TW202505206A - Power board structure of integrated circuit burn-in system - Google Patents

Abstract

The present invention relates to a power board structure of an integrated circuit burn-in system, including a power board installed on a burn-in substrate; and a plurality of shunt modules, which are arranged on the power board and electrically connected to the power board, wherein each shunt module includes at least a current measurement circuit unit and a voltage measurement unit module; wherein each shunt module is used to electrically connect to a corresponding component to be tested arranged on the burn-in substrate. In this way, an independent measurement circuit is provided for each component to be tested, and components to be tested with different qualities can be identified, and the components to be tested can be graded; the time point when the component to be tested is damaged can be known during the burn-in process; and then, the power shunt will make the voltage level of the components to be tested at the front, middle, and rear positions of the entire burn-in substrate more consistent.

Description

Power board structure of integrated circuit burn-in system

The present invention relates to the technical field of integrated circuit burn-in test, and more particularly to a power board structure of an integrated circuit burn-in system. The power board structure provides a voltage measurement circuit unit and a current measurement unit for each corresponding component to be tested.

The IC burn in system is an important equipment in the pre-burn in process of the IC manufacturing process. The power board is used to supply power to the IC device under test (DUT). The power board structure 100' of the known IC burn in system, please refer to Figures 1 and 2. The power board 1' (which can be electrically connected to a burn in board 10') has only a set of current measurement circuit units 2' and voltage measurement circuit units 3', and is electrically connected to all the devices under test (i.e. ICs) through a single high-power (high-current) dynamic power supply 4' (DPS, dynamic power supplies) disposed on the burn in board 10', such as the devices under test DUT1~DUT6, but not limited to this.

The power board structure 100' of the conventional integrated circuit burn-in system is of large capacity and centralized type. The device under test (i.e., IC) on the burn-in substrate 10' is prone to inconsistent voltage drop at the front and rear ends. This is because there is only one voltage detection point and it is impossible to achieve the same voltage on the entire burn-in substrate 10'. The disadvantages are briefly listed as follows. First, if multiple DUTs (i.e., ICs) are connected to the same power supply 4’ at the same time, if there is a DUT of poor quality, it will be damaged. Secondly, it is impossible to distinguish between DUTs (i.e., ICs) of different qualities, which means that the current consumption of each DUT (i.e., IC) cannot be detected. In addition, there is only the measurement function of the entire power board 1’, and it is impossible to know whether a single DUT (i.e., IC) has a problem during the burn-in process. Finally, the entire power board uses a complete output method, which will cause different problems to occur in the voltage level of the DUTs (i.e., ICs) at the front, middle, and back of a burn-in substrate.

The purpose of the present invention is to provide a power board structure of an integrated circuit burn-in system, which uses a set of high-power (high-current) power modules to supply the entire burn-in substrate, and the output part is designed to output in a small current shunt mode, that is, a plurality of shunt modules are arranged on the power board, and each shunt module has a current measurement circuit unit, an over-current detection unit, an output switch and a voltage measurement circuit unit. Compared with the aforementioned known power board structure of the integrated circuit burn-in system, it has the following advantages, which are briefly described as follows. First, independent measurement circuits can disconnect (OFF) the corresponding power supply of poor-quality DUTs (i.e. ICs) when they are damaged without burning out the IC holders. Second, independent measurement circuits are provided for each DUT to distinguish DUTs (i.e. ICs) of different quality and classify IC products. In addition, independent measurement circuits are provided for each DUT (i.e. IC) to know the time point when the DUT is damaged during the burn-in process. Then, the power shunt output method will make the voltage level of the DUTs (i.e. ICs) at the front, middle, and back of the entire burn-in substrate more consistent. Finally, each DUT (i.e. IC) has an independent measurement circuit to collect data from each DUT (i.e. IC), allowing the product to have a product compliance function.

In accordance with the above-mentioned objectives, the present invention provides a power board structure of an integrated circuit burn-in system, comprising a power board electrically connected to a burn-in substrate; and a plurality of shunt modules disposed on the power board and electrically connected to the power board, wherein each of the shunt modules at least comprises a current measuring circuit unit and a voltage measuring unit module; wherein each of the shunt modules is used to electrically connect to a corresponding component to be tested disposed on the burn-in substrate.

