經濟部智慈財產局Μ工消f合作社印製 1253891 A7 _____ B7五、發明説明（j ) 【發明領域】 本發明是關於表面被平坦化的印刷配線基板的製造方 法。 【發明背景】 【習知技藝之說明】 對於以例如增層法（Build-up)製造多層印刷配線板，爲 了配線的筒拾度化需要平坦化下層基板的表面。但是’由 於印刷基板的電路圖案一般藉由鈾刻（Etch)除去銅箔的不要 部分的去掉（Subtract)法製造，故形成電路圖案部分由基材 表面隆起的凹凸狀。 因此，爲了平坦化如上述表面形成凹凸狀的印刷基板 ，例如如以下的方法被提出。例如使半硬化狀態的樹脂薄 片疊層於電路圖案上，在減壓環境下中介平滑板按壓 (Press)此樹脂薄片，埋入於電路圖案間使其硬化，然後， 平面硏磨樹脂表面的方法習知以來被提出。 但是，由於基板上的電路圖案有疏或密的部分的情形 ，或貫通孔（Through hole)的有無等，有無法均勻且良好地 形成樹脂層的情形。例如電路圖案在密的部分中，在電路 圖案間很難壓入樹脂薄片，因未充塡部分殘留故在後製程 中產生孔洞（Voids)，或因在電路圖案上殘存相當厚的樹脂 ，使樹脂層表面不平坦，變成電路圖案僅形成密的部分緩 緩地隆起的狀態。而且相反地電路圖案在疏的部分或形成 有貫通孔的部分中，與其他部分比較樹脂量不足’樹脂層 (請先閱讀背面之注意事項再填寫本頁) -裝· 訂 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 1253891 A7 B7 五、發明説明（2) 的表面緩緩地變成凹陷的狀態。在這種狀態下即使中介平 滑板進行按壓，樹脂層全體也難以均勻地形成，而且，精 度佳地進行具有這種緩緩的起伏的基板的平坦硏磨也很困 難。 本發明乃鑒於上述事情所進行的創作，其目的爲提供 即使有電路圖案的疏密或貫通孔的有無，也能在基板全體 形成均勻良好的樹脂層的印刷配線基板的製造方法。 【發明槪要】 爲了解決上述課題所進行的本發明在形成有電路圖案 的印刷配線基板上重疊半硬化狀態的樹脂薄片形成樹脂層 ，按壓此樹脂層壓入該電路圖案間使其硬化，然後藉由覆 蓋該電路圖案硏磨硬化的樹脂，使該電路圖案露出的印刷 配線基板的製造方法，在該印刷配線基板上重疊樹脂薄片 前’於與該樹脂薄片的該電路圖案面對的面印刷該電路圖 案的逆圖案的樹脂之處具有特徵。 而且，在形成有貫通孔以及電路圖案的印刷配線基板 上’重疊半硬化狀態的樹脂薄片形成樹脂層，按壓此樹脂 層壓入該電路圖案間使其硬化，然後藉由覆蓋該電路圖案 硏磨硬化的樹脂，使該電路圖案露出的印刷配線基板的製 造方法，在該印刷配線基板上重疊樹脂薄片前，於該樹脂 薄片之中對應該貫通孔的位置，印刷塡埋該貫通孔用的樹 脂之處具有特徵。 對樹脂層的按壓是在減壓環境中進行也可以。而且在 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) -裝· 經濟部智慧財產局員工消費合作社印製 -6 - 經濟部智慧財產局員工消費合作社印製 1253891 A7 ___B7 五、發明説明（3) 樹脂層上重疊面對樹脂層的面被粗面化的金屬箔而按壓也 可以。此情形金屬箔可藉由與電路圖案異種的金屬而形成 〇 如果依照本發明因樹脂層被按壓，故即使該樹脂層在 電路圖案的形成部分緩緩地隆起，此隆起也被壓碎使樹脂 層全體變薄而寬。此時，即使基板上的電路圖案有疏密， 因在面對樹脂薄片的電路圖案的面預先印刷有電路圖案的 逆圖案的樹脂，故樹脂層與電路圖案的疏密無關，全體被 均勻化。若在此狀態下使樹脂硬化的話，因在電路圖案上 僅殘留相當薄的樹脂層，藉由以不傷及電路圖案的強度來 硏磨，故可得到露出電路圖案的平坦的基板。 而且，對於基板具有貫通孔的情形，藉由於樹脂薄片 之中對應貫通孔的位置預先印刷樹脂，貫通孔內也不會使 樹脂不足，且也能均勻地形成基板上的樹脂層全體。 此外，藉由在減壓環境中進行對樹脂層的按壓，即使 假設在樹脂層內包含有氣泡，也能除去該氣泡。 而且，在按壓樹脂層時，若在樹脂層上中介面對樹脂 層的面被粗面化的金屬箔的話，使樹脂層更容易變薄而寬 ，而且，該樹脂層的表面仿照金屬箔的粗面化表面變成微 細的凹凸狀。其結果可更容易進行殘留樹脂層的硏磨。 再者，對於以與電路圖案異種的金屬形成上述金屬箔 的情形，僅使金屬箔溶解，可藉由對電路圖案的金屬不給 予影響的選擇的蝕刻除去金屬箔。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閱讀背面之注意事項再填寫本頁)The Ministry of Economic Affairs, Zhici, and the Ministry of Commerce, the Ministry of Commerce, and the Ministry of Commerce, Printed on the website. 1253891 A7 _____ B7 V. [Invention] (J) Field of the Invention The present invention relates to a method of manufacturing a printed wiring board having a flat surface. [Description of the Invention] The multilayer printed wiring board is manufactured by, for example, a build-up method, and it is necessary to planarize the surface of the lower substrate in order to achieve the cylinder pick-up of the wiring. However, since the circuit pattern of the printed circuit board is generally manufactured by a subtractive method of removing unnecessary portions of the copper foil by erbium etching (Etch), the circuit pattern portion is formed in a concavo-convex shape in which the surface of the substrate is raised. Therefore, in order to planarize the printed circuit board having the uneven surface formed as described above, for example, the following method has been proposed. For example, a semi-hardened resin sheet is laminated on a circuit pattern, and a resin sheet is pressed by a smoothing plate under a reduced pressure