KR101044133B1 - Carrier for manufacturing printed circuit board, manufacturing method thereof and manufacturing method of printed circuit board using same - Google Patents

Abstract

The present invention relates to a carrier for manufacturing a printed circuit board, and includes a base member including two metal layers, an insulating layer laminated on the two metal layers, and an adhesive member formed on a side surface of the base member.

The present invention also relates to a method of manufacturing a carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the carrier.

Carrier, Adhesive, Buildup Layer

Description

A CARRIER FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME AND A METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD USING THE SAME}

The present invention relates to a carrier for manufacturing a printed circuit board, a method for manufacturing the same, and a method for manufacturing a printed circuit board using the same.

In general, a printed circuit board is formed of copper foil on one or both sides of a board made of various thermosetting synthetic resins to arrange and fix integrated circuits (ICs) or electronic components on the board, and to implement electrical wiring therebetween and then coated with an insulator. .

In recent years, due to the development of the electronic industry, the demand for high functionalization and light weight reduction of electronic components is rapidly increasing. Accordingly, printed circuit boards on which such electronic components are mounted also require high density wiring and thinning.

In particular, in order to cope with the thinning of the printed circuit board, a coreless substrate that can reduce the overall thickness and shorten the signal processing time by removing the core substrate has been attracting attention. However, in the case of the coreless substrate, since the core substrate is not used, a carrier member capable of performing a support function during the manufacturing process is required.

1 to 5 illustrate a method of manufacturing a printed circuit board using a carrier according to the prior art. Hereinafter, the manufacturing method will be described with reference to FIGS. 1 to 5.

First, as shown in FIG. 1, the carrier 10 is prepared. Specifically, the adhesive layer 12, the first metal layer 13, and the second metal layer 14 are sequentially formed on both surfaces of the copper foil laminated plate 11 (CCL) having copper foil layers formed on both surfaces of the insulating layer. At this time, both ends of the adhesive layer 12 are adhered to the copper-clad laminate 11 and the second metal layer 14 by applying heat and pressure with a high temperature / high pressure press. On the other hand, the first metal layer 13 is in contact with the second metal layer 14 but is not bonded.

Next, as shown in FIG. 2, the buildup layer 15 is formed on both sides of the carrier 10, and the third metal layer 16 is formed on the outermost insulating layer. The buildup layer 15 is generally performed by a known method, and vias connecting the respective buildup circuit layers may be additionally formed. In addition, the third metal layer 16 is formed to prevent warpage of the build-up layer 15.

Next, as shown in FIG. 3, the buildup layer 15 is separated from the carrier 10. At this time, both ends of the adhesive layer 12 bonded to the copper-clad laminate 11 and the second metal layer 14 are removed through a router process to separate the buildup layer 15 from the carrier 10. Since the first metal layer 13 serves as a release layer and is not bonded to the second metal layer 14, when the adhesive layer 12 is removed, the first metal layer 13 is easily separated from the second metal layer 14.

Next, as shown in FIG. 4, the second metal layer 14 and the third metal layer 16 formed on the buildup layer 15 are removed by etching.

Next, as shown in FIG. 5, the open part 17 which exposes the pad part 19 of the outermost circuit layer of the buildup layer 15 is processed to the outermost insulating layer of the buildup layer 15, and solder ball (18) is formed.

However, in the case of a conventional printed circuit board using a carrier, since both ends of the printed circuit board are cut by the router process, there is a problem that the size of the printed circuit board is reduced.

In addition, since the carrier 10 is also cut during the router process, the carrier 10 may not be reused, thereby causing a large process cost and process time.

The present invention has been devised to solve the above problems, and proposes a carrier and a method of manufacturing the same, which are formed of a part of a printed circuit board which is finally formed while performing a support function.

In addition, a method of manufacturing a printed circuit board using such a carrier is proposed.

According to a preferred embodiment of the present invention, a carrier for manufacturing a printed circuit board includes a base member including two metal layers, an insulating layer laminated on the two metal layers, and an adhesive member formed on a side surface of the base member. Characterized in that.

Here, the adhesive member is characterized in that formed longer than the thickness of the base member to form a step in the insulating layer direction located on the inside.

In addition, the adhesive member is characterized in that the metal paste.

