200410620 A7 B7 五、發明説明（彳） 【發明領域】 本發明是關於表面被平坦化的印刷配線基板的製造方 (請先閱讀背面之注意事項再填寫本頁} 法。 【發明背景】 【習知技藝之說明】 對於以例如增層法（Build-up)製造多層印刷配線板，爲 了配線的高密度化需要平坦化下層基板的表面。但是，由 於印刷基板的電路圖案一般藉由蝕刻（Etch)除去銅箔的不要 部分的去掉（Subtract)法製造，故形成電路圖案部分由基材 表面隆起的凹凸狀。 因此，爲了平坦化如上述表面形成凹凸狀的印刷基板 ，例如如以下的方法被提出。例如使半硬化狀態的樹脂薄 片疊層於電路圖案上，在減.壓環境下中介平滑板按壓 (Press)此樹脂薄片，埋入於電路圖案間使其硬化，然後， 平面硏磨樹脂表面的方法習知以來被提出。 經濟部智慧財產局員工消費合作社印^Γ 但是，由於基板上的電路圖案有疏或密的部分的情形 ，或貫通孔（Through hole)的有無等，有無法均勻且良好地 形成樹脂層的情形。例如電路圖案在密的部分中，在電路 圖案間很難壓入樹脂薄片，因未充塡部分殘留故在後製程 中產生孔洞（Voids)，或因在電路圖案上殘存相當厚的樹脂 ，使樹脂層表面不平坦，變成電路圖案僅形成密的部分緩 緩地隆起的狀態。而且相反地電路圖案在疏的部分或形成 有貫通孔的部分中，與其他部分比較樹脂量不足，樹脂層 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 200410620 A7 B7 五、發明説明（2) --------I — (请先閱讀背面之法意事項存填寫本 的表面緩緩地變成凹陷的狀態。在這種狀態下即使中介平 滑板進行按壓，樹脂層全體也難以均勻地形成，而且，精 度佳地進行具有這種緩緩的起伏的基板的平坦硏磨也很困 難。 本發明乃鑒於上述事情所進行的創作，其目的爲提供 即使有電路圖案的疏密或貫通孔的有無，也能在基板全體 形成均勻良好的樹脂層的印刷配線基板的製造方法。 【發明槪要】 爲了解決上述課題所進行的本發明在形成有電路圖案 的印刷配線基板上重疊半硬化狀態的樹脂薄片形成樹脂層 ，按壓此樹脂層壓入該電路圖案間使其硬化，然後藉由覆 蓋該電路圖案硏磨硬化的樹脂，使該電路圖案露出的印刷 配線基板的製造方法，在該印刷配線基板上重疊樹脂薄片 前，於與該樹脂薄片的該電路圖案面對的面印刷該電路圖 案的逆圖案的樹脂之處具有特徵。 經濟部智慧財產局員工消費合作社印製 而且，在形成有貫通孔以及電路圖案的印刷配線基板 上，重疊半硬化狀態的樹脂薄片形成樹脂層，按壓此樹脂 層壓入該電路圖案間使其硬化，然後藉由覆蓋該電路圖案 硏磨硬化的樹脂，使該電路圖案露出的印刷配線基板的製 造方法，在該印刷配線基板上重疊樹脂薄片前，於該樹脂 薄片之中對應該貫通孔的位置，印刷塡埋該貫通孔用的樹 脂之處具有特徵。 對樹脂層的按壓是在減壓環境中進行也可以。而且在 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -6 - 200410620 A7 _B7 五、發明説明（3) 樹脂層上重疊面對樹脂層的面被粗面化的金屬箔而按壓也 (請先閱讀背面之注意事項再填寫本頁) 可以。此情形金屬箔可藉由與電路圖案異種的金屬而形成 〇 如果依照本發明因樹脂層被按壓，故即使該樹脂層在 電路圖案的形成部分緩緩地隆起，此隆起也被壓碎使樹脂 層全體變薄而寬。此時，即使基板上的電路圖案有疏密， 因在面對樹脂薄片的電路圖案的面預先印刷有電路圖案的 逆圖案的樹脂，故樹脂層與電路圖案的疏密無關，全體被 均勻化。若在此狀態下使樹脂硬化的話，因在電路圖案上 僅殘留相當薄的樹脂層，藉由以不傷及電路圖案的強度來 硏磨，故可得到露出電路圖案的平坦的基板。 而且，對於基板具有貫通孔的情形，藉由於樹脂薄片 之中對應貫通孔的位置預先印刷樹脂，貫通孔內也不會使 樹脂不足，且也能均勻地形成基板上的樹脂層全體。 此外，藉由在減壓環境中進行對樹脂層的按壓，即使 假設在樹脂層內包含有氣泡，也能除去該氣泡。 經濟部智慧財產局員工消費合作社印製 而且，在按壓樹脂層時，若在樹脂層上中介面對樹脂 層的面被粗面化的金屬箔的話，使樹脂層更容易變薄而寬 ，而且，該樹脂層的表面仿照金屬箔的粗面化表面變成微 細的凹凸狀。其結果可更容易進行殘留樹脂層的硏磨。 再者，對於以與電路圖案異種的金屬形成上述金屬箔 的情形，僅使金屬箔溶解，可藉由對電路圖案的金屬不給 予影響的選擇的蝕刻除去金屬箔。 本纸張尺度適用中國國家標準（CNS ) A4規格（210'〆 297公釐） 200410620 A7 B7 五、發明説明（4) 【圖示之簡單說明】 圖1是貼銅疊層板的剖面圖。 圖2是相同地形成電路圖案的配線基板的剖面圖。 圖3是以與本發明的第一實施形態有關的樹脂薄片形 成樹脂層的情形的配線基板的剖面圖。 圖4是相同地顯示減壓按壓時的佈局的配線基板的剖 面圖。 圖5是相同地樹脂硬化後的配線基板的剖面圖。 圖6是相同地除去金屬箔後的配線基板的剖面圖。 圖7是相同地硏磨後的配線基板的剖面圖。 圖8是在貼銅疊層板形成貫通孔的配線基板的剖面圖 〇 圖9是相同地形成電鍍層的配線基板的剖面圖。 圖1 〇是相同地形成電路圖案的配線基板的剖面圖。 圖11是以與本發明的第二實施形態有關的樹脂薄片形 成樹脂層的情形的配線板的剖面圖。 圖12是相同地顯示減壓按壓時的佈局的配線基板的剖 面圖。 圖1 3是相同地樹脂硬化後的配線基板的剖面圖。 圖1 4是相同地除去金屬箔後的配線基板的剖面圖。 圖1 5是相同地硏磨後的配線基板的剖面圖。 【符號說明】 1 〇 :貼銅疊層板 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 券-- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財1局員工消費合作社印製200410620 A7 B7 V. Description of the invention (彳) [Field of the invention] The present invention relates to the manufacturer of a printed wiring board whose surface is flattened (please read the precautions on the back before filling this page). [Background of the Invention] [Xi Explanation of the know-how] For manufacturing a multilayer printed wiring board by, for example, a build-up method, it is necessary to planarize the surface of the underlying substrate in order to increase the density of the wiring. However, the circuit pattern of the printed substrate is generally etched (Etch). ) It is produced by the Subtract method of removing unnecessary portions of the copper foil, so that the circuit pattern portion is formed in a convex shape bulging from the surface of the substrate. Therefore, in order to planarize a printed substrate having a concave and convex shape on the surface, for example, the following method is used. It is proposed that, for example, a resin sheet in a semi-hardened state is laminated on a circuit pattern, and the resin sheet is pressed by an intermediary smooth plate under a reduced pressure environment, buried in the circuit pattern to harden, and then the resin is flat-honed. The surface method has been proposed since the beginning. The Intellectual Property Bureau of the Ministry of Economic Affairs, the Consumer Cooperative Cooperative Association ΓΓ However, due to the circuit on the substrate When the pattern has sparse or dense parts, or the presence of through holes, etc., the resin layer cannot be formed uniformly and well. For example, in dense parts, it is difficult to press in between circuit patterns. Resin flakes have holes (Voids) in the post-processing due to the unfilled part remaining, or the resin layer surface is not flat due to the remaining thick resin on the circuit pattern, and only the dense part of the circuit pattern is formed slowly. The state of the bulge. On the contrary, the circuit pattern is insufficient in the amount of resin compared with other parts in the sparse part or the part with through holes. The paper size of the resin layer is in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm). 200410620 A7 B7 V. Description of the invention (2) -------- I — (Please read the legal notice on the back to fill in the surface of the book slowly and gradually become a depressed state. In this state, even if the intermediary is smooth It is difficult to uniformly form the entire resin layer by pressing the plate, and it is also difficult to perform flat honing of the substrate having such gentle fluctuations with high accuracy. The purpose of the above-mentioned creation is to provide a method for manufacturing a printed wiring board that can form a uniform and good resin layer throughout the substrate even with the denseness of circuit patterns or the presence or absence of through-holes. According to the present invention, the resin layer is formed by superimposing a resin sheet in a semi-hardened state on a printed wiring board on which a circuit pattern is formed. The resin layer is pressed and laminated between the circuit patterns to harden, and then the circuit pattern is covered. A method of manufacturing a printed wiring board by grinding hardened resin and exposing the circuit pattern, before the resin sheet is superposed on the printed wiring board, printing a reverse pattern of the circuit pattern on a surface facing the circuit pattern of the resin sheet. Resin features. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. On the printed wiring board with through-holes and circuit patterns, a semi-hardened resin sheet is laminated to form a resin layer. This resin is pressed into the circuit patterns to harden it. , And then a method of manufacturing a printed wiring board by honing and hardening the resin covering the circuit pattern to expose the circuit pattern, before overlapping the resin sheet on the printed wiring board, the position corresponding to the through hole in the resin sheet The characteristics of the resin for printing and burying the through hole are characteristic. The pressing of the resin layer may be performed in a reduced pressure environment. And this paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) -6-200410620 A7 _B7 V. Description of the invention (3) The resin layer is superimposed on the resin layer and the surface facing the resin layer is roughened metal foil And press (please read the precautions on the back before filling this page). In this case, the metal foil can be formed of a metal different from the circuit pattern. If the resin layer is pressed according to the present invention, even if the resin layer is gently raised at the portion where the circuit pattern is formed, the bulge is crushed to make the resin The whole layer becomes thin and wide. At this time, even if the circuit pattern on the substrate is dense, the resin pattern has a reverse pattern resin printed on the surface facing the circuit pattern of the resin sheet, so the resin layer is uniform regardless of the density of the circuit pattern. . When the resin is hardened in this state, only a relatively thin resin layer remains on the circuit pattern, and it is honed with a strength that does not damage the circuit pattern, so that a flat substrate with a circuit pattern exposed can be obtained. In addition, when the substrate has a through hole, since resin is printed in advance in the resin sheet at a position corresponding to the through hole, the resin is not insufficient in the through hole, and the entire resin layer on the substrate can be formed uniformly. In addition, by pressing the resin layer in a reduced pressure environment, even if it is assumed that air bubbles are contained in the resin layer, the air bubbles can be removed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When pressing the resin layer, if the metal foil facing the resin layer is roughened on the resin layer, the resin layer will become thinner and wider. The surface of this resin layer becomes a fine uneven shape following the roughened surface of the metal foil. As a result, honing of the residual resin layer can be performed more easily. When the metal foil is formed of a metal different from the circuit pattern, only the metal foil is dissolved, and the metal foil can be removed by selective etching that does not affect the metal of the circuit pattern. This paper size applies the Chinese National Standard (CNS) A4 specification (210'〆 297 mm) 200410620 A7 B7 V. Description of the invention (4) [Simplified description of the figure] Figure 1 is a sectional view of a copper-clad laminated board. FIG. 2 is a cross-sectional view of a wiring substrate in which a circuit pattern is