environment, embedded in a circuit pattern to be hardened, and then a method of planarly honing a resin surface It has been proposed since the beginning. However, in the case where the circuit pattern on the substrate has a thin or dense portion, or the presence or absence of a through hole, the resin layer may not be formed uniformly and satisfactorily. For example, in a dense portion of the circuit pattern, it is difficult to press the resin sheet between the circuit patterns, and voids are generated in the post-process due to the remaining portion, or a relatively thick resin remains on the circuit pattern. The surface of the resin layer is not flat, and the circuit pattern is in a state in which only a dense portion is gradually raised. In addition, the circuit pattern is in a thin portion or a portion in which a through hole is formed, and the amount of resin is insufficient compared with other portions. 'Resin layer (please read the back of the page before refilling this page) - Loading and setting the paper size China National Standard (CNS) A4 specification (210X297 mm) -5- 1253891 A7 B7 V. The surface of the invention (2) gradually becomes a recessed state. In this state, even if the intermediate slider is pressed, it is difficult to form the entire resin layer uniformly, and it is difficult to perform the flat honing of the substrate having such gentle undulations with an excellent degree of precision. In view of the above, it is an object of the present invention to provide a method of manufacturing a printed wiring board in which a uniform resin layer can be formed on the entire substrate even if the circuit pattern is dense or the presence or absence of a through hole. [Invention] In the present invention, a resin sheet is formed by laminating a resin sheet having a semi-hardened state on a printed wiring board on which a circuit pattern is formed, and the resin is laminated and cured between the circuit patterns. A method of manufacturing a printed wiring board in which the circuit pattern is cured by covering the circuit pattern honing and hardening, and printing on a surface facing the circuit pattern of the resin sheet before the resin sheet is superposed on the printed wiring board The resin of the reverse pattern of the circuit pattern is characterized. Further, a resin sheet having a semi-hardened state is formed on the printed wiring board on which the through holes and the circuit pattern are formed, and the resin layer is pressed and laminated between the circuit patterns to be hardened, and then the circuit pattern is honed by covering the circuit pattern. In the method of manufacturing a printed wiring board in which the circuit pattern is exposed, a resin for burying the through hole is printed at a position corresponding to the through hole in the resin sheet before the resin sheet is superposed on the printed wiring board. There are features. The pressing of the resin layer may be carried out in a reduced pressure environment. Also, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied to the paper scale (please read the notes on the back