JP4693295B2 - Circuit formation method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit pattern manufacturing method.
[0002]
[Prior art]
An RFID data carrier that has been provided with a coiled antenna pattern on a base material such as plastic has been used to form a resonant circuit with this antenna pattern and a capacitive element to receive and transmit radio waves of a certain frequency. Has been. And a conductive metal layer provided the conductive metal layer such as aluminum is etched provided the photoresist has been formed by removing the unnecessary metal layer portion in the RFID data carrier is on generally the substrate.
[0003]
However, when an IC chip is attached and electrically connected to the antenna pattern of the RFID data carrier formed in this way and then covered with the RFID data carrier and protected with a protective film such as a polyester film, the periphery of the IC chip and the antenna circuit In this case, sufficient adhesion with the protective film may not be obtained.
[0004]
[Problems to be solved by the invention]
An object of the present invention is to provide a method for forming a circuit in which adhesion of a circuit pattern such as an RFID data carrier to a substrate of a protective film is sufficiently obtained.
[0005]
[Means for Solving the Problems]
The invention described in claim 1 solves the above-mentioned problems, and a conductive metal layer is provided on a base material, and a resist printed by screen printing using a screen printing plate is provided on the conductive metal layer and etched. by a circuit pattern including connections to IC chips, after forming in a state where jagged corresponding to the screen printing plate of the screen mesh on its end sides remain, the IC chip to the connecting portion of the formed circuit pattern The protective layer for covering and then covering the circuit pattern and the IC chip is formed by resin coating or film lamination.
[0006]
The invention according to claim 2 solves the above-described problem, and a circuit pattern including a connection portion to an IC chip using a conductive ink including a conductive metal on a substrate is used as a screen using a screen printing plate. After forming with jagged edges corresponding to the screen mesh of the screen printing plate by the printing method, an IC chip is attached to the connection part of the formed circuit pattern, and then the circuit pattern and the IC chip are covered. The protective layer is formed by resin coating or film lamination .
[0007]
The method of the present invention can be effectively applied to a circuit pattern of an RFID data carrier whose circuit pattern includes a coiled antenna pattern.
[0008]
In the method of forming the circuit of the present invention, by screen printing a circuit pattern including connections to the IC chip, or a screen printing resist pattern provided on the metal layer, forming by etching, the screen mesh of Giza Giza The remaining circuit pattern is formed. The Giza Giza and forming a protective layer by coating or laminating onto this increases the degree contact with the circuit pattern. As a result, sufficient adhesion with the protective film is obtained around the IC chip and the antenna circuit.
[0009]
Therefore, in the case of an RFID data carrier circuit pattern in which the circuit pattern has a narrow interval and the line is coiled, the edge of the circuit pattern is laminated with sufficient strength even between the lines of the circuit that have a narrow interval. Adhesive and fixed to the adhesive layer.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The method of the present invention will be described below with reference to the drawings.
First, as shown in FIG. 1A, a blank plate in which a metal layer 3 such as aluminum is dry-laminated on a base material 1 such as polyester via an adhesive layer 2 is prepared. Then, a resist pattern is provided on the blank plate by screen printing at a screen line number of 175 line / in to 200 line / in, and etching is performed. As shown in FIG. 1B, the contact pad portion (IC chip connection portion) 5 and a circuit portion 4 such as an antenna coil are formed. At this time, since the resist pattern is formed by screen printing, a jagged surface 9 corresponding to the screen mesh of the screen printing plate is formed on the edge of the circuit pattern 4 formed as shown in FIG.
[0011]
Next, as shown in FIG. 1C, the IC chip 6 is placed on the contact pad portion 5, and the protective film 8 is laminated through the laminate adhesive layer 7 to form a protective layer . At that time, the jagged 9 formed on the edge of the circuit unit 4 exists, so that the circuit unit 4 is firmly bonded to the laminate adhesive layer 7. Results adhesion between the end side and the laminate adhesive layer 7 of the circuit section 4 as a high adhesive strength unchanged the adhesion between the laminated adhesive layer 7 and the substrate 1 is obtained.
[0012]
In the above embodiment, the protective layer is formed by laminating, but the same effect can be obtained by coating a resin instead of doing this.
[0013]
In the above embodiment, the contact pad portion 5 and the circuit portion 4 such as the antenna coil are formed by providing a screen printing resist pattern on the substrate and etching, but instead of doing this, aluminum or the like is formed. The circuit portion 4 such as the direct contact layer pad portion 5 and the antenna coil may be formed by screen printing on a base material using a conductive ink containing a conductive metal.