formed. Fig. 3 is a cross-sectional view of a wiring board in a case where a resin layer is formed using a resin sheet according to the first embodiment of the present invention. Fig. 4 is a cross-sectional view of a wiring board showing a layout at the same time when the pressure is reduced. FIG. 5 is a cross-sectional view of a wiring substrate after the resin is cured. FIG. 6 is a cross-sectional view of the wiring substrate after the metal foil is removed in the same manner. FIG. 7 is a cross-sectional view of a wiring board after honing in the same manner. Fig. 8 is a cross-sectional view of a wiring substrate having through-holes formed in a copper-clad laminated board. Fig. 9 is a cross-sectional view of a wiring substrate in which a plating layer is similarly formed. FIG. 10 is a cross-sectional view of a wiring substrate in which a circuit pattern is similarly formed. Fig. 11 is a sectional view of a wiring board in a case where a resin layer is formed with a resin sheet according to a second embodiment of the present invention. Fig. 12 is a cross-sectional view of a wiring board showing a layout when the pressure is reduced. FIG. 13 is a cross-sectional view of the wiring board after the resin is cured in the same manner. FIG. 14 is a cross-sectional view of the wiring substrate after the metal foil is removed in the same manner. FIG. 15 is a cross-sectional view of a wiring board after honing in the same manner. [Symbols] 1 〇: The paper size of copper-clad laminated board is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) coupons-(Please read the precautions on the back before filling this page) Printed by the Bureau's Consumer Cooperative
-8- 200410620 A7 B7 五、發明説明（5) 11:玻璃環氧基板 12:銅箔 13:貫通孔 14:電鍍層 15:電路圖案 16:樹脂層 17:鎳箔 18:特氟隆薄片 1 9 :不銹鋼板 20:樹脂薄片 (請先閲讀背面之注意事項再填寫本頁) 裝_ 經 濟 部 智 慧 財 產 局 員 玉 消 合 作 社 印 【較佳實施例之詳細說明】 <第一實施形態> 在本實施形態如圖1所示，基材使用例如在厚度 100〜3 00//m的玻璃環氧基板11的兩面貼附銅箔12而成的 貼銅疊層板1 〇。在此貼銅疊層板1 〇利用周知的光蝕刻法形 成電路圖案15(參照圖2)。 其次如圖3所示，在配線基板的電路圖案1 5上藉由疊 層例如令熱硬化性環氧樹脂爲半硬化狀態的厚度約3 0 // m 的樹脂薄片20，在基板上形成樹脂層1 6。在面對此樹脂薄 片20的電路圖案15的面預先印刷有與電路圖案15逆圖案 的熱硬化性環氧樹脂。 其次如圖4所示，在減壓環境中令單面被針狀電鍍而 粗面化的厚度的鎳箔17其粗面面對樹脂層16而放 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -9- 200410620 A7 B7 五、發明説明（6) (請先閱讀背面之注意事項再填寫本頁) 在樹脂層1 6上。中介令距其外側厚度約1 mm的平滑的不 銹鋼板 19爲離形薄膜的特氟隆（Teflon)薄片18，以 3 OKg/cm2壓於基板。於是樹脂層16表面爲緩緩的起伏狀態 的情形也被平滑的不銹鋼板1 9壓碎而被平坦化，並且樹脂 層16全體變薄且寬。而且，樹脂層16中的氣泡浮在樹脂 層1 6的表面附近由樹脂內部被除去。 其次，壓住不銹鋼板19充分壓碎電路圖案15上的樹 脂層1 6，在充分地使樹脂中的氣泡放出到外部後，更進行 加熱使樹脂層1 6正式硬化。 經濟部智慧財產局員工消費合作社印 其次，去除不銹鋼板19以及特氟隆薄片18,藉由鎳專 用的蝕刻液除去附著於樹脂層16表面的鎳箔17(參照圖5 以及圖6)。於是，銅的電路圖案15上的殘渣樹脂層變成 1 0 // m以下，並且成爲其表面被粗化的狀態。因此最後藉 由利用陶瓷拋光輪（Buff)去除電路圖案15上的樹脂層16的 一次平滑表面硏磨，與利用平面磨削機使面內平均粗糙精 度爲3// m以下的二次精加工硏磨使基板平坦化（圖7)。在 此表面硏磨時，殘留於電路圖案15上的樹脂層16爲10// m非常薄，且因其表面被粗化故硏磨容易進行。 <第二實施形態> 以下參照圖8至圖1 5說明本發明的第二實施形態。與 上述第一實施形態重複的部分省略。 在本實施形態在與上述第一實施形態同樣的貼銅疊層 板1 〇的必要位置使用周知的鑽孔（Dri 11)等加工打開貫通孔 本紙張尺度適用中國國家標準（CNS ) ( 2丨Gx297公董） — 200410620 經 濟 部 智 慧 財 產 局 消 費 合 社 印 製“ A7 __B7_五、發明説明（7) 13(參照圖8)，進行化學電鍍以及電解電鍍在也包含貫通孔 1 3的內周面的全域形成銅的電鍍層1 4，令基板表面的導體 層厚度爲約20 // m(參照圖9)，然後利用周知的光蝕刻法形 成電路圖案15 (參照圖10)。 其次如圖1 1所示，在配線基板的電路圖案1 5上藉由 疊層例如令熱硬化性環氧樹脂爲半硬化狀態的厚度約3 0 // m的樹脂薄片20，在基板上形成樹脂層1 6。