and fill out this page) - Installation · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed - 6 - Ministry of Economic Affairs The Intellectual Property Office employee consumption cooperative prints 1253891 A7 ___B7 V. Inventive Note (3) It is also possible to press the surface of the resin layer which is overlapped with the surface of the resin layer by the roughened metal foil. In this case, the metal foil can be formed by a metal different from the circuit pattern. If the resin layer is pressed according to the present invention, the ridge is crushed even if the resin layer is gradually raised in the formation portion of the circuit pattern. The layers are thin and wide. At this time, even if the circuit pattern on the substrate is dense, the resin of the reverse pattern of the circuit pattern is printed in advance on the surface facing the circuit pattern of the resin sheet, so that the resin layer is not uniform with the density of the circuit pattern, and the whole is uniformized. . When the resin is cured in this state, only a relatively thin resin layer remains on the circuit pattern, and the substrate can be honed without impairing the strength of the circuit pattern, so that a flat substrate having a circuit pattern exposed can be obtained. Further, in the case where the substrate has a through hole, the resin is printed in advance in the position of the corresponding through hole in the resin sheet, the resin is not insufficient in the through hole, and the entire resin layer on the substrate can be uniformly formed. Further, by pressing the resin layer in a reduced pressure environment, it is possible to remove the bubbles even if air bubbles are contained in the resin layer. Further, when the resin layer is pressed, if the metal foil whose surface of the resin layer is roughened on the resin layer is interposed, the resin layer is more easily thinned and widened, and the surface of the resin layer is modeled on the metal foil. The roughened surface becomes a fine uneven shape. As a result, honing of the residual resin layer can be performed more easily. Further, in the case where the metal foil is formed of a metal different from the circuit pattern, only the metal foil is dissolved, and the metal foil can be removed by selective etching which does not affect the metal of the circuit pattern. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) (please read the notes on the back and fill out this page)
經濟部智慧財產局員工消費合作社印製 1253891 A7 ______B7 五、發明説明（4) 【圖示之簡單說明】 圖1是貼銅疊層板的剖面圖。 圖2是相同地形成電路圖案的配線基板的剖面圖。 圖3是以與本發明的第一實施形態有關的樹脂薄片形 成樹脂層的情形的配線基板的剖面圖。 圖4是相同地顯示減壓按壓時的佈局的配線基板的剖 面圖。 圖5是相同地樹脂硬化後的配線基板的剖面圖。 圖6是相同地除去金屬箔後的配線基板的剖面圖。 圖7是相同地硏磨後的配線基板的剖面圖。 圖8是在貼銅疊層板形成貫通孔的配線基板的剖面圖 〇 圖9是相同地形成電鍍層的配線基板的剖面圖。 圖1 〇是相同地形成電路圖案的配線基板的剖面圖。 圖Π是以與本發明的第二實施形態有關的樹脂薄片形 成樹脂層的情形的配線板的剖面圖。 圖1 2是相同地顯示減壓按壓時的佈局的配線基板的剖 面圖。 圖1 3是相同地樹脂硬化後的配線基板的剖面圖。 圖14是相同地除去金屬箔後的配線基板的剖面圖。 圖1 5是相同地硏磨後的配線基板的剖面圖。 【符號說明】 1 〇:貼銅疊層板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumer Cooperatives 1253891 A7 ______B7 V. INSTRUCTIONS (4) [Simple description of the illustration] Figure 1 is a cross-sectional view of a copper-clad laminate. 