufficient resolution of the photolithography process, and realizes the large-scale transfer of nanoscale features by using a mold prepared by electron beam etching. However, the method realizes synchronous transfer of micro-nano scale features on all the molds, and if different micro-nano scale features need to be combined, such as changing relative positions, a plurality of molds are required to be prepared, so that the process is complicated and the cost is increased.
Therefore, the existing micro-nano scale feature transferring method lacks flexibility, a plurality of dies are required to be manufactured when the flexible combination of a plurality of micro-nano scale features is realized, the process is complicated, and the transferring method is low in efficiency in application occasions such as process principle verification.
Disclosure of Invention
Aiming at the technical problems existing in the prior art, the invention provides the imprinting method of the micro-nano features, which is helpful for solving the problem that the efficiency is lower because a plurality of dies need to be prepared when the prior art realizes flexible selection and combination of various micro-nano scale features in application occasions such as prototype verification and the like.
The invention provides an imprinting method of micro-nano characteristics, which comprises a mould preparation step and an imprinting and demoulding step, wherein,
the preparation steps of the die are as follows: the electronic ignition of the wire bonding instrument is controlled to enable the tail end of the metal wire to form a metal ball, the metal ball is controlled to contact the plane substrate and apply bonding force to enable the tail end of the metal ball to form an imprinting plane, the imprinting plane of the metal ball is mutually in extrusion contact with a pre-prepared original die by utilizing the bonding force and bonding temperature applied by the wire bonding instrument, and micro-nano features on the surface of the original die are enabled to be imprinted on the imprinting plane of the metal ball to form the metal ball die;
the steps of stamping and demoulding are as follows: and utilizing bonding force or bonding force and bonding temperature applied by a wire bonding instrument to press and contact the metal ball die and the mask layer on the surface of the target substrate, so as to enable micro-nano characteristics of an imprinting plane on the metal ball die to be imprinted on the mask layer on the surface of the target substrate, and removing the metal ball die from the mask layer after curing the mask layer.
According to the imprinting method of the micro-nano feature, in the imprinting and demolding steps, an electronic sparking current is led into a grounding unit in advance, so that the current is prevented from passing through the metal ball mold.
According to the imprinting method of the micro-nano feature, in the imprinting and demolding steps, the grounding unit is a grounding metal rod.
According to the imprinting method of the micro-nano features, in the imprinting and demolding steps, the electronic sparking current is set to be a low current value so as to prevent the current from damaging the micro-nano features on the metal ball mold.
According to the imprinting method of the micro-nano features, in the imprinting and demolding steps, the mask layer on the target substrate is subjected to heat treatment to realize solidification treatment of the mask layer.
According to the imprinting method of the micro-nano features, ultraviolet light is utilized to penetrate through the target substrate and the mask layer is cured in the imprinting and demolding steps.
According to the imprinting method of the micro-nano features, the micro-nano features on the surface of the original mold are prepared through photoetching, electron beam etching and reactive ion etching.
According to the imprinting method of the micro-nano features, the mask layer is made of thermoplastic polymer materials or photo-polymerization polymer materials, the mask layer is deposited on the target substrate in a spin coating or spray coating mode, and the thickness of the mask layer is larger than the depth of the micro-nano features on the surface of the metal ball die.
The imprinting method of the micro-nano features, according to the invention, further comprises the following post-processing steps: and removing the residual mask layer material at the bottom of the micro-nano features, which covers the surface of the target substrate, so that the target substrate is exposed.
According to the imprinting method of the micro-nano features, when the metal ball mold is required to be prepared again to imprint new micro-nano features, the used metal ball mold is bonded with the recovery substrate with the surface containing the metal plating layer by controlling the wire bonding instrument, so that the metal ball mold is separated from the metal wire and fixed on the recovery substrate, and the waste treatment of the metal ball mold is completed; the broken metal wire is used in the preparation of new metal spheres for imprinting new micro-nano features.
According to the imprinting method of the micro-nano features, after imprinting of the micro-nano features is completed once and etching of the surface of the target substrate is carried out, a mask layer is coated on the target substrate imprinted with the micro-nano features again, and imprinting of micro-nano features with different shapes is carried out on the mask layer at positions corresponding to the positions imprinted with the micro-nano features, so that stacking combination imprinting of a plurality of different micro-nano features on the same target substrate is realized.