[0014]
FIG. 3 shows an example of a circuit pattern including a contact pad portion 5 and a circuit portion 4 such as an antenna coil. This pattern is an example of an RFID data carrier pattern.
[0015]
In the above embodiment, the protective layer is formed by laminating, but the same effect can be obtained by coating a resin instead of doing this.
[0016]
Example 1
A blank plate is prepared by dry laminating 30 μm thick aluminum on a 38 μm thick polyester film through an adhesive layer. A resist pattern is formed on the polyester film by screen printing with a screen mesh of 300 mesh and etched to create an IC chip. An RFID data carrier pattern including a connection to was formed. Next, a polyester film (thickness 25 μm) was laminated through a polyester-based laminate adhesive layer with the IC chip placed on the connection portion.
[0017]
As a result of investigation on the adhesion state between the edge of the pattern of the RFID data carrier including the connection part to the IC chip and the laminate adhesive layer, it is found that the product obtained as described above is bonded with sufficient strength. It was.
[0018]
(Example 2)
Using a conductive ink containing silver on a 38 μm thick polyester film, an RFID data carrier pattern including a connection to an IC chip is formed by screen printing with a screen line number of 325 mesh, and then the IC chip is connected to the connection. A polyester film (thickness: 12 μm) was laminated through a polyester-based laminate adhesive layer in the state of being placed.
[0019]
As a result of investigation on the adhesion state between the edge of the pattern of the RFID data carrier including the connection part to the IC chip and the laminate adhesive layer, it is found that the product obtained as described above is bonded with sufficient strength. It was.
[0020]
【The invention's effect】
As described above in detail, according to the method of the present invention, a conductive metal layer is provided on a substrate, and a resist printed by screen printing using a screen printing plate is provided on the conductive metal layer and etched. , a circuit pattern including connections to the IC chip, or formed in a state of jagged corresponding to the screen printing plate of the screen mesh on its end sides remain, or, the conductor ink comprising a conductive metal on a substrate using by a circuit pattern including connections to the IC chip, by a screen printing method using a screen printing plate, it is formed in a state of jagged corresponding to the screen printing plate of the screen mesh on its end sides remain Te, the screen form a protective layer on the circuit pattern remaining mesh of Giza Giza by laminating a coating or film of resin Then the jagged increases the degree contact with the circuit pattern. As a result, sufficient adhesion with the protective layer is obtained around the IC chip and the antenna circuit.
[0021]
Therefore, in the case of an RFID data carrier circuit pattern in which the circuit pattern has a narrow interval and the line is coiled, the edge of the circuit pattern is laminated with sufficient strength even between the lines of the circuit that have a narrow interval. Adhesive and fixed to the adhesive layer.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing a method of the present invention.
FIG. 2 is a schematic diagram showing a state in which a jagged edge is formed on an edge of a circuit pattern formed by screen printing . FIG. 3 is an example of a circuit pattern including a contact pad portion 5 and a circuit portion 4 such as an antenna coil. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 3 Metal layer 4 Circuit parts, such as an antenna coil 5 Contact layer pad part 6 IC chip 7 Laminate adhesive layer 8 Protective film
9 Jagged edges formed on the circuit pattern

Claims (3)

Provided a conductive metal layer on a substrate, by etching to provide a screen-printed resist by a screen printing plate to the conductive metal layer, a circuit pattern including connections to the IC chip, its end after forming in a state where jagged corresponding to the screen printing plate of the screen mesh sides remain attached to the IC chip to the connecting portion of the formed circuit pattern, a protective layer covering the circuit pattern and the IC chip later accordingly resin A method of forming a circuit, characterized by forming by coating or laminating a film. A circuit pattern including a connection portion to an IC chip using a conductive ink containing a conductive metal on a base material is screen printed using a screen printing plate , and the edge corresponds to the screen mesh of the screen printing plate. After forming with jagged edges, an IC chip is attached to the connection part of the formed circuit pattern, and then a protective layer covering the circuit pattern and the IC chip is formed by resin coating or film lamination. Circuit forming method.   3. The method of forming a circuit according to claim 1, wherein the circuit pattern is a circuit pattern of an RFID data carrier including a coiled antenna pattern.

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