[go: up one dir, main page]

TW373290B - Memory cell having a vertical transistor and a trench capacitor - Google Patents

Memory cell having a vertical transistor and a trench capacitor

Info

Publication number
TW373290B
TW373290B TW086119163A TW86119163A TW373290B TW 373290 B TW373290 B TW 373290B TW 086119163 A TW086119163 A TW 086119163A TW 86119163 A TW86119163 A TW 86119163A TW 373290 B TW373290 B TW 373290B
Authority
TW
Taiwan
Prior art keywords
trench
contact
gate
memory cell
source
Prior art date
Application number
TW086119163A
Other languages
English (en)
Inventor
Norbert Arnold
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW373290B publication Critical patent/TW373290B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/038Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0383Making the capacitor or connections thereto the capacitor being in a trench in the substrate wherein the transistor is vertical
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/39DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench
    • H10B12/395DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench the transistor being vertical

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
TW086119163A 1996-12-20 1997-12-18 Memory cell having a vertical transistor and a trench capacitor TW373290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/770,962 US5937296A (en) 1996-12-20 1996-12-20 Memory cell that includes a vertical transistor and a trench capacitor

Publications (1)

Publication Number Publication Date
TW373290B true TW373290B (en) 1999-11-01

Family

ID=25090246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119163A TW373290B (en) 1996-12-20 1997-12-18 Memory cell having a vertical transistor and a trench capacitor

Country Status (5)

Country Link
US (3) US5937296A (zh)
EP (1) EP0852396A3 (zh)
JP (1) JPH10189916A (zh)
KR (1) KR19980064222A (zh)
TW (1) TW373290B (zh)