2 is a cross-sectional view of a wiring board in which a circuit pattern is formed in the same manner. Fig. 3 is a cross-sectional view showing a wiring board in a case where a resin sheet is formed of a resin sheet according to the first embodiment of the present invention. Fig. 4 is a cross-sectional view of the wiring board in which the layout at the time of pressure reduction pressing is similarly displayed. Fig. 5 is a cross-sectional view showing a wiring board in which the resin is cured in the same manner. Fig. 6 is a cross-sectional view showing the wiring board after the metal foil is removed in the same manner. Fig. 7 is a cross-sectional view of the wiring board after the same honing. 8 is a cross-sectional view of a wiring board in which a through-hole is formed in a copper-clad laminate. FIG. 9 is a cross-sectional view of a wiring board in which a plating layer is formed in the same manner. Fig. 1 is a cross-sectional view of a wiring board in which a circuit pattern is formed in the same manner. The cross-sectional view of the wiring board in the case where the resin sheet is formed of the resin sheet according to the second embodiment of the present invention. Fig. 12 is a cross-sectional view of the wiring board in which the layout at the time of pressure reduction pressing is similarly displayed. Fig. 13 is a cross-sectional view of the wiring board in which the resin is cured in the same manner. Fig. 14 is a cross-sectional view showing the wiring board after the metal foil is removed in the same manner. Fig. 15 is a cross-sectional view of the wiring board after the same honing. [Description of Symbols] 1 〇: Copper-clad laminate This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back and fill out this page)
-8 - 1253891 A7 B7 五、發明説明（5) u:玻璃環氧基板 12:銅箔 貫通孔 14:電鍍層 15:電路圖案 1 6 :樹脂層 1 7 ··鎳箔 1 8 :特氟隆薄片 1 9:不銹鋼板 20:樹脂薄片 【較佳實施例之詳細說明】 <第一實施形態> 在本實施形態如圖1所示，基材使用例如在厚度 100〜3 00 // m的玻璃環氧基板11的兩面貼附銅箔12而成的 貼銅疊層板1 0。在此貼銅疊層板1 0利用周知的光蝕刻法形 成電路圖案15(參照圖2)。 其次如圖3所示，在配線基板的電路圖案1 5上藉由疊 層例如令熱硬化性環氧樹脂爲半硬化狀態的厚度約30 // m 的樹脂薄片20，在基板上形成樹脂層1 6。在面對此樹脂薄 片20的電路圖案15的面預先印刷有與電路圖案15逆圖案 的熱硬化性環氧樹脂。 其次如圖4所示，在減壓環境中令單面被針狀電鍍而 粗面化的厚度18//m的鎳箔17其粗面面對樹脂層16而放 本紙張尺度適用中國國家標準（CNS )八4規格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁) -裝- 訂 經濟部智慧財4局Μ工消費合作社印製 -9- 1253891 A7 B7 五、發明説明（6) 在樹脂層1 6上。中介令距其外側厚度約1 m m的平滑的不 銹鋼板 19爲離形薄膜的特氟隆（Teflon)薄片18，以 3 OKg/cm2壓於基板。於是樹脂層16表面爲緩緩的起伏狀態 的情形也被平滑的不銹鋼板1 9壓碎而被平坦化，並且樹脂 層16全體變薄且寬。而且，樹脂層1 6中的氣泡浮在樹脂 層1 6的表面附近由樹脂內部被除去。 其次，壓住不銹鋼板19充分壓碎電路圖案15上的樹 脂層1 6，在充分地使樹脂中的氣泡放出到外部後，更進行 加熱使樹脂層1 6正式硬化。 其次，去除不銹鋼板19以及特氟隆薄片18，藉由鎳專 用的蝕刻液除去附著於樹脂層16表面的鎳箔17(參照圖5 以及圖6)。於是，銅的電路圖案1 5上的殘渣樹脂層變成 1 0 // m以下，並且成爲其表面被粗化的狀態。因此最後藉 由利用陶瓷拋光輪（Buff)去除電路圖案15上的樹脂層16的 一次平滑表面硏磨，與利用平面磨削機使面內平均粗糙精 度爲3 // m以下的二次精加工硏磨使基板平坦化（圖7)。在 此表面硏磨時，殘留於電路圖案15上的樹脂層16爲10// m非常薄，且因其表面被粗化故硏磨容易進行。 <第二實施形態> 以下參照圖8至圖1 5說明本發明的第二實施形態。與 上述第一實施形態重複的部分省略。 在本實施形態在與上述第一實施形態同樣的貼銅疊層 板10的必要位置使用周知的鑽孔（Drill)等加工打開貫通孑匕 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -10- 1253891 A7 B7 五、發明説明（7) 13(參照圖8)，進行化學電鍍以及電解電鍍在也包含貫通孔 1 3的內周面的全域形成銅的電鍍層1 4，令基板表面的導體 層厚度爲約20 // m(參照圖9)，然後利用周知的光蝕刻法形 成電路圖案15 (參照圖10)。 