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TWD115746S1 - 支撐板 - Google Patents

支撐板

Info

Publication number
TWD115746S1
TWD115746S1 TW095301182F TW95301182F TWD115746S1 TW D115746 S1 TWD115746 S1 TW D115746S1 TW 095301182 F TW095301182 F TW 095301182F TW 95301182 F TW95301182 F TW 95301182F TW D115746 S1 TWD115746 S1 TW D115746S1
Authority
TW
Taiwan
Prior art keywords
round holes
back side
small round
semiconductor wafer
design
Prior art date
Application number
TW095301182F
Other languages
English (en)
Inventor
中村彰彥
宮成淳
稻尾吉浩
Original Assignee
東京應化工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京應化工業股份有限公司 filed Critical 東京應化工業股份有限公司
Publication of TWD115746S1 publication Critical patent/TWD115746S1/zh

Links

Abstract

【物品用途】;本創作的物品是一種支撐板，當在研磨半導體晶圓之背面側進行薄板化時，貼附在半導體晶圓之正面側，於研磨之際，防止半導體晶圓發生破裂等，材質例如可使用玻璃板。;【創作特點】;如立體圖、前視圖及後視圖所示，該支撐板為一薄板體，並於適當處做部分切除形成平切面，其正面的外周具有許多貫穿至背面的小圓孔，於該些小圓孔所圍構的內表面上，佈滿蜂巢形花紋，且於該花紋的中心具有四個貫穿至背面的小圓孔，因此由後視圖觀看時，除小圓孔外其餘為平滑面狀的設計；綜上所述，本創作之整體造形除了功能需求外，同時更考慮到美觀上的要求，依此產生此以特殊之外觀樣態，確為一創新美觀之產品。
TW095301182F 2005-09-08 2006-03-08 支撐板 TWD115746S1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005026008 2005-09-08

Publications (1)

Publication Number Publication Date
TWD115746S1 true TWD115746S1 (zh) 2007-03-01

Family

ID=38120961

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095301182F TWD115746S1 (zh) 2005-09-08 2006-03-08 支撐板

Country Status (2)

Country Link
US (1) USD544452S1 (zh)
TW (1) TWD115746S1 (zh)

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USD809804S1 (en) * 2014-12-17 2018-02-13 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
TWD174921S (zh) 2014-12-17 2016-04-11 日本碍子股份有限公司 複合基板之部分
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
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USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling

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Publication number Publication date
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