According to the imprinting method of the micro-nano features, provided by the invention, the tail end of the metal wire is promoted to form the metal ball by controlling the electronic ignition of the wire bonding instrument, the micro-nano features on the surface of the original die are promoted to be imprinted on the imprinting plane of the metal ball by utilizing the bonding force and the bonding temperature applied by the wire bonding instrument, so as to form the metal ball die, and finally, the micro-nano features are imprinted on the mask layer on the surface of the target substrate by controlling the metal ball die by utilizing the wire bonding instrument under the action of the bonding force or the bonding force and the bonding temperature; compared with the existing methods such as photoetching, nanoimprint and the like, the method provided by the invention has the advantages of small number of required original molds, and being beneficial to flexibly selecting and combining different micro-nano scale features.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic process diagram of a mold preparation step in accordance with an embodiment of the present invention;
FIG. 2 is a schematic illustration of the process of the imprinting and demolding steps of the first embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a process of the imprinting and demolding steps in a second embodiment of the present invention;
FIG. 4 is a schematic diagram showing the process of the discarding step of the metal ball mold according to the present invention;
FIG. 5 is a schematic diagram of a process for imprint lithography of stacks of different micro-nano scale features in accordance with the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The imprinting method of micro-nano features includes mold preparation and imprinting and demolding steps,
as shown in fig. 1, which is a schematic process diagram of a die preparation step, a simulated ball bonding-wedge bonding process using a standard wire bonder is implemented, and specifically includes:
as shown in fig. 1 (a) and 1 (b), first, by manipulating a wire bonder, a metal ball 103 is generated by electronic firing between a firing electrode 20 and a wire 101, the metal ball 103 being formed at the bottom end of the wire 101;
then, as shown in fig. 1 (c), the wire bonder is used to control the movement of the metal ball 103 and control the metal ball 103 to contact the flat substrate 301 with a smooth surface downwards, the wire bonder is used to apply bonding force downwards through the ceramic nozzle 102, so that the tail end of the metal ball 103 is pressed downwards against the flat substrate 301, the bottom tail end of the metal ball can form an embossing plane, as shown in fig. 1 (d), and then the metal ball is separated from the flat substrate 301;
in the above steps, the flat substrate 301 having a smooth surface was made of silicon (surface polishing treatment), the wire bonding force applied was set to 1500mN, the bonding time was 50ms, no ultrasonic vibration energy was applied, and the diameter of the top flat surface of the metal ball 103 formed was about 80 μm;
finally, as shown in fig. 1 (e) and fig. 1 (f), under the control of a wire bonder, the stamping plane at the bottom end of the metal ball 103 is contacted with the micro-nano scale feature structure 402 on the surface of the pre-prepared original mold 401, and under the action of the bonding force and the bonding temperature (the bonding force and the bonding temperature are generated by using the wire bonder), the stamping plane material at the bottom of the metal ball 103 can squeeze and fill the micro-nano scale feature structure 402 (i.e. micro-nano feature) on the surface of the original mold 401, so that the micro-nano scale feature structure 402 on the surface of the original mold 401 can be stamped on the stamping plane at the bottom of the metal ball 103, so that the metal ball 103 forms the metal ball mold 105.
After the above steps are completed, the imprinting and demolding steps are performed, and the process is implemented by using a single-step ball bonding process simulated by a wire bonding apparatus, as shown in fig. 2, and includes:
as shown in fig. 2 (a), the wire bonding apparatus is used to control the metal ball mold 105 to move and contact with the mask layer 602 on the surface of the target substrate 601, and the mask layer 602 is caused to squeeze the micro-nano feature 104 filling the imprinting plane at the bottom of the metal ball mold 105 under the action of the bonding force and the bonding temperature by using the bonding force and the bonding temperature applied by the wire bonding apparatus, so that the micro-nano feature 104 can be imprinted on the mask layer 602.
