1250836 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種預鑄式多層電路板之製造方法， 尤指一種使線路更細且結構強度提高，成本較低又易 於生產規劃之電路板製造方法。 【先前技術】 按；眾所周知，習知單層或多層電路板的製造方式， Φ 需以底片曝光構成影像轉移，於銅箔面之基板顯影線路， 再經由蝕刻、鑽孔後予以電鍍，而多層板則需經由高壓之 壓合過程，此種習知之製程至少存在以下之缺失： 1. 製程繁複，耗工費時，成本較高。 2. 高壓壓合過程中，易因高壓的應力造成電路板變形 及尺寸的變動。 3. 所需的耗材及設備龐大，生產的連續性不易規劃。 此外，所生產電路之線路有一定寬度之限制，否則有 ^ 短路、斷線之虞，且其強度不足，殊不理想。 【發明内容】 本發明之主要目的，即在提供一種預鑄式多層電路板 之製造方法，改善習知電路板製程之缺失，並提高電 路板之品質。 前述之製造方法，係於玻璃纖維基板鑽孔後’將導電 材料填塞於該等導通孔。 前述之製造方法，係設有鏤刻線路之鋼板模具，使樹 脂塗佈於該模具，再將模具與基板相互貼合，並於脫模後 5 !25〇836 使樹脂固定於基板。 、、前述之製造方法，係於樹脂塗佈導電材料，使導電材 料均佈於樹脂之線路，再經由真空除去氣泡、烘烤，以及 噴砂除膜、清洗後，使該導電材料嵌於樹脂之線路，構成 電路板。 如述之製造方法，係於多層之疊合後，於最外層線路 須焊接部份予以電鍍，以增加其機械強度。 【實施方式】 請同時參閱第一至七圖，本發明之製程主要包含以下 之步驟： 1·於玻璃纖維基板1鑽出預定之導通孔U(如圖一所 示）。 2·於基板1之各導通孔丨丨填塞入導電材料2(如圖二 所示）。 3·設以鋼板之上、下模具3、4，於該等模具3、4鏤 刻浮突之線路31、41 (如一般電路板之印刷線路）， 使樹脂5塗佈於該上、下模具3、4,再將塗佈有樹 脂5之上、下模具3、4分別由上、下方與基板j 疊合，並於樹脂5預設導通孔51 (如圖三所示）。 4·於上、下模具3、4與基板1貼合後，予以烘烤固 化（如圖四所示），再將上、下模具3、4脫模。 5·該上、下模具3、4於脫模後，樹脂5即緊貼於基 板1 ’並於表面形成内凹之線路52(如圖五所示）， 再予以喷砂除膜、清洗。 1250836 ΤΐίίίΓ塗饰於樹脂5表面，使該導電材料2均 7.再以切除去氣泡以及烘烤固化。 嵌入於樹月旨5't式去除多餘之導電材料2，僅存留 2,如此而構/路52及導通孔51内之導電材料 經由前述電路板100 (如圖七所示）。 均勻嵌塞於樹脂5 成之電路板100，由於導電材料2 路板之銅⑽印刷線路般路52，故而可構成導通，如-般電 而如圖八所示，，饮 各層之線路再予以疊^明係可依前述之各步驟製作其他 線路須焊接部㈣以電=構成多層電路板，並於最外層 電鍍銅6經由噴砂去臈：：、先6 其機械強度。末將 綜上所述，本發明至If’作最後之清潔。 1. 因線路係以導電·^備以下之優點·· 強度及耐熱性。枓2埋於樹脂5内’可提高剥離 2. 由於不需以高壓壓合 板變形及尺寸變動之問題。免日4應力造成電路 3·由於不需經由影像轉移之 ， 設備’利於生產連續性之明。β即省大量耗材及 此外，本發明之製程可使 s 之結構強度，為一實用〜，、田微，且保有足夠 麦依法提出專利中請，#，局* /、新穎性之創作， 至感德便。 杳置’早曰賜准專利， 1250836 【圖式簡單說明】 第一圖係本發明之基板結構圖。 第二圖係本發明之基板填塞導電材料實施例圖。 第三圖係本發明之模具塗佈樹脂實施例圖。 第四圖係本發明之模具與基板疊合實施例圖。 第五圖係本發明之脫模後樹脂貼合於基板實施例圖。 φ 第六圖係本發明之塗佈導電材料實施例圖。 第七圖係本發明之電路板完成圖。 第八圖係本發明之多層電路板疊合及電鍍銅實施例圖。 【主要元件符號說明】 L基板 4L線路 11.導通孔 5.樹脂 2.導電材料 51.導通孔 3.上模具 52.線路 31.線路 6.電鍍銅 4.下模具 100.電路板1250836 IX. Description of the invention: [Technical field of the invention] The present invention relates to a method for manufacturing a multilayered circuit board, in particular to a circuit board which makes the circuit thinner and has higher structural strength, lower cost and easy production planning. Production method. [Prior Art] According to the well-known method of manufacturing a single-layer or multi-layer circuit board, Φ needs to be image-transferred by film exposure, and the substrate is developed on a copper foil surface, and then electroplated by etching and drilling, and multilayered. The board needs to pass the high pressure pressing process. The conventional process has at least the following defects: 1. The process is complicated, labor-intensive, and costly. 2. During high-pressure press-fitting, it is easy to cause deformation and dimensional changes of the board due to high-voltage stress. 3. The consumables and equipment required are huge, and the continuity of production is difficult to plan. In addition, the circuit of the produced circuit has a certain width limit, otherwise there is a short circuit, a broken wire, and its strength is insufficient, which is not ideal. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for manufacturing a multilayered circuit board, which improves the defects of the conventional circuit board process and improves the quality of the circuit board. In the above manufacturing method, after the glass fiber substrate is drilled, a conductive material is packed in the via holes. In the above manufacturing method, a steel plate mold having a etched line is provided, a resin is applied to the mold, and the mold and the substrate are bonded to each other, and the resin is fixed to the substrate after the mold release. The manufacturing method described above is that the conductive material is coated on the resin, the conductive material is evenly distributed on the circuit of the resin, and the bubbles are removed by vacuum, baked, and the film is blasted and cleaned, and then the conductive material is embedded in the resin. Lines that make up the board. As described in the manufacturing method, after the lamination of the layers, the welded portion of the outermost layer is plated to increase its mechanical strength. [Embodiment] Please refer to the first to seventh figures at the same time. The process of the present invention mainly comprises the following steps: 1. Drill a predetermined via hole U on the glass fiber substrate 1 (as shown in Fig. 1). 