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TWD167988S - 半導體製造裝置用晶舟 - Google Patents

半導體製造裝置用晶舟

Info

Publication number
TWD167988S
TWD167988S TW103300468F TW103300468F TWD167988S TW D167988 S TWD167988 S TW D167988S TW 103300468 F TW103300468 F TW 103300468F TW 103300468 F TW103300468 F TW 103300468F TW D167988 S TWD167988 S TW D167988S
Authority
TW
Taiwan
Prior art keywords
manufacturing equipment
semiconductor manufacturing
wafer
semiconductor wafer
wafer boats
Prior art date
Application number
TW103300468F
Other languages
English (en)
Inventor
Hidenari Yoshida
Tomoshi Taniyama
Original Assignee
日立國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司 filed Critical 日立國際電氣股份有限公司
Publication of TWD167988S publication Critical patent/TWD167988S/zh

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置用晶舟，為一種半導體晶圓施行成膜時，用以將半導體晶圓水平地保持在反應室內的晶舟。;【設計說明】;如B-B放大剖面圖所示，將半導體晶圓載置在前方左右形成梳子狀的爪部、和形成在後方左右之支柱部的梳子狀段差部。本物品是由石英製成。
TW103300468F 2013-07-29 2014-01-24 半導體製造裝置用晶舟 TWD167988S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013017233 2013-07-29

Publications (1)

Publication Number Publication Date
TWD167988S true TWD167988S (zh) 2015-05-21

Family

ID=54012970

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103300468F TWD167988S (zh) 2013-07-29 2014-01-24 半導體製造裝置用晶舟

Country Status (2)

Country Link
US (1) USD738329S1 (zh)
TW (1) TWD167988S (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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USD764423S1 (en) * 2014-03-05 2016-08-23 Hzo, Inc. Corrugated elements for defining longitudinal channels in a boat for a deposition apparatus
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
JP1537312S (zh) * 2014-11-20 2015-11-09
JP1537629S (zh) * 2014-11-20 2015-11-09
JP1537630S (zh) * 2014-11-20 2015-11-09
JP1537313S (zh) * 2014-11-20 2015-11-09
JP1563649S (zh) * 2016-02-12 2016-11-21
JP1597807S (zh) * 2017-08-21 2018-02-19
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP1638282S (zh) * 2018-09-20 2019-08-05
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP1658652S (zh) * 2019-08-07 2020-04-27
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1731670S (zh) * 2022-03-04 2022-12-08
JP1731675S (zh) * 2022-05-30 2022-12-08
JP1731673S (zh) * 2022-05-30 2022-12-08
JP1731674S (zh) * 2022-05-30 2022-12-08
JP1741512S (zh) * 2022-09-14 2023-04-11

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USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
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USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus

Also Published As

Publication number Publication date
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