As shown in fig. 2 (b), after the mask layer 602 is cured, the metal ball mold 105 is separated from the mask layer 602 on the surface of the target substrate 601, so that the micro-nano structure 603 for reproducing the size features of the micro-nano feature structure 104 is formed on the surface of the mask layer 602, and the imprint transfer of the micro-nano feature from the original mold 401 to the target substrate 601 is accurately realized.
In the step of performing the imprinting and the demolding, an electronic sparking current in a wire bonding process is introduced into the grounding unit from the sparking electrode 20 in advance, so that the current is prevented from passing through the metal ball mold 105, and deformation damage of the micro-nano characteristic structure 104 on the bottom surface of the metal ball mold 105 is prevented.
Specifically, the grounding unit is a grounding metal rod 50, more specifically, the grounding metal rod 50 may be a tungsten needle or a separate gold wire;
it can be appreciated that, since the bottom end of the metal sphere 103 forms the stamping plane, the micro-nano scale feature 402 on the surface of the original mold 401 can be completely stamped on the bottom of the metal sphere 103, so as to avoid the incomplete micro-feature during the stamping and re-stamping process.
According to the imprinting method of the micro-nano features, the tail ends of metal wires are promoted to form metal balls through electronic ignition triggered by controlling a wire bonding instrument, bonding force and bonding temperature applied by the wire bonding instrument are utilized to promote micro-nano features on the surface of an original die to be imprinted on an imprinting plane of the metal balls so as to form a metal ball die, and finally, under the action of the bonding force or bonding force and bonding temperature, the wire bonding instrument is utilized to control the metal ball die to imprint the micro-nano features on a mask layer on the surface of a target substrate, and as the die preparation step and the imprinting and demolding step are completed by adopting a standard wire bonding instrument widely used in industry and by means of standard ball bonding and wedge bonding wire bonding process, the flexible and efficient transfer of the features of different micro-nano dimensions from the original die to the target substrate can be conveniently realized, and different micro-nano scale features which are flexibly selected and combined can be realized, and the precision is high; compared with the existing methods such as photoetching, nanoimprint and the like, the method provided by the invention has the advantages of small number of required original molds, and being beneficial to flexibly selecting and combining different micro-nano scale features.
Optionally, in the steps of stamping and demolding, the electronic sparking current can be set to be a low current value, and the electronic sparking current is set to be close to a zero value, so that the influence of the current on the microstructure feature of the surface of the metal ball mold can be avoided, deformation and damage are prevented, the use of a grounded metal rod is avoided, and the flow is simplified.
Alternatively, the metal ball 103 may be formed by electronic sparking a metal wire made of a metal such as Au, ag, al, cu or an alloy thereof, and specifically, the metal ball material provided in this embodiment is gold with a diameter of 125 μm, and the gold wire used has a diameter of 25 μm.
Optionally, the original mold 401 provided in this embodiment is a silicon wafer, and its surface micro-nano scale feature structure is a circular micro-pit with a diameter of 10 μm and a depth of 2 μm, and patterning is achieved by photolithography and reactive ion etching; the applied wire bonding force was set at 2500mN, the bonding time was 100ms, the bonding temperature was 200℃and no ultrasonic vibration energy was applied.
Alternatively, the micro-nano features of the surface of the original mold 401 are prepared by photolithography, electron beam etching, reactive ion etching processes.
Optionally, in this embodiment, the mask layer 602 is a thermoplastic polymer material, and the mask layer is deposited on the target substrate by spin coating or spray coating, and the thickness of the mask layer is greater than the depth of the micro-nano feature on the surface of the metal ball mold.
Alternatively, in this embodiment, the mask layer 602 is made of a thermoplastic polymer material, so in this embodiment, the mask layer 602 on the target substrate 601 is cured by heat treatment.
After the imprinting and demolding steps are finished, the embodiment further comprises a post-processing step, including:
referring to fig. 2 (b) and fig. 2 (c), the mask layer 602 on the surface of the target substrate 601 is processed by using an oxygen plasma etching process, so that the residual mask layer material at the bottom of the micro-nano structure 603 and covering the surface of the target substrate 601 is removed, and the target substrate material is exposed (as shown in fig. 2 (c)), thereby facilitating the subsequent processing such as reactive ion etching on the target substrate.