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656535A (en) * 1996-03-04 1997-08-12 Siemens Aktiengesellschaft Storage node process for deep trench-based DRAM
US5793075A (en) * 1996-07-30 1998-08-11 International Business Machines Corporation Deep trench cell capacitor with inverting counter electrode
SE510455C2 (sv) * 1997-06-06 1999-05-25 Ericsson Telefon Ab L M Förfarande för att anordna en begravd kondensator och en begravd kondensator anordnad enligt förfarandet
US6316807B1 (en) * 1997-12-05 2001-11-13 Naoto Fujishima Low on-resistance trench lateral MISFET with better switching characteristics and method for manufacturing same
US6177699B1 (en) * 1998-03-19 2001-01-23 Lsi Logic Corporation DRAM cell having a verticle transistor and a capacitor formed on the sidewalls of a trench isolation
US6074909A (en) * 1998-07-31 2000-06-13 Siemens Aktiengesellschaft Apparatus and method for forming controlled deep trench top isolation layers
DE19845058A1 (de) 1998-09-30 2000-04-13 Siemens Ag DRAM-Zellenanordnung und Verfahren zu deren Herstellung
DE19845004C2 (de) * 1998-09-30 2002-06-13 Infineon Technologies Ag DRAM-Zellenanordnung und Verfahren zu deren Herstellung
EP1118116B1 (de) 1998-09-30 2007-01-03 Infineon Technologies AG Substrat mit einer vertiefung, das für eine integrierte schaltungsanordnung geeignet ist, und verfahren zu dessen herstellung
US5977579A (en) * 1998-12-03 1999-11-02 Micron Technology, Inc. Trench dram cell with vertical device and buried word lines
US6235638B1 (en) * 1999-02-16 2001-05-22 Micron Technology, Inc. Simplified etching technique for producing multiple undercut profiles
DE19907174C1 (de) * 1999-02-19 2000-09-14 Siemens Ag Verfahren zum Herstellen einer DRAM-Zelle mit einem Grabenkondensator
DE19911148C1 (de) * 1999-03-12 2000-05-18 Siemens Ag DRAM-Zellenanordnung und Verfahren zu deren Herstellung
DE19911149C1 (de) * 1999-03-12 2000-05-18 Siemens Ag Integrierte Schaltungsanordnung, die eine in einem Substrat vergrabene leitende Struktur umfaßt, die mit einem Gebiet des Substrats elektrisch verbunden ist, und Verfahren zu deren Herstellung
DE19914490C1 (de) * 1999-03-30 2000-07-06 Siemens Ag Speicherzellenanordnung und Verfahren zu deren Herstellung
DE19923262C1 (de) * 1999-05-20 2000-06-21 Siemens Ag Verfahren zur Erzeugung einer Speicherzellenanordnung
US6291298B1 (en) * 1999-05-25 2001-09-18 Advanced Analogic Technologies, Inc. Process of manufacturing Trench gate semiconductor device having gate oxide layer with multiple thicknesses
DE19930748C2 (de) * 1999-07-02 2001-05-17 Infineon Technologies Ag Verfahren zur Herstellung von EEPROM- und DRAM-Grabenspeicherzellbereichen auf einem Chip
TW411553B (en) * 1999-08-04 2000-11-11 Mosel Vitelic Inc Method for forming curved oxide on bottom of trench
DE19941401C1 (de) * 1999-08-31 2001-03-08 Infineon Technologies Ag Verfahren zur Herstellung einer DRAM-Zellenanordnung
DE19943760C1 (de) 1999-09-13 2001-02-01 Infineon Technologies Ag DRAM-Zellenanordnung und Verfahren zu deren Herstellung
DE19944011B4 (de) * 1999-09-14 2007-10-18 Infineon Technologies Ag Verfahren zur Bildung mindestens zweier Speicherzellen eines Halbleiterspeichers
DE19944012B4 (de) * 1999-09-14 2007-07-19 Infineon Technologies Ag Grabenkondensator mit Kondensatorelektroden und entsprechendes Herstellungsverfahren
DE19947053C1 (de) * 1999-09-30 2001-05-23 Infineon Technologies Ag Grabenkondensator zu Ladungsspeicherung und Verfahren zu seiner Herstellung
JP3457236B2 (ja) * 1999-11-05 2003-10-14 茂徳科技股▲ふん▼有限公司 深いトレンチキャパシター蓄積電極の製造方法
DE19956078B4 (de) * 1999-11-22 2006-12-28 Infineon Technologies Ag Verfahren zur Herstellung eines Isolationskragens in einem Grabenkondensators
US6271080B1 (en) * 1999-12-16 2001-08-07 International Business Machines Corporation Structure and method for planar MOSFET DRAM cell free of wordline gate conductor to storage trench overlay sensitivity
DE10008814B4 (de) * 2000-02-25 2006-06-29 Mosel Vitelic Inc. Aufbau eines Drams mit vertikalem Transistor und dessen Herstellung
DE10011889A1 (de) 2000-03-07 2001-09-20 Infineon Technologies Ag Speicherzelle mit Graben und Verfahren zu ihrer Herstellung
US6288422B1 (en) 2000-03-31 2001-09-11 International Business Machines Corporation Structure and process for fabricating a 6F2 DRAM cell having vertical MOSFET and large trench capacitance
US6281539B1 (en) 2000-03-31 2001-08-28 International Business Machines Corporation Structure and process for 6F2 DT cell having vertical MOSFET and large storage capacitance
US6326275B1 (en) * 2000-04-24 2001-12-04 International Business Machines Corporation DRAM cell with vertical CMOS transistor
US6437381B1 (en) * 2000-04-27 2002-08-20 International Business Machines Corporation Semiconductor memory device with reduced orientation-dependent oxidation in trench structures
US6486024B1 (en) 2000-05-24 2002-11-26 Infineon Technologies Ag Integrated circuit trench device with a dielectric collar stack, and method of forming thereof