According to a preferred embodiment of the present invention, a method for manufacturing a printed circuit board carrier includes: (A) combining two copper foil laminated plates such that a metal layer formed on one surface of a copper foil laminated plate is contacted, (B) the two bonded Forming an adhesive member on the side of the copper-clad laminate, and (C) removing the outer layer metal layers of the two copper-clad laminates.

At this time, the step (B), (B-1) is a step of applying a metal paste corresponding to the adhesive member on the side of the two copper clad laminate plate bonded, and (B-2) the step of curing the metal paste Characterized in that it comprises a.

In addition, in the step (B), the adhesive member is characterized in that it is formed to have a length corresponding to the thickness of the two copper-clad laminate.

In the method of manufacturing a printed circuit board using a carrier according to a preferred embodiment of the present invention, (A) the copper foil laminated sheets are bonded to each other so that the metal layers formed on one surface of the two copper foil laminated plates are bonded to each other, and the side surfaces of the two copper foil laminated plates are bonded to each other. After forming the member, preparing a carrier by removing the outer layer metal layers of the two copper clad laminates, (B) forming an inner circuit layer including vias in an exposed insulating layer of the copper clad laminates, ( C) forming a buildup layer on the inner circuit layer, (D) removing the adhesive member, and (E) forming a circuit pattern on the metal layer and the outermost metal layer of the buildup layer. It features.

At this time, in the step (D), characterized in that for removing the adhesive member polishing.

The method may further include forming a protective layer on the metal layer on which the circuit pattern is formed and the outermost metal layer of the build-up layer.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Since the carrier according to the present invention eliminates the routing process, it is possible to prevent the reduction of the size of the finally produced printed circuit board, and because the carrier is composed of a part of the finally produced printed circuit board to prevent the loss of costs due to the manufacture of the carrier can do.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

For printed circuit board manufacturing carrier

6 is a cross-sectional view of a carrier for manufacturing a printed circuit board according to an exemplary embodiment of the present invention. Hereinafter, a carrier for manufacturing a printed circuit board according to the present embodiment will be described with reference to this.

As shown in FIG. 6, the carrier for manufacturing a printed circuit board according to the present invention includes a base member and an adhesive member 200 formed of two layers of a metal layer 120 and an insulating layer 110 stacked on the metal layer 120. Include.

The base member serves as a core layer, and includes a two-layer metal layer 120 and an insulating layer 110 stacked on the metal layer 120 at a central portion thereof.

The insulating layer 110 is finally a member constituting a part of the printed circuit board, and is laminated on the metal layer 120. Here, the insulating layer 110 may be integral with the metal layer 120 by bonding.

The metal layer 120 may have a structure to which two metal layers 120 are attached, and may be made of, for example, an electrically conductive metal such as gold, silver, copper, or nickel. In addition, the two metal layers 120 are attached by the relatively weak van der Waals forces at the attachment interface and are not bonded.

On the other hand, the insulating layer has a thickness of 30㎛, the metal layer is preferably formed to have a thickness of 12㎛ in order to implement a thin plate.

The adhesive member 200 is formed on the side of the base member to bond the two metal layers 120 attached thereto. Since the two-layer metal layer 120 formed at the center of the base member is weak in adhesion, it is formed on the side of the base member to increase the bonding force of the base member.

As shown in FIG. 6, the adhesive member 200 is preferably formed longer than the thickness of the base member so as to form a step in the direction of the insulating layer 110 located inside. Accordingly, the adhesive member 200 has a protrusion in the thickness direction of the base member. These protrusions serve to guide the thickness and area of the inner circuit layer formed on the insulating layer 110.

In addition, the adhesive member 200 is bonded to the two metal layers 120, for example, it is preferably formed of a metal paste. This is because the metal paste is easy to form with a uniform thickness on the side of the base member, and is easy to remove in the manufacture of a printed circuit board.

For printed circuit board manufacturing Carrier  Manufacturing method

7 to 9 are cross-sectional views illustrating a manufacturing process of a carrier for manufacturing a printed circuit board according to an exemplary embodiment of the present invention. Hereinafter, a manufacturing process of a carrier for manufacturing a printed circuit board according to an exemplary embodiment of the present invention will be described with reference to FIGS. 7 to 9.