2. Insert the conductive material 2 into each of the via holes of the substrate 1 (as shown in Fig. 2). 3. The steel plate upper and lower molds 3, 4 are formed, and the floating lines 31, 41 (such as the printed circuit of a general circuit board) are engraved on the molds 3, 4, and the resin 5 is applied to the upper and lower molds. 3, 4, the upper and lower molds 3, 4 coated with the resin 5 are superposed on the substrate j from the upper and lower sides, respectively, and the through holes 51 are defined in the resin 5 (as shown in FIG. 3). 4. After the upper and lower molds 3 and 4 are bonded to the substrate 1, they are baked and cured (as shown in Fig. 4), and the upper and lower molds 3 and 4 are released. 5. After the upper and lower molds 3, 4 are released from the mold, the resin 5 is adhered to the substrate 1' and a concave line 52 (shown in Fig. 5) is formed on the surface, and then the film is removed by sandblasting and cleaning. 1250836 ΤΐίίίΓ is applied to the surface of the resin 5, so that the conductive material 2 is further removed by cutting and curing. The conductive material 2 is removed in the 5't type, and only the remaining 2 is left. Thus, the conductive material in the structure/path 52 and the via 51 is passed through the circuit board 100 (as shown in FIG. 7). Evenly embedded in the circuit board 100 of the resin 5, since the copper (10) of the conductive material 2 board is printed circuit-like way 52, it can be turned on, such as - as shown in Fig. 8, the lines of the drinking layers are further According to the above steps, other lines must be welded (4) to form a multi-layer circuit board, and the outermost layer of copper 6 is blasted by sandblasting::, first 6 mechanical strength. In summary, the present invention proceeds to the final cleaning of If'. 1. Because the circuit is electrically conductive, it has the following advantages: · Strength and heat resistance.枓2 is buried in the resin 5' to improve peeling. 2. There is no need to deform the high-pressure plate and change the size. Free of day 4 stress caused by the circuit 3 · Because there is no need to transfer through the image, the device 'is conducive to the continuity of production.即 即 省 省 省 省 省 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及Feeling the virtues.杳 ’ ' Early patents, 1250836 [Simple description of the drawings] The first figure is the substrate structure diagram of the present invention. The second figure is a diagram of an embodiment of a substrate-filled conductive material of the present invention. The third figure is a diagram of an embodiment of the mold coating resin of the present invention. The fourth figure is a diagram of an embodiment in which the mold and the substrate of the present invention are superposed. Fig. 5 is a view showing an embodiment in which a resin is bonded to a substrate after demolding of the present invention. φ Fig. 6 is a view showing an embodiment of the coated conductive material of the present invention. The seventh drawing is a circuit board completion diagram of the present invention. The eighth figure is a diagram of an embodiment of the multilayer circuit board stacking and electroplating copper of the present invention. [Main component symbol description] L substrate 4L line 11. Via hole 5. Resin 2. Conductive material 51. Via hole 3. Upper mold 52. Line 31. Line 6. Electroplated copper 4. Lower mold 100.