DE10027913A1 (de) * 2000-05-31 2001-12-13 Infineon Technologies Ag Speicherzelle mit einem Grabenkondensator
US6358867B1 (en) 2000-06-16 2002-03-19 Infineon Technologies Ag Orientation independent oxidation of silicon
US6417063B1 (en) * 2000-06-22 2002-07-09 Infineon Technologies Richmond, Lp Folded deep trench capacitor and method
DE10043586B4 (de) * 2000-09-05 2005-07-28 Promos Technologies, Inc. DRAM-Zellen mit tief eingegrabenen Kondensatoren und darüber liegenden, vertikalen Transistoren und ein Herstellungsverfahren dafür
US6355518B1 (en) 2000-09-05 2002-03-12 Promos Technologies, Inc. Method for making a DRAM cell with deep-trench capacitors and overlying vertical transistors
US6284593B1 (en) * 2000-11-03 2001-09-04 International Business Machines Corporation Method for shallow trench isolated, contacted well, vertical MOSFET DRAM
US6258659B1 (en) * 2000-11-29 2001-07-10 International Business Machines Corporation Embedded vertical DRAM cells and dual workfunction logic gates
US6570207B2 (en) 2000-12-13 2003-05-27 International Business Machines Corporation Structure and method for creating vertical capacitor and anti-fuse in DRAM process employing vertical array device cell complex
US6576944B2 (en) 2000-12-14 2003-06-10 Infineon Technologies Ag Self-aligned nitride pattern for improved process window
DE10100582A1 (de) * 2001-01-09 2002-07-18 Infineon Technologies Ag Verfahren zur Herstellung von Grabenkondensatoren für integrierte Halbleiterspeicher
US6544838B2 (en) 2001-03-13 2003-04-08 Infineon Technologies Ag Method of deep trench formation with improved profile control and surface area
US6518616B2 (en) * 2001-04-18 2003-02-11 International Business Machines Corporation Vertical gate top engineering for improved GC and CB process windows
US6551942B2 (en) 2001-06-15 2003-04-22 International Business Machines Corporation Methods for etching tungsten stack structures
US6610573B2 (en) * 2001-06-22 2003-08-26 Infineon Technologies Ag Method for forming a single wiring level for transistors with planar and vertical gates on the same substrate
DE10142591A1 (de) * 2001-08-31 2003-03-27 Infineon Technologies Ag Verfahren zum Herstellen einer Grabenstruktur
US6544855B1 (en) * 2001-10-19 2003-04-08 Infineon Technologies Ag Process flow for sacrificial collar with polysilicon void
WO2003036714A1 (fr) * 2001-10-24 2003-05-01 Hitachi, Ltd D Procede de fabrication de misfet longitudinal, misfet longitudinal, procede de fabrication de dispositif de stockage a semi-conducteur et dispositif de stockage a semi-conducteur
KR100442781B1 (ko) * 2001-12-24 2004-08-04 동부전자 주식회사 트렌치 캐패시터를 구비한 반도체소자 및 그 제조방법
DE10208249B4 (de) * 2002-02-26 2006-09-14 Infineon Technologies Ag Halbleiterspeicher mit vertikalem Auswahltransistor
US6661042B2 (en) 2002-03-11 2003-12-09 Monolithic System Technology, Inc. One-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region
US6686624B2 (en) * 2002-03-11 2004-02-03 Monolithic System Technology, Inc. Vertical one-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region
US6661050B2 (en) * 2002-03-20 2003-12-09 Taiwan Semiconductor Manufacturing Co., Ltd Memory cell structure with trench capacitor and method for fabrication thereof
DE10212932B4 (de) * 2002-03-22 2006-02-09 Infineon Technologies Ag Trenchzelle für ein DRAM-Zellenfeld
KR100474737B1 (ko) * 2002-05-02 2005-03-08 동부아남반도체 주식회사 고집적화가 가능한 디램 셀 구조 및 제조 방법
DE10225410A1 (de) * 2002-06-07 2004-01-08 Infineon Technologies Ag Verfahren zur Herstellung von NROM-Speicherzellen mit Grabentransistoren
US6605504B1 (en) * 2002-06-28 2003-08-12 Infineon Technologies Ag Method of manufacturing circuit with buried strap including a liner
US6727540B2 (en) * 2002-08-23 2004-04-27 International Business Machines Corporation Structure and method of fabricating embedded DRAM having a vertical device array and a bordered bitline contact
US7224024B2 (en) * 2002-08-29 2007-05-29 Micron Technology, Inc. Single transistor vertical memory gain cell
US6838723B2 (en) 2002-08-29 2005-01-04 Micron Technology, Inc. Merged MOS-bipolar capacitor memory cell
US6569732B1 (en) 2002-10-02 2003-05-27 Taiwan Semiconductor Manufacturing Company Integrated process sequence allowing elimination of polysilicon residue and silicon damage during the fabrication of a buried stack capacitor structure in a SRAM cell
US6804142B2 (en) 2002-11-12 2004-10-12 Micron Technology, Inc. 6F2 3-transistor DRAM gain cell
US7030436B2 (en) * 2002-12-04 2006-04-18 Micron Technology, Inc. Embedded DRAM gain memory cell having MOS transistor body provided with a bi-polar transistor charge injecting means
US20040132245A1 (en) * 2003-01-06 2004-07-08 Pi-Chun Juan Method of fabricating a dram cell
US6853025B2 (en) * 2003-02-20 2005-02-08 Infineon Technologies Aktiengesellschaft Trench capacitor with buried strap
US6956256B2 (en) * 2003-03-04 2005-10-18 Micron Technology Inc. Vertical gain cell
US6696344B1 (en) * 2003-03-10 2004-02-24 Nanya Technology Corporation Method for forming a bottle-shaped trench