在此樹脂薄片 20之中對應貫通孔13的位置，預先印刷有塡埋貫通孔13 用的熱硬化性環氧樹脂。而且此時樹脂層1 6表面變成電路 圖案1 5部分隆起的緩緩的起伏狀態。 其次與上述第一實施形態一樣，將單面被粗面化的厚 度18//m的鎳箔17放在樹脂薄片20上，中介特氟隆薄片 1 8在減壓環境中將距其外側厚度約1 mm的平滑的不銹鋼板 19壓於基板（參照圖12)。樹脂薄片20因來自不銹鋼板19 施加的壓力而容易變形。即令疊層於電路圖案15上的樹脂 部分埋入圖案間而移動，令基板全體大致成平坦的狀態。 而且，在樹脂薄片預先被印刷的樹脂被壓入貫通孔內部， 貫通孔內完全被樹脂埋入。再者，藉由不銹鋼板19被壓住 ，使樹脂薄片20全體變薄且寬。而且同時進入樹脂薄片20 與基板表面之間的氣泡或樹脂薄片2 0中的氣泡浮在樹脂薄 片20的表面附近，由樹脂內部被除去。因此，進行加熱使 樹脂薄片20正式硬化。 然後，去除不銹鋼板19,藉由鎳專用的蝕刻液除去附 著於樹脂薄片20表面的鎳箔17(參照圖13以及圖14)。電 (請先閲讀背面之注意事項再填寫本頁) -裝· 、-ιτ 本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇Χ297公釐） -11 - 200410620 A7 B7 五、發明説明（8) (請先閲讀背面之注意事項再填寫本頁) 路圖案1 5上的樹脂薄片20被壓碎薄到1 〇 # m左右。最後 ，與上述第一實施形態一樣進行硏磨，使電路圖案15露出 得到平坦基板（參照圖15)。 本發明並非限定於根據以上的記述以及圖面說明的實 施形態，例如如以下的實施形態也包含於本發明的技術範 圍，再者，除了以下以外，在不脫離其要旨的範圍內可實 施種種的變更。 (1 )、在上述實施形態雖然藉由去掉法形成電路圖案， 惟以藉由添加（Additive)法形成的構成也可以。 (2) 、在上述實施形態雖然樹脂層的材料使用熱硬化性 環氧樹脂，惟並非限定於此，使用尿素樹脂、蜜胺 (Melamine)樹脂、苯酚樹脂、丙烯樹脂、不飽和聚酯樹脂等 的熱硬化性樹脂也可以。 (3) 、在上述實施形態雖然金屬箔材料使用鎳，惟並非 限定於此，使用銅等的其他金屬也可以。 【產業上的可利用性】 經濟部智慧財產局員工消費合作社印_. 如以上所述如果依照本發明，即使有電路圖案的疏密 或貫通孔的有無，也能製造在基板全體形成有均勻且良好 的樹脂層的印刷配線基板。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -12--8- 200410620 A7 B7 V. Description of the invention (5) 11: Glass epoxy substrate 12: Copper foil 13: Through hole 14: Plating layer 15: Circuit pattern 16: Resin layer 17: Nickel foil 18: Teflon sheet 1 9: Stainless steel plate 20: Resin sheet (please read the precautions on the back before filling this page) Packing _ Printed by Yu Xiao Cooperative, Member of the Intellectual Property Bureau of the Ministry of Economic Affairs [Detailed description of the preferred embodiment] < First embodiment > In this embodiment, as shown in FIG. 1, a copper-clad laminated board 10 in which a copper foil 12 is attached to both sides of a glass epoxy substrate 11 having a thickness of 100 to 3 00 // m is used as a base material, for example. Here, the copper-clad laminated board 10 is formed with a circuit pattern 15 by a known photoetching method (see FIG. 2). Next, as shown in FIG. 3, a resin sheet 20 having a thickness of about 3 0 // m, for example, a thermosetting epoxy resin in a semi-hardened state, is laminated on the circuit pattern 15 of the wiring substrate to form a resin on the substrate. Layers 1 to 6. On the surface of the circuit pattern 15 of this resin sheet 20, a thermosetting epoxy resin having a pattern reverse to that of the circuit pattern 15 is printed in advance. Secondly, as shown in FIG. 4, in a decompressed environment, a nickel foil 17 having a thickness of one side being needle-plated and roughened has a rough surface facing the resin layer 16, and the paper size is in accordance with Chinese National Standards (CNS) A4 specification (210X297 mm) -9-200410620 A7 B7 V. Description of the invention (6) (Please read the precautions on the back before filling this page) on the resin layer 16. The intermediary made a smooth stainless steel plate 19 having a thickness of about 1 mm from the outside thereof a Teflon sheet 18 of a release film, and pressed it to the substrate at 3 OKg / cm2. As a result, the surface of