其次如圖1 1所示，在配線基板的電路圖案1 5上藉由 疊層例如令熱硬化性環氧樹脂爲半硬化狀態的厚度約3 0 // m的樹脂薄片20，在基板上形成樹脂層1 6。在此樹脂薄片 20之中對應貫通孔13的位置，預先印刷有塡埋貫通孔13 用的熱硬化性環氧樹脂。而且此時樹脂層1 6表面變成電路 圖案1 5部分隆起的緩緩的起伏狀態。 其次與上述第一實施形態一樣，將單面被粗面化的厚 度18/zm的鎳箔17放在樹脂薄片20上，中介特氟隆薄片 1 8在減壓環境中將距其外側厚度約1 mm的平滑的不銹鋼板 19壓於基板（參照圖12)。樹脂薄片20因來自不銹鋼板19 施加的壓力而容易變形。即令疊層於電路圖案1 5上的樹脂 部分埋入圖案間而移動，令基板全體大致成平坦的狀態。 而且，在樹脂薄片預先被印刷的樹脂被壓入貫通孔內部， 貫通孔內完全被樹脂埋入。再者，藉由不銹鋼板19被壓住 ，使樹脂薄片20全體變薄且寬。而且同時進入樹脂薄片20 與基板表面之間的氣泡或樹脂薄片20中的氣泡浮在樹脂薄 片20的表面附近，由樹脂內部被除去。因此，進行加熱使 樹脂薄片20正式硬化。 然後，去除不銹鋼板1 9，藉由鎳專用的蝕刻液除去附 著於樹脂薄片20表面的鎳箔17(參照圖13以及圖14)。電 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝· 訂 經濟部智慧財產局員工消費合作社印製 -11 - 1253891 經濟部智慈財產局員工消費合作社印製 A7 B7 五、發明説明（8) 路圖案15上的樹脂薄片20被壓碎薄到10//Π1左右。最後 ’與上述第一實施形態一樣進行硏磨，使電路圖案1 5露出 得到平坦基板（參照圖15)。 本發明並非限定於根據以上的記述以及圖面說明的實 施形態，例如如以下的實施形態也包含於本發明的技術範 圍，再者，除了以下以外，在不脫離其要旨的範圍內可實 施種種的變更。 (1 )、在上述實施形態雖然藉由去掉法形成電路圖案， 惟以藉由添加（Additive)法形成的構成也可以。 (2 )、在上述實施形態雖然樹脂層的材料使用熱硬化性 環氧樹脂，惟並非限定於此，使用尿素樹脂、蜜胺 (Melamine)樹脂、苯酚樹脂、丙烯樹脂、不飽和聚酯樹脂等 的熱硬化性樹脂也可以。 (3)、在上述實施形態雖然金屬箔材料使用鎳，惟並非 限定於此，使用銅等的其他金屬也可以。 【產業上的可利用性】 如以上所述如果依照本發明，即使有電路圖案的疏密 或貫通孔的有無，也能製造在基板全體形成有均勻且良好 的樹脂層的印刷配線基板。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)-8 - 1253891 A7 B7 V. Invention description (5) u: Glass epoxy substrate 12: Copper foil through hole 14: Plating layer 15: Circuit pattern 1 6 : Resin layer 1 7 · Nickel foil 1 8 : Teflon Sheet 19: Stainless steel sheet 20: Resin sheet [Detailed description of preferred embodiment] <First Embodiment> In the present embodiment, as shown in Fig. 1, the substrate is used, for example, at a thickness of 100 to 300 m / m. A copper-clad laminate 10 made by attaching a copper foil 12 to both surfaces of a glass epoxy substrate 11 is used. The copper clad laminate 10 is formed into a circuit pattern 15 by a known photolithography method (see Fig. 2). Next, as shown in FIG. 3, a resin layer is formed on the substrate by laminating a resin sheet 20 having a thickness of about 30 // m in a semi-hardened state, for example, by laminating the thermosetting epoxy resin on the circuit pattern 15 of the wiring substrate. 1 6. On the surface of the circuit pattern 15 of the resin sheet 20, a thermosetting epoxy resin reversely patterned with the circuit pattern 15 is printed in advance. Next, as shown in FIG. 4, the nickel foil 17 having a thickness of 18/m which is roughened by needle-shaped plating on one side in a reduced-pressure environment has a rough side facing the resin layer 16 and the paper size is applied to the Chinese national standard. (CNS) Eight 4 specifications (210Χ297 mm) (Please read the notes on the back and fill out this page) - Install - Order the Ministry of Economic Affairs 4th Bureau Completion Consumer Cooperative Printed - 9- 1253891 A7 B7 V. Invention Description (6) On the resin layer 16. The smooth stainless steel sheet 19 having a thickness of about 1 m from the outside was interposed to form a Teflon sheet 18 of a release film, which was pressed against the substrate at 3 OKg/cm 2 . Then, the surface of the resin layer 16 is gradually undulated, and is also flattened by the smooth stainless steel plate 19, and the entire resin layer 