US7135731B2 (en) * 2003-12-10 2006-11-14 Nanya Technology Corp. Vertical DRAM and fabrication method thereof
DE10358324A1 (de) 2003-12-12 2005-07-14 Infineon Technologies Ag Leistungstransistorzelle und Leistungstransistorbauelement mit Schmelzsicherung
US7504299B2 (en) * 2004-01-30 2009-03-17 International Business Machines Corporation Folded node trench capacitor
JP3930486B2 (ja) * 2004-02-26 2007-06-13 株式会社東芝 半導体装置およびその製造方法
US7223669B2 (en) * 2004-06-16 2007-05-29 International Business Machines Corporation Structure and method for collar self-aligned to buried plate
US20060234441A1 (en) * 2005-04-13 2006-10-19 Promos Technologies Inc. Method for preparing a deep trench
JP2006324488A (ja) * 2005-05-19 2006-11-30 Nec Electronics Corp 半導体装置及びその製造方法
US7402860B2 (en) * 2005-07-11 2008-07-22 Infineon Technologies Ag Method for fabricating a capacitor
KR100711520B1 (ko) 2005-09-12 2007-04-27 삼성전자주식회사 리세스된 게이트 전극용 구조물과 그 형성 방법 및리세스된 게이트 전극을 포함하는 반도체 장치 및 그 제조방법.
KR100703027B1 (ko) 2005-09-26 2007-04-06 삼성전자주식회사 리세스 게이트 형성 방법
KR100650626B1 (ko) 2005-11-15 2006-11-27 삼성전자주식회사 반도체 장치 및 반도체 장치의 제조 방법
US7492005B2 (en) * 2005-12-28 2009-02-17 Alpha & Omega Semiconductor, Ltd. Excessive round-hole shielded gate trench (SGT) MOSFET devices and manufacturing processes
CN100459074C (zh) * 2006-02-22 2009-02-04 南亚科技股份有限公司 具有沟槽式栅极的半导体装置及其制造方法
JP5118347B2 (ja) * 2007-01-05 2013-01-16 株式会社東芝 半導体装置
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
US7781310B2 (en) 2007-08-07 2010-08-24 Semiconductor Components Industries, Llc Semiconductor die singulation method
US8859396B2 (en) 2007-08-07 2014-10-14 Semiconductor Components Industries, Llc Semiconductor die singulation method
TWI389302B (zh) * 2008-01-02 2013-03-11 Nanya Technology Corp 溝渠式半導體元件之結構
KR100971411B1 (ko) * 2008-05-21 2010-07-21 주식회사 하이닉스반도체 반도체 장치의 수직 채널 트랜지스터 형성 방법
KR101917392B1 (ko) * 2012-04-19 2018-11-09 에스케이하이닉스 주식회사 반도체 소자 및 그 제조방법
US9484260B2 (en) 2012-11-07 2016-11-01 Semiconductor Components Industries, Llc Heated carrier substrate semiconductor die singulation method
US9136173B2 (en) 2012-11-07 2015-09-15 Semiconductor Components Industries, Llc Singulation method for semiconductor die having a layer of material along one major surface
US9418894B2 (en) 2014-03-21 2016-08-16 Semiconductor Components Industries, Llc Electronic die singulation method
TWI549301B (zh) * 2014-05-27 2016-09-11 華亞科技股份有限公司 垂直式電晶體結構與形成垂直式電晶體結構接觸節點的方法
US9385041B2 (en) 2014-08-26 2016-07-05 Semiconductor Components Industries, Llc Method for insulating singulated electronic die
JP6164372B2 (ja) * 2014-09-17 2017-07-19 富士電機株式会社 半導体装置および半導体装置の製造方法
US9805935B2 (en) 2015-12-31 2017-10-31 International Business Machines Corporation Bottom source/drain silicidation for vertical field-effect transistor (FET)
US10002962B2 (en) 2016-04-27 2018-06-19 International Business Machines Corporation Vertical FET structure
US9812567B1 (en) 2016-05-05 2017-11-07 International Business Machines Corporation Precise control of vertical transistor gate length
US9653575B1 (en) 2016-05-09 2017-05-16 International Business Machines Corporation Vertical transistor with a body contact for back-biasing
US10366923B2 (en) 2016-06-02 2019-07-30 Semiconductor Components Industries, Llc Method of separating electronic devices having a back layer and apparatus
US9842931B1 (en) 2016-06-09 2017-12-12 International Business Machines Corporation Self-aligned shallow trench isolation and doping for vertical fin transistors
US9853127B1 (en) 2016-06-22 2017-12-26 International Business Machines Corporation Silicidation of bottom source/drain sheet using pinch-off sacrificial spacer process
US10217863B2 (en) 2016-06-28 2019-02-26 International Business Machines Corporation Fabrication of a vertical fin field effect transistor with an asymmetric gate structure
US10243073B2 (en) 2016-08-19 2019-03-26 International Business Machines Corporation Vertical channel field-effect transistor (FET) process compatible long channel transistors
US9704990B1 (en) 2016-09-19 2017-07-11 International Business Machines Corporation Vertical FET with strained channel
US10312346B2 (en) 2016-10-19 2019-06-04 International Business Machines Corporation Vertical transistor with variable gate length
US9812443B1 (en) 2017-01-13 2017-11-07 International Business Machines Corporation Forming vertical transistors and metal-insulator-metal capacitors on the same chip
US10373869B2 (en) 2017-05-24 2019-08-06 Semiconductor Components Industries, Llc Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus
JP6817895B2 (ja) * 2017-05-24 2021-01-20 株式会社東芝 半導体装置
CN108493188B (zh) * 2018-05-09 2023-10-13 长鑫存储技术有限公司 集成电路存储器及其形成方法、半导体集成电路器件
US10818551B2 (en) 2019-01-09 2020-10-27 Semiconductor Components Industries, Llc Plasma die singulation systems and related methods
CN111710677B (zh) * 2019-03-18 2024-11-22 汉萨科技股份有限公司 半导体元件及其制造方法
US11063157B1 (en) 2019-12-27 2021-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Trench capacitor profile to decrease substrate warpage