In some embodiments, each of the shunt modules further includes an overcurrent detection unit electrically connected to the current measuring circuit unit.

In some embodiments, each of the shunt modules further includes an output switch electrically connected to the over-current detection unit.

In some embodiments, the over-current detection unit is configured to detect whether a current provided by the current measurement unit exceeds a preset threshold value.

In some embodiments, the output switch is configured to short-circuit or open-circuit to turn on or off the current output to the corresponding device under test.

In some embodiments, when the current is less than the preset critical value, the output switch is short-circuited to conduct the current and output it to the corresponding device under test.

In some embodiments, when the current is greater than the preset critical value, the output switch is disconnected to cut off the current and the current will not be output to the corresponding device under test.

In some embodiments, the voltage measurement circuit unit is electrically connected to the corresponding device under test and provides a voltage to the corresponding device under test.

In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments listed in the drawings are described in detail below.

The advantages, features and technical methods achieved by the present invention will be described in more detail with reference to exemplary embodiments and the attached drawings so as to be easier to understand, and the present invention can be implemented in different forms, so it should not be understood that the present invention is limited to the embodiments described herein. On the contrary, for those with ordinary knowledge in the relevant technical field, the provided embodiments will make the present disclosure more thorough and comprehensive and completely convey the scope of the present invention, and the present invention will only be defined by the scope of the attached patent application.

In addition, the terms "include" and/or "comprising" refer to the existence of the stated features, regions, wholes, steps, operations, elements and/or parts, but do not exclude the existence or addition of one or more other features, regions, wholes, steps, operations, elements, parts and/or combinations thereof.

In order to facilitate your review committee to understand the content of the present invention and the effects that can be achieved, each specific embodiment is described in detail as follows with reference to the drawings.

Fig. 3 is a schematic diagram of the structure of the power board structure of the integrated circuit burn-in system of the present invention connected to multiple components under test. Fig. 4 is a detailed schematic diagram of the structure of the power board structure of the integrated circuit burn-in system of the present invention connected to multiple components under test. Fig. 5 is a schematic diagram of the structure of the power board structure of the integrated circuit burn-in system of the present invention.

3 to 5 , the power board structure 100 of the integrated circuit burn-in system of the present invention may include a power board 1 and a plurality of shunt modules 2.

The power board 1 can be electrically connected to a burner substrate 200.

Each shunt module 2 is disposed on the power board 1 and electrically connected to the power board 1. In some embodiments, each shunt module 2 is used to electrically connect a corresponding device under test (i.e., DUT1 to DUT6) disposed on the burner substrate 200. In some embodiments, please refer to FIG. 5 , each shunt module 2 may include a current measuring circuit unit 21, an overcurrent detection unit 22, an output switch 23, and a voltage measuring circuit unit 24. The overcurrent detection unit 22 is electrically connected to the current measuring circuit unit 21. The output switch 23 is electrically connected to the overcurrent detection unit 22. The voltage measurement circuit unit 24 is electrically connected to the corresponding device under test (ie, DUT1 - DUT6) and provides a voltage to the corresponding device under test (ie, DUT1 - DUT6), and measures a measurement voltage MV of the corresponding device under test (ie, DUT1 - DUT6).

In some embodiments, the overcurrent detection unit 22 is configured to detect whether a current provided by the current measuring circuit unit 21 exceeds a preset critical value. The output switch 23 is configured to short-circuit (turn on) or open-circuit (turn off) to conduct or disconnect the current output to the corresponding device under test (i.e., DUT1~DUT6). That is, when the current is less than the preset critical value, the output switch 23 short-circuits to conduct the current and output it to the corresponding device under test (i.e., DUT1~DUT6); and when the current is greater than the preset critical value, the output switch opens to disconnect the current and the current will not be output to the corresponding device under test (i.e., DUT1~DUT6).