16 is thin and wide. Further, the bubbles in the resin layer 16 float in the vicinity of the surface of the resin layer 16 and are removed from the inside of the resin. Next, the stainless steel plate 19 is pressed and the resin layer 16 on the circuit pattern 15 is sufficiently crushed, and after the bubbles in the resin are sufficiently released to the outside, the resin layer 16 is finally hardened by heating. Next, the stainless steel plate 19 and the Teflon sheet 18 are removed, and the nickel foil 17 adhering to the surface of the resin layer 16 is removed by a nickel-specific etching solution (see Figs. 5 and 6). Then, the residue resin layer on the copper circuit pattern 15 becomes 10 // m or less, and the surface thereof is roughened. Therefore, a smooth surface honing of the resin layer 16 on the circuit pattern 15 is removed by using a ceramic polishing wheel (Buff), and secondary finishing with an in-plane average roughness accuracy of 3 // m or less by using a surface grinder. The honing flattens the substrate (Fig. 7). At the time of the surface honing, the resin layer 16 remaining on the circuit pattern 15 is 10/m very thin, and since the surface thereof is roughened, honing is easy. <Second Embodiment> A second embodiment of the present invention will be described below with reference to Figs. 8 to 15 . Parts overlapping with the above-described first embodiment are omitted. In the present embodiment, the position of the copper-clad laminate 10 similar to that of the above-described first embodiment is processed using a well-known drill (Drill) or the like. The paper size is applied to the Chinese National Standard (CNS) A4 specification (210X297).装装)-- (Please read the note on the back and fill out this page) Printed by the Intellectual Property Office of the Ministry of Economic Affairs, employee consumption cooperatives -10- 1253891 A7 B7 V. Invention description (7) 13 (refer to Figure 8), Electroless plating and electrolytic plating are performed on the entire surface of the inner peripheral surface of the through-hole 13 to form a copper plating layer 14 so that the thickness of the conductor layer on the surface of the substrate is about 20 // m (refer to FIG. 9), and then well-known The circuit pattern 15 is formed by photolithography (see FIG. 10). Next, as shown in FIG. 11, a resin sheet 20 having a thickness of about 30 μm in a semi-hardened state, for example, by laminating a thermosetting epoxy resin on the circuit pattern 15 of the wiring substrate, is formed on the substrate. Resin layer 16. In the resin sheet 20, a thermosetting epoxy resin for burying the through hole 13 is printed in advance at a position corresponding to the through hole 13. Further, at this time, the surface of the resin layer 16 becomes a gently undulating state in which the circuit pattern 15 is partially raised. Next, as in the first embodiment described above, a nickel foil 17 having a thickness of 18/zm which is roughened on one side is placed on the resin sheet 20, and the intermediate Teflon sheet 18 is about to be thicker from the outer side in a reduced