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225697A (en) * 1984-09-27 1993-07-06 Texas Instruments, Incorporated dRAM cell and method
JPS62268156A (ja) * 1986-05-16 1987-11-20 Toshiba Corp 半導体記憶装置
JPH01149454A (ja) * 1987-12-04 1989-06-12 Fujitsu Ltd 半導体記憶装置及びその製造方法
JPH0414868A (ja) * 1990-05-09 1992-01-20 Hitachi Ltd 半導体記憶装置とその製造方法
KR940006679B1 (ko) * 1991-09-26 1994-07-25 현대전자산업 주식회사 수직형 트랜지스터를 갖는 dram셀 및 그 제조방법
US5365097A (en) * 1992-10-05 1994-11-15 International Business Machines Corporation Vertical epitaxial SOI transistor, memory cell and fabrication methods
JP3439493B2 (ja) * 1992-12-01 2003-08-25 沖電気工業株式会社 半導体記憶装置の製造方法
US5406515A (en) * 1993-12-01 1995-04-11 International Business Machines Corporation Method for fabricating low leakage substrate plate trench DRAM cells and devices formed thereby
US5360758A (en) * 1993-12-03 1994-11-01 International Business Machines Corporation Self-aligned buried strap for trench type DRAM cells
US5395786A (en) * 1994-06-30 1995-03-07 International Business Machines Corporation Method of making a DRAM cell with trench capacitor
US5827765A (en) * 1996-02-22 1998-10-27 Siemens Aktiengesellschaft Buried-strap formation in a dram trench capacitor
US6018174A (en) * 1998-04-06 2000-01-25 Siemens Aktiengesellschaft Bottle-shaped trench capacitor with epi buried layer