Alternatively, the target substrate 601 may be selected from a wafer-like standard-sized substrate, a small die substrate, and other sized flexible or inflexible substrates.
The metal ball mold 105 described above may be recycled.
Through the steps, the imprinting transfer of the once complete micro-nano scale features is completed.
Example two
The difference between this embodiment and the embodiment is that, as shown in fig. 3 (a), after the mask layer 702 presses the micro-nano feature 104 filling the stamping plane at the bottom of the metal ball mold 105, so that the micro-nano feature 104 is stamped on the mask layer 702, the ultraviolet light is utilized to penetrate the target substrate 701 upwards and cure the mask layer 702;
in order to enable ultraviolet light required for curing the mask layer 702 to penetrate the target substrate 701, the target substrate 701 provided in this embodiment is a glass sheet, so that light is convenient to penetrate, and the mask layer 702 is made of a photo-polymerization polymer material, so that curing of the mask layer 702 is realized by using light, specifically, the mask layer 702 in this embodiment is made of photoresist, and the thickness is about 3 μm; the bonding force is 200mN, the bonding time is 10s, the bonding temperature is room temperature, and no ultrasonic vibration energy is applied;
as shown in fig. 3 (b), after the mask layer 702 is cured, the metal ball mold 105 is separated from the surface of the target substrate 701, so that the micro-nano structure 703 for reproducing the dimensional features of the micro-nano structure 104 is formed on the surface of the mask layer 702.
The parts not mentioned in this embodiment are the same as those in the first embodiment, and will not be described here again.
Based on the first embodiment and the second embodiment, further, the method further includes a step of discarding the metal ball mold 105, as shown in fig. 4, which includes the following steps:
as shown in fig. 4 (a), when the metal ball mold is to be newly prepared to imprint and reproduce a new micro-nano feature, the used metal ball mold 105 is bonded to the recovery substrate 801 with the metal plating layer 802 on the surface by controlling the wire bonder under the bonding pressure and the bonding temperature applied by the wire bonder, so that the metal ball mold 105 is separated from the metal wire 101 and fixed on the recovery substrate 801, thereby completing the disposal of the metal ball mold 105.
The recycling substrate 801 provided in this embodiment is a silicon die, and the surface metal plating layer 802 is composed of 50nm thick TiW and 300nm thick Au, deposited by electron beam evaporation; the bonding force applied is 1000mN, the bonding temperature is 150 ℃, and the ultrasonic vibration energy is 30%;
as shown in fig. 4 (b), the rear porcelain nozzle 102 is lifted, the wire 101 is broken, and the metal ball mold 105 becomes the waste metal ball mold 106 fixedly attached to the recovery substrate 801;
the broken wire 101 can be used in the preparation of new metal sphere molds for imprinting new micro-nano features.
Based on the above first and second embodiments, further, as shown in fig. 5, a process of transferring and stacking different micro-nano scale features on a target substrate is further included, that is, after imprinting of one micro-nano feature is completed and etching of the surface of the target substrate is performed, a mask layer is recoated on the target substrate imprinted with the micro-nano feature, and imprinting of different shapes of micro-nano features is performed on the mask layer at a position corresponding to the imprinted micro-nano feature, so as to implement stacked combination imprinting of a plurality of different micro-nano features, which includes:
firstly, the first micro-nano scale structure feature 604 is transferred on the target substrate 601 by using the transfer method described in the first embodiment, as shown in fig. 5 (a), and the detailed process is not repeated;
then, the target substrate 601 is subjected to deep reactive ion etching to form a micro-nano scale structure 605, as shown in fig. 5 (b);
removing the mask layer on the surface of the target substrate 601 by a solvent such as acetone, as shown in fig. 5 (c);
a new mask layer 606 is coated on the surface of the target substrate 601 again, and the material of the mask layer is still thermoplastic, as shown in fig. 5 (d);
then, as shown in fig. 5 (e) to 5 (f), using the optical alignment function of the wire bonder, by the same method as in the first embodiment, the imprint transfer of the second micro-nano scale feature 109 is performed on the target substrate 601 at a position above the first micro-nano scale feature 605, so that the second micro-nano scale feature 607 stacked with the first micro-nano scale feature 605 is formed on the new mask layer 606, which corresponds to the imprinting of the micro-nano feature of the different shape again on the mask layer at the position corresponding to the imprinted micro-nano feature; the materials and process parameters used in this embodiment are the same as those in the first embodiment, and thus are not described here again;