the resin layer 16 is gradually undulated, and it is crushed and flattened by the smooth stainless steel plate 19, and the entire resin layer 16 becomes thin and wide. The bubbles in the resin layer 16 float near the surface of the resin layer 16 and are removed from the inside of the resin. Next, the stainless steel plate 19 is pressed to sufficiently crush the resin layer 16 on the circuit pattern 15, and after the bubbles in the resin are sufficiently discharged to the outside, the resin layer 16 is hardened by further heating. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Next, the stainless steel plate 19 and the Teflon sheet 18 are removed, and the nickel foil 17 attached to the surface of the resin layer 16 is removed with a nickel-specific etching solution (see Figs. 5 and 6). Then, the residual resin layer on the copper circuit pattern 15 becomes 10 / m or less, and the surface is roughened. Therefore, a smooth surface honing of the resin layer 16 on the circuit pattern 15 is finally removed by using a ceramic buff, and a secondary finishing with an in-plane average roughness accuracy of 3 // m or less using a surface grinder. Honing flattens the substrate (Figure 7). When the surface is honed, the resin layer 16 remaining on the circuit pattern 15 is very thin, and honing is easy because the surface is roughened. < Second Embodiment > A second embodiment of the present invention will be described below with reference to Figs. 8 to 15. The part overlapping with the first embodiment is omitted. In this embodiment, a through hole is opened at a necessary position of the copper-clad laminated board 10 similar to the first embodiment by using a well-known drilling (Dri 11) or the like. The paper size applies the Chinese National Standard (CNS) (2 丨Gx297 director) — 200410620 Printed by the Consumer Cooperative of the Bureau of Intellectual Property of the Ministry of Economic Affairs “A7 __B7_ V. Invention Description (7) 13 (refer to FIG. 8), chemical plating and electrolytic plating are performed on the inner periphery that also includes the through holes 13 A copper plating layer 14 is formed over the entire surface of the substrate, so that the thickness of the conductor layer on the substrate surface is about 20 // m (see FIG. 9), and then a circuit pattern 15 (see FIG. 10) is formed by a well-known photoetching method. As shown in FIG. 11, a resin layer 20 having a thickness of about 3 0 // m is formed by laminating a thermosetting epoxy resin in a semi-hardened state on a circuit pattern 15 of a wiring substrate 1 to form a resin layer 1 on the substrate. 6. The position of the resin sheet 20 corresponding to the through hole 13 is printed with a thermosetting epoxy resin for embedding the through hole 13 in advance. At this time, the surface of the resin layer 16 becomes a part of the circuit pattern 15. Mild undulations. As in the first embodiment described above, a nickel foil 17 with a thickness of 18 // m that has been roughened on one side is placed on the resin sheet 20, and the intervening Teflon sheet 18 will