First, as shown in FIG. 7, two copper foil laminated plates 100 having metal layers 120 and 130 formed on both surfaces of the insulating layer 110 are prepared, and a metal layer 120 formed on one surface of the copper foil laminated plate 100 is formed. Two copper foil laminated plates 100 are attached so as to contact each other.

At this time, the two attached metal layers 120 form an attachment interface by relatively weak van der Waals forces. This attachment interface has an adhesion force that can be separated by an external force, but is not bonded.

Next, as shown in FIG. 8, the adhesive member 200 is formed on the side surfaces of the two copper-clad laminates 100 attached thereto. The adhesive member 200 bonds two copper-clad laminates 100 to serve as an integral core layer. In particular, the side surfaces of the two metal layers 120 forming the adhesion interface are adhered.

At this time, the adhesive member 200 is preferably formed to have a length corresponding to the thickness of the two copper foil laminated plate 100 attached. Subsequently, when the outer metal layer 130 of the copper clad laminate 100 is removed, the adhesive member 200 may be formed to have a step in the direction of the insulating layer 110.

In addition, the adhesive member 200 is preferably formed of a metal paste. In the case of forming the metal paste, the metal paste is applied to the side surfaces of the two copper-clad laminates 100 attached first. At this time. Tools such as rollers can be used to apply a uniform thickness. Next, the metal paste is cured. At this time, it is preferable from an economical viewpoint to harden | cure for about 1 hour at the temperature of 120 degreeC.

Finally, as shown in FIG. 9, the outer metal layer 130 of the two copper clad laminated boards 100 which were attached is removed. As a result, it has a structure of a carrier for manufacturing a printed circuit board having two metal layers 120 and an insulating layer 110 stacked on the metal layers 120. The structure in which the outer layer metal layer 130 is removed enables the manufacture of the inner layer circuit layer having vias in the manufacturing process of the printed circuit board using the carrier.

The removal of the outer metal layer 130 is performed through, for example, an etching process, and the etching process is well known and thus detailed description thereof will be omitted. However, it is preferable that all of the outer metal layer 130 is removed.

Carrier  Manufacturing method of printed circuit board using

10 to 14 are views for explaining a method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention. Hereinafter, a manufacturing method of a printed circuit board using a carrier according to a preferred embodiment of the present invention will be described with reference to FIGS. 10 to 14.

In this embodiment, the manufacturing of the printed circuit board on both sides of the carrier will be described. However, the present invention is not limited thereto, and the printed circuit board may be manufactured only on one surface of the carrier.

First, the carrier shown in FIG. 9 is prepared. The carrier is manufactured as described above with reference to FIGS. 7 to 9, and is formed on the side of the base member and the base member composed of two metal layers 120 and an insulating layer 110 stacked on the metal layer 120. An adhesive member 200 is included.

Here, the metal layer 120 and the insulating layer 110 finally constitute a part of the printed circuit board, the adhesive member 200 is removed.

Next, as shown in FIG. 10, an inner circuit layer 130 ′ including a via is formed on the insulating layer 110. It may have a structure like a copper-clad laminate 100 'having vias formed thereon.

Inner circuit layer 130 'is a YAG laser or CO ₂ After forming the via hole using a laser, for example, it is formed by performing a semi-additive process (SAP) or a modified semi-additive process (MSAP).

Next, as shown in FIG. 11, a buildup layer 300 is formed on the inner circuit layer 130 ′. In Figure 11, the buildup layer 300 has a two-layer structure, but this is only one example, it may have a single layer or a multi-layer structure.

The build-up layer 300 is manufactured by stacking a circuit pattern and an insulating material on which the wiring is formed on the inner circuit layer 130 ′ by plating and printing methods, and the like. In more detail, a separate insulating material is laminated and a YAG laser or CO ₂ After forming the via hole by using a laser, it may be completed by forming a circuit layer including the via by performing a semi-additive process (SAP) or a modified semi-additive process (MSAP). In this case, the desmear process may be performed in the process of forming the via hole.

Next, as shown in FIG. 12, the adhesive member 200 is removed. Removal of the adhesive member 200 is performed by physical and chemical methods. In the conventional carrier method, there is a problem that the routing process is required to reduce the size of the printed circuit board. However, according to the present invention, such a problem does not occur because only the adhesive member 200 formed on the side of the base member is removed.