Also Published As

Publication number Publication date
US6150210A (en) 2000-11-21
JPH10189916A (ja) 1998-07-21
US6200851B1 (en) 2001-03-13
KR19980064222A (ko) 1998-10-07
EP0852396A2 (en) 1998-07-08
EP0852396A3 (en) 2001-07-18
US5937296A (en) 1999-08-10

Similar Documents

Publication Publication Date Title
TW373290B (en) Memory cell having a vertical transistor and a trench capacitor
EP1017095A3 (en) DRAM trench capacitor cell
EP1003219A3 (en) DRAM with stacked capacitor and buried word line
CA1248231A (en) High density memory
US6437401B1 (en) Structure and method for improved isolation in trench storage cells
TW429613B (en) Dynamic random access memory with trench type capacitor
KR900004178B1 (en) Dynamic random access memory trench capacitor
EP1077487A3 (en) Trench capacitor DRAM cell with vertical transistor
KR930006930A (ko) 수직형 트랜지스터를 갖는 dram셀 및 그 제조방법
KR960016773B1 (en) Buried bit line and cylindrical gate cell and forming method thereof
GB1531824A (en) Semi-conductor memory device
EP0462576B1 (en) DRAM using barrier layer
TW428312B (en) A new scheme of capacitor and bit-line at same level and its fabrication method for 8F2 DRAM cell with minimum bit-line coupling noise
Goebel et al. Fully depleted surrounding gate transistor (SGT) for 70 nm DRAM and beyond
EP1026745A3 (en) Field-shield-trench isolation for trench capacitor DRAM
EP0331911A3 (en) Charge amplifying trench memory cell
EP1148552A3 (en) Vertical transistor DRAM cell with stacked storage capacitor and associated method cell
HK129094A (en) Three-dimensional 1-transistor cell structure with a trench capacitor for a dynamic semiconductor memory, and method for its manufacture
KR960019728A (ko) 반도체 메모리장치 및 그 제조방법
US6902982B2 (en) Trench capacitor and process for preventing parasitic leakage
US5701264A (en) Dynamic random access memory cell having increased capacitance
US20040129965A1 (en) Trench capacitor process for preventing parasitic leakage
KR20010093742A (ko) 메모리 셀 필드를 갖춘 반도체 메모리
HK125595A (en) Memory cell design for dynamic semiconductor memories
TW200511564A (en) Dynamic random access memory cell and fabrication thereof