have a thickness from its outer side in a reduced pressure environment. A 1 mm smooth stainless steel plate 19 is pressed against the substrate (see FIG. 12). The resin sheet 20 is easily deformed by the pressure applied from the stainless steel plate 19. Even if the resin portion laminated on the circuit pattern 15 is buried between the patterns and moved, The entire substrate is made substantially flat. In addition, the resin printed in advance on the resin sheet is pressed into the through hole, and the through hole is completely embedded in the resin. Furthermore, the stainless steel plate 19 is pressed to make the resin sheet The entire 20 becomes thin and wide. At the same time, bubbles that enter between the resin sheet 20 and the substrate surface or bubbles in the resin sheet 20 float near the surface of the resin sheet 20 and are removed from the inside of the resin. Therefore, heating is performed to make the resin sheet 20 is hardened. Then, the stainless steel plate 19 is removed, and the nickel foil 17 (see FIGS. 13 and 14) attached to the surface of the resin sheet 20 is removed with a nickel-specific etching solution. Electricity (please read the precautions on the back first) (Fill in this page again) -Packing ·, -ιτ This paper size is applicable to Chinese National Standards (CNS) A4 specifications (21 × 297 mm) -11-200410620 A7 B7 V. Description of the invention (8) (Please read the note on the back first Please fill in this page again) The resin sheet 20 on the road pattern 15 is crushed to a thickness of about 10 mm. Finally, the honing is performed in the same manner as the first embodiment to expose the circuit pattern 15 to obtain a flat substrate (see FIG. 15). The present invention is not limited to the embodiments described above and illustrated in the drawings. For example, the following embodiments are also included in the technical scope of the present invention. In addition, the scope of the present invention is not deviated from the gist except the following. Various changes can be implemented. (1) Although the circuit pattern is formed by the removal method in the above embodiment, a configuration formed by the additive method may be used. (2) In the above embodiment, although the material of the resin layer is a thermosetting epoxy resin, it is not limited to this. Urea resin, melamine resin, phenol resin, acrylic resin, unsaturated polyester resin, etc. are used. Thermosetting resin is also possible. (3) Although nickel is used as the metal foil material in the above embodiment, it is not limited to this, and other metals such as copper may be used. [Industrial Applicability] As stated above, according to the present invention, the Intellectual Property Bureau employee ’s consumer cooperative prints _. According to the present invention, even if there are denseness of circuit patterns or the presence or absence of through-holes, it can be produced uniformly on the entire substrate. A printed wiring board with a good resin layer. This paper size applies to China National Standard (CNS) A4 (210X 297mm) -12-