[go: up one dir, main page]

TWD115746S1 - Supporting plate - Google Patents

Supporting plate

Info

Publication number
TWD115746S1
TWD115746S1 TW095301182F TW95301182F TWD115746S1 TW D115746 S1 TWD115746 S1 TW D115746S1 TW 095301182 F TW095301182 F TW 095301182F TW 95301182 F TW95301182 F TW 95301182F TW D115746 S1 TWD115746 S1 TW D115746S1
Authority
TW
Taiwan
Prior art keywords
round holes
back side
small round
semiconductor wafer
design
Prior art date
Application number
TW095301182F
Other languages
Chinese (zh)
Inventor
中村彰彥
宮成淳
稻尾吉浩
Original Assignee
東京應化工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京應化工業股份有限公司 filed Critical 東京應化工業股份有限公司
Publication of TWD115746S1 publication Critical patent/TWD115746S1/en

Links

Abstract

【物品用途】;本創作的物品是一種支撐板，當在研磨半導體晶圓之背面側進行薄板化時，貼附在半導體晶圓之正面側，於研磨之際，防止半導體晶圓發生破裂等，材質例如可使用玻璃板。;【創作特點】;如立體圖、前視圖及後視圖所示，該支撐板為一薄板體，並於適當處做部分切除形成平切面，其正面的外周具有許多貫穿至背面的小圓孔，於該些小圓孔所圍構的內表面上，佈滿蜂巢形花紋，且於該花紋的中心具有四個貫穿至背面的小圓孔，因此由後視圖觀看時，除小圓孔外其餘為平滑面狀的設計；綜上所述，本創作之整體造形除了功能需求外，同時更考慮到美觀上的要求，依此產生此以特殊之外觀樣態，確為一創新美觀之產品。[Purpose of the article]: The article of this invention is a support plate. When the back side of the semiconductor wafer is thinned by grinding, it is attached to the front side of the semiconductor wafer to prevent the semiconductor wafer from cracking during grinding. The material that can be used is, for example, a glass plate. ;【Features of the design】;As shown in the three-dimensional diagram, front view and back view, the support plate is a thin plate with a partial cut at an appropriate location to form a flat section. The outer periphery of the front side has many small round holes that penetrate to the back side. The inner surface surrounded by these small round holes is covered with a honeycomb pattern, and in the center of the pattern there are four small round holes that penetrate to the back side. Therefore, when viewed from the back side, except for the small round holes, the rest is a smooth surface design. In summary, the overall shape of this design not only meets functional requirements, but also takes into account aesthetic requirements, thus producing this special appearance, which is indeed an innovative and beautiful product.

TW095301182F 2005-09-08 2006-03-08 Supporting plate TWD115746S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005026008 2005-09-08

Publications (1)

Publication Number Publication Date
TWD115746S1 true TWD115746S1 (en) 2007-03-01

Family

ID=38120961

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095301182F TWD115746S1 (en) 2005-09-08 2006-03-08 Supporting plate

Country Status (2)

Country Link
US (1) USD544452S1 (en)
TW (1) TWD115746S1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
JP1534136S (en) 2014-11-13 2015-09-28
JP1534137S (en) 2014-11-13 2015-09-28
JP1534138S (en) * 2014-11-13 2015-09-28
USD809804S1 (en) * 2014-12-17 2018-02-13 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
TWD174921S (en) 2014-12-17 2016-04-11 日本碍子股份有限公司 Portion of composite substrates
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1427772A1 (en) * 1965-11-23 1968-12-12 Telefunken Patent Method for cutting a semiconductor wafer into individual semiconductor chips
US5663654A (en) * 1990-08-29 1997-09-02 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
EP0707214A3 (en) * 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe for full-wafer testing
US5894161A (en) * 1997-02-24 1999-04-13 Micron Technology, Inc. Interconnect with pressure sensing mechanism for testing semiconductor wafers
US6483043B1 (en) * 2000-05-19 2002-11-19 Eaglestone Partners I, Llc Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device
US7204887B2 (en) * 2000-10-16 2007-04-17 Nippon Steel Corporation Wafer holding, wafer support member, wafer boat and heat treatment furnace
US6448805B1 (en) * 2001-02-12 2002-09-10 Novalux, Inc. Method and apparatus for wafer-level testing of semiconductor lasers
US20020121915A1 (en) * 2001-03-05 2002-09-05 Agere Systems Guardian Corp. Automated pattern clustering detection for wafer probe maps
KR20040094390A (en) * 2002-04-11 2004-11-09 세키스이가가쿠 고교가부시키가이샤 Method for manufacturing semiconductor chip
US6710611B2 (en) * 2002-04-19 2004-03-23 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
US7015418B2 (en) * 2002-05-17 2006-03-21 Gsi Group Corporation Method and system for calibrating a laser processing system and laser marking system utilizing same
SG111069A1 (en) * 2002-06-18 2005-05-30 Micron Technology Inc Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
JP2004207606A (en) * 2002-12-26 2004-07-22 Disco Abrasive Syst Ltd Wafer support plate

Also Published As

Publication number Publication date
USD544452S1 (en) 2007-06-12

Similar Documents

Publication Publication Date Title
TWD115746S1 (en) Supporting plate
TWD119070S1 (en) Support plate
USD707812S1 (en) Sanitary napkin
USD632207S1 (en) Set of gemstones in an arrangement
USD651306S1 (en) Sanitary napkin
USD621736S1 (en) Watch dial
USD679005S1 (en) Sanitary napkin
USD678519S1 (en) Sanitary napkin
USD676689S1 (en) Table
USD651708S1 (en) Sanitary napkin
USD638424S1 (en) Base station
TWD114694S1 (en) Massage chair
USD561495S1 (en) Pedestal table
USD655519S1 (en) Combination circular dining table and chairs
TWD111399S1 (en) Speaker
USD640057S1 (en) Polishing pad carrier
USD674729S1 (en) Reclining chair
USD517446S1 (en) Decorative article
USD663406S1 (en) Heating plate
USD684378S1 (en) Sheet for vehicle seats
TWD146230S (en) Pedestal covers
USD630799S1 (en) Cosmetic holder
USD561494S1 (en) Table
TWD110660S1 (en) Light emitting semiconductor device
USD611872S1 (en) Gemstone setting