In addition, when the adhesive member 200 is removed, the two layers of the metal layer 120 constituting the carrier base member have weak adhesive force, so that the two layers of the metal layer 120 are separated and separated into two printed circuit boards. In this case, the function of the carrier is terminated, and the metal layer 120 and the insulating layer 110 forming the carrier constitute a part of the printed circuit board.

At this time, when the adhesive member 200 is formed of a metal paste, it is preferable to remove the polishing using an abrasive brush or the like to maintain the size of the printed circuit board.

Next, as shown in FIG. 13, a circuit pattern is formed on the outermost metal layer of the metal layer 120 and the buildup layer 300. The circuit pattern can be formed using a subtractive method or the like. Meanwhile, the circuit pattern of the outermost metal layer of the buildup layer 300 ′ may be formed during the buildup process. In addition, the metal layer 120 may be removed, and the outermost layer circuit pattern may be formed by a separate plating process.

In this case, the outermost metal layer of the metal layer 120 ′ and the build-up layer 300 ′ on which the circuit pattern is formed forms an outer circuit layer of the printed circuit board.

Next, as shown in FIG. 14, the protective layer 400 may be formed on the metal layer 120 ′ having the circuit pattern forming the outer layer circuit layer of the printed circuit board and the outermost metal layer of the build-up layer 300 ′. have.

The protective layer 400 may be formed of, for example, a solder resist such as a dry film type solder resist or a liquid solder resist.

In addition, a solder ball 500 for connecting to an external device (not shown) may be formed through an open part formed on an outer circuit layer. Here, the pad portion of the printed circuit board and the external device (not shown) may be electrically connected through the solder ball 500.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 to 5 are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to the prior art.

6 is a cross-sectional view of a carrier for manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

7 to 9 are process cross-sectional views for explaining the manufacturing method of the carrier shown in FIG.

10 to 14 are cross-sectional views illustrating a method of manufacturing a printed circuit board using the carrier illustrated in FIG. 6.

<Description of the symbols for the main parts of the drawings>

100: copper foil laminated plate 110: insulating layer

120: metal layer 130: outer layer metal layer

130 ': inner circuit layer 200: adhesive member

300: buildup layer 400: protective layer

500 solder ball

Claims (9)

A base member including two metal layers and an insulating layer laminated on the two metal layers; And An adhesive member formed on a side of the base member; Carrier for manufacturing a printed circuit board comprising a. The method according to claim 1, The adhesive member is a carrier for manufacturing a printed circuit board, characterized in that formed longer than the thickness of the base member to form a step in the direction of the insulating layer located inside. The method according to claim 1, The adhesive member is a carrier for manufacturing a printed circuit board, characterized in that the metal paste. (A) combining the two copper foil laminated plates so that the metal layer formed on one surface of the copper foil laminated plate is in contact; (B) forming an adhesive member on the sides of the two copper clad laminates combined; And (C) removing the outer metal layers of the two copper-clad laminates joined; Carrier manufacturing method for manufacturing a printed circuit board comprising a. The method according to claim 4, Step (B) is, (B-1) applying a metal paste corresponding to the adhesive member to the side surfaces of the two copper-clad laminates joined; And (B-2) curing the metal paste; Carrier manufacturing method for manufacturing a printed circuit board comprising a. The method according to claim 4, In the step (B), the adhesive member is a carrier manufacturing method for a printed circuit board, characterized in that formed to have a length corresponding to the thickness of the two copper-clad laminate plate combined. (A) combining the copper clad laminates such that the metal layers formed on one surface of the two copper clad laminates are in contact with each other, and forming an adhesive member on the side surfaces of the two copper foil laminateds, and then removing the outer metal layers of the two copper clad laminated plates. Preparing a carrier; (B) forming an inner circuit layer including vias in the exposed insulating layer of the copper clad laminate; (C) forming a buildup layer on the inner circuit layer; (D) removing the adhesive member; And (E) forming a circuit pattern on the metal layer and the outermost metal layer of the buildup layer; Method of manufacturing a printed circuit board using a carrier comprising a. The method of claim 7, In the step (D), the manufacturing method of the printed circuit board using a carrier, characterized in that for removing the adhesive member. The method of claim 7, (F) forming a protective layer on the metal layer on which the circuit pattern is formed and the outermost metal layer of the build-up layer; Method of manufacturing a printed circuit board using a carrier, characterized in that it further comprises.

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