finally, as shown in fig. 5 (g) to 5 (h), the target substrate 601 is further etched with two different micro-nano scale structures 605 and 608 by using the implementation method shown in fig. 5 (a) to 5 (c), and as shown in fig. 5 (h), the stacked combination imprinting of multiple different micro-nano features on the same target substrate is finally realized, wherein the micro-nano scale features stacked on each other are usually in a central symmetrical pattern, so that the requirement on rotation positioning precision during alignment is low.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The imprinting method of the micro-nano features is characterized by comprising a mold preparation step and an imprinting and demolding step, wherein,
the preparation steps of the die are as follows: the electronic ignition of the wire bonding instrument is controlled to enable the tail end of the metal wire to form a metal ball, the metal ball is controlled to contact the plane substrate and apply bonding force to enable the tail end of the metal ball to form an imprinting plane, the imprinting plane of the metal ball is mutually in extrusion contact with a pre-prepared original die by utilizing the bonding force and bonding temperature applied by the wire bonding instrument, and micro-nano features on the surface of the original die are enabled to be imprinted on the imprinting plane of the metal ball to form the metal ball die;
the steps of stamping and demoulding are as follows: and utilizing bonding force or bonding force and bonding temperature applied by a wire bonding instrument to press and contact the metal ball die and the mask layer on the surface of the target substrate, so as to enable micro-nano characteristics of an imprinting plane on the metal ball die to be imprinted on the mask layer on the surface of the target substrate, and removing the metal ball die from the mask layer after curing the mask layer.
2. The method of imprinting micro-nano features according to claim 1, wherein an electronic sparking current is introduced into a grounding unit in advance during the imprinting and de-imprinting steps, the grounding unit being a grounded metal rod, preventing the current from passing through the metal ball mold.
3. The method of claim 1, wherein the step of stamping and stripping sets the electronic firing current to a low current value to prevent the current from damaging the micro-nano features on the metal ball mold.
4. The method according to claim 1, wherein the curing of the mask layer is performed by heat-treating the mask layer on the target substrate during the imprinting and de-imprinting steps.
5. The method according to claim 1, wherein in the imprinting and demolding steps, ultraviolet light is used to penetrate the target substrate and cure the mask layer.
6. The method according to claim 1, wherein the micro-nano features on the surface of the original mold are prepared by photolithography, electron beam etching, and reactive ion etching.
7. The method according to claim 1, wherein the mask layer is made of thermoplastic polymer material or photo-polymerization polymer material, the mask layer is deposited on the target substrate by spin coating or spray coating, and the thickness of the mask layer is greater than the depth of the micro-nano features on the surface of the metal ball mold.
8. The method of imprinting micro-nano features according to any one of claims 1-7, further comprising a post-processing step of: and removing the residual mask layer material at the bottom of the micro-nano features, which covers the surface of the target substrate, so that the target substrate is exposed.
9. The method for imprinting micro-nano features according to claim 1, wherein when the metal ball mold is newly prepared to imprint a new micro-nano feature, the wire bonding apparatus is controlled to bond the used metal ball mold with the recovery substrate with the metal plating layer on the surface, so that the metal ball mold is separated from the metal wire and fixed on the recovery substrate, thereby completing the disposal of the metal ball mold; the broken metal wire is used in the preparation of new metal spheres for imprinting new micro-nano features.
10. The imprinting method of micro-nano features according to claim 1, wherein after imprinting of the micro-nano features is completed once and etching of the surface of the target substrate is performed, a mask layer is recoated on the target substrate imprinted with the micro-nano features, and imprinting of micro-nano features with different shapes is performed on the mask layer at positions corresponding to the positions imprinted with the micro-nano features, so that stacked combination imprinting of a plurality of different micro-nano features on the same target substrate is realized.
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