In summary, the power board structure 100 of the integrated circuit burn-in system of the present invention uses a set of high-power (high-current) power modules to supply the entire burn-in substrate, and the output part is designed to output in a small current shunt mode, that is, a plurality of shunt modules are arranged on the power board, and each shunt module has a current measuring circuit unit, an over-current detection unit, an output switch and a voltage measuring circuit unit. Compared with the aforementioned known power board structure of the integrated circuit burn-in system, it has the following advantages, which are briefly described as follows. First, independent measurement circuits can disconnect (OFF) the corresponding power supply of poor-quality DUTs (i.e. ICs) when they are damaged without burning out the IC holders. Second, independent measurement circuits are provided for each DUT to distinguish DUTs (i.e. ICs) of different quality and classify IC products. In addition, independent measurement circuits are provided for each DUT (i.e. IC) to know the time point when the DUT is damaged during the burn-in process. Then, the power shunt output method will make the voltage level of the DUTs (i.e. ICs) at the front, middle, and back of the entire burn-in substrate more consistent. Finally, each DUT (i.e. IC) has an independent measurement circuit to collect data from each DUT (i.e. IC), allowing the product to have a product compliance function.

The invention disclosed in this case is a preferred embodiment. Any partial changes or modifications that are derived from the technical concept of this case and are easily inferred by people familiar with the art do not deviate from the scope of the patent rights of this case.

In summary, this case shows technical features that are different from the known in terms of purpose, means and effect. Moreover, it is the first invention that is practical and meets the patent requirements for invention. We sincerely request the review committee to carefully examine this and grant a patent as soon as possible to benefit the society.

100: Power board structure 1: Power board 2: Shunt module 21: Current measurement circuit unit 22: Overcurrent detection unit 23: Output switch 24: Voltage measurement circuit unit 200: Burner substrate 100’: Power board structure 1’: Power board 10’: Burner substrate 2’: Current measurement circuit unit 3’: Voltage measurement circuit unit 4’: Dynamic power supply DUT1~DUT6: Device under test MV: Measurement voltage

FIG. 1 is a schematic diagram of the structure of the power supply board structure of the known integrated circuit burn-in system connected to multiple components to be tested. FIG. 2 is a schematic diagram of the detailed structure of the power supply board structure of the known integrated circuit burn-in system connected to multiple components to be tested. FIG. 3 is a schematic diagram of the structure of the power supply board structure of the integrated circuit burn-in system of the present invention connected to multiple components to be tested. FIG. 4 is a schematic diagram of the detailed structure of the power supply board structure of the integrated circuit burn-in system of the present invention connected to multiple components to be tested. FIG. 5 is a schematic diagram of the structural block of the power supply board structure of the integrated circuit burn-in system of the present invention.

100: Power board structure

1: Power board

21: Flow measurement circuit unit

24: Voltage measurement circuit unit

200: Burning machine substrate

DUT1~DUT6: Components under test

MV:Measure voltage

Claims (8)

A power board structure of an integrated circuit burn-in system includes: a power board electrically connected to a burn-in substrate; and a plurality of shunt modules disposed on the power board and electrically connected to the power board, wherein each shunt module includes at least a current measurement circuit unit and a voltage measurement unit module; wherein each shunt module is used to electrically connect to a corresponding component to be tested disposed on the burn-in substrate. The power board structure of the integrated circuit burn-in system as described in claim 1, wherein each of the shunt modules also includes an overcurrent detection unit electrically connected to the current measurement circuit unit. The power board structure of the integrated circuit burn-in system as described in claim 2, wherein each of the shunt modules also includes an output switch electrically connected to the over-current detection unit. A power board structure of an integrated circuit burn-in system as described in claim 3, wherein the overcurrent detection unit is configured to detect whether a current provided by the current measuring circuit unit exceeds a preset critical value. A power board structure for an integrated circuit burn-in system as described in claim 4, wherein the output switch is configured to short-circuit or open-circuit to turn on or off the current output to the corresponding device under test. A power board structure of an integrated circuit burn-in system as described in claim 5, wherein when the current is less than the preset critical value, the output switch is short-circuited to conduct the current and output it to the corresponding device under test. A power board structure of an integrated circuit burn-in system as described in claim 6, wherein when the current is greater than the preset critical value, the output switch is disconnected to disconnect the current and the current will not be output to the corresponding device under test. A power board structure of an integrated circuit burn-in system as described in claim 1, wherein the voltage measurement circuit unit is electrically connected to the corresponding device under test and provides a voltage to the corresponding device under test.

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