pressure environment. A 1 mm smooth stainless steel plate 19 is pressed against the substrate (see Fig. 12). The resin sheet 20 is easily deformed by the pressure applied from the stainless steel plate 19. In other words, the resin portion laminated on the circuit pattern 15 is embedded between the patterns and moved, so that the entire substrate is substantially flat. Further, the resin printed on the resin sheet in advance is pressed into the inside of the through hole, and the through hole is completely embedded in the resin. Further, the stainless steel sheet 19 is pressed to make the entire resin sheet 20 thin and wide. Further, the bubble which enters between the resin sheet 20 and the surface of the substrate or the bubble in the resin sheet 20 floats near the surface of the resin sheet 20, and is removed from the inside of the resin. Therefore, heating is performed to cause the resin sheet 20 to be substantially hardened. Then, the stainless steel plate 19 is removed, and the nickel foil 17 attached to the surface of the resin sheet 20 is removed by an etching solution for nickel (see Figs. 13 and 14). The standard of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the note on the back and fill in the page). Installed and subscribed to the Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperative Printed -11 - 1253891 Ministry of Economic Affairs Zhici Property Bureau employee consumption cooperative printed A7 B7 V. Invention Description (8) The resin sheet 20 on the road pattern 15 is crushed to a thickness of about 10//Π1. Finally, the honing is performed in the same manner as in the first embodiment described above, and the circuit pattern 15 is exposed to obtain a flat substrate (see Fig. 15). The present invention is not limited to the above-described embodiments and the embodiments described in the drawings. For example, the following embodiments are also included in the technical scope of the present invention, and various other modifications can be made without departing from the scope of the invention. Changes. (1) In the above embodiment, the circuit pattern is formed by the removal method, but the configuration may be formed by an additive method. (2) In the above embodiment, the material of the resin layer is a thermosetting epoxy resin, but is not limited thereto, and a urea resin, a melamine resin, a phenol resin, an acrylic resin, an unsaturated polyester resin, or the like is used. A thermosetting resin can also be used. (3) In the above embodiment, nickel is used as the metal foil material, but it is not limited thereto, and other metals such as copper may be used. [Industrial Applicability] According to the present invention, according to the present invention, it is possible to manufacture a printed wiring board in which a uniform and good resin layer is formed on the entire substrate even in the presence of the density of the circuit pattern or the presence or absence of the through